JPH08237529A - Optical device - Google Patents

Abstract

PURPOSE: To provide the optical device with which the photographic optical means of a light quantity control means can be positioned corresponding to an optical axis with simple work procedure and high accuracy. CONSTITUTION: This optical device is provided with a substrate 1 mounting an image pickup optical system and a mechanism system on its surface. An iris part 30 is provided with two iris fans 31 and 32 point-symmetrically arranged with an optical axis K matched with the axial line of an opening part 1a as a center. The respective iris fans 31 and 32 are constituted to be rotated on parallel planes with respectively provided shafts 33 and 34 as centers. The shaft 33 of the iris fan 31 is inserted to a positioning hole 37 provided on the substrate 1 so as to be rotated and the shaft 34 of the iris fan 32 is inserted to a positioning hole 41 on the substrate 1 so as to be rotated. By inserting the correspondent shafts 33 and 34 to the respective positioning holes 37 and 38, the respective iris fans 31 and 32 are positioned so that the optical axis K can be matched with the central position of the iris opening regulated by their rotations.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device for forming an image of a subject on a solid-state image pickup device via a photographing optical member.

[0002]

2. Description of the Related Art Generally, an optical device using a solid-state image pickup device is provided with a zoom lens mechanism so as to obtain a desired photographing range.

The structure of the zoom lens mechanism of this optical device will be described with reference to FIG. FIG. 23 is a vertical cross-sectional view showing the configuration of a zoom lens mechanism of a conventional optical device.

As shown in FIG. 27, the optical device comprises a plurality of lens groups including a first lens group 101a, a second lens group 101b, a third lens group 101c and a fourth lens group 101d. The second lens group 101b and the fourth lens group 101d are each moved within the predetermined range along the optical axis direction. The zoom operation is performed by moving the second lens group 101b, and the focus adjustment is performed by moving the fourth lens group 101d.

On the optical axis behind the fourth lens group 101d, an optical low-pass filter 102 and a solid-state image sensor 103 such as a CCD are sequentially arranged.

First lens group 101a, third lens group 10
1c, optical low-pass filter 102, solid-state image sensor 10
3 and the like are held in the casing 104.

On the other hand, the second lens group 101b is held by the optical holding member 105. Optical holding member 105
Are movably supported in the optical axis direction by guide pins 106 and screw members 107 extending parallel to the optical axis direction. Each end of the guide pin 106 is supported by the casing 104.

The screw member 107 is formed with a screw portion to be engaged with the optical holding member 105. Each end of the screw member 107 is rotatably supported by the casing 104, and the driving force from the step motor 110 is transmitted to the screw member 107 via the gear group 101. When the screw member 107 is rotated by the driving force from the step motor 110, the optical holding member 105 is rotated along with the rotation of the screw member 107.
Is moved in the optical axis direction while being guided by the guide pin 106, and the second lens 1 is moved by the movement of the optical holding member 105.
The zoom operation by 01b is performed. The play between the screw member 107 and the optical holding member 105 is eliminated by the biasing spring 108 and the biasing member 109.

The fourth lens group 101d is the second lens group 1
Like 01b, it is held by the optical holding member 116. The optical holding member 116 is supported by a guide pin 117 extending in parallel with the optical axis direction and a screw member 113 so as to be movable in the optical axis direction. Each end of the guide pin 117 is supported by the casing 104.

The screw member 113 is formed with a screw portion which is engaged with the optical holding member 116. One end of the screw member 113 is rotatably supported by the casing 104. The other end of the screw member 113 is rotatably supported by the casing 104 and is directly connected to the output shaft of the step motor 112. The screw member 113 is the step motor 112.
When the optical holding member 116 is rotated by the driving force from the optical holding member 116, the optical holding member 116 is moved in the optical axis direction while being guided by the guide pin 117 as the screw member 113 rotates.
By the movement of 6, the focus adjustment by the fourth lens 101d is performed. The play between the screw member 113 and the optical holding member 116 is caused by the bias spring 108 and the bias member 109.
Removed by and.

The second lens group 102b and the third lens group 10
An aperture 114 is arranged between the aperture 1c and the aperture 1c, and the aperture diameter of the aperture 114 is adjusted by the driving force from the motor 115. The exposure amount is adjusted by adjusting the aperture diameter of the diaphragm 114.

[0012]

In recent years, with advances in semiconductor chips such as memories and microcomputers, portable information devices have become widespread and their miniaturization and high performance have been further promoted.
Portability is required as a necessary condition for this portable information device, and in particular, it is strongly required to be thin.

As such portable information equipment, there is an optical device for picking up a subject image, or an information equipment including this optical device. In order to reduce the thickness of this optical device, an imaging optical system (for example, 23, a system including each lens group shown in FIG. 23, a diaphragm and a solid-state image sensor, a mechanical system (for example, a gear that drives the lens group shown in FIG. 23, a motor,
The entire device must be thinned, including the system that consists of the motor that drives the diaphragm.

However, in the conventional optical device, for example, the optical holding member 105 is supported by the guide pin 106 and the screw member 107 symmetrically with respect to the optical axis.
The outer diameter of the casing 104 is larger than the outer diameter of the lens group 101b, and a motor 115 for driving the diaphragm 114, a motor 110 for driving the second lens group 101b, and Since the motor 112 for driving the four-lens group 101d is held, it is very difficult to further reduce the dimension in the direction orthogonal to the optical axis, that is, to reduce the thickness in the direction orthogonal to the optical axis. Therefore, it is very difficult to reduce the thickness of the entire device.

Further, since the motor 115 for adjusting the aperture diameter of the diaphragm 114 is arranged outside the casing 104, the structure of the diaphragm 114 prevents the thinning of the entire apparatus.

Further, since the exposure amount is adjusted by adjusting the aperture diameter of the diaphragm 114, it is necessary to position the diaphragm 114 with respect to the optical axis so that the center of the aperture diameter of the diaphragm 114 and the optical axis coincide with each other with high accuracy. Therefore, when the diaphragm 114 is installed in the casing 104, the positioning work procedure becomes very complicated.

An object of the present invention is to provide an optical device in which there is no fear that the light amount adjusting means and the driving means thereof will prevent the entire device from being made thin.

Another object of the present invention is to provide an optical device capable of positioning the light amount adjusting means with respect to the optical axis of the photographing optical system with a high accuracy by a simple work procedure.

[0019]

According to the first aspect of the present invention,
In an optical device for forming a subject image on a solid-state image sensor through a photographing optical system, a light amount adjusting operation for adjusting a light amount of the subject image and a substrate on which the photographing optical system and the solid-state image sensor are mounted is performed. A light quantity adjusting means and a driving means for generating a driving force for the light quantity adjusting means to perform a light quantity adjusting operation, wherein the light quantity adjusting means and the driving means are respectively arranged on a plane parallel to the substrate. It is characterized by being

According to a second aspect of the present invention, in the optical device according to the first aspect, the optical path formed by the photographing optical system includes an optical path portion extending perpendicularly to the substrate, and the light amount adjusting means is It is arranged so as to adjust the amount of light passing through the optical path portion.

According to a third aspect of the present invention, in the optical device according to the second aspect, the light amount adjusting means has a movable adjusting member for performing the light amount adjusting operation by adjusting a light amount passing region of the optical path portion. The movable adjusting member operates along a plane substantially parallel to the substrate.

According to a fourth aspect of the present invention, in the optical device according to the third aspect, the movable adjusting member is provided with a shaft rotatably and vertically supported by the substrate, and the movable adjusting member is provided with the shaft. It is characterized by rotational movement about an axis.

The invention according to claim 5 is the same as claims 1 to 4.
In the optical device described above, at least a part of the constituent members of the driving unit is provided on the substrate.

According to a sixth aspect of the present invention, in an optical device for forming a subject image on a solid-state image sensor through a photographing optical system, a light amount for adjusting the light amounts of the photographing optical system, the solid-state image sensor and the subject image. It has a substrate on which a light amount adjusting means for performing an adjusting operation is mounted, and the substrate is provided with a restricting portion for restricting the position of the light amount adjusting means.

According to a seventh aspect of the present invention, in the optical device according to the sixth aspect, the optical path formed by the photographing optical system includes an optical path portion extending perpendicularly to the substrate, and the light quantity adjusting means is It is characterized in that it is positioned by the restriction portion of the substrate so as to adjust the amount of light passing through the optical path portion.

[0026]

According to the structure of the optical device of claim 1, the light amount adjusting means and the light amount adjusting means for performing the light amount adjusting operation for adjusting the light amount of the object image are provided on the substrate on which the photographing optical system and the solid-state image pickup device are mounted. Since the driving means for generating the driving force for performing the adjusting operation are arranged on the plane parallel to the substrate, the light amount adjusting means and the increase in the thickness of the substrate due to the driving means are prevented. It can be suppressed as much as possible.

According to a second aspect of the present invention, the optical path formed by the photographing optical system includes an optical path portion extending perpendicularly to the substrate, and the light quantity adjusting means is arranged so as to adjust the amount of light passing through the optical path portion. Therefore, it is possible to adjust the light amount of the optical path portion extending vertically to the substrate by the light amount adjusting means without increasing the thickness of the substrate in the thickness direction.

In the structure of the optical device according to the third aspect, the light amount adjusting means has a movable adjusting member for performing the light amount adjusting operation by adjusting the light amount passing region of the optical path portion, and the movable adjusting member is substantially parallel to the substrate. Since the movable adjusting member operates along the flat surface, it is possible to suppress the increase in the thickness of the substrate in the thickness direction of the movable adjusting member as much as possible.

In the optical device according to the present invention, the movable adjusting member is provided with the shaft rotatably and vertically supported by the substrate, and the movable adjusting member rotates about the shaft. The amount of light in the optical path portion extending perpendicularly to the substrate can be adjusted by the movable adjusting member without increasing the thickness in the thickness direction.

In the structure of the optical device according to the fifth aspect, since at least a part of the constituent members of the driving means is provided on the substrate, it is possible to further suppress the increase in the thickness of the substrate in the thickness direction due to the driving means. it can.

In the optical device according to the sixth aspect of the present invention, the light amount adjusting means is mounted on the substrate on which the photographing optical system, the solid-state image sensor, and the light amount adjusting means for adjusting the light amount of the subject image are mounted. Since the regulating portion for regulating the position is provided, the position of the light amount adjusting means with respect to the optical axis of the photographing optical system can be determined in advance by the position regulating portion.

In the optical device according to the present invention, the optical path formed by the photographing optical system includes an optical path portion extending perpendicularly to the substrate, and the light amount adjusting means adjusts the amount of light passing through the optical path portion. Since the positioning is performed by the restricting portion, it is possible to easily perform the positioning with respect to the optical path portion formed in the photographing optical system and extending perpendicularly to the substrate.

[0033]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view showing the configuration of an embodiment of the optical device of the present invention, FIG. 2 is an exploded perspective view showing the configuration of the diaphragm of the optical device of FIG. 1, and FIG. 3 is the optical device of FIG. 3 is a vertical cross-sectional view showing the configuration of the actuator of the optical member G2 of FIG. 4, FIG. 4 is a cross-sectional view taken along the line BB of FIG. 3, and FIG.
-A sectional view taken along line A, Fig. 6 is a longitudinal sectional view showing another configuration example of the actuator of the optical member G2, and Fig. 7 is a longitudinal sectional view showing the periphery of the solid-state imaging device of the optical device of Fig. 1. 8 is an exploded perspective view showing the periphery of the solid-state image sensor of the optical device of FIG. 1, FIG. 9 is an exploded perspective view showing the periphery of the back surface side of the substrate of the solid-state image sensor of the optical device of FIG. 1, and FIG. 1 is a vertical cross-sectional view showing another mounting example of a glass member for protecting the image pickup surface of the device, FIG. 11 is a vertical cross-sectional view showing another mounting example of the glass member for protecting the image pickup surface of the solid-state image pickup device, and FIG. FIG. 13 is a block diagram showing the configuration of the optical device, FIG. 13 is a focusing characteristic diagram during focusing, and FIG. 14 is a diagram showing a zoom tracking curve.

As shown in FIG. 1, the optical device comprises a substrate 1 on the surface of which an imaging optical system and a mechanical system are mounted. A plurality of openings 1a, 1b, 1c are formed in the substrate 1. The opening 1a is hermetically sealed by a sealing member such as glass so that a light flux can pass therethrough, and dust and dirt are prevented from entering the accommodation space of the mounted component formed between the substrate 1 and the shield case 49.

The imaging optical system mounted on the substrate 1 has a diaphragm unit 3 for adjusting the amount of light of a subject guided from the opening 1a.
0, and a plurality of prism-shaped optical members G1 and G made of glass, plastic, or the like on which a free-form reflecting surface is formed.
2, G3 and G4, and a fixed image sensor 2 that receives light emitted from the optical member G4 and converts the light into an electric signal.

As shown in FIG. 2, the pattern portion 30 has two diaphragm blades 31 and 32 arranged point-symmetrically with respect to an optical axis K which coincides with the axis of the opening 1a. Each diaphragm blade 31, 32 is configured to rotate about a shaft 33, 34 provided on each diaphragm blade 31, 32.
The rotational movement of 2 is carried out on a plane parallel to the substrate 1. The shaft 33 of the diaphragm blade 31 is a positioning hole 3 provided in the substrate 1.
7, the shaft 34 of the diaphragm blade 32 is rotatably inserted into the positioning hole 41 of the substrate 1. By inserting the shafts 33 and 34 corresponding to the positioning holes 37 and 38, the diaphragm blades 31 and 32 are positioned so that the center position of the diaphragm opening regulated by the rotation thereof and the optical axis K coincide with each other. It The rotation of the diaphragm blades 31 and 32 changes the diaphragm aperture amount to adjust the light amount.

The diaphragm blades 31 and 32 are provided with permanent magnets 35 and 36, respectively, as a part of the actuator. The permanent magnets 35 and 36 are also used as magnetic scales for detecting the positions of the pattern blades 31 and 32, respectively. The permanent magnets 35 and 36 are magnetized so that their magnetic poles are arranged in a direction perpendicular to the rotation direction of the diaphragm blades 31 and 32 and in a direction perpendicular to the substrate 1.

A coil 38, a yoke 39 and a position sensor 40 are arranged at a position on the substrate 1 opposed to the permanent magnet 35, and a coil 42 and a yoke 43 are arranged at a position on the substrate 1 opposed to the permanent magnet 36. And a position sensor 44 are arranged. The yoke 39 is fitted in a recess (not shown) formed in the substrate 1 so as to be integrated with the substrate 1, as described later.

The permanent magnet 35 cooperates with the coil 38 and the yoke 39 to form an actuator for driving the diaphragm blade 31. In this actuator, when a current is passed through the coil 38 while a magnetic flux passes between the permanent magnet 35 and the yoke 39, the interaction between the magnetic flux and the current causes the permanent magnet 35, that is, the pattern blade 31, to move the shaft 3 to the shaft 3.
Rotate around 3. The position sensor 40 comprises a Hall sensor, and this Hall sensor detects a change in the magnetic field of the permanent magnet 35 due to the rotation of the pattern blade 31. The value detected by the position sensor 40 is used as a control amount for controlling the rotation amount of the diaphragm blade 31 so as to obtain a predetermined print value.

The permanent magnet 36 constitutes an actuator for driving the diaphragm blade 32 in cooperation with the coil 42 and the yoke 43. Part of coil 42 and yoke 43
Are fitted into recesses (not shown) formed in the substrate 1. The position sensor 44, like the position sensor 42,
It is composed of a Hall sensor that detects a change in the magnetic field of the permanent magnet 36 due to the rotation of the pattern blade 32.

The permanent magnets 35 and 36 may be made of plastic magnets, and the plastic magnets may be integrated so as to be a part of the diaphragm blades 31 and 32.

In each of the optical members G1, G2, G3, and G4, for example, the light incident from the opening 1a through the diaphragm 30 is repeatedly reflected a plurality of times inside the optical member G1, and then the optical members It has the same function as a lens group configured by combining a plurality of spherical lenses so as to be guided to G2.

The optical member G1 is fixed to the substrate 1.
The optical member G1 is provided with a pair of shafts G1a for positioning with respect to the substrate 1, and each shaft G1a is fitted into the corresponding opening 1b of the substrate 1 to position the optical member G1 with respect to the substrate 1. It is fixed. In the present embodiment, the substrate 1 and the optical member G1 are positioned and fixed by fitting the respective shafts G1a and the corresponding openings 1b, but instead of this, the optical member G1 is attached to the substrate 1. It is also possible to use a method in which the substrate 1 and the optical member G1 are fixed with an adhesive after the positioning is performed by the positioning means.

Each of the optical members G2 and G3 has a substrate 1
By moving in a predetermined direction (longitudinal direction of the substrate 1) parallel to the surface of the, the zooming (focal length adjustment)
It is an optical member for performing an operation and a focusing (focus adjustment) operation.

The optical member G2 is fixed to the moving table 3 with an adhesive. The moving table 3 is made of a high magnetic permeability material such as iron formed in a flat plate shape. The moving table 3 includes a part of an actuator for moving the moving table 3 in a predetermined direction in parallel with the substrate 1, and a position detecting section for detecting a moving position.
A position restricting portion is provided for guiding the moving direction and restricting the moving position.

In this embodiment, as shown in FIGS. 1 and 3 to 5, the permanent magnet 5 is provided as a part of the actuator.
A magnetic scale 7 is provided as a position detecting portion, and a groove portion 9 and a concave groove portion 11 each having a V-shaped cross-section in a plane perpendicular to the moving direction are provided as position regulating portions. The permanent magnet 5 is composed of two sets of magnets magnetized in a direction perpendicular to the moving direction of the optical member G2, and each magnet is arranged in a direction parallel to the substrate 1.

The coil 17 and the yoke 19 which cooperate with the movable table 3 and the permanent magnet 5 to form an actuator are the substrate 1
It is provided in. A part of the coil and the yoke 19 are
As shown in FIG. 3, it is fitted in a recess 1 e formed in the substrate 1.

The magnetic force of the magnetic scale 7 is detected by a position sensor 21 including an MR sensor and a Hall sensor, and the position sensor 21 is provided on the substrate 1 so as to face the magnetic scale 7.

Rail portions 13 and 14 for guiding the moving direction of the moving table 3 and restricting the moving position are provided at respective positions on the substrate 1 facing the respective groove portions 9 and 11. Grooves having a V-shaped cross section are formed in the rail portions 13 and 14 in a plane perpendicular to the moving direction of the moving table 3. A ball 46 is inserted between each groove 9 and 11 and the corresponding rail 13 and 14.

In the actuator composed of the moving table 3, the permanent magnet 5, the coil 17 and the yoke 19,
When a current is applied to the coil 17, a driving force is generated by the interaction between a magnetic circuit and a current, which will be described later, and the driving force causes the movable table 3 or the optical member G2 to move in the optical axis direction (direction perpendicular to the paper surface in FIG. 3). Be moved. Specifically, FIG.
As shown in (b), a magnetic path indicated by a dotted line in the drawing is formed between the permanent magnet 5, the movable base 3 having magnetic permeability, and the yoke 19. When an electric current is passed through the coil 17 existing in the magnetic path between the permanent magnet 5 and the yoke 19, the moving base 3, that is, the optical member G2 is moved by the driving force generated by the interaction between the magnetic force and the electric current, and the arrow mark shown in the figure. Is moved in the direction. By changing the direction of the current flow, the moving direction of the moving table 3 changes. For example, the moving table 3 can be moved from the position shown in FIG. 5B to the position shown in FIG. The table 3 can be moved from the position shown in FIG. 5 (b) to the position shown in FIG. 5 (c).

When the movable table 3 is moved, as shown in FIG. 4, a magnetic attraction force acts between the permanent magnet 5 and the yoke 19, so that the movable table 3 and the rail portion 13 have a ball 46.
It is in close contact without play through. The moving table 3 is shown in FIG.
The ball 46 rotates to the right when moving in the direction shown in FIG. 4, and the ball 46 rotates to the left when moving in the direction shown in FIG. Holds stable through. Further, since the ball 46 rolls while moving to the moving table 3, the rolling friction acting on the contact surface between the moving table 3 and the rail portion 13 with respect to the ball 46 causes the contact between the guide pin and the lens holding member described in the conventional example. It is negligibly smaller than the sliding friction applied to the parts, and the load when the optical member G2 is moved due to friction can be reduced. The magnetic field of the magnetic scale 7 changes as the movable table 3 moves, and the change is read by the position sensor 21. The detected value from the position sensor 21 is
It is used for movement control of the moving table 3.

In this embodiment, the permanent magnet 5 composed of two sets of magnets arranged in the direction parallel to the substrate 1 is used, but instead of this, as shown in FIG. Using permanent magnets 51 and 52 that are vertically magnetized,
The permanent magnets 51 and 52 may be fixed to the back yoke 53. With such a configuration,
The magnetic path has permanent magnets 51, 52 with the smallest spatial gap.
The magnetic field is concentrated between the lower surface and the yoke 19 to stabilize the driving force and the magnetic path.

Similarly, the optical member G3 is fixed to the movable table 4 with an adhesive. The moving table 4 has the same configuration as the moving table 3, and the moving table 4 includes a permanent magnet 6 as a part of an actuator, a magnetic scale 8 as a position detecting section, and a moving direction of the moving table 4 as a position restricting section. Groove 10 and concave groove 12 having a V-shaped cross-section in a plane perpendicular to the plane
Are provided respectively.

The coil 18 and the yoke 20 which cooperate with the movable table 4, the permanent magnet 6 and constitute the actuator are provided on the substrate 1. The yoke 20 is, as described later,
It is made of an iron base that is fitted into the opening (not shown) formed in the substrate 1 so as to be integrated with the substrate 1.

The actuator composed of the movable table 4, the permanent magnet 6, the coil 18 and the yoke 20 performs the same operation as the actuator composed of the permanent magnet 5, the coil 17 and the yoke 19 described above.

The magnetic force of the magnetic scale 9 is detected by a position sensor 22 including an MR sensor and a Hall sensor, and the position sensor 22 is provided on the substrate 1 so as to face the magnetic scale 9.

Rail portions 15 and 16 for guiding the moving direction of the moving table 4 and restricting the moving position are provided at respective positions on the substrate 1 facing the respective groove portions 10 and 12. Grooves having a V-shaped cross-sectional shape are formed in the rail portions 15 and 16 in a plane perpendicular to the moving direction of the moving table 3, and the rail portions 1 corresponding to the respective groove portions 10 and 12 are formed.
A ball 47 is inserted between the parts 5 and 16. The optical member G3 is moved in a predetermined direction in accordance with the movement of the movable table 4, and the frictional force generated between the groove portions 10 and 12 and the corresponding rail portions 15 and 16 when the movable table 4 is moved is equal to that of the ball 4
Reduced by 7 rolling.

In this embodiment, each optical member G2, G
3 and the movable bases 3 and 4 are fixed by an adhesive, but instead of this, the optical members G2 and G3 are insert-molded or outsert-molded to the movable bases 3 and 4, respectively, so that the optical components G3 and G3 are fixed. It is also possible to integrate the members G2 and G3 with the respective movable bases 3 and 4.

The optical member G4 is fixed to the substrate 1 with an adhesive. The optical axis of the emitted light of the optical member G4 is the substrate 1
Is arranged on the substrate 1 so as to coincide with the axis of the opening 1c. An optical filter (not shown) for removing unnecessary high frequency components and infrared rays included in the subject image is attached to the optical member G4. The optical filter may be integrally formed with the optical member G4 by vapor deposition.

In the optical system composed of the respective optical members G1, G2, G3, G4, the light incident on the optical member G1 from the opening 1a of the substrate 1 through the diaphragm 30 is parallel to the surface of the substrate 1. Direction, the reflected light is guided to the optical member G4 by the optical members G2 and G3, and the light is emitted in the direction perpendicular to the surface of the substrate 1 by the optical member G4.

The light emitted from the optical member G4 is emitted from the substrate 1
Is guided to the solid-state image sensor 2 through the opening 1c.

The solid-state image pickup device 2 is shown in FIGS.
As shown in, it is attached to the back surface of the substrate 1. As shown in FIG. 8, the solid-state image sensor 2 has a plurality of terminals 904 including terminals for outputting accumulated signals and terminals for inputting timing pulses and the like. Each terminal 9
04 is provided on the imaging surface 905 side of the solid-state imaging device 2. In the solid-state imaging device 2, the optical axis of the imaging surface 905 is the substrate 1
Is arranged on the back surface side of the substrate 1 so as to coincide with the axis of the opening 1c. Since each terminal 904 is directly connected to the terminal 907 provided on the back surface of the substrate 1 by soldering or the like, it is less likely to be affected by noise or the like.

The solid-state image pickup element 2 is sealed with a resin member 903 from the back side thereof. The resin member 903 protects the solid-state image sensor 2 and increases the mounting strength of the solid-state image sensor 2 to the substrate 1.

The opening 1c of the substrate 1 is covered with the glass member 50, and the glass member 50 is arranged between the optical member G4 and the substrate 1. The glass member 50 protects the imaging surface 905 of the solid-state imaging device 2.

In the present embodiment, the glass member 50 for protecting the image pickup surface 905 is arranged between the substrate 1 and the optical member G4, but instead of this, as shown in FIG. A glass member 902 for protecting the image pickup surface 905 of the solid-state image pickup device 2 may be fitted in the opening 901 of the substrate 1. With this configuration, the glass member 902 does not project to the surface of the substrate 1, and it is possible to suppress an increase in the thickness of the substrate 1 around the solid-state imaging device 2 in the thickness direction, and thus to reduce the thickness of the entire device. Can be thinned.

Further, instead of the glass member 50, as shown in FIG. 11, a part of the optical member G4 is provided with an opening 90 of the substrate 1.
1 so that the optical member G
4 can also be used as a glass member for protecting the image pickup surface 905 of the solid-state image pickup element 2, and the optical member G4 can be easily positioned with respect to the solid-state image pickup element 2.

Further, in this embodiment, the electrode 9 is provided on the image pickup surface side.
Although the solid-state image sensor 2 in which 04 is formed is used,
It is also possible to use an assembly in which the solid-state imaging device 2 is mounted in advance on a substrate such as ceramic. In this assembly, an electrode that connects to the electrode 904 of the solid-state image sensor 2 is provided, and this electrode and the electrode provided on the back surface of the substrate 1 can be directly connected.

As shown in FIG. 1, on the substrate 1, a plurality of circuit elements 45 are provided in addition to the above-mentioned components constituting the optical image pickup system.
a and 45b are mounted. Each circuit element 45a is composed of an actuator of each of the movable bases 3 and 4 on which the optical members G2 and G3 are mounted, an actuator of the diaphragm unit 3, and an element forming a drive circuit of each position sensor. The circuit element 45b includes an element that constitutes a drive circuit and a video signal processing circuit of the solid-state image sensor 2.

The board 1 is provided with a connector 48 for connecting the circuit elements 45a and 45b to an external circuit.

A shield case 49 is attached to the substrate 1 so as to shield the components mounted on the substrate 1 from magnetism and light from the outside, suppress internal reflection, and prevent dust from entering from the outside. The shield case 49 is formed of, for example, an iron plate whose inner surface is painted black.

Next, the procedure for assembling the optical device of this embodiment will be described.

First, in the first step, the fixed contact parts are arranged on the substrate 1. As the solid contact parts, the solid-state image pickup element 2, the optical members G1 and G4, the coils 17 and 18 and the yoke 1 which constitute the actuators of the optical members G2 and G3.
9, 20, rail portions 13, 14, 15, 16, position sensors 21, 22, coils 38, 42 of the diaphragm portion 30, yokes 39, 43, position sensors 40, 44, and circuit elements 45a, 45b. There is.

First, the solid-state image sensor 2 is fixed to the back surface of the substrate 1 by soldering, bonding or the like.
Of the terminal 905 and the terminal 907 of the substrate 1 are electrically connected.

Next, the glass member 50 is attached so as to cover the opening 1a, and the optical member G4 is fixed to the surface of the substrate 1. The optical member G4 is fixed to the substrate 1 with an adhesive or the like.

After mounting the optical member G4, the optical member G1
The axis G1a of is fitted into the corresponding opening 1b, and the position of the optical member G1 on the substrate 1 is determined.

Next, the other fixed components are sequentially positioned and fixed to the substrate 1 by soldering, bonding or the like. The coils 17 and 18, the yokes 19 and 20, the position sensors 21 and 22, the coils 38 and 42, the yokes 39 and 43, the position sensors 40 and 44, and the circuit elements 45a and 45b are connected to a wiring pattern formed on the substrate 1. It

With the completion of this first step, mounting of fixed parts on the substrate 1, movable blades 3 and 4 for mounting the diaphragm blades 31 and 32 of the diaphragm portion 30 and the optical members G2 and G3. The electrical connection of the coil, position sensor, etc. for driving and controlling the motor is completed. In this way, the fixed component that needs to be electrically connected to the substrate 1 including the solid-state image sensor 2 is directly electrically connected to the substrate 1 such as solder without passing through the lead wire or the flexible printed board. The assembly process required for electric wiring is omitted, and the cost is reduced.

Next, the second step is executed. In this second step, the diaphragm blades 31 and 32 that are movable members are mounted on the substrate 1. Specifically, the shaft 33 of the diaphragm blade 31 is inserted into the hole 37 of the substrate 1, and similarly, the shaft 34 of the diaphragm blade 32.
Are inserted into the holes 41 of the substrate 1.

Next, the third step is executed. In this third step, the optical members G2 and G3, which are the image pickup optical system, and the movable member that constitutes the actuator thereof are mounted. The movable bases 3 and 4 are mounted on the rail portions 13, ..., 16 via balls 46 and 47, respectively, and the positions of the optical members G2 and G3 are determined with respect to the movable third and fourth.

Next, the fourth step is executed, and in this fourth step, the shield case 49 is attached. The shield case 49 is placed on the substrate 1 so as to cover the surface of the substrate 1, and the corresponding portion is fixed to the ground pattern of the substrate 1 by soldering.

By the completion of the fourth step, the mounting of the component on the substrate 1 is completed.

As described above, it is possible to simplify the assembly process without using a complicated and expensive component such as a housing that conventionally holds an optical system such as a lens, and to provide a low-cost imaging optical system. Can be offered.

Further, by arranging the above-mentioned members or parts on the flat board 1, it is easy to determine the arrangement and posture of each part so that the dimension of the board 1 in the thickness direction is not increased as much as possible. As a result, a thin optical device can be easily obtained.

Further, the diaphragm blades 31, 32 of the diaphragm unit 30.
Is rotated in a plane parallel to the substrate 1, and the yokes 39 and 43 are fitted into the recesses formed in the substrate 1, so that the diaphragm blades 31 and 32 of the diaphragm unit 30 and the yoke 3 are formed.
It is possible to suppress an increase in the thickness of the substrate 1 in the thickness direction due to 9, 43, etc., and it is possible to realize a thinner optical device.

Further, with respect to the substrate 1 on which the solid-state image pickup device 2 is mounted, each optical member, the restricting portion of the optical member, and the diaphragm portion 30
Since the positions are arranged, the positional accuracy of each can be improved.

Further, the shaft 33 of the diaphragm blade 31 is inserted into the hole 37 of the substrate 1, and the shaft 34 of the diaphragm blade 32 is inserted into the hole 4 of the substrate 1.
When the aperture blades 3 and 3 are inserted into the aperture blades 1, the aperture blades 31 and 32 are aligned with the optical axis K.
Positioning can be performed with respect to 1, 32, and the diaphragm 3
Positioning with respect to the optical axis K of 0 can be performed with a simple procedure and with high accuracy.

In this embodiment, each optical member G1, G
Although the imaging optical system based on G2, G3, and G4 has been described as an example, in the imaging optical system including the imaging optical system including the lens group including the refracting optical system or the lens group including the refracting optical system as described in the conventional example, these are described. It is possible to make the optical system movable by directly disposing the optical system on the substrate or on the movable table.

Next, the structure of this embodiment will be described electrically with reference to FIG. FIG. 12 is a block diagram showing the configuration of the optical device of FIG.

As shown in FIG. 12, the optical device has an image pickup optical system 601. The imaging optical system 601 includes a diaphragm unit G12 (a diaphragm unit 30 shown in FIG. 1) that limits the amount of incident light.
An optical member G1 for fixing the position, an optical member G2 for changing the photographing magnification by moving the position, an optical member G3 for adjusting the focus by moving the position, and an unnecessary high frequency component and infrared rays of the subject image by fixing the position. And an optical member G4 on which an optical filter for performing the operation is formed.

The light emitted from the optical member G4 is incident on the solid-state image sensor 2, and the incident light is converted into an electric signal by the solid-state image sensor 2. The solid-state image sensor 2 is driven by the image sensor drive circuit 604, and the image sensor drive circuit 604 amplifies the timing signal generated by the clock circuit 603,
The solid-state imaging device 2 is driven by the amplified signal. The generation timing of the timing signal in the clock circuit 603 is controlled by the CPU 616.

The electric signal output from the solid-state image sensor 2 is applied to the preprocessing circuit 605. Preprocessing circuit 6
Reference numeral 05 is an amplifier for the electric signal from the solid-state image sensor 2, and C
Performs DS processing and the like. The signal from the preprocessing circuit 605 is converted into a digital signal by the A / D converter 606, and this digital signal is given to the process circuit 607. The process circuit 607 performs various kinds of processing on the digital signal to visualize it.

The video signal from the process circuit 607 is D
The display device 609 via the A / A converter 608, the analog output 611 via the D / A converter 610, and the memory 61.
2, the digital output is supplied to the focus information detection circuit 614 and the brightness information detection circuit 615, respectively.

The display device 609 is composed of an LCD for displaying the image indicated by the image signal. The analog output 611 includes an analog signal output terminal for outputting a signal to, for example, a television monitor. The memory 612 records the video signal. The digital output 613 includes a terminal for outputting a signal to, for example, an external recording medium.

The focus information detection circuit 614 detects the focus state of the subject image based on the video signal from the process circuit 607. The detection result is given to the CPU 616.

The brightness information detection circuit 615 detects the brightness information of the subject image based on the video signal from the process circuit 607. The detection result is given to the CPU 616.

The optical member G2 is moved in a predetermined direction by the actuator 617. This actuator 617
As shown in FIG. 1, is composed of a moving table 3, a permanent magnet 5, a coil 17, and a yoke 19. Drive control of the actuator 617 is performed by a control signal from the actuator control circuit 619, and this control signal is amplified by the drive circuit 620 and then given to the actuator 617. The position of the optical member G2 is detected by the position detector 618, and this position detector 618 includes the position sensor 21 shown in FIG. The signal from the position detector 618 is
After being amplified by the amplifier 621, it is given to the CPU 616 via the A / D converter 622.

The optical member G3 is moved in a predetermined direction by the actuator 623. This actuator 623
As shown in FIG. 1, is composed of a moving table 4, a permanent magnet 6, a coil 18, and a yoke 20. The drive control of the actuator 623 is performed by a control signal from the actuator control circuit 625, and this control signal is amplified by the drive circuit 626 and then given to the actuator 623. The position of the optical member G3 is detected by the position detector 624, and this position detector 624 is composed of the position sensor 22 shown in FIG. The signal from the position detector 624 is
After being amplified by the amplifier 627, it is given to the CPU 616 via the A / D converter 628.

The diaphragm G12 is driven by the actuator 629 so that the diaphragm amount becomes a predetermined diaphragm amount. This actuator 629, as shown in FIG.
2, permanent magnets 35, 36, coils 38, 42, yoke 3
It is composed of 9,43. The drive control of the actuator 629 is performed by the control signal from the actuator control circuit 631, and this control signal is used as the drive circuit 632.
It is given to the actuator 629 after being amplified by.
The diaphragm amount of the diaphragm portion G12, that is, the rotational positions of the diaphragm blades 31 and 32 are detected by the position detector 630, and the position detector 630 is composed of the position sensors 40 and 44 shown in FIG. The signal from the position detector 630 is amplified by the amplifier 633, and then is transmitted to the CPU 6 via the A / D converter 634.
Given to 16.

The CPU 616 uses the detectors 618 and 62.
4, 630, the focus information detection circuit 614, and the luminance information detection circuit 615 detect the corresponding actuator control circuit 62.
0, 626, 630 are controlled.

An operation instruction signal is given to the CPU 616 from the operation unit 635. The operation unit 635 generates an operation instruction signal corresponding to the operation by the photographer.

In such a circuit structure, it can be classified into an image pickup optical system 601, an actuator drive circuit 636, and a video signal processing circuit 637 which processes an electric signal from the solid-state image pickup device 2. Actuator drive circuit 63
6 includes actuator control circuits 619, 625, 6
31 is included, and the actuator drive circuit 636 is similar to that shown in FIG.
The circuit element 45a shown in FIG. The video signal processing circuit 637 includes an image sensor driving circuit 604 and a clock circuit 6.
03, and the circuit element 45b shown in FIG.

The CPU 616 and the focus information detection circuit 6
The brightness information detection circuit 615 and the brightness information detection circuit 615 can be mounted on the substrate 1, but the mounting position is not particularly limited.

The display device 609, the memory 612 and the operating section 635 are arranged outside.

Next, the operation of the optical device will be described.

First, a photographer operates the operation unit 635 to input a photographing start command to the CPU 616. In response to the instruction, the CPU 616 turns on the power of each circuit and instructs the clock circuit 603 to output the timing signal for the solid-state image sensor 2. The timing signal output from the clock circuit 603 is used as the image sensor drive circuit 604.
Then, it is amplified into a signal capable of driving the solid-state imaging device 2. The light incident on the solid-state image sensor 2 is converted into an electric signal by the drive signal, and the electric signal is transferred to the front direct processing unit circuit 60.
Given to 5. The pre-processing circuit 605 performs processing such as CDS processing, non-linearization, and signal amplification on the electric signal from the solid-state image sensor 602. Preprocessing circuit 605
Is output to the process circuit 607 after being digitized by the A / D converter 606. Process circuit 6
Reference numeral 07 performs various processes for visualizing the digital signal from the A / D converter 606, such as primary color separation, white balance, gamma correction, aperture correction, luminance signal, and color difference signal generation. This image signal is converted into an analog signal by the D / A converter 608, and the image represented by the analog signal is displayed on the display device 609. Further, the video signal is recorded in the memory 612 as a digital signal as needed, or is output to an external device.

Next, the operation of the image pickup optical system 601 will be described.

Focusing is usually done automatically. When the video signal from the process circuit 607 is input to the focus information detection circuit 614, the focus information detection circuit 614
Detects the amount of high frequency components of the input video signal (hereinafter referred to as focus information). As shown in FIG. 13, the focus information has a maximum characteristic when the imaging optical system 601 is in focus with respect to the subject, and has a characteristic that decreases as defocusing occurs.

The CPU 616 detects a change in the focus information while moving the optical member G3, and controls the actuator control circuit 625 so as to move the optical member G3 to the position where the focus information becomes maximum as follows. CPU616
Outputs a focus lens movement signal so that the target lens position calculated from the focus information and the actual lens position follow each other. The actual lens position of the optical member G3 is CP after the position information detected by the position detector 624 is amplified by the amplifier 627 and digitized by the A / D converter 628.
It is input to U616 and calculated.

The actuator control circuit 625 generates an actuator control signal based on the focus lens movement signal. The actuator control signal is the drive circuit 626.
Is amplified to a signal that can drive the actuator 623 with
The actuator 623 is driven. Actuator 6
The optical member G3 is moved in accordance with the driving of 23, and focusing is performed.

Zooming is performed by the photographer operating the operation unit 635. According to the instruction input from the operation unit 635, the CPU 616 calculates the target position of the optical member G2. The current lens position of the optical member G2 is detected by the position detector 618. The output signal of the position detector 618 is amplified by the amplifier 621 and input to the A / D converter 622. The output from the position detector 618 digitized by the A / D converter 622 is input to the CPU 616,
The lens position information of the optical member G2 is calculated. CPU6
Reference numeral 16 outputs a movement signal for the optical member G2 so that the target lens position and the actual lens position follow each other. The actuator control circuit 619 generates an actuator control signal based on the movement signal for the optical member G2. The actuator control signal is amplified by the drive circuit 620 into a signal capable of driving the actuator, and the actuator 617 is driven. The optical member G2 is moved along with the driving of the actuator 617, and zooming is performed.

In the inner focus type zoom lens as in the present embodiment, in order to perform zooming while the subject is in focus, the position of the optical member G2 and the position of the optical member G3 are determined by a predetermined curve ( It is necessary to move on the zoom tracking curve). An example of the zoom tracking curve is shown in FIG. In the figure, 0.6 m, 1.
2 m and 1.0 m represent subject distances.

Optical member G obtained from the position detector 618
2 from the position information of the optical member G3 obtained from the position detector 624, the current subject distance is calculated,
During zooming, the target position of the optical member G3 is calculated based on the tracking curve corresponding to the current subject distance. Similar to the optical member G2, the current lens position of the optical member G3 is detected by the position detector 624, and the position detector 62
The output signal of No. 4 is amplified by the amplifier 627 and input to the A / D converter 628. The output of the position detector 624 digitized by the A / D converter 628 is input to the CPU 616, and the lens position information of the optical member G3 is calculated. C
The PU 616 outputs a focus lens movement signal so that the target lens position and the actual lens position closely follow each other.
The actuator control circuit 625 generates an actuator control signal based on the focus lens movement signal. The actuator control signal is amplified by the drive circuit 626 into a signal capable of driving the actuator, and the actuator 62
3 is driven and the optical member G3 is moved. Therefore, the solid-state image sensor 2 does not blur the subject even during zooming.
Is imaged.

The exposure amount is adjusted by controlling the diaphragm member G12 with the actuator 629 and changing the aperture amount for the image pickup optical system 601. Normally, this exposure amount is automatically performed. The video signal from the process circuit 607 is input to the luminance information detection circuit 615. The brightness information detection circuit 615 detects the brightness of the subject image (hereinafter referred to as brightness information) from the input video signal. Current diaphragm G
The 12 positions are detected by the position detector 630. The output signal of the position detector 630 is amplified by the amplifier 633, and A /
It is input to the D converter 634. The output of the position detector 630 digitized by the A / D converter 634 is the CPU 61.
6, and the aperture position information of the print portion G12 is obtained. The CPU 616 calculates the optimum exposure amount based on the input brightness information of the subject image, and further calculates the target aperture position from the optimum exposure amount and the current aperture position information. A diaphragm movement signal is output so that the target diaphragm position and the actual print position follow each other. Actuator control circuit 63
1 generates an actuator control signal based on the print movement signal. The actuator control signal is supplied to the drive circuit 6
The signal is amplified by 32 to a signal capable of driving the actuator 629, and the actuator 629 is driven. The diaphragm G12 is driven according to the driving of the actuator 629, and the exposure amount is adjusted.

Next, the structure and manufacturing method of the substrate 1 will be described with reference to the drawings. 15 is a vertical cross-sectional view showing the structure of the substrate of the optical device of FIG. 1, and FIG. 16 is an exploded perspective view showing a part of the steps in the method of manufacturing the substrate of the optical device of FIG.

As shown in FIG. 15, the substrate 1 is composed of a ceramic base 801, an iron base 801a and an aluminum base 801b. Ceramic base 8
As the material of 01, ceramic excellent in dimensional stability and heat dissipation is used, and the ceramic base 801 is a base that forms the frame of the substrate 1. Iron having a high magnetic permeability is used as the material of the iron base 801a, and the iron base 801a is a yoke (19, 2 in FIG. 1) forming a part of the actuator.
0, which corresponds to 39 and 44 in FIG. 2). The aluminum base 801b forms an image pickup element drive circuit or a video signal processing circuit, and is made of aluminum having high thermal conductivity as a base. These bases 801, 801a,
The material of 801b is not limited to the above, and for example, as the material of the base 801a, a material having high magnetic permeability, that is, electromagnetic soft iron, permalloy, or the like can be used. As the material of the base 801b, a material having high thermal conductivity such as copper can be used. Each base 80
An insulating layer 801c is formed on the surfaces of 1, 801a and 801b.

Next, a method of manufacturing the substrate 1 will be described with reference to FIG.

Referring to FIG. 16, first, the iron base 80
1a and an aluminum base 801b, a ceramic base 801 having holes previously formed in a portion corresponding to the aluminum base 801b
01a and an aluminum base 801b are prepared.

Next, the iron base 801a is fitted in one hole of the ceramic base 801, and the aluminum base 801b is fitted in the other hole. Ceramic base 801 and iron base 801a are ceramic base 80
1 and the aluminum base 801b are fixed to each other with an adhesive to form one sheet of base material.

Next, the resin is applied to the copper foil and laminated on the base material to form the ceramic base 8 shown in FIG.
01, iron base 801a, aluminum base 801b
An insulating layer 801c is formed on each surface of the. As an alternative method of forming the insulating layer 801c, there is a method of laminating a copper foil after applying a resin for forming the insulating layer on the base material side, but the former is preferable in that continuous processing is possible. Are better.

After forming the insulating layer 801c, the wiring pattern is formed by etching the copper foil, the application of the solder resist, the solder plating on the exposed copper foil surface, and the surface treatment such as the solder leveler are sequentially performed.

Next, the solid-state image pickup device 2, the coils 17 and 1
8, 38, 42, the circuit elements 45a, 45b, and the position sensors 21, 22 are electrically connected to the wiring pattern formed on the substrate 1 by soldering or the like. Coil 1
7, 18, 38, 42 and rail portions 13, 14, 1
5, 16 are adhered onto the substrate 1 with an adhesive.

As described above, a single member is not used as the base material of the substrate 1, but a material having properties suitable for the characteristics required by the components mounted on the substrate 1 is used as the base material. That is, a ceramic base material that is a skeleton of the substrate and has excellent dimensional stability such as flatness, an iron base material with high magnetic permeability in the portion where the actuator is formed, an image sensor drive circuit or image that requires heat dissipation of electronic parts. By selecting an aluminum or copper base material for the portion on which the signal processing circuit is mounted and an optimum material for each portion on the substrate 1, a substrate can be produced in which the advantages of each base material can be utilized. In particular, it is extremely effective in radiating heat from the electronic components, and it is possible to prevent the deformation of the substrate due to heat generation of the electronic components, and the relative positions of the respective optical members and the solid-state image sensor 2 due to the deformation of the substrate 1. It is possible to suppress the deviation of the optical member, the collapse of the optical member, and the like.
Therefore, it is possible to prevent deterioration of the captured image due to the deformation of the substrate 1.

In this embodiment, a sheet-shaped coil is used as the coil and the coil is adhered onto the substrate 1 with an adhesive or the like. However, similar to the pattern on the substrate 1, the copper foil is etched. By doing so, it is possible to form a coil. In this case, although there is a certain limit to the number of turns of the coil, since it can be formed in the same manner as the wiring pattern, steps such as adhering the sheet coil can be omitted, and positioning work of the sheet coil with respect to the substrate 1 can be eliminated. it can.

Next, the case where one member is used as the base material of the substrate will be described with reference to FIG. 17 is a perspective view showing another substrate used in the optical device of FIG.

As shown in FIG. 17, the substrate 802 is made of a metal substrate having a wiring pattern formed on a metal plate via an insulating layer. The material of the metal is iron having high magnetic permeability, or aluminum or copper having excellent heat dissipation. Insulation layer,
Since the formation of the wiring pattern is the same as that described above,
The description is omitted.

After the substrate 802 is prepared, first, the image pickup device 2 is arranged from the back surface of the substrate 802 to the coils 17, 18, 38, 4.
2, circuit elements 45a and 45b, position sensors 21 and 22
Are electrically connected to the wiring patterns formed on the substrate 802 from the surface of the substrate 802 by soldering, respectively, and the coils 17, 18, 38, 42, the rail portion 13,
, 16 are fixed to the substrate 802 with an adhesive or the like. According to this method, the substrate can be formed on the basis of one metal plate, so that it is possible to form a substrate having low cost and good flatness, and in addition, depending on the material of the metal portion of the substrate. The following effects (a) and (b) are obtained, respectively.

(A) In the case of a material having a high magnetic permeability such as iron When the optical system is driven by driving, a part of the substrate acts as a yoke, so that the yoke as a component is not required, which contributes to cost reduction. .

(B) In the case of a material having a good heat dissipation property such as aluminum The heat generated around the image pickup device drive circuit or the video signal processing circuit and around the actuator coil is satisfactorily dissipated, and the substrate is deformed such as warped. Can be prevented.

Next, a more effective method for preventing the deformation of the electronic components on the substrate due to heat generation and further mechanical deformation will be described with reference to FIGS. 18 to 20. FIG.
Is a perspective view showing another substrate used in the optical device of FIG.
19 is a perspective view showing another substrate used in the optical device of FIG. 1, and FIG. 20 is a diagram showing a mounting state of the substrate of FIG.

As for this method, as shown in FIG.
A method of providing a notch 809 around an electronic component 812 such as a CPU that requires heat dissipation. As shown in FIG. 19, a V groove 810 is provided around the entire optical system in which the planarity of the substrate needs to be maintained.
There is a method of providing.

A method of attaching the substrate 1 to the equipment by these methods will be described with reference to FIGS. 18 to 20.

As shown in FIGS. 18 and 19, mounting holes 811 are provided at the four corners of the substrate 1 by each method. The mounting area of the electronic component such as the CPU, which generates a large amount of heat on the substrate 1, is divided by the notch 809 or the V groove 810.

A method of mounting these substrates 1 will be described by taking the substrate 1 shown in FIG. 19 as an example.

As shown in FIG. 20, the board 1 has a mounting hole 8
It is fixed to a board mounting portion 814 provided inside the device with a screw 813 inserted through 11.

When the board mounting portion 814 is deformed by a force from the outside of the device or is deformed by the processing accuracy, an external force acts on the substrate 1, but the external force causes V.
Only the portion of the groove 810 is deformed, and the other portion of the substrate 1 can be kept flat.

The same effect can be obtained in the case of the substrate 1 having the cutout 809 shown in FIG.

Next, a structure for absorbing thermal deformation in the substrate 1 shown in FIG. 18 will be described.

Specifically, the electronic component 812 is cut out 809.
When the electronic component 812 is heated, the deformation such as the warp of the substrate 1 around the electronic component 812 is the same as that when the mechanical deformation is absorbed by the V-groove 810 by arranging the same in the region between the edge and the edge. , The thermal deformation is absorbed by the notch 809, the notch 80
The area going inward from 9 can remain flat.

Next, another substrate configuration example will be described with reference to FIGS. 21 is a perspective view showing another substrate used in the optical device of FIG. 1, and FIG.
It is a longitudinal cross-sectional view showing the substrate of No. 1.

Referring to FIGS. 21 and 22, the substrate 8
21 is composed of two sub-boards 821a and 821b each having a wiring pattern formed on a metal plate via an insulating layer.

Sub-substrate 821 forming the actuator
Sub-board 821b for forming an image sensor drive circuit or a video signal processing circuit is formed on a by using iron having high magnetic permeability as a base.
Is based on copper, aluminum, etc., which have high thermal conductivity. Insulating layers 821c and 821d are formed on the surfaces of the sub substrates 821a and 821b. The sub-substrate 821a and the insulating layer 821c are formed with an opening 829 extending coaxially, and the sub-substrate 821b and the insulating layer 821d are formed with an opening 830 extending coaxially. The solid-state image sensor 2 is inserted into the opening 830, and the solid-state image sensor 2 is mounted on the back surface of the sub-board 821b. Object light is incident on the solid-state imaging device 2 through the opening 830.

Next, a method of manufacturing the substrate 821 will be described.

First, an iron-based sub-substrate 821a forming an actuator and a copper-based or aluminum-based sub-substrate 821b are prepared.

Next, the resin is applied to the copper foil and laminated on each of the base materials, so that the sub substrates 821a and 821 are formed.
Insulating layers 821c and 821d are formed on the surface of 21b.

After forming the insulating layers 821c and 821d, the foil is etched to form a wiring pattern of the actuator circuit on the sub-substrate 821a and a wiring pattern of the image pickup device driving circuit or the video signal processing circuit on the sub-substrate 821b. To be done.

Next, surface treatment such as application of solder resist, solder plating on the exposed copper foil surface, and solder leveler is sequentially performed.

Each of the sub substrates 821a and 821b is laminated via an insulating adhesive.

By using this substrate 821, the same effect as that of the substrate shown in FIG. 15 can be obtained, and in addition, the actuator drive system, that is, the circuit element 45a and the sub-substrate 8 forming the actuator, which are sources of noise.
21a, an image pickup element drive circuit which is susceptible to noise shadow or a circuit element 45b for video signal processing and a sub-board 821b which forms an image pickup element drive circuit or a video signal processing circuit are formed on a completely different layer on the board 821. Can be formed, and the influence of noise in the substrate 821 can be minimized. The video signal processing circuit is equivalent to the video signal processing circuit 637 shown in FIG. 12, but the internal configuration thereof is not limited.

Further, in manufacturing the substrate 821, unlike the substrate 1 shown in FIG. 16, it is not necessary to fit another base into a hole formed in the base in advance to form one base. The two bases can be independently manufactured by the conventional forming method, the manufacturing process can be simplified, and the manufacturing cost can be reduced.

[0151]

As described above, according to the optical device of the first aspect, the light amount adjusting operation for adjusting the light amount of the subject image is performed on the substrate on which the photographing optical system and the solid-state image sensor are mounted. Since the light quantity adjusting means and the driving means for generating the driving force for the light quantity adjusting means to perform the light quantity adjusting operation are respectively arranged on the planes parallel to the substrate, the light quantity adjusting means and the substrate caused by the driving means are provided. It is possible to suppress an increase in thickness in the thickness direction as much as possible, and there is no fear that the light amount adjusting means and the driving means prevent the device from becoming thin.

According to the optical device of the second aspect, the optical path formed by the photographing optical system includes an optical path portion extending perpendicularly to the substrate, and the light amount adjusting means is arranged so as to adjust the amount of light passing through the optical path portion. Therefore, it is possible to adjust the light amount of the optical path portion extending vertically to the substrate by the light amount adjusting means without increasing the thickness of the substrate in the thickness direction.

According to the optical device of the third aspect, the light amount adjusting means has a movable adjusting member for performing the light amount adjusting operation by adjusting the light amount passing region of the optical path portion, and the movable adjusting member is substantially parallel to the substrate. Since the movable adjusting member operates along the flat surface, it is possible to suppress the increase in the thickness of the substrate in the thickness direction of the movable adjusting member as much as possible.

According to the optical device of the fourth aspect, the movable adjusting member is provided with the shaft rotatably and vertically supported by the substrate, and the movable adjusting member rotates about the axis. The amount of light in the optical path portion extending perpendicularly to the substrate can be adjusted by the movable adjusting member without increasing the thickness in the thickness direction.

According to the optical device of the fifth aspect, since at least a part of the constituent members of the driving means is provided on the substrate, it is possible to further suppress the increase in the thickness of the substrate due to the driving means. it can.

According to the optical device of the sixth aspect, the light amount adjusting means is mounted on the substrate on which the photographing optical system, the solid-state image sensor, and the light amount adjusting means for performing the light amount adjusting operation for adjusting the light amount of the subject image are mounted. Since the regulating portion for regulating the position is provided, the position of the light amount adjusting means with respect to the optical axis of the photographing optical system can be determined in advance by the position regulating portion, and the light amount adjustment can be performed with a simple operation procedure and high accuracy. The means can be positioned with respect to the optical axis of the photographing optical system.

According to the optical device of the seventh aspect, the optical path formed by the photographing optical system includes an optical path portion extending perpendicularly to the substrate, and the light amount adjusting means adjusts the amount of light passing through the optical path portion. Since the positioning is performed by the restricting portion, it is possible to easily perform the positioning with respect to the optical path portion formed in the photographing optical system and extending perpendicularly to the substrate.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a configuration of an embodiment of an optical device of the present invention.

FIG. 2 is an exploded perspective view showing a configuration of a diaphragm unit of the optical device of FIG.

3 is a vertical cross-sectional view showing a configuration of an actuator of an optical member G2 of the optical device of FIG.

FIG. 4 is a sectional view taken along line BB of FIG.

5 is a cross-sectional view taken along the line AA of FIG.

FIG. 6 is a vertical cross-sectional view showing another configuration example of the actuator of the optical member G2.

7 is a vertical cross-sectional view showing the periphery of the solid-state image sensor of the optical device of FIG.

8 is an exploded perspective view showing the periphery of a solid-state image sensor of the optical device of FIG.

9 is an exploded perspective view showing the periphery of the back surface side of the substrate of the solid-state image sensor of the optical device of FIG.

FIG. 10 is a vertical cross-sectional view showing another example of mounting a glass member for protecting the image pickup surface of the solid-state image pickup element.

FIG. 11 is a vertical cross-sectional view showing another mounting example of the glass member for protecting the image pickup surface of the solid-state image pickup element.

12 is a block diagram showing a configuration of the optical device of FIG.

FIG. 13 is a focusing characteristic diagram during focusing.

FIG. 14 is a diagram showing a zoom tracking curve.

15 is a vertical cross-sectional view showing a configuration of a substrate of the optical device shown in FIG.

16 is an exploded perspective view showing a part of the steps in the method for manufacturing the substrate of the optical device in FIG.

17 is a perspective view showing another substrate used in the optical device of FIG.

18 is a perspective view showing another substrate used in the optical device of FIG. 1. FIG.

19 is a perspective view showing another substrate used in the optical device of FIG. 1. FIG.

20 is a diagram showing a mounting state of the board of FIG.

21 is a perspective view showing another substrate used in the optical device of FIG. 1. FIG.

22 is a vertical sectional view showing the substrate of FIG. 21. FIG.

FIG. 23 is a vertical cross-sectional view showing the configuration of a conventional optical device.

[Explanation of symbols]

 1,802 Substrate 2 Solid-state imaging device 3,4 Moving stand 7 Magnetic scale 5,6,35,36 Permanent magnet 13,14,15,16 Rail part 17,18,38,42 Coil 19,20,39,43 Yoke 21 and 22 Position sensor 30 Aperture part 31,32 Aperture blade 33,34 Shaft 37,41 Positioning hole (regulating part) 45a, 45b Circuit element 46,47 Ball G1 Optical member G2 Optical member G3 Optical member G4 Optical member

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshiya Kurihashi 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Toshikazu Yanai 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Incorporated (72) Inventor Kenichi Kimura 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc.

Claims (7)

[Claims] 1. An optical device for forming a subject image on a solid-state image sensor through a photographing optical system, wherein a substrate on which the photographing optical system and the solid-state image sensor are mounted and a light amount of the subject image are adjusted. A light quantity adjusting means for performing a light quantity adjusting operation, and a driving means for generating a driving force for the light quantity adjusting means to perform the light quantity adjusting operation, wherein the light quantity adjusting means and the driving means are on a plane parallel to the substrate. An optical device, characterized in that they are respectively arranged in 2. The optical path formed by the photographing optical system includes an optical path portion extending perpendicularly to the substrate, and the light amount adjusting means is arranged to adjust the amount of light passing through the optical path portion. The optical device according to claim 1, wherein: 3. The light amount adjusting means has a movable adjusting member for performing the light amount adjusting operation by adjusting a light amount passing region of the optical path portion, and the movable adjusting member is provided on a surface substantially parallel to the substrate. The optical device according to claim 2, wherein the optical device operates along the line. 4. The movable adjusting member is provided with a shaft that is rotatably and vertically supported by the substrate, and the movable adjusting member rotates about the shaft. The optical device described. 5. The optical device according to claim 1, wherein at least a part of a constituent member of the actuator is provided on the substrate. 6. An optical device for forming an image of a subject on a solid-state image sensor via a photographing optical system, the photographing optical system comprising:
The solid-state image pickup device and a light amount adjusting means for performing a light amount adjusting operation for adjusting the light amount of the subject image are provided on the substrate, and a restricting portion for restricting a position of the light amount adjusting means is provided on the substrate. An optical device characterized by being provided. 7. An optical path formed by the photographing optical system includes an optical path portion extending perpendicularly to the substrate, and the light amount adjusting means adjusts the amount of light passing through the optical path portion of the substrate. The optical device according to claim 6, wherein the optical device is positioned by a restriction portion.