JPH0632449A - Wafer carrying and storing system in manufacturing processing for semiconductor - Google Patents

Abstract

PURPOSE:To prevent the surface of a wafer from being stained with particles in manufacturing processes for a semiconductor by using a wafer storing box the inside of which is evacuated for the movement and the temporary storage of each wafer, and concurrently providing a means by which each wafer is automatically housed in and taken out of the storing box, and also is automatically carried/stored. CONSTITUTION:As for a wafer carrying/storing system in manufacturing processes for wafers, an exclusive vacuum carrier 103 is housed in a wafer storing box 106, and the inside of the box is then evacuated by a storing box cap closing means 105. The wafer storing box 106 is carried so as to be housed in a main stocker 107. Next, the wafer storing box 106 is carried in to a processing line by means of carriage among processes. Temporary storing is carried out by local stockers 108 and 109. Respective processing devices include mixedly a batch process 110 and a process for counting the number of sheets 111, also include processing means 116 which does not match a fully automatic storing cap closing means 117, however all of these are properly utilized. Each wafer which has been processed, is then forwarded to the following process.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer / storage system in a semiconductor manufacturing process which positively utilizes a wafer storage box having a vacuum inside for transferring / storing wafers in the semiconductor manufacturing process.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, when a wafer is transferred and stored in the atmosphere, a plastic case is usually used, and the wafer is stored and transferred and stored in the plastic case. In addition, a storage box whose inside is evacuated for the purpose of reducing particle contamination of the wafer is also commercially available. However, this storage box is equipped with a manual valve to directly evacuate the inside of the storage box or open it to the atmosphere.
I used to open and close the opening cap by hand. Therefore, there are problems that operations such as storing and taking out wafers in the storage box are complicated and the weight is increased.

In order to solve the above problems, there is an apparatus disclosed in the specification and drawings of Japanese Patent Application No. 2-312825. This apparatus is intended to facilitate the operation and reduce the weight by indirectly exhausting and opening the wafer for storage in the storage box and automatically opening and closing the opening cover.

[0004]

However, the apparatus disclosed in the specification and drawings of the above-mentioned Japanese Patent Application No. 2-312825 is also an improvement in the operation of the storage box alone, and in the semiconductor manufacturing process, there is a distance. It is not proposed in consideration of positively utilizing a wafer storage box whose inside is in a vacuum state for transferring and storing wafers between processes, and is suitable for such a wafer transfer / storage device. It wasn't something.

The present invention has been made in view of the above-mentioned points, and in the semiconductor manufacturing process, a semiconductor manufacturing process which positively utilizes a wafer storage box having a vacuum inside for transferring and storing wafers between the processes. It is an object of the present invention to provide a wafer transfer / storage system in.

[0006]

In order to solve the above problems, the present invention provides a wafer transfer / storage system in a semiconductor manufacturing process between a process in the atmosphere and a process in vacuum in the semiconductor manufacturing process, and respectively. A wafer storage box with a vacuum inside is used for the transfer and temporary storage of the wafer between the processes, and the wafer is stored in the storage box, the wafer is taken out of the storage box, and the wafer is transferred and stored. Automatic storage / removal
It was constructed by providing transportation and storage means.

The automatic storage / unloading / transporting / storing means opens the storage box to the atmosphere when the wafer is stored in the storage box and is taken out from the storage box with respect to the connection between the process in the atmosphere and the storage box. However, the connection between the process in a vacuum and the storage box is characterized by having a function of keeping the storage box in a vacuum without opening it to the atmosphere.

When the storage box is connected to each process, the automatic storage / unloading / transporting / storing means has a function of storing wafers in a plurality of storage boxes and taking out wafers from the plurality of storage boxes. Characterize.

Further, a storage box cleaning means for cleaning the storage box is provided.

[0010]

As described above, the wafer transfer / storage apparatus uses the storage box for storing the wafer in a vacuum state, and the automatic storage / unloading / transfer / storage means stores the wafer in the storage box. Since the wafer is automatically taken out from the wafer and the wafer is transferred / stored automatically, the wafer can be transferred / stored between the processes in the semiconductor manufacturing process without contaminating the surface of the wafer with particles.

[0011]

【Example】

[Embodiment 1] FIG. 1 is a diagram showing a configuration of a wafer transfer / storage system in a semiconductor manufacturing process according to the present invention. Temporary storage of a wafer between a process in the atmosphere and a process in a vacuum and between the processes. FIG. 2 is a diagram showing a configuration of a system using a wafer storage box whose inside is in a vacuum state and a flow of each process. The outline of this system will be described below.

First, after the wafer 101 is received in the factory, it is cleaned and dried in the cleaning / drying step 102 for each carrier as a pre-process, and then the wafer is transferred to the vacuum dedicated carrier 103 by the carrier transfer step 104. . Subsequently, the storage box cap opening / closing device (vacuum box device) 105
Then, this vacuum-dedicated carrier 103 is attached to the wafer storage box 106.
Then, the inside of the wafer storage box 106 is evacuated.

Next, the wafer storage box 106 is transported,
Stored in the main stocker 107. The main stocker 107 is a device for storing a large number of wafer storage boxes 106. The main stocker 107 measures the internal pressure of the wafer storage box 106 and keeps the wafer storage so as to keep this pressure substantially constant (the degree of vacuum is substantially constant). The inside of the box 106 can be evacuated constantly or periodically.

Next, when a wafer supply request is issued from the process steps 112 to 115, the wafer storage box 1
06 is transferred from the main stocker 107 between processes,
It is transported to the process line. And if not immediately connected to the process, the local stocker 1
It is stored in 08 and 109. This local stocker 1
08 and 109 are intended for temporary storage of process steps, and the number of stored wafer storage boxes 106 is not so large. However, in case of long-term storage, just like the main stocker 107, the internal pressure of the wafer storage box 106 can be measured and the pressure can be kept constant.
The inside of the wafer storage box 106 can be evacuated constantly or regularly.

Next, each process apparatus may include a batch processing 110 and a single-wafer processing 111, or may not be a fully automatic storage cap opening / closing apparatus. Therefore, it may be necessary to take out the vacuum dedicated carrier 103 from the vacuum wafer storage box 106 to the atmosphere. Therefore, the storage box cap opening / closing device for opening / closing the cap of the wafer storage box 106 includes a simple type simple storage box cap opening / closing device 116 used for the purpose of breaking the vacuum in the wafer storage box 106. There is a fully automatic storage box cap opening / closing device 117,
Both are used properly.

In the case of a process which does not correspond to the fully automatic storage box cap opening / closing device 117, the simple storage box cap opening / closing device 116 is used and the wafer storage box 1
Wafer carrier 1 for exclusive use of vacuum by breaking the vacuum inside 06
03 into the atmosphere, and the process equipment 112-1, 1 in process step 112 and process step 114.
Set it to 14-1. Here, in the case of batch processing, each wafer carrier is processed, and in the case of single wafer processing, each wafer is processed. When the processing is completed, the vacuum-dedicated carrier 103 is again taken out into the atmosphere and stored in the wafer storage box 106, and the vacuum-dedicated carrier 103 is vacuum-stored in the wafer storage box 106 by using the simple storage box cap opening / closing device 116. .

Further, a fully automatic storage box cap opening / closing device 11
In the case of the process step 113 and the process step 115 corresponding to No. 7, the vacuum dedicated carrier 103 is taken out without breaking the vacuum in the wafer storage box 106, for example, by the method as described in Example 2 below. The process is set in each vacuum process device or the transport paths 113-1 and 115-1 and all the operations are completed.

When one process step is completed in the above-described manner, it is transferred to the next process step line again by the transfer between steps, or if it is not immediately transferred to the next process step, it is stored in the local stocker 118. To be done. When all the process steps are completed in this manner, finally, the wafer storage box cap opening / closing device 119 is used to take out the dedicated vacuum carrier 103 from the wafer storage box 106, and the wafer is again transferred to the normal transfer carrier 1 for the subsequent steps.
Reprinted on 22.

On the other hand, the wafer storage box 106, the cap 106a and the vacuum carrier 103 which have been used once or a predetermined number of times are cleaned and dried through cleaning / drying steps 120 and 121, respectively, and then a wafer receiving / cleaning / drying step. To the storage box cap opening / closing device (vacuum BOX device) 105. It should be noted that the cleaning / drying process of the wafer storage box 106, the cap 106a, and the vacuum-dedicated carrier 103 may be carried out at any place as necessary, and may be sent to the wafer storage box cap opening / closing device at any place as necessary. It has become.

[Embodiment 2] FIG. 2 is a diagram showing a schematic configuration of a fully automatic storage box cap opening / closing device (a fully automatic storage box cap opening / closing device of FIG. 1) in the semiconductor manufacturing process of the present invention. This fully-automatic storage box cap opening / closing device includes a storage box loading device 1, a driving device 2, a storage box connection chamber 3, a gate valve device 4, and a storage box content storage / extraction device 5.
And a robot 6.

The storage box loading device 1 is a device for transferring a storage box 8 containing a case containing an empty wafer or a wafer from a predetermined location and mounting the storage box 8 in the mounting port 3-1 of the storage box connection chamber 3. A storage box mounting base 1-2 on which the storage box 8 is mounted is provided in 1-1. The storage box mounting table 1-2 is connected to a motor 1-4 via a screw type transmission rod 1-3, and by driving the motor 1-4, an arrow A
You can move in any direction.

The drive device 2 is configured such that the screw type elevating rod 2-1 is rotated in the direction of arrow B by a rotating means (not shown) so that the elevating slide 2-2 is elevated as indicated by arrow C. A cap opening / closing mechanism 2-3 is provided on the elevating slide 2-2, and the cap opening / closing mechanism 2-3 can be moved in the direction of arrow D via a screw type transmission rod 2-5. ing.

The storage box connection chamber 3 has a chamber portion 3-2, and the chamber portion 3-2 is provided with the above-mentioned mounting port 3-1 and entrance / exit port 3-3. An expandable bellows 9 is provided between the bottom of the chamber 3-2 and the base of the cap opening / closing mechanism 2-3. In addition, the piping 3 leading to the vacuum device is provided in the chamber 3-2.
-4 is connected via a valve 3-5.

The gate valve device 4 includes a gate valve chamber 4-
1 has a structure in which a gate valve 4-2 is arranged inside. The gate valve 4-2 can be moved in the up-down direction and the left-right direction by a drive device 4-3 as shown by an arrow E. Further, the gate valve chamber 4-1 is provided with doorways 4-4 and 4-5.

The storage box contents storage / extraction device 5 is a room 5-1.
In the configuration, the arm 6-1 of the robot 6 is arranged in
The chamber 5-1 is provided with doorways 5-2 and 5-3. The arm 6-1 is rotatable in the directions of arrows F and G. A pipe 5-5 leading to the vacuum device is connected to the chamber 5-1 via a valve 5-6. In addition, doorway 5
A connection device 10 is connected to -3 via a gate valve 7. Note that 3-6, 3-7, 4-6, 5-4 are sealing members such as O-rings.

As shown in the cross section of FIG. 3, the storage box 8 has a vacuum state inside the storage box main body 8-1 and a cap 8-3 at the opening (entrance) with a seal member 8-6 interposed. Adsorbed. Then, a storage box dust cover 8-4 covering the cap 8-3 is adsorbed through a seal member 8-7. In this case, the vacuum is also present between the cap 8-3 and the protective box dustproof cover 8-4. Further, the inside of the chamber 3-2 of the storage box connection chamber 3 is placed in a vacuum state, and the connection chamber dust cover 3-8 is adsorbed to the mounting port 3-1 with the seal member 3-6 interposed.

In the fully automatic storage box cap opening / closing device having the above-mentioned structure, the operation for storing and withdrawing the contents such as wafers from the storage box 8 will be described. 5 and 6
FIG. 6 is a flow chart showing a storing process. First, the valve 3-5 of the storage box connection chamber 3 is opened to open the chamber 3-2 to the atmosphere (step ST1). With the chamber 3-2 open to the atmosphere, the connection chamber dust cover 3-8 is removed as shown in FIG. 4 (step ST2), and the empty storage box 8 is carried in from the empty box stocker (not shown) (step ST3). , The storage box dustproof cover 8-4 is removed using a device not shown (step S
T4). Next, the storage box loading device 1 presses the collar portion 8-2 of the storage box to load the storage box 8 (step ST5).

Subsequently, the cap opening / closing mechanism 2-3 is hung on the cap 8-3 (step ST6). Then piping 3-
The chamber 3-2 is evacuated by a vacuum device (not shown) via 4 to bring the chamber 3-2 into a vacuum state (step ST7). In this way, the inside of the chamber 3-2 is evacuated,
The pressure difference between the inside of the storage box body 8-1 (vacuum state) and the inside of the chamber 3-2 is eliminated, the cap opening / closing device 2-3 is moved in the direction of arrow D (right side), and the elevating slide 2-2. Is moved in the direction of arrow C (down), and the cap 8-3 is removed (step ST8). If the process is an atmospheric process, the chamber 3-2 is opened to the atmosphere via the pipe 3-4 (step ST9).

Next, the drive unit 4-of the gate valve unit 4
3 is driven to move the gate valve 4-2 in the direction of arrow E (leftward and downward) to open the gate valve 4-2 (step ST10). In this state, the arm 6-1 of the robot 6
Thus, the contents of the storage box are taken out from the connection device 10 (in this case, the gate valve 7 is open) and stored in the storage box 8 (step ST11). Then, the gate valve 4-2 is closed (step ST12). In the case of the atmospheric process, the chamber 3-2 and the storage box 8 are connected via the pipe 3-4.
-1 The inside of the chamber 3-2 and the storage box 8 are evacuated.
The inside of -1 is brought into a vacuum state (step ST13).

Next, the opening of the storage box body 8-1 is closed by the cap 8-3 (step ST14), and the inside of the chamber 3-2 is opened to the atmosphere (step ST15). As a result, since the inside of the storage box body 8-1 is in a vacuum state and the inside of the chamber 3-2 is in an atmospheric state, the cap 8-3 is adsorbed to the opening. Then, the cap opening / closing device 2-3 is removed from the cap 8-3 (step ST16), and the storage box 8 is unloaded by the storage box loading device 1 (step ST17). Then, using a device not shown, the cap 8 of the storage box 8
-3 is covered with the storage box dustproof cover 8-4 as shown in FIG. 3 (step ST18), and the storage box 8 is carried out to another process or stocker (step ST19).

Next, the mounting port 3-1 of the storage box connection chamber 3 is closed by the connection chamber dust cover 3-8 (step ST20), and the chamber 3-2 is evacuated (step ST21). As a result, the connection chamber dust cover 3-8 is adsorbed by the difference between the atmospheric pressure outside the chamber 3-2 and the vacuum pressure inside the chamber 3-2.

Next, the operation of taking out contents such as wafers from the storage box 8 will be described. 7 and 8 are flow charts showing the take-out step. The valve 3-5 of the storage box connection chamber 3 is opened to open the chamber 3-2 to the atmosphere (step ST3).
1). The connection chamber dust cover 3-8 is removed with the chamber 3-2 open to the atmosphere (step ST32), and the storage box 8 is carried in from another process or stocker (step ST3).
3), a storage box dust cover 8-4 using a device (not shown)
Is removed (step ST34). Next, the storage box loading device 1 presses the collar portion 8-2 of the storage box to load the storage box 8 (step ST35).

Subsequently, the cap opening / closing mechanism 2-3 is hung on the cap 8-3 (step ST36). Then piping 3
The chamber 3-2 is evacuated by a vacuum device (not shown) via -4 to bring the chamber 3-2 into a vacuum state (step ST37). In this way, the inside of the chamber 3-2 is set to a vacuum state, the pressure difference between the inside of the storage box body 8-1 (vacuum state) and the inside of the chamber 3-2 is eliminated, and the cap opening / closing mechanism 2-3 is moved to the arrow D. Moving in the direction (right side), and lifting slide 2-2
Is moved in the direction of arrow C (downward), and the cap 8-3 is removed (step ST38). If the process is an atmospheric process, the chamber 3-2 is opened to the atmosphere again (step ST39).

Next, the drive unit 4- of the gate valve unit 4
3 is driven to move the gate valve 4-2 in the direction of arrow E (leftward and downward) to open the gate valve 4-2 (step ST40). In this state, the arm 6-1 of the robot 6
Then, the contents of the storage box are taken out from the storage box 8 (step ST41). Then, the gate valve 4-2 is closed (step ST42). In the case of an atmospheric process, the chamber 3-2 and the storage box 8-1 are evacuated through a pipe 8-4 to evacuate the chamber 3-2 and the storage box 8-1. (Step ST43).

Next, the opening of the storage box body 8-1 is closed by the cap 8-3 (step ST44), and the inside of the chamber 3-2 is opened to the atmosphere (step ST45). As a result, since the inside of the storage box body 8-1 is in a vacuum state and the inside of the chamber 3-2 is in an atmospheric state, the cap 8-3 is adsorbed to the opening. Subsequently, the cap opening / closing mechanism 2-3 is removed from the cap 8-3 (step ST46), and the storage box 8 is unloaded by the storage box loading device 1 (step ST47). Then, using a device not shown, the cap 8 of the storage box 8
-3 is covered with the storage box dustproof cover 8-4 as shown in FIG. 2 (step ST48), and the storage box is carried out (step ST49).

Next, the mounting port 3-1 of the storage box connection chamber 3 is closed by the connection chamber dust cover 3-8 (step ST50), and the chamber 3-2 is evacuated (step ST51). As a result, the connection chamber dust cover 3-8 is adsorbed by the pressure difference between the atmospheric pressure outside the chamber 3-2 and the vacuum pressure inside the chamber 3-2. In addition, in FIGS. 5 and 6,
,,, and A and A and B and B are connected.

[Embodiment 2] FIG. 9 is a diagram showing another schematic configuration of a wafer transfer / storage apparatus in the semiconductor manufacturing process of the present invention. As shown in FIG. 9, a storage box contents storage / extraction device 5 is arranged facing the transport path or the process device 100 via a gate valve device 4D, and the storage box contents storage / extraction device 5 is provided on three sides. Gate valve device 4A, 4
Storage box connection chambers 3A, 3B and 3C are arranged with B and 4C interposed. Storage boxes 8A, 8B and 8C can be loaded or unloaded into the connection chambers 3A, 3B and 3C by storage box loading devices (not shown).

Storage box connection chambers 3A, 3B, 3C, gate valve devices 4A, 4B, 4C, 4D, storage boxes 8A, 8B,
8C and the storage box content storage / extraction device 5 have substantially the same structure as the storage box connection chamber 3, the gate valve device 4, the storage box 8 and the storage box content storage / extraction device 5 of FIG. The operations of storing the contents of the storage box in the storage box 8 and taking out the contents of the storage box from the storage box 8 are substantially the same.

In the wafer transfer / storage apparatus having the above-mentioned structure, the storage box contents from the transfer path or the process unit 100 are transferred to the storage boxes 8A, 8A,
Stored in or removed from 8B and 8C. Note that FIG.
In the above, the three storage boxes 8 are provided by interposing the gate valve devices 4A, 4B and 4C in the storage box contents storage / extraction device 5.
Although an example in which A, 8B, and 8C are arranged is shown, the storage box contents storage / extraction device 5 may have a pentagonal shape, and a gate valve device may be provided on the upper part to arrange four storage boxes. The good thing is right.

Further, as shown in FIG. 10, the gate valve devices 4 are arranged in parallel along the transfer path or the process device 100.
It is also possible to arrange a plurality of automatic storage / removal / transport / storage devices including the storage box contents storage / extraction device 5 and the storage box connection chamber 3 so that the storage boxes 8 can be stored and removed from the storage boxes.

Further, as shown in FIG. 11, an automatic storage / removal / transportation / storage of a gate valve device 4, a storage box contents storage / removal device 5 and a storage box connection chamber 3 with the transfer path or the process device 100 sandwiched therebetween. The device may be arranged so that the device can be stored in and taken out of the storage box 8.

[Embodiment 3] FIG. 12 is a diagram showing a flow of steps for cleaning the storage box and the cap. In the cleaning process, first, the storage box 8 is conveyed from the empty box stocker, the dustproof cover 8-4 is removed, and the dustproof cover 8-4 is washed (step ST60). Next, the storage box is loaded (step ST61), and then the opening / closing device 2-3 is capped 8-3.
(Step ST62). Subsequently, the chamber 3-2 is evacuated to a vacuum state (step ST63), the cap 8-3 is removed (step ST64), and the inside of the storage box 8 is opened to the atmosphere (step ST65). Then, the storage box 8 is unloaded to wash the storage box (step ST6).
6). Next, a cap receiver (not shown) is loaded (step ST67), and the cap is hooked (step ST68). The cap is unloaded (step ST69) and the cap 8-3 is washed. If cleaning is to be performed continuously, the process returns to step ST60 and the process is repeated.

If the cleaning is not continuous cleaning, the cap 8-3 is loaded (step ST70), the cap 8-3 is removed (step ST71), and then the cap receiver is unloaded (step ST72). Subsequently, the cleaned storage box 8 is loaded (step ST73), the chamber 3-2 is evacuated (step ST74), and the chamber 3-2 and the storage box 8 are loaded.
Make a vacuum inside. In this state, the opening of the storage box body 8-1 is closed by the cap 8-3 (step ST75), and the chamber portion 3-
The inside of 2 is opened to the atmosphere (step ST76). As a result, the cap 8-3 is adsorbed to the opening of the storage box body 8-1. Subsequently, the opening / closing device 2-3 is removed from the cap 8-3 (step ST77), and the storage box 8 is unloaded by the storage box loading device 1 (step ST78).
Then, the cap 8-4 of the storage box 8 is covered with the storage box dustproof cover 8-7 (step ST79), and the storage box is carried out.

[0044]

As described above, according to the present invention, the wafer transfer / storage device is a wafer storage box having a vacuum inside, and the automatic storage / unloading / transfer / storing means is used.
Since the wafers are stored in the storage box, the wafers are taken out of the storage box, and the wafers are transferred and stored automatically, the wafers can be transferred and stored between the processes in the semiconductor manufacturing process without contaminating the wafers. The excellent effect that it becomes possible can be expected.

[Brief description of drawings]

FIG. 1 is a diagram showing a schematic configuration of a wafer transfer / storage system in a semiconductor manufacturing process of the present invention.

FIG. 2 is a diagram showing a schematic configuration of a fully automatic storage box cap opening / closing device of the present invention.

FIG. 3 is a view showing a cross section of a storage box.

FIG. 4 is a view showing a state in which a chamber dust cover is attached to a mounting port of a storage box connection chamber.

FIG. 5 is a flowchart showing a storing process of the fully automatic storage box cap opening / closing device of the present invention.

FIG. 6 is a flowchart showing a storing process of the fully automatic storage box cap opening / closing device of the present invention.

FIG. 7 is a flowchart showing a take-out process of the fully automatic storage box cap opening / closing device of the present invention.

FIG. 8 is a flowchart showing a take-out process of the fully automatic storage box cap opening / closing device of the present invention.

FIG. 9 is a diagram showing an example of an arrangement of the fully automatic storage box cap opening / closing device of the present invention.

FIG. 10 is a diagram showing an example of the arrangement of the fully automatic storage box cap opening / closing device of the present invention.

FIG. 11 is a view showing an example of the arrangement of the fully automatic storage box cap opening / closing device of the present invention.

FIG. 12 is a flowchart showing the cleaning system of the present invention.

[Explanation of symbols]

 1 Storage Box Loading Device 2 Drive Device 3 Storage Box Connection Room 4 Gate Valve Device 5 Storage Box Contents Storage / Ejection Device 6 Robot 7 Gate Valve 8 Storage Box 9 Bellows 10 Connection Device

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H01L 21/68 T 8418-4M

Claims (4)

[Claims] 1. A wafer storage box having a vacuum inside is used for transferring and temporarily storing a wafer between a process in air and a process in vacuum in a semiconductor manufacturing process, and between each process. , Automatic storage / unloading for automatically storing and storing wafers in / from the storage box, and taking / unloading wafers from / into the storage box
A wafer transfer / storage system in a semiconductor manufacturing process, which is provided with transfer / storage means. 2. The automatic storage / unloading / transporting / storing means stores the wafers in the storage box and removes the wafers from the storage box in connection with the process in the atmosphere and the storage box. 2. The semiconductor manufacturing according to claim 1, wherein the semiconductor box has a function of opening the storage box to the atmosphere and maintaining the vacuum state without opening the storage box to the atmosphere when connecting the process and the storage box in a vacuum. Wafer transfer / storage system in process. 3. The automatic storage / unloading / transporting / storing means has a function of storing wafers in a plurality of storage boxes and taking out wafers from the plurality of storage boxes when connecting the storage boxes to each process. The wafer transfer / storage system in the semiconductor manufacturing process according to claim 1, characterized in that it has. 4. A wafer transfer / storage system in a semiconductor manufacturing process according to claim 1, further comprising storage box cleaning means for cleaning the storage box.