JPH08139474A - Printed board mounting structure - Google Patents
Printed board mounting structureInfo
- Publication number
- JPH08139474A JPH08139474A JP30145394A JP30145394A JPH08139474A JP H08139474 A JPH08139474 A JP H08139474A JP 30145394 A JP30145394 A JP 30145394A JP 30145394 A JP30145394 A JP 30145394A JP H08139474 A JPH08139474 A JP H08139474A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- mounting structure
- support
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Landscapes
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、人工衛星搭載用等とし
て使用されるプリント基板の実装構造に関し、特に、二
以上のプリント基板が重ね合わせて実装される重段層式
のプリント基板実装構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for a printed circuit board used for mounting an artificial satellite, and more particularly to a multi-layered printed circuit board mounting structure in which two or more printed circuit boards are stacked and mounted. Regarding
【０００２】[0002]
【従来の技術】人工衛星搭載用等として使用されるプリ
ント基板においては、衛星内の限られたスペースにおい
て高密度の実装を行なうべく、二以上のプリント基板
が、一定間隔をもって同一方向上下に重ね合わされて実
装される重段層式の実装構造が採用されている。2. Description of the Related Art In a printed circuit board used for mounting an artificial satellite or the like, two or more printed circuit boards are superposed vertically in the same direction at a constant interval in order to achieve high density mounting in a limited space in the satellite. The multi-layered mounting structure is adopted.
【０００３】以下、図４及び図５を参照して、このよう
な従来のプリント基板の重段層式実装構造について説明
する。図４に示すように、例えば、二枚のプリント基板
を重段実装する場合のプリント基板の実装構造は、実装
するハウジング１に、一端がボルト状で他端がナット状
のサポート２，３を介してプリント基板４，５が実装さ
れ、固定用のねじ６，７により固定される構成となって
いる。A conventional multi-layer mounting structure for such a printed circuit board will be described below with reference to FIGS. 4 and 5. As shown in FIG. 4, for example, in a printed circuit board mounting structure in which two printed circuit boards are mounted in multiple layers, supports 2 and 3 having one end of a bolt shape and the other end of a nut shape are mounted on a housing 1 to be mounted. The printed circuit boards 4 and 5 are mounted via the above, and are fixed by fixing screws 6 and 7.
【０００４】すなわち、従来の重断層式のプリント基板
の実装構造は、上方に開口した筐体状のハウジング１の
内部底面に下側サポート２の一端が螺合し、この下側サ
ポート２の他端上に下側プリント基板５が搭載され、こ
の下側プリント基板５を貫通して上側サポート３の一端
が下側サポート２の他端に螺合する。そして、この上側
サポート３の他端上に上側プリント基板４が搭載され、
この上側プリント基板４を貫通してねじ６及びねじ７が
上側サポート３に螺合する構成となっている。That is, in the conventional mounting structure of a heavy fault type printed circuit board, one end of the lower support 2 is screwed to the inner bottom surface of the housing 1 having a housing opening upward, and the other of the lower support 2 The lower printed circuit board 5 is mounted on the end, and one end of the upper support 3 is screwed into the other end of the lower support 2 while penetrating the lower printed circuit board 5. The upper printed circuit board 4 is mounted on the other end of the upper support 3,
The upper printed board 4 is penetrated, and the screws 6 and 7 are screwed into the upper support 3.
【０００５】なお、サポート２，３及びねじ６，７につ
いては、プリント基板を安定的に支持，固定するため、
通常、少なくとも、プリント基板４，５の四隅に設けら
れ、プリント基板の大きさ等により適宜その数が増減さ
れるもので、図５に示す従来の実装構造では、プリント
基板の四隅に加えて、さらに二箇所を追加した計六箇所
に設けてある。Regarding the supports 2 and 3 and the screws 6 and 7, in order to stably support and fix the printed circuit board,
Usually, it is provided at least at the four corners of the printed circuit boards 4 and 5, and the number thereof is appropriately increased or decreased depending on the size of the printed circuit board. In the conventional mounting structure shown in FIG. 5, in addition to the four corners of the printed circuit board, It is provided at a total of six locations with two additional locations.
【０００６】このような構成からなる従来の重段層式実
装構造におけるプリント基板の実装は、以下の手順によ
り行なう。まず、ハウジング１の表面に下側サポート２
を螺合させ、この下側サポート２上に下側プリント基板
５を搭載する。そして、下側プリント基板５を貫通して
サポート２にねじ６及びねじ７を螺合させ、下側プリン
ト基板５をハウジング１に仮に固定する。The mounting of the printed circuit board in the conventional multi-layer mounting structure having such a structure is carried out by the following procedure. First, the lower support 2 is provided on the surface of the housing 1.
And the lower printed circuit board 5 is mounted on the lower support 2. Then, the lower printed circuit board 5 is pierced and the support 6 is screwed with the screws 6 and 7 to temporarily fix the lower printed circuit board 5 to the housing 1.
【０００７】この状態で、下側プリント基板５に取り付
けた端子８へ必要な配線材９をはんだ付けし、さらに、
衛星打ち上げ時の耐震対策等として、配線材９をプリン
ト基板５及びハウジング１の周囲に固着剤１０により固
着する。これで、下側プリント基板５の実装が完了す
る。In this state, the necessary wiring material 9 is soldered to the terminals 8 mounted on the lower printed circuit board 5, and further,
The wiring material 9 is fixed to the periphery of the printed circuit board 5 and the housing 1 with a fixing agent 10 as a measure against earthquakes when the satellite is launched. This completes the mounting of the lower printed circuit board 5.
【０００８】次いで、同様の手順により、上側プリント
基板４についても実装を行なう。すなわち、まず、下側
プリント基板５を仮止めしているねじ６及びねじ７を取
り外し、下側プリント基板５を貫通して上側サポート３
を下側サポート２に螺合させる。そして、この上側サポ
ート３上に上側プリント基板４を搭載する。Then, the upper printed circuit board 4 is also mounted by the same procedure. That is, first, the screws 6 and 7 that temporarily fix the lower printed circuit board 5 are removed, and the upper support 3 is penetrated through the lower printed circuit board 5.
Is screwed onto the lower support 2. Then, the upper printed circuit board 4 is mounted on the upper support 3.
【０００９】その後、上側プリント基板４を貫通して上
側サポート３にねじ６及びねじ７を螺合させて上側プリ
ント基板４を固定するとともに、下側プリント基板５と
同様にして、上側プリント基板４にも配線材９のはんだ
付けを行ない、さらに、固着剤１０による固着を行な
う。これによって、二枚のプリント基板４，５の重段実
装が完了する。なお、実装するプリント基板が二以上の
場合にも、同様の手順により行なう。After that, the upper printed board 4 is fixed by penetrating the upper printed board 4 and screwing the screws 6 and 7 onto the upper support 3 to fix the upper printed board 4 in the same manner as the lower printed board 5. Then, the wiring material 9 is soldered and further fixed by the adhesive 10. This completes the multi-stage mounting of the two printed boards 4 and 5. Note that the same procedure is performed when two or more printed circuit boards are mounted.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の実装構造では、下側プリント基板表面や上側
プリント基板裏面に、実装完了後に修理・改造等のリワ
ークが必要となった場合、一度実装，固定した上側プリ
ント基板及びその配線を全て取り外さなければならなか
った。このため、固着された配線材に傷を付けたり、周
辺の電気部品を破損したりする問題が生じ、また、作業
にも多大な時間を要する問題があった。However, in such a conventional mounting structure, when rework such as repair or modification is required after completion of mounting on the lower printed circuit board surface or the upper printed circuit board rear surface, once mounting is performed, , I had to remove all the fixed upper printed circuit board and its wiring. Therefore, there is a problem in that the fixed wiring material is scratched or electric components around the wiring material are damaged, and there is also a problem that a lot of time is required for the work.
【００１１】なお、このような問題を除去することを目
的として、特開昭５８−１３７２９８号，実開昭６２−
５５３９２号等の公報においてプリント基板の実装技術
が提案されているが、これらはいずれも、テレビ等の家
電製品におけるプリント基板の重段実装構造に関するリ
ワークに際しての不都合を解消すべく提案されたもので
ある。For the purpose of eliminating such a problem, JP-A-58-137298 and JP-A-62-62
The printed circuit board mounting techniques have been proposed in publications such as 55392, but these are all proposed in order to eliminate the inconvenience at the time of reworking regarding the multi-stage mounting structure of the printed circuit boards in home electric appliances such as televisions. is there.
【００１２】このため、人工衛星に応用した場合、構造
の複雑さ等から、操作性，作業性が悪く、特に、実開昭
６２−５５３９２号公報記載の装置では、装置自体が非
常に大型化，大重量化し、かつ、複雑な機構となるた
め、軽量小型化の要求される人工衛星には用いることは
できなかった。Therefore, when it is applied to an artificial satellite, the operability and workability are poor due to the complexity of the structure. Especially, in the device disclosed in Japanese Utility Model Laid-Open No. 62-55392, the device itself becomes very large. ， Because it becomes heavy and has a complicated mechanism, it could not be used for artificial satellites that are required to be lightweight and compact.
【００１３】本発明は、このような従来の技術が有する
問題を解決するために提案されたものであり、きわめて
単純かつ小型，軽量な構造のみによって重段層式のプリ
ント基板のリワークを簡単に行なえるプリント基板実装
構造の提供を目的とする。The present invention has been proposed in order to solve the problems of the prior art, and it is possible to easily rework a multi-layer printed circuit board only with an extremely simple, small, and lightweight structure. It is intended to provide a printed circuit board mounting structure that can be performed.
【００１４】[0014]
【課題を解決するための手段】上記目的を達成するため
本発明のプリント基板実装構造は、少なくとも二以上の
プリント基板が、上下に重ね合わされて実装されるプリ
ント基板の実装構造であって、下側プリント基板と、前
記下側プリント基板の上方に重ね合わされる上側プリン
ト基板と、前記下側プリント基板底面に配設され、該下
側プリント基板を搭載，保持する下側サポートと、下側
プリント基板の表面に配設され、前記上側プリント基板
を搭載，保持する曲折自在な上側サポートと、を具備し
た構成としてある。In order to achieve the above-mentioned object, a printed circuit board mounting structure of the present invention is a printed circuit board mounting structure in which at least two or more printed circuit boards are vertically stacked and mounted. Side printed circuit board, an upper printed circuit board overlaid on the lower printed circuit board, a lower support disposed on the bottom surface of the lower printed circuit board for mounting and holding the lower printed circuit board, and a lower printed circuit board. A flexible upper support that is disposed on the surface of the substrate and that mounts and holds the upper printed circuit board is provided.
【００１５】また、好ましくは、前記曲折自在の上側サ
ポートを、ボールジョイント機構又はリンク機構により
曲折自在に構成してある。さらに好ましくは、前記曲折
自在の上側サポートが、６０〜９０度曲折可能な構成と
してある。Preferably, the bendable upper support is made bendable by a ball joint mechanism or a link mechanism. More preferably, the bendable upper support is configured to be bendable by 60 to 90 degrees.
【００１６】[0016]
【作用】上記構成からなる本発明のプリント基板実装構
造によれば、プリント基板を支持するサポートを曲折自
在に構成することによって、固定された固着剤等を取り
外すことなく、上側プリント基板を下側プリント基板に
対して容易に展開することができ、下側プリント基板表
面，上側プリント基板裏面のリワークの際における作業
性の向上を図ることができる。According to the printed circuit board mounting structure of the present invention having the above-described structure, the support for supporting the printed circuit board is configured to be bendable, so that the upper printed circuit board is placed on the lower side without removing the fixed adhesive agent or the like. It can be easily developed on the printed circuit board, and the workability at the time of reworking the lower printed circuit board front surface and the upper printed circuit board back surface can be improved.
【００１７】[0017]
【実施例】以下、本発明のプリント基板実装構造の実施
例について、図１及び図２を参照して説明する。図１
は、本発明のプリント基板実装構造の第一の実施例を示
す一部断面正面図図であり、図２は図１におけるプリン
ト基板実装構造の上側サポートの拡大一部断面正面図で
ある。Embodiments of the printed circuit board mounting structure of the present invention will be described below with reference to FIGS. FIG.
FIG. 2 is a partially sectional front view showing a first embodiment of a printed circuit board mounting structure of the present invention, and FIG. 2 is an enlarged partial sectional front view of an upper side support of the printed circuit board mounting structure in FIG.
【００１８】ここで、本発明のプリント基板実装構造
は、プリント基板を支持するサポートの一部を曲折自在
に構成した点に特徴があり、これ以外の部分は、図３に
示す従来のプリント基板実装構造と同じ構成としてあ
る。従って、従来と同様の部分については同一符号を付
し、詳細な説明は省略する。Here, the printed circuit board mounting structure of the present invention is characterized in that a part of the support for supporting the printed circuit board is configured to be bendable, and the other parts are structured as in the conventional printed circuit board shown in FIG. It has the same structure as the mounting structure. Therefore, the same reference numerals are given to the same parts as those in the related art, and the detailed description is omitted.
【００１９】同図に示すように、本実施例のプリント基
板実装構造は、二枚のプリント基板を重段実装する場合
であり、実装対象となる上方に開口した筐体状のハウジ
ング１と、このハウジング１の内部底面に配設される下
側サポート２と、下側サポート２に搭載，保持される下
側プリント基板５と、下側プリント基板５の上に配設さ
れる上側サポート３と、上側サポート３に搭載，保持さ
れる上側プリント基板４と、上側プリント基板４貫通し
て上側サポート３に螺合するねじ６及びねじ７とからな
る。As shown in the figure, the printed circuit board mounting structure of the present embodiment is a case where two printed circuit boards are mounted in multiple stages, and a housing-like housing 1 to be mounted, which has an upper opening, A lower support 2 disposed on the inner bottom surface of the housing 1, a lower printed circuit board 5 mounted and held on the lower support 2, and an upper support 3 disposed on the lower printed circuit board 5. An upper printed circuit board 4 mounted and held on the upper support 3, and a screw 6 and a screw 7 penetrating the upper printed circuit board 4 and screwed into the upper support 3.
【００２０】サポート２，３及びねじ６，７は、少なく
ともプリント基板４，５が保持，固定できる箇所及び個
数設けられ、本実施例においてはプリント基板４，５の
それぞれ四隅に設けてあり、さらに、四隅に設けた上側
サポート３のうちの一方向側（図１における左側）の二
本の上側サポート３を、曲折自在の展開サポート１１と
して構成してある。The supports 2 and 3 and the screws 6 and 7 are provided at least at positions and in a number where the printed circuit boards 4 and 5 can be held and fixed. In this embodiment, they are provided at the four corners of the printed circuit boards 4 and 5, respectively. Of the upper supports 3 provided at the four corners, two upper supports 3 on one side (left side in FIG. 1) are configured as bendable expansion supports 11.
【００２１】この展開サポート１１は、図２に示すよう
に、軸中心部に受け部１１ａ及びボール部１１ｂの噛合
わせからなるボールジョイント機構を設けてあり、受け
部１１ａとボール部１１ｂの接触部分が球状をなし、曲
折自在となっている。As shown in FIG. 2, the unfolding support 11 is provided with a ball joint mechanism in the center of the shaft which is formed by meshing the receiving portion 11a and the ball portion 11b, and the contact portion between the receiving portion 11a and the ball portion 11b. Has a spherical shape and is bendable.
【００２２】すなわち、受け部１１ａは、展開サポート
１１の、下側プリント基板５を貫通してサポート２に螺
合するボルトを形成した側（図面下側）に、ボール部１
１ｂは、展開サポート１１の、上側プリント基板４の底
面を支持するとともに、ねじ６が螺合するナット部が形
成してある側に、それぞれ設けられ、両者が互いに連結
して、一体の展開サポート１１を構成する。That is, the receiving portion 11a is provided on the side of the expansion support 11 on which a bolt is formed which penetrates the lower printed circuit board 5 and is screwed into the support 2 (lower side in the drawing).
Numerals 1b are provided respectively on the side of the expansion support 11 that supports the bottom surface of the upper printed circuit board 4 and on which the nut portion with which the screw 6 is screwed is formed, and both are connected to each other to form an integrated expansion support. Make up 11.
【００２３】また、この展開サポート１１は、ボール部
１１ｂのボール付け根部分の一側（図２における右側）
が受け部１１ａの縁部一側と当接して一直線状に係止す
るとともに、他側（図２における左側）が受け部１１ａ
の縁部他側と当接して直角状に係止する。すなわち、展
開サポート１１は、下側プリント基板５に対して９０度
曲折自在となる。この曲折角度は、受け部１１ａの縁部
他側の高さを変えることにより、適宜変更することがで
きるが、プリント基板のリワークの作業性の観点から、
６０〜９０度の範囲が好ましい。Further, the expansion support 11 is provided on one side of the ball root portion of the ball portion 11b (right side in FIG. 2).
Comes into contact with one edge of the receiving portion 11a and locks in a straight line, and the other side (left side in FIG. 2) of the receiving portion 11a.
The other side of the edge is abutted and locked at a right angle. That is, the expansion support 11 can be bent 90 degrees with respect to the lower printed circuit board 5. The bending angle can be appropriately changed by changing the height of the receiving portion 11a on the other side of the edge portion, but from the viewpoint of workability of reworking the printed circuit board,
The range of 60 to 90 degrees is preferable.
【００２４】このような構成からなる本実施例のプリン
ト基板実装構造によりプリント基板の実装を行なう場合
には、以下の手順により行なう。すなわち、まず、ハウ
ジング１の表面に下側サポート２を螺合させ、この下側
サポート２上に下側プリント基板５を搭載する。そし
て、下側プリント基板５を貫通して下側サポート２にね
じ６及びねじ７を螺合させ、下側プリント基板５をハウ
ジング１に仮に固定する。When the printed circuit board is mounted by the printed circuit board mounting structure of the present embodiment having such a configuration, the following procedure is performed. That is, first, the lower support 2 is screwed onto the surface of the housing 1, and the lower printed circuit board 5 is mounted on the lower support 2. Then, the lower printed circuit board 5 is pierced and the lower support 2 is screwed with the screws 6 and 7 to temporarily fix the lower printed circuit board 5 to the housing 1.
【００２５】この状態で、下側プリント基板５に取り付
けた端子８へ必要な配線材９をはんだ付けし、さらに、
衛星打ち上げ時の耐震対策等として、配線材９をプリン
ト基板５及びハウジング１の周囲に固着剤１０により固
着する。これで、下側プリント基板５の実装が完了す
る。In this state, the required wiring material 9 is soldered to the terminals 8 mounted on the lower printed circuit board 5, and further,
The wiring material 9 is fixed to the periphery of the printed circuit board 5 and the housing 1 with a fixing agent 10 as a measure against earthquakes when the satellite is launched. This completes the mounting of the lower printed circuit board 5.
【００２６】次いで、同様の手順により、上側プリント
基板４についても実装を行なう。すなわち、まず、下側
プリント基板５を仮止めしているねじ６及びねじ７を取
り外し、一方向側の下側サポート２には、展開サポート
１１のねじ部を受け部１１ａと、ボール部１１ｂを噛み
合わせた状態で螺合させ、他方向側の下側サポート２に
は上側サポート３を螺合させる。Next, the upper printed circuit board 4 is also mounted by the same procedure. That is, first, the screws 6 and 7 that temporarily fix the lower printed circuit board 5 are removed, and the screw support 11a and the ball 11b of the deployment support 11 are attached to the lower support 2 on one side. The upper support 3 is screwed in the engaged state, and the lower support 2 in the other direction is screwed with the upper support 3.
【００２７】そして、この展開サポート１１及び上側サ
ポート３上に上側プリント基板４を搭載し、上側プリン
ト基板４を貫通して展開サポート１１及び上側サポート
３にねじ６及びねじ７を螺合させて上側プリント基板４
を固定する。このとき、展開サポート１１は、受け部１
１ａ及びボール部１１ｂの一側縁部及び付け根部を当接
させて一直線状としておく。これにより、上側プリント
基板４の搭載やねじ６の螺合，位置合わせ等の作業は容
易に行なうことができる。Then, the upper printed circuit board 4 is mounted on the expansion support 11 and the upper support 3, and the upper support 3 and the upper support 3 are penetrated to screw the screws 6 and 7 to the upper support 3 and the upper support 3. Printed circuit board 4
Is fixed. At this time, the expansion support 11 is connected to the receiving unit 1
1a and one side edge portion of the ball portion 11b and the base portion are brought into contact with each other to form a straight line. As a result, operations such as mounting the upper printed circuit board 4, screwing the screws 6, and positioning can be easily performed.
【００２８】その後、下側プリント基板５と同様にし
て、上側プリント基板４にも配線材９のはんだ付けを行
ない、さらに、固着剤１０による固着を行なう。この
際、上側プリント基板４の展開時に断線等が発生しない
よう、配線材９を余裕を持って配設することが望まし
い。これによって、二枚のプリント基板４，５の重段実
装が完了する。なお、実装するプリント基板が二以上の
場合にも、同様の手順により行なう。Thereafter, in the same manner as the lower printed circuit board 5, the wiring material 9 is soldered to the upper printed circuit board 4 and further fixed by the adhesive 10. At this time, it is desirable to arrange the wiring material 9 with a margin so that a disconnection or the like does not occur when the upper printed circuit board 4 is developed. This completes the multi-stage mounting of the two printed boards 4 and 5. Note that the same procedure is performed when two or more printed circuit boards are mounted.
【００２９】ここで、このように固定された状態で、下
側プリント基板５表面又は上側プリント基板４裏面に電
気部品を取り付ける等のリワーク作業が生じたときに
は、少なくともプリント基板４の裏面が見える状態が必
要となる。In this fixed state, at least the back surface of the printed circuit board 4 is visible when a rework operation such as attaching an electric component to the front surface of the lower printed circuit board 5 or the back surface of the upper printed circuit board 4 occurs. Is required.
【００３０】そこで、本実施例のプリント基板実装構造
によれば、上側プリント基板４を取り付けてあるねじ７
を取り外すことによって、上側プリント基板４の一方向
側を支持している展開サポート１１が曲折可能となるの
で、上側プリント基板４を展開し、リワーク作業が行な
える。Therefore, according to the printed circuit board mounting structure of the present embodiment, the screw 7 to which the upper printed circuit board 4 is attached is attached.
By removing, the unfolding support 11 supporting one side of the upper printed circuit board 4 can be bent, so that the upper printed circuit board 4 can be unfolded and a rework operation can be performed.
【００３１】なお、上側プリント基板４の展開時には、
展開サポート１１は、受け部１１ａ及びボール部１１ｂ
の他側縁部及び付け根部を当接させ直角状としておく。
これにより、上側プリント基板４は下側プリント基板５
に対して９０度展開した状態となるので、プリント基板
のリワーク作業を容易に行なうことができるとともに、
上側プリント基板４が展開し過ぎてハウジング１に接触
して配線，部品を傷める等のおそれもなく、安心して作
業が行なえる。When the upper printed circuit board 4 is unfolded,
The expansion support 11 includes a receiving portion 11a and a ball portion 11b.
The other side edge portion and the base portion are brought into contact with each other to form a right angle.
As a result, the upper printed circuit board 4 is moved to the lower printed circuit board 5
Since it is in a state of being developed 90 degrees with respect to, it is possible to easily perform rework work of the printed circuit board,
There is no fear that the upper printed circuit board 4 will unfold too much and come into contact with the housing 1 to damage the wiring or components, and the work can be carried out with peace of mind.
【００３２】このように、本実施例におけるプリント基
板実装構造によれば、プリント基板を支持するサポート
の一方向側にボールジョイント機構を設けることによっ
て、固定された固着剤等を取り外すことなく、上側プリ
ント基板を下側プリント基板に対して容易に展開するこ
とができ、下側プリント基板表面，上側プリント基板裏
面にリワークの必要が生じた場合にも、作業効率を損な
うことなく、きわめて簡単にリワーク作業を行なうこと
ができ、製品に対するストレスも最小限に押さえること
もできる。As described above, according to the printed circuit board mounting structure of the present embodiment, the ball joint mechanism is provided on one side of the support for supporting the printed circuit board so that the fixed adhesive agent and the like can be removed without removing it. The printed circuit board can be easily deployed to the lower printed circuit board, and even when the lower printed circuit board front surface and the upper printed circuit board back surface need to be reworked, the work efficiency is not impaired and reworking is extremely easy. Work can be performed and stress on the product can be minimized.
【００３３】なお、本実施例においては、上側サポート
３の一方向側のみを展開サポート１１としてあるが、固
着剤１０による配線材９の固着をハウジング１の内周側
面に行なわない場合には、他方向側の上側サポート３に
ついても展開サポート１１として構成することもでき
る。In this embodiment, only one direction side of the upper support 3 is used as the expansion support 11. However, if the wiring material 9 is not fixed to the inner peripheral surface of the housing 1 by the adhesive 10, The upper support 3 on the other direction side can also be configured as the expansion support 11.
【００３４】次に、本発明のプリント基板実装構造の第
二の実施例について、図３を参照して説明する。同図に
示すように、本実施例においては、上記第一の実施例に
おいて展開サポート１１に設けたボールジョイント機構
を、リンク機構に代えて設けてある。Next, a second embodiment of the printed circuit board mounting structure of the present invention will be described with reference to FIG. As shown in the figure, in this embodiment, the ball joint mechanism provided in the expansion support 11 in the first embodiment is provided instead of the link mechanism.
【００３５】すなわち、本実施例の展開サポート１１
は、軸中心部に曲折自在のリンク機構を設けるととも
に、リンク接続部が互いに当接して直線状をなし、か
つ、他側に突設したストッパ１１ｃにより展開時には直
角状となり、第一の実施例と同様、下側プリント基板５
に対して９０度曲折自在となっている。なお、展開サポ
ート１１の曲折角度は、ストッパ１１ｃの位置を変える
ことで変更することができる。That is, the expansion support 11 of this embodiment.
In the first embodiment, a bendable link mechanism is provided at the center of the shaft, the link connecting portions are in contact with each other to form a straight line, and a stopper 11c projecting to the other side forms a right angle when deployed. Similar to lower printed circuit board 5
It can be bent 90 degrees. The bending angle of the expansion support 11 can be changed by changing the position of the stopper 11c.
【００３６】これにより、上側プリント基板４が展開自
在となり、第一の実施例の場合と同様、プリント基板の
リワークを容易に行なうことができる上に、一般にリン
ク機構はボールジョイント機構に比べてコストが低いた
め、装置全体の低コスト化にも資するという効果もあ
る。As a result, the upper printed circuit board 4 can be unfolded so that the printed circuit board can be easily reworked as in the case of the first embodiment, and the link mechanism is generally less expensive than the ball joint mechanism. Since it is low, there is also an effect that it contributes to cost reduction of the entire apparatus.
【００３７】[0037]
【発明の効果】以上説明したように本発明のにプリント
基板実装構造よれば、きわめて単純かつ小型軽量な機構
のみによってプリント基板のリワークを簡単に行なうこ
とができる。As described above, according to the printed circuit board mounting structure of the present invention, the rework of the printed circuit board can be easily performed only by the extremely simple, small and lightweight mechanism.
【図１】本発明のプリント基板実装構造の第一の実施例
を示す一部断面正面図である。FIG. 1 is a partially sectional front view showing a first embodiment of a printed circuit board mounting structure of the present invention.
【図２】図１におけるプリント基板実装構造の上側サポ
ートの拡大一部断面正面図である。FIG. 2 is an enlarged partial sectional front view of an upper side support of the printed circuit board mounting structure in FIG.
【図３】本発明のプリント基板実装構造の第二の実施例
を示す、（ａ）は上側サポートの拡大一部断面正面図
で、（ｂ）は同要部斜視図である。3A and 3B show a second embodiment of the printed circuit board mounting structure of the present invention. FIG. 3A is an enlarged partial sectional front view of the upper support, and FIG.
【図４】従来のプリント基板実装構造を示す一部断面正
面図である。FIG. 4 is a partial cross-sectional front view showing a conventional printed circuit board mounting structure.
【図５】図４における従来のプリント基板実装構造の一
部平面図である。5 is a partial plan view of the conventional printed circuit board mounting structure in FIG.
１…ハウジング ２…下側サポート ３…上側サポート ４…上側プリント基板 ５…下側プリント基板 ６…固定用のねじ ７…固定用のねじ １１…展開サポート １１ａ…受け部 １１ｂ…ボール部 １１ｃ…ストッパ DESCRIPTION OF SYMBOLS 1 ... Housing 2 ... Lower support 3 ... Upper support 4 ... Upper printed circuit board 5 ... Lower printed circuit board 6 ... Fixing screw 7 ... Fixing screw 11 ... Expansion support 11a ... Receiving part 11b ... Ball part 11c ... Stopper
Claims (4)
下に重ね合わされて実装されるプリント基板の実装構造
であって、 下側プリント基板と、 前記下側プリント基板の上方に重ね合わされる上側プリ
ント基板と、 前記下側プリント基板底面に配設され、該下側プリント
基板を搭載，保持する下側サポートと、 下側プリント基板の表面に配設され、前記上側プリント
基板を搭載，保持する曲折自在な上側サポートと、 を具備したことを特徴とするプリント基板実装構造。1. A mounting structure of a printed circuit board in which at least two or more printed circuit boards are stacked and mounted on each other, and a lower printed circuit board and an upper printed circuit board stacked above the lower printed circuit board. A lower support disposed on the bottom surface of the lower printed circuit board for mounting and holding the lower printed circuit board, and a bendable body disposed on the surface of the lower printed circuit board for mounting and holding the upper printed circuit board. A printed circuit board mounting structure, characterized by comprising:
ジョイント機構により曲折自在に構成した請求項１記載
のプリント基板実装構造。2. The printed circuit board mounting structure according to claim 1, wherein the bendable upper support is made bendable by a ball joint mechanism.
機構により構成した請求項１記載のプリント基板実装構
造。3. The printed circuit board mounting structure according to claim 1, wherein the bendable upper support is constituted by a link mechanism.
９０度曲折可能な請求項１，２又は３記載のプリント基
板実装構造。4. The bendable upper support comprises 60-
The printed circuit board mounting structure according to claim 1, 2 or 3, which is bendable by 90 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30145394A JPH08139474A (en) | 1994-11-10 | 1994-11-10 | Printed board mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30145394A JPH08139474A (en) | 1994-11-10 | 1994-11-10 | Printed board mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08139474A true JPH08139474A (en) | 1996-05-31 |
Family
ID=17897079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30145394A Pending JPH08139474A (en) | 1994-11-10 | 1994-11-10 | Printed board mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08139474A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2394121A (en) * | 2002-10-09 | 2004-04-14 | Hewlett Packard Development Co | Circuit board support arrangement |
| GB2501151B (en) * | 2012-04-10 | 2014-04-09 | Xyratex Tech Ltd | A storage enclosure and a method of accessing components within a storage enclosure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3106776B2 (en) * | 1993-06-30 | 2000-11-06 | 日産自動車株式会社 | Bending mold |
-
1994
- 1994-11-10 JP JP30145394A patent/JPH08139474A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3106776B2 (en) * | 1993-06-30 | 2000-11-06 | 日産自動車株式会社 | Bending mold |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2394121A (en) * | 2002-10-09 | 2004-04-14 | Hewlett Packard Development Co | Circuit board support arrangement |
| US6822878B2 (en) | 2002-10-09 | 2004-11-23 | Hewlett-Packard Development Company, L.P. | Circuit board support arrangement, method, and method for using the same |
| GB2394121B (en) * | 2002-10-09 | 2005-12-07 | Hewlett Packard Development Co | Circuit board support arrangement,method,and method for using the same |
| GB2501151B (en) * | 2012-04-10 | 2014-04-09 | Xyratex Tech Ltd | A storage enclosure and a method of accessing components within a storage enclosure |
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