JPH06102593B2 - holder - Google Patents

Description

TECHNICAL FIELD The present invention relates to a holder for a substrate such as a wafer or a target in an apparatus for producing a thin film in a reduced pressure atmosphere.

[Summary of the Invention] The present invention is to braze an electrode plate and a mounting flange to a cylindrical insulating tube in order to cope with an increase in wafer size required for an IC manufacturing apparatus in recent years and ultra high vacuum. With respect to the holder joined by, the airtight sub-flange is provided in the opening of the mounting flange of the holder body so that the inside of the cylinder can be evacuated. By doing so, the atmospheric pressure applied to the back surface of the electrode plate can be removed, the warp of the electrode plate and the leakage / damage of the joint can be eliminated, and the brazing material in each joint can be eliminated by making the inside of the cylinder vacuum. it can.

[Conventional technology]

In the conventional holder, the inside 1b of the back side cylinder of the electrode plate 1 is at atmospheric pressure as shown in FIG.

[Problems to be Solved by the Invention]

Therefore, when the wafer size becomes large (6 ″ or more), the electrode plate is warped due to the pressure difference between the vacuum side in the chamber of the electrode plate and the atmospheric side inside the cylinder of the electrode plate,
Due to the pressure difference, 50
A tensile stress of 0 kg or more was applied, causing leakage and damage at the joint. Furthermore, in order to maintain an ultra-high vacuum, the joints between the electrode plate and the mounting flange and the insulation tube are brazed together, causing leakage and damage to the joints due to the oxidation of the brazing material in the atmosphere side joints due to the heating of the electrode plates. Was occurring. Further, in order to reduce the warp of the electrode plate due to the pressure difference, the electrode plate becomes thick, and the magnetic flux density on the target in the target holder is extremely small.

[Means for Solving the Problems]

In order to solve the above-mentioned problems, this invention seals the mounting flange side of the holder with a sub-flange, provides an exhaust pipe on the sub-flange, and connects it to a vacuum pump so that the inside of the cylinder can be evacuated to a vacuum. .

[Action]

A sub-flange for sealing the inside of the cylinder provided on the side of the mounting flange, and by evacuating the inside of the cylinder of the holder using a vacuum pump, the air inside the cylinder is eliminated to create a vacuum,
The atmospheric pressure on the back of the electrode plate was eliminated. By doing this, the atmospheric pressure applied to the back surface of the electrode plate can be removed, the warp of the electrode plate and the leakage / damage of the joint are eliminated, and the vacuum inside the cylinder does not oxidize the brazing material at each joint, and Since the electrode plate can be made thin, the magnetic flux density on the target can be increased.

〔Example〕

Next, examples of the present invention will be described. FIG. 1 is a vertical sectional view of the whole target holder of the first embodiment according to the present invention. A holder is constituted by the electrode plate 1, the ceramic tube 2, the mounting flange 3 and the sub-flange 12. A ceramic (for example, alumina) tube 2 is brazed and bonded to an electrode plate 1 (which may also serve as an electrostatic chuck) made of copper, stainless steel, molybdenum, or the like. The other end of the ceramic tube 2 is made of stainless steel or the like. The mounting flange 3 is brazed and joined to form a target holder body. The main body of the target holder is fixed to the vacuum chamber frame 13 via a mounting flange 3 with screws. Further flange 3
Includes a sub-flange 12 made of stainless steel or aluminum
Are fixed by screws, and an airtight cylindrical space 1a is formed in the target holder body.

The magnet 14 for generating magnetic flux is fixed to the yoke 15 and fixed to the back surface (on the side of the space 1a) of the electrode plate 1 by the magnet holder 16. The cooling pipe 4 is provided so as to pass through the sub-flange 12 and the yoke 15, and cools the back surface side of the electrode plate 1. The electrode 6 is provided via an insulating bush 7 and an O-ring 8 so that the electrode 6 can penetrate the sub-flange 12 in an airtight manner in an electrically insulated state.

Further, the sub-flange 12 is provided with an exhaust pipe 9 made of stainless steel or aluminum for evacuating the cylindrical space 1a and a leak pipe 10 for introducing a gas such as the atmosphere or an inert gas into the cylindrical space 1a. . With such a structure, when the vacuum chamber 13 is evacuated,
At the same time, the inside of the cylinder of the target holder main body can be evacuated, the stress due to the atmospheric pressure is not generated on the back side of the electrode plate 1, and the inside of the cylinder of the target holder main body can be evacuated.

Next, a second embodiment of the present invention will be described with reference to FIG. The material of the components used for the holder is the same as that shown in FIG. FIG. 2 is an overall vertical cross-sectional view of the wafer susceptor according to the present invention, which includes an electrode plate 1 (which may also serve as an electrostatic chuck), a ceramic tube 2 and a ceramic tube 2 which are brazed to the electrode plate 1. A wafer susceptor body consisting of a mounting flange 3 brazed to the above can be airtightly penetrated to one end of the mounting flange 3 while the electrodes 6, heater electrode 20, temperature sensor 21, etc. are electrically insulated. The insulating bush 7 and the O-ring 8, the exhaust pipe 9 for connecting the inside of the wafer susceptor body cylinder to the vacuum pump, and the leak pipe 10 for connecting the inside of the wafer susceptor body cylinder to the leak pipe, and Sub-flange via O-ring 11 to keep the inside of the cylinder airtight
12 is attached to one end of the mounting flange 3.
With such a structure, when the vacuum chamber 13 is evacuated, the inside of the cylindrical portion of the wafer susceptor body can be evacuated at the same time, and the stress due to the atmospheric pressure is generated on the back side of the electrode plate 1. It has become possible to create a vacuum inside the cylinder of the wafer susceptor body.

〔The invention's effect〕

By using a holder capable of vacuuming the inside of the cylinder by using the sub-flange for vacuuming the inside of the cylinder according to the present invention, since the inside of the holder main body cylinder can be evacuated, the electrode plate warps due to the pressure difference between the front and back of the electrode plate, and the electrode. Prevents leakage damage to the brazed joints of the plates, prevents oxidation of the brazing material at each joint due to heating of parts related to the heater, etc. and the electrode plate. I was able to raise it. In addition, ICs manufactured using this target holder can be manufactured with stable quality because various defect factors caused by the warp and small magnetic flux density of the electrodes or electrostatic chuck are removed. became.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing the whole target holder showing the first embodiment of the present invention, and FIG. 2 is a vertical sectional view showing the whole substrate holder showing the second embodiment, and FIG. The figure is a vertical cross-sectional view showing the entire conventional target holder. 1 ... Electrode plate (may also be used as an electrostatic chuck) 2 ... Ceramic tube 3 ... Mounting flange 4 ... Cooling water pipe 5 ... O-ring 6 ... Electrode 7 ... Insulation bush 8 ... O Ring 9 …… Exhaust pipe 10 …… Leak pipe 11 …… O-ring 12 …… Sub-flange 13 …… Vacuum chamber 14 …… Magnet 15 …… Yoke 16 …… Magnet holder 17 …… Target 18 …… Heater 19… … Substrate 20 …… Heater electrode 21 …… Temperature sensor 22 …… Cooling pipe 23 …… Cooling water cover 24 …… Heater holder 25 …… Reflector

Claims (1)

[Claims] 1. An electrode plate is provided at one end of a cylindrical insulating tube, and a mounting flange is provided at the other end, and a sub-flange is mounted on the lower surface of the mounting flange, and the cylindrical insulating tube is formed by the electrode plate and the sub-flange. A holder characterized in that the inside of a cylinder consisting of the mounting flange and the mounting flange is sealed, an exhaust port communicating with the inside of the cylinder is provided in a part of the sub-flange, and the inside of the cylinder is sucked to form a vacuum.