JPH0739220B2 - Cream Solder screen mask - Google Patents
Cream Solder screen maskInfo
- Publication number
- JPH0739220B2 JPH0739220B2 JP26080786A JP26080786A JPH0739220B2 JP H0739220 B2 JPH0739220 B2 JP H0739220B2 JP 26080786 A JP26080786 A JP 26080786A JP 26080786 A JP26080786 A JP 26080786A JP H0739220 B2 JPH0739220 B2 JP H0739220B2
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- screen mask
- pattern
- solder
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Plates And Materials Therefor (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、フラットパッケージICやリード付きチップキ
ャリアIC等の高密度リード付きICを印刷配線基板上へ半
田付けする際に使用するクリーム半田印刷用スクリーン
マスクの印刷パターンに関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to cream solder printing used for soldering high-density leaded ICs such as flat package ICs and chip carrier ICs with leads onto a printed wiring board. The printing pattern of the screen mask for use.
（従来の技術） 近年、高密度実装を行うために印刷配線基板上に集積回
路（IC）を内蔵するパッケージが搭載されるようになっ
てきている。特にフラットパッケージIC及びリード付き
チップキャリアICは他のチップ型面実装部品と共に高密
度化、薄型化に適しているため、広く使用されるように
なってきている。ところで、これらICと印刷配線基板と
を接続するリード端子のリード数と、そのリードピッチ
は高密度化の要求と共に多端子、小ピッチ化の傾向にあ
り、最近ではピン数100以上、リードピッチ0.635mm以下
のもが広く使われるようになっている。(Prior Art) In recent years, a package containing an integrated circuit (IC) has been mounted on a printed wiring board for high-density mounting. In particular, flat package ICs and chip carrier ICs with leads are widely used because they are suitable for high density and thinning together with other chip type surface mount components. By the way, the number of leads of the lead terminals connecting these ICs and the printed wiring board and the lead pitch thereof are tending to be multi-terminals and small pitches along with the demand for high density. Recently, the number of pins is 100 or more and the lead pitch is 0.635. Thing less than mm is widely used.
しかし、これらフラットパッケージICやリード付きチッ
プキャリアICのリードピッチが小さくなるにしたがっ
て、半田付け前に印刷配線基板上に印刷塗布されるクリ
ーム半田の印刷性が悪くなり、クリーム半田未塗布不良
や、隣接する塗布部との印刷ブリッジ不良が発生し易
く、後工程にて改修することが必要となっている。However, as the lead pitch of these flat package ICs and chip carrier ICs with leads becomes smaller, the printability of cream solder that is printed and applied on the printed wiring board before soldering deteriorates, resulting in poor solder paste application, A printing bridge defect with an adjacent coating portion is likely to occur, and it is necessary to repair it in a later process.
このような状況から、半田付け接続の不良率を低減させ
るために種々の提案がなされており、この種の先行技術
として、実開昭61−12267号、特開昭61−13654号等があ
げられる。Under such circumstances, various proposals have been made in order to reduce the defective rate of soldering connection, and examples of this type of prior art include Japanese Utility Model Laid-Open No. 61-12267 and Japanese Patent Laid-Open No. 61-13654. To be
以下、これらの従来技術の構成を図を用いて説明する。Hereinafter, the configurations of these conventional techniques will be described with reference to the drawings.
第７図は従来のクリーム半田印刷用スクリーンマスクに
より、印刷配線基板上の接続部にクリーム半田を塗布し
た第１の例を示す平面図である。FIG. 7 is a plan view showing a first example in which cream solder is applied to a connection portion on a printed wiring board by using a conventional cream solder printing screen mask.
この図において、印刷配線基板に整列して設けられた接
続パターン１に対応して矩形のクリーム半田塗布パター
ン２を互い違いに、つまり、千鳥状に配置したスクリー
ンマスクを使用してクリーム半田を印刷塗布するように
している。In this figure, the rectangular cream solder application patterns 2 are staggered in correspondence with the connection patterns 1 arranged on the printed wiring board, that is, the cream solder is applied by printing using a screen mask arranged in a staggered pattern. I am trying to do it.
このように、矩形のクリーム半田塗布パターン２を互い
に違いに配置したことにより、隣接する塗布部との隣接
辺の長さが短くなり、印刷ブリッジ不良及び半田ブリッ
ジの不良を減少させることができる。As described above, by arranging the rectangular cream solder coating patterns 2 differently from each other, the length of the side adjacent to the adjacent coating portion can be shortened, and printing bridge defects and solder bridge defects can be reduced.
第８図は従来のクリーム半田印刷用スクリーンマスクに
より印刷配線基板上の千鳥状に配設された接続パターン
３上にクリーム半田を塗布した第２の例を示す平面図で
ある。FIG. 8 is a plan view showing a second example in which cream solder is applied onto the connection patterns 3 arranged in a staggered pattern on a printed wiring board by a conventional cream solder printing screen mask.
この場合、クリーム半田印刷用スクリーンマスクのクリ
ーム半田塗布パターン４も印刷配線基板上の接続パター
ン３をはみ出さない範囲で、互い違いに印刷塗布するよ
うにしている。In this case, the cream solder application patterns 4 of the screen mask for cream solder printing are also alternately applied by printing as long as the connection patterns 3 on the printed wiring board do not protrude.
このように、印刷配線基板上の接続パターン４も互い違
いに配置したことにより、互い違いに配置して印刷され
たクリーム半田が溶融時に基板上の接続部に拡がっても
隣接する接続パターン３との隣接辺の長さが短く保たれ
るため、半田ブリッジの不良を減少させることができ
る。In this way, the connection patterns 4 on the printed wiring board are also staggered, so that even if the cream solder printed with staggered printing spreads to the connection part on the board when melted, it is adjacent to the adjacent connection pattern 3. Since the length of the side is kept short, defects in the solder bridge can be reduced.
（発明が解決しようとする問題点） しかしながら、これら従来の方法では、 （１） リードピッチがより小さくなった場合に、印刷
されたクリーム半田が隣接する接続パターンのクリーム
半田と連ながってしまい、半田溶融時に半田ブリッジ不
良を発生し易くなったり、 （２） また、所定の印刷厚さに対してスクリーンマス
クの印刷スリット幅寸法Ｗが小さ過ぎるために、スクリ
ーンマスクからのクリーム半田の版抜け性が悪くなり、
クリーム半田が印刷されないため、半田オープン不良が
発生し易いといった問題があった。(Problems to be Solved by the Invention) However, in these conventional methods, (1) when the lead pitch becomes smaller, the printed cream solder is connected to the cream solder of the adjacent connection pattern. Therefore, solder bridging defects are likely to occur when the solder is melted. (2) Further, since the print slit width dimension W of the screen mask is too small for a predetermined print thickness, the plate of cream solder from the screen mask The ease of removal becomes worse,
Since the cream solder is not printed, there is a problem that a solder open defect is likely to occur.
本発明は、上記問題点を除去し、クリーム半田印刷時に
おけるクリーム半田の隣接する接続パターンとの連なが
り不良や、版抜け不良を減少させ、半田溶融時の半田接
続品質を向上させ得るクリーム半田印刷用スクリーンマ
スクを提供することを目的とする。The present invention eliminates the above-mentioned problems, reduces the connection failure of the cream solder with the adjacent connection pattern at the time of cream solder printing, and reduces the defective printing, and improves the solder connection quality during solder melting. An object is to provide a screen mask for solder printing.
（問題点を解決するための手段） 本発明は、上記問題点を解決するために、印刷配線基板
上へ高密度リード付きICを半田付けする際に使用するク
リーム半田印刷用スクリーンマスクにおいて、上記ICリ
ードを半田接続すべき印刷配線基板上の接続パターンの
形状が矩形であるにもかかわらず、この接続パターン上
に印刷塗布するクリーム半田の印刷形状を複数個の円形
とし、かつ、隣接する接続パターン上に印刷塗布するク
リーム半田の複数個の円形形状の中心位置が互い違いに
なるように配置するようにしたものである。(Means for Solving Problems) In order to solve the above problems, the present invention provides a cream solder printing screen mask used when soldering an IC with high-density leads onto a printed wiring board, comprising: Despite the rectangular shape of the connection pattern on the printed wiring board to which the IC leads should be connected by soldering, the solder paste printed on the connection pattern should be printed in multiple circles and adjacent connections should be made. The cream solder to be printed and applied on the pattern is arranged so that the center positions of a plurality of circular shapes are staggered.
（作用） 本発明によれば、上記のように構成したので、隣接する
クリーム半田パターン間の距離が従来の矩形の場合と同
一でありながら、従来の矩形パターンの幅寸法よりも大
きな寸法の直径の円形パターンを配置することにより、
クリーム半田印刷時のクリーム半田の連ながり不良や、
版抜け不良等の印刷不良を減少させることができる。(Operation) According to the present invention, since it is configured as described above, the distance between adjacent cream solder patterns is the same as in the case of the conventional rectangle, but the diameter of the dimension larger than the width dimension of the conventional rectangular pattern. By arranging the circular pattern of
When the solder paste is printed with cream solder,
It is possible to reduce printing defects such as defective printing.
（実施例） 以下、本発明の実施例について図面を参照しながら詳細
に説明する。(Example) Hereinafter, the Example of this invention is described in detail, referring drawings.
第１図は本発明の一実施例を示すクリーム半田塗布状態
平面図、第２図は本発明のクリーム半田印刷用スクリー
ンマスクのセット状態を示す図、第３図はクリーム半田
塗布パターンの説明図、第４図は本発明の一実施例を示
すICの実装状態を示す図である。FIG. 1 is a plan view of a cream solder application state showing an embodiment of the present invention, FIG. 2 is a view showing a set state of a screen mask for cream solder printing of the present invention, and FIG. 3 is an explanatory view of a cream solder application pattern. FIG. 4 is a diagram showing a mounted state of an IC showing an embodiment of the present invention.
この実施例おいては印刷配線基板11の接続パターン12は
４方向に同列に形成されている。この接続パターン12上
に印刷塗布されるクリーム半田のスクリーンマスク17
（第２図参照）に形成された印刷パターンにより、複数
個の円形のクリーム半田塗布パターン16が形成される。
このクリーム半田塗布パターン16は隣接するクリーム半
田塗布パターン16とはその円形の中心が互いに違いにず
れるように配置される。即ち、第２図に示されるよう
に、クリーム半田を塗布したい印刷配線基板11を所定の
位置にセットし、該印刷配線基板の矩形の接続パターン
12上に、対応する複数の円形塗布パターンが重なるよう
に、該円形パターンが形成、配置されたスクリーンマス
ク17を所定の距離をもたせて覆い被せた後、該スクリー
ンマスク17上に供給されたクリーム半田をスキージ等の
治具を使って擦りつけることによって、クリーム半田が
スクリーンマスク17に形成された円形パターンを通して
印刷配線基板11上に形成された矩形パターン上に接する
までにスクリーンマスク17と共に押し付けられ、スキー
ジ等の治具の移動によりスクリーンマスク17が印刷配線
基板11から離れる時に、クリーム半田と印刷配線基板11
との接着力により、クリーム半田がスクリーンマスク17
から版抜けし、印刷配線基板11上に塗布される。なお、
ここで使用するスクリーンマスク17の材質は一般に使用
されているもの、例えば、ステンレス版、銅版ニッケル
メッキ版、樹脂版等いずれでも可能である。In this embodiment, the connection patterns 12 on the printed wiring board 11 are formed in the same row in four directions. Screen mask 17 of cream solder printed and applied on this connection pattern 12
A plurality of circular cream solder application patterns 16 are formed by the printing pattern formed (see FIG. 2).
The cream solder application patterns 16 are arranged such that the centers of the circles of the adjacent cream solder application patterns 16 are different from each other. That is, as shown in FIG. 2, the printed wiring board 11 to which cream solder is to be applied is set at a predetermined position, and the rectangular connection pattern of the printed wiring board is set.
The circular pattern is formed and arranged so that the plurality of circular coating patterns corresponding to each other are overlapped on the screen mask 12, and the screen mask 17 is covered with a predetermined distance, and then the cream supplied onto the screen mask 17 is applied. By rubbing the solder with a jig such as a squeegee, the cream solder is pressed together with the screen mask 17 through the circular pattern formed on the screen mask 17 until it contacts the rectangular pattern formed on the printed wiring board 11. , When the screen mask 17 is separated from the printed wiring board 11 by the movement of a jig such as a squeegee, the cream solder and the printed wiring board 11
Due to the adhesive strength with
The plate is removed from the printed circuit board and applied onto the printed wiring board 11. In addition,
The material of the screen mask 17 used here may be a commonly used one, for example, a stainless plate, a copper plate nickel-plated plate, a resin plate, or the like.
この場合、円形パターンは印刷配線基板11との接触面積
に対する周長が矩形と比較して短いため、クリーム半田
と印刷配線基板11との接着力に対するスクリーンマスク
による抵抗力が小さく、クリーム半田の版抜け性が良好
であり、従って、版抜け不良が減少する。In this case, the circular pattern has a shorter perimeter relative to the contact area with the printed wiring board 11 than the rectangular shape, and therefore the resistance of the screen mask to the adhesive force between the cream solder and the printed wiring board 11 is small, and the cream solder plate Good releasability, thus reducing defective printing.
この点について第３図を参照しながら詳細に説明する。This point will be described in detail with reference to FIG.
第３図は隣接する接続パターンへの塗布間隙と接続パタ
ーンへの塗布幅の関係を示したものである。FIG. 3 shows the relationship between the coating gap between adjacent connection patterns and the coating width of the connection patterns.
この図において、隣接する接続パターン上に印刷塗布さ
れるクリーム半田が連ながり不良となるのを防止するた
めに、クリーム半田塗布間隙をｘに固定すると、隣接す
る接続パターンのピッチをｐとした場合、矩形のクリー
ム半田塗布パターン（矩形パターン）５の塗布幅d1はｐ
−ｘとなる。これに対して、円形パターン６の塗布幅d2
は、この場合、塗布径d2となり、隣接する接続パターン
の円形パターンとの中心の交互の位置ずれ量をｃとすれ
ば、 となり、円形パターン６の塗布幅d2は矩形パターン５の
塗布幅d1の場合よりも塗布幅が大きくなり、従って、ス
クリーンマスクによる印刷塗布厚ｔとの比もt/d2＜t/d1
となり、矩形よりも円形で、かつ、中心を交互にずらし
て配置した場合の方がクリーム半田の版抜け性が良く、
かつ前記塗布幅d1とd2が等しく、かつ、印刷塗布厚ｔが
同じ場合には、クリーム半田塗布間隙ｘは円形パターン
の方が矩形パターンにする場合よりも大きくすることが
でき、印刷塗布されるクリーム半田の連がり不良を防止
することができる。In this figure, when the cream solder application gap is fixed to x in order to prevent the continuous connection of the cream solder printed and applied on the adjacent connection patterns, the pitch of the adjacent connection patterns is set to p. In this case, the coating width d 1 of the rectangular cream solder coating pattern (rectangular pattern) 5 is p
-X. On the other hand, the coating width d 2 of the circular pattern 6
In this case, the coating diameter is d 2 , and if the alternating positional displacement amount of the center of the adjacent connecting pattern and the circular pattern is c, Therefore, the coating width d 2 of the circular pattern 6 is larger than the coating width d 1 of the rectangular pattern 5, and therefore the ratio with the printing coating thickness t by the screen mask is t / d 2 <t / d. 1
Therefore, it is more circular than a rectangle, and when the centers are staggered alternately, the cream solder release property is better,
When the coating widths d 1 and d 2 are equal and the printing coating thickness t is the same, the cream solder coating gap x can be made larger in the circular pattern than in the rectangular pattern. It is possible to prevent the defective connection of the cream solder.
第４図はこのようにしてクリーム半田が塗布された後、
フラットパッケージICが実装された状態を示す図であ
り、第４図（ａ）はその平面図、第４図（ｂ）はその側
断面図を示している。Fig. 4 shows that after cream solder is applied in this way,
It is a figure which shows the state by which the flat package IC was mounted, FIG.4 (a) is the top view, FIG.4 (b) has shown the side sectional view.
この図に示されるように、印刷配線基板11上には接続パ
ターン12が形成され、その上に前記した円形のクリーム
半田塗布パターンが形成され、そこにフラットパッケー
ジIC15のリード端子14が半田付けされる。13はその半田
を示している。As shown in this figure, a connection pattern 12 is formed on the printed wiring board 11, the circular cream solder application pattern is formed on the connection pattern 12, and the lead terminals 14 of the flat package IC 15 are soldered thereto. It 13 shows the solder.
次に、本発明の他の実施例を第５図及び第６図を参照し
ながら説明する。Next, another embodiment of the present invention will be described with reference to FIGS.
第５図は本発明の他の実施例を示すクリーム半田塗布状
態平面図、第６図は本発明の他の実施例を示すICの実装
状態を示す図である。FIG. 5 is a plan view of a cream solder application state showing another embodiment of the present invention, and FIG. 6 is a view showing an IC mounting state showing another embodiment of the present invention.
この実施例においては、接続パターン12′も互い違いに
配置される点が前記実施例と相違する。This embodiment is different from the previous embodiment in that the connection patterns 12 'are also arranged in a staggered manner.
即ち、互い違いに配置される接続パターン12′上には第
１図に示されると同様の円形クリーム半田塗布パターン
16が形成される。そして、第４図に示されると同様にフ
ラットパッケージIC15が実装される。That is, the circular cream solder application pattern similar to that shown in FIG. 1 is provided on the connection patterns 12 'which are alternately arranged.
16 are formed. Then, the flat package IC 15 is mounted in the same manner as shown in FIG.
なお、本発明は上記実施例に限定されるものではなく、
本発明の趣旨に基づいて種々の変形が可能であり、これ
らを本発明の範囲から排除するものではない。The present invention is not limited to the above embodiment,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.
（発明の効果） 以上、詳細に説明したように、本発明によれば、印刷配
線基板上にクリーム半田を印刷塗布する時に使用するス
クリーンマスクの印刷パターンを複数個の円形パターン
で形成し、かつ、隣接する接続パターンへの印刷パター
ンの円形パターンの中心位置を互い違いになるようにず
らして配置したことにより、隣接するクリーム半田塗布
パターン間の距離を従来の矩形の場合と同一でありなが
ら、従来の矩形パターンの幅寸法よりも大きな寸法の直
径を有する円形パターンを配置することができる。従っ
て、クリーム半田印刷時のクリーム半田の連ながり不良
や、基板上に半田が塗布されない、所謂、版抜け不良が
減少し、半田リフロー時の半田ブリッジ不良や、半田オ
ープン不良を減少させることができる。(Effects of the Invention) As described in detail above, according to the present invention, the print pattern of the screen mask used when the cream solder is printed and applied on the printed wiring board is formed of a plurality of circular patterns, and , By arranging the center positions of the circular patterns of the printed patterns to the adjacent connection patterns so as to be staggered, the distance between the adjacent cream solder application patterns is the same as in the case of the conventional rectangle, A circular pattern having a diameter larger than the width of the rectangular pattern can be arranged. Therefore, it is possible to reduce the failure of continuous soldering of cream solder during printing of cream solder, the so-called plate missing defect in which solder is not applied on the substrate, and the solder bridge defect and the solder open defect during solder reflow. it can.
第１図は本発明の一実施例を示すクリーム半田塗布状態
平面図、第２図は本発明のクリーム半田印刷用スクリー
ンマスクのセット状態を示す図、第３図はクリーム半田
塗布パターンの説明図、第４図は本発明の一実施例を示
すICの実装状態を示す図、第５図は本発明の他の実施例
を示すクリーム半田塗布状態平面図、第６図は本発明の
他の実施例を示すICの実装状態を示す図、第７図は従来
の第１のクリーム半田塗布状態平面図、第８図は従来の
第２のクリーム半田塗布状態平面図である。 11……印刷配線基板、12,12′……接続パターン、13…
…半田、14……リード端子、15……フラットパッケージ
IC、16……クリーム半田塗布パターン、17……クリーム
半田のスクリーンマスク。FIG. 1 is a plan view of a cream solder application state showing an embodiment of the present invention, FIG. 2 is a view showing a set state of a screen mask for cream solder printing of the present invention, and FIG. 3 is an explanatory view of a cream solder application pattern. FIG. 4 is a diagram showing a mounted state of an IC showing an embodiment of the present invention, FIG. 5 is a plan view of a cream solder application state showing another embodiment of the present invention, and FIG. 6 is another view of the present invention. FIG. 7 is a diagram showing a mounted state of an IC showing an embodiment, FIG. 7 is a plan view of a conventional first cream solder application state, and FIG. 8 is a plan view of a conventional second cream solder application state. 11 …… Printed wiring board, 12, 12 ′ …… Connection pattern, 13…
… Solder, 14… Lead terminal, 15… Flat package
IC, 16 …… Cream solder application pattern, 17 …… Cream solder screen mask.
Claims (1)
して高密度リード付きICを半田付けする際に使用するク
リーム半田印刷用スクリーンマスクにおいて、前記ICの
一つのリードに対応した接続パターン上に印刷すべきス
クリーンマスクの半田印刷パターンを複数の円形形状に
すると共に隣接する接続パターン上に印刷すべきスクリ
ーンマスクの半田印刷パターンの複数個の円形形状の中
心位置を交互にずらすようにしたことを特徴とするクリ
ーム半田印刷用スクリーンマスク。Claim: What is claimed is: 1. A cream solder printing screen mask used for soldering an IC with high-density leads by applying cream solder to a printed wiring board by printing, and a connection pattern corresponding to one lead of said IC. The solder print pattern of the screen mask to be printed on the plurality of circular shapes and the center positions of the plurality of circular shapes of the solder print pattern of the screen mask to be printed on the adjacent connection patterns are alternately shifted. A screen mask for cream solder printing characterized by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26080786A JPH0739220B2 (en) | 1986-11-04 | 1986-11-04 | Cream Solder screen mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26080786A JPH0739220B2 (en) | 1986-11-04 | 1986-11-04 | Cream Solder screen mask |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63115169A JPS63115169A (en) | 1988-05-19 |
| JPH0739220B2 true JPH0739220B2 (en) | 1995-05-01 |
Family
ID=17353022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26080786A Expired - Fee Related JPH0739220B2 (en) | 1986-11-04 | 1986-11-04 | Cream Solder screen mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739220B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0281689A (en) * | 1988-09-19 | 1990-03-22 | Tamura Seisakusho Co Ltd | Screen mask for cream solder printing |
| EP1465468B1 (en) | 2003-03-31 | 2007-11-14 | SANYO ELECTRIC Co., Ltd. | Metal mask and method of printing lead-free solder paste using same |
| US11033990B2 (en) * | 2018-11-29 | 2021-06-15 | Raytheon Company | Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies |
-
1986
- 1986-11-04 JP JP26080786A patent/JPH0739220B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63115169A (en) | 1988-05-19 |
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| LAPS | Cancellation because of no payment of annual fees |