JPH0619201Y2 - Package for microwave equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an improvement of a package that accommodates microwave devices such as an amplifier, a mixer, and an oscillator.

[Conventional technology]

A conventional microwave device package is, for example, Japanese Patent Publication No.
No. 0-43022. As shown in FIG. 5, this microwave device package includes a first dielectric frame 2 surrounding a microwave device on a metallic carrier 1 and a second dielectric frame 3 as a spacer.
And a metallic lid 4 which is a protective plate are sequentially laminated, and as shown in FIG. 6, the input / output metal films 5a and 5b and the bias metal are formed on the surface of the first dielectric frame 2. Membrane 6
a and 6b are arranged, and the input / output metal films 5a and 5b
The input / output terminal and the bias terminal of the microwave device are connected to b and the bias metal films 6a and 6b by wire bonding or the like.

Therefore, the microwave input from the input / output metal films 5a and 5b is constituted by the microstrip line formed on the first dielectric frame 2 and the first dielectric frame 2 and the second dielectric frame 3. Propagate to the input terminal of the micro device through the triplate line. In addition, the output of the microwave device is input / output metal films 5a,
It is taken out of the package from b. The bias metal films 6a and 6b are also applied to the microwave device.
Through the same as above.

[Problems to be solved by the invention]

A large-sized microwave device package having the above structure also has a large dielectric frame itself, and warpage may occur during the manufacturing of the large dielectric frame, which may cause cracks, which makes manufacturing difficult. There was a problem.

It is an object of the present invention to solve this problem and to provide a microwave device package which does not require a large dielectric frame.

[Means for solving problems]

In order to achieve the above-mentioned object, the package for a microwave device of the present invention is provided with recesses of upper openings formed on the surfaces of portions of the first metallic frame 11 facing each other.
A two-layer dielectric substrate composed of a lower-layer dielectric substrate and an upper-layer dielectric substrate is arranged, and a metal film is provided on the lower surface of the lower-layer dielectric substrate,
A frame mounting metal film facing the first metallic frame, a metal film for connecting the package and a metal film for connecting outside the package are provided on the surface of the upper dielectric substrate, and an interlayer metal film is formed on the back surface of the upper dielectric substrate. Is provided, and both side portions of this interlayer metal film are electrically connected to the metal film for connection inside the package and the metal film for connection outside the package through through holes provided in the upper dielectric substrate. A microstrip line is formed by the metal film for connecting inside the package, the metal film for connecting outside the package, and the interlayer metal film, and a triplate line is formed by the metal film for frame attachment, the interlayer metal film, and the back surface metal film. It will be done.

[Action]

Since the microwave device package of the present invention has the above-described configuration and does not include the frame-shaped dielectric frame, the problem that the dielectric frame is cracked does not occur.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is an exploded view of FIG. 1, and FIG. 3 is an exploded perspective view of a two-layer dielectric substrate.

In FIGS. 1 and 2, 1 is a metallic carrier, 4 is a metallic lid, 11 is a first metallic frame surrounding the microwave device, and 12 is a second metallic frame as a spacer. On the surface of the central portion of each side of the frame-shaped first metallic frame 11 placed on the metallic carrier 1, concave portions 13a, 13b, 14a, 14b having openings are provided upward. Two-layer dielectric substrates 17a and 17b in which a lower-layer dielectric substrate 15 and an upper-layer dielectric substrate 16 are stacked are arranged in the recesses 13a and 13b, respectively. The recess 14
Two-layer dielectric substrates 20a and 20b in which a lower-layer dielectric substrate 18 and an upper-layer dielectric substrate 19 are stacked are arranged on a and 14b, respectively. A frame-shaped second metallic frame 12 is mounted on the first metallic frame 11, and a lid 4 is mounted thereon.

The above-mentioned layer dielectric substrates 17a, 17b, 20a, 20b constituting the input / output terminal portion or the bias terminal portion have the metal film constitution M of almost the same constitution. Only FIG. 3 will be described.

In FIG. 3, 21 is a metal film for frame attachment provided on the surface of the upper dielectric substrate 16a so as to face the second metallic frame 12, and 22 and 23 are metal films for frame attachment provided inside and outside the same surface. A metal film for connecting inside the package and a metal film for connecting outside the package which extend in the direction perpendicular to the film, 24 and 24 are through holes provided in the first upper layer dielectric substrate 16a, and 25 is the first upper layer dielectric substrate 16a. An interlayer metal film provided on the back surface so as to bridge the through holes 24, 24, and a back surface metal film 26 provided on the back surface of the first lower dielectric substrate 15a. The in-package connecting metal film 22 and the interlayer metal film 25, and the interlayer metal film 25 and the outside-package connecting metal film 23 are electrically connected through the through holes 24 filled with metal. .

In addition, the above-mentioned metal film structure M is a two-layer dielectric substrate 20a,
Two 20b are installed on both sides.

When assembling the package of this embodiment, the second metallic frame 12 is covered so as to cover the frame mounting metal film 21.
The frame attachment metal film 21 is electrically connected to the first metallic frame 11 via the second metallic frame 12. The back surface metal film 26 is also electrically connected to the first metallic frame 11. Therefore, in this package, a microstrip line is formed by the in-package connecting metal film 22 and the interlayer metal film 25, and the outside-package connecting metal film 23 and the interlayer metal film 25, and the interlayer metal film 25 and the frame attaching metal film 2 are provided.
1, the back plate metal film 26 constitutes a triplate line, the input terminal of the microwave device is connected to the in-package connecting metal film 22, and the microwave is input from the outside-package connecting metal film 23. Is propagated through the microstrip line-triplate line-microstrip line and supplied to the microwave device. On the other hand, the output of the microwave device is output to the outside-package connecting metal film 23 by a route opposite to this.

A perspective view of another embodiment of the present invention is shown in FIG. In this embodiment, four sets of two-layer dielectric substrates 17a and 17b are provided, respectively, and it is characterized in that they can be appropriately assigned to input / output signals or bias supply terminals. Note that the number of two-layer dielectric substrates can be increased.

[Effect of device]

In the microwave device package of the present invention, a two-layer dielectric substrate is arranged in a plurality of recesses provided in the first metallic frame, and the two-layer dielectric substrate is provided with a back surface metal film on the lower surface. A lower-layer dielectric substrate and an upper-layer dielectric substrate laminated on the lower-layer dielectric substrate, and a frame-attaching metal film for electrical connection with the second metallic frame on the upper surface of the upper-layer dielectric substrate. And a metal film for connecting inside the package and a metal film for connecting outside the package are formed, and the metal film for connecting inside the package and the metal film for connecting outside the package are electrically connected to the lower surface of the upper dielectric substrate. Each through hole provided for the purpose of providing an interlayer metal film for electrically connecting the through holes provided between the upper layer dielectric substrate and the lower layer dielectric substrate,
A microstrip line is formed by the metal film for connecting inside the package, a metal film for connecting outside the package, and an interlayer metal film, and a triplate line is formed by the metal film for frame attachment, the interlayer metal film, and the back surface metal film. Therefore, the problem that the dielectric frame having a large frame shape is not required and therefore the frame is broken at the time of manufacturing the dielectric frame is solved, and the package is larger, has high accuracy and durability, and is a microwave device package. There is an effect that it is possible to manufacture a package that sufficiently fulfills the function as. There is also an advantage that the heat radiation and the electromagnetic shield effect are superior to those of the conventional ones.

[Brief description of drawings]

1 is a perspective view of an embodiment of the present invention, FIG. 2 is an exploded view of FIG. 1, FIG. 3 is an exploded perspective view of a two-layer dielectric substrate, and FIG.
FIG. 5 is a perspective view of another embodiment, FIG. 5 is a perspective view of a conventional example, and FIG. 6 is an exploded view of FIG. 1 ... Metal carrier, 4 ... Lid, 11 ... First metal frame, 12 ... Second metal frame, 13a, 13
b, 14a, 14b ... Recessed portion, 15, 18 ... Lower layer dielectric substrate, 16, 19 ... Upper layer dielectric substrate, 17a, 17
b, 20a, 20b ... 2-layer dielectric substrate, 21 ... Frame mounting metal film, 22 ... Package internal connection metal film, 23 ... Package external connection metal film, 24 ... Through hole, 25 ... … Interlayer metal film, 26 …… Backside metal film.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H05K 9/00 L 7128-4E

Claims (1)

[Scope of utility model registration request] 1. A frame-shaped first member which is provided on a metallic carrier and is formed with an upwardly opening recess for fitting a two-layer dielectric substrate which constitutes an input / output terminal portion or a bias terminal portion. What is claimed is: 1. A microwave device package comprising a metallic frame, a small second metallic frame facing the first metallic frame, and a lid covering the second metallic frame, wherein the recess is the first metal. Of the two-layer dielectric substrate, the lower-layer dielectric substrate having a lower surface provided with a back surface metal film, and the upper-layer dielectric substrate laminated on the lower-layer dielectric substrate. A frame attachment metal film for electrical connection with the second metallic frame, a package inner connection metal film, and a package outer connection connection metal film formed on the upper surface of the upper dielectric substrate. Was done In addition, each through hole provided for electrically connecting the metal film for connecting inside the package and the metal film for connecting outside the package and the lower surface of the upper dielectric substrate, the upper dielectric substrate and the lower dielectric substrate, And an interlayer metal film for electrically connecting the through-holes, which is provided between the layers, and the microstrip is formed by the metal film for connection inside the package, the metal film for connection outside the package, and the interlayer metal film. A microwave device package comprising a line and a triplate line comprising a frame mounting metal film, an interlayer metal film and a back surface metal film.