JPH067256U - Electronic parts - Google Patents

Abstract

(57) [Abstract] [Purpose] In an electronic component having a heat dissipation terminal, a solder bridge is prevented from occurring between the heat dissipation terminal and the lead terminal during solder dipping. [Structure] In order to reduce the amount of molten solder adhering to the heat dissipation terminal portion 12, for example, a slit 13 or the like is provided in the heat dissipation terminal portion 12. When the printed circuit board separates from the molten solder layer during the solder dipping of the printed circuit board, the amount of solder adhered to the heat dissipation terminal portion 12 decreases due to the presence of the slit 13. Therefore, since the solder attached to the heat dissipation terminal portion 12 is easily separated from the molten solder layer, the amount of solder flowing to the rear lead terminal 11 is reduced, and a solder bridge is generated between the heat dissipation terminal portion 12 and the lead terminal 11. It is possible to prevent this.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electronic component such as an IC having a heat dissipation terminal portion near a lead terminal and having the lead terminal and the heat dissipation terminal portion soldered to a substrate by a dip method.

[0002]

[Prior art]

 There is a dip method as a method for soldering electronic components to a printed circuit board. As is well known, this dip method involves mounting a plurality of electronic components on one or both sides of a printed circuit board, transporting the printed circuit board in a substantially horizontal state in this state, and immersing the one side in the surface of the molten metal , The lead terminals of electronic components are soldered to the conductive patterns on the printed circuit board. According to this method, a large number of electronic components mounted on the printed circuit board can be soldered at one time, which saves time and costs.

[0003]

[Problems to be solved by the device]

 In the above-mentioned dip method, the printed circuit board is transported almost horizontally and one surface of the printed circuit board is immersed in the surface of the molten solder layer.Therefore, when the printed circuit board separates from the solder layer, the lead terminals of the electronic components mounted on the printed circuit board are removed. Solder that adheres to the solder will separate from the molten solder layer. At this time, in some cases, the rear end of the adhered solder may flow and adhere to the rear lead terminal, which may cause a so-called solder bridge. This solder bridge is more likely to occur as the lead terminal spacing (pitch) is narrower.

By the way, as shown in FIG. 6, a heat dissipation terminal portion 12 is provided in an electronic component that generates a large amount of heat when a completed printed circuit board is incorporated into an apparatus for use.

Since the heat dissipation terminal portion 12 is generally provided in the center of the main body of the electronic component 1, it is arranged between the lead terminals 11. When a printed circuit board on which such an electronic component 1 is mounted is soldered by the dip method, a large amount of solder adheres to the heat dissipation terminal portion 12 having a large area, and when this is separated from the molten solder layer, the printed circuit board In many cases, it flows backward and adheres to the rear lead terminal 11 with respect to the transport direction, which often causes a solder bridge. If such a solder bridge occurs, the heat radiating terminal portion 12 and the lead terminal 11 may be short-circuited, and the electronic component 1 may be damaged in some cases.

[0006] Therefore, the present invention solves the above-mentioned problems, and an electronic component having a heat dissipation terminal portion, which can prevent the occurrence of a solder bridge at the time of solder dipping, is provided. It is provided.

[0007]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, in the present invention, an electronic component is provided which has a heat-radiating terminal in the vicinity of the lead terminal and the lead terminal and the heat-radiating terminal are soldered to a printed circuit board by a dip method. When separating from the molten solder layer, means for reducing the amount of molten solder that adheres to the heat dissipation terminal is provided in the heat dissipation terminal to prevent the solder bridge between the heat dissipation terminal and the lead terminal. It is what

[0008]

[Action]

 In the electronic component 1 shown in FIGS. 1 to 5, a cutout portion is provided in a part of the heat dissipation terminal portion 12. That is, when the printed circuit board is separated from the molten solder layer during solder dipping of the printed circuit board, the heat radiation terminal portion 12 has a cutout portion, so that the amount of solder adhered to the heat radiation terminal portion 12 is reduced by the presence of the cutout portion. To do. Therefore, the solder attached to the heat radiating terminal portion 12 is easily separated from the molten solder layer, the amount of solder flowing to the rear lead terminals is reduced, and a solder bridge is generated between the heat radiating terminal portion and the lead terminals. It is possible to prevent this.

[0009]

【Example】

 Next, an embodiment of the electronic component according to the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a first embodiment of an electronic component according to the present invention. In this electronic component 1, a heat dissipation terminal portion 12 is provided between lead terminals 11. The heat dissipation terminal portion 12 is provided with a large number of slits 13 extending substantially at right angles to the main body of the electronic component 1.

In this electronic component 1, since the slit 13 is provided in the heat dissipation terminal portion 12 when the printed board is separated from the molten solder layer during the solder dipping of the printed circuit board, the solder adhesion to the heat dissipation terminal portion 12 is prevented. The quantity is reduced by the presence of the slit 13. Therefore, since the solder attached to the heat dissipation terminal portion 12 is easily separated from the molten solder layer, the amount of solder flowing to the rear lead terminal 11 is reduced, and the space between the heat dissipation terminal portion 12 and the lead terminal 11 is reduced. It is possible to prevent the generation of solder bridges.

FIG. 2 shows a second embodiment. On the surface side of the heat dissipation terminal portion 12 of the electronic component 1, a recess 14 having a size that covers the entire heat dissipation terminal portion 12 is provided. FIG. 3 shows a third embodiment. The heat radiating terminal portion 12 of the electronic component 1 is provided with a comb blade portion 15. FIG. 4 shows a fourth embodiment. As in the case of FIG. 3, the heat dissipation terminal portion 12 of the electronic component 1 is provided with the comb-shaped portion 16 at an appropriate angle (θ) with respect to the body of the electronic component 1. FIG. 5 shows a fifth embodiment. A large number of holes 17 are provided on the surface side of the heat dissipation terminal portion 12 of the electronic component 1.

In the other embodiments shown in FIG. 2 to FIG. 5 as well, as in the first embodiment shown in FIG. 1 described above, since the heat dissipation terminal portion 12 is provided with the notches such as the recesses 14, When the printed circuit board separates from the molten solder layer during solder dipping of the printed board, the amount of solder adhered to the heat dissipation terminal portion 12 decreases due to the presence of the notch. Therefore, since the solder adhered to the heat dissipation terminal portion 12 is easily separated from the molten solder layer, the amount of solder flowing to the rear lead terminal 11 is reduced, and the solder bridge between the heat dissipation terminal portion 12 and the lead terminal 11 is reduced. It is possible to prevent the occurrence of.

It should be noted that the present invention is not limited to the above-described embodiment, and in short, it is sufficient to provide a means for reducing the amount of molten solder adhering to the heat radiating terminal portion on the heat radiating terminal portion.

[0015]

[Effect of device]

 As described above, the present invention is provided with a means for reducing the amount of molten solder attached to the heat radiating terminal portion in the heat radiating terminal portion. Therefore, according to the present invention, it is possible to prevent a solder bridge generated between the heat dissipation terminal portion and the lead terminal.

[Brief description of drawings]

FIG. 1 is an explanatory diagram illustrating a first embodiment of an electronic component according to the present invention.

FIG. 2 is an explanatory view illustrating a second embodiment of the electronic component according to the present invention.

FIG. 3 is an explanatory view illustrating a third embodiment of the electronic component according to the present invention.

FIG. 4 is an explanatory view illustrating a fourth embodiment of the electronic component according to the present invention.

FIG. 5 is an explanatory view illustrating a fifth embodiment of the electronic component according to the present invention.

FIG. 6 is an explanatory diagram illustrating a conventional electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 11 Lead terminal 12 Heat dissipation terminal portion 13 Slit 14 Recessed portion 15, 16 Comb edge portion 17 Hole

Claims (2)

[Scope of utility model registration request] 1. A heat dissipation terminal portion is provided in the vicinity of the lead terminal,
In an electronic component in which the lead terminal and the heat radiating terminal portion are soldered to a printed circuit board by a dip method, when the electronic component is separated from the molten solder layer, a means for reducing the amount of molten solder attached to the heat radiating terminal portion is provided. An electronic component, characterized in that it is provided on a heat dissipation terminal part to prevent a solder bridge generated between the heat dissipation terminal part and the lead terminal. 2. The electronic component according to claim 1, wherein a cutout portion is provided in the heat radiation terminal portion as a means for reducing the amount of molten solder attached to the heat radiation terminal portion.