JPH063292A - Direction aligning device for crystal plate, cut face inspection device for crystal plate, and direction aligning cut face inspection device for crystal plate - Google Patents

Abstract

PURPOSE:To provide a direction aligning device and cut surface inspection device for crystal plate with an extremely short measuring time. CONSTITUTION:In a directional aligning. cut face inspection device for crystal plate, a plurality of crystal plates 3 having crystal lattice surfaces inclined at a determined angle to a cut surface are aligned toward a fixed direction, and the inclination to the crystal lattice surface of the cut surface is measured for the aligned crystal plates 3. The device has a sample base 4 for placing the crystal plates 3, an X-ray tube 1 for emitting X-ray to the crystal plates 3 placed on the sample 4 base; and a position sensitive X-ray detector (PSPC) 8 for detecting the X-ray diffracted by the crystal plates 3. The sample base 4 is intermittently rotated within a horizontal surface at an angle interval of 90 deg.. The PSPC 8 simultaneously detects the diffracted X-rays within a wide range.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal plate orientation aligning device for aligning a plurality of crystal plates each having a crystal lattice plane inclined at a predetermined angle with respect to a cut surface in a fixed direction. The present invention relates to a crystal plane cut surface inspection device for measuring an inclination angle of a cut surface with respect to a crystal lattice plane, and a crystal plate direction alignment / cut surface inspection device having both an alignment function and a cut surface inspection function.

[0002]

2. Description of the Related Art In recent years, quartz plates have been widely used industrially. This crystal plate is generally made of a crystal rod of 0.2 mm.
It is formed by cutting to a certain thickness. At the time of cutting, AT cut plate, BT cut plate, FC cut plate, IT cut plate, LC cut plate, S
Various cut plates such as C cut plate and RT cut plate are produced. In fact, AT cut plates are widely used.

When many crystal plates are manufactured, it is desirable that the cut surfaces and the crystal lattice planes have a uniform inclination angle between the manufactured crystal plates. As a device for accurately inspecting this tilt angle and measuring the deviation from the standard angle position, a cut surface inspection device utilizing X-ray diffraction measurement as shown in FIG. 4 has already been known.

Generally, X-rays are diffracted or reflected by the crystal lattice plane of the quartz plate. Now, the distance between crystal lattice planes is d (angstrom), the wavelength of X-ray is λ (angstrom),
When the angle between the X-ray incident on the crystal plate and the crystal lattice plane inside the crystal plate (that is, Bragg angle) is θ, and n is an arbitrary integer, when the X-ray incident angle θ satisfies nλ = 2d sin θ Only, the X-rays are diffracted by the crystal plate, especially the crystal lattice planes inside.

In FIG. 4, the X-ray R emitted from the X-ray source 51 is made into a thin X-ray beam by the slit 52,
The light enters the crystal plate 53 at point P. The X-ray detector 58 is previously arranged at an angle position of 2θ with respect to the incident X-ray, where θ is the Bragg angle of the crystal lattice plane to be the reference for measurement. When the crystal plate to be measured is set at a predetermined measurement position and swingingly rotated about the X-ray incident point P as indicated by arrow A, when the crystal lattice plane comes to the position of θ, Diffraction or reflection occurs which is detected by the X-ray detector 58. By reading the rotation angle of the crystal plate 53 in this case, the amount of deviation of the cut surface Q from the preset standard position can be known.

When an inspection is performed by this cut surface inspection apparatus, the direction of the crystal plate 53 to be measured with respect to the traveling path of the X-ray R is the direction in which the crystal lattice planes inside have a relationship as shown in FIG. Must be aligned. This is because diffracted X-rays cannot be detected if the quartz plate is oriented in the wrong direction. For example, assuming that the crystal plate 53 is formed in a square shape as shown in FIG. 5, one side L1 of the crystal plate 53 is directed toward the X-ray detector 58 in the illustrated state. If X-ray diffraction occurs,
When the crystal plate 53 is erroneously placed so that any of the other sides L2, L3, L4 of the crystal plate 53 is directed to the X-ray detector 58, the crystal plate 53 does not cause X-ray diffraction. Therefore, normal X-ray diffraction measurement cannot be performed.

Although not directly related to the cut surface inspection apparatus, when packing a large number of crystal plates in a box, etc., the crystal plates are not arranged randomly but packed in a box. It is required to line up in the direction.

As described above, when handling a plurality of crystal plates, it is often required to align the crystal plates in a certain direction.

Conventionally, as a direction aligning device for aligning a quartz plate in a certain direction, there is a device utilizing X-ray diffraction measurement as in the cut surface inspection device. This device is shown in FIG.
As shown in FIG. 5, a sample table 54 that is intermittently rotatable at an angular interval of 90 ° around an axis ω that passes through the X-ray incident point P as shown by an arrow B, and is arranged on one side of the sample table 54. And an X-ray detector 58 arranged on the other side of the sample table 54. The crystal plate 53 to be measured is placed on the sample table 54, the sample table 54 and the crystal plate 53 on the sample table 54 are intermittently rotated at fixed time intervals, and the crystal plate is at each stationary position during the intermittent rotation. It is determined whether or not the crystal plate 53 is oriented in a desired direction by irradiating the crystal plate 53 with X-ray R and determining whether the crystal plate 53 undergoes X-ray diffraction at that time. When detecting the diffracted X-rays, the crystal plate 53 is moved by the arrow A as in the case of FIG.
It is rocked and rotated like.

[0010]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention The above-mentioned conventional cut surface inspection device for crystal plate (FIG. 4) and direction alignment device (FIG. 6)
In the above, as the X-ray detector 58, an X-ray detector having a structure for capturing X-rays through a very narrow X-ray capturing opening and measuring the intensity of the captured X-rays, for example, a proportional counter (Proportional Counter). , P
C) and a scintillation counter (Scintilla)
Tion Counter, SC) was used.
This type of X-ray detector has a narrow opening for taking in X-rays, and therefore, in order to find X-rays that are diffracted by the crystal plate, the crystal plate is rotated and oscillated within a predetermined angle range, or X-ray detection It was necessary to rotate and oscillate the vessel around a crystal plate within a predetermined angle range. In order to perform this rotation swing,
In the conventional direction alignment device and cut surface inspection device,
A relatively long measurement time was needed.

The present invention has been made in order to solve the above-mentioned problems in the conventional direction aligning device and cut surface inspection device, and it is a crystal plate direction aligning device or cut surface inspection device having a very short measuring time. The purpose is to provide a device.

[0012]

In order to achieve the above object, a crystal plate orientation aligning apparatus according to the present invention comprises a sample table on which a crystal plate is placed, sample rotating means for rotating the sample table,
An X-ray source for irradiating a quartz plate mounted on the sample table with X-rays;
An X-ray detector for detecting X-rays diffracted by the quartz plate, and the X-ray detector is characterized by having a position-sensitive X-ray detector.

Further, the crystal plate cut surface inspection apparatus according to the present invention irradiates the crystal plate placed at the inspection position with X-rays.
It has a radiation source and an X-ray detector for detecting X-rays diffracted by a quartz plate, and the X-ray detector is characterized by having a position-sensitive X-ray detector.

Further, the direction alignment of the crystal plate according to the present invention
The cut surface inspection apparatus includes a sample stage on which a crystal plate is placed, a sample rotating unit that rotates the sample stage, an X-ray source that irradiates the crystal plate placed on the sample stage with X-rays, and a diffraction plate. And an X-ray detector for detecting the generated X-rays, and the X-ray detector has a position-sensitive X-ray detector.

In the above structure, the position-sensitive X-ray detector has a function of simultaneously measuring two pieces of information, that is, intensity information of the X-ray and position information of the position where the X-ray enters the X-ray detector. X-ray detector. As such an X-ray detector, for example, a position-sensitive proportional counter (PS
PC), a linear X-ray sensor using a photodiode array, or the like can be used.

[0016]

The position-sensitive X-ray detector is arranged over a wide angular range extending linearly around the quartz plate. Therefore, X-rays diffracted by the crystal plate to be inspected, that is, diffracted X-rays are simultaneously measured over a wide angle range. Therefore, there is no need to rotate and oscillate the X-ray detector as in the conventional case, and the inspection of the orientation of the crystal plate and the inspection of the deviation of the inclination angle of the cut surface with respect to the crystal lattice surface can be performed in a very short time. Became.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment of a quartz plate directional alignment / cut surface inspection apparatus according to the present invention when viewed in plan from above. This direction alignment / cut surface inspection device aligns the direction in which the square crystal plate 3 as shown in FIG. 2 is placed in a certain direction (direction alignment processing), and further cuts the cut surface with respect to the internal crystal lattice plane. The amount of deviation of the tilt angle from the standard tilt angle is inspected (cut surface inspection process).

In FIG. 1, a large number of crystal plates 3 to be inspected are randomly stored in a component storage tray of a parts feeder 5. As is well known, the parts feeder 5 conveys a large number of housed quartz plates 3 side by side by high-frequency vibration, and conveys them to the parts take-out section E. The orientation of the crystal plate 3 conveyed to the component take-out portion E, in other words, the orientation of the crystal lattice plane inside thereof is disordered. The crystal plate 3 conveyed to the component take-out section E is conveyed by a conveying device (not shown) at a proper timing and then conveyed to the sample table 4. This transfer device is not limited to a special structure, but for example, the crystal plate 3 is suction-held by suction of air,
It is possible to use a carrying means configured to carry the crystal plate 3 to the sample table 4 in the holding state.

As shown in FIG. 2, the sample table 4 is made of a square plate material, and an in-plane rotation driving device 6 is provided at a lower position thereof. In-plane rotation drive device 6
Is composed of, for example, a pulse motor, and operates based on a command from a control device 7 having a built-in computer to intermittently move the sample table 4 around the central axis ω at 90 ° intervals as indicated by arrow F. Driven to rotate.

In FIG. 1 or 2, an X-ray tube 1 as an X-ray source is provided on the right side of the sample table 4, while a position-sensitive X-ray detector as a position-sensitive X-ray detector is provided on the left side of the sample table 4. Type proportional counter, so-called PSPC (Position
Sensitive Proportional Co
8) is provided.

The PSPC 8 is internally provided with an anode line 9, a cathode line 10 and a delay line 1 as shown in FIG.
Have one. When X-rays enter the PSPC 8 through the X-ray capturing openings 12 extending in the vertical direction, electric charges are induced in the cathode line 10, and electric pulse signals corresponding to the electric charges appear at both ends of the delay line 11. This pulse signal is input to the multi-channel analyzer (MCA) 13. The pulse signals appearing at both ends of the delay line 11 have a time difference proportional to the distance of the cathode line 10 or the like in the length direction X. Therefore, the incident position of the X-ray in the length direction X can be known by measuring the time difference between the pulse signals generated at both ends of the delay line 11. That is, PSPC8
Is PS at each position in the length direction X, that is, the diffraction angle 2θ direction, within the range in which the anode wire 9 and the like are stretched.
The X-rays that have entered the PC 8 are detected almost at the same time.

The MCA 13 has a large number of memory channels corresponding to each angular position formed by subdividing the length direction X into a large number, and a memory memory corresponding to an incident position where X-rays are incident. The intensity of the incident X-ray is accumulated in the channel and stored. The X-ray position information and intensity information stored in the MCA 13 are read by the control device 7.

Returning to FIG. 1, an L-shaped guide block 14 and two pressing pieces 15a, 1 reciprocating in a direction perpendicular to each other are provided at the front side position (downward position in the figure) of the sample table 4.
A positioning stage G with 5b is provided. Between the sample stage 4 and the positioning stage G, a quartz plate transfer device (not shown) is arranged. This crystal plate conveying device conveys the crystal plate 3 placed on the sample table 4 in parallel without changing its direction and conveys it to the positioning stage G. When the crystal plate 3 is placed on the positioning stage G, the pressing pieces 15a, 15b move toward the guide block 14 and press the crystal plate 3 against the guide block 14, whereby the crystal plate 3 is always placed at a fixed position. .

A crystal plate recovery stage H is set at a position on the near side of the positioning stage G (lower position in the figure). On the crystal plate recovery stage H, any one of a plurality of cassettes 17 arranged in a row in a row on an XY stage 16 formed in a rectangular flat plate shape is placed. A crystal plate conveying device (not shown) is arranged between the positioning stage G and the crystal plate collecting stage H.
This crystal plate carrier is also used for crystal plate 3 between both stages G and H.
Are conveyed in parallel without changing their orientation.

In the embodiment, a total of 27 cassettes 17 are arranged side by side on the XY stage 16 with 9 rows in the vertical direction and 3 rows in the horizontal direction. The three vertical vertical rows of the three cassette groups 17a are arranged such that the crystal plates that fall within the deviation 0 region in which the amount of deviation of the inclination angle between the internal crystal lattice plane and the cut plane of the crystal plate 3 from the standard inclination angle is the smallest. It is a group of cassettes to be stored. The four groups of cassette groups arranged on the left side of the central cassette group 17a respectively have a deviation −1 area, a deviation −2 area, and a deviation − area as the deviation amount of the cut surface inclination angle gradually increases on the negative side. It is divided into four areas, three areas and nonstandard areas. Similarly, on the right side of the central cassette group 17a, as the deviation amount of the cut surface inclination angle gradually increases on the plus side, it is divided into four sections of deviation + 1 area, deviation + 2 area, deviation + 3 area, and nonstandard area. The cassette groups are arranged.

An X-axis motor 18 and a Y-axis motor 19 are connected to the XY stage 16. The X-axis motor 18 is
It operates based on a command from the control device 7 to move the XY stage 16 in a parallel straight line in the XX direction (left and right direction in the drawing). The Y-axis motor 19 also operates based on a command from the control device 7 to move the XY stage 16 in a parallel straight line in the YY direction (the vertical direction in the drawing). By moving the XY stage 16 in the X-X direction and the Y-Y direction by an appropriate distance, any one desired cassette 17 on the XY stage 16 can be carried to the crystal plate recovery stage H.

The operation of the crystal plate directional alignment / cut surface inspection apparatus having the above-described structure will be described below.

In FIG. 1, the parts feeder 5 conveys the quartz plates 3 one by one to the parts take-out section E, and further places them on a predetermined position on the sample table 4. After that, the quartz plate 3 placed on the sample table 4 is successively subjected to two processes of a direction alignment process and a cut surface inspection process.

(Direction Alignment Processing) This processing is performed in order to always set the crystal lattice plane in the quartz plate 3 in a predetermined inclination state with respect to the X-ray R emitted from the X-ray tube 1 in FIG. It is something that will be done. Specifically, the crystal plate 3 placed on the sample table 4 is irradiated with the X-ray R from the X-ray tube 1. At that time, PSPC8 determines whether X-ray diffraction occurs on the crystal plate 3.
To measure by. When the diffracted X-rays are not measured by the PSPC 8, the control device 7 operates the in-plane rotation driving device 6 to rotate the sample stage 4, that is, the quartz plate 3 by 90 ° about the central axis ω and stop it. Then, in the state of rotating by 90 degrees, repeat X for the crystal plate 3.
The X-ray diffraction measurement is performed by the ray tube 1 and the PSPC 8.

Since the quartz plate 3 has a square shape, the tilt state of the crystal lattice plane always satisfies the X-ray diffraction condition with respect to the X-ray R at any stop position while repeating the rotation of 90 ° four times. Match the tilted state. When the crystal plate 3 coincides with its tilted position, the X-rays emitted from the X-ray tube 1
And the diffracted X-rays are detected by the PSPC 8. When the diffracted X-rays are detected by the PSPC 8, the operation of the in-plane rotation drive device 6 is stopped by the command from the control device 7, and the intermittent in-plane rotation of the sample table 4 is stopped. Through the above processing, the crystal lattice planes inside the crystal plate 3 are always aligned in a constant direction with respect to the X-ray R.

In the conventional apparatus shown in FIG. 6, the crystal plate 53 is swung in the direction of arrow A in order to search for the diffracted X-rays from the crystal plate 53, or alternatively, the X-ray detector 58 is used. It was necessary to oscillate around the crystal plate 53, so that a very long measurement time was required. On the other hand, in the apparatus of FIG. 2, the PSPC 8 can simultaneously detect diffracted X-rays within a wide range in which the X-ray capturing aperture 12 is present.
8 It is no longer necessary to oscillate itself. For this reason, the measurement time was significantly shortened.

When the above direction alignment processing is completed, the crystal plate 3
The processing mode shifts to the cut surface inspection processing while still being mounted on the sample table 4.

(Cut Surface Inspection Processing) This processing is for inspecting how much the inclination angle of the cut surface of the quartz plate 3 with respect to the internal crystal lattice plane deviates from the standard inclination angle. Specifically, the following processing is performed.

The X-rays R emitted from the X-ray tube 1 are incident on the quartz plate 3 aligned in a certain direction by undergoing the above-described direction alignment process. At this time, the X-rays are diffracted by the crystal lattice planes inside the crystal plate 3, and the diffracted X-rays are the openings 12 of the PSPC 8.
It is taken into the PSPC 8 via. Captured X
A pulse signal is output from the PSPC 8 corresponding to the intensity of the line. This output pulse signal is stored in a memory channel in the MCA 13 corresponding to the angular position of the diffracted X-ray, and the controller 7 further controls that channel,
That is, the value of the diffraction angle 2θ of the diffracted X-ray is identified.

The control device 7 calculates the deviation amount from the standard value for this diffraction angle 2θ. The deviation amount of the diffraction angle 2θ depends on the inclination angle of the internal crystal lattice plane and the cut plane of the quartz plate 3. That is, by measuring the deviation amount of the diffraction angle 2θ, the deviation amount of the inclination angle of the cut surface from the standard inclination angle can be known. Thus,
The deviation of the cut surface of the crystal plate 3 from the standard state is inspected. Even in this cut surface inspection process, it is not necessary to rotate and swing the crystal plate 3 or the PSPC 8, and therefore,
The measurement time is significantly shortened.

When the above cut surface inspection processing is completed, the control device 7 rotates the X-axis motor 18 and the Y-axis motor 19 of FIG. 1 by a predetermined angle based on the calculated deviation amount. By this rotation, the XY stage 16 is translated in the vertical and horizontal directions by an appropriate distance, and among the cassettes 17 on the XY stage 16, the cassette 17 corresponding to the deviation value that matches the deviation amount of the diffraction angle 2θ. Is carried to the crystal plate collection stage H.

After that, the crystal plate 3 that has been inspected on the sample table 4 is conveyed in parallel to the positioning stage G, and the pressing piece 15 is pressed.
It is pressed against the guide block 14 by a and 15b to be positioned, and is parallel conveyed to the inside of the cassette 17 set on the crystal collecting stage H and is housed in the cassette 17. Since the crystal plates 3 are always conveyed in parallel, the crystal plates 3 housed in the respective cassettes 17 are always oriented in a fixed direction. There is a limit to the number of crystal plates 3 that can be accommodated in one cassette 17. When the number of the crystal plates 3 stored in one cassette 17 reaches the limit value, the subsequent crystal plates 3 are stored in any of the other cassettes 17 in the same deviation value group.

FIG. 3 shows another embodiment of the direction alignment / cut surface inspection apparatus for a quartz plate according to the present invention. This embodiment is different from the embodiment shown in FIG. 2 in that the crystal plate 3
As a position-sensitive X-ray detector for detecting X-rays from, the linear X-ray sensor 28 is used instead of the position-sensitive proportional counter (PSPC) 8 in FIG.

The linear X-ray sensor 28 has a photodiode array formed by arranging a large number of photodiodes formed of, for example, semiconductors in a line in the longitudinal direction (direction of arrow C). By self-scanning these photodiodes by a switching circuit composed of a shift register and a switching transistor, an X-ray incident on any one of the photodiodes in the photodiode array is detected.
The self-scanning of the photodiode array makes it possible to obtain the diffraction angle information of the diffracted X-rays from the quartz plate 3.

The multi-channel analyzer 13 arranged in the cylindrical housing 20 has the same function as the multi-channel analyzer 13 shown in FIG.

Although the present invention has been described with reference to the preferred embodiments, the present invention is not limited to the embodiments.

The apparatus shown in FIG. 1 is an embodiment in which the present invention is applied to a composite apparatus having both a crystal plate orientation aligning device and a crystal plate cut surface inspection device. However, it is of course possible to individually apply the present invention to each of the direction alignment device and the cut surface inspection device.

In the illustrated embodiment, the square-shaped crystal plate is the object to be inspected, but a crystal plate having any other shape, for example, a circular crystal plate, may be the object to be inspected.

[0044]

According to the present invention, since the position sensitive X-ray detector having a wide X-ray detection range is used as the X-ray detector, it is not necessary to rotate and oscillate the quartz plate or the X-ray detector. , It became possible to measure in an extremely short time.

[0045]

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an embodiment of a crystal plate directional alignment / cut surface inspection apparatus according to the present invention.

FIG. 2 is a perspective view showing a main part of the embodiment shown in FIG.

FIG. 3 is a perspective view showing a main part of another embodiment of the crystal plate directional alignment / cut surface inspection apparatus according to the present invention.

FIG. 4 is a schematic diagram showing an example of a conventional cut surface inspection device for a crystal plate.

5 is a perspective view showing the orientation of the quartz plate with respect to the X-ray detector in the embodiment of FIG.

FIG. 6 is a schematic view showing an example of a conventional crystal plate orientation aligning apparatus.

[Explanation of symbols]

 1 X-ray tube 3 Quartz plate 4 Sample stage 6 In-plane rotation drive device 8 PSPC 28 Linear X-ray sensor E Parts pick-up position of parts feeder G Positioning stage H Quartz plate recovery stage

Claims (5)

[Claims] 1. A crystal plate orientation aligning device for aligning a plurality of crystal plates each having a crystal lattice plane inclined at a predetermined angle with respect to a cut surface in a fixed direction, wherein the crystal plates are placed. A sample table, a sample rotating means for rotating the sample table, an X-ray source for irradiating a crystal plate mounted on the sample table with X-rays, and an X-ray detector for detecting X-rays diffracted by the crystal plate. An apparatus for orienting a quartz plate, wherein the X-ray detector has a position-sensitive X-ray detector. 2. An apparatus for inspecting a cut surface of a crystal plate for measuring an inclination angle of a cut surface of the crystal plate with respect to a crystal lattice plane, comprising: an X-ray source for irradiating a crystal plate placed at an inspection position with X-rays.
An X-ray detector for detecting X-rays diffracted by a crystal plate, and the X-ray detector has a position-sensitive X-ray detector. 3. A plurality of crystal plates having crystal lattice planes inclined at a predetermined angle with respect to the cut planes are aligned in a fixed direction, and the aligned crystal planes are inclined with respect to the crystal lattice planes of the cut planes. A device for inspecting the orientation and cut surface of a crystal plate for measuring an angle, comprising: a sample table on which the crystal plate is mounted; sample rotating means for rotating the sample table; and an X-ray on the crystal plate mounted on the sample table. And an X-ray detector for detecting X-rays diffracted by the quartz plate, and the X-ray detector has a position-sensitive X-ray detector. Plate direction alignment / cut surface inspection device. 4. The position-sensitive X-ray detector is a position-sensitive proportional counter, as claimed in any one of claims 1 to 3.
A crystal plate orientation aligning device according to any one of
Cut surface inspection device or direction alignment / cut surface inspection device. 5. The crystal plate orientation aligning device according to claim 1, wherein the position-sensitive X-ray detector is a linear X-ray sensor. Surface inspection device or direction alignment / cut surface inspection device.