JPH0582683A - Surface-mounting type electronic component - Google Patents

Abstract

PURPOSE:To provide a surface-mount type electronic component in which thermal or mechanical strain is difficult to transmit through the inside of an electronic component, and which is superior in airtightness and reliability. CONSTITUTION:Lead terminals 11, 12, 13 and 14 are provided on the bottom surface of an electronic component 1, and an adaptor 2 is attached to this bottom surface. The adaptor is made of a resin material, and a plurality of metal terminal plates, being arranged face to face with each other, are implanted in this adaptor. These metal terminal plates are exposed, and adjoin to each other, thereby constituting adjoining sections. The lead terminals 11-14 are connected to these adjoining sections. Otherwise, through-holes may be formed in the lead terminals 11-14, and a guide portion may be formed by cutting the periphery of this through-hole.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a reference oscillation source for communication equipment,
Alternatively, the present invention relates to an electronic component used as a clock source of a microcomputer, and particularly to a thin surface mount electronic component in consideration of mounting on a printed wiring board.

[0002]

2. Description of the Related Art With the miniaturization of electronic equipment, electronic components are required to have a low overall height and to be mounted on a printed wiring board at a high density on the surface thereof, and the mounting can be performed by an automatic machine. Is required. In order to meet this demand, there has been an urgent movement to use lead-less electronic components as chip type. The chip-type electronic component 7 as shown in FIG. 10 can be surface-mounted and has a small volume including the total height, as compared with electronic components such as a crystal oscillator that is hermetically sealed using a metal can. be able to. In addition, 71 and 72 are solders, and 8 is a printed wiring board. A chip-shaped electronic component as shown in FIG. 10 has a lead-out electrode provided on the lower surface thereof, and the lead-out electrode connects to an external electrode such as a printed wiring board. With the flow of automation of the assembly, electro-mechanical joining of electronic components to a printed wiring board is often performed by reflow soldering. With reflow soldering, an appropriate amount of solder is supplied to the joint in advance,
This is a method of soldering by melting the solder with a heat source from the outside.

[0003]

The chip-type electronic component is
A package made of ceramic or the like is used, and generally, it is firmly electro-mechanically bonded to the printed wiring board by solder or the like as described above. However, since it is leadless, it does not have a portion where the shrinkage strain at the time of hardening the solder or the strain due to the deformation of the substrate is alleviated. For example,
Depending on the electronic device, after the chip type electronic component is mounted on the printed wiring board, the deformation of the board may be corrected. In most cases, electronic parts are subjected to a heat cycle test or an aging test in order to secure or confirm the reliability. What is a heat cycle test?
A cycle of 100 ° C. for 30 minutes → 25 ° C. for 3 minutes → -40 ° C. for 30 minutes is repeated several hundred times. However, by repeating such a cycle, the bonding material such as solder expands and contracts. In the case of a chip-type electronic component, it does not have a portion that relaxes strain in these cases, and therefore,
The package on the chip electronic component side may be cracked to reduce the airtightness of the package, or the joint surface with each component may be peeled off, resulting in an unstable conductive state. Further, regarding the airtightness at the time of sealing, in the case of the ceramic package, there are cases where sufficient airtightness cannot be ensured.

The present invention has been made to solve the above problems, and provides a surface mount type electronic component which is difficult to transmit thermal or mechanical strain to the inside of the electronic component and has high airtightness and high reliability. The purpose is.

[0005]

In order to solve the above problems, a surface mount type electronic component according to the present invention comprises a base in which a plurality of lead terminals are insulated and planted in a metal shell.
In a surface mount type electronic component having an adapter having a plurality of metal terminal plates attached to the bottom surface of the electronic component having at least a cap for hermetically sealing by coupling between the base and the metal, the adapter is made of a resin material. , A plurality of pairs of metal terminal boards are planted in parallel with the main surface of this adapter, and the metal terminal boards of each pair are close to each other in the exposed state at the center of the adapter, and the lead terminals are inserted into this close area. It is characterized in that the electronic component and the adapter are integrated by joining. The base and the cap may be joined by a highly reliable sealing method such as resistance welding or cold pressure welding.

As another structure of the present invention, at least a base in which a plurality of lead terminals are insulated and planted in a metal shell, and a cap which is hermetically sealed by being metal-bonded to the base are provided. On the bottom of the electronic parts that we have,
In a surface mount type electronic component having an adapter having a plurality of metal terminal plates attached thereto, the adapter is made of a resin material, a plurality of metal terminal plates are planted in parallel with the main surface of the adapter, and the metal terminal plates are It is exposed at the center of the adapter, and a through hole through which the lead terminal penetrates is provided in this exposed portion, and a notch is provided from this through hole to the periphery of the through hole, and the guide portion having elasticity due to this notch It is possible to cite a structure in which the electronic component and the adapter are integrated by inserting and joining the lead terminal into the through hole.

[0007]

According to the first aspect of the invention, since the electronic component is sealed by metal-to-metal coupling such as resistance welding using a metal base and a cap, airtightness is not impaired, and external It is difficult to transmit mechanical strain from the inside of electronic components. Also, it can be easily surface-mounted with an adapter. The adapter has a structure in which a metal terminal plate is planted in an insulating resin material, and this metal terminal plate has a close portion separated at its center, and at least this close portion is covered with the resin material. Since it is not exposed and the lead terminal is sandwiched at this portion, the lead terminal of the electronic component and the metal terminal plate of the adapter are firmly joined. The base used in the present invention is generally obtained by implanting a plurality of lead terminals in a metal shell insulated with powdered molded glass and firing and molding in this state. In particular, the lead terminal may be displaced from the desired installation position. According to the present invention, since the metal terminal plate is exposed at the center of the adapter, it has flexibility, and since the area of the vicinity of the metal terminal plate can be made large, even if the position of the lead terminal is slightly displaced. , Make sure that the lead terminal and the metal terminal board are in contact with each other.

According to the second aspect of the invention, since the electronic component is sealed by metal-to-metal coupling such as resistance welding using a metal base and a cap, airtightness is not impaired, and external It is difficult to transmit mechanical strain from the inside of electronic components. Also, it can be easily surface-mounted with an adapter. The adapter has a structure in which a metal terminal plate is planted in an insulating resin material. The metal terminal plate has a through hole in the center thereof, the periphery of the through hole is exposed, and a notch connected to the through hole is provided around the through hole, and the guide portion having elasticity by the notch. Since the guide terminal is formed, even if the position of the lead terminal is slightly displaced, even if the guide portion is slightly deformed, the lead terminal is guided to the through hole, and the lead terminal and the metal terminal plate are surely brought into contact with each other.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings, taking a crystal oscillator as an electronic component as an example. First Embodiment FIG. 1 is a perspective view showing a first embodiment of the present invention.
1 is an exploded perspective view of FIG. 1 seen from below, and FIG. 3 is an enlarged view showing a joined state of a lead terminal and a metal terminal plate. The surface mount type crystal oscillator includes a crystal oscillator 1 and an adapter 2 attached to the bottom surface thereof. Crystal oscillator 2
Although not shown, a crystal vibrating piece formed with electrodes and necessary circuit parts are housed in the internal space, and the electrodes pulled out from the vibrating pieces are lead terminals 11, 12, 13, 1.
It is electrically connected to 4. The respective lead terminals are led out downward from the bottom surface of the crystal oscillator 2. The adapter 2 includes a hollow frame body 2a made of a resin material such as polyimide, and metal terminal plates 21, 22, 23, 24, 25, which are provided in parallel with the main surface by penetrating the side surfaces of the frame body.
26, 27 and 28. 21 of these metal terminal boards
And 22, 23 and 24, 25 and 26, 27 and 28 face each other, and the lead terminals 11, 12, 1
They are provided at intervals corresponding to 3, 14. The opposing metal terminal plates are close to each other at a distance slightly smaller than the diameter of the lead terminals 11, 12, 13, and 14, and the proximity portion 3
1, 32, 33, 34 are formed.

As illustrated in FIG. 3, when the lead terminal 11 of the crystal oscillator is press-fitted into the proximity portion 31 of the adapter 2 thus constructed, each tip portion 21 of the metal terminal plate,
22 is slightly bent, and the two are electrically and mechanically connected with the metal terminal plate sandwiching the lead terminal. After that, reinforcement bonding may be performed with a conductive bonding material in order to ensure this bonding. At this time, even when the lead terminal is pressed and displaced from the desired position, one of the metal terminal plates is largely bent, and the lead terminal and the metal terminal plate are joined.

Second and Third Embodiments Second and third embodiments will be described with reference to FIGS. 4 and 5. Both of these figures are plan views of the adapter 4, which is to be mounted on an electronic component for two terminals. As shown in FIG. 4, by making the tip portions of the metal terminal plates 41, 42, 43, 44 opposite to each other concave, the lead terminals are guided to the center of the metal terminal plates, and the lead terminals are more securely clamped. Can be In addition, 4a is a frame. Further, as shown in FIG. 5, by enlarging the area of the tip end portions of the metal terminal plates 51, 52, 53, 54, the lead terminals can be held more securely. Or cut 5 at this tip
You may provide 1a, 52a, 53a, 54a. As a result, the lead terminal can be press-fitted without applying unnecessary stress to the metal terminal plate. In addition, 5a is a frame.

Fourth Embodiment FIG. 6, FIG. 7, FIG. 8 and FIG. 9 are views showing a fourth embodiment of the present invention, and are a plan view, a side view, a bottom view and a main part of a metal terminal plate, respectively. FIG. Surface mount crystal oscillator
Crystal oscillator and adapter 6 attached to the bottom
However, the structure of the crystal oscillator is almost the same as that shown in the first embodiment, and the description thereof will be omitted (however, in the description of this embodiment, the crystal oscillator is for a three-terminal type). ). The adapter 6 is a hollow frame body 6a made of a resin material such as polyimide, and metal terminal plates 61, 62, 6 which penetrate the side faces of the frame body and are provided parallel to the main surface.
3 and 3. These metal terminal plates are provided at intervals corresponding to the lead terminals of the crystal oscillator, and the lead terminal through holes 61a, 62a, 6 are provided near the center in the longitudinal direction thereof.
3a is provided. Further, as illustrated in FIG. 9, H-shaped cuts 611, 621, centering on these through holes.
631 is provided, and the guide portion 61 is formed by this notch.
2, 613, 622, 623, 632, 633 are formed. Reference numeral 64 is a recess into which the crystal oscillator is fitted.

When the lead terminal plate of the crystal oscillator is press-fitted into the through hole of the adapter 6 thus constructed, each guide portion of the metal terminal plate is bent slightly due to its elasticity, and the metal terminal plate holds the lead terminal. The two are electrically and mechanically connected. After that, reinforcement bonding may be performed with a conductive bonding material in order to ensure this bonding. Even if the positions of the lead terminal and the metal terminal plate are not aligned with each other, the elasticity of the guide portion causes the guide portion to bend and guide the lead terminal to the through hole.

[0014]

According to the present invention, since the electronic component is sealed by metal-to-metal coupling such as resistance welding using a metal base and a cap, airtightness is not impaired, and strain from the outside is not generated. Since it is difficult to transmit stress to the inside of electronic components, a highly reliable surface mount type electronic component can be obtained by combining with an adapter.

Particularly, according to the first aspect of the present invention, the adapter has a structure in which a metal terminal plate is embedded in an insulating resin material, and the metal terminal plate is separated at its center and has a proximity portion. Since at least this proximity portion is not covered with the resin material and is exposed and the lead terminal is sandwiched by this portion, the bonding between the lead terminal of the electronic component and the metal terminal plate of the adapter is firm. become. Therefore, a conduction failure or the like does not occur. In addition, even if the lead terminals on the electronic component side are installed on the adapter with a deviation from the predetermined position, the metal terminal board is flexible because it is exposed at the center of the adapter, and the proximity of the metal terminal board Since the area of the portion can be made large, the lead terminal and the metal terminal plate are surely brought into contact with each other, and there is no conduction failure.

Further, according to the invention as set forth in claim 2, even if the lead terminal on the electronic component side is installed on the adapter with a deviation from a predetermined position and the position of the lead terminal is slightly deviated, a metal is used. Since the lead terminal is guided to the through hole of the metal terminal plate due to the existence of the guide portion provided by the cutout of the terminal plate, the lead terminal and the metal terminal plate are surely brought into contact with each other and there is no conduction failure.

[Brief description of drawings]

FIG. 1 is a perspective view showing a surface mount type crystal oscillator according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view of the surface mount crystal oscillator of FIG. 1 seen from below.

FIG. 3 is a diagram showing a joined state of a lead terminal and a metal terminal plate.

FIG. 4 is a sectional view showing a second embodiment.

FIG. 5 is a sectional view showing a third embodiment.

FIG. 6 is a plan view showing a fourth embodiment.

FIG. 7 is a side view of FIG.

FIG. 8 is a bottom view of FIG.

9 is an enlarged view of a main part of FIG.

FIG. 10 is a diagram showing a conventional example.

[Explanation of symbols]

1 Crystal oscillator (electronic component) 2, 4, 5, 6 Adapter 2a, 4a, 5a, 6a Frame body 21, 22, 23, 24, 25, 26, 27, 28, 4
1, 42, 43, 4451, 52, 53, 54, 61,
62, 63 metal terminal plate 31, 32, 33, 34 proximity portion 61a, 62a, 63a through hole

Claims (2)

[Claims] 1. A bottom surface of an electronic component having at least a base having a plurality of lead terminals insulated and planted in a metal shell, and a cap for hermetically sealing by metal-bonding to the base. In the surface-mounted electronic component to which an adapter having a metal terminal plate is attached, the adapter is made of a resin material, and a plurality of pairs of metal terminal plates are planted in parallel with the main surface of the adapter, and each pair of metal terminals. A surface mount type electronic component in which the plates are close to each other in an exposed state at a central portion of the adapter, and the electronic component and the adapter are integrated by inserting and joining the lead terminal in the adjacent portion. 2. A bottom surface of an electronic component having at least a base in which a plurality of lead terminals are insulated and planted in a metal shell, and a cap for hermetically sealing by metal-bonding with the base. In the surface mount type electronic component to which an adapter having a metal terminal plate is attached, the adapter is made of a resin material, a plurality of metal terminal plates are planted in parallel with the main surface of the adapter, and the metal terminal plates are adapters. It is exposed at the central portion, and a through hole through which the lead terminal penetrates is provided in this exposed portion, and a cut is provided from this through hole to the periphery of the through hole, and the guide portion having elasticity is formed by this cut. A surface formed by integrating the electronic component and the adapter by inserting and joining the lead terminal into the through hole. Mounted electronic components.