JPH0793347B2 - Semiconductor device inspection equipment - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device inspection apparatus.

2. Description of the Related Art Conventionally, after inspecting the electrical characteristics of a semiconductor device in a wafer state and judging whether the semiconductor device is good or bad, in order to separate a good product and a defective product in a die bonding process as a post process, an example is shown in FIG. Ink dots have been applied to defective semiconductor devices by using a defective ink dot device (hereinafter referred to as an inker).

The outline of the mechanism of the inker will be described with reference to FIG. The inker body is fixed to the prober by the support rod 8. The lead 1 made of synthetic fiber Tegus passes through the inside of the ink fountain 3 and reaches almost the tip of the lead support cylinder 2. The lead 1 is also connected to the mover 5. The mover 5 penetrates the inside of the electromagnet 4 and connects the lead 1, and when a current is passed through the coil of the electromagnet 4, the mover 5 moves downward due to the magnetic force, and when the current is stepped, the spring 6
It is a mechanism that returns to the top. The lead 1 moves up and down inside the lead support cylinder 2 and the ink fountain 3 in conjunction with the mover 5. The lead support cylinder has a uniform inner diameter and outer diameter.
When the ink fountain 3 is filled with ink and the lead 1 is moved up and down several times, the ink adheres to the tip and side wall of the lead 1. Third
As shown in FIGS. A and b, when the position and height of the inker are appropriately adjusted and the lead 1 is lowered on the semiconductor device having the defective electric characteristics, the ink adhering to the tip of the lead 1 becomes a dot on the defective semiconductor device. To be done. The height of the lead 1 is adjusted by the adjusting screw 7 so that the lead 1 is brought into proper contact with the surface of the semiconductor device at the time of hitting.

That is, FIG. 3 is an enlarged cross-sectional view of a part of the ink fountain 3, the lead support cylinder 2 and the lead 1 of FIG. 2 in order to clarify the actual use state. Semiconductor device pad 1
1, and a probe 10 for measuring electrical characteristics is added.

FIG. 3a is a diagram before ink dots are applied. The ink 9 filled in the ink fountain 3 reaches near the tip of the lead support cylinder 2 due to surface tension and capillary development.

FIG. 3b is a diagram at the time of hitting the ink. The lead 1 drops and reaches the surface of the defective semiconductor device 12, and a part of the ink 9 attached to the tip of the lead 1 is spotted on the surface of the defective semiconductor device 12.

FIG. 3c is a diagram showing a state in which the operations shown in FIGS. 3a and 3b are repeated hundreds to thousands of times. The ink 9 adheres to the outer wall of the tip of the lead support cylinder 2 and its amount gradually increases, and the ink 9 becomes spherical due to the surface tension and its diameter also increases. Usually, it depends on the viscosity of the ink, and the lower the viscosity, the faster the state of FIG.

The state of FIG. 3c further progresses, and finally, as shown in FIG. 3d, a large lump of ink 9 is generated by the probe 10 or the pad.
Attach to 11. When the ink adheres to the probe 10, the ink adheres to the pad 11 during the subsequent measurement of the semiconductor device, causing wire bond failure during the wire bond process in the subsequent process.
Further, since the height of the ink attached to the surface of the semiconductor device reaches several hundreds of microns or more due to the surface tension, when the probe 10 is moved to measure the adjacent semiconductor device on the wafer, the tip of the probe 10 is exposed to the ink. Upon contact, the probe 10 and the pad 11 of the semiconductor device are contaminated with ink. Also, the ink itself may pull the thread and contaminate the next chip.

Means for Solving the Problems The present invention is to attach a sensor made of a conductive material to the outer wall of an insulating lead supporting cylinder and to detect a leak current by applying a voltage between the insulating lead supporting cylinder and the sensor. is there.

Operation With this configuration, the voltage is always applied between the conductive lead and the sensor, the conductive ink collects at the tip of the insulating lead supporting cylinder, and when the sensor comes into contact with the sensor, a leak current flows to enable detection.

Example 1 An example is shown in Fig. 1a. Conductive lead 1 (eg, metal, carbon-based), insulating lead support cylinder 13 is attached with metal cylinder 14 on the outer wall tip, and conductive lead 1 and metal cylinder 14 are attached.
Is electrically connected and a buzzer 15 is attached. The ink 9 is a conductive ink (eg, carbon-based ink, water-based ink).

First, in the state of FIG. 1A, the buzzer 15 does not operate because there is the insulating lead support cylinder 13 between the conductive lead 1 and the metal cylinder 14 and they are not electrically connected. The state shown in FIG. 1B is when the ink 9 is formed at the tip of the insulating lead support cylinder 13. At this time, if the ink 9 is conductive, the insulating lead supporting cylinder 13 is provided between the conductive lead 1 and the metal cylinder 14.
However, through the ink 9, the conductive lead 1 and the metal tube 14 are electrically connected to each other, and the buser 15 operates, so that a lump of ink is formed into a spherical shape at the tip of the insulating lead support tube 13. It can be confirmed that this is possible, and by eliminating this, contamination of the non-defective semiconductor device with ink can be prevented.

EFFECTS OF THE INVENTION If the present invention is used, a semiconductor device can be efficiently inspected and its industrial value is great.

[Brief description of drawings]

FIG. 1 is a structural schematic diagram of a semiconductor device inspection apparatus according to an embodiment of the present invention, FIG. 2 is a schematic diagram of a conventional inspection apparatus, and FIG.
The figure is a conventional operation state diagram. 1 ... Lead (conductive lead in FIG. 1), 2 ... Lead support cylinder, 3 ... Inkwell, 4 ... Electromagnet, 5 ... Mover, 6 ... Spring, 7 ... Lead height adjustment Screw, 8 ... Support rod, 9 ... Ink (same electrical ink in Fig. 1), 10 ...
… Probe, 11 …… Pad, 12 …… Semiconductor device, 13 ……
Insulated lead support tube, 14 …… Metal tube, 15 …… Buzzer.

Claims (1)

[Claims] 1. A conductive lead, an insulating lead supporting cylinder for supporting the lead on an inner wall, a lead supporting cylinder and a tip of the lead, and a defective product spot in a gap between the lead side wall and the inner wall of the lead supporting cylinder. A leak that flows while applying a voltage between the conductive lead and the sensor, which is provided with an ink bottle for supplying a conductive ink for use with the sensor and a sensor made of a conductive material provided on the tip of the outer wall of the lead support cylinder. Semiconductor device inspection device that detects current.