JPH0661642A - Jointing method for flexible resin board - Google Patents
Jointing method for flexible resin boardInfo
- Publication number
- JPH0661642A JPH0661642A JP4214005A JP21400592A JPH0661642A JP H0661642 A JPH0661642 A JP H0661642A JP 4214005 A JP4214005 A JP 4214005A JP 21400592 A JP21400592 A JP 21400592A JP H0661642 A JPH0661642 A JP H0661642A
- Authority
- JP
- Japan
- Prior art keywords
- flexible resin
- wiring pattern
- resin substrate
- circuit board
- adhesive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、配線パターンが形成さ
れた可撓性樹脂基板の接続方法に関する。さらに詳しく
は、液晶表示装置(LCD)やエレクトロルミネッセン
ス(EL)、プラズマディスプレイなど平面型表示装置
の基板の配線パターンと回路基板の配線パターンとを電
気的接続する可撓性樹脂基板の接続方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting a flexible resin substrate on which a wiring pattern is formed. More specifically, the present invention relates to a flexible resin substrate connection method for electrically connecting a wiring pattern of a substrate of a flat-panel display device such as a liquid crystal display device (LCD), electroluminescence (EL), or plasma display to a wiring pattern of a circuit board. .
【0002】[0002]
【従来の技術】LCDなど平面型表示モジュールに形成
された配線パターンの各端子と駆動回路などが形成され
た回路基板の配線パターンの各端子とを電気的接続する
のに、途中で屈曲させたりできるようにするため、TA
B(Tape Automated Bonding)やFPC(Flexible printe
d circuit)などの配線パターンが印刷法や蒸着法などに
より形成された可撓性樹脂基板を仲介させて、その可撓
性樹脂基板の一端側を平面型表示モジュールに、他端側
を駆動回路素子などの形成された回路基板に接着し、各
配線が連結される構成になっている。2. Description of the Related Art In order to electrically connect each terminal of a wiring pattern formed on a flat display module such as an LCD to each terminal of a wiring pattern of a circuit board on which a driving circuit is formed, the terminals may be bent in the middle of the wiring. TA to be able to
B (Tape Automated Bonding) and FPC (Flexible printe)
A wiring pattern such as a d circuit) is mediated by a flexible resin substrate formed by a printing method or an evaporation method, and one end side of the flexible resin substrate is a flat display module and the other end side is a drive circuit. It is configured to be adhered to a circuit board on which elements and the like are formed and to connect each wiring.
【0003】この可撓性樹脂基板の従来の接着方法を図
2に基づいて説明する。図2において、厚さ25μmのポ
リイミド系樹脂などの可撓性樹脂基板11上に厚さ35μm
のCu膜からなる配線パターン12が形成された基板と、
やはり配線パターン14が形成された回路基板13とを位置
合わせして異方導電性接着フィルム(ACF)15を介在
させる(図2(a)参照)。ここで異方導電性接着フィ
ルムとは、エポキシ接着剤に粒径が5μmくらいの樹脂
ボールに金メッキが施された導電粒子を混在させた接着
フィルムで、圧接されると接着剤や導電粒子が空隙部に
押し出され、凹凸部のあるものも均一に接着されると共
に、凸部では導電粒子が圧接されることにより導電性を
有し、凹部では接着効果はあるが導電粒子間が接触せ
ず、横方向への導電性を有しないものである。A conventional bonding method for this flexible resin substrate will be described with reference to FIG. In FIG. 2, a thickness of 35 μm is formed on a flexible resin substrate 11 such as a polyimide resin having a thickness of 25 μm.
A substrate on which a wiring pattern 12 made of a Cu film is formed,
Again, the circuit board 13 on which the wiring pattern 14 is formed is aligned and the anisotropic conductive adhesive film (ACF) 15 is interposed (see FIG. 2A). Here, the anisotropic conductive adhesive film is an adhesive film in which conductive particles, which are gold-plated resin balls having a particle size of about 5 μm, are mixed in an epoxy adhesive, and the adhesive and the conductive particles are void when pressed. Extruded to the part, even with the uneven portion is evenly bonded, in the convex portion has conductive by pressure-contacting the conductive particles, the concave portion has an adhesive effect but the conductive particles do not contact, It does not have lateral conductivity.
【0004】つぎに、異方導電性接着フィルムを介在さ
せた2枚の基板を圧接し、温度150℃、圧力15〜20kgf
/cm2 で30〜40秒間加熱および加圧して、接着する(図
2(b)参照)。このときCu膜の凸状部上の異方導電
性接着フィルムは隣接する凸状部間の凹部に押しやられ
るため、該凹部は異方導電性接着フィルムでほとんど充
填され両基板間の寸法Cは両基板にそれぞれ形成された
配線パターンの厚さの和とほぼ等しくなる。Next, two substrates with an anisotropic conductive adhesive film interposed are pressure-welded to each other at a temperature of 150 ° C. and a pressure of 15 to 20 kgf.
Heat and pressurize at 30 cm / cm 2 for 30 to 40 seconds to bond (see FIG. 2 (b)). At this time, since the anisotropic conductive adhesive film on the convex portion of the Cu film is pushed to the concave portion between the adjacent convex portions, the concave portion is almost filled with the anisotropic conductive adhesive film, and the dimension C between both substrates is It is approximately equal to the sum of the thicknesses of the wiring patterns formed on both substrates.
【0005】[0005]
【発明が解決しようとする課題】前述の方法で可撓性樹
脂基板と平面表示型モジュールおよび回路基板とをそれ
ぞれ接続するには、異方導電性接着フィルムの厚さを変
更したものを準備しなければならない。すなわち、平面
表示型モジュールの配線パターンは通常光透過性などの
ためITO膜などで1μm以下と薄く形成されるが、回
路基板や可撓性樹脂基板の配線パターンはCu膜などで
35μm位の厚さに形成されている。そのため平面表示型
モジュール側での接着後の両基板間の寸法(図2(b)
のC)は35〜40μmであり、異方導電性接着フィルムの
厚さは20μm程度であるのに対し、回路基板側では、両
基板の配線パターンが共に35μm位の厚さがあるため、
異方導電性接着フィルムの厚さは35〜40μmの厚さであ
ることが必要だからである。In order to connect the flexible resin substrate to the flat display type module and the circuit board by the above-mentioned method, an anisotropic conductive adhesive film having a different thickness is prepared. There must be. That is, the wiring pattern of the flat-panel display type module is usually formed as thin as 1 μm or less with an ITO film or the like because of its light transmittance, but the wiring pattern of the circuit board or the flexible resin substrate is a Cu film or the like.
It is formed with a thickness of about 35 μm. Therefore, the dimensions between both substrates after bonding on the flat display module side (Fig. 2 (b))
C) is 35 to 40 μm, and the thickness of the anisotropic conductive adhesive film is about 20 μm, while on the circuit board side, the wiring patterns of both boards have a thickness of about 35 μm.
This is because the anisotropic conductive adhesive film needs to have a thickness of 35 to 40 μm.
【0006】さらに、両基板を圧着する際、凸部に存在
する導電粒子と接着剤は殆ど凹部の方に押しやられる
が、可撓性樹脂基板と回路基板との接着のように両側に
高い凸状部が形成されている基板を圧接すると、一時的
に凸部に大きな圧力がかかり、とくに上下基板の配線パ
ターンの位置ずれがあると接触面積が小さくなり、一層
その部分の樹脂に大きな圧力がかかり、導電粒子がつぶ
される。導電粒子は前述のように樹脂ボールに金メッキ
などがされたもので、ボール状では圧接されることによ
り弾力性を有して両基板での接触を確実にするが、ボー
ルがつぶされると弾力性がなくなり両基板の配線パター
ン間の電気的接触が不充分になるという問題がある。Further, when the two substrates are pressure-bonded to each other, the conductive particles and the adhesive present in the convex portions are almost pushed to the concave portions, but the convex portions on both sides are highly convex like the flexible resin substrate and the circuit board are adhered. When the substrate on which the striped portion is formed is pressed, a large pressure is temporarily applied to the convex portion. Especially, if the wiring patterns of the upper and lower substrates are misaligned, the contact area becomes smaller, and the larger pressure is applied to the resin in that portion. As a result, the conductive particles are crushed. As described above, the conductive particles are resin balls plated with gold, etc., and when pressed in a ball shape, they have elasticity to ensure contact with both substrates, but when the balls are crushed they are elastic. There is a problem that the electrical contact between the wiring patterns of both substrates becomes insufficient.
【0007】本発明は叙上の問題を解決して、可撓性樹
脂基板の平面型表示モジュールと回路基板のどちら側の
接着でも同じ厚さの異方導電性接着フィルムで接着でき
るようにすると共に、少々の位置ずれが生じても両基板
の配線パターンを確実に接続できるような可撓性樹脂基
板の接続方法を提供することを目的とする。The present invention solves the above problem and enables the flexible resin substrate to be bonded on either side of the flat panel display module and the circuit substrate with an anisotropic conductive adhesive film having the same thickness. At the same time, it is an object of the present invention to provide a method for connecting a flexible resin substrate so that the wiring patterns of both substrates can be surely connected even if a slight displacement occurs.
【0008】[0008]
【課題を解決するための手段】本発明による可撓性樹脂
基板の接続方法は、平面型表示モジュールに設けられた
配線パターンと、駆動回路などが形成された回路基板に
設けられた配線パターンとを可撓性樹脂基板に設けられ
た配線パターンを介して接続する可撓性樹脂基板の接続
方法であって、前記可撓性樹脂基板または回路基板に設
けられた配線パターンのあいだの凹部に絶縁性樹脂を充
填し、ついで両基板間に異方導電性接着フィルムを介在
させて熱圧着させることを特徴としている。A method of connecting a flexible resin substrate according to the present invention comprises a wiring pattern provided on a flat display module and a wiring pattern provided on a circuit board on which a driving circuit and the like are formed. Is a method for connecting a flexible resin substrate through a wiring pattern provided on the flexible resin substrate, wherein insulation is provided in a concave portion between the wiring patterns provided on the flexible resin substrate or the circuit board. It is characterized in that it is filled with a conductive resin and then thermocompression bonded with an anisotropic conductive adhesive film interposed between both substrates.
【0009】[0009]
【作用】本発明の可撓性樹脂基板の接続方法によれば、
回路基板など凸部の高い配線パターンが形成された基板
と接着するばあいに、凸部のあいだの凹部にあらかじめ
樹脂を充填しているため、ガラス基板に薄いITO膜な
どが形成されたのと同様に凸部が殆どなくなる。そのた
め、位置合わせずれの有無にかかわらず配線パターンの
凸状部を均一に加圧できると共に1種類の厚さの異方導
電性接着フィルムにより可撓性樹脂基板と平面表示型モ
ジュールの基板または回路基板との接着をすることがで
きる。According to the flexible resin substrate connecting method of the present invention,
When bonding to a substrate such as a circuit board on which a wiring pattern with high protrusions is formed, the recesses between the protrusions are pre-filled with resin, so a thin ITO film etc. was formed on the glass substrate. Similarly, there are almost no protrusions. Therefore, the convex portion of the wiring pattern can be uniformly pressed regardless of the presence or absence of misalignment, and the flexible resin substrate and the substrate or circuit of the flat panel display type module can be formed by the anisotropic conductive adhesive film having one thickness. It can be bonded to a substrate.
【0010】[0010]
【実施例】つぎに添付図面に基づき本発明の可撓性樹脂
基板の接続方法を詳細に説明する。図1は本発明の可撓
性樹脂基板の接続方法の各工程を示す断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for connecting flexible resin substrates according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a sectional view showing each step of the method for connecting a flexible resin substrate of the present invention.
【0011】図1において、1は可撓性樹脂基板を示し
ており、たとえば厚さが約25μm位のポリイミド系樹脂
で一方の面にCu箔をラミネートし、これをエッチング
して配線パターン2が形成されている。In FIG. 1, reference numeral 1 denotes a flexible resin substrate. For example, a wiring pattern 2 is formed by laminating a Cu foil on one surface with a polyimide resin having a thickness of about 25 μm and etching the Cu foil. Has been formed.
【0012】この配線パターン2は厚さが約35μmに形
成されており、各配線パターン2のあいだには凹部3が
形成されている。この可撓性樹脂基板1に形成された配
線パターン2の一端側は液晶表示モジュールなど平面型
表示モジュールの配線パターンと接続され、他端側は回
路基板4の配線パターン5に接続されるもので、前述の
ように平面型表示モジュールの配線パターンの厚さは約
1μm位、回路基板4の配線パターン5の厚さは約35μ
m位に形成されている。図1では、この厚く形成された
配線パターン2、5同士を接続する部分の接続方法の工
程図を示している。The wiring pattern 2 is formed to have a thickness of about 35 μm, and a recess 3 is formed between the wiring patterns 2. One end side of the wiring pattern 2 formed on the flexible resin substrate 1 is connected to a wiring pattern of a flat display module such as a liquid crystal display module, and the other end side is connected to a wiring pattern 5 of the circuit board 4. As described above, the thickness of the wiring pattern of the flat display module is about 1 μm, and the thickness of the wiring pattern 5 of the circuit board 4 is about 35 μm.
It is formed in the m position. FIG. 1 shows a process diagram of a method of connecting the thickly formed wiring patterns 2 and 5 to each other.
【0013】まず、接続する2枚の基板1、4のうち1
枚の基板1の配線パターンのあいだの凹部3に絶縁性樹
脂6を充填し固化する(図1(a)(b)参照)。ここ
で絶縁性樹脂6は流動性を有し、放置したり、加熱した
り、紫外線照射などにより硬化し、絶縁性を有するもの
であればよく、たとえば硬化剤を混合することにより常
温で硬化するエポキシ樹脂、熱硬化性エポキシ樹脂や紫
外線硬化樹脂などが用いられる。また絶縁性樹脂6の塗
布量は配線パターンのあいだの凹部3に完全に充填でき
るように、配線パターン2の上面まで完全に覆って、あ
とから余分な樹脂を除去する(図1(b)参照)のが望
ましいが、凹部3を完全に充填できなくても本発明の目
的を達成できる。ついで、凹部3に充填した樹脂を硬化
させる。たとえば前述の熱硬化性のエポキシ樹脂を使用
したばあい、約150 ℃で30分間位の加熱処理をすること
により硬化し、配線パターン2間の凹部3が絶縁性樹脂
6で埋められる。First, one of the two substrates 1 and 4 to be connected is
Insulating resin 6 is filled in the recesses 3 between the wiring patterns of the substrates 1 and solidified (see FIGS. 1A and 1B). Here, the insulating resin 6 may be fluid as long as it has fluidity and is cured by being left standing, heated, or irradiated with ultraviolet rays, and has insulating properties. For example, it is cured at room temperature by mixing a curing agent. Epoxy resin, thermosetting epoxy resin, ultraviolet curing resin, etc. are used. Further, the amount of the insulating resin 6 applied is such that the upper surface of the wiring pattern 2 is completely covered so that the recesses 3 between the wiring patterns can be completely filled, and excess resin is removed later (see FIG. 1B). Although it is preferable that the object of the present invention is achieved, even if the concave portion 3 cannot be completely filled. Then, the resin filled in the recess 3 is cured. For example, when the above-mentioned thermosetting epoxy resin is used, it is cured by heat treatment at about 150 ° C. for about 30 minutes, and the recess 3 between the wiring patterns 2 is filled with the insulating resin 6.
【0014】つぎに、両基板のあいだに異方導電性接着
フィルム7を介在させ熱圧着する(図1(c)(d)参
照)。具体的には両基板1、4の配線パターン2、5の
位置合わせをし、厚さが約20μmの異方導電性接着フィ
ルムを介在させて重ね合わせ、温度を150 〜170 ℃に昇
温すると共に圧力を15〜20kgf /cm2 印加し30〜40秒間
この状態を保持し、圧着する。このばあい両基板1、4
に形成された配線パターン2、5の厚さは共に約35μm
位あり、両基板1、4の接着後の間隔は約70μmにな
る。しかし一方の基板1の配線パターンのあいだの凹部
3は絶縁性樹脂6が充填されているため、異方導電性接
着フィルム7は他方の基板4の凹部に流れ込むだけであ
るため、異方導電性接着フィルム7の厚さも薄いもので
よい。その結果配線パターンの膜厚が薄い平面型表示モ
ジュールと可撓性樹脂基板とを接着するばあい(両基板
間の間隔35〜40μm)と殆ど同じ条件になり、同じ厚さ
の異方導電性接着フィルムを使用することができる。Next, an anisotropic conductive adhesive film 7 is interposed between both substrates and thermocompression bonding is performed (see FIGS. 1C and 1D). Specifically, the wiring patterns 2 and 5 of both substrates 1 and 4 are aligned, and they are stacked with an anisotropic conductive adhesive film having a thickness of about 20 μm interposed therebetween, and the temperature is raised to 150 to 170 ° C. At the same time, apply a pressure of 15 to 20 kgf / cm 2 and maintain this state for 30 to 40 seconds, and then crimp. In this case, both boards 1, 4
The thickness of the wiring patterns 2 and 5 formed on the
The distance between the substrates 1 and 4 after bonding is about 70 μm. However, since the concave portions 3 between the wiring patterns of the one substrate 1 are filled with the insulating resin 6, the anisotropic conductive adhesive film 7 only flows into the concave portions of the other substrate 4, and therefore the anisotropic conductivity The thickness of the adhesive film 7 may be thin. As a result, when the flat display module having a thin wiring pattern and the flexible resin substrate are bonded (the distance between the substrates is 35 to 40 μm), the conditions are almost the same, and the anisotropic conductivity is the same. Adhesive films can be used.
【0015】なお、前述の実施例では可撓性樹脂基板側
の凹部への樹脂充填の例で説明したが、反対側の基板
(たとえば、回路基板)側の凹部を樹脂などで充填して
同様の方法により形成しても同じである。また、FPC
やTABなどの可撓性樹脂基板同士を接着することもで
きる。In the above-mentioned embodiment, the resin is filled in the concave portion on the flexible resin substrate side, but the same procedure is performed by filling the concave portion on the opposite substrate (eg, circuit board) side with resin or the like. It is the same even if formed by the method of. Also, FPC
Flexible resin substrates such as TAB and TAB can be adhered to each other.
【0016】[0016]
【発明の効果】以上説明したとおり、本発明の可撓性樹
脂基板の接続方法によれば、2枚の基板のあいだに位置
ずれがあっても、配線パターンの一部に過大な圧力が加
わることがなく、導電粒子がつぶれて導電不良になるこ
とがない。また、可撓性樹脂基板と回路基板との接続で
あれ、可撓性樹脂基板とガラスパネルとの接続であれ、
同一厚さの異方導電性接着フィルムを介在させて接続で
きるので、可撓性樹脂基板の両側で平面型表示パネルと
回路基板とを接着するばあいも異方導電性接着フィルム
を切り替える必要がない。As described above, according to the flexible resin substrate connecting method of the present invention, an excessive pressure is applied to a part of the wiring pattern even if the two substrates are misaligned. In addition, the conductive particles are not crushed to cause poor conductivity. Further, whether it is the connection between the flexible resin substrate and the circuit board or the connection between the flexible resin substrate and the glass panel,
Since the anisotropic conductive adhesive film having the same thickness can be used for connection, it is necessary to switch the anisotropic conductive adhesive film when the flat display panel and the circuit board are bonded on both sides of the flexible resin substrate. Absent.
【0017】その結果、安価に形成できると共に、導電
特性もよく、性能の向上した平面型表示装置をうること
ができる。As a result, it is possible to obtain a flat-panel display device which can be formed at low cost and has good conductivity and improved performance.
【図1】本発明の可撓性樹脂基板の接続方法の各工程を
示す断面図である。FIG. 1 is a sectional view showing each step of a method for connecting a flexible resin substrate of the present invention.
【図2】従来の可撓性樹脂基板の接続方法の各工程を示
す断面図である。FIG. 2 is a cross-sectional view showing each step of a conventional flexible resin substrate connection method.
1 可撓性樹脂基板 2 配線パターン 3 凹部 4 回路基板 5 配線パターン 6 絶縁性樹脂 7 異方導電性接着フィルム 1 Flexible Resin Substrate 2 Wiring Pattern 3 Recess 4 Circuit Board 5 Wiring Pattern 6 Insulating Resin 7 Anisotropic Conductive Adhesive Film
Claims (1)
パターンと、駆動回路などが形成された回路基板に設け
られた配線パターンとを可撓性樹脂基板に設けられた配
線パターンを介して接続する可撓性樹脂基板の接続方法
であって、 前記可撓性樹脂基板または回路基板に設けられた配線パ
ターンのあいだの凹部に絶縁性樹脂を充填し、ついで両
基板間に異方導電性接着フィルムを介在させて熱圧着さ
せることを特徴とする可撓性樹脂基板の接続方法。1. A wiring pattern provided on a flat display module and a wiring pattern provided on a circuit board on which a driving circuit and the like are formed are connected via a wiring pattern provided on a flexible resin substrate. A method for connecting a flexible resin substrate, comprising filling an insulating resin in the recesses between the wiring patterns provided on the flexible resin substrate or the circuit board, and then forming an anisotropic conductive adhesive film between the two substrates. A method for connecting a flexible resin substrate, characterized in that thermocompression bonding is performed with intervening.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP04214005A JP3113080B2 (en) | 1992-08-11 | 1992-08-11 | Flexible resin substrate connection method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP04214005A JP3113080B2 (en) | 1992-08-11 | 1992-08-11 | Flexible resin substrate connection method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0661642A true JPH0661642A (en) | 1994-03-04 |
JP3113080B2 JP3113080B2 (en) | 2000-11-27 |
Family
ID=16648690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP04214005A Expired - Fee Related JP3113080B2 (en) | 1992-08-11 | 1992-08-11 | Flexible resin substrate connection method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3113080B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2724052A1 (en) * | 1994-08-31 | 1996-03-01 | Nec Corp | Assembly method for large scale integrated circuits |
US5976910A (en) * | 1995-08-30 | 1999-11-02 | Nec Corporation | Electronic device assembly and a manufacturing method of the same |
WO2005064452A1 (en) * | 2003-12-25 | 2005-07-14 | Nissha Printing Co., Ltd. | Touch panel |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7498615B2 (en) | 2020-07-22 | 2024-06-12 | Ykk Ap株式会社 | Fittings |
-
1992
- 1992-08-11 JP JP04214005A patent/JP3113080B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2724052A1 (en) * | 1994-08-31 | 1996-03-01 | Nec Corp | Assembly method for large scale integrated circuits |
US5896276A (en) * | 1994-08-31 | 1999-04-20 | Nec Corporation | Electronic assembly package including connecting member between first and second substrates |
US5976910A (en) * | 1995-08-30 | 1999-11-02 | Nec Corporation | Electronic device assembly and a manufacturing method of the same |
WO2005064452A1 (en) * | 2003-12-25 | 2005-07-14 | Nissha Printing Co., Ltd. | Touch panel |
Also Published As
Publication number | Publication date |
---|---|
JP3113080B2 (en) | 2000-11-27 |
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