JPH0714668U - Circuit board device - Google Patents
Circuit board deviceInfo
- Publication number
- JPH0714668U JPH0714668U JP4992093U JP4992093U JPH0714668U JP H0714668 U JPH0714668 U JP H0714668U JP 4992093 U JP4992093 U JP 4992093U JP 4992093 U JP4992093 U JP 4992093U JP H0714668 U JPH0714668 U JP H0714668U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- circuit board
- conductor
- recess
- film resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
(57)【要約】
【目的】 回路基板装置における集積度の向上を図る。
【構成】 回路基板２上に抵抗値の大きい第１の厚膜抵
抗３と抵抗値の小さい第２の厚膜抵抗４を形成する時
に、第２の厚膜抵抗４の下に凹部７を形成する。また、
電流容量の小さい第１の厚膜導体５と電流容量の大きい
第２の厚膜導体６を形成する時に、第２の厚膜導体６の
下に凹部８を形成する。
(57) [Abstract] [Purpose] To improve the degree of integration in circuit board devices. [Structure] When forming a first thick film resistor 3 having a large resistance value and a second thick film resistor 4 having a small resistance value on a circuit board 2, a recess 7 is formed under the second thick film resistor 4. To do. Also,
When forming the first thick film conductor 5 having a small current capacity and the second thick film conductor 6 having a large current capacity, the recess 8 is formed under the second thick film conductor 6.
Description
【０００１】[0001]
本考案は混成集積回路装置等の回路基板装置に関する。 The present invention relates to a circuit board device such as a hybrid integrated circuit device.
【０００２】[0002]
セラミックス等の回路基板の上に厚膜抵抗や厚膜導体で回路を形成した回路基 板装置は公知である。 A circuit board device in which a circuit is formed by a thick film resistor or a thick film conductor on a circuit board such as ceramics is known.
【０００３】[0003]
ところで、抵抗値の低い厚膜抵抗を形成する場合、又は電流容量の大きい厚膜 導体（パワーライン）を形成する場合には、それぞれのパターンの幅を大きくす ることが必要になり、必然的に回路基板装置が大型になった。 By the way, when forming a thick film resistor with a low resistance value or forming a thick film conductor (power line) with a large current capacity, it is necessary to increase the width of each pattern, which is inevitable. The size of the circuit board device has become large.
【０００４】 そこで、本考案の目的は、集積度の向上を容易に図ることができる回路基板装 置を提供することにある。Therefore, an object of the present invention is to provide a circuit board device capable of easily improving the degree of integration.
【０００５】[0005]
上記目的を達成するための本考案は、絶縁性回路基板上に厚膜抵抗及び厚膜導 体を備えた回路基板装置において、前記回路基板に凹部が形成され、この凹部の 中に前記厚膜抵抗又は厚膜導体が充填されていることを特徴とする回路基板装置 に係わるものである。 なお、請求項２に示すように、抵抗値の異なる第１及び第２の厚膜抵抗の内の 抵抗値の小さい第２の厚膜抵抗の下に凹部を設けることが望ましい。 また、請求項３に示すように、電流容量の異なる第１及び第２の厚膜導体の内 の電流容量の大きい第２の厚膜導体の下に凹部を設けることが望ましい。 The present invention for achieving the above object provides a circuit board device having a thick film resistor and a thick film conductor on an insulating circuit board, wherein a recess is formed in the circuit board, and the thick film is provided in the recess. The present invention relates to a circuit board device characterized by being filled with a resistor or a thick film conductor. As described in claim 2, it is desirable to provide a recess under the second thick film resistor having a smaller resistance value among the first and second thick film resistors having different resistance values. Further, as described in claim 3, it is desirable to provide a concave portion under the second thick film conductor having a large current capacity among the first and second thick film conductors having different current capacities.
【０００６】[0006]
本考案によれば回路基板に形成された凹部に厚膜抵抗又は厚膜導体を設けるの で、膜厚を厚くすることが可能になり、同一の抵抗値又は電流容量を得る場合に はパターン幅を狭くし、集積度を向上させることができる。 また、請求項２の場合には、抵抗値の異なる第１及び第２の厚膜抵抗を同一種 類の厚膜ペーストで形成しても第２の厚膜抵抗の面積がさほど大きくならない。 また、請求項３の場合には、電流容量の異なる第１及び第２の厚膜導体を同一 種類の厚膜ペーストで形成しても第２の厚膜導体の幅がさほど大きくならない。 According to the present invention, since the thick film resistor or the thick film conductor is provided in the recess formed in the circuit board, it is possible to increase the film thickness, and in the case of obtaining the same resistance value or current capacity, the pattern width Can be narrowed and the degree of integration can be improved. In the second aspect, even if the first and second thick film resistors having different resistance values are formed by the same kind of thick film paste, the area of the second thick film resistor is not so large. In the third aspect, even if the first and second thick film conductors having different current capacities are formed of the same kind of thick film paste, the width of the second thick film conductor does not become so large.
【０００７】[0007]
次に、図１及び図２を参照して本考案の実施例に係わる回路基板装置を説明す る。 図１に示す混成集積回路構成の回路基板装置１は、セラミックス等から成る絶 縁性回路基板２と、この上に形成された第１及び第２の厚膜抵抗３、４と、第１ 及び第２の厚膜導体５、６とを有する。なお、この回路基板装置１は、パワート ランジスタ、モノリシックＩＣ、コンデンサ等の種々の回路素子を含むが、図１ ではこれ等が省略されている。 Next, a circuit board device according to an embodiment of the present invention will be described with reference to FIGS. A circuit board device 1 having a hybrid integrated circuit configuration shown in FIG. 1 includes an insulating circuit board 2 made of ceramics or the like, first and second thick film resistors 3 and 4 formed thereon, and first and second thick film resistors 3 and 4. Second thick film conductors 5, 6. The circuit board device 1 includes various circuit elements such as a power transistor, a monolithic IC, and a capacitor, which are omitted in FIG.
【０００８】 第１の厚膜抵抗３は第１の抵抗値を有し、第２の厚膜抵抗４は第１の抵抗値よ りも小さい第２の抵抗値を有する。また、第１の厚膜導体５は第１の電流容量を 有し、第２の厚膜導体６はパワーラインであって第１の電流容量よりも大きい第 ２の電流容量を有する。第１の厚膜抵抗３及び第１の厚膜導体５は回路基板２の 平坦な表面上に形成されているが、第２の厚膜抵抗４及び第２の厚膜導体６は、 回路基板２の表面に形成された第１及び第２の凹部７、８の上に形成されている 。The first thick film resistor 3 has a first resistance value, and the second thick film resistor 4 has a second resistance value smaller than the first resistance value. Further, the first thick film conductor 5 has a first current capacity, and the second thick film conductor 6 is a power line and has a second current capacity larger than the first current capacity. The first thick film resistor 3 and the first thick film conductor 5 are formed on the flat surface of the circuit board 2, while the second thick film resistor 4 and the second thick film conductor 6 are formed on the circuit board. It is formed on the first and second recesses 7 and 8 formed on the surface of 2.
【０００９】 第２の厚膜抵抗４の下の第１の凹部７は、図１から明らかなように第２の厚膜 抵抗４の幅よりも狭い幅に形成されている。従って、第２の厚膜抵抗４の一部は 第１の凹部７の外の回路基板２の表面上に形成されている。第２の厚膜抵抗４は 第１の厚さの第１の厚膜抵抗３と同一の厚さの部分を回路基板２の表面上に有す る他に、第１の厚さよりも厚い第２の厚さの部分を第１の凹部７の上に有する。 従って、第１及び第２の厚膜抵抗３、４を同一材料で形成する場合に第２の厚膜 抵抗４を幅狭にして集積度を向上させることができる。なお、第２の厚膜抵抗４ をトリミングする時には、第２の厚膜抵抗４の凹部７の外の厚さの小さい領域に 図１に示すようにトリミングの溝（切欠部）９を設ける。これにより、トリミン グを容易に達成することが可能になる。The first recess 7 below the second thick film resistor 4 is formed to have a width narrower than the width of the second thick film resistor 4 as is apparent from FIG. Therefore, a part of the second thick film resistor 4 is formed on the surface of the circuit board 2 outside the first recess 7. The second thick film resistor 4 has a portion having the same thickness as the first thick film resistor 3 of the first thickness on the surface of the circuit board 2 and is thicker than the first thickness. It has a thickness of 2 above the first recess 7. Therefore, when the first and second thick film resistors 3 and 4 are formed of the same material, the second thick film resistor 4 can be narrowed to improve the degree of integration. When trimming the second thick film resistor 4, a trimming groove (notch) 9 is provided in a region of the second thick film resistor 4 having a small thickness outside the recess 7 as shown in FIG. This makes it easy to achieve trimming.
【００１０】 第２の厚膜導体６は第１の厚さの第１の厚膜導体５よりも厚い第２の厚さの部 分を凹部８の上に有する。従って、第１及び第２の厚膜導体５、６の幅を例えば 同一に設定したとしても、第２の厚膜導体６の電流容量が大きくなる。これは第 ２の厚膜導体６の幅を小さくして集積度の向上が図られることを意味する。The second thick film conductor 6 has a second thickness portion above the recess 8 that is thicker than the first thick film conductor 5 having the first thickness. Therefore, even if the widths of the first and second thick film conductors 5 and 6 are set to be, for example, the same, the current capacity of the second thick film conductor 6 becomes large. This means that the width of the second thick film conductor 6 can be reduced to improve the degree of integration.
【００１１】 図１及び図２の回路基板装置１の第１及び第２の厚膜導体５、６を形成する場 合には、回路基板２の表面上に、金属粒子とガラス粉末とバインダとから成る周 知の厚膜導体ペーストをスクリーン印刷法によって所定パターンに塗布する。こ の時、同一の導体ペーストによって第１及び第２の厚膜導体５、６のための導体 ペースト層を形成する。同一のスクリーン印刷工程によって第１及び第２の厚膜 導体５、６のための導体ペースト層を形成しても、第２の厚膜導体６の領域の凹 部８に導体ペーストが充填されるために、ここでの導体ペースト層の厚さが他よ りも厚くなる。When forming the first and second thick film conductors 5 and 6 of the circuit board device 1 shown in FIGS. 1 and 2, metal particles, glass powder, and a binder are formed on the surface of the circuit board 2. The known thick-film conductor paste consisting of is applied in a predetermined pattern by screen printing. At this time, the same conductor paste is used to form the conductor paste layers for the first and second thick film conductors 5 and 6. Even if the conductor paste layers for the first and second thick film conductors 5 and 6 are formed by the same screen printing process, the recess 8 in the region of the second thick film conductor 6 is filled with the conductor paste. Therefore, the conductor paste layer here is thicker than the others.
【００１２】 第１及び第２の厚膜抵抗３、４を形成する場合には、金属粒子とガラス粉末と バインダとを適当に配合した周知の厚膜抵抗ペーストをスクリーン印刷法によっ て回路基板２上に塗布する。なお、第１及び第２の厚膜抵抗３、４は同一の厚膜 抵抗ペーストを使用して同時に形成する。厚膜抵抗ペーストをスクリーン印刷法 で塗布すると、凹部７に厚膜抵抗ペーストが充填され、ここでの厚膜抵抗ペース ト層の厚さが他の部分よりも厚くなる。 次に、導体ペースト層及び抵抗ペースト層を周知の方法で焼成することによっ て図１及び図２の第１及び第２の厚膜抵抗３、４と第１及び第２の厚膜導体５、 ６とが完成する。When forming the first and second thick film resistors 3 and 4, a well-known thick film resistor paste in which metal particles, glass powder, and a binder are appropriately mixed is used by a screen printing method to form a circuit board. Apply on top of 2. The first and second thick film resistors 3 and 4 are simultaneously formed by using the same thick film resistor paste. When the thick film resistance paste is applied by the screen printing method, the thick film resistance paste is filled in the concave portion 7, and the thickness of the thick film resistance paste layer here becomes thicker than other portions. Next, by firing the conductor paste layer and the resistance paste layer by a known method, the first and second thick film resistors 3 and 4 and the first and second thick film conductors 5 in FIGS. , 6 and are completed.
【００１３】 上述から明らかなように、集積度の向上を図った第１及び第２の厚膜抵抗３、 ４を同一の工程によって容易に形成することができる。また、第１及び第２の厚 膜導体５、６も同一工程で容易に形成することができる。As is clear from the above description, the first and second thick film resistors 3 and 4 with improved integration can be easily formed by the same process. Also, the first and second thick film conductors 5 and 6 can be easily formed in the same step.
【００１４】[0014]
本発明は上述の実施例に限定されるものでなく、変形可能なものである。例え ば、第２の厚膜導体６も凹部８からはみ出すように形成することができる。また 、ワイヤを接続するためのボンディングパッド部にも凹部を形成し、ここでの導 体層を他の部分よりも厚くすることができる。また、第２の厚膜抵抗４を第１の 厚膜抵抗３のための第１の抵抗ペ−ストよりも抵抗率の低い第２の抵抗ペ−スト で形成し、第２の厚膜抵抗４のスペ−スを更に小さくすることができる。また、 第２の厚膜抵抗体６を第１の厚膜導体５のための導体ペ−ストよりも抵抗率の低 い導体ペ−ストで形成し、第２の厚膜導体６のスペ−スを更に小さくすることが できる。また、１種類の厚膜抵抗又は厚膜導体を設ける場合にも本発明を適用す ることができる。 The present invention is not limited to the above embodiment, but can be modified. For example, the second thick film conductor 6 can also be formed so as to protrude from the recess 8. In addition, a recess may be formed in a bonding pad portion for connecting a wire so that the conductor layer here can be thicker than other portions. In addition, the second thick film resistor 4 is formed with a second resistance paste having a lower resistivity than the first resistance paste for the first thick film resistor 3, The space of 4 can be further reduced. Further, the second thick film resistor 6 is formed of a conductor paste having a resistivity lower than that of the conductor paste for the first thick film conductor 5, and the space of the second thick film conductor 6 is formed. The space can be further reduced. The present invention can also be applied to the case where one type of thick film resistor or thick film conductor is provided.
【図１】本考案の実施例の回路基板装置の一部を示す平
面図である。FIG. 1 is a plan view showing a part of a circuit board device according to an embodiment of the present invention.
【図２】図１のＡ−Ａ線断面図である。FIG. 2 is a sectional view taken along the line AA of FIG.
３、４ 第１及び第２の厚膜抵抗 ５、６ 第１及び第２の厚膜導体 ７、８ 凹部 3, 4 First and second thick film resistors 5, 6 First and second thick film conductors 7, 8 Recesses
Claims (3)
体を備えた回路基板装置において、 前記回路基板に凹部が形成され、この凹部の中に前記厚
膜抵抗又は厚膜導体が充填されていることを特徴とする
回路基板装置。1. A circuit board device having a thick film resistor and a thick film conductor on an insulating circuit board, wherein a recess is formed in the circuit board, and the recess is filled with the thick film resistor or the thick film conductor. A circuit board device characterized by being provided.
１の厚膜抵抗と、前記第１の抵抗値よりも小さい第２の
抵抗値の第２の厚膜抵抗とが形成された回路基板装置に
おいて、 前記第１の厚膜抵抗が前記回路基板上に第１の厚さに形
成され、 前記回路基板に凹部が形成され、 前記第２の厚膜抵抗の少なくとも一部が前記凹部に形成
され、 前記凹部における前記第２の厚膜抵抗の厚さが前記第１
の厚さよりも厚い第２の厚さであることを特徴とする回
路基板装置。2. A first thick film resistor having a first resistance value and a second thick film resistor having a second resistance value smaller than the first resistance value are formed on an insulating circuit board. In the above described circuit board device, the first thick film resistor is formed to have a first thickness on the circuit board, a recess is formed in the circuit board, and at least a part of the second thick film resistor is formed. The thickness of the second thick film resistor formed in the recess is the first thick film resistor.
A second thickness greater than the thickness of the circuit board device.
厚膜導体と、前記第１の電流容量よりも大きい第２の電
流容量の第２の厚膜導体とが形成された回路基板装置に
おいて、 前記第１の厚膜導体が前記回路基板上に第１の厚さに形
成され、 前記回路基板に凹部が形成され、 前記第２の厚膜導体の少なくとも一部が前記凹部に形成
され、 前記凹部における前記第２の厚膜導体の厚さが前記第１
の厚さよりも厚い第２の厚さであることを特徴とする回
路基板装置。3. A first thick film conductor having a first current capacity and a second thick film conductor having a second current capacity, which is larger than the first current capacity, are formed on an insulating substrate. In the circuit board device, the first thick film conductor is formed to have a first thickness on the circuit board, a recess is formed in the circuit board, and at least a part of the second thick film conductor is the recess. And the thickness of the second thick film conductor in the recess is equal to that of the first thick film conductor.
A second thickness greater than the thickness of the circuit board device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4992093U JPH0714668U (en) | 1993-08-20 | 1993-08-20 | Circuit board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4992093U JPH0714668U (en) | 1993-08-20 | 1993-08-20 | Circuit board device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0714668U true JPH0714668U (en) | 1995-03-10 |
Family
ID=12844456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4992093U Pending JPH0714668U (en) | 1993-08-20 | 1993-08-20 | Circuit board device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0714668U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494395U (en) * | 1972-04-13 | 1974-01-16 | ||
| JPS5269797U (en) * | 1975-11-18 | 1977-05-24 |
-
1993
- 1993-08-20 JP JP4992093U patent/JPH0714668U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494395U (en) * | 1972-04-13 | 1974-01-16 | ||
| JPS5269797U (en) * | 1975-11-18 | 1977-05-24 |
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