JPH06310846A - Method of laser soldering of electronic part - Google Patents
Method of laser soldering of electronic partInfo
- Publication number
- JPH06310846A JPH06310846A JP5123519A JP12351993A JPH06310846A JP H06310846 A JPH06310846 A JP H06310846A JP 5123519 A JP5123519 A JP 5123519A JP 12351993 A JP12351993 A JP 12351993A JP H06310846 A JPH06310846 A JP H06310846A
- Authority
- JP
- Japan
- Prior art keywords
- horizontal portion
- irradiating
- lead
- laser
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、レーザ光を照射して電
子部品をプリント基板等に実装する、電子部品のレーザ
半田付け実装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser soldering method for mounting electronic components on a printed circuit board or the like by irradiating laser light.
【０００２】[0002]
【従来の技術】従来のレーザ光を用いて電子部品をプリ
ント基板等に実装する方法は、図２に示すように、プリ
ント基板６０に電子部品５０を実装するとき、電子部品
５０のリード２の先端部でありプリント基板６０と接合
する第二の水平部２ａにレーザ光１０を照射する。この
時、プリント基板６０と第二の水平部２ａは、クリーム
半田３を介して接合する。レーザ光１０を照射し、クリ
ーム半田３を溶融した後、リード２の折れ曲がり部２ｂ
にレーザ光１０を走査し、半田付けを行うという方法で
あった。2. Description of the Related Art A conventional method of mounting an electronic component on a printed circuit board or the like by using a laser beam is, as shown in FIG. The second horizontal portion 2a, which is the tip portion and is joined to the printed circuit board 60, is irradiated with the laser light 10. At this time, the printed circuit board 60 and the second horizontal portion 2 a are joined via the cream solder 3. After radiating the laser beam 10 to melt the cream solder 3, the bent portion 2b of the lead 2
It was a method of scanning the laser beam 10 and soldering.
【０００３】[0003]
【発明が解決しようとする課題】ところが、上述したよ
うな従来の実装方法では、レーザ光１０をリード２の折
れ曲がり部２ｂまで照射しているが、リード２の電子部
品５０の側面から延出している第一の水平部２ｃへレー
ザ光１０による熱が逃げてしまう時間が早くなり、十分
な接合ができないという問題があった。また、プリント
基板６０上に半田３が少ない場合には、この折れ曲がり
部２ｂと第二の水平部２ａとの接続されている部分にバ
ックフィレットが十分に形成されず、プリント基板６０
とリード２との接合強度が低くなってしまうという問題
があった。However, in the conventional mounting method as described above, the laser light 10 is applied to the bent portion 2b of the lead 2, but the lead 2 is extended from the side surface of the electronic component 50. There is a problem in that the heat of the laser light 10 escapes to the existing first horizontal portion 2c in a short time, and sufficient bonding cannot be performed. Further, when the solder 3 is small on the printed circuit board 60, the back fillet is not sufficiently formed in the portion where the bent portion 2b and the second horizontal portion 2a are connected, and the printed circuit board 60 is not formed.
There is a problem that the bonding strength between the lead and the lead 2 is reduced.
【０００４】そこで、本発明は、プリント基板上の半田
が少ない場合においても、接合強度の高い電子部品のレ
ーザ半田付け実装方法を提供することを目的とする。Therefore, it is an object of the present invention to provide a laser soldering mounting method for electronic components having high bonding strength even when the printed circuit board has a small amount of solder.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に、本発明は、電子部品の側面から延出している第一の
水平部と、この第一の水平部に接続され折れ曲がってい
る折れ曲がり部と、この折れ曲がり部に接続されプリン
ト基板に半田を介して接合される第二の水平部とを有す
る電子部品のリードに、レーザ光を照射して半田付けを
する電子部品のレーザ半田付け実装方法において、前記
プリント基板上に接合される前記第二の水平部にレーザ
光を照射する第一の工程と、前記折れ曲がり部にレーザ
光を照射する第二の工程と、前記第一の水平部にレーザ
光を照射する第三の工程と、を有するものである。In order to solve the above-mentioned problems, the present invention provides a first horizontal portion extending from a side surface of an electronic component and a bent portion connected to the first horizontal portion and bent. Laser soldering mounting of an electronic component in which a lead of an electronic component having a portion and a second horizontal portion connected to the bent portion and joined to a printed board via solder is irradiated with laser light for soldering In the method, a first step of irradiating the second horizontal portion bonded to the printed board with laser light, a second step of irradiating the bent portion with laser light, and the first horizontal portion And a third step of irradiating the same with laser light.
【０００６】また、本発明は、電子部品の側面から延出
している第一の水平部と、この第一の水平部に接続され
折れ曲がっている折れ曲がり部と、この折れ曲がり部に
接続されプリント基板に半田を介して接合される第二の
水平部とを有する電子部品のリードに、レーザ光を照射
して半田付けをする電子部品のレーザ半田付け実装方法
において、前記第一の水平部にレーザ光を照射する第一
の工程と、前記折れ曲がり部にレーザ光を照射する第二
の工程と、前記プリント基板上に接合される前記第二の
水平部にレーザ光を照射する第三の工程と、を有するも
のである。According to the present invention, the first horizontal portion extending from the side surface of the electronic component, the bent portion connected to the first horizontal portion and bent, and the printed circuit board connected to the bent portion are provided. A laser soldering mounting method for an electronic component, in which a lead of an electronic component having a second horizontal portion joined via solder is irradiated with a laser beam to perform soldering, a laser beam is provided on the first horizontal portion. A first step of irradiating, a second step of irradiating the bent portion with a laser beam, a third step of irradiating a laser beam to the second horizontal portion bonded on the printed circuit board, Is to have.
【０００７】[0007]
【作用】上記本発明の電子部品のレーザ半田付け実装方
法によれば、プリント基板上に接合されるリードの第二
の水平部にレーザ光を照射する第一の工程と、リードの
折れ曲がり部にレーザを照射する第二の工程と、リード
の第一の水平部にレーザ光を照射する第三の工程とを有
し、或いは、リードの第一の水平部にレーザ光を照射す
る第一の工程と、リードの折れ曲がり部にレーザを照射
する第二の工程と、プリント基板上に接合されるリード
の第二の水平部にレーザ光を照射する第三の工程とを有
するので、例えば狭ピッチの電子部品を少ない半田でプ
リント基板に実装する際においても、バックフィレット
を形成することができ、リードとプリント基板との接合
強度を向上することができる。According to the laser soldering mounting method for electronic parts of the present invention, the first step of irradiating the second horizontal portion of the lead joined to the printed circuit board with the laser beam and the bent portion of the lead are performed. It has a second step of irradiating a laser and a third step of irradiating the first horizontal portion of the lead with laser light, or a first step of irradiating the first horizontal portion of the lead with laser light. Since it has a step, a second step of irradiating the bent portion of the lead with a laser, and a third step of irradiating the second horizontal portion of the lead bonded to the printed board with a laser beam, for example, a narrow pitch Even when the electronic component (1) is mounted on the printed circuit board with a small amount of solder, the back fillet can be formed, and the bonding strength between the lead and the printed circuit board can be improved.
【０００８】[0008]
【実施例】本発明の第一の実施例を図１を参照して説明
する。図１は、第一実施例である電子部品のレーザ半田
付け実装方法を示す図である。なお、従来と同一の機能
を有するものには同一の符号を付すことにより、その詳
細な説明は省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a diagram showing a laser soldering mounting method for an electronic component according to a first embodiment. It should be noted that components having the same functions as those of the related art are designated by the same reference numerals, and detailed description thereof will be omitted.
【０００９】電子部品５０の側面からリード２が延びて
いる。このリード２は、電子部品５０の側面から水平に
延出している第一の水平部２ｃと、この第一の水平部２
ｃよりほぼ垂直方向に折れ曲がっている折れ曲がり部２
ｂと、この折れ曲がり部２ｂより延出し第一の水平部２
ｃと平行であり、プリント基板６０と接合される第二の
水平部２ａとからなる。The lead 2 extends from the side surface of the electronic component 50. The lead 2 includes a first horizontal portion 2c extending horizontally from the side surface of the electronic component 50 and the first horizontal portion 2c.
Bent part 2 that is bent in a direction substantially vertical from c
b and the first horizontal portion 2 extending from the bent portion 2b
The second horizontal portion 2a is parallel to c and is joined to the printed circuit board 60.
【００１０】この電子部品５０をプリント基板６０に実
装する際には、リード２と接合されるパッド（図示せ
ず）にクリーム半田３を塗布し、各パッド上に各リード
２を載置させ、レーザ光１０を用いて実装する。When mounting the electronic component 50 on the printed circuit board 60, cream solder 3 is applied to a pad (not shown) joined to the lead 2 and each lead 2 is placed on each pad. It mounts using the laser beam 10.
【００１１】まず、図１（ａ）に示すように、レーザ光
１０を第二の水平部２ａに照射する。このレーザ光１０
の熱により、第二の水平部２ａ下のクリーム半田３が溶
融し始める。次に、レーザ光１０をリード２の折れ曲が
り部２ｂへ走査させ、図１（ｂ）に示すように折れ曲が
り部２ｂにレーザ光１０を照射する。次に、レーザ光１
０をリード２の第一の水平部２ｃへ走査させ、図１
（ｃ）に示すように、第一の水平部２ｃへレーザ光１０
を照射する。First, as shown in FIG. 1A, the laser beam 10 is applied to the second horizontal portion 2a. This laser light 10
The heat of causes the cream solder 3 under the second horizontal portion 2a to start melting. Next, the bent portion 2b of the lead 2 is scanned with the laser light 10, and the bent portion 2b is irradiated with the laser light 10 as shown in FIG. 1B. Next, laser light 1
0 is scanned onto the first horizontal portion 2c of the lead 2, and
As shown in (c), the laser light 10 is transmitted to the first horizontal portion 2c.
Irradiate.
【００１２】このとき、第一の水平部２ｃも加熱される
ので、クリーム半田３へ熱が伝導し、半田３が溶融す
る。よって、折れ曲がり部２ｂと第二の水平部２ａとの
接続部付近にはバックフィレット３０が形成される。な
お、従来では、第一の水平部２ｃへレーザ光１０を照射
していなかったので、この第一の水平部２ｃへ熱が逃げ
てしまい、その結果、半田３には十分な熱が伝わらず、
折れ曲がり部２ｂと第二の水平部２ａとの接続部にバッ
クフィレットを形成するのは困難であった。At this time, since the first horizontal portion 2c is also heated, heat is conducted to the cream solder 3 and the solder 3 is melted. Therefore, the back fillet 30 is formed near the connecting portion between the bent portion 2b and the second horizontal portion 2a. Note that, in the past, since the laser beam 10 was not applied to the first horizontal portion 2c, heat escapes to the first horizontal portion 2c, and as a result, sufficient heat is not transmitted to the solder 3. ,
It was difficult to form a back fillet at the connection between the bent portion 2b and the second horizontal portion 2a.
【００１３】以上により、第一の水平部２ｃへレーザ光
１０を照射することにより、電子部品５０のリード２と
プリント基板６０との接合強度を高めるバックフィレッ
ト３０を形成することができる。As described above, by irradiating the first horizontal portion 2c with the laser beam 10, it is possible to form the back fillet 30 which enhances the bonding strength between the lead 2 of the electronic component 50 and the printed circuit board 60.
【００１４】なお、第二実施例として、リード２へのレ
ーザ光１０の走査方向を逆にしてもよい。まずリード２
の第一の水平部２ｃにレーザ光１０を照射させ、次に、
折れ曲がり部２ｂに照射し、最後に第二の水平部２ａを
照射してもよい。このときにも、第一実施例と同様にバ
ックフィレット３０が形成されるので、接合強度が高ま
る。As a second embodiment, the scanning direction of the laser beam 10 on the lead 2 may be reversed. First lead 2
The laser beam 10 is irradiated on the first horizontal portion 2c of
It is also possible to irradiate the bent portion 2b and finally irradiate the second horizontal portion 2a. At this time as well, since the back fillet 30 is formed as in the first embodiment, the bonding strength is increased.
【００１５】[0015]
【発明の効果】以上説明したように本発明によれば、プ
リント基板と半田を介して接合されるリードの第二の水
平部にレーザ光を照射する第一の工程と、リードの折れ
曲がり部にレーザ光を照射する第二の工程と、電子部品
の側面から延出しているリードの第一の水平部にレーザ
光を照射する第三の工程とを有し、或いは、電子部品の
側面から延出しているリードの第一の水平部にレーザ光
を照射する第一の工程と、リードの折れ曲がり部にレー
ザ光を照射する第二の工程と、プリント基板と半田を介
して接合されるリードの第二の水平部にレーザ光を照射
する第三の工程とを有するので、例えば狭ピッチの電子
部品を少ない半田でプリント基板に実装する際において
も、バックフィレットを形成することができ、リードと
プリント基板との接合強度を向上することができる。さ
らに、接合強度が高くなるので、歩留りが向上する。As described above, according to the present invention, the first step of irradiating the second horizontal portion of the lead, which is joined to the printed board via the solder, with the laser beam, and the bent portion of the lead It has a second step of irradiating the laser beam and a third step of irradiating the first horizontal portion of the lead extending from the side surface of the electronic component with the laser beam, or extending from the side surface of the electronic component. The first step of irradiating the first horizontal portion of the lead out with laser light, the second step of irradiating the bent portion of the lead with laser light, and the lead of the lead joined to the printed board via solder Since it has a third step of irradiating the second horizontal portion with a laser beam, it is possible to form a back fillet even when mounting a narrow pitch electronic component on a printed circuit board with a small amount of solder, and With printed circuit board It can be improved if strength. Further, since the bonding strength is increased, the yield is improved.
【図１】本発明の第一実施例である実装方法を示す要部
の側面図である。FIG. 1 is a side view of essential parts showing a mounting method according to a first embodiment of the present invention.
【図２】従来の実装方法を示す要部の斜視図である。FIG. 2 is a perspective view of a main part showing a conventional mounting method.
２ リード ２ａ 第二の水平部 ２ｂ 折れ曲がり部 ２ｃ 第一の水平部 ３ 半田 １０ レーザ光 ３０ バックフィレット ５０ 電子部品 ６０ プリント基板 2 lead 2a second horizontal portion 2b bent portion 2c first horizontal portion 3 solder 10 laser light 30 back fillet 50 electronic component 60 printed circuit board
Claims (2)
水平部と、この第一の水平部に接続され折れ曲がってい
る折れ曲がり部と、この折れ曲がり部に接続されプリン
ト基板に半田を介して接合される第二の水平部とを有す
る電子部品のリードに、レーザ光を照射して半田付けを
する電子部品のレーザ半田付け実装方法において、 前記プリント基板上に接合される前記第二の水平部にレ
ーザ光を照射する第一の工程と、 前記折れ曲がり部にレーザ光を照射する第二の工程と、 前記第一の水平部にレーザ光を照射する第三の工程と、 を有することを特徴とする電子部品のレーザ半田付け実
装方法。1. A first horizontal portion extending from a side surface of an electronic component, a bent portion connected to the first horizontal portion and bent, and a printed circuit board connected to the bent portion via solder. A laser soldering mounting method for an electronic component, in which a lead of an electronic component having a second horizontal portion to be joined is irradiated with laser light for soldering, wherein the second horizontal portion is joined to the printed circuit board. A first step of irradiating the portion with laser light, a second step of irradiating the bent portion with laser light, and a third step of irradiating the first horizontal portion with laser light. Laser soldering mounting method for characteristic electronic components.
水平部と、この第一の水平部に接続され折れ曲がってい
る折れ曲がり部と、この折れ曲がり部に接続されプリン
ト基板に半田を介して接合される第二の水平部とを有す
る電子部品のリードに、レーザ光を照射して半田付けを
する電子部品のレーザ半田付け実装方法において、 前記第一の水平部にレーザ光を照射する第一の工程と、 前記折れ曲がり部にレーザ光を照射する第二の工程と、 前記プリント基板上に接合される前記第二の水平部にレ
ーザ光を照射する第三の工程と、 を有することを特徴とする電子部品のレーザ半田付け実
装方法。2. A first horizontal portion extending from a side surface of the electronic component, a bent portion connected to the first horizontal portion and bent, and connected to the bent portion via a solder to a printed circuit board. A laser soldering mounting method for an electronic component, in which a lead of an electronic component having a second horizontal portion to be joined is irradiated with laser light for soldering, wherein a laser beam is emitted to the first horizontal portion. One step, a second step of irradiating the bent portion with laser light, and a third step of irradiating the second horizontal portion bonded to the printed circuit board with laser light, Laser soldering mounting method for characteristic electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5123519A JPH06310846A (en) | 1993-04-27 | 1993-04-27 | Method of laser soldering of electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5123519A JPH06310846A (en) | 1993-04-27 | 1993-04-27 | Method of laser soldering of electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06310846A true JPH06310846A (en) | 1994-11-04 |
Family
ID=14862626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5123519A Withdrawn JPH06310846A (en) | 1993-04-27 | 1993-04-27 | Method of laser soldering of electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06310846A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6983539B2 (en) * | 1995-10-31 | 2006-01-10 | Hewlett-Packard Development Company, L.P. | Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps |
-
1993
- 1993-04-27 JP JP5123519A patent/JPH06310846A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6983539B2 (en) * | 1995-10-31 | 2006-01-10 | Hewlett-Packard Development Company, L.P. | Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000704 |