JPH08116167A - Soldering equipment - Google Patents

Abstract

PURPOSE: To provide a soldering equipment which increases the atmosphere sealability of the inside of a chamber and which allows a reflow soldering process and a flow soldering process to be done in one and the same chamber. CONSTITUTION: Inside a chamber 9, a preheating process section 4, a reflow soldering process section 6, and a flow soldering process section 7 are installed. In a heater of the preheating process section 4, control boards 13 whose board faces face the direction to cross at right angles with the direction in which wiring boards are carried are installed along the carriage direction A of the wiring boards.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for soldering a wiring board in an atmosphere in a chamber, and more particularly to a soldering apparatus excellent in atmosphere sealing property.

[0002]

2. Description of the Related Art In the following description, the following eight publications and documents will be used to describe the prior art.

Technology disclosed in Japanese Patent Laid-Open No. 60-6270 (known example 1) "Soldering of electronics" (edited by the soldering technology editorial board: published by General Electronics Publishing: date of issue, 1976) "Technology of" 9.2 Automatic device "described on pages 229 to 248 of January 20) (referred to as known example 2) -Technology of Japanese Utility Model Laid-Open No. 4-98364 (referred to as known example 3) -JP-A-5- Technology of JP-A-305429 (referred to as known example 4) -Technology of JP-A-2-30373 (referred to as known example 5) -Technology of JP-A-1-215462 (referred to as known example 6) -JP-A-60- Technology of 165791 (referred to as known example 7) -Technology of JP-A-2-294098 (referred to as known example 8) First, a soldering apparatus using a reflow method and a flow method will be described.

Wiring board soldering apparatuses are roughly classified into reflow soldering apparatuses and flow soldering apparatuses, and there are soldering apparatuses corresponding to each.

As a reflow soldering apparatus, an infrared or far infrared heating method, a hot air heating method and the like are generally used, and there is also a soldering apparatus which utilizes these characteristics in combination with each other. In either case, the wiring board is heated in the atmosphere in the chamber, and the solder in the portion to which the solder has been supplied in advance is melted and soldered.

[0006] For example, the technique of "Soldering method and apparatus for cream solder" of the known example 1 is a technique of preheating with infrared rays and melting the solder with hot air, and "infrared heater" corresponding to each step. And a "hot air blower" are installed.

The flow soldering device is a device for contacting a wiring board with a jet wave of molten solder and supplying the molten solder to a portion to be soldered for soldering. This is a configuration in which soldering is performed after preheating the wiring board,
This is the most common soldering device.

For example, in "Soldering of Electronics" of the known example 2, the details are described with examples.

Next, the technique of the soldering process in a low oxygen concentration atmosphere will be described.

Along with the progress of so-called micro soldering, in which electronic components are miniaturized and have a finer pitch, and mounting density on a wiring board is increased, so-called dechlorofluorocarbon is attempted to achieve no cleaning after soldering the wiring board. Progress is being made. The core technology for achieving these is a soldering technology in a specific gas atmosphere, or in other words, in a low oxygen concentration atmosphere. That is, in such an atmosphere, the surface tension of the molten solder is reduced, the oxidation of the soldered portion is suppressed, and good solderability can be obtained with a small amount of flux.

Therefore, also in the flow soldering apparatus, each soldering process such as the preheating process and the soldering process is covered with a tunnel-shaped chamber, and a series of soldering processes are executed in the atmosphere in this chamber. are doing. That is, nitrogen gas (N ₂
Gas) or the like, and the soldering process is performed in an atmosphere of low oxygen concentration where the inert gas occupies the majority.

This also applies to the reflow soldering apparatus, which is configured to supply an inert gas such as N ₂ gas into the chamber and execute the soldering process in an atmosphere of low oxygen concentration. .

In an apparatus for soldering in an atmosphere of such an inert gas, the gas consumption of N ₂ gas or the like is added as a cost in the soldering process of the wiring board, so N ₂ gas or the like is added. Low consumption is a mandatory requirement. Therefore, a technique for improving the sealing property of the chamber without reducing the productivity has been developed. That is, it is the development of a sealing technique that can obtain good sealing performance while leaving the carry-in port and the carry-out port from the chamber open.

For example, the sealing technique of the "reflow furnace" disclosed in the known example 3 and the sealing technique of the "heating furnace for soldering" disclosed in the known example 4 are carried into the inlet and outlet of the furnace. In addition, the plate-shaped members are arranged in parallel with each other while leaving the opening area for carry-out, and a so-called labyrinth flow path is formed to improve the sealing property of the furnace. This technique is mainly used in the field of fluid engineering as a conventional means for sealing a compressible fluid.

Next, the technique of the heater for heating will be described.

An electric heater is generally used as a means for heating the wiring board in the furnace, and a sheathed heater, a panel heater, a finned heater, etc. are used.

For example, an example in which a heating device is constructed by arranging sheathed heaters at a predetermined interval is described in "9.2.3.5 Preliminary page" described on pages 237 to 238 of the known example 2 "Soldering of electronics". Heating, "in particular in Figure 9.30 thereof.

Further, the "reflow soldering device" of the known example 5
In the above technology, a technical example using a panel heater as a heating means is described.

Further, in the technique of "Reflow soldering method and device" of the known example 6, a technique example using a heater with fins as a heating means is described. The heater with fins is used for hot air heating type reflow soldering, and is used with fins for improving heat exchange efficiency.

Next, a soldering apparatus which is compatible with both the reflow method and the flow method will be described.

Conventionally, the reflow soldering apparatus and the flow soldering apparatus are separate. Therefore, for a wiring board configured to reflow solder one side of the wiring board and flow solder the other side, solder with the flow soldering equipment after soldering with the reflow soldering equipment. The process of marking was needed. Also, the reverse order process was performed.

As a technique for eliminating such an inefficient production process, there are, for example, a "general-purpose soldering furnace" technique of the known example 7 and a "soldering device" technique of the known example 8.

In the technique of the "general-purpose solder furnace" of the known example 7,
A solder bath is installed on the lower side of one furnace, and a near infrared heater is installed on the upper side, so that reflow soldering can be performed on one surface of the wiring board and flow soldering can be performed on the other surface. are doing.

In the technique of the "soldering apparatus" of the publicly known example 8, a heating chamber of a hot air heating system is arranged on the upper side of the apparatus in the order of heating steps (preheating → reflow heating), and a heating wire heating system is arranged on the lower side. The preheating device and the jet solder bath are arranged so as to match the chamber. As a result, the controllability of the heating temperature of the wiring board is improved, and it is possible to adapt flexibly to the heating and soldering of various types of boards (wiring board for double-sided reflow, wiring board for reflow on one side with one-sided flow, etc.). .

[0025]

The sealing technique of the "reflow furnace" disclosed in the known example 3 and the sealing technique of the "heating furnace for soldering" disclosed in the known example 4 are basically the chamber Since the labyrinth flow path is formed only at the carry-in port and the carry-out port, its sealing property naturally has a limit.

Further, in the technique of the "general-purpose solder furnace" of the known example 7 and the technique of the "soldering apparatus" of the known example 8, it is considered that the atmosphere inside the chamber is sealed from the atmosphere outside the chamber. Absent.

It is an object of the present invention to remarkably improve the atmosphere sealing property of a flow soldering device or a reflow soldering device for soldering in an atmosphere in a chamber. It is another object of the present invention to realize an apparatus which is remarkably excellent in atmosphere sealing property and can perform reflow soldering and flow soldering in one chamber.

That is, by achieving an atmosphere of low oxygen concentration with an extremely small amount of inert gas consumption, a good soldering process environment can be realized, and high productivity and high-quality wiring board manufacturing can both be achieved. is there.

[0029]

The present invention is characterized in that the heater for heating forms a labyrinth flow path.

According to the first aspect of the present invention, the plate member is oriented along the carrying direction of the wiring board with the plate surface facing the heater for heating the wiring board in a direction intersecting with the carrying direction of the wiring board. Are installed side by side.

The invention according to claim 2 of the present invention is
A heater for preheating the wiring board is provided in the preheating step section, and plate-shaped members are arranged in parallel along the conveyance direction of the wiring board with the plate surface facing the heater in a direction intersecting the direction of conveying the wiring board. Then, this heater is arranged at least on the side of the wiring board where the reflow soldering is performed, and in the soldering step, the heater for heating the atmosphere in the chamber and the reflow soldering of the wiring board for the atmosphere in the chamber are performed. And a solder bath for bringing the jet wave of the solder melt into contact with the flow soldering surface side of the wiring board.

The invention according to claim 3 of the present invention is
The heater is formed as a panel-shaped heater.

[0033]

According to the first aspect of the present invention, the unnecessary flow of the atmosphere can be suppressed by the plate member provided on the heater even when the wiring board is heated in the chamber. That is, it is possible to suppress the outflow of the atmosphere in the chamber to the outside of the chamber.

According to the second aspect of the present invention, since the plate heater is provided with the plate member in the preheating process section, the fluid resistance in the chamber is increased and the atmosphere in the chamber is increased. It is possible to extremely effectively suppress the outflow of the gas to the outside of the chamber.

In the soldering process section, the reflow soldering is a hot air heating method in which hot air is blown against the wiring board in the process section, so that the temperature of the wiring board can be raised in a short time to melt the solder. A vigorous atmosphere flow occurs in the chamber due to the circulation of the hot air. However, since the chamber portion of the preheating step section forms the labyrinth passage, it is possible to obtain a very good sealing property.

Therefore, even in the flow soldering step, flow soldering can be performed in an atmosphere environment with a low oxygen concentration.

Further, in the invention according to claim 3 of the present invention, the panel-shaped heater can surely partition the inside of the chamber by the panel-shaped shape itself. Then, the plate-shaped member provided on the panel-shaped heater further partitions the inside of the chamber. As a result, the fluid resistance in the chamber is increased, and unnecessary flow of the atmosphere can be surely suppressed, and the outflow of the atmosphere in the chamber to the outside of the chamber can be suppressed more effectively.

[0038]

【Example】

[Embodiment 1] FIG. 1 is a side sectional view showing a first embodiment of the present invention, and is a view for explaining a soldering apparatus capable of performing reflow soldering and flow soldering.

In FIG. 1, reference numeral 1 is a wiring board, 2 is an entire reflow / flow soldering apparatus (hereinafter simply referred to as a soldering apparatus), and includes an inlet side labyrinth section 3, a preheating step section 4, and a soldering step section 5. , And the outlet-side labyrinth portion 8, which are sequentially arranged in the transport direction A of the wiring substrate 1 and are integrally formed by the chamber 9.
The chamber 9 includes an upper chamber body 9A and a lower chamber body 9B.
Consists of The upper chamber body 9A side of the soldering process section 5 is formed by the reflow soldering process section 6, and the lower chamber body 9B side is formed by the flow soldering process section 7.

Reference numeral 10 is a conveyer conveyor for the wiring board 1.
It is arranged through the chamber 9. Reference numerals 11 and 12 denote an inlet and an outlet of the wiring board 1 formed in the chamber 9.

As described above, the soldering apparatus 2 of FIG. 1 is configured to perform reflow soldering on the upper surface side of the wiring board 1 and flow soldering on the lower surface side. Further, the preheating process, the reflow soldering process, or the flow soldering process is performed in the atmosphere in the chamber 9, and the inlet side labyrinth portion 3 is provided on the carry-in port 11 side of the chamber 9 and the carry-out port 12 side thereof. Is provided with an outlet side labyrinth portion 8.

A restraining plate 13 made of a plate-shaped member is provided on the labyrinth portions 3 and 8 on the inlet side and the outlet side, respectively.
The wiring board 1 with its board faced in the direction intersecting the transport direction A of
Are arranged side by side in the chamber 9 along the transfer direction A, and of course, the transfer area of the wiring board 1 is left. Generally, the crossing direction of the restraining plate 13 is set at 90 ° with respect to the transport direction A of the wiring board 1 so that the resistance against the flow of the fluid (atmosphere) is maximized.

On the other hand, the preheating process section 4 is divided into three regions, in which the panel heater 14 with the inhibition plate 13 is arranged on the upper surface side of the wiring board 1 and the panel without the inhibition plate 13 on the lower surface side. The heater 14 is provided.

FIG. 2 shows a panel heater 1 with a suppression plate 13.
4 is a perspective view showing an example of No. 4 of FIG. That is, a heater 16 for preheating such as a sheath heater is attached to one surface of a panel 15 made of a metal member having good thermal conductivity, and a plate-shaped member, that is, a suppression plate 13 is attached to the other surface of the panel 15. It is the attached structure. When the panel heater 14 is attached to the chamber 9 of FIG. 1, the inhibition plates 13 are arranged side by side along the conveyance direction A of the wiring board 1 with the plate surfaces facing in a direction intersecting the conveyance direction A of the wiring board 1. . It is also effective to coat the panel 15 with a ceramic or the like that efficiently radiates far infrared rays in order to improve the heating property. Reference numeral 17 is a connection terminal of the heater 16.

Here, in FIG. 1 and FIG. 2, the chamber 9
Alternatively, the crossing direction of the inhibition plates 13 arranged in parallel with the panel heater 14 is set to 90 ° with respect to the transport direction A of the wiring board 1 so that the resistance to the flow of the fluid (atmosphere) is maximized. That is, the chamber 9 is the conveyor 10
Since it has a pipe-like shape along the line, it is possible to maximize the flow resistance of the fluid that tries to flow along the conveyor 10. In addition, the material of the restraint plate 13 is the panel 1
Although the same material as that of No. 5 may be used, it is also effective to use a material having a good radiation property of far infrared rays, such as ceramic, in order to enhance the heating property.

FIG. 3 is a perspective view showing an example in which the suppressing plate 13 is directly attached to the heater 16, and the same reference numerals as those in FIG. 2 indicate the same reference numerals.

That is, if the panel heater 14 shown in FIG. 2 is not used, the notch 13a of the restraining plate 13 is directly inserted into the heater 16 such as a sheath heater as shown in FIG. 3 and fixed by an appropriate means. By doing so, the suppressing plates 13 can be arranged in parallel along the transport direction A of the wiring board 1. However, in general, the panel heater 14 is superior in performing uniform heating.

In the preheating process section 4 of FIG. 1, the panel heater 14 for heating the lower surface side of the wiring board 1 has a configuration in which the inhibition plate 13 is not attached in the configuration of the panel heater 14 with the inhibition plate 13 of FIG. is there. In addition, although not shown, it is also effective to reduce the length of the restraining plate 13 and attach it. That is, in the first embodiment, the wiring board 1
In order to make the preheating temperature on the lower surface side of the above higher than the general preheating temperature, the interval between the wiring board 1 and the panel heater 14 is narrowed. If general preheating is performed, the panel heater 14 with the suppressing plate 13 may be used on the lower surface side as well.

FIG. 4 is a sectional view of the preheating process section 4 taken along the line II of FIG. That is, the chamber 9 is divided into an upper chamber body 9A and a lower chamber body 9B,
The upper chamber body 9A is provided with the panel heater 14 with the restraint plate 13 illustrated in FIG. 2, and the lower chamber body 9B is provided with the panel heater 14 without the restraint plate 13. Then, both the heaters 1 on the upper surface side and the lower surface side
The carrier conveyor 10 is passed between 6 and 16. The transfer conveyor 10 is configured by providing a holding claw 19 for holding the wiring board 1 on a transfer chain 18 that circulates and rotates. The holding claw 19 holds the wiring board 1 and the transfer chain 18
Is guided by the chain guide 20 and conveyed. In addition, the same reference numerals as those in FIG. 2 indicate the same parts.

The soldering process section 5 is constructed as shown in FIGS. FIG. 5 is a cross-sectional view of the reflow soldering process portion 6 taken along the line II-II of FIG. 1, and the same reference numerals as those in FIG. 4 denote the same parts. That is, in FIG. 5 and FIG.
The atmosphere heated by the reflow heater 16A is set to the fan 2
1 and the hood 22 to circulate and convey the conveyor 10
This is a configuration in which hot air is blown onto the wiring board 1 conveyed by. Further, the flow soldering process section 7 is shown in FIG.
, The solder melt 24 jetted from the jet tank 25
There is provided a flow type solder bath 23 having a structure in which the jet wave 27 is formed by a pump mechanism (shown by blades) 26.

As shown in FIG. 1, a gas supply nozzle 28 is arranged between the restraint plates 13 of the outlet side labyrinth portion 8 and an inert gas such as N ₂ gas is ejected from the gas supply nozzle 28. It is a configuration that allows it. In this case, the inert gas ejected from the gas supply nozzle 28 is blown against the chamber wall or the suppression plate 13 on the bottom side of the outlet side labyrinth portion 8, and as a result, it is ejected from between the suppression plates 13 of the outlet side labyrinth portion 8. The directivity of ejection is given so that the inert gas is ejected toward the soldering process section 5. Further, by this, it is possible to provide a reserving motion in which the inert gas swirls in the space between the restraining plates 13. In addition, in FIG. 1, the inert gas supply means is omitted and not shown.

Next, the operation will be described. The inlet-side labyrinth portion 3 and the outlet-side labyrinth portion 8 prevent the atmosphere in the chamber 9 of the preheating process unit 4 and the soldering process unit 5 from flowing out of the chamber 9. Conversely, the atmospheric air outside the chamber 9 is also suppressed from flowing into the chamber 9.

Further, since the panel heaters 14 with the inhibiting plates 13 are provided in the three regions of the chamber 9 of the preheating process section 4, the flow of the atmosphere in the chamber 9 is suppressed. Difficult to flow out of 9. Therefore, the soldering device 2 of the first embodiment can obtain extremely high sealing performance. In addition, since the reflow soldering process section 6 is configured to perform reflow soldering by a hot air heating method, the length of the outlet side labyrinth portion 8 is made slightly longer than that of the inlet side labyrinth portion 3 to improve sealing performance. There is. Further, by adopting a flow storage method as the inert gas supply method, a better sealing property is secured.

On the other hand, the inert gas ejected from the gas supply nozzle 28 flows toward the soldering process section 5.
That is, the flow amount of the atmosphere is minimized by suppressing and balancing the flow of the atmosphere that is being taken out of the chamber 9 when the transfer conveyor 10 and the wiring substrate 1 are transferred.

The soldering process is carried out as follows. That is, the wiring substrate 1 held and carried in the conveyor 10 from the carry-in port 11 is heated to a target temperature in the preheating process unit 4 after passing through the labyrinth unit 3 on the entrance side. Since the panel heater 14 on the lower surface side of the wiring board 1 is brought close to the wiring board 1, the preheating temperature on the lower surface side can be made higher than the surface temperature on the upper surface side.
Such a heating method is particularly effective for a ceramic multilayer wiring board or the like in which wiring patterns are laminated in multiple layers and a ceramic having a large specific heat is used as an insulating base member.

Then, in the soldering process section 5, the lower surface side of the wiring substrate 1 is brought into contact with the jet wave 27 to be soldered,
On the upper surface side of the wiring board 1, the solder that has been supplied in advance is melted by the hot air, and the intended portion is soldered. Even in a ceramic multilayer wiring board or the like, since the layers are sufficiently heated, the solder melt 24 supplied from the jet wave 27 can be sufficiently supplied to each layer.

Further, in the soldering process section 5, since the heating method for reflow soldering is the hot air heating method,
The hot air radiated from the solder melt 24 or the like in the solder bath 23 is hardly affected by the hot air heating temperature, and the controllability of the reflow soldering temperature is excellent.

Next, the wiring board 1 is conveyed from the carry-out port 12 to the next step through the labyrinth section 8 on the exit side, and a series of soldering processes are completed.

In FIG. 1, the reflow soldering process section 6 and the flow soldering process section 7 are connected to the wiring board 1.
It was provided at the same position in the vertical direction with respect to the transport direction A of
The reflow soldering process part 6 and the flow soldering process part 7 may be provided so as to be displaced from each other. That is, the flow soldering process section 7 can be provided on the rear side or the front side of the reflow soldering process section 7 in the transport direction A of the wiring board 1. [Embodiment 2] FIG. 6 is a side sectional view showing a second embodiment of the present invention, showing a flow soldering apparatus 31.
The same reference numerals denote the same parts.

That is, the second embodiment shows an example in which the heater 16 with the inhibiting plate 13 is used as the preheating heater of the flow soldering apparatus 31. Further, although not shown in the drawing, like the first embodiment, the panel heater 14 may be provided with the inhibition plate 13.

As shown in FIG. 6, the transfer conveyor 1 for the wiring substrate 1 is placed in a tunnel-shaped chamber 32 having a "V" shape.
No. 0, and a heater 16 with a suppression plate 13 is provided in the preheating process section 4, and subsequently the solder melt 2
Solder bath 23 and chamber 32 forming the jet wave 27 of No. 4
A gas supply nozzle 28 for supplying an inert gas such as N ₂ gas for forming an atmosphere of low oxygen concentration is provided therein. In addition, in the tunnel-shaped chamber 32, the plate 1 is oriented in a direction intersecting the transfer direction A of the wiring substrate 1 and the restraining plate 1 is provided.
3 are arranged in parallel along the transport direction A of the wiring board 1. Further, also in the second embodiment, the same technique as in the first embodiment is used as the inert gas supply technique.

As described above, by using the heater 16 with the inhibiting plate 13 as the heater for preheating, unnecessary flow of the atmosphere in the chamber 32 is suppressed, and the sealing property of the chamber 32 is significantly improved. . Therefore, it becomes possible to realize an environment of a good soldering process excellent in atmosphere controllability, and the soldering quality of the wiring board 1 is significantly improved. [Third Embodiment] FIG. 7 is a side sectional view showing a third embodiment of the present invention, showing a reflow soldering apparatus 41, and the same reference numerals as those in FIG. 1 denote the same parts.

That is, the third embodiment shows an example in which the preheating step portion 4 of the reflow soldering device 41 is provided with the suppression plate 13 on the panel heater 14 as in the first embodiment.
Although not shown, the heater 16 with the restraint plate 13 is also provided.
It is also possible to adopt a configuration provided with.

As shown in FIG. 7, a conveyer conveyor 10 for the wiring board 1 is provided through each part of the chamber 9.
Panel heaters 14 each having a restraining plate 13 are provided in the preheating step section 4, and subsequently, in the reflow soldering step section 6, a reflow heater 16A for blowing hot air onto the wiring board 1, Fan 21, hood 2
2 and so on. Further, an inlet side labyrinth portion 3 is provided on the carry-in port 11 side of the wiring board 1, and an outlet side labyrinth portion 8 is provided on the carry-out port 12 side.

A gas supply nozzle 28 for forming an atmosphere of low oxygen concentration in the chamber 9 is arranged in the outlet side labyrinth portion 8. In addition, also in the third embodiment, the same technique as in the first embodiment is used as the inert gas supply technique.

As described above, by using the panel heater 14 with the inhibiting plate 13 as the preheating heater,
Unnecessary flow of the atmosphere in the chamber 9 is suppressed, and the sealing property of the chamber 9 is significantly improved. Therefore, it becomes possible to realize an environment of a good soldering process excellent in atmosphere controllability, and the soldering quality of the wiring board 1 is significantly improved.

The heater 14 of the panel with the restraint plate 13
It is also possible to configure the heating means of the reflow soldering process section 6 by using. However, since the heating means in this case is a direct heating method such as a far infrared heating method, the fan 21 and the hood 22 for blowing hot air onto the wiring board 1 are not necessary. That is, these are design matters when the optimum heating characteristics are selected for the wiring substrate 1 which is the member to be soldered.

[0068]

As described above, according to the invention described in claim 1 of the present invention, the plate-shaped member is wired to the heater for heating the wiring substrate with the plate surface oriented in the direction intersecting the direction in which the wiring substrate is conveyed. Since the substrates are arranged side by side along the carrying direction of the substrate, the atmosphere sealing property of the flow soldering device or the reflow soldering device that performs soldering in the chamber atmosphere can be significantly improved. In other words, this greatly improves the atmosphere controllability, and it becomes possible to realize a good soldering process environment, and it is possible to perform high-quality soldering on the soldered member such as the wiring board. Become.

Further, it becomes possible to achieve an atmosphere of low oxygen concentration with a very small amount of inert gas consumption without using a shutter mechanism or the like, and to achieve both high productivity and high quality wiring board manufacturing at low cost. Will be able to.

Further, in the invention according to claim 2, a heater for preheating the wiring board is provided in the preheating process section, and the plate surface is directed to the heater in a direction intersecting the direction in which the wiring board is conveyed. Plate-shaped members are arranged side by side along the carrying direction of the wiring board, a heater is disposed on at least the surface side of the wiring board on which reflow soldering is performed, and in the soldering step part, a heater for heating the atmosphere in the chamber, With a fan for blowing the atmosphere in the chamber onto the reflow soldering surface side of the wiring board, and with a solder bath for contacting the jet wave of the solder melt with the flow soldering surface side of the wiring board, It is possible to obtain good heating temperature controllability during the reflow process, and by using a heater with a suppression plate in the preheating process part, the atmosphere sealing property is remarkably excellent, low cost and high cost. It is possible to realize a soldering apparatus capable of both solderable capable reflow soldering process and flow soldering process quality.

Further, in the invention according to the third aspect, since the heater is formed by the panel heater, the panel heater itself also partitions the chamber, and the unnecessary atmosphere flow is further suppressed. Therefore, there is an advantage that it becomes possible to realize a soldering apparatus having a further improved atmospheric sealing property.

[Brief description of drawings]

FIG. 1 is a side sectional view showing a first embodiment of the present invention.

FIG. 2 is a perspective view showing an example of the panel heater shown in FIG.

FIG. 3 is a perspective view showing an example in which a suppression plate is attached to a heater.

FIG. 4 is a cross-sectional view of a preheating process section taken along line I-I of FIG.

5 is a cross-sectional view of the reflow soldering process section taken along line II-II of FIG.

FIG. 6 is a side sectional view showing a second embodiment of the present invention.

FIG. 7 is a side sectional view showing a third embodiment of the present invention.

[Explanation of symbols]

 1 wiring board 2 reflow / flow soldering device 3 inlet side labyrinth part 4 preheating step part 5 soldering step part 6 reflow soldering step part 7 flow soldering step part 8 outlet side labyrinth part 9 chamber 10 transport conveyor 13 restraining plate 14 panel heater 15 panel 16 heater 16A heater 23 solder bath 24 solder melt 27 jet wave 31 flow soldering device 41 reflow soldering device

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Ryoji Hakuda 2-1-1, Nishishinjuku, Shinjuku-ku, Tokyo Inside Hitachi Chemical Co., Ltd. (72) Inventor Masaei Yamakawa 2-chome, Nishishinjuku, Shinjuku-ku, Tokyo No. 1 within Hitachi Chemical Co., Ltd.

Claims (3)

[Claims] 1. A soldering apparatus comprising a heater in a chamber, wherein the wiring board is heated in an atmosphere in the chamber to carry out soldering while heating the wiring board, wherein the heater heats the wiring board. A soldering device, wherein the plate-shaped members are arranged in parallel along the transportation direction of the wiring board with the plate surface facing in a direction intersecting the transportation direction. 2. A preheating step part for preheating a wiring board in an atmosphere in a chamber, and a soldering step for performing reflow soldering on one surface of the wiring board and flow soldering on the other surface. And a heater for preheating the wiring board in the preheating step section, and directing a plate surface in a direction intersecting a direction in which the wiring board is conveyed to the heater. Plate-like members are arranged in parallel along the carrying direction of the wiring board, the heater is arranged at least on the surface side of the wiring board on which reflow soldering is performed, and in the soldering step section, the atmosphere in the chamber is set. And a fan for blowing the atmosphere in the chamber to the reflow soldering surface side of the wiring board, and the jet wave of the solder melt is applied to the flow solder of the wiring board. And a solder bath into contact with only the surface side, the soldering apparatus, characterized in that. 3. The soldering device according to claim 1, wherein the heater is a panel-shaped heater.