JPH0613499A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To prevent the peeling-off of a pad for outer lead of silicon gel filled type hybrid integrated circuit device. CONSTITUTION:A case material 10 for sealing an integrated circuit element has a frame shape approximately. Inside this outer frame 12, a pair of a wall body 14 is provided for dividing an integrated circuit substrate into an integrated circuit element mounting region 16 and an outer lead fixing region 18. The silicon gel is injected in a sol state to the integrated circuit element region 16 separated by a pair of wall bodies 14, thereafter, it is heat-treated and becomes silicon gel. By a pair of wall bodies for dividing to the integrated circuit element mounting region 16 and the outer lead fixing region 18, the permeation and scattering of silicon sol having high fluidity and permeability to the outer lead fixing region 18 can be prevented, and peeling-off of pad 38 for outer lead caused by the sticking of silicon sol to the outer lead fixing region 18 can be prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a silicon gel-filled hybrid integrated circuit device.

[0002]

2. Description of the Related Art As shown in FIG. 7, a conventional hybrid integrated circuit device has a case member (60) having a substantially box shape and external leads (8).
0), a first insulating metal substrate (70) on which the integrated circuit element (82) and the like are fixed and mounted, and mainly a second insulating metal substrate (90) used for improving the insulating property.

The case member (60) has a wall body (62) which abuts the peripheral portion of the first insulating metal substrate (70). As shown in FIG. 7, the silicon gel introducing hole (6
4) is formed. Further, usually, a step portion is formed at an end portion in the longitudinal direction of the case member (60), and a hole for a screw for coupling the hybrid integrated circuit device to a heat sink (not shown) is formed in the step portion. The case material (60) is obtained by injection molding fiberglass rain hose PET (FRPET), for example.

First and second insulating metal substrates (70)
(90) is approximately 2 mm considering heat dissipation characteristics and workability
Thick aluminum is used and its surface is anodized for improved insulation. First insulating metal substrate (7
Reference numeral 0) is a rectangle, and when the hybrid integrated circuit device is substantially completed, it is divided and pressed from several to ten or more units of the hybrid integrated circuit device substrate to the size of the unit hybrid integrated circuit device. Further, the second insulating metal substrate (90) has substantially the same planar shape as the case member (60), and the adhesive layer (92) for adhering the second insulating metal substrate (90) to the first insulating metal substrate (70) is not shown in the figure. And contributes to insulation between the first insulating metal substrate (70).

The external lead pad (74), the die bond pad (76), the wire bonding pad (78) and the conductive path (not shown) are made of a thermosetting insulating resin having adhesiveness such as polyimide resin and have a thickness of about 35 μm. The clad material with the copper foil is hot-pressed onto the first insulating metal substrate (70) at a temperature of 150 ° C. to 170 ° C. and a pressure of 50 to 100 kg per square centimeter, and then the copper foil is photo-etched into a predetermined pattern. Is formed. The thermosetting insulating resin is completely cured in this hot pressing process to form an insulating layer (72) having a thickness of about 35 μm.

Chip parts are used for semiconductor elements such as the integrated circuit element (82) and other circuit elements, and the integrated circuit element (82) is made of silver paste or the like to form a die bond pad () on the first insulating metal substrate (70). 76) fixed to the chip capacitor or chip resistor, external lead (8
Atypical parts such as 0) are soldered and fixed to predetermined pads. These circuit elements and parts are provided in predetermined pads (74) (7
6) After being temporarily attached to the solder paste screen-printed on (78), it is reflowed and completely fixed. The peripheral portion of the first insulating metal substrate (70) is heat-pressed (125 ° C., 8 ° C.) to the wall body (62) of the case material (60) using an epoxy impregnated polyester non-woven fabric as an adhesive sheet.
Time), and the mounted circuit element is sealed.

[0007]

SUMMARY OF THE INVENTION The present invention is for external leads (80) that are particularly reliable and may occur in silicon gel filled hybrid integrated circuit devices that are subject to special heat cycle tests. This was done in the process of elucidating the cause of the peeling of the pad (74). That is, as a result of the inventor's research, when a hybrid integrated circuit device sealed with a resin case material (60) is subjected to a heat cycle test, the end portion of the case material (60) bends upward as shown by the arrow in FIG. It was known to do. It was also known that this curvature is slight when the thermosetting resin (96) and the first insulating metal substrate (70) are completely fixed to each other.

The adhesive strength between the case material (60) and the thermosetting resin (96) such as epoxy resin filled in the area where the outer leads (80) are fixed is extremely high, whereas the silicone gel (94) and others are very strong. When the silicon gel (94) adheres to the external lead (80) fixing part, the thermosetting resin (96) and the external lead are adhered to each other according to the curvature of the case material (60) because the adhesive strength of the material is low. It was elucidated that (80) was lifted from the first insulating metal substrate (70), and eventually the pad (74) was peeled off.

The reason why the silicon gel (94) adheres to the fixed portion of the external lead (80) is that in the conventional hybrid integrated circuit device, sol-state silicon is injected from the fixed portion of the external lead (80). This is because the silicon sol that wets the outer wall of the injection pipe adheres to the fixed portion of the outer lead (80). Further, since the injected silicon sol has a high fluidity, as shown in FIG. 7, the electrode pattern for the external lead (80) is permeated to wet the fixed part of the external lead (80) with the silicon sol. Furthermore, this is because the silicon sol that scatters when the silicon sol is injected at a high pressure adheres to the external lead (80) fixing portion.

Further, in the conventional hybrid integrated circuit device, since the pair of external leads are led out from the opposite surfaces, it is not possible to simultaneously fill and cure the thermosetting resin for reinforcing the external lead fixing portion. It is possible and has a problem that the manufacturing process is complicated. Therefore, it is a first object of the present invention to provide a highly reliable silicon gel-filled hybrid integrated circuit device which does not cause the peeling of the pad even when a severe heat cycle is applied. Is to provide a hybrid integrated circuit device capable of simultaneously filling and curing a thermosetting resin for reinforcing the external lead fixing portion.

[0011]

[Means for Solving the Problems]
To achieve the object, a hybrid integrated circuit device according to the present invention is an integrated circuit board in which a plurality of integrated circuit elements and external lead terminals are fixedly mounted on a circuit pattern formed on an insulating metal substrate, and the integrated circuit board is provided with the integrated circuit board. A resin having a wall body that is in contact with and surrounds the integrated circuit element mounting area and that divides the boundary with the external lead terminal fixing area, and an outer frame formed on the outer periphery of the wall body and surrounding the external lead terminal fixing area. A case member made of metal, and the wall body is formed lower than the outer frame, and the integrated circuit element mounting region surrounded by the wall body is filled with silicon gel, and the outside of the region surrounded by the outer frame is formed. It is characterized in that a thermosetting resin is filled and laminated on the lead terminal fixing region and the silicon gel.

Further, the hybrid integrated circuit device according to the present invention comprises: an integrated circuit board having a plurality of integrated circuit elements on a circuit pattern formed on an insulating metal substrate and external lead terminals fixed and mounted on at least opposite peripheral end portions; Abutting on the integrated circuit board, surrounding the integrated circuit element mounting area, and
An opening for filling the silicon gel and the thermosetting resin, which has a wall body that divides the boundary with the external lead terminal fixing area and an outer frame that is formed on the outer peripheral portion of the wall body and surrounds the external lead terminal fixing area. And a case body made of resin provided in the same direction, the wall body is formed lower than the outer frame, and the integrated circuit element mounting region surrounded by the wall body is filled with silicon gel, It is characterized in that an epoxy resin is filled and laminated on the external lead terminal fixing area and the silicon gel in the area surrounded by the frame.

[0013]

In the hybrid integrated circuit device configured as described above, the outer lead fixing region of the silicon sol injection pipe is formed by forming the wall body dividing the integrated circuit element mounting region and the outer lead fixing region in the case material. It is possible to avoid the problem that the silicon sol on the outer wall of the silicon sol injection pipe adheres to the external lead fixing area and the problem that the scattered silicon sol adheres to the external lead fixing area by avoiding the approach to.

By forming a wall body that divides the integrated circuit element mounting region and the external lead fixing region in the case material, and forming an opening for filling the silicon gel and the thermosetting resin in a single direction. It is possible to solve the problem of contamination of the external lead fixing portion due to scattering of the silicon sol, and it is possible to perform the injection of the silicon sol and the filling of the thermosetting resin on a single jig.

Further, since the wall of the case material is set to be lower than the outer frame, a thermosetting resin is filled in the outer lead fixing region and the upper part of the silicon gel, and the thermosetting resin filled in the outer lead fixing region is filled. The adhesive force of the resin can prevent peeling of the thermosetting resin due to expansion and contraction and expansion of the silicon gel that occurs during thermal shock.

[0016]

EXAMPLES The present invention will be described below based on the examples shown in FIGS. Referring to FIGS. 1 and 2, an embodiment illustrating a dual in-line package hybrid integrated circuit device includes a pair of walls (14) within an outer frame (12).
The wall body (14) is provided with an insulating metal substrate (30)
A semiconductor material such as a case material (10), an integrated circuit element (46), which divides the upper area into an integrated circuit element mounting area (16) and an external lead fixing area (18), an external lead (44).
A first insulating metal substrate (30) for fixing and mounting etc., a second insulating metal substrate (50) mainly used for improving the insulating property, and a silicon gel filled in an integrated circuit element mounting region (16) (56), a thermosetting resin (58) filled in the upper portion of the silicon gel (56) and the external lead fixing area (18).

The silicon gel (56) filled for improving the weather resistance is provided in a predetermined state in the integrated circuit element mounting region (16) formed by the pair of walls (14) in a sol state by a pump or the like not shown. To the depth of, and heat-treated after the injection to be gelled. According to the present embodiment, at this time, the area of the integrated circuit element mounting area (16) is large, and the integrated circuit element mounting area (16) and the external lead fixing area (1
Because of the wall (14) for separation formed between 8), access to the outer lead fixing region (18) of the silicon sol injection pipe is avoided, and the silicon sol on the outer wall of the silicon sol injection pipe is prevented. There is no problem of attaching to the external lead fixing area (18) or of attaching scattered silicon sol to the external lead fixing area (18).

Then, a thermosetting resin (58) is filled in the upper part of the silicon gel (56) and a pair of external lead fixing regions (18) and heat-treated to complete the structure of FIG.
The present embodiment will be described in more detail with reference to FIGS. The case material (10) is formed in a substantially frame shape as shown in FIG. This case material is formed by injection molding using an insulating resin material such as fiberglass rain hose PET (FRPET).

The case material (10) is a wall body (14) for dividing the external lead fixing area and the integrated circuit element mounting area.
Is provided. The wall (14) is arranged near the external lead terminal fixing pad and is set lower than the outer frame (12). The integrated circuit element mounting region (16) surrounded by the wall body (14) is filled with the silicon gel (56) as described above. Silicon gel (5
When the external lead terminal fixing region (18) surrounded by the outer frame (12) and the silicone gel (56) are filled with a thermosetting resin (58) such as epoxy resin to cover and protect 6), The silicone gel (56) will be completely coated with the thermosetting resin (58). Although the adhesiveness at the interface between the silicone gel (56) and the thermosetting resin (58) is not good, the thermosetting resin (58) does not adhere to the external lead terminal fixing area (18) as described above. Since it is filled, the adhesiveness to the outer frame (12), the wall body (14) and the substrate (30) surface is good, and the two peripheral edge regions facing each other are bonded. , For example, -40 ° C to +
Silicon gel (56) even after heat shock test at 150 ℃
The thermosetting resin (58) and the case material (10) do not separate even when the material expands and contracts.

The bottom surface of the wall (14) is formed so as not to contact the surface of the first insulating metal substrate (30). That is, the case material (10) and the first insulating metal substrate (3
0) is integrated with the wall (14) and the substrate (3).
0) are not in contact with each other, and a space portion having a predetermined interval is formed between them. This space is the external lead terminal (4
The surface of the substrate, on which the lead terminals are not formed, is formed in contact with the case material. The reason why the wall body (14) is not in contact with the first insulating metal substrate (30) is to avoid an adverse effect caused by a solder ball generated when soldering the external lead.

By the way, FIG. 4 shows a first embodiment which is adapted to this embodiment.
It is a perspective view of the insulating metal substrate (30) of FIG. Aluminum having a thickness of about 2 mm is used for the first insulating metal substrate (30) in consideration of heat dissipation characteristics and workability, and the surface thereof is anodized for improving the insulating property. When the hybrid integrated circuit device is substantially completed, the insulating metal substrate (30) is divided and pressed from several to ten or more units of the hybrid integrated circuit substrate into the size of the unit hybrid integrated circuit device.

The external lead pad (38), the wire bonding pad (40), the die bond pad (42) and the conductive path (not shown) are made of a thermosetting insulating resin having adhesiveness such as polyimide resin and have a thickness of approximately 35 μm. A clad material with a copper foil is hot-pressed on the first insulating metal substrate (30) at a temperature of 150 ° C. to 170 ° C. and a pressure of 50 to 100 kg per square centimeter, and then the copper foil is photo-etched into a predetermined pattern. Is formed. The thermosetting insulating resin is completely cured in this hot pressing process to form an insulating layer having a thickness of about 35 μm.

Chip parts are used for semiconductor elements such as the integrated circuit element (46) and other circuit elements, and the integrated circuit element (46) is fixed to the die bond pad (42) with silver paste or the like to form a chip capacitor or Atypical parts such as chip resistors are soldered and fixed to predetermined pads.
These circuit elements are temporarily attached to a screen-printed solder paste on predetermined pads (40) and (42) and then reflowed to be completely fixed.

Finally, the external lead terminals (44) are soldered and fixed to the fixing pads (38). This external lead terminal (44) has about 3 at the tip of the lead terminal (44).
A soldering iron heated to 00 to 350 [deg.] C. is pressed for several seconds to melt the solder previously formed on the pad (38), and the lead terminal (44) is soldered and fixed onto the pad (38).

Referring to FIG. 5, the case member (1
0) and the first insulating metal substrate (30) are overlapped as shown, and the peripheral portion of the first insulating metal substrate (30) and the outer frame (12) of the case material (10) are temporarily made of silicone resin. To be glued. As described above, the silicon sol is injected into the integrated circuit element mounting region (16), and the adhesive resin (57) is interposed in the space formed between the wall body (14) and the substrate (30). Therefore, the silicon sol does not flow out to the external lead fixing region (18). Then, as described above, the area surrounded by the outer frame (12) is filled with the thermosetting resin (58), and the silicon gel (56) is adhered to the substrate (30) by the thermosetting resin (58). The thermosetting resin (5) is coated and expands and contracts due to expansion and contraction of the silicon gel (56) during thermal shock.
8) is not peeled off.

FIG. 6 is a perspective view of a second insulating metal substrate (50) used mainly for improving the insulating property. Second
The insulating metal substrate (50) of the first insulating metal substrate (30)
The same material as that of the case material (10), and the hole (5) at a position corresponding to the hole (22) for the screw coupled to the heat dissipation plate of the case material (10).
4) is formed. The second insulating metal substrate (50) is bonded to the outer frame (12) of the case member (10) by a silicone resin (see reference numeral (52) in FIG. 2). Then, the silicon resin used for this adhesion improves the insulating performance between the first insulating metal substrate (30) and a heat sink (not shown). The second substrate (50) is made of a thermosetting resin (58) filled in the outer frame (12) to form the first substrate (30).
And completely fixed to the case material (10).

In the embodiments described in detail above, the external lead terminals (44) are derived from the opposite sides of the substrate (30), but the present invention is not limited to this. It goes without saying that the same can be achieved even with a type in which external lead terminals are led out from four directions of the substrate (30), for example.

[0028]

As described in detail above, according to the present invention,
Since the case body has a wall that divides the integrated circuit element mounting area and the external lead fixing area, there is little risk of approaching the external lead fixing area of the silicon sol injection pipe, and the silicon sol on the outer wall of the silicon sol injection pipe is fixed to the external lead. The problem of adhesion to the area and the problem that the scattered silicon sol adheres to the external lead fixing area do not occur. As a result, it is possible to provide a highly reliable silicon gel-filled hybrid integrated circuit device which does not cause peeling of the pad even when a severe heat cycle is applied.

Further, according to the present invention, the wall body of the case material is set lower than the outer frame, and the silicon gel filled in the integrated circuit element mounting region in the wall body is filled in the external lead terminal fixing region. By being coated with a thermosetting resin, the thermosetting resin is firmly bonded in the area where the external leads are fixed, so that even if the silicon gel expands and contracts and expands even during extremely severe thermal shock, It does not peel off from the case material. As a result, a highly reliable hybrid integrated circuit device can be provided.

[Brief description of drawings]

FIG. 1 is a perspective view showing the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a perspective view of a case member.

FIG. 4 is a perspective view of a first insulating metal substrate.

FIG. 5 is a perspective view in which a case member and a first metal substrate are integrated.

FIG. 6 is a perspective view showing a second insulating metal substrate.

FIG. 7 is a cross-sectional view showing a conventional example.

[Explanation of symbols]

 10 Case Material 12 Outer Frame 16 Integrated Circuit Element Mounting Area 18 External Lead Fixing Area 30 First Insulating Metal Substrate 32 Insulating Layer 38 External Lead Pad 40 Wire Bonding Pad 42 Die Bond Pad 44 External Lead Terminal 46 Integrated Circuit Element 50 Second Insulating metal substrate 52 Insulating layer 56 Silicon gel 57 Silicon adhesive 58 Thermosetting resin

Claims (2)

[Claims] 1. An integrated circuit board having a plurality of integrated circuit elements and external lead terminals fixed and mounted on a circuit pattern formed on an insulating metal substrate, and abutting on the integrated circuit board,
A resin case material having a wall body that surrounds the integrated circuit element mounting region and divides a boundary with the external lead terminal fixing region, and an outer frame that is formed on an outer peripheral portion of the wall body and surrounds the external lead terminal fixing region. The wall is formed lower than the outer frame, the integrated circuit element mounting region surrounded by the wall is filled with silicon gel, and the outside of the region surrounded by the outer frame is provided. A hybrid integrated circuit device, wherein a thermosetting resin is filled and laminated on the lead terminal fixing region and the silicon gel. 2. An integrated circuit board in which a plurality of integrated circuit elements and external lead terminals are fixedly mounted on at least opposite peripheral end portions on a circuit pattern formed on an insulating metal substrate, and the integrated circuit board is brought into contact with the integrated circuit board. A silicon gel that surrounds the integrated circuit element mounting region and that has a wall that divides the boundary with the external lead terminal fixing region and an outer frame that is formed on the outer periphery of the wall and that surrounds the external lead terminal fixing region; And a case member made of resin provided with openings for filling a thermosetting resin in the same direction, wherein the wall body is formed lower than the outer frame, and the integrated body surrounded by the wall body is formed. A hybrid integrated circuit characterized in that a silicon gel is filled in a circuit element mounting area, and an epoxy resin is filled and laminated on the external lead terminal fixing area in the area surrounded by the outer frame and the silicon gel. Location.