Nothing Special   »   [go: up one dir, main page]

JPH0697643A - Solder surface mount equipment - Google Patents

Solder surface mount equipment

Info

Publication number
JPH0697643A
JPH0697643A JP24538092A JP24538092A JPH0697643A JP H0697643 A JPH0697643 A JP H0697643A JP 24538092 A JP24538092 A JP 24538092A JP 24538092 A JP24538092 A JP 24538092A JP H0697643 A JPH0697643 A JP H0697643A
Authority
JP
Japan
Prior art keywords
heater
stage
parallelism
semiconductor device
solder surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24538092A
Other languages
Japanese (ja)
Inventor
Akira Ozaki
彰 尾崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP24538092A priority Critical patent/JPH0697643A/en
Publication of JPH0697643A publication Critical patent/JPH0697643A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent solder connection failure, by a method wherein a stage or a heater are displaced so as to keep parallelism when pressure is applied in the state that the stage and the heater deviate from parallelism. CONSTITUTION:By arranging an elastic member 5 between an equipment stand 6 and a stage 4, parallelism of the stage 4 and the heater 2 are always maintained by the effect of the elastic member 5, when a heater 2 applies pressure to an outer lead 1a of a semiconductor device 1, so that the heater 2 applies uniform pressure to the outer lead 1a of the semiconductor device 1, and prevents solder connection failure.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、フラットタイプの半導
体装置の半田面実装技術、特に組立工程、実装工程等に
おいて発生するアウターリードと実装基板との半田接続
不良を防止することのできる技術に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder surface mounting technique for a flat type semiconductor device, and more particularly to a technique capable of preventing a solder connection failure between an outer lead and a mounting substrate which occurs in an assembly process, a mounting process and the like. It is a thing.

【0002】[0002]

【従来の技術】従来、フラットタイプの半導体装置のア
ウターリードと実装基板を半田付けする装置は、前記半
導体装置が仮り止めされた実装基板をステージで支持
し、加熱されたヒータを半導体装置のアウターリードに
加圧し、半田付けを行うのが一般的であった。
2. Description of the Related Art Conventionally, an apparatus for soldering an outer lead of a flat type semiconductor device and a mounting substrate supports a mounting substrate on which the semiconductor device is temporarily fixed on a stage, and heats a heater to the outer side of the semiconductor device. It is common to pressurize the leads and solder them.

【0003】このような従来構造の半田面実装装置の一
例を図4を用いて説明する。
An example of such a conventional solder surface mounting apparatus will be described with reference to FIG.

【0004】同図において、まず、半導体装置1が仮り
止めされた実装基板3を装置架台6に設けられたステー
ジ4の上面にのせる。次にヒータ2を下降させて、アウ
ターリード1aを加圧することにより、前記半導体装置
1のアウターリード1aが実装基板3に半田付けされる
という構造である。
In FIG. 1, first, the mounting substrate 3 to which the semiconductor device 1 is temporarily fixed is placed on the upper surface of the stage 4 provided on the device mount 6. Next, the heater 2 is lowered to pressurize the outer leads 1a, so that the outer leads 1a of the semiconductor device 1 are soldered to the mounting substrate 3.

【0005】尚、半導体装置の実装技術に関して記載さ
れた文献の例としては、応用技術出版株式会社1988
年11月16日発行、村上元著「表面実装形LSIパッ
ケージの実装技術とその信頼性向上」第346〜347
頁が挙げられる。
Incidentally, as an example of a document describing the mounting technology of a semiconductor device, Applied Technology Publishing Co., Ltd. 1988 is available.
Issued on November 16, 2015, by Murakami, "Mounting Technology for Surface Mount LSI Packages and Improving Its Reliability", Nos. 346 to 347
Page.

【0006】[0006]

【発明が解決しようとする課題】ところが、上記図4に
示した技術において、ステージ4とヒータ2は半導体装
置1のアウターリード1aを半田付けする上で高精度な
平行度が必要とされ、ヒータ2の交換後、装置保守等の
際にその都度平行度の調整を行っている。
However, in the technique shown in FIG. 4, the stage 4 and the heater 2 are required to have a high degree of parallelism when soldering the outer leads 1a of the semiconductor device 1. After the replacement of item 2, the parallelism is adjusted each time the device is maintained.

【0007】しかし、調整は人手による作業のため時間
がかかり過ぎるうえ、ステージ4、実装基板3、ヒータ
2への異物付着又は汚れによるステージ4やヒータ2の
平面度の悪化のため、高精度な平行度を維持するのが困
難となり、図4に示すようにアウターリード1aが加圧
及び加熱されず半田接続不良を引き起こすという問題点
があった。
However, the adjustment takes too much time due to the manual work, and the flatness of the stage 4 and the heater 2 is deteriorated due to the adhesion or dirt of the stage 4, the mounting substrate 3 and the heater 2, so that the precision is high. It is difficult to maintain the parallelism, and there is a problem that the outer lead 1a is not pressed and heated as shown in FIG.

【0008】本発明の目的は、フラットタイプの半導体
装置のアウターリードと実装基板との半田接続不良を防
止することのできる半田面実装装置を提供することにあ
る。
An object of the present invention is to provide a solder surface mounting device capable of preventing a solder connection failure between the outer lead of a flat type semiconductor device and a mounting substrate.

【0009】本発明の前記ならびにその他の目的と新規
な特徴は、本明細書の記述および添付図面から明らかに
なるであろう。
The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

【0010】[0010]

【課題を解決するための手段】本願において開示される
発明のうち、代表的なものの概要を簡単に説明すれば、
以下のとおりである。
Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

【0011】すなわち、ステージまたはヒータにずれが
生じ、ステージとヒータの平行度の精度が保たれなくな
った場合でも、装置架台とステージの間に設けられた半
田接続不良防止手段により、ステージが平行度のずれに
追従し、ヒータとの平行度を保つ構造となっている。
That is, even when the stage or the heater is misaligned and the accuracy of the parallelism between the stage and the heater cannot be maintained, the parallelism of the stage can be prevented by the solder connection failure preventing means provided between the apparatus stand and the stage. The structure is such that it follows the deviation of the gap and maintains the parallelism with the heater.

【0012】また、ヒータと、該ヒータが保持されてい
るヒータ台との間に半田接続不良防止手段を設けること
においても、上記と同様の結果を得ることが可能とな
る。
The same result as described above can be obtained also by providing the solder connection failure prevention means between the heater and the heater base holding the heater.

【0013】[0013]

【作用】前記した手段によれば、半導体装置の四辺に延
びたアウターリードに常に均等にヒータを加圧及び加熱
させることが可能となるため、半田接続不良を防止する
ことができる。
According to the above-mentioned means, since it is possible to constantly pressurize and heat the outer leads extending on the four sides of the semiconductor device evenly, it is possible to prevent defective solder connection.

【0014】また、ヒータ交換や装置保守等の際の面倒
な平行度の調整を実施せずに済むため、作業性の向上も
可能となる。
Further, since it is not necessary to perform the troublesome adjustment of the parallelism at the time of replacing the heater or maintaining the apparatus, the workability can be improved.

【0015】[0015]

【実施例1】図1は本発明の一実施例である半田面実装
装置を示す正面図である。
Embodiment 1 FIG. 1 is a front view showing a solder surface mounting apparatus which is an embodiment of the present invention.

【0016】半導体装置1を支持する側の構造として
は、装置の土台となり金属で作られた装置架台6と、こ
の装置架台6と同様に金属で作られ、実装基板3を取り
付けるステージ4と、前記装置架台6と前記ステージ4
の間に介設され、シリコーンゴム等で形成された弾性体
5(半田接続不良防止手段)とが接着剤等で結合されて
いる。
As the structure for supporting the semiconductor device 1, a device base 6 made of metal to serve as a base of the device, and a stage 4 made of metal similar to the device base 6 to which the mounting substrate 3 is attached, The device base 6 and the stage 4
An elastic body 5 (solder connection failure prevention means) formed of silicone rubber or the like is interposed between the two by means of an adhesive or the like.

【0017】一方、半田付けを実施する側の構造として
は、熱伝導率の高い金属材料を用いたヒータ2に熱源で
あるヒータ素子2aが埋め込まれ、また、ヒータ2の上
側には該ヒータ2を下降させて加圧するためのエアシリ
ンダ2bが組み込まれている。
On the other hand, as a structure on the side where soldering is performed, a heater element 2a which is a heat source is embedded in a heater 2 made of a metal material having a high thermal conductivity, and the heater 2 is provided above the heater 2. An air cylinder 2b for lowering and pressurizing is installed.

【0018】ここで、本実施例の動作について説明す
る。
The operation of this embodiment will be described below.

【0019】半田付けを実施する際には、まず、ステー
ジ4の上面に半導体装置1が仮り止めされた実装基板3
を取り付ける。
When performing soldering, first, the mounting substrate 3 with the semiconductor device 1 temporarily fixed on the upper surface of the stage 4 is mounted.
Attach.

【0020】次に、エアシリンダ2bによりヒータ2を
下降させて、半導体装置1のアウターリード1aを加圧
する。加圧する際、図2に示すようにステージ4とヒー
タ2との平行度がずれた状態で加圧すると、弾性体5が
変形し、ステージ4はヒータ2との平行度を保つように
変位し、半導体装置1の四辺に延びたアウターリード1
aが全て均等に加圧されるため、半田接続不良の発生を
防止することが可能となる。
Next, the heater 2 is lowered by the air cylinder 2b to pressurize the outer lead 1a of the semiconductor device 1. When the pressure is applied with the parallelism between the stage 4 and the heater 2 deviated as shown in FIG. 2, the elastic body 5 is deformed and the stage 4 is displaced so as to maintain the parallelism with the heater 2. , The outer leads 1 extending to the four sides of the semiconductor device 1
Since a is uniformly pressed, it is possible to prevent the occurrence of defective solder connection.

【0021】また、ステージ4やヒータ2にゴミ等の異
物が付着し、ステージ4やヒータ2の平面度が損なわれ
た状態であっても、ヒータ2によって半導体装置1のア
ウターリード1aが加圧される際に弾性体5が変形する
ため、アウターリード1aは全て均等に加圧され、前記
同様、半田接続不良の発生を防止することが可能とな
る。
Even when foreign matter such as dust adheres to the stage 4 and the heater 2 and the flatness of the stage 4 and the heater 2 is impaired, the heater 2 presses the outer lead 1a of the semiconductor device 1. Since the elastic body 5 is deformed at the time of performing, all the outer leads 1a are uniformly pressed, and similarly to the above, it is possible to prevent the occurrence of defective solder connection.

【0022】[0022]

【実施例2】図3は本発明の他の実施例の半田面実装装
置を示す部分断面図である。
[Embodiment 2] FIG. 3 is a partial sectional view showing a solder surface mounting apparatus according to another embodiment of the present invention.

【0023】本実施例では、半田接続不良防止手段であ
る弾性体5が半田付けを実施するヒータ2側に設けられ
たことを特徴としている。
The present embodiment is characterized in that the elastic body 5, which is means for preventing defective solder connection, is provided on the heater 2 side for soldering.

【0024】まず、半導体装置1を支持するステージ4
側としては、装置の土台となり金属で作られた装置架台
6と、前記装置架台6同様に金属で作られ実装基板3を
取り付けるステージ4により構成されている。
First, the stage 4 supporting the semiconductor device 1
The side is composed of a device base 6 which is made of metal and serves as a base of the device, and a stage 4 which is made of metal like the device base 6 and to which the mounting substrate 3 is attached.

【0025】また、半田付けを実施するヒータ2側に
は、ヒータ2とヒータ台7の間にシリコーンゴム等で形
成された弾性体5(半田接続不良防止手段)が接着剤等
により結合されて介設されている。
On the side of the heater 2 for soldering, an elastic body 5 (solder connection failure prevention means) made of silicone rubber or the like is bonded between the heater 2 and the heater base 7 with an adhesive or the like. It is installed.

【0026】本実施例2においても、前記実施例1で述
べたのと同様に、ヒータ2を下降させて半導体装置1の
アウターリード1aを加圧する際に、ステージ4とヒー
タ2との平行度がずれた状態で加圧すると、弾性体5が
変形し、ヒータ2はステージ4と平行度を保つように変
位し、半導体装置1の四辺に延びたアウターリード1a
が全て均等に加圧されるため、半田接続不良の発生を防
止することが可能となる。
In the second embodiment, as in the first embodiment, when the heater 2 is lowered to pressurize the outer leads 1a of the semiconductor device 1, the parallelism between the stage 4 and the heater 2 is increased. When pressure is applied in a state of deviation, the elastic body 5 is deformed, the heater 2 is displaced so as to maintain parallelism with the stage 4, and the outer leads 1a extending to the four sides of the semiconductor device 1 are deformed.
Is uniformly applied, it is possible to prevent the occurrence of defective solder connection.

【0027】以上、本発明者によってなされた発明を実
施例に基づき具体的に説明したが、本発明は上記実施例
に限定されるものではなく、その要旨を逸脱しない範囲
で種々変更可能であることは言うまでもない。
Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

【0028】例えば、半田接続不良防止手段としては、
前記した弾性体以外の手段を用いてもよい。
For example, as means for preventing defective solder connection,
Means other than the elastic body described above may be used.

【0029】[0029]

【発明の効果】本願において開示される発明のうち、代
表的なものによって得られる効果を簡単に説明すれば、
下記のとおりである。
The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

【0030】すなわち、ステージとヒータとの平行度に
ずれが発生した場合でも、ステージ側またはヒータ側の
少なくともどちらか一方に半田接続不良防止手段を設け
ることによって、半導体装置を実装基板に半田付けする
際の半田接続不良を防止することが可能となる。
That is, even if the parallelism between the stage and the heater is deviated, the semiconductor device is soldered to the mounting substrate by providing the solder connection failure prevention means on at least one of the stage side and the heater side. It is possible to prevent defective solder connection.

【0031】また、装置点検や保守時の面倒な平行度の
調整を実施せずに済むため、作業性の向上も可能とな
る。
Further, since it is not necessary to carry out troublesome adjustment of the parallelism at the time of inspecting the apparatus and performing maintenance, it is possible to improve workability.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例である半田面実装装置を示す
正面図である。
FIG. 1 is a front view showing a solder surface mounting apparatus that is an embodiment of the present invention.

【図2】本発明の一実施例である半田面実装装置を示す
部分断面図である。
FIG. 2 is a partial cross-sectional view showing a solder surface mounting apparatus that is an embodiment of the present invention.

【図3】本発明の実施例2による半田面実装装置を示す
部分断面図である。
FIG. 3 is a partial cross-sectional view showing a solder surface mounting device according to a second embodiment of the present invention.

【図4】従来構造の半田面実装装置を示す部分断面図で
ある。
FIG. 4 is a partial cross-sectional view showing a solder surface mounting device having a conventional structure.

【符号の説明】[Explanation of symbols]

1 半導体装置 1a アウターリード 2 ヒータ 2a ヒータ素子 2b エアシリンダ 3 実装基板 4 ステージ 5 弾性体(半田接続不良防止手段) 6 装置架台 7 ヒータ台 1 Semiconductor Device 1a Outer Lead 2 Heater 2a Heater Element 2b Air Cylinder 3 Mounting Board 4 Stage 5 Elastic Body (Solder Connection Failure Prevention Means) 6 Device Stand 7 Heater Stand

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 フラットタイプの半導体装置のアウター
リードと実装基板を部分加熱法により半田付けを行う装
置であって、半導体装置を支持するステージと加熱及び
加圧を行うためのヒータとの平行度のずれによる半田接
続不良を防止する手段を設けることを特徴とする半田面
実装装置。
1. An apparatus for soldering an outer lead of a flat type semiconductor device and a mounting substrate by a partial heating method, the parallelism between a stage supporting the semiconductor device and a heater for heating and pressurizing. A solder surface mounting device, characterized in that means for preventing a solder connection failure due to misalignment is provided.
【請求項2】 前記ヒータの平行度のずれに追従して該
ヒータとの平行度を保つように前記ステージが変位する
ことを特徴とする請求項1記載の半田面実装装置。
2. The solder surface mounting device according to claim 1, wherein the stage is displaced so as to follow the deviation of the parallelism of the heater and maintain the parallelism with the heater.
【請求項3】 前記ステージの平行度のずれに追従して
該ステージとの平行度を保つように前記ヒータが変位す
ることを特徴とする請求項1記載の半田面実装装置。
3. The solder surface mounting apparatus according to claim 1, wherein the heater is displaced so as to keep the parallelism with the stage by following the deviation of the parallelism of the stage.
【請求項4】 前記半田接続不良防止手段は、前記ステ
ージ側に介設された弾性体であることを特徴とする請求
項1記載の半田面実装装置。
4. The solder surface mounting device according to claim 1, wherein the solder connection failure prevention means is an elastic body provided on the stage side.
【請求項5】 前記半田接続不良防止手段は、前記ヒー
タ側に介設された弾性体であることを特徴とする請求項
1記載の半田面実装装置。
5. The solder surface mounting device according to claim 1, wherein the solder connection failure prevention means is an elastic body provided on the heater side.
JP24538092A 1992-09-16 1992-09-16 Solder surface mount equipment Pending JPH0697643A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24538092A JPH0697643A (en) 1992-09-16 1992-09-16 Solder surface mount equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24538092A JPH0697643A (en) 1992-09-16 1992-09-16 Solder surface mount equipment

Publications (1)

Publication Number Publication Date
JPH0697643A true JPH0697643A (en) 1994-04-08

Family

ID=17132802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24538092A Pending JPH0697643A (en) 1992-09-16 1992-09-16 Solder surface mount equipment

Country Status (1)

Country Link
JP (1) JPH0697643A (en)

Similar Documents

Publication Publication Date Title
KR101253794B1 (en) Electric component mounting apparatus
TW201705323A (en) Mounting device and mounting method
EP3657539A1 (en) Method and device for simultaneously bonding multiple chips of different heights on a flexible substrate using anisotropic conductive film or paste
JP3895703B2 (en) Printed circuit board connection device
KR20030012808A (en) Method for fabricating semiconductor-mounting body and apparatus for fabricating semiconductor-mounting body
US4638937A (en) Beam lead bonding apparatus
JP3896017B2 (en) Semiconductor mounting body manufacturing method and semiconductor mounting body manufacturing apparatus
US4876221A (en) Bonding method
JP3028740B2 (en) Light beam soldering method
WO2021177409A1 (en) Element array pressurizing device, manufacturing device, and manufacturing method
US6285553B1 (en) Mounting structure for an LSI
JPH0697643A (en) Solder surface mount equipment
JP2001345355A (en) Support frame adhering apparatus
JPH08293525A (en) Junction method of board with lead
JPH10173007A (en) Bare chip-mounting apparatus
JP4619209B2 (en) Semiconductor element mounting method and semiconductor element mounting apparatus
JP3608226B2 (en) Semiconductor chip mounting method and semiconductor device
JPH04171949A (en) Semiconductor device manufacturing method and semiconductor device manufacturing device
JPH06244545A (en) Component mounting tool
JP2002313843A (en) Connection device
JP2021141158A (en) Device array pressurizer, manufacturing device and manufacturing method
JP2021163774A (en) Crimping head, mounting device, and mounting method using this
JP2021141160A (en) Pressure device, manufacturing apparatus and manufacturing method for device array
JP2001146357A (en) Tape sticking method for sticking tape to semiconductor base board and device therefor
JP2001189553A (en) Bonding device for substrate and method for bonding substrate using the same