JPH08179007A - Change kit structure for ic tester handler - Google Patents
Change kit structure for ic tester handlerInfo
- Publication number
- JPH08179007A JPH08179007A JP33607194A JP33607194A JPH08179007A JP H08179007 A JPH08179007 A JP H08179007A JP 33607194 A JP33607194 A JP 33607194A JP 33607194 A JP33607194 A JP 33607194A JP H08179007 A JPH08179007 A JP H08179007A
- Authority
- JP
- Japan
- Prior art keywords
- measured
- change kit
- change
- tester
- types
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Packages (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣテスタによって被
測定対象ＩＣデバイスの電気的特性を測定する際に用い
るハンドラ内のチェンジキットの構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a change kit in a handler used when measuring the electrical characteristics of an IC device to be measured by an IC tester.
【０００２】[0002]
【従来の技術】ＩＣテスタによって、被測定対象ＩＣデ
バイスの電気的特性を測定する場合には、ＩＣテスタの
ハンドラ内をハンドリングして、多種多様な被測定対象
ＩＣデバイスのパッケージ外形寸法のものを搬出するた
めに、チェンジキットと呼ばれる変換キットが使用され
る。即ち、被測定対象ＩＣデバイスのパッケージの外形
寸法は多種多様であり、しかも、それが製造又は流通す
る過程で用いられるカストマトレイと呼ばれる収納トレ
イの収納配列ピッチの寸法はバラバラである。そこでＩ
Ｃテスタ側では、被測定対象ＩＣデバイスを測定するの
に必要なテストトレイの収納配列ピッチの寸法に適合さ
せるために、中間段階としてのラフなアライメントをす
るのにプレート状のチェンジキットで対応している。次
の段階では、テストトレイに収納されて測定作業を行う
ことを可能としている。2. Description of the Related Art When an IC tester is used to measure the electrical characteristics of an IC device to be measured, the inside of the handler of the IC tester is handled to obtain a variety of package external dimensions of the IC device to be measured. To carry it out, a conversion kit called a change kit is used. That is, the package of the IC device to be measured has a wide variety of outer dimensions, and the storage array pitch of the storage tray called “Kastoma Toray” used in the process of manufacturing or distributing the IC packages varies. So I
On the C tester side, a plate-shaped change kit is used to perform rough alignment as an intermediate step in order to match the dimensions of the storage array pitch of the test tray required to measure the IC device to be measured. ing. In the next stage, it is possible to carry out the measurement work while being stored in the test tray.
【０００３】しかし、上記の従来技術によれば、被試験
対象ＩＣデバイスのパッケージの外形が異なる毎、図５
に示すようなチェンジキットをその都度交換せねばなら
ない。このことは容易に多品種に対応できるメリットも
あるが、チェンジキットの交換時間が必要であり、
パッケージの外形寸法毎のチェンジキットが必要であ
り、それを準備することでＩＣテスタ稼働のためのコス
トがかさむ、また、多種で多数台のチェンジキットを
保有して活用するためには、保存のスペースが多大に必
要である、という問題点を有していた。However, according to the above-mentioned prior art, each time the package of the IC device under test has a different outer shape, as shown in FIG.
The change kit as shown in must be replaced each time. This has the merit of being able to easily support a wide variety of products, but requires change kit replacement time,
A change kit for each external dimension of the package is required, and preparing it will increase the cost for operating the IC tester. Also, in order to have and use a large number of change kits of various types, save them. It has a problem that a large amount of space is required.
【０００４】[0004]
【発明が解決しようとする課題】本発明が解決しようと
する課題は、ＩＣテスタによって被測定対象ＩＣデバ
イスの電気的特性を測定する際に用いるＩＣテスタのハ
ンドラ内のチェンジキットの種類と枚数を減少させ、
被測定対象ＩＣデバイスのパッケージ外形が変わる度毎
にチェンジキットを交換する必要のない構造を得ること
である。The problem to be solved by the present invention is to determine the type and number of change kits in the handler of the IC tester used when measuring the electrical characteristics of the IC device to be measured by the IC tester. Decrease,
It is to obtain a structure in which it is not necessary to replace the change kit every time the package outline of the IC device to be measured changes.
【０００５】[0005]
【課題を解決するための手段】本発明によるＩＣテスタ
用のハンドラのチェンジキットの構造では、プレート状
の基板上の同一平面内に、外形寸法及び深さ寸法の異な
る被測定対象ＩＣデバイス収納穴を複数段としたもの
を、複数組設ける構成とした。また、同じくプレート状
の基板上の同一平面内に、外形寸法及び深さ寸法の異な
る被測定対象ＩＣデバイス収納穴を、複数種で設け、か
つそれらを複数段に、複数組設ける構成とした。さら
に、同じプレート状の基板上の同一平面内に、外形寸法
及び深さ寸法の異なる比測定対象ＩＣデバイス収納穴
を、複数種で設け、かつそれらを複数段に、複数組設け
る構成とした。In the structure of the change kit of the handler for the IC tester according to the present invention, the IC device housing holes to be measured having different outer dimensions and depth dimensions are provided in the same plane on the plate-shaped substrate. A plurality of stages having a plurality of stages is provided. Also, in the same plane on the plate-shaped substrate, a plurality of types of IC device storage holes to be measured having different outer dimensions and depth dimensions are provided, and a plurality of sets of these holes are provided in a plurality of stages. Further, a plurality of types of ratio measurement target IC device storage holes having different outer dimensions and depth dimensions are provided in the same plane on the same plate-shaped substrate, and a plurality of sets of these holes are provided in a plurality of stages.
【０００６】[0006]
【作用】本発明によるチェンジキットの構成では、被測
定対象とするＩＣデバイスの外形寸法が大きいものを基
準として、その範囲内で収納できる外形寸法の小さいも
のの収納穴を設けることで、ハンドラによるハンドリン
グに必要な規則正しいピッチとすることができる。ま
た、本発明によれば、被測定対象ＩＣデバイスの外形
寸法と厚さ寸法及び端子形状を基にした組み合わせハ
ンドラの構造上から制約されるチェンジキットの厚さの
限界ハンドラの吸着搬送するハンドリング吸着ヘッド
が持つ上下方向へのストロークの長さ、等を考慮するこ
とで、複数段の構成が可能となった。In the configuration of the change kit according to the present invention, the handling by the handler is performed by providing a storage hole for a small external dimension that can be accommodated within that range, with the external dimension of the IC device to be measured as a reference. It can be the regular pitch required for. Further, according to the present invention, the limit of the thickness of the change kit that is constrained by the structure of the combination handler based on the outer dimensions and thickness dimensions of the IC device to be measured and the terminal shape. By considering the length of the vertical stroke of the head, etc., it is possible to configure multiple stages.
【０００７】[0007]
【実施例】図１は、本発明の実施例によるチェンジキッ
トの構造を示す概念図である。図２及び図３は、本発明
の他の実施例によるチェンジキットの概念を示す平面図
である。また、図４は、従来技術では２枚別々のチェン
ジキットであったものを、本発明によって２段とし１枚
の構成とした概念を説明するための部分的断面図であ
る。そして、図５には、従来技術によって一般的に使用
されているチェンジキットの構造を示す概念図である。1 is a conceptual diagram showing the structure of a change kit according to an embodiment of the present invention. 2 and 3 are plan views showing the concept of a change kit according to another embodiment of the present invention. Further, FIG. 4 is a partial cross-sectional view for explaining the concept of the conventional change kit having two separate change kits, which has two stages according to the present invention. FIG. 5 is a conceptual diagram showing the structure of a change kit generally used in the related art.
【０００８】（１）図１に示すように、本発明によるＩ
Ｃテスタ用ハンドラのチェンジキットの構造において
は、プレート状基板３の同一平面内に、外形寸法及び深
さ寸法の異なる複数段から成る被測定対象ＩＣデバイス
収納穴２を複数組で設けた。このことで、１枚のチェン
ジキット１が、２種類の被測定対象ＩＣデバイス４の測
定作業用として使用できるようになった。 （２）また、図２に示すチェンジキット１ではプレート
状基板３の同一平面内に、外形寸法及び深さ寸法の異な
る複数種の被測定対象ＩＣデバイス収納穴２を設けた。
このことで１枚のチェンジキット１で他種類に適用で
き、多品種少量の測定作業用として使用が可能となっ
た。(1) As shown in FIG. 1, I according to the present invention
In the structure of the change kit of the handler for the C tester, a plurality of sets of IC device storage holes 2 to be measured having a plurality of stages having different outer dimensions and depth dimensions are provided in the same plane of the plate-shaped substrate 3. As a result, one change kit 1 can be used for the measurement work of the two types of IC devices 4 to be measured. (2) In the change kit 1 shown in FIG. 2, a plurality of types of IC device storage holes 2 to be measured having different outer dimensions and depth dimensions are provided in the same plane of the plate-shaped substrate 3.
As a result, one change kit 1 can be applied to other types, and it can be used for measurement work of many kinds of small quantities.
【０００９】（３）さらに、図３に示すチェンジキット
１では、同じくプレート状基板３の同一平面内に、外形
寸法及び深さ寸法の異なる複数種の被測定対象ＩＣデバ
イス収納穴２を複数段で、かつ複数組で設けた。従っ
て、このことで１枚のチェンジキット１で適用できる種
類が増え、多品種少量の測定作業用としての利便性が高
まった。(3) Further, in the change kit 1 shown in FIG. 3, a plurality of types of IC device accommodation holes 2 to be measured having different outer dimensions and depth dimensions are provided in a plurality of stages in the same plane of the plate substrate 3. And, it was provided in multiple sets. Therefore, this increases the number of types that can be applied with one change kit 1 and enhances the convenience for measuring work of a large number of different types of products.
【００１０】[0010]
【発明の効果】本発明は、以上説明したように構成され
ているので、以下に記載されるような効果を奏する。 （１）１枚のチェンジキットで２つ以上の品種に対応で
きるために交換時間が少なくとも１／２以下となったこ
とで、ＩＣテスタの稼働率が向上した。 （２）従来技術では、被測定対象ＩＣデバイスのパッケ
ージの外形寸法が変わる毎に用意する必要があったが、
１枚で多種類の外形寸法に対応可能としたことで、チェ
ンジキットの制作費が少なくとも１／２以下に減少し
た。 （３）保有すべきチェンジキットの数が減少したこと
で、保管に要するスペースが格段に減少した。 （４）品種が変わっても、チェンジキットを交換する回
数が減らせたので、特に多品種少量のものの測定時には
セットアップ時間が短縮し、ＩＣテスタの稼働率が向上
した。Since the present invention is configured as described above, it has the following effects. (1) Since the change time is at least 1/2 or less because one change kit can handle two or more types, the operation rate of the IC tester is improved. (2) In the prior art, it was necessary to prepare each time the external dimensions of the package of the IC device to be measured changed.
By making it possible to handle a wide variety of external dimensions with one sheet, the production cost of the change kit has been reduced by at least 1/2 or less. (3) Since the number of change kits to be held has decreased, the space required for storage has dramatically decreased. (4) Since the number of times to change the change kit can be reduced even if the type of product is changed, the setup time is shortened and the operation rate of the IC tester is improved, especially when measuring a large number of various types of products.
【図１】本発明の実施例によるチェンジキットの構造を
示す概念図である。FIG. 1 is a conceptual diagram showing the structure of a change kit according to an embodiment of the present invention.
【図２】本発明の他の実施例を示す平面図である。FIG. 2 is a plan view showing another embodiment of the present invention.
【図３】本発明の第３の実施例を示す平面図である。FIG. 3 is a plan view showing a third embodiment of the present invention.
【図４】本発明の実施例の概念を説明するための断面図
である。FIG. 4 is a sectional view for explaining the concept of the embodiment of the present invention.
【図５】従来技術によるチェンジキットの構造を示す概
念図である。FIG. 5 is a conceptual diagram showing a structure of a change kit according to a conventional technique.
１ チェンジキット ２ 被測定対象ＩＣデバイス収納穴 ３ プレート状基板 ４ 被測定対象デバイス 1 Change kit 2 IC device storage hole for measurement 3 Plate-shaped substrate 4 Device for measurement
Claims (3)
外形及び深さ寸法の異なる複数段の被測定対象ＩＣデバ
イス収納穴（２）を、複数組設けた、 ことを特徴とするＩＣテスタ用ハンドラのチェンジキッ
トの構造。1. A plate-shaped substrate (3) in the same plane,
A structure of a change kit of a handler for an IC tester, characterized in that a plurality of sets of a plurality of IC device storage holes (2) to be measured having different outer shapes and depth dimensions are provided.
外形及び深さ寸法の異なる複数種の被測定対象ＩＣデバ
イス収納穴（２）を設けた、 ことを特徴とするＩＣテスタ用ハンドラのチェンジキッ
トの構造。2. In the same plane of the plate-shaped substrate (3),
A structure of a change kit for a handler for an IC tester, characterized in that a plurality of types of IC device storage holes (2) to be measured having different outer shapes and depth dimensions are provided.
外形及び深さ寸法の異なる複数種の被測定対象ＩＣデバ
イス収納穴（２）を、複数段で、かつ複数組設けた、 ことを特徴とするＩＣテスタ用ハンドラのチェンジキッ
トの構造。3. A plate-shaped substrate (3) in the same plane,
A change kit structure for an IC tester handler, characterized in that a plurality of types of IC device storage holes (2) to be measured having different outer shapes and depth dimensions are provided in a plurality of stages and in a plurality of sets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33607194A JPH08179007A (en) | 1994-12-22 | 1994-12-22 | Change kit structure for ic tester handler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33607194A JPH08179007A (en) | 1994-12-22 | 1994-12-22 | Change kit structure for ic tester handler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08179007A true JPH08179007A (en) | 1996-07-12 |
Family
ID=18295400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33607194A Withdrawn JPH08179007A (en) | 1994-12-22 | 1994-12-22 | Change kit structure for ic tester handler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08179007A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100408984B1 (en) * | 2000-07-10 | 2003-12-06 | 이국상 | Test board for burn-in test and PC base test |
| JP2007003261A (en) * | 2005-06-22 | 2007-01-11 | Hioki Ee Corp | Circuit board inspection device |
| US7652467B2 (en) | 2006-08-09 | 2010-01-26 | Fujitsu Microelectronics Limited | Carrier tray for use with prober |
| WO2012167242A2 (en) * | 2011-06-03 | 2012-12-06 | Texas Instruments Incorporated | Shuttle plate having pockets for accommodating multiple semiconductor package sizes |
| WO2020103173A1 (en) * | 2018-11-20 | 2020-05-28 | 深圳市华星光电技术有限公司 | Substrate carrier, sputtering device, and sputtering method |
-
1994
- 1994-12-22 JP JP33607194A patent/JPH08179007A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100408984B1 (en) * | 2000-07-10 | 2003-12-06 | 이국상 | Test board for burn-in test and PC base test |
| JP2007003261A (en) * | 2005-06-22 | 2007-01-11 | Hioki Ee Corp | Circuit board inspection device |
| JP4576294B2 (en) * | 2005-06-22 | 2010-11-04 | 日置電機株式会社 | Circuit board inspection equipment |
| US7652467B2 (en) | 2006-08-09 | 2010-01-26 | Fujitsu Microelectronics Limited | Carrier tray for use with prober |
| WO2012167242A2 (en) * | 2011-06-03 | 2012-12-06 | Texas Instruments Incorporated | Shuttle plate having pockets for accommodating multiple semiconductor package sizes |
| WO2012167242A3 (en) * | 2011-06-03 | 2013-01-24 | Texas Instruments Incorporated | Shuttle plate having pockets for accommodating multiple semiconductor package sizes |
| JP2014519039A (en) * | 2011-06-03 | 2014-08-07 | 日本テキサス・インスツルメンツ株式会社 | Shuttle plate with pockets to accommodate multiple semiconductor package sizes |
| US8829939B2 (en) | 2011-06-03 | 2014-09-09 | Texas Instruments Incorporated | Shuttle plate having pockets for accomodating multiple semiconductor package sizes |
| WO2020103173A1 (en) * | 2018-11-20 | 2020-05-28 | 深圳市华星光电技术有限公司 | Substrate carrier, sputtering device, and sputtering method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020305 |