JPH0692388A - Electronic part assembly - Google Patents
Electronic part assemblyInfo
- Publication number
- JPH0692388A JPH0692388A JP4235900A JP23590092A JPH0692388A JP H0692388 A JPH0692388 A JP H0692388A JP 4235900 A JP4235900 A JP 4235900A JP 23590092 A JP23590092 A JP 23590092A JP H0692388 A JPH0692388 A JP H0692388A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- tape
- strip
- carrier tape
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体チップの供給、特
にダイスボンダ，タブ(ＴＡＢ)インナー・リード・ボン
ダ，フリップ・チップ・ボンダ等への供給と、表裏整列
のある電子部品の実装機への供給に適した電子部品集合
体に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the supply of semiconductor chips, especially to die bonders, tab (TAB) inner lead bonders, flip chip bonders, etc. The present invention relates to an electronic component assembly suitable for supply.
【０００２】[0002]
【従来の技術】近年、ダイスボンダ，ＴＡＢインナー・
リード・ボンダ，フリップ・チップ・ボンダ等への半導
体チップの供給方法あるいは、電子部品の実装機の表裏
整列のある電子部品の供給方法は、テープ等の帯状長尺
部材に半導体チップ等の電子部品を等間隔に載置し、連
続安定供給をねらった電子部品集合体による方法が主流
である。2. Description of the Related Art In recent years, die bonders and TAB inner
The method of supplying the semiconductor chip to the lead bonder, flip chip bonder, etc., or the method of supplying the electronic part having the front and back alignment of the mounter of the electronic part is described in the following. The mainstream method is a method of mounting electronic components at equal intervals and using an electronic component assembly aiming at continuous stable supply.
【０００３】以下図面を参照しながら、上述した従来の
電子部品集合体の一例について説明する。An example of the above-mentioned conventional electronic component assembly will be described below with reference to the drawings.
【０００４】図５は従来の電子部品集合体の外観斜視図
を示すものである。図５において、第１の帯状長尺部材
１(以下、キャリアテープという)には電子部品２を案内
収納できる収納穴３が等間隔に多数個配されており、か
つキャリアテープ１の収納穴３を被覆するように両側に
は第２の帯状長尺部材４(以下、ボトムテープという)お
よび同じく第２の帯状長尺部材５(以下、トップテープ
という)がキャリアテープ１を挾み込み熱圧着あるいは
接着剤または機械的結合により固定している。FIG. 5 is an external perspective view of a conventional electronic component assembly. In FIG. 5, a first strip-shaped long member 1 (hereinafter, referred to as a carrier tape) is provided with a large number of storage holes 3 for guiding and storing electronic components 2 at equal intervals, and the storage holes 3 of the carrier tape 1 are arranged. A second strip-shaped long member 4 (hereinafter referred to as a bottom tape) and a second strip-shaped long member 5 (hereinafter referred to as a top tape) on both sides so as to cover the carrier tape 1 are sandwiched by thermocompression bonding. Alternatively, they are fixed by an adhesive or a mechanical bond.
【０００５】図６は上記図５のＡ−Ａ断面図を示し、図
６に示すように、ボトムテープ４はキャリアテープ１の
底面の全体に固定されているが、トップテープ５はテー
プの両端部５ａおよび５ｂの部分でのみ固定されてい
る。FIG. 6 is a sectional view taken along the line AA of FIG. 5, and as shown in FIG. 6, the bottom tape 4 is fixed to the entire bottom surface of the carrier tape 1, but the top tape 5 is at both ends of the tape. It is fixed only at the portions 5a and 5b.
【０００６】電子部品２は上記収納穴３に１個ずつ案内
収納される状態にて、キャリアテープ１とトップテープ
５，ボトムテープ４に沿って等間隔に載置されている。The electronic components 2 are placed at equal intervals along the carrier tape 1, the top tape 5 and the bottom tape 4 while being guided and stored one by one in the storage holes 3.
【０００７】またキャリアテープ１には、電子部品２の
載置に対応して送り穴６が設けられている。Further, the carrier tape 1 is provided with feed holes 6 corresponding to the mounting of the electronic components 2.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら上記のよ
うな構成では、表裏のある電子部品の場合、図５のＢ−
Ｂ断面図を示す図７のように、電子部品２はトップテー
プ５を剥がして一方向Ｃから電子部品２の表２Ａ側から
のみしか取出すことができない。However, in the above-mentioned configuration, in the case of an electronic component having a front surface and a back surface, B- in FIG.
As shown in FIG. 7 showing the B sectional view, the electronic component 2 can be removed only from the front side 2A side of the electronic component 2 from the one direction C by peeling off the top tape 5.
【０００９】そのため、図７と同様の図５のＢ−Ｂ断面
図を示す図８のように、電子部品２の裏側２Ｂから逆方
向Ｄに取出す場合、電子部品集合体であるテーピング品
を製造するテーピング機の供給部を大幅に改造しなけれ
ばならないという問題点を有していた。Therefore, when the electronic component 2 is taken out in the reverse direction D from the back side 2B of the electronic component 2 as shown in FIG. 8 which is a sectional view taken along line BB of FIG. However, there is a problem that the supply part of the taping machine must be remodeled significantly.
【００１０】また、ボトムテープ４を剥がして電子部品
２を取出そうとしても、ボトムテープ４は電子部品２の
裏側２Ｂに全面固定されているため接合強度が強く、ボ
トムテープ４が切れたり、ボトムテープの剥がし力にバ
ラツキがあるため、電子部品の供給に不具合を生じてい
た。Even if the bottom tape 4 is peeled off and the electronic component 2 is taken out, since the bottom tape 4 is entirely fixed to the back side 2B of the electronic component 2, the bonding strength is strong and the bottom tape 4 is broken or the bottom tape 4 is broken. Due to variations in the tape peeling force, there was a problem in the supply of electronic components.
【００１１】本発明は上記問題点に鑑み、表裏のある電
子部品を何れの方向からも安定して取出すことができ、
そしてテーピング機の大幅な改造が不要な電子部品集合
体を提供することを目的とするものである。In view of the above problems, the present invention can stably take out electronic components having front and back sides from any direction,
The object of the present invention is to provide an electronic component assembly which does not require major modification of the taping machine.
【００１２】[0012]
【課題を解決するための手段】上記問題を解決するため
に、本発明の電子部品集合体は、多数個の電子部品の収
納穴を等間隔に有する第１の帯状長尺部材(キャリアテ
ープ)と、このキャリアテープの内側にあって前記収納
穴の開口部を被覆するため、第２の帯状長尺部材(ボト
ムテープとトップテープ)の両端の部分のみを固定し、
前記収納穴に電子部品を載置したものである。In order to solve the above problems, an electronic component assembly according to the present invention is a first strip-shaped long member (carrier tape) having storage holes for a large number of electronic components at equal intervals. And, in order to cover the opening of the storage hole inside the carrier tape, only the end portions of the second strip-shaped long member (bottom tape and top tape) are fixed,
An electronic component is placed in the storage hole.
【００１３】[0013]
【作用】本発明によれば、第２の帯状長尺部材のトップ
テープとボトムテープの両端の部分のみを第１の帯状長
尺部材のキャリアテープに固定して、表裏のある電子部
品を載置した電子部品集合体であるので、前記トップテ
ープあるいはボトムテープの何れを剥がしても電子部品
が安定して供給され、何れの方向からでも電子部品を取
出せる。According to the present invention, only the both end portions of the top tape and the bottom tape of the second strip-shaped long member are fixed to the carrier tape of the first strip-shaped long member to mount electronic components having front and back sides. Since the electronic component assembly is placed, the electronic component can be stably supplied regardless of whether the top tape or the bottom tape is peeled off, and the electronic component can be taken out from any direction.
【００１４】[0014]
【実施例】以下、本発明の一実施例の電子部品集合体に
ついて図面を参照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component assembly according to an embodiment of the present invention will be described below with reference to the drawings.
【００１５】図１は本発明の一実施例における電子部品
集合体の外観斜視図を示し、図２は図１のＡ−Ａ断面図
を示し、前記図５等の各構成部材等と同じ部分には同一
符号で示す。FIG. 1 is an external perspective view of an electronic component assembly according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line AA of FIG. Are denoted by the same reference numerals.
【００１６】図１および図２に示すように、第１の帯状
長尺部材(キャリアテープ)１の収納穴３に電子部品２が
載置され、キャリアテープ１の片側に該キャリアテープ
の送り穴６を有する構成は従来例の図５等と同様であ
る。As shown in FIGS. 1 and 2, an electronic component 2 is placed in a storage hole 3 of a first strip-shaped long member (carrier tape) 1, and a carrier tape feed hole is provided on one side of the carrier tape 1. The configuration having 6 is similar to that of the conventional example shown in FIG.
【００１７】本実施例においては、第２の帯状長尺部材
(ボトムテープ４およびトップテープ５)の各両端部４
ａ，４ｂおよび５ａ，５ｂが図２の断面図から明らかな
ように前記キャリアテープ１に固定されている点に特徴
を有する。In this embodiment, the second strip-shaped elongated member is used.
Both ends 4 of (bottom tape 4 and top tape 5)
It is characterized in that a, 4b and 5a, 5b are fixed to the carrier tape 1 as is clear from the sectional view of FIG.
【００１８】次に図３および図４により、キャリアテー
プ１の収納穴３に載置されている電子部品２の取出しを
説明する。図３は電子部品２の表側２Ａを上方(矢印Ｃ
方向)に取出す場合の図１のＢ−Ｂ断面図である。すな
わち図１において、キャリアテープ１が電子部品２を載
置したピッチ寸法分を送ると共に、トップテープ５がピ
ッチ寸法分キャリアテープ１から剥がされる。そして、
電子部品２が図面には記載されていない電子部品２のク
ランプ機構によってクランプされ、電子部品２の表側２
Ａを上方にして次のボンディング動作に移る。Next, with reference to FIGS. 3 and 4, the removal of the electronic component 2 placed in the storage hole 3 of the carrier tape 1 will be described. FIG. 3 shows the front side 2A of the electronic component 2 facing upward (arrow C
2 is a sectional view taken along line BB in FIG. That is, in FIG. 1, the carrier tape 1 feeds the pitch dimension on which the electronic component 2 is placed, and the top tape 5 is peeled from the carrier tape 1 by the pitch dimension. And
The electronic component 2 is clamped by a clamp mechanism of the electronic component 2 not shown in the drawing, and the front side 2 of the electronic component 2 is clamped.
With A set to the upper side, the next bonding operation starts.
【００１９】図４は電子部品２の裏側２Ｂを上方(矢印
Ｄ方向)にして取出そうとしている場合の図１のＢ−Ｂ
断面図である。FIG. 4 is a sectional view taken along the line BB of FIG. 1 when the back side 2B of the electronic component 2 is to be taken out with the upper side (direction of arrow D) being taken out.
FIG.
【００２０】上述の図３と同様の方法で、電子部品２の
裏側２Ｂを上方にして次のポンディング動作に移ること
ができる。In the same manner as in FIG. 3 described above, the back side 2B of the electronic component 2 can be moved upward and the next bonding operation can be started.
【００２１】上記図３および図４は、トップテープ５を
キャリアテープ１から剥がす場合を示しているが、ボト
ムテープ４を剥がすことで、前記図３，図４の取出し方
向Ｃ，Ｄと反対方向に電子部品２を容易に安定して取出
すことができる。3 and 4 show the case where the top tape 5 is peeled from the carrier tape 1, but by peeling the bottom tape 4, the direction opposite to the take-out directions C and D shown in FIGS. Moreover, the electronic component 2 can be easily and stably taken out.
【００２２】以上のように、本実施例によれば、ボトム
テープ４とトップテープ５をキャリアテープ１に各両端
部４ａ，４ｂおよび５ａ，５ｂのみにて固定することに
より、同一方法のテーピング品でも、電子部品２を表側
２Ａからでも裏側２Ｂからでも安定して供給することが
できる。As described above, according to the present embodiment, the bottom tape 4 and the top tape 5 are fixed to the carrier tape 1 only at both ends 4a, 4b and 5a, 5b, respectively, so that taping products of the same method can be obtained. However, the electronic component 2 can be stably supplied from the front side 2A or the back side 2B.
【００２３】また、以上のような電子部品集合体の形態
にすることにより、電子部品集合体を製造するテーピン
グ機において、電子部品の供給部を大幅に改造すること
なく、電子部品集合体を提供することができる。Further, by providing the electronic component assembly as described above, in a taping machine for manufacturing the electronic component assembly, the electronic component assembly can be provided without significantly modifying the electronic component supply section. can do.
【００２４】[0024]
【発明の効果】以上説明したように、本発明の電子部品
集合体は、多数個の収納穴を等間隔に有するキャリアテ
ープと、このキャリアテープの両側にあって前記収納穴
の開口部を被覆可能なトップテープとボトムテープの両
端部のみをキャリアテープに固定して、前記収納穴に電
子部品を載置した電子部品集合体にすることにより、表
裏のある電子部品の表側からでも、裏側からでも容易に
かつ安定して取出しクランプすることができる。As described above, the electronic component assembly of the present invention has a carrier tape having a large number of storage holes at equal intervals, and covers the openings of the storage holes on both sides of the carrier tape. By fixing only the both ends of the possible top tape and bottom tape to the carrier tape to form an electronic component assembly in which the electronic components are placed in the storage holes, even from the front side of the electronic components with the front and back sides, from the back side However, it can be easily and stably taken out and clamped.
【図１】本発明の一実施例における電子部品集合体の外
観斜視図である。FIG. 1 is an external perspective view of an electronic component assembly according to an embodiment of the present invention.
【図２】図１のＡ−Ａ断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図３】電子部品の表側を上方にした図１のＢ−Ｂ断面
図である。FIG. 3 is a sectional view taken along the line BB of FIG. 1 with the front side of the electronic component facing upward.
【図４】電子部品の裏側を上方にした図１のＢ−Ｂ断面
図である。FIG. 4 is a cross-sectional view taken along the line BB of FIG. 1 with the back side of the electronic component facing upward.
【図５】従来の電子部品集合体の外観斜視図である。FIG. 5 is an external perspective view of a conventional electronic component assembly.
【図６】図５のＡ−Ａ断面図である。6 is a cross-sectional view taken along the line AA of FIG.
【図７】従来の片方向から取出そうとしている図５のＢ
−Ｂ断面図である。FIG. 7B of FIG. 5 which is about to be taken out from the conventional one direction.
It is a -B sectional view.
【図８】従来の逆方向から取出そうとしている図５のＢ
−Ｂ断面図である。FIG. 8B of FIG. 5 which is about to be taken out from the conventional reverse direction.
It is a -B sectional view.
１…第１の帯状長尺部材(キャリアテープ)、 ２…電子
部品、 ３…収納穴、４…第２の帯状長尺部材(ボトム
テープ)、 ４ａ，４ｂ…ボトムテープの端部、５…第
２の帯状長尺部材(トップテープ)、 ５ａ，５ｂ…トッ
プテープの端部、 ６…送り穴。DESCRIPTION OF SYMBOLS 1 ... 1st strip | belt-shaped elongate member (carrier tape), 2 ... Electronic component, 3 ... Storage hole, 4 ... 2nd strip | belt-shaped elongate member (bottom tape), 4a, 4b ... End part of bottom tape, 5 ... 2nd strip | belt-shaped elongate member (top tape), 5a, 5b ... edge part of top tape, 6 ... feed hole.
Claims (3)
する第１の帯状長尺部材と、この第１の帯状長尺部材の
両側にあって前記収納穴の開口部を被覆可能な第２の帯
状長尺部材とからなり、前記第２の帯状長尺部材の両端
の部分のみを前記第１の帯状長尺部材に固定し、前記収
納穴に電子部品を載置したことを特徴とする電子部品集
合体。1. A first strip-shaped elongated member having storage holes for a large number of electronic components at equal intervals, and an opening of the storage hole can be covered on both sides of the first strip-shaped elongated member. A second strip-shaped elongated member, wherein only both end portions of the second strip-shaped elongated member are fixed to the first strip-shaped elongated member, and an electronic component is placed in the storage hole. An electronic component assembly.
に機械送り可能な送り案内穴を設けてなることを特徴と
する請求項１記載の電子部品集合体。2. The electronic component assembly according to claim 1, wherein one of the first strip-shaped elongated members is provided with a feed guide hole capable of being machine-fed.
尺部材とを接着材料にて固定してなることを特徴とする
請求項１記載の電子部品集合体。3. The electronic component assembly according to claim 1, wherein the first strip-shaped long member and the second strip-shaped long member are fixed with an adhesive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4235900A JPH0692388A (en) | 1992-09-03 | 1992-09-03 | Electronic part assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4235900A JPH0692388A (en) | 1992-09-03 | 1992-09-03 | Electronic part assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0692388A true JPH0692388A (en) | 1994-04-05 |
Family
ID=16992903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4235900A Pending JPH0692388A (en) | 1992-09-03 | 1992-09-03 | Electronic part assembly |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0692388A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004260195A (en) * | 1998-08-14 | 2004-09-16 | Lucent Technol Inc | Chip carrier tape and operation unit of ic chip using the chip carrier tape |
| JP2005234576A (en) * | 2004-02-17 | 2005-09-02 | Clearlab Internatl Pte Ltd | Package for disposable soft contact lens |
| US8061897B2 (en) | 2005-02-14 | 2011-11-22 | Menicon Singapore Pte Ltd. | Package |
| JP2013184827A (en) * | 2012-03-08 | 2013-09-19 | Gratzer Technologies Gmbh & Co Kg | Arrangement constitution for applying decorative rigid body to substrate, its use method and its manufacturing method |
| US10865028B2 (en) | 2005-02-14 | 2020-12-15 | Mentcon Singapore Pte Ltd. | Heat sealable, retortable laminated foil |
-
1992
- 1992-09-03 JP JP4235900A patent/JPH0692388A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004260195A (en) * | 1998-08-14 | 2004-09-16 | Lucent Technol Inc | Chip carrier tape and operation unit of ic chip using the chip carrier tape |
| US9615639B2 (en) | 2002-08-17 | 2017-04-11 | Menicon Singapore Pte Ltd. | Packaging for disposable soft contact lenses |
| US10786057B2 (en) | 2002-08-17 | 2020-09-29 | Menicon Singapore Pte Ltd. | Packaging for disposable soft contact lenses |
| JP2005234576A (en) * | 2004-02-17 | 2005-09-02 | Clearlab Internatl Pte Ltd | Package for disposable soft contact lens |
| JP2009214944A (en) * | 2004-02-17 | 2009-09-24 | Menicon Singapore Pte Ltd | Package |
| US8061897B2 (en) | 2005-02-14 | 2011-11-22 | Menicon Singapore Pte Ltd. | Package |
| US10865028B2 (en) | 2005-02-14 | 2020-12-15 | Mentcon Singapore Pte Ltd. | Heat sealable, retortable laminated foil |
| JP2013184827A (en) * | 2012-03-08 | 2013-09-19 | Gratzer Technologies Gmbh & Co Kg | Arrangement constitution for applying decorative rigid body to substrate, its use method and its manufacturing method |
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