JPH07259725A - Flexible tube curing device - Google Patents

Abstract

PURPOSE:To provide the flexible tube curving device which facilitates assembling works for a curved section, and is suitable for making a flexible tube slenderer. CONSTITUTION:A flexible tube 13 is formed out of a plurality of curved tubes 12a and 12b which can be split along a split surface in its axial direction, and curved sections 11a and 11b are formed by combining the split surfaces of the respective curved tubes 12a and 12b with each other in a state that an SMA actuator 16 is interposed between the split surfaces of the respective curved tubes 12a and 12b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible tube bending device used for an insertion portion of an endoscope, a catheter, a multi-joint arm of a multi-joint arm robot, etc., which bends freely.

[0002]

2. Description of the Related Art Conventionally, an endoscope insertion portion, a catheter,
A bending device for a flexible tube using a shape memory alloy (hereinafter referred to as SMA) is known as an actuator that flexibly bends a flexible tube used for an articulated arm of an articulated arm robot.

An example of this type is Japanese Patent Publication No. 4-7.
No. 229 discloses a flat SM in the tip of a catheter.
A configuration in which an A actuator is arranged is shown. The SMA actuator used here stores a first shape which is curved in an arc shape in advance. This SM
The A actuator is incorporated in the catheter while being cooled to room temperature and plastically deformed into the second linear shape. When the SMA actuator is heated again to a predetermined transition temperature, the SMA actuator returns to the first shape curved in an arcuate shape. With the deformation operation of the SMA actuator at this time, the tip of the catheter is It is designed to be deformed into the same shape as the SMA actuator.

The SMA actuator is arranged on the outer peripheral surface of the flexible tube in order to improve the attachment of the actuator. Then, for example, when the above technique is adopted as the bending mechanism of the insertion portion of the endoscope, the light guide fiber (LG), the image guide fiber (IG), the signal line, the treatment tool, etc. are housed inside the flexible tube. It has become so.

[0005]

However, SMA
When the actuator is arranged on the outer peripheral surface of the flexible tube, it is necessary to slide between the SMA actuator and the bending portion of the flexible tube during the bending operation of the flexible tube. It is necessary to provide a clearance between the curved portion and a sliding guide member. for that reason,
There is a problem that it is difficult to reduce the outer diameter of the flexible tube to which the SMA actuator is attached.

Furthermore, since it is necessary to mount a protective tube or the like on the outside of the SMA actuator, there is a problem that it becomes more difficult to reduce the outer diameter of the flexible tube on which the SMA actuator is mounted. The present invention has been made in view of the above circumstances, and an object thereof is to provide a flexible tube bending device that facilitates assembling a bending portion and is suitable for reducing the diameter of a flexible tube.

[0007]

According to the present invention, there is provided a flexible tube bending device having a bending portion for bendingly driving the flexible tube according to a deformation operation of a shape memory type actuator arranged in the flexible tube. The flexible tube is composed of a plurality of flexible tube constituent elements that can be divided along the dividing surface in the axial direction, and the shape memory type actuator is provided between the dividing surfaces of the respective flexible tube constituent elements. In this state, the flexible tube constituent elements are connected to each other to form the curved portion.

[0008]

By assembling the shape memory type actuator between the divided surfaces of the respective flexible tube constituent elements, the assembling is facilitated, and by incorporating the actuator inside the flexible tube, the actuator and the flexible tube are separated from each other. A flexible tube is not required to have a mechanism for sliding between them, and the diameter of the flexible tube is reduced.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. FIG. 1A shows an ultrafine endoscope 1.
2 shows a schematic configuration of the entire system. Figure 1
In (A), 2 is a control unit connected to the endoscope 1. A TV monitor 3 and a joystick 4 for bending operation are connected to the control unit 2. Further, the control unit 2 includes a light source, a video processor, and a bending actuator control circuit, which are not shown.

Further, the body 5 of the endoscope 1 is provided with an insertion portion 6 having an extremely small diameter which is inserted into a blood vessel of a patient and an operation end portion 7 on the proximal side which is connected to a proximal end portion of the insertion portion 6. It is provided.
The base end of the universal cord 8 is connected to the operation end 7. The tip of the universal cord 8 is detachably connected to the control unit 2 via a connector.

Further, the image guide fiber 9 and the light guide fiber 10 are provided in the insertion portion 6 of the endoscope body 5.
Is built in. Two (first and second) curved portions 11a and 11b are arranged side by side on the front end side of the insertion portion 6 in the front-rear direction.

FIG. 1B shows a schematic structure of the distal end side of the insertion portion 6. Here, on the distal end side of the insertion portion 6, two rectangular tubular curved tubes (flexible tube constituent elements) 12a, 12 that can be divided along an axial division surface including the central axis thereof.
A flexible tube 13 formed by adhering b is provided. A protective tube 14 is attached to the flexible tube 13.

Further, the first and second bending portions 11 are provided between the bonding surfaces (divided surfaces) of the tubular bending tubes 12a and 12b.
Two front and rear bending actuators 15 corresponding to a and 11b are provided. Here, as shown in FIG. 1C, each bending actuator 15 is provided with a flat plate-shaped SMA actuator (shape memory type actuator) 16 made of NiTi-based shape memory alloy (SMA). As shown in FIG. 4, the SMA actuator 16 is a thin film heater 17 on a so-called omnidirectional SMA substrate which is subjected to a memory process so that the substantially arcuate curved shape is inverted between the high temperature side and the low temperature side at a transformation temperature (intermediate temperature). Is pasted.

Each thin film heater 17 is connected to an integrated circuit 18, and each integrated circuit 18 has a common control line 19.
Tied with. The control line 19 includes a power line, a ground line, and a control signal line.

Further, the control line 19 is connected to the above-mentioned bending actuator control circuit of the control unit 2. Then, according to the control signal from the bending actuator control circuit of the control unit 2, the integrated circuit 1
An appropriate electric power is supplied to the heater 17 by the switch 8.

Further, as shown in FIG. 2A, each tubular bending tube 12a, 12b is provided on one side surface of a tubular body 20 having a substantially rectangular cross section and extends in a direction orthogonal to the axial direction of the tubular body 20. A plurality of substantially V-shaped notches 21 are formed along the axial direction of the tubular body 20. And each tubular bending tube 12
A hinge portion 22 serving as a rotation axis at the time of bending is formed on the portions a and 12b by the remaining portions of the respective cutout portions 21.

Further, an image guide fiber 9 and a light guide fiber 10 are dispersed and inserted in the tubular curved tubes 12a and 12b, respectively. That is, as shown in FIG. 1B, the image guide fiber 9 is inserted into one of the tubular bending tubes 12a,
The light guide fiber 1 is placed in the other tubular bending tube 12b.
0 is inserted.

Next, a method of manufacturing the tubular body 20 of the tubular bending tubes 12a and 12b will be described. Here, as shown in FIG. 2B, the tubular body 20 of each of the tubular curved tubes 12a and 12b is formed on the silicon wafer 23 by the following etching process and the cutout portion 24 corresponding to the cutout portion 21 of the tubular body 20 and After forming the groove portions 25 for folding, the silicon wafer 23 is bent along the groove portions 25 to complete the tubular body 20 shown in FIG.

3 (A) to 3 (E) show a forming operation for forming the notch portion 24 and the groove portion 25 in the silicon wafer 23 which is a forming material of the tubular body 20 of each tubular bending tube 12a, 12b. It is a thing. That is, at the time of the work of forming the cutout portion 24 and the groove portion 25 in the silicon wafer 23, first, as shown in FIG. 3A, after the first polyimide film 27 is thinly formed on the substrate 26 of the silicon wafer 23, The pattern 28 of the groove portion 25 is formed in the first polyimide film 27 by a normal photolithography technique used for semiconductor manufacturing (first step).

Next, the molded product of the first step is immersed in an etching solution for an appropriate period of time to anisotropically etch the exposed groove portion 25, thereby forming a "V" shape as shown in FIG. 3 (B). The groove portion 25 is formed (second step).

After forming the "V" -shaped groove portion 25,
The first polyimide film 27 on which the pattern 28 of the groove portion 25 is formed is removed from the molded product of the second step. continue,
After the second polyimide film 29 is newly formed on the surface of the substrate 26, the pattern 30 of the cutout portion 24 is formed on the second polyimide film 29 by the photolithography technique as shown in FIG. 3C. Third step).

Next, the molded product of the third step is immersed in an etching solution for an appropriate time to expose the cutout portion 24.
Is anisotropically etched to form a cutout portion 24 penetrating the substrate 26 as shown in FIG. 3D (fourth step).

Finally, the second polyimide film 29 remaining on the molded product of the fourth step is removed (fifth step), and as shown in FIG. 3 (E), the silicon wafer 23 is removed.
The work of forming the notch portion 24 corresponding to the notch portion 21 of the pipe body 20 and the groove portion 25 for folding is completed.

A state in which a control line 19 is provided between the bonding surfaces of the tubular bending tubes 12a and 12b, with the front and rear bending actuators 15 corresponding to the first and second bending portions 11a and 11b, respectively. By connecting the two tubular bending tubes 12a and 12b with each other,
The curved portions 11a and 11b are formed.

Next, the operation of the above configuration will be described.
First, when the ultrafine endoscope 1 is used, the operator inserts the insertion portion 6 of the endoscope 1 into the blood vessel of the patient, and the joystick 4 causes the first and second bending portions on the distal end side of the insertion portion 6. 11a,
The bending operation is performed on 11b. At this time, in the neutral state where the joystick 4 is not tilted, each bending actuator 15
The heating temperature of the SMA actuator 16 by the heater 17 is adjusted so that is maintained in the neutral state of the linear state shown by the solid line in FIG.

When the joystick 4 is tilted from the neutral state in an arbitrary bending direction and a signal for performing an arbitrary bending is generated, the selected SMA actuator 16 is heated above the transformation temperature or energized to a temperature below the neutral state. The integrated circuit 18 controls the heating of the heater 17 so as to reduce the amount. As a result, the first and second bending portions 11a and 11b have a curved shape in which they are curved in a substantially arcuate shape in the upward direction as shown by an arrow U from the neutral state of the straight line state shown by the solid line in FIG. As shown by the arrow D, it is freely curved in a downwardly curved substantially arcuate shape.

Therefore, the following effects are obtained with the above-mentioned structure. That is, on the distal end side of the insertion portion 6, there is provided a flexible tube 13 formed by bonding two tubular curved tubes 12a and 12b that can be divided along an axial division surface including the central axis thereof. Since the SMA actuator 16 is provided between the bonding surfaces of the tubular bending tubes 12a and 12b of 13, the first and second bending portions 11a and 11b are integrally manufactured on the distal end side of the insertion portion 6. As compared with the conventional case where the SMA actuator 16 is arranged on the outer peripheral surface of the flexible tube 13, the first and second curved portions 11a and 11b can be easily assembled.

Further, since the SMA actuator 16 is incorporated in the flexible tube 13, a mechanism for sliding between the SMA actuator 16 and the flexible tube 13 is unnecessary, and the flexible tube 13 has a small diameter. Can be achieved.

Since the SMA actuator 16 is arranged on the bonding surface of the tubular bending tubes 12a and 12b including the central axis of the flexible tube 13, the first and second bending portions 11 are arranged.
It is possible to reduce the sliding amount between the SMA actuator 16 and the tubular bending tubes 12a and 12b during the bending operation of a and 11b as compared with the conventional case. Therefore, it is not necessary to use a conventional structural device for sliding between the SMA actuator 16 and the tubular bending tubes 12a and 12b.
The diameter of the flexible tube 13 can be reduced as compared with the conventional one.

Furthermore, since the SMA actuator 16 is attached to the bonding surfaces of the divided tubular curved tubes 12a and 12b, the work of attaching the SMA actuator 16 is simple, and the outer dimensions of the flexible tube 13 are, for example, submillimeter. Assembly is possible even if the diameter is reduced to the order.

Inside the flexible tube 13, the integrated circuit 18 is provided.
Since the wire saving is performed by using, the number of wires of each bending actuator 15 is increased as in the conventional case even when forming a multi-bending structure in which a plurality of bending actuators 15 are provided, and the diameter of the flexible tube 13 is reduced. Can be prevented.

Further, a substantially V-shaped notch 21 extending in a direction orthogonal to the axial direction of the tubular body 20 is provided on one side surface of the tubular body 20 of each tubular bending tube 12a, 12b. 20
Since a plurality of hinge tubes 22 are formed along the axial direction of each of the cutout portions 21 and the remaining portion of each notch portion 21 serves as a rotation axis during bending, the bending tubes 12a and 12b having no rotation axis are formed.
And is suitable for miniaturization.

Further, the above-mentioned first to fifth steps of the forming work for forming the notch portion 24 and the groove portion 25 in the silicon wafer 23 which is the forming material of the tubular body 20 of each tubular bending tube 12a, 12b are the semiconductor manufacturing. Since the above process is applied, the cutout portion 24 and the groove portion 25 can be finely processed in the silicon wafer 23 with high precision in the order of microns.

Since the groove portion 25 for folding is formed on the substrate 26 of the silicon wafer 23, the silicon wafer 2
The substrate 26 of No. 3 is easily bent. Therefore, at the time of assembling the tubular body 20 of each tubular bending tube 12a, 12b, the silicon wafer 23 can be easily bent along the groove portion 25 for folding, and each tubular bending tube 12a, 12b.
The tube body 20 of b can be easily assembled. Therefore, a very small structure can be realized.

Further, FIGS. 5A and 5B show the second embodiment of the present invention.
FIG. FIG. 5A shows a schematic configuration of the bending portion 31 provided at the tip of the insertion portion of the endoscope. A plurality of bending tubes 32, which are manufactured by a manufacturing method similar to the conventional one, are arranged in parallel in the bending portion 31 along the axial direction of the insertion portion of the endoscope. Here, the front and rear curved pipes 32, 32 adjacent to each other are rotatably connected by a rotary shaft 33.

Further, as shown in FIG. 5B, each of the bending tubes 32 is a bending tube main body (flexible tube constituent element) 34, and the bending tube main body 34 is divided in the axial direction including the rotating shaft 33. And a split body (flexible tube constituent element) 35 that can be split along a surface (a mating surface). Here, the curved tube body 34 is formed with a connection recess 36 with the split body 35. Further, the split body 35 is provided with a convex portion 37 which is fitted into the connecting concave portion 36 of the bending tube main body 34.

Further, in the bending portion 31, as shown in FIG. 5 (A), the connecting concave portions 3 of the bending tube main bodies 34 of all the bending tubes 32 are connected.
The bending actuator 15 and the actuator control line 19 having the same structure as in the first embodiment are fixed to the dividing surface between the convex portion 37 of the divided body 35 and the concave portion 6.

Therefore, in the above-mentioned configuration, each bending tube 32 of the bending portion 31 disposed on the distal end side of the insertion portion of the endoscope is provided along the axial dividing surface including the rotation shaft 33. Since the separable bending tube main body 34 and the dividing body 35 are bonded to each other, and the SMA actuator 16 of the bending actuator 15 is interposed between the bonding surfaces of the bending tube main body 34 and the dividing body 35 of each bending tube 32. The bending portion 3 is the same as in the first embodiment.
1 can be easily assembled and the diameter of the curved portion 31 can be reduced.

Further, FIGS. 6A, 6B and 7
(A) and (B) show a third embodiment of the present invention. This is one in which the tubular body 41 of the tubular bending tube having the bending portion as shown in FIG. 6B is formed by using the manufacturing method by etching similar to that of the first embodiment.

In this case, the tubular body 41 of the tubular bending tube is shown in FIG.
As shown in (A), a notch portion 43 and a groove portion 44 for folding are formed on the silicon wafer 42 in the same etching process as in the first embodiment in a comb shape. Then, after the notch portion 43 and the groove portion 44 for folding are formed on the silicon wafer 42, the silicon wafer 42 is bent into a quadrangle along each groove portion 44 to form the tubular body shown in FIG. 6B. 41 is completed.

Further, the tube body 41 of this bending tube is shown in FIG.
As shown in (A), a bending actuator using the SMA wire 45 is arranged. This SMA wire 45 has the property of contracting in the axial direction when transformation occurs. In addition, in order to fix the SMA wire 45 to the tubular body 41 of the bending tube, a wire guide portion 46 having a substantially L-shape is formed by cutting and raising in a part of the tubular body 41 of the bending tube. In this case, a U-shaped cutout portion 47 for forming the wire guide portion 46 is formed on the silicon wafer 42 by etching as shown in FIG. 7B.

Further, a groove portion 49 for folding is similarly formed by etching on the cantilever 48 at the inner portion of the U-shaped notch portion 47. And this cantilever 4
The wire guide portion 46 is formed by bending the portion 8 along the groove portion 49 for folding. In addition, SM
Both ends of the A wire 45 are fixed to the tubular body 41 of the bending tube, and an intermediate portion thereof is slidably held by a wire guide portion 46.

During operation of the bending portion having the above structure, the SMA wire 45 of the tube body 41 of the bending tube is electrically heated.
When the SMA wire 45 undergoes transformation due to this energization heating, the SMA wire 45 contracts in the axial direction, so that the tube body 41 of the bending tube is bent along with the contraction operation of the SMA wire 45.

Therefore, in the above-described structure, since the cutout portions 43 are formed in the tubular body 41 of the tubular bending tube in a comb shape, the pitch of the cutout portions 43 can be reduced. When the pitch of the notch portion 43 is reduced in this way, the curved shape becomes a smooth curve when the bending portion is operated, and thus it is particularly suitable as a bending portion of an endoscope to be inserted into a living body hollow organ.

Further, in this manufacturing method, the SMA wire 45 is used.
Since the wire guide portion 46 can be integrally manufactured, the manufacturing is easier and suitable for miniaturization as compared with the conventional manufacturing method in which the wire guide member is brazed to the tubular body 41 of the bending tube. Moreover, there is an effect of cost reduction. The bending tube of this embodiment can be applied not only to SMA wire but also to conventional angle wire.

Further, FIGS. 8A to 8D show the fourth embodiment of the present invention.
FIG. This is different from the configuration of forming the groove portions 25 and 44 for V-shaped groove for folding in order to bend the silicon wafers 23 and 42 as in the first and third embodiments, and here another configuration is used. Is adopted.

That is, in this embodiment, firstly, as shown in FIG.
After the polyimide film 53 is thinly formed, an opening 54 for a bent portion is formed in the first polyimide film 53 by a normal photolithography technique used for semiconductor manufacturing.

Subsequently, a Teflon film 55 is formed on the entire back surface of the substrate 52 of the silicon wafer 51, and an opening 54 for a bent portion on the front surface side is formed on the Teflon film 55.
A mask 56 made of polyimide is formed at a position corresponding to.

Next, as shown in FIG. 8B, the through hole 5 is formed in a portion of the substrate 52 of the silicon wafer 51 corresponding to the opening 54 of the first polyimide film 53 by etching.
Form 7. At this time, the substrate 5 of the silicon wafer 51
The Teflon film 55 is left on the back surface of No. 2 only in the area covered by the mask 56.

Finally, by removing only the polyimide film of the mask 56, the substrate 52 of the silicon wafer 51 has a structure in which the Teflon film 55 is connected as a hinge as shown in FIG. 8C. Therefore, in this embodiment, when assembling a curved tube, the silicon wafer 51 is bent by bending the Teflon film 55 as a hinge as shown in FIG. 8 (D).

Therefore, in the case of the above structure, the Teflon film 55 is bent as a hinge to bend the silicon wafer 51.
As described in the first and third embodiments, the silicon wafers 23 and 42 are deformed by the V-groove-shaped groove portions 25 and 44 for folding, as in the first and third embodiments.
The silicon wafer 51 can be more easily bent than in the case of bending the two, and the bending tube can be easily assembled.

Further, FIGS. 9A to 9D show the fifth embodiment of the present invention.
FIG. This simplifies the step of bending the silicon wafers 23 and 42 in the first and third embodiments along the V-shaped groove portions 25 and 44 for folding.

That is, in this embodiment, first, as shown in FIG. 9A, a recess 63 for a bent portion is formed by etching on the back surface of the substrate 62 of the silicon wafer 61.
Subsequently, as shown in FIG. 9B, a filling material 64 having a coefficient of thermal expansion sufficiently higher than that of the silicon wafer 61 is filled in the recess 63. As a filling method of the filling material 64, there is a method of laminating, for example, aluminum on the concave portion 63 of the silicon wafer 61 by sputtering.

When assembling a curved tube, the entire processed silicon wafer 61 in which the filling material 64 is filled in the recess 63 is heated. At this time, the thermal expansion of aluminum, which is the filling material 64, in the recess 63 exceeds that of the silicon wafer 61, so that the silicon wafer 61 is bent at the recess 63 as shown in FIG. 9D. In this state, if the bonding surfaces at both ends of the silicon wafer 61 are fixed to each other, a curved tube is formed.

Therefore, in the case of the above structure, the silicon wafer 61 is simply heated by heating the entire silicon wafer 61.
Since the concave portion 63 can be automatically bent, the work of bending the silicon wafer 61, which becomes more difficult as the structure becomes finer and more complicated, can be facilitated.
Therefore, a microstructure of a curved tube can be realized.

The material having a large coefficient of thermal expansion may be a metal having a relatively large expansion coefficient such as copper and silver in addition to aluminum. In addition to metals, resins such as paraffin and polyethylene may be used.

Further, FIGS. 10A to 10C show a sixth embodiment of the present invention. FIG. 10A shows a rotary shaft 72 between a pair of curved tubes 71a and 71b that are adjacent to each other in the front-rear direction along the axial direction of the insertion portion of the endoscope, as in the second embodiment.
It shows a bending portion 73 configured to be rotatably connected via.

Further, a bending actuator 74 formed of a plate-like SMA is mounted between the bending tubes 71a and 71b. In this case, the front end of the bending actuator 74 is fixed to the outer peripheral surface of the front bending tube 71a, and the rear end of the bending actuator 74 is fixed to the outer peripheral surface of the rear bending tube 71b.

Further, as shown in FIG. 10B, a connecting pin 75 serving as a rotary shaft 72 is fixed to the outer peripheral surface of the front end portion of the rear bending tube 71b. Further, the front curved tube 71a
An extension portion 76 extending rearward is formed on the outer peripheral surface of the rear end portion. An elongated hole 77 that is long in the axial direction of the insertion portion is formed in the extension portion 76. The connecting pin 75 of the rear curved tube 71b is slidably inserted into the elongated hole 77.

The bending actuator 74 is shown in FIG.
As shown in (C), a shape curved in a substantially bow shape is stored in advance. Further, the bending actuator 74 is held at a normal position where it is extended in a substantially linear shape as shown in FIG.

During the bending operation of the bending portion 73, the plate-shaped SMA of the bending actuator 74 is heated, and the bending actuator 73 is heated as shown in FIG.
It is adapted to be bent and deformed into a substantially arcuate curved shape shown in (C). At this time, the front and rear bending tubes 71a and 71b are moved along with the bending operation of the plate-like SMA of the bending actuator 74.
The distance between them changes, but this is absorbed by the operation of the connecting pin 75 of the rear bending tube 71b sliding along the elongated hole 77 of the front bending tube 71a.

Therefore, in the case of the above construction, a rear extension 76 is formed on the outer peripheral surface of the rear end portion of the front bending tube 71a, and a long hole 77 is formed in this extension 76, and this length is increased. Since the connecting pin 75 of the rear bending tube 71b is slidably inserted into the hole 77, the bending actuator 74 formed by the plate-like SMA is used at both ends of the bending tube 71a, 71b.
Each can be fixed to b. Therefore, one end side of the bending actuator 74 is connected to the bending tube 71 as in the conventional case.
Conventionally, there is no need for a sliding means which is slidably connected to one of a and 71b and which is provided in order to prevent the sliding end side of the bending actuator 74 from separating from the bending tube. It is possible to reduce the diameter of the entire curved portion 73 as compared with the above.

Further, since the bending actuator 74 does not slide with respect to the bending tubes 71a and 71b, for example, SMA
Even if the surface of the is coated with insulation or the like, there is no risk of peeling off the coating layer.

Further, the connecting pin 75 of the rear bending tube 71b
Is slidably inserted into the long hole 77 of the front bending tube 71a, so that the operation of the bending actuator 74 of the SMA is not hindered. Note that the bending tubes 71a and 71a are similar to the conventional rotating shaft.
Even if an unreasonable external force (compressive force, torsional force) is applied to b, the bending actuator 74 of the SMA and the built-in object can be protected.

FIG. 11 shows a modification of the sixth embodiment. In this, the rearward extending portion 76 of the front curved tube 71a is formed into a substantially arcuate shape, and the rearward extending portion 76 is formed with a substantially arcuate elongated hole 77. Also in this case, the same effect as that of the sixth embodiment can be obtained.

12 to 13D show the seventh embodiment of the present invention. This relates to a method of manufacturing the bending actuator shown in each of the above embodiments. Here, first, as shown in FIG. 12, a first shape memory alloy thin film 82 having a thickness of 40 μm is formed on a molded substrate 81 of a curved actuator by sputter deposition.

Next, as shown in FIG. 13B, a first polyimide film 83 having a thickness of 1 μm is formed on the shape memory alloy thin film 82 of the substrate 81, and then a first photolithography technique used in semiconductor manufacturing is used to form the first polyimide film 83. The polyimide film 83 and the first shape memory alloy thin film 82 are patterned into a predetermined shape. Subsequently, a two-layer metal thin film pattern 84 composed of a titanium thin film 84a and a platinum thin film 84b sufficiently thinner than titanium is formed by sputter deposition and a photolithography technique. Here, an electrode forming region 85 is formed at the end of the metal thin film pattern 84 as shown in FIG.

Next, FIG. 13 is formed on the laminated body of the substrate 81.
A second polyimide film 86 is formed as shown in FIG.
This is patterned into substantially the same shape as the first shape memory alloy thin film 82 by the photolithography technique, and the metal thin film pattern 8 is formed as shown in FIG. 13 (C).
An opening 87 is formed in the fourth electrode formation region 85.

Next, a second shape memory alloy thin film (not shown) having a thickness of 60 μm is formed and processed into the same shape as the first shape memory alloy thin film 82 by the photolithography technique. After that, the substrate material is removed and the lead wire 88 is connected to the electrode forming region 85 of the metal thin film pattern 84 to form the bending actuator.

Then, the first shape memory alloy thin film 82 and the second shape memory alloy thin film are heated by causing a current to flow through the metal thin film pattern 84 of the bending actuator through the lead wire 88 to generate Joule heat. The first shape memory alloy thin film 82 and the second shape memory alloy thin film are deformed into a predetermined curved shape stored in advance to function as an actuator. At this time, since the metal thin film pattern 84 is distorted due to the driving of the bending actuator, the displacement of the first shape memory alloy thin film 82 and the second shape memory alloy thin film is detected by detecting the change in the electric resistance. Thus, it becomes possible to feedback control the bending actuator. That is, the metal thin film pattern 84 can be used as a strain sensor.

Therefore, in the bending actuator having the above-described structure, the first shape memory alloy thin film 82 and the second shape memory alloy thin film 82 and the second polyimide film 86 are provided on both sides of the metal thin film pattern 84, respectively. Since the shape memory alloy thin film is provided, compared to the case where the heater is formed on a single layer of shape memory alloy, the film thickness and the curvature of the stored shape are the same (substantially the same force In the case of the present embodiment, the strain generated in the metal thin film pattern 84 when the bending actuator bends can be reduced to 1/5.

The strain ε generated in the metal thin film pattern 84 is so small that the thickness of the metal thin film pattern 84 is negligible, and the SMA of the entire first shape memory alloy thin film 82 and the second shape memory alloy thin film is large. Where t is the thickness and r is the curvature, ε = 0.2 t / r, which is ⅕ of the case where a heater is formed on a single-layer shape memory alloy.

The first shape memory alloy thin film 82 and the second
The strain generated in the metal thin film pattern 84 can be further reduced by adjusting the film thickness ratio with the shape memory alloy thin film.

Therefore, even if the curvature of the stored shape is reduced in order to increase the amount of force generated by the bending actuator, the metal thin film pattern 84 will not be excessively distorted, so that the reproducibility is improved. Highly accurate measurement is possible. Therefore, as a result, it is possible to control the bending actuator with high accuracy.

Further, in the present embodiment, one of the first shape memory alloy thin film 82 and the second shape memory alloy thin film of the bending actuator is replaced with an elastic body, and this is made to function as a bias spring, so that the shape memory alloy is formed. It is possible to easily function as the bending actuator without adding a complicated structure such as performing shape memory processing in two directions or attaching a bias spring to the outside. for that reason,
In this case, the structure can be further simplified.

FIGS. 14A to 15B show an eighth embodiment of the present invention. This relates to a method of manufacturing a bending actuator different from that of the seventh embodiment.

Here, first, as shown in FIG. 14B, a first shape memory alloy thin film 92 having a thickness of 50 μm is formed on the molded substrate 91 of the curved actuator by sputtering deposition.

Next, as shown in FIG. 14A, a first polyimide film 93 is formed to a thickness of 1 μm on the first shape memory alloy thin film 92 of the substrate 91, and then a metal thin film pattern 94 of a platinum thin film is formed. Are formed by sputter deposition and the usual photolithography technique used for semiconductor manufacturing. Here, an electrode forming region 95 is formed at the end of the metal thin film pattern 94 as shown in FIG.

Next, FIG. 14 is formed on the laminated body of the substrate 91.
A second polyimide film 96 is formed as shown in FIG. 14D, and an opening 97 is formed in the electrode forming region 95 of the metal thin film pattern 94 as shown in FIG.

Next, as shown in FIG.
A second shape memory alloy thin film 98 having a thickness of 0 μm is formed and processed into the illustrated shape by a photolithography technique. After that, the substrate material is removed, and the lead wire 99 is connected to the electrode formation region 95 of the metal thin film pattern 94 as shown in FIG.

The first shape memory alloy thin film 92 and the second shape memory alloy thin film 98 are heated by passing an electric current through the lead wire 99 to the metal thin film pattern 94 of the bending actuator to generate Joule heat. Then, the first shape memory alloy thin film 92 and the second shape memory alloy thin film 98 are deformed into a predetermined curved shape stored in advance and function as an actuator. At this time, the resistance value of the platinum metal thin film pattern 94 changes as the bending actuator is driven. Therefore, since the displacement of the bending actuator depends on the temperature, the bending actuator can be feedback-controlled by detecting the change in the resistance value of the metal thin film pattern 94 and calculating the temperature. That is, the metal thin film pattern 94 can be used as a temperature sensor.

Therefore, in the bending actuator having the above structure, since the first shape memory alloy thin film 92 and the second shape memory alloy thin film 98 have the same thickness, the metal thin film pattern 94 located in the middle thereof is curved. Highly accurate temperature measurement is possible without being distorted by the displacement of the actuator.

Further, in the present embodiment, one of the first or second shape memory alloy thin films 92 and 98 of the bending actuator is replaced with an elastic body such as a super elastic alloy, and this is made to function as a bias spring, so that the shape is improved. It is possible to easily function as a bending actuator without adding a complicated structure such as performing a shape memory treatment in two directions on the memory alloy or attaching a bias spring to the outside.
Therefore, in this case, the structure can be further simplified.

Further, when the metal thin film pattern 94 is used as a temperature sensor and also as a heater for the first and second shape memory alloy thin films 92 and 98, from the viewpoint of thermal efficiency, the temperature on the superelastic alloy side is increased. It is desirable to thicken the sensor polyimide.

Although the seventh and eighth embodiments have been described above, it is also possible to control the bending actuator of a higher degree by combining these. That is, a curved actuator is formed of three layers of shape memory alloy,
A metal thin film pattern made of the same material is formed in the middle of the whole and at a position slightly deviated from it.

The shape memory alloy is heated mainly by the metal thin film pattern arranged in the middle of the whole,
On the other hand, a relatively small current is passed to detect only the resistance value. Regarding the resistance values of these two metal thin film patterns, when driving the shape memory alloy actuator, the one arranged in the middle is affected only by temperature, and the other is affected by both temperature and displacement.
Therefore, it is possible to measure both the displacement and the temperature with high accuracy from the change in the resistance value of both.

Further, since the difference in temperature with respect to the same displacement in the shape memory alloy reflects the generation amount of stress-induced martensite, the load of the actuator can be obtained from these two parameters. in this way,
Being able to perform feedback control by both displacement and load is extremely important for performing advanced work of the actuator.

16 to 17B show a ninth embodiment of the present invention. This relates to a method for manufacturing a bending actuator different from the seventh and eighth embodiments.

Here, first, the first substrate 1 shown in FIG.
The first shape memory alloy thin film 102 is formed on 01, and then the second shape memory alloy thin film 104 is formed on the second substrate 103. Then, both the substrates 101 and 103 are heat-treated at a high temperature to form the shape memory alloy thin films 102 and 104.
Solution treatment is performed.

Subsequently, as shown in FIG. 17B, a first resin film 105 is formed on the first substrate 101 by the same method as in the seventh and eighth embodiments, and the first resin film 105 and the first shape are formed. The memory alloy thin film 102 is patterned. Further, a metal thin film pattern 106 and a second resin film 107 are formed thereon.
Here, as shown in FIG.
An electrode formation region 108 is formed as shown in FIG. In addition, the electrode forming region 10 of the metal thin film pattern 106
An opening 109 is formed in the second resin film 107 in correspondence with No. 6.

Although not shown here, the second shape memory alloy thin film 104 is also patterned into a predetermined shape on the second substrate 103 by a photolithography technique.

Next, as shown in FIG. 16, the first substrate 10
The first and second substrates 103 are bonded to each other and heat-treated at a temperature equal to or higher than the glass transition temperature of the first resin film 105 and the second resin film 107.
Join 3 After that, both substrate materials are removed, and the lead wire 1 is formed on the electrode formation region 108 of the metal thin film pattern 106.
By connecting 10 a bending actuator is formed.

Then, the first and second Joule heat is generated by passing an electric current through the lead wire 110 to the metal thin film pattern 106 of the bending actuator.
The shape memory alloy thin films 102 and 104 are heated to function as actuators.

By taking such a method,
Unlike the method shown in the eighth embodiment, the solution heat treatment temperature of the shape memory alloy thin films 102 and 104 is not limited by the heat resistance of the polyimide film, and the shape memory alloy thin film 102 of higher quality can be obtained. 104 can be obtained.

Here, by appropriately setting the film thicknesses of the first and second shape memory alloy thin films 102 and 104,
The same effects as those of the seventh and eighth embodiments can be obtained. Further, by using a shape memory alloy having a three-layer structure, it is possible to perform more precise control as described above.

18A to 19E show a tenth embodiment of the present invention. This is the 7th
9 to 9 relate to a method of manufacturing a bending actuator different from each of the embodiments. Here, two wafers, a first wafer 121 shown in FIG. 18A and a second wafer 122 shown in FIG. 18B, are prepared.

Further, as shown in FIG. 19B, after a silicon nitride film 124 serving as a stopper for silicon etching is formed on the silicon substrate 123 of the first wafer 121, a semiconductor process is applied to the control circuit and Wiring 12
5 and the thin film heater pattern 126 for heating the SMA are integrated to form a control chip chain. After this, a polyimide film 127 is further formed by coating.

Further, as shown in FIG. 19A, a silicon nitride film 129 which similarly serves as a stopper for silicon etching is formed on the silicon substrate 128 of the second wafer 122, and then the SMA thin film 130 is formed by sputtering. It is formed, patterned, and subjected to a solution state (recrystallization) treatment at a temperature of about 800 ° C. After this, a polyimide film 131 is further formed by coating.

Next, with the two wafers 121 and 122 facing each other and aligned, the two wafers 121 and 122 are bonded together as shown in FIG. 19C. At this time, since the uppermost layers of the two wafers 121 and 122 are the polyimide films 127 and 131, it is not necessary to use anodic oxidation or the like for bonding, and it is sufficient to heat the polyimide films 127 and 131 to the glass transition temperature or higher.

Further, after the two wafers 121 and 122 are bonded together, as shown in FIG. 19D, the silicon substrates 123 and 128 of the two wafers 121 and 122 are KOH.
Etching is performed by using the above. At this time, the silicon nitride films 124 and 129 function as etching stoppers.

Next, the silicon nitride films 124 and 129 are replaced with C
After removing with F4 / O2 plasma, the necessary portion is cut out as shown in FIG.
Get 32.

This method is advantageous when the SMA thin film 130 is used as the bending actuator 132 because the solubilization temperature of the SMA thin film 130 is not limited by the material used for the control chip chain.

Further, after forming a silicon nitride film 124 serving as a stopper for silicon etching on the silicon substrate 123 of the first wafer 121, a semiconductor process is applied to apply a control circuit and wiring 125, and a thin film heater for heating SMA. A control chip chain that is integrated with the pattern 126 is formed, and a silicon nitride film 129 that also serves as a silicon etching stopper is formed on the silicon substrate 128 of the second wafer 122, and then the SMA thin film 130 is formed by sputtering. Since it is formed, it is possible to reduce the number of wirings, and the bending actuator 132
Can be downsized and can be easily assembled.

The present invention is not limited to the above embodiments, and it goes without saying that various modifications can be made without departing from the gist of the present invention. Next, other characteristic technical matters of the present invention will be additionally described as follows.

(Additional Item 1) The flexible tube bending device according to claim 1, wherein the divided surface is a surface including a central axis of the flexible tube.

(Additional Item 2) The flexible tube bending device according to claim 1, wherein the shape memory type actuator is a shape memory alloy actuator. (Additional Item 3) The flexible tube bending device according to Additional Item 2, wherein the shape memory alloy actuator is a plate-shaped shape memory alloy that stores a curved shape.

(Additional Item 4) The flexible tube has a plurality of cutouts extending in a direction perpendicular to the axial direction of the tubular body on one side surface of the tubular body along the axial direction of the tubular body. The flexible tube bending device according to claim 1, wherein the flexible tube bending device has a notch structure formed.

(Additional Item 5) The flexible tube bending device according to claim 1, wherein the flexible tube has a structure in which a plurality of tubular members are connected by a rotating shaft. (Additional Item 6) In the flexible tube, a rear extending portion is formed on the outer peripheral surface of the rear end portion of the front tubular member, and a long hole is formed in this extending portion. 6. The flexible tube bending device as set forth in appendix 5, wherein a connecting pin of a tubular member is slidably inserted.

(Additional Item 7) A step of removing the first region, which is a cutout portion of the constituent substrate of the flexible tube, by etching.
A method of manufacturing a flexible tube, comprising: a step of thinning a second region which is a groove portion for folding of the substrate by etching; and a step of bending the substrate along the second region.

(Prior Art of Supplementary Note 7) The conventional bending tube structure of an endoscope has a structure in which a metal pipe is processed and rotatably connected by a rivet or the like as shown in JP-A-60-156430. is there. With this structure, there is no problem in assembling if the diameter is several millimeters or more, but it becomes difficult to process and assemble parts when forming a small curved tube having a diameter of submillimeter or less.

(Purpose of Supplementary Note 7) Method of Manufacturing Flexible Tube for Flexible Tube Bending Device with Easy-Assembly and Suitable for Thinning Diameter (Effect of Supplementary Note 7) Main Manufacturing Method Applying Semiconductor Manufacturing Process In this case, since it is possible to process grooves and cutouts in the order of microns, and the groove area is provided so that the groove can be bent and assembled, the assembly is easy.

(Additional Item 8) The groove portion for folding formed in the step of thinning the second region of the substrate by etching is filled with a different material having a high coefficient of thermal expansion, and the different material is thermally expanded so that the 8. The method for manufacturing a flexible tube according to appendix 7, wherein a step of bending the substrate along two regions is provided.

(Additional Item 9) The method for manufacturing a flexible tube according to Additional Item 8, wherein the different material having a high coefficient of thermal expansion is a metal having a coefficient of thermal expansion higher than that of silicon. (Additional Item 10) The method for manufacturing a flexible tube according to Additional Item 8, wherein the different material having a high coefficient of thermal expansion is a resin having a coefficient of thermal expansion higher than that of silicon.

(Additional Item 11) It is characterized in that the groove portion for folding formed in the step of thinning the second region of the substrate by etching is filled with a different material having a high elastic modulus. The method for manufacturing a flexible tube according to appendix 7.

(Additional Item 12) The method for producing a flexible tube according to Additional Item 11, wherein the dissimilar material having a high elastic modulus is a metal having an elastic modulus higher than that of silicon. (Additional Item 13) The different material having a high elastic modulus is a resin having an elastic modulus higher than that of silicon.
1. The method for manufacturing a flexible tube described in 1.

(Additional Item 14) The method for producing a flexible tube according to Additional Item 13, wherein the resin is a fluororesin. (Additional Item 15) The method for manufacturing a flexible tube according to Additional Item 7, wherein the first region is a cutout portion of the flexible tube.

(Additional Item 16) In an actuator comprising a shape memory alloy and a strain sensor arranged in close contact with the shape memory alloy, the strain sensors have different film thicknesses, and at least one of them is a shape memory alloy. A shape memory type actuator characterized in that it is arranged between layers of materials.

(Prior Art of Appendix 16) Since a thermodynamic conversion element such as SMA which generates a driving force by heat functions as an actuator itself, a very small actuator can be constructed. When such a micro actuator is applied to an application requiring highly accurate positioning such as a manipulator, a sensor for feedback is required. Control of the SMA actuator is possible by sensing displacement or temperature. As a sensing device in a small actuator, a strain gauge for detecting a change in resistance value of a metal thin film pattern or a resistance temperature detector is advantageous in terms of downsizing, but if the resistance temperature sensor is attached to the SMA, Strain associated with displacement makes accurate temperature measurement impossible. Further, in order to obtain a large output with the SMA actuator, it is necessary to give a relatively large strain. However, when such a large strain is to be measured with a strain gauge, a strain which has reproducible strain due to plastic deformation of the metal thin film is generated. It becomes impossible to measure. (JP-A-63-99829 and JP-A-1-2)
(Publication No. 62373) (Purpose of Supplementary Note 16) It is to provide a shape memory type actuator capable of highly accurate position control.

(Effect of Supplementary Note 16) Unlike the case where the strain sensor is simply attached to the SMA film, the strain applied to the strain sensor can be made significantly smaller than the maximum strain of the SMA film. Even if the force is increased, the characteristic of the strain gauge does not deteriorate, and highly accurate strain measurement with high reproducibility becomes possible.

(Additional Item 17) The shape memory type actuator according to Additional Item 16, wherein the shape memory alloy has a plate shape. (Additional Item 18) The shape memory actuator according to Additional Item 16, wherein the shape memory alloy is a NiTi-based shape memory alloy.

(Additional Item 19) The shape memory actuator according to Additional Item 16, wherein the strain sensor is made of a metal having a relatively small temperature coefficient of resistance. (Additional Item 20) The shape memory actuator according to Additional Item 19, wherein the metal having a relatively small temperature coefficient of resistance value is titanium.

(Additional Item 21) The shape memory actuator according to Additional Item 16, wherein the strain sensor is a semiconductor having a large gauge factor. (Additional Item 22) In an actuator configured by a shape memory alloy and a temperature sensor arranged in close contact with the shape memory alloy, the temperature sensor has two or more layers in which the film thicknesses are substantially equal and at least one is a shape memory alloy. A shape memory type actuator characterized by being arranged between materials.

(Effect of Supplementary Note 22) According to this configuration, the temperature sensor can perform highly accurate temperature measurement without being subjected to strain. (Additional Item 23) The shape memory actuator according to Additional Item 22, wherein the shape memory alloy has a plate shape.

(Additional Item 24) The shape memory alloy is Ni
3. The shape memory actuator according to claim 2, which is a Ti-based shape memory alloy. (Additional Item 25) The shape memory actuator according to Additional Item 22, wherein the temperature sensor is a metal having a relatively large temperature coefficient of resistance.

(Additional Item 26) The shape memory actuator according to Additional Item 25, wherein the metal having a relatively large temperature coefficient of resistance is platinum. (Additional Item 27) A method of manufacturing a shape memory actuator, comprising: laminating a substrate on which a sensor is formed with a substrate on which a shape memory alloy thin film is formed and etching a predetermined pattern, to be integrated.

(Prior Art of Appendix 27) In order to miniaturize an SMA manipulator with a sensor, an S circuit is formed on a substrate on which an electronic circuit for driving the sensor and others is formed.
A method that applies semiconductor manufacturing technology, such as MA film formation by sputtering, is conceivable.
The alloy is generally amorphous as it is, and heat treatment at a considerably high temperature is required to crystallize the alloy to make it function. There is a problem that this heat treatment impairs the functions of the sensor and the electronic circuit formed on the substrate.

(Purpose of Supplementary Note 27) A method of manufacturing a shape memory actuator, in which an actuator made of a shape memory alloy with a sensor can be miniaturized. (Effect of Supplementary Note 27) According to the present manufacturing method, a high-quality SMA thin film can be obtained without the solution treatment temperature of the SMA film being limited by the heat resistance of other elements constituting the sensor. Suitable for miniaturization.

(Additional Item 28) The method for manufacturing a shape memory actuator according to Additional Item 27, wherein the sensor is at least one of a strain sensor and a temperature sensor.

(Additional Item 29) In a flexible tube bending device for performing bending driving by combining a flexible tube connected to a bendable body with a shape memory type actuator, the shape memory type actuator has a different film thickness and at least one of A flexible tube bending device in which a strain sensor is arranged between two or more layers of a shape memory alloy.

(Prior Art of Supplement 29) Supplement 16,
There has never been a flexible tube bending device to which an actuator corresponding to 22 is applied. (Purpose of Additional Item 29) It is an object of the present invention to provide a flexible tube bending device capable of position control with high accuracy.

(Effect of Supplementary Note 29) A flexible tube capable of highly accurate position control can be achieved. (Additional Item 30) In a flexible tube bending device that performs bending driving by combining a bendablely connected flexible tube with a shape memory actuator, the shape memory actuator comprises:
A flexible tube bending device, characterized in that a temperature sensor is disposed between two or more layers of materials having substantially the same film thickness, at least one of which is a shape memory alloy.

[0132]

According to the present invention, a flexible tube is constituted by a plurality of flexible tube constituent elements which can be divided along the dividing surface in the axial direction thereof, and a shape is formed between the dividing surfaces of the respective flexible tube constituent elements. Since the bending portion is formed by connecting the respective flexible tube constituent elements with the memory type actuator interposed, the bending portion can be easily assembled and the diameter of the flexible tube can be reduced. it can.

[Brief description of drawings]

FIG. 1A is a schematic configuration diagram of an entire system of an ultrafine endoscope according to a first embodiment of the present invention, FIG. 1B is an exploded perspective view of a distal end portion of an insertion portion of the ultrafine endoscope, and FIG. 8A is a plan view showing a control line for an actuator. FIG.

FIG. 2A is a perspective view of a curved tube, and FIG. 2B is a perspective view showing a silicon wafer in which a notch portion and a folding groove portion are formed by an etching process.

FIG. 3 is a vertical cross-sectional view of a main part showing a forming process of a cutout portion and a groove portion for bending margin on a silicon wafer.

FIG. 4 is a schematic configuration diagram for explaining a bending operation of a bending portion.

FIG. 5 shows a second embodiment of the present invention (A)
Is an exploded perspective view of the curved portion, and FIG.

FIG. 6 shows a third embodiment of the present invention (A)
FIG. 3B is a perspective view showing a silicon wafer in which a notch portion and a groove portion for bending margin are formed by an etching process, and FIG.

FIG. 7A is a cross-sectional view showing a wire guide portion of a bending tube, and FIG. 7B is a perspective view showing a notch portion for a wire guide portion and a groove portion for a bending margin, which are formed by etching on a silicon wafer. Fig.

FIG. 8 shows a fourth embodiment of the present invention (A)
(C) is a longitudinal cross-sectional view of an essential part for explaining the forming process of the bent part of the curved tube, and (D) is a longitudinal cross-sectional view of the essential part showing the bent part of the curved tube.

FIG. 9 shows a fifth embodiment of the present invention (A)
(C) is a longitudinal cross-sectional view of an essential part for explaining the forming process of the bent part of the curved tube, and (D) is a longitudinal cross-sectional view of the essential part showing the bent part of the curved tube.

FIG. 10 shows a sixth embodiment of the present invention,
(A) is a side view of a main part showing a connecting portion of a bending piece, (B) is a longitudinal sectional view of the same, and (C) is a side view showing a bending state of the bending piece.

FIG. 11 is a side view showing a modified example of the sixth embodiment.

FIG. 12 is a vertical cross-sectional view showing a state in which a shape memory alloy thin film is formed on a molded substrate of the bending actuator used in the seventh embodiment of the present invention by sputtering deposition.

13A is a plan view showing a structure of a bending actuator on which a metal thin film pattern is formed, FIG. 13B is a sectional view taken along line L ₁ -L _{1 of} FIG. 13A, and FIG. 13C is a metal thin film pattern. plan view showing a state where the lead wire is connected to the electrode formation region, (D) is L ₂ -L ₂ sectional view taken on line (C).

14A is a plan view showing a structure of a bending actuator in which a metal thin film pattern of the bending actuator used in the eighth embodiment of the present invention is formed, and FIG. 14B is a view showing L _{1 of} FIG. 14A. -L ₁ line sectional view, (C) is a plan view showing a state of forming an opening in the electrode formation region of the metal thin film pattern, (D) is L ₂ -L ₂ sectional view taken on line (C).

15A is a plan view showing a state in which a lead wire is connected to an electrode formation region of a metal thin film pattern, and FIG. 15B is a cross-sectional view taken along line L ₁ -L _{1 of} FIG. 15A.

FIG. 16 is a first substrate and a second substrate according to a ninth embodiment of the present invention.
FIG. 6 is a vertical cross-sectional view showing a state in which the substrates of FIG.

17A is a plan view showing a state in which an opening is formed in an electrode formation region of a metal thin film pattern, and FIG. 17B is a plan view of FIG.
L ₁ -L ₁ line sectional view.

FIG. 18 shows a tenth embodiment of the present invention,
(A) is a plan view showing a first wafer, (B) is a plan view showing a second wafer.

19A is a vertical cross-sectional view of the first wafer, FIG.
Is a vertical sectional view of the second wafer, (C) is a vertical sectional view showing a state in which two wafers are bonded together, and (D) is a vertical sectional view showing a state in which the silicon substrates of the two wafers are etched and removed. FIG. 3E is a vertical cross-sectional view showing an actuator formed by cutting out a necessary portion.

[Explanation of symbols]

11a, 11b, 31 ... Bending portion, 12a, 12b ... Bending tube (flexible tube constituent element), 13 ... Flexible tube, 16 ... SMA actuator (shape memory type actuator), 34 ... Bending tube body (flexible tube configuration) Element), 35 ... Divided body (flexible tube constituent element).

Claims (1)

[Claims] 1. A flexible tube bending apparatus including a bending portion that bends and drives the flexible tube in accordance with a deformation operation of a shape memory type actuator arranged in the flexible tube, wherein the flexible tube has an axis center thereof. Each of the flexible tubes is configured by a plurality of flexible tube constituent elements that can be divided along a dividing surface in the direction, and the shape memory actuator is interposed between the dividing surfaces of the respective flexible tube constituent elements. A flexible tube bending device characterized in that the bending portion is formed by connecting constituent elements.