JPH06120384A - Heat transport device - Google Patents
Heat transport deviceInfo
- Publication number
- JPH06120384A JPH06120384A JP26576492A JP26576492A JPH06120384A JP H06120384 A JPH06120384 A JP H06120384A JP 26576492 A JP26576492 A JP 26576492A JP 26576492 A JP26576492 A JP 26576492A JP H06120384 A JPH06120384 A JP H06120384A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- header
- liquid
- headers
- generating member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電子装置の冷却装置に
係り、特に、半導体素子を冷却し所定の温度に保つよう
にした電子回路基板の冷却装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for an electronic device, and more particularly to a cooling device for an electronic circuit board which cools a semiconductor element to maintain a predetermined temperature.
【0002】[0002]
【従来の技術】従来の電子装置は、特開平1−84699号,
特開平2−244748 号公報に記載のように、ヒートパイプ
を発熱部材に接触させ、発熱部材で発生する熱を放熱部
材によって放熱している。また、米国特許4590993 号に
記載のように、多数のダクトの両端にコンテナ部を設
け、中に封入した液体を振動機構によって振動させコン
テナ間で熱輸送させている。2. Description of the Related Art A conventional electronic device is disclosed in JP-A-1-84699,
As described in Japanese Patent Laid-Open No. 2-244748, a heat pipe is brought into contact with a heat generating member, and the heat generated by the heat generating member is radiated by the heat radiating member. Further, as described in US Pat. No. 4,590,933, container parts are provided at both ends of a large number of ducts, and the liquid enclosed therein is vibrated by a vibrating mechanism to transfer heat between the containers.
【0003】[0003]
【発明が解決しようとする課題】上記従来例で特開平2
−244748 号公報の例では、ヒートパイプ自体の柔軟性
が得られず、発熱部材が他の部材とともに狭い空間内に
搭載された装置において、発熱部材と放熱部材とをヒー
トパイプで接続する場合、それらの設置場所が他の部材
の配置状態に大きく左右されたり、発熱部材等の設置場
所を変更するなどの必要があった。また、米国特許4590
993 号の例でも、二つのコンテナ間がダクト構造である
ため、装置内の部材の配置が著しく制限された。一方、
特開平1−84699 号公報の例では、柔軟性を得るため細
管型のヒートパイプを用いた場合、熱輸送量の動作限界
が低いなどの問題があった。このため、熱輸送量増大の
ために複数本を用いても柔軟性が損なわれるなどの問題
もあった。[Patent Document 1] Japanese Unexamined Patent Publication No.
In the example of the −244748 publication, the flexibility of the heat pipe itself cannot be obtained, and in a device in which the heat generating member is mounted in a narrow space together with other members, when the heat generating member and the heat radiating member are connected by the heat pipe, It is necessary to greatly change the installation location of the other members and to change the installation location of the heat generating member and the like. Also, U.S. Pat.
In the case of No. 993 as well, the duct structure between the two containers severely limited the arrangement of members within the equipment. on the other hand,
In the example of Japanese Patent Laid-Open No. 1-84699, there is a problem that the operation limit of the heat transport amount is low when a thin tube heat pipe is used to obtain flexibility. For this reason, there is a problem that flexibility is lost even if a plurality of wires are used to increase the heat transport amount.
【0004】本発明の目的は、発熱部材が他の部材とと
もに狭い空間内に搭載された装置であっても、部材の配
置状態に左右されずに、発熱部材で発生する熱を任意の
場所に設置された放熱部材まで効率良く輸送する熱輸送
デバイスを提供することにある。An object of the present invention is to provide a device in which a heat-generating member is mounted together with other members in a narrow space, and the heat generated by the heat-generating member can be applied to an arbitrary place regardless of the arrangement state of the members. Another object of the present invention is to provide a heat transport device that efficiently transports the heat radiating member installed.
【0005】[0005]
【課題を解決するための手段】上記目的を達成するため
に、本発明の熱輸送デバイスは、発熱部材,放熱部材の
それぞれに接触させた、内部にフィンを有する扁平状の
ヘッダ部材をフレキシブルチューブで接続し、内部に封
入した液を、液駆動機構を設けてヘッダ間で液振動ある
いは液循環させるようにした。In order to achieve the above object, the heat transport device of the present invention includes a flexible tube having a flat header member having fins therein, which is in contact with each of the heat generating member and the heat radiating member. A liquid drive mechanism is provided to oscillate or circulate the liquid, which is connected inside the header, by a liquid drive mechanism.
【0006】[0006]
【作用】熱輸送デバイスは、発熱部材,放熱部材のそれ
ぞれに接触させたヘッダの接続にフレキシブルチューブ
を用いているので、スペースの関係で限定された場所に
設置された放熱部材であっても、発熱部材以外の部材の
配置にかかわらず、それらを避けて接続できる。発熱部
材とヘッダとは熱的に直接接続され、さらに、ヘッダ内
に設けたフィンによって効率良くヘッダ内の液に熱が伝
熱される。液は、ヘッダ間で振動あるいは循環している
ので発熱部材に接続されたヘッダから放熱部材に接続さ
れたヘッダに効率よく熱を輸送する。同様に、放熱部材
側のヘッダも熱的に直接放熱部材に接続されているの
で、輸送された熱は効率よく放熱される。従って、発熱
部材が他の部材とともに狭い空間内に搭載された装置で
あっても、部材の配置状態に左右されずに、発熱部材で
発生する熱を任意の場所に設置された放熱部材まで効率
良く輸送することができ、発熱部材が冷却される。In the heat transport device, since the flexible tube is used to connect the header in contact with each of the heat generating member and the heat radiating member, even if the heat radiating member is installed in a limited place due to space limitations, Regardless of the arrangement of members other than the heat generating member, they can be avoided and connected. The heat generating member and the header are thermally directly connected, and the fins provided in the header efficiently transfer heat to the liquid in the header. Since the liquid vibrates or circulates between the headers, the liquid efficiently transfers heat from the header connected to the heat generating member to the header connected to the heat radiating member. Similarly, since the header on the heat dissipation member side is also thermally connected directly to the heat dissipation member, the transported heat is efficiently dissipated. Therefore, even in a device in which the heat generating member is mounted in a narrow space together with other members, the heat generated by the heat generating member can be efficiently transferred to a heat radiating member installed at an arbitrary location regardless of the arrangement of the members. It can be transported well and the heat generating member is cooled.
【0007】[0007]
【実施例】図1に本発明の実施例を示す。扁平なヘッダ
1,2が複数のフレキシブルチューブ3で接続され、内
部に液体4、例えば、水が封入されている。それぞれの
ヘッダ1,2の内部にはフィン50,51が設けられて
おり、ヘッダ壁より内部の液体に効率よく熱が伝わる。
それぞれのヘッダ1,2は放熱部材,発熱部材に接触な
どの手段によって熱的に接続される。ヘッダの大きさ
は、発熱部材,放熱部材の大きさに応じて任意に設定で
きる。一方のヘッダ1は、液体封入部が二つの部屋に分
けられ、それぞれベロー60,61が設けられている。
一方のベロー60には、駆動機構が取り付けられる。駆
動機構によってベロー60が伸縮し、その体積変化が、
フレキシブルチューブ3,ヘッダ2、さらに、フレキシ
ブルチューブ30を通してヘッダ1内のベロー61を伸
縮させる。結果的に、液体4はヘッダ1とヘッダ2との
間で往復振動する。ここで、ヘッダ1内部の分割された
領域に対応してヘッダ2の内部も2領域に分割されてフ
レキシブルチューブで接続されるが、ヘッダ2ではそれ
ぞれの2領域はヘッダ内部で流通している。駆動機構
は、例えば、ベローに固定された支持部70を中心軸か
らずらして回転軸71に取付け、モータ72によって回
転軸71を回転させベロー支持部70を往復運動させる
ようにしてもよい。また、回転軸の代わりにカム部材を
用い、カム部材を回転させ、直接、ベローを伸縮しても
よい。なお、駆動機構は、ヘッダ外部に設けてもよい。
本実施例により、発熱部材が他の部材とともに狭い空間
内に搭載された装置であって発熱部材,放熱部材の配置
位置が限定されていても、ヘッダの一方、例えば、ヘッ
ダ2を発熱部材に、他方のヘッダ1を放熱部材にそれぞ
れ接触させることによって、部材の配置状態に左右され
ずに、発熱部材で発生する熱を放熱部材まで効率良く輸
送することができ、発熱部材が冷却される。EXAMPLE FIG. 1 shows an example of the present invention. The flat headers 1 and 2 are connected by a plurality of flexible tubes 3, and a liquid 4, for example, water is sealed inside. Fins 50 and 51 are provided inside the headers 1 and 2, respectively, so that heat is efficiently transferred from the header wall to the liquid inside.
The headers 1 and 2 are thermally connected to the heat radiation member and the heat generation member by means such as contact. The size of the header can be arbitrarily set according to the sizes of the heat generating member and the heat radiating member. In one header 1, the liquid sealing portion is divided into two chambers, and bellows 60 and 61 are provided respectively.
A drive mechanism is attached to one of the bellows 60. The bellows 60 expands and contracts by the drive mechanism, and the volume change is
The bellows 61 in the header 1 is expanded and contracted through the flexible tube 3, the header 2 and the flexible tube 30. As a result, the liquid 4 reciprocates between the header 1 and the header 2. Here, the inside of the header 2 is also divided into two regions corresponding to the divided regions inside the header 1 and connected by a flexible tube, but in the header 2, each of the two regions circulates inside the header. For example, the drive mechanism may be configured such that the support portion 70 fixed to the bellows is attached to the rotating shaft 71 while being displaced from the central axis, and the rotating shaft 71 is rotated by the motor 72 to reciprocate the bellows supporting portion 70. Alternatively, a cam member may be used instead of the rotating shaft, and the cam member may be rotated to directly expand and contract the bellows. The drive mechanism may be provided outside the header.
According to the present embodiment, even if the heat generating member is mounted in a narrow space together with other members and the arrangement positions of the heat generating member and the heat radiating member are limited, one of the headers, for example, the header 2 is used as the heat generating member. By bringing the other header 1 into contact with the heat dissipating member, the heat generated in the heat generating member can be efficiently transported to the heat dissipating member without being affected by the arrangement of the members, and the heat generating member is cooled.
【0008】図2に他の実施例を示す。図1に示した実
施例と類似した構成で、扁平なヘッダ1,2が2本のフ
レキシブルチューブ3,30で接続され、内部に液体
4、例えば、水が封入されている。それぞれのヘッダ
1,2の内部にはフィン50,51が設けられており、
ヘッダ壁より内部の液体に効率よく熱が伝わる。それぞ
れのヘッダ1,2は放熱部材,発熱部材に接触などの手
段によって熱的に接続される。ヘッダの大きさは、発熱
部材,放熱部材の大きさに応じて任意に設定できる。そ
れぞれのヘッダ1,2は、液体封入部が二つの部屋に分
けられ、それぞれ、逆止弁80,81が設けられる。一
方のヘッダ1は、二つの部屋のそれぞれにベロー60,
61が設けられ、一方のベロー60には、駆動機構が取
り付けられる。駆動機構によって、ベロー60が縮むと
体積減少に伴う圧力増加で、逆止弁80は閉じ、ヘッダ
2の逆止弁81が開き、ヘッダ1のベロー61が伸び
る。この時、ベローの体積変化分だけ液体がヘッダ1,
フレキシブルチューブ3,ヘッダ2,フレキシブルチュ
ーブ31を通して流れる。さらに、ベロー60が伸びる
と圧力減少によって、逆止弁80,81が逆に作動して
ベロー61が縮み、液体は、ヘッダ1内で移動する。こ
の繰返しで、ベローの伸縮によって、液体がヘッダ1,
2間で循環する。なお、駆動機構は、図1で示した機構
が使える。また、ヘッダの外部に設けてもよい。これに
よって、一方のヘッダに発熱部材を接触させ、フィンを
通して液体に伝えられた熱が、液体の循環によって他方
のヘッダに移動する。従って、他方のヘッダに放熱部材
を取り付けることによって、効果的に放熱できる。各ヘ
ッダは、フレキシブルチューブによって接続されている
ので、部材の配置状態に左右されずに、発熱部材で発生
する熱を放熱部材まで効率良く輸送することができ、発
熱部材が冷却される。FIG. 2 shows another embodiment. With a configuration similar to that of the embodiment shown in FIG. 1, flat headers 1 and 2 are connected by two flexible tubes 3 and 30, and a liquid 4, for example, water is sealed inside. Fins 50 and 51 are provided inside the headers 1 and 2,
Heat is efficiently transferred to the liquid inside from the header wall. The headers 1 and 2 are thermally connected to the heat radiation member and the heat generation member by means such as contact. The size of the header can be arbitrarily set according to the sizes of the heat generating member and the heat radiating member. Each of the headers 1 and 2 has a liquid sealing portion divided into two chambers, and check valves 80 and 81 are provided respectively. One header 1 is a bellows 60 for each of the two rooms,
61 is provided, and a drive mechanism is attached to one of the bellows 60. When the bellows 60 contracts due to the drive mechanism, the check valve 80 is closed, the check valve 81 of the header 2 is opened, and the bellows 61 of the header 1 is extended due to an increase in pressure due to a decrease in volume. At this time, the liquid in the header 1 corresponds to the volume change of the bellows.
It flows through the flexible tube 3, the header 2 and the flexible tube 31. Further, when the bellows 60 extends, the pressure decrease causes the check valves 80 and 81 to operate in reverse, and the bellows 61 contracts, so that the liquid moves in the header 1. By repeating this process, the liquid expands due to the expansion and contraction of the bellows.
Cycle between two. As the drive mechanism, the mechanism shown in FIG. 1 can be used. It may also be provided outside the header. As a result, the heat generating member is brought into contact with one of the headers, and the heat transferred to the liquid through the fins moves to the other header due to the circulation of the liquid. Therefore, heat can be effectively dissipated by attaching the heat dissipating member to the other header. Since the headers are connected by the flexible tube, the heat generated in the heat generating member can be efficiently transported to the heat radiating member without being affected by the arrangement state of the members, and the heat generating member is cooled.
【0009】他の実施例を図3に示す。扁平なヘッダ
1,2が2本のフレキシブルチューブ3,30で接続さ
れ、内部に液体4が封入されている。一方のヘッダ1の
内部に小型のポンプ7を内蔵させ、それぞれのヘッダ間
で液を循環させる。ヘッダの内部にはフィン50,51
が設けられており、ヘッダ壁と液体との熱交換の促進及
び拡大流路を形成している。発熱部材及び放熱部材をそ
れぞれヘッダに接触させることによって、効果的に放熱
できる。各ヘッダは、フレキシブルチューブによって接
続されているので、部材の配置状態に左右されずに、発
熱部材で発生する熱を放熱部材まで効率良く輸送するこ
とができ、発熱部材が冷却される。Another embodiment is shown in FIG. The flat headers 1 and 2 are connected by two flexible tubes 3 and 30, and the liquid 4 is enclosed inside. A small pump 7 is built in one of the headers 1 and liquid is circulated between the headers. Fins 50 and 51 are inside the header
Is provided to form an enlarged flow path and to promote heat exchange between the header wall and the liquid. Heat can be effectively dissipated by bringing the heat generating member and the heat dissipating member into contact with the header. Since the headers are connected by the flexible tube, the heat generated by the heat generating member can be efficiently transported to the heat radiating member without being affected by the arrangement of the members, and the heat generating member is cooled.
【0010】図4に他の実施例を示す。本実施例は、図
1から図3に示した実施例と同様な構成で、放熱側のヘ
ッダ壁を放熱フィン8と一体構造として成形したもので
ある。各ヘッダには、発熱部材11からヘッダ1内部の
液体4への伝熱及び、液体4から放熱器8への伝熱を促
進するためフィン50,51が設けられる。さらに、ヘ
ッダ内には液駆動機構73が備えられ、フレキシブルチ
ューブ3を通してヘッダ間で液が駆動される。ヘッダ間
での液の駆動は、図1で示した往復振動あるいは図2で
示した循環によってもよい。本実施例によれば、放熱器
8とヘッダ壁が一体になっているため、ヘッダから放熱
器への接触熱抵抗が無くなり、効果的な放熱ができる。FIG. 4 shows another embodiment. This embodiment has the same structure as the embodiment shown in FIGS. 1 to 3, and the header wall on the heat dissipation side is formed integrally with the heat dissipation fin 8. Each header is provided with fins 50 and 51 for promoting heat transfer from the heat generating member 11 to the liquid 4 inside the header 1 and heat transfer from the liquid 4 to the radiator 8. Further, a liquid driving mechanism 73 is provided in the header, and liquid is driven between the headers through the flexible tube 3. The liquid may be driven between the headers by the reciprocating vibration shown in FIG. 1 or the circulation shown in FIG. According to this embodiment, since the radiator 8 and the header wall are integrated, contact heat resistance from the header to the radiator is eliminated, and effective heat radiation can be performed.
【0011】図5に他の実施例を示す。本実施例では、
複数のヘッダ2a,2b,2cが共通ヘッダ1にフレキ
シブルチューブ3で接続された構成であり、ヘッダ2
a,2b,2cが発熱部材に、ヘッダ1は放熱部材に接
続される。発熱部材に接続されるヘッダは発熱部材の数
に応じて増減される。各々のヘッダは、前述までの実施
例と同様な構造となっており、ヘッダ1に駆動機構を組
み込み、ヘッダ2a,2b,2cに対して同時に液駆動
するか、あるいは、ヘッダ2a,2b,2cのそれぞれ
に駆動機構を組み込んでもよい。本実施例によれば、複
数の発熱部材が狭い空間内に散在していてもそれぞれの
発熱体を同時に一つの放熱部材で冷却できる。FIG. 5 shows another embodiment. In this embodiment,
A plurality of headers 2a, 2b, 2c are connected to the common header 1 by a flexible tube 3, and the header 2
The a, 2b and 2c are connected to a heat generating member, and the header 1 is connected to a heat radiating member. The number of headers connected to the heat generating members is increased or decreased according to the number of heat generating members. Each of the headers has a structure similar to that of the above-described embodiments, and a driving mechanism is incorporated in the header 1 to drive the headers 2a, 2b, 2c simultaneously with the liquid, or the headers 2a, 2b, 2c. A drive mechanism may be incorporated in each of the above. According to this embodiment, even if a plurality of heat generating members are scattered in a narrow space, each heat generating member can be cooled simultaneously by one heat radiating member.
【0012】本発明の他の実施例を図6に示す。本実施
例は、図1で示した実施例と同様な構成で、扁平形状の
ヘッダ1,2,フレキシブルチューブ3,フィン50,
51,ベロー60,液駆動機構70,71,72等から
なり、液体4が封入されている。ヘッダ2の少なくとも
一つの壁を可とう性フィルム90として、液駆動用のベ
ロー60の体積変化を可とう性フィルム90によって吸
収させたものである。このため、体積変化吸収用のベロ
ーが不要になり、構造の簡略化が図れる。Another embodiment of the present invention is shown in FIG. This embodiment has the same structure as the embodiment shown in FIG. 1, and has flat headers 1 and 2, a flexible tube 3, a fin 50,
51, a bellows 60, liquid drive mechanisms 70, 71, 72 and the like, in which the liquid 4 is enclosed. At least one wall of the header 2 is used as the flexible film 90, and the flexible film 90 absorbs the volume change of the bellows 60 for driving the liquid. Therefore, the bellows for absorbing the volume change are not required, and the structure can be simplified.
【0013】図7に図6に係る他の実施例を示す。図7
では、さらに、両方のヘッダ1,2に可とう性フィルム
91,92を用い、液駆動機構74,75によって液4
を往復振動させる。この時、液駆動機構74,75は、
互いに逆位相の振幅によって、可とう性フィルム91,
92を駆動し、内部の液4を往復振動させる。図7で
は、駆動機構をそれぞれのヘッダに設けた場合を示した
が、駆動機構をどちらか一方のフィルムに、接着などの
手段によって駆動機構の伸縮に応じてフィルムを追従さ
せることにより駆動機構を一つとすることができる。FIG. 7 shows another embodiment according to FIG. Figure 7
Then, further, the flexible films 91 and 92 are used for both the headers 1 and 2, and the liquid 4 is driven by the liquid drive mechanisms 74 and 75.
Oscillate back and forth. At this time, the liquid drive mechanisms 74 and 75 are
Due to the amplitudes of the opposite phases, the flexible film 91,
The liquid 92 inside is driven to reciprocally vibrate. In FIG. 7, the case where the drive mechanism is provided in each header is shown, but the drive mechanism is made to follow one of the films according to the expansion and contraction of the drive mechanism by means of adhesion or the like. Can be one.
【0014】図8に、本発明を電子機器に用いた場合の
実施例を示す。電子機器は、複数の半導体素子を搭載し
た配線基板21,キーボード22,ディスク装置23,
表示装置24などからなる。配線基板21に搭載された
半導体素子のうち、発熱量の特に大きい半導体素子25
にヘッダ2が接続される。半導体素子25とヘッダ2と
はサーマルコンパウンド、あるいは、高熱伝導シリコン
ゴム26などを挟んで接触させ、半導体素子25で発生
する熱を効率よくヘッダ2に伝える。さらに、半導体素
子25に接続されたヘッダ2はフレキシブルチューブ3
によって、表示装置24の背面に取り付けられたヘッダ
1に接続されている。ヘッダ1,2の内部には液体が封
入されており、ヘッダ1の内部、あるいは、外部に設け
た液駆動機構により、ヘッダ間で液が駆動される。液体
の駆動は、ヘッダ間での往復振動、あるいは、循環によ
る。放熱側のヘッダ1は、表示装置24の背面の広い面
積が利用できるので、自然放熱によっても効果的な放熱
が可能となる。また、ヘッダ間はフレキシブルチューブ
によって接続されるので、狭い筐体内に多数の部品が実
装された状態でも、高発熱半導体素子と放熱部分とが容
易に熱的に接続できるので、電子機器の実装構造に左右
されることなく効率的に半導体素子を冷却することがで
きる。FIG. 8 shows an embodiment in which the present invention is applied to an electronic device. The electronic device includes a wiring board 21 having a plurality of semiconductor elements, a keyboard 22, a disk device 23,
The display device 24 and the like are included. Among the semiconductor elements mounted on the wiring board 21, the semiconductor element 25 having a particularly large heat generation amount
The header 2 is connected to. The semiconductor element 25 and the header 2 are brought into contact with each other with a thermal compound or a high thermal conductive silicone rubber 26 sandwiched therebetween to efficiently transfer the heat generated in the semiconductor element 25 to the header 2. Further, the header 2 connected to the semiconductor element 25 has a flexible tube 3
Is connected to the header 1 attached to the back surface of the display device 24. Liquid is sealed in the headers 1 and 2, and the liquid is driven between the headers by a liquid driving mechanism provided inside or outside the header 1. The liquid is driven by reciprocating vibration between headers or circulation. Since the large area on the back surface of the display device 24 can be used for the heat dissipation side header 1, effective heat dissipation can be achieved even by natural heat dissipation. Further, since the headers are connected by the flexible tube, even if a large number of components are mounted in a narrow housing, the high heat generating semiconductor element and the heat radiating portion can be easily thermally connected. The semiconductor element can be cooled efficiently without being affected by the above.
【0015】図9に、本発明を電子機器に用いた場合の
他の実施例を示す。電子機器は、複数の半導体素子を搭
載した配線基板21,キーボード22,ディスク装置2
3,表示装置24などからなる。配線基板21に搭載さ
れた半導体素子のうち、発熱量の特に大きい半導体素子
25にヘッダ2が接続される。半導体素子25とヘッダ
2とはサーマルコンパウンド、あるいは、高熱伝導シリ
コンゴム26などを挟んで接触させ、半導体素子25で
発生する熱を効率よくヘッダ2に伝える。さらに、半導
体素子25に接続されたヘッダ2はフレキシブルチュー
ブ3によって、筐体後部に設けた放熱フィン27に取り
付けたヘッダ1に接続される。なお、放熱フィン27と
ヘッダ1とは一体構造であってもよい。ヘッダ1,2の
内部には液体が封入されており、ヘッダ1の内部、ある
いは、外部に設けた液駆動機構により、ヘッダ間で液が
駆動される。液体の駆動は、ヘッダ間での往復振動、あ
るいは、循環による。放熱フィン27は、ファン28に
よって冷却され、高い放熱性能が得られる。本発明によ
れば、放熱フィン27を筐体内の限られたスペースを利
用して設置しても、フレキシブルチューブによって他の
部材を避けて任意にヘッダ間を接続できるので、装置の
実装状態に左右されることなく高発熱半導体素子と放熱
フィンとを容易に熱的に接続できる。よって、効率的に
半導体素子を冷却することができる。FIG. 9 shows another embodiment in which the present invention is applied to an electronic device. The electronic device includes a wiring board 21 having a plurality of semiconductor elements, a keyboard 22, a disk device 2
3, a display device 24 and the like. Among the semiconductor elements mounted on the wiring board 21, the header 2 is connected to the semiconductor element 25 that generates a particularly large amount of heat. The semiconductor element 25 and the header 2 are brought into contact with each other with a thermal compound or a high thermal conductive silicone rubber 26 sandwiched therebetween to efficiently transfer the heat generated in the semiconductor element 25 to the header 2. Further, the header 2 connected to the semiconductor element 25 is connected by the flexible tube 3 to the header 1 attached to the radiation fin 27 provided on the rear part of the housing. The heat radiation fin 27 and the header 1 may have an integrated structure. Liquid is sealed in the headers 1 and 2, and the liquid is driven between the headers by a liquid driving mechanism provided inside or outside the header 1. The liquid is driven by reciprocating vibration between headers or circulation. The heat radiation fin 27 is cooled by the fan 28, and high heat radiation performance is obtained. According to the present invention, even if the radiating fins 27 are installed in a limited space in the housing, the headers can be arbitrarily connected to each other by avoiding other members by the flexible tube. It is possible to easily and thermally connect the high heat generating semiconductor element and the heat radiation fin without being damaged. Therefore, the semiconductor element can be cooled efficiently.
【0016】[0016]
【発明の効果】本発明によれば、発熱部材が他の部材と
ともに狭い空間内に搭載された装置であっても、部材の
配置状態に左右されずに、発熱部材で発生する熱を任意
の場所に設置された放熱部材まで効率良く輸送すること
ができ、発熱部材を効率よく冷却することができる。According to the present invention, even in a device in which a heat generating member is mounted in a narrow space together with other members, the heat generated by the heat generating member is not affected by the arrangement of the members. The heat dissipating member can be efficiently transported to the heat dissipating member installed in the place, and the heat generating member can be efficiently cooled.
【図1】本発明の一実施例の断面図。FIG. 1 is a sectional view of an embodiment of the present invention.
【図2】本発明の第二の実施例の断面図。FIG. 2 is a sectional view of a second embodiment of the present invention.
【図3】本発明の第三の実施例の断面図。FIG. 3 is a sectional view of a third embodiment of the present invention.
【図4】本発明の第四の実施例の断面図。FIG. 4 is a sectional view of a fourth embodiment of the present invention.
【図5】本発明の第五の実施例の説明図。FIG. 5 is an explanatory diagram of a fifth embodiment of the present invention.
【図6】本発明の第六の実施例の斜視図。FIG. 6 is a perspective view of a sixth embodiment of the present invention.
【図7】本発明の第七の実施例の断面図。FIG. 7 is a sectional view of a seventh embodiment of the present invention.
【図8】本発明の第八の実施例の斜視図。FIG. 8 is a perspective view of an eighth embodiment of the present invention.
【図9】本発明の第九の実施例の斜視図。FIG. 9 is a perspective view of a ninth embodiment of the present invention.
1,2…ヘッダ、3…フレキシブルチューブ、4…冷却
液体、50,51…フィン、60,61…ベロー。1, 2 ... Header, 3 ... Flexible tube, 4 ... Cooling liquid, 50, 51 ... Fins, 60, 61 ... Bellows.
Claims (1)
させ、前記発熱部材で発生する熱を前記放熱部材に輸送
する手段によって前記発熱部材を冷却する装置におい
て、発熱部材並びに放熱部材のそれぞれに接触する扁平
形状の複数のヘッダ、及び、複数のフレキシブルチュー
ブを有し、前記複数のヘッダ間を前記フレキシブルチュ
ーブで接続し、内部に液体を封入し、前記ヘッダ間で液
体を駆動したことを特徴とする熱輸送デバイス。1. A device for cooling a heat-generating member by means of bringing the heat-generating member and the heat-dissipating member into contact with each other and transporting heat generated in the heat-generating member to the heat-dissipating member. Characterized by having a plurality of flat-shaped headers and a plurality of flexible tubes, connecting the plurality of headers with the flexible tube, enclosing a liquid inside, and driving the liquid between the headers. Heat transport device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26576492A JPH06120384A (en) | 1992-10-05 | 1992-10-05 | Heat transport device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26576492A JPH06120384A (en) | 1992-10-05 | 1992-10-05 | Heat transport device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06120384A true JPH06120384A (en) | 1994-04-28 |
Family
ID=17421700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26576492A Pending JPH06120384A (en) | 1992-10-05 | 1992-10-05 | Heat transport device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06120384A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6728102B2 (en) | 2000-09-21 | 2004-04-27 | Kabushiki Kaisha Toshiba | Electronic apparatus including a cooling unit for cooling a heat generating component |
US6983790B2 (en) * | 2003-03-27 | 2006-01-10 | Mitsubishi Denki Kabushiki Kaisha | Heat transport device, semiconductor apparatus using the heat transport device and extra-atmospheric mobile unit using the heat transport device |
US7100678B2 (en) * | 2004-03-18 | 2006-09-05 | Hon Hai Precision Industry Co., Ltd. | Phase-change heat dissipating device and method for manufacturing it |
-
1992
- 1992-10-05 JP JP26576492A patent/JPH06120384A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6728102B2 (en) | 2000-09-21 | 2004-04-27 | Kabushiki Kaisha Toshiba | Electronic apparatus including a cooling unit for cooling a heat generating component |
US6751095B2 (en) | 2000-09-21 | 2004-06-15 | Kabushiki Kaisha Toshiba | Cooling unit including radiator for radiating heat of heat generating component, and electronic apparatus including the cooling unit |
US6920043B1 (en) | 2000-09-21 | 2005-07-19 | Kabushiki Kaisha Toshiba | Electronic apparatus including a circulation path for circulating cooling medium |
US6983790B2 (en) * | 2003-03-27 | 2006-01-10 | Mitsubishi Denki Kabushiki Kaisha | Heat transport device, semiconductor apparatus using the heat transport device and extra-atmospheric mobile unit using the heat transport device |
US7100678B2 (en) * | 2004-03-18 | 2006-09-05 | Hon Hai Precision Industry Co., Ltd. | Phase-change heat dissipating device and method for manufacturing it |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH06266474A (en) | Electronic apparatus equipment and lap top electronic apparatus equipment | |
US7486515B2 (en) | Fluid circulator for fluid cooled electronic device | |
US7031155B2 (en) | Electronic thermal management | |
JPH07142886A (en) | Electronic device cooler | |
TWI243011B (en) | Cooling system or electronic apparatus, and electronic apparatus using the same | |
US7165413B2 (en) | Integrated liquid cooling device with immersed electronic components | |
JP3284585B2 (en) | Electronic equipment cooling device | |
JP4234722B2 (en) | Cooling device and electronic equipment | |
JP2001159931A (en) | Computer | |
JP2004111968A (en) | Heat sink with heat pipe directly brought into contact with component | |
JP2004111969A (en) | Heat sink with angled heat pipe | |
KR20050081815A (en) | Electronic device equipped with liquid cooling system, and radiator and manufacturing method thereof | |
JPH06120384A (en) | Heat transport device | |
JP2009099995A (en) | Refrigerator and electronic apparatus | |
JP2006046868A (en) | Radiator and heat pipe | |
JP4012773B2 (en) | Electronics | |
JPH07286788A (en) | Heat transporting element and electronic instrument employing the element | |
US7162887B2 (en) | Integrated liquid cooling device for electronic components | |
JPH03273669A (en) | Semiconductor device with cooling mechanism | |
JP3598416B2 (en) | Heat transport device for electronic equipment | |
JP2004264806A (en) | Integral body holding apparatus | |
JPH02181957A (en) | Heat sink | |
KR100488104B1 (en) | Plate Radiator Structure of CPU Cooling Module | |
JPH0396261A (en) | Heat-pipe type cooler | |
JP2004146547A (en) | Cooling device for electronic apparatus |