JPH06295757A - Spigot strip for electronic controller of car - Google Patents
Spigot strip for electronic controller of carInfo
- Publication number
- JPH06295757A JPH06295757A JP6035927A JP3592794A JPH06295757A JP H06295757 A JPH06295757 A JP H06295757A JP 6035927 A JP6035927 A JP 6035927A JP 3592794 A JP3592794 A JP 3592794A JP H06295757 A JPH06295757 A JP H06295757A
- Authority
- JP
- Japan
- Prior art keywords
- section
- connection
- hole
- wiring plate
- plug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、自動車の電子的な制御
装置のための差込条片であって、SMD・組立のために
設けられており、絶縁体内に配置された接点部材を有し
ており、接点部材の接続区分が配線プレートの上面に設
けられた接続部に接続されている形式のものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plug-in strip for an electronic control unit of a motor vehicle, which is provided for SMD assembly and has a contact member arranged in an insulator. The connection section of the contact member is connected to the connection portion provided on the upper surface of the wiring plate.
【0002】[0002]
【従来の技術】自動車の電子的な制御装置の機能範囲の
増大に伴って、制御装置の配線プレート上に組み込まれ
る電子的な構成部材の数及び密度が増大する。従来は構
成部材がその接続区分で組立孔を通して配線プレート内
に差し込まれ、配線プレートの裏面で通常はスウェルは
んだ付け(Schwalloetung)によって配線プレートの導
体路に電気的に接続されると共に機械的に安定的に配線
プレートに固定されており、従ってコストの理由から配
線プレートへの装備は今日次第にSMD・技術によって
行われるようになっている。BACKGROUND OF THE INVENTION With the increasing functional range of electronic vehicle controls, the number and density of electronic components mounted on the wiring boards of the controller increases. In the past, components were plugged into the wiring plate through their assembly holes at their connection sections, and were electrically connected to the conductor tracks of the wiring plate and mechanically stable, usually by swell soldering (Schwalloetung) on the back side of the wiring plate. It is permanently fixed to the wiring plate, and therefore for reasons of cost, the mounting on the wiring plate is increasingly done by SMD technology.
【0003】SMD・技術(surface mounted devices
=面接触組立された構成部材)においては、組立孔を備
えていない配線プレートが用いられる。SMD・技術に
おいては構成部材の接続区分が配線プレートの、圧着さ
れたはんだペーストを備えた特殊な接続面上に載せられ
て、はんだペーストの溶融されるリフローはんだ付け
(Reflow-Loetung)によって接続面に材料接続的に結合
される。SMD technology (surface mounted devices
(= Surface-contact assembled component), a wiring plate having no assembly hole is used. In SMD technology, the connection sections of the components are placed on a special connection surface of the wiring plate with the crimped solder paste, and the connection surface is formed by reflow soldering, which melts the solder paste. Is materially connected to.
【0004】スウェルはんだ付け技術(Schwalloettech
nik)を用いて接点部材の接続区分を配線プレートの組
込孔によって配線プレートに形状接続的に固定する場合
には、接続区分がSMD・技術でもっぱら配線プレート
の表面にはんだ付けによって材料接続的に保持される。Swell soldering technology (Schwalloettech
nik) is used to fix the connection section of the contact member to the wiring plate in a shape-connecting manner by the built-in hole of the wiring plate, the connection section is made by SMD / technique exclusively by soldering on the surface of the wiring plate for material connection. Held in.
【0005】このような結合は機械的な負荷に際して機
能障害を不都合に起こす傾向にあり、それというのは配
線プレートの組立孔内での形状接続の欠陥に基づき機械
的な負荷による力がはんだ付けで受け止められねばなら
ず、はんだ付けはこのような負荷に対して必要な強度を
有していないからである。Such a connection tends to disadvantageously lead to functional failure during mechanical loading, because of the mechanical loading forces caused by soldering due to defects in the form connections within the assembly holes of the wiring plate. This is because soldering does not have the necessary strength for such loads.
【0006】さらに、電子的な制御装置の機能範囲の増
大に伴って差込条片内の差込結合部分の数が増大し、こ
れによって大きな差込力に基づき接点部材の接続区分と
配線プレートの接続面との間の接続部分の機械的な負荷
が増大し、制御装置の故障の傾向が不都合に強まる。Furthermore, as the functional range of the electronic control unit increases, the number of plug-in connection parts in the plug-in strip increases, which makes it possible to connect the contact members with the connecting plate and the wiring plate based on a large plug-in force. This increases the mechanical load on the connection between the connection surface and the connection surface, and undesirably increases the tendency of the controller to fail.
【0007】[0007]
【発明の利点】前記欠点を申し分なく避けるために、本
発明の構成に基づき差込条片の接触部材が固定区分で以
て配線プレートの孔内に挿入されていてそこで、特別な
支持面上に設けられた溶融可能なはんだペースト(Lotp
aste)によって形状接続的に固定されており、その結
果、差込条片に作用する差込力が確実に受け止められ
る。In order to satisfactorily avoid the disadvantages mentioned above, according to the invention, the contact elements of the plug-in strip are inserted into the holes of the wiring plate by means of fixed sections, where there are special support surfaces. Meltable solder paste (Lotp
It is fixed in a shape-connecting manner by means of aste), so that the insertion force acting on the insertion strip can be reliably received.
【0008】本発明の有利な構成が請求項2以下に記載
してある。Advantageous configurations of the invention are described in the subclaims.
【0009】[0009]
【実施例】差込条片12のプラスチックから成る絶縁体
11は端面に、対向ソケット(図示せず)を受容するた
めの受容体13を有している。DESCRIPTION OF THE PREFERRED EMBODIMENT The plastic insulator 11 of the bayonet strip 12 has at its end face a receptacle 13 for receiving a counter socket (not shown).
【0010】絶縁体11内には、扁平プラグとして構成
された多数の接点部材14が埋め込まれている。2列に
配置された接点部材14は差込区分16で以て絶縁体1
1から前方へ受容体13内に突出している。接点部材1
4の他方の端部は絶縁体11から後方へ突出して、引き
込み区分17、接続区分18及び固定区分19を形成し
ている。A large number of contact members 14 configured as flat plugs are embedded in the insulator 11. The contact members 14 arranged in two rows are provided with a plug-in section 16 so that the insulator 1
It protrudes from 1 to the front in the receptor 13. Contact member 1
The other end of 4 projects rearwardly from the insulator 11 and forms a lead-in section 17, a connecting section 18 and a fixed section 19.
【0011】引き込み区分17は絶縁体11の背面から
出発して、最初の部分で所属の差込区分16と同じ方向
に向けられている。引き込み区分17は、配線プレート
22の方向への円弧状の折り曲げ部に続いて絶縁体11
の背面に対して平行に延び、絶縁体11から離れる方向
への別の円弧状の折り曲げ部(湾曲部)で接続区分18
に移行しており、接続区分が差込区分16と同じ方向に
向けられていて配線プレート22の上面21に接触して
いる。孔23の範囲で接続区分18が直角な折り曲げ部
で、孔23内に突入する固定区分19に移行している。
配線プレート22の上面21上で接続区分18がストリ
ップ状の接続部26に接触しており、接続部は接続区分
18で覆われない支持面27によって延ばされている。
支持面27から概略的に示す導体路28が延びており、
導体路は配線プレート22上に組み込まれる構成部材
(図示せず)への電気的な接続を行う。Starting from the rear side of the insulation 11, the lead-in section 17 is oriented in the first part in the same direction as the associated insert section 16. The lead-in section 17 is provided with the insulator 11 after the arc-shaped bent portion in the direction of the wiring plate 22.
Of the connecting section 18 extending in parallel to the back surface of the
The connection section is oriented in the same direction as the insertion section 16 and is in contact with the upper surface 21 of the wiring plate 22. The connecting section 18 is bent at a right angle in the range of the hole 23 and is transferred to the fixed section 19 which projects into the hole 23.
On the upper surface 21 of the wiring plate 22, the connection section 18 is in contact with the strip-shaped connection section 26, which is extended by a support surface 27 which is not covered by the connection section 18.
A conductor track 28, which is schematically shown, extends from the support surface 27,
The conductor tracks make electrical connections to components (not shown) incorporated on the wiring plate 22.
【0012】配線プレート22はSMD−組立のために
構成されている。このために、接続部26及び支持面2
7がはんだ付けの前には配線プレート22への装備に際
してはんだペースト29として存在するはんだでスクリ
ーンプリンティング(Sieb-druckverfahren)によって
厚い層をなして形成されている。はんだペースト29内
に接続区分18が押し込まれ、配線プレート22の所属
の孔23内に差し込まれた固定区分19が支持面27の
はんだペースト29と接続される。Wiring plate 22 is configured for SMD-assembly. For this purpose, the connecting portion 26 and the supporting surface 2
Before soldering, 7 is formed as a thick layer by screen printing (Sieb-druckverfahren) with solder existing as a solder paste 29 when it is mounted on the wiring plate 22. The connection section 18 is pressed into the solder paste 29, and the fixed section 19 inserted into the associated hole 23 of the wiring plate 22 is connected to the solder paste 29 on the support surface 27.
【0013】変化例として固定区分19の後方に保持区
分31を配置してあり、保持区分が配線プレート22
の、接続部26と逆の裏面32に折り曲げによって接触
しており、これによって配線プレート22上に組み込ま
れた接点部材14が付加的に確保される。As a modified example, a holding section 31 is arranged behind the fixed section 19, and the holding section is the wiring plate 22.
The back surface 32 opposite to the connection portion 26 is in contact with it by bending, so that the contact member 14 incorporated on the wiring plate 22 is additionally secured.
【0014】配線プレート22の裏面32は熱導出のた
めの基礎プレート33で覆われており、この場合、基礎
プレート33上に配置された熱伝導性の絶縁層34がゴ
ム若しくは別の絶縁部材から成っている。このような絶
縁層34は通常は閉じたプレートであり、変化例では絶
縁層は基礎プレート33の、配線プレートの孔23に相
対して形成された切欠き36の範囲で中断されていて、
切欠き36の底部37にも設けられている。切欠き36
は保持区分31をそれぞれ半径方向の距離を置いて取り
囲むように規定されている。The back surface 32 of the wiring plate 22 is covered with a base plate 33 for heat dissipation. In this case, the heat conductive insulating layer 34 disposed on the base plate 33 is made of rubber or another insulating member. Made of Such an insulating layer 34 is normally a closed plate, in a variant the insulating layer is interrupted in the region of a notch 36 formed in the base plate 33 facing the hole 23 of the wiring plate,
It is also provided in the bottom portion 37 of the notch 36. Cutout 36
Are defined such that they respectively surround the holding sections 31 at a radial distance.
【0015】接続部26及び支持面27上に設けられた
はんだペースト29が差込条片12の組み込みの後に配
線プレート22上の接点部材14と熱作用で溶着され
る。これによって、一方では接続区分18が所属の接続
部26と材料接続的に結合され、他方でははんだペース
ト29が支持面27から固定区分19に沿って毛管作用
に基づいて所属の孔23内に達する。支持面27上のは
んだペースト29の量は、孔23が完全にはんだで満た
されて、はんだの冷却の後に孔23の壁と固定区分19
との間の安定的な結合が生じるように規定されている。The solder paste 29 provided on the connecting portion 26 and the supporting surface 27 is welded to the contact member 14 on the wiring plate 22 by the thermal action after the insertion strip 12 is assembled. As a result, on the one hand the connecting section 18 is materially connected with the associated connecting portion 26 and, on the other hand, the solder paste 29 reaches from the supporting surface 27 along the fixing section 19 into the associated hole 23 by capillary action. . The amount of solder paste 29 on the support surface 27 is such that the holes 23 are completely filled with solder and, after cooling of the solder, the walls of the holes 23 and the fixed sections 19 are fixed.
It is specified that a stable bond between and occurs.
【0016】はんだ付けの後に、差込条片12は配線プ
レート22上にねじ結合(図示せず)によって保持さ
れ、接点部材14が機械的及び電気的に配線プレート2
2に結合される。After soldering, the bayonet strips 12 are held on the wiring plate 22 by screw connections (not shown), the contact members 14 being mechanically and electrically connected to the wiring plate 2.
Is bound to two.
【0017】差込区分16を対向ソケットに結合する際
に配線プレート22に伝達される差込力は、引き込み区
分17の構造によって、接続区分18と接続部分26と
の間の接点箇所にわずかにしか影響を及ぼさない程度に
減少させられている。このために引き込み区分17は互
いに逆向きの円弧状の折り曲げ部によって伸縮ループの
特性を有しており、このような円弧状の折り曲げ部が内
側への変形によって差込力を減少させる。減少せしめら
れた差込力は、接続区分18の範囲に剪断負荷を生ぜし
めかつ固定区分の範囲に圧縮負荷若しくは引っ張り負荷
を生ぜしめる広い面状のはんだ結合部によって完全に受
け止められる。従って、接続部26と接続区分18との
間のそれぞれの結合部が温度変化に基づく膨張力によっ
て生じる機械的な負荷からも保護される。従って、本発
明に基づく差込条片及びそれに適合せしめられた配線プ
レートによって、SMD・組立技術の利点も接点部材1
4と配線プレート22の接続部との間の機械的な安定性
の利点も得られる。Due to the construction of the pull-in section 17, the plug-in force transmitted to the wiring plate 22 when the plug-in section 16 is connected to the opposite socket is slightly different at the contact point between the connecting section 18 and the connecting section 26. It has been reduced to the extent that it only has an effect. For this reason, the pull-in section 17 has the characteristic of an expansion and contraction loop by the arcuate bent portions that are opposite to each other, and such arcuate bent portions reduce the insertion force by the inward deformation. The reduced plug-in forces are completely taken up by the wide area solder joints which produce a shear load in the area of the connecting section 18 and a compressive or tensile load in the area of the fixed section. Therefore, the respective connection between the connection 26 and the connection section 18 is also protected from the mechanical load caused by the expansion forces due to temperature changes. Therefore, with the plug-in strip according to the invention and the wiring plate adapted to it, the advantages of the SMD / assembly technique are also given.
4 and the connection of the wiring plate 22 with the advantages of mechanical stability.
【図1】本発明に基づく差込条片及び配線プレートの一
部分の断面図。1 is a cross-sectional view of a portion of an insert strip and a wiring plate according to the present invention.
【図2】図1の差込条片及び配線プレートの部分平面
図。FIG. 2 is a partial plan view of the insertion strip and the wiring plate of FIG.
11 絶縁体、 12 差込条片、 13 受容
体、 14 接点部材、 16 差込区分、 1
7 引き込み区分、 18 接続区分、 19 固
定区分、 21 上面、 22 配線プレート、
23 孔、26 接続部、 29 はんだペース
ト、 31 保持区分、 32 裏面、 33
基礎プレート、 34 絶縁層、 36 切欠き、
37底部11 Insulator, 12 Insert Strip, 13 Receptor, 14 Contact Member, 16 Insert Section, 1
7 pull-in section, 18 connection section, 19 fixed section, 21 upper surface, 22 wiring plate,
23 holes, 26 connection portion, 29 solder paste, 31 holding section, 32 back surface, 33
Base plate, 34 insulating layer, 36 notch,
37 bottom
───────────────────────────────────────────────────── フロントページの続き (72)発明者 ラインハルト ファセル ドイツ連邦共和国 オーベラスバッハ ヘ ーベルシュトラーセ 9 (72)発明者 ヘルベルト クリンガー ドイツ連邦共和国 ニュルンベルク バイ ムバッハー ヴェーク 16 アー (72)発明者 ハルトムート ツェーブル ドイツ連邦共和国 フュルト モストシュ トラーセ 25 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Reinhard Fasel Oberusbach Heberstraße Germany 9 (72) Inventor Herbert Klinger Germany Nuremberg Beimbacher Weg 16 Ar (72) Inventor Hartmut Zeble Germany Republic Furth Moststrasse 25
Claims (4)
条片であって、SMD・組立のために設けられており、
絶縁体(11)内に配置された接点部材(14)を有し
ており、接点部材の接続区分(18)が配線プレート
(22)の上面(21)に設けられた接続部(26)に
接続されている形式のものにおいて、接続部(26)が
はんだペーストのための付加的な支持面(27)を備
え、かつ孔(23)を有しており、接点部材(14)の
接続区分(18)が平面で接続部(26)に接触してい
て、少なくとも固定区分(19)で以て延長されてお
り、固定区分が孔(23)内に挿入されて接続部の支持
面(27)のはんだペーストによって孔(23)内に形
状接続的に固定されていることを特徴とする、自動車の
電子的な制御装置のための差込条片。1. A plug strip for an electronic control unit of a motor vehicle, which is provided for SMD assembly.
It has a contact member (14) arranged in an insulator (11), and a connection section (18) of the contact member is connected to a connection portion (26) provided on the upper surface (21) of the wiring plate (22). In the connected form, the connection part (26) is provided with an additional support surface (27) for the solder paste and has holes (23), and the connection section of the contact member (14). The (18) is in plane contact with the connection (26) and is extended by at least the fixed section (19), the fixed section being inserted into the hole (23) and the support surface (27) of the connection. Plug-in strip for an electronic control unit of a motor vehicle, characterized in that it is form-fitted in the hole (23) by means of the solder paste according to (4).
る貫通孔として構成されており、固定区分(19)が保
持区分(31)内へ移行しており、保持区分が孔(2
3)を貫通して配線プレート(22)の、接続部(2
6)と逆の裏面(32)に当てつけられている請求項1
記載の差込条片。2. The hole (23) is configured as a through hole through the wiring plate (22), the fixed section (19) is transferred into the holding section (31), and the holding section is provided with the hole (2).
3) penetrating through the wiring plate (22) and connecting part (2
The back surface (32) opposite to the above (6) is applied.
Insert strips listed.
溶融されるようになっており、この場合に接続区分(1
8)が所属の接続部(26)に電気的に結合され、かつ
支持面27からのはんだペースト(29)の流入によっ
て固定区分(19)が孔(23)内に形状接続的に固定
されている請求項2記載の差込条片。3. The solder paste (29) is adapted to be melted by heating, in which case the connection section (1)
8) is electrically coupled to the associated connection (26), and the fixing section (19) is fixedly fixed in the hole (23) by the inflow of solder paste (29) from the support surface 27. Insert strip according to claim 2.
と対向ソケットに連結可能な同じ方向に向けられた差込
区分(16)との間に引き込み区分(17)を有してお
り、引き込み区分が接続区分(18)及び差込区分(1
6)に対してほぼ垂直に延びており、円弧状の互いに逆
向きの湾曲部を介して一方で差込区分(16)にかつ他
方で接続区分(18)内に移行している請求項1から3
のいずれか1項記載の差込条片。4. Each contact member (14) has a connection section (18).
Has a pull-in section (17) between the same-oriented plug-in section (16) connectable to the opposite socket, the pull-in section having a connecting section (18) and a plug-in section (1).
6) extending substantially perpendicularly to 6) and transitioning into the plug-in section (16) on the one hand and into the connecting section (18) on the other hand via arcuate opposite curves. From 3
Insert strips according to any one of.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4307134A DE4307134C2 (en) | 1993-03-06 | 1993-03-06 | Connector strip for electronic control devices in motor vehicles |
DE4307134.1 | 1993-03-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06295757A true JPH06295757A (en) | 1994-10-21 |
Family
ID=6482154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6035927A Pending JPH06295757A (en) | 1993-03-06 | 1994-03-07 | Spigot strip for electronic controller of car |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH06295757A (en) |
BR (1) | BR9400820A (en) |
DE (1) | DE4307134C2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007234680A (en) * | 2006-02-27 | 2007-09-13 | Kyocera Corp | Electronic circuit board and electronic device |
JP2008198572A (en) * | 2007-02-15 | 2008-08-28 | Denso Corp | Electronic device |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19607014A1 (en) * | 1996-02-24 | 1997-08-28 | Bosch Gmbh Robert | Method of making a composite assembly |
DE19736607C1 (en) * | 1997-08-22 | 1999-07-15 | Dunkel Otto Gmbh | PCB socket |
FR2822598B1 (en) * | 2001-03-21 | 2003-06-20 | Sagem | POWER CONNECTOR FOR PRINTED CIRCUIT |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0279881B1 (en) * | 1987-02-25 | 1989-09-13 | Winchester Electronics Zweigwerk Der Litton Precision Products International Gmbh | Method and connection device for joining a multipole terminal and a printed-circuit board together |
JP2567344Y2 (en) * | 1991-02-08 | 1998-04-02 | 日本エー・エム・ピー株式会社 | Surface mount type electrical connector |
-
1993
- 1993-03-06 DE DE4307134A patent/DE4307134C2/en not_active Expired - Fee Related
-
1994
- 1994-03-04 BR BR9400820A patent/BR9400820A/en not_active IP Right Cessation
- 1994-03-07 JP JP6035927A patent/JPH06295757A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007234680A (en) * | 2006-02-27 | 2007-09-13 | Kyocera Corp | Electronic circuit board and electronic device |
JP4671426B2 (en) * | 2006-02-27 | 2011-04-20 | 京セラ株式会社 | Electronics |
JP2008198572A (en) * | 2007-02-15 | 2008-08-28 | Denso Corp | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
DE4307134C2 (en) | 2002-04-04 |
BR9400820A (en) | 1994-10-11 |
DE4307134A1 (en) | 1994-09-08 |
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