JPH05251501A - Tab tape - Google Patents

Abstract

PURPOSE:To prevent the electrostatic destruction of a semiconductor device even after the electric test of the semiconductor device is performed. CONSTITUTION:After performing the test of an IC chip 12 by cutting a short- circuit bar 22, conductive tape is adhered on a slit 18 used for cutting the short- circuit bar 22. Thus, each test pad 20 is connected with a short-circuit area 14 by adhering the conductive tape along the slit, and each lead and each electrode of the IC chip 12 are short-circuited each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB tape for mounting a semiconductor device (integrated circuit or IC) on a substrate by using a film carrier.

[0002]

2. Description of the Related Art The TAB method is widely used as one of the methods for mounting an IC chip using a film carrier. The film used in the TAB system is made of, for example, polyimide, and its width is usually 35 mm, 48 mm, or 70 mm. Further, sprocket holes are provided at both edges of the TAB film, and by using these holes, the TAB tape can be accurately fed and wound.

When the IC chip is bonded to the film carrier, the lead wire and the electrode part of the IC chip are superposed on each frame of the film carrier while the film carrier is being sent from the reel, and the bumps are formed in advance through the bumps. The two are joined. In this way, the inner lead bonding (ILB) of the IC chip is performed. According to this method, a large number of electrodes of the IC chip and the lead wires of the film carrier can be bonded together, the processing accuracy is high, and a quick bonding operation is possible.

The T mounted with the IC chip in this manner
There are two subsequent methods for handling AB tape. One is a method of handling by using the reel of TAB tape as it is, and the other is a method of handling by cutting each frame.

FIG. 6 is a diagram showing the former method of processing a TAB tape as it is on a reel. First, in FIG. 6A, inner lead bonding of the IC chip is performed by the bonder 56 while the film carrier 52 delivered from the delivery reel 50 is wound on the take-up reel 54. After that, in FIG. 6B, the reel 54 becomes the delivery reel, and the individual I
The C chip is resin-sealed by potting. Then, as shown in FIG. 6C, each IC chip is tested by the IC tester 58 as needed. In this way, the reel 60 of the TAB tape as shown in FIG. 6D is obtained, and the reel 60 is sent to the step of mounting on the substrate or shipped as it is. According to such a method, there is an advantage that the work is always advanced by feeding and winding by a reel, and the work can be smoothly performed by using this reel even at the stage of mounting on the substrate.

FIG. 7 is a diagram showing the other method,
It shows a method in which the TAB tape is cut into individual frames after IC chip bonding and processed. According to this method, the film carrier 64 delivered from the reel 62 as shown in FIG.
After the C chip is bonded, it is cut into each frame by the cutter 68 and stored in the carrying magazine 70. After that, as shown in FIG. 7B, the IC chip is molded using a molding die 71, and the outside of the IC chip is resin-sealed. Then, it is housed in the carrying magazine 70 again, and in the state of being housed in the carrying magazine 70, it is sent to the mounting process as a separate TAB tape for each frame, or is shipped as it is.

[0007]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention As shown in FIG.
The lead wire 73 of each frame of the AB tape 72 is provided with a test pad 76 for applying a probe when testing the bonded IC chip 74, and the lead wires are short-circuited to each other. By short-circuiting each lead wire in this manner, the entire lead wire can be easily electrically plated with gold, and the bonded IC chip can be connected to the ground to protect it from electrostatic damage. However, when testing the IC chip 74, it is necessary to cut the short circuit between the test pads 76 as shown in FIG. 9 and electrically separate the respective lead wires 73.

By the way, if each lead wire is left in a cut state after the IC chip test is completed, there is still a risk of electrostatic breakdown. Conventionally, in order to prevent such electrostatic breakdown, as shown in FIG. 10, when the TAB tape 78 is wound around a reel, a conductive tape 80 having the same width as the TAB tape is wound together. I am turning. However, in such a method of winding the TAB tape and the conductive tape together, there is a portion where the lead wire of the IC chip and the conductive tape are not completely in contact with each other, and therefore, it is not sufficient to prevent electrostatic breakdown. Is. In addition, this method has a drawback that it is not easy to handle, because two kinds of tapes must be wound at the same time at the time of winding and only the conductive tape needs to be removed at the time of mounting.

Further, as shown in FIG. 6, the entire process from IC chip bonding to IC chip test is carried out on reels.
In the case of using the two reel, a frame in which the copper lead of the TAB tape had a defect, or a defect was found after the test I
The frame to which the C chip is joined is included in the series of TAB tapes as it is. Therefore, if the obtained reel is sent as it is to the step of mounting on the substrate, there is a disadvantage that it is necessary to select and remove only such frames to carry out the mounting work.

On the other hand, in the method of cutting and handling the TAB tape for each frame, a defective frame or a frame to which a defective IC chip is joined may be discarded at the time when it is found. When the process is finished, it is a good IC
There is an advantage that a TAB tape having only chips mounted thereon can be obtained. However, this method is inconvenient when the IC chip is mounted on the board because the TAB tape is independent for each frame. However, there is a drawback in that it costs extra.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a TAB tape in which the semiconductor device is not likely to be electrostatically destroyed even after an electrical test of the semiconductor device. It is a thing.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a long TAB tape containing only good frames.

[0013]

According to a first aspect of the invention for achieving the above object, a large number of lead wires and a short-circuit region having one end thereof commonly connected are formed for each frame, and the leads are provided. In a TAB tape in which a semiconductor device is bonded to a wire, the lead wire is cut, the semiconductor device is electrically isolated from the short-circuit area, an electrical test is performed, and then the cut lead wire is electrically conductively bonded. It is characterized by being electrically connected using a tape.

A second aspect of the present invention for attaining the above object comprises a sprocket hole, a plurality of lead wires and a short-circuit region in which one ends of them are commonly connected are formed, and a semiconductor device is provided on the lead wires. In the joined TAB tapes, each frame on which the semiconductor device is mounted is attached with an adhesive member so that the sprocket holes are continuous in a predetermined shape and at a predetermined interval and the short-circuit regions are electrically connected to each other. It is characterized by being used and joined.

In the second aspect of the invention, the adhesive member is a conductive adhesive tape, and the conductive adhesive tape is used to join the respective frames and to electrically connect the short-circuit areas of the respective frames to each other. desirable. Further, the lead wire may be one in which a portion cut during a test of the semiconductor device is electrically connected by a conductive adhesive tape.

[0016]

According to the first aspect of the present invention, each of the lead wires cut at the time of the electrical test of the semiconductor device can be electrically connected by using the conductive adhesive tape by the above-mentioned structure, and therefore the electrical power of the semiconductor device can be improved. Since the lead wires are kept at the same potential even after the electrical test, the semiconductor device after the electrical test is also resistant to electrostatic breakdown, and by connecting the short-circuit area to the ground, the electrostatic breakdown of the semiconductor device Can be effectively prevented.

According to the second aspect of the present invention, since each frame is joined and formed into a long shape by using the adhesive member according to the above-mentioned structure, only non-defective frames having the semiconductor device can be selected and joined. Moreover, since the short-circuited areas are connected to each other, a TAB tape containing only good IC chips can be obtained, and by connecting the short-circuited area of one of the frames to the ground, it is mounted on all the frames. The semiconductor device can be effectively protected from electrostatic breakdown.

Then, in the second invention, a conductive adhesive tape is used as the adhesive member, the respective frames are joined by the conductive adhesive tape, and the short-circuited areas of the respective frames are electrically connected to each other, whereby the respective frames are electrically connected. Since it is possible to perform the connection of 1 and the connection of the short-circuited areas of each frame at the same time, it is possible to efficiently perform the bonding work of each frame.

Further, in the second invention, the lead wires cut during the test of the semiconductor device are electrically connected by the conductive adhesive tape, so that the semiconductor device is caused by static electricity even after the electrical test of the semiconductor device. Can be effectively prevented from being destroyed.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a part of a single-frame TAB tape on which lead wires and short-circuit areas are formed, and FIG. 2A is a TAB tape cut into individual frames to test a semiconductor device. Is a plan view showing a state in which it is housed in a dedicated slide carrier, FIG. 5B is a side view thereof, and FIGS. 3 to 5 are plan views showing some examples of joining the respective tops with a conductive tape. ..

The TAB tape 10 shown in FIG. 1 is one of a semiconductor device (hereinafter also simply referred to as an IC chip) 12 to which inner leads have been bonded and then cut into individual frames as shown in FIG. Yes, TAB tape 1
The IC chip 12 is bonded to the central portion of 0. A short circuit region 14 made of copper is formed on the outer peripheral portion of the TAB tape 10. The sprocket hole 16 provided in the short-circuited area is for accurately and surely conveying the TAB tape, and corresponds to the standard for movie films. Further, an elongated slit 18 is provided in the inner portion of the short circuit area 14 of the TAB tape 10 in parallel with the short circuit area 14.

The size of each electrode of the bonded IC chip 12 and the distance between the electrodes are very small. However, each electrode is extended to a peripheral portion of each frame of the TAB tape by a large number of copper lead wires 13 formed on the TAB tape 10, and the test pad 20 having a size large enough to apply a test probe 20. It is connected to the. Further, each test pad 20 has a short-circuit area 1 formed by a thin short-circuit bar 22 provided so as to cross the slit 18.
4 is connected. As a result, all the test pads are short-circuited to each other, and the IC chip 12 can be protected from electrostatic damage. If necessary, current can be passed through all the lead wires through the short-circuit area 14, and each lead wire can be plated with gold or the like.

I bonded to the TAB tape 10
To test the C chip 12, each electrode of the IC chip must be electrically independent. Therefore, in this embodiment, the short-circuit bar 22 is cut along the slit 18 provided in the TAB tape 10 with a cutter or the like. The shorting bar 22 is sufficiently thin so that this cutting can be done easily. As a result, the electrodes of the IC chip 12 are easily electrically independent. After that, as shown in FIG. 2, the TAB tape 10 is housed in a dedicated TAB carrier 25, mounted on an IC tester (not shown), and a probe of the IC tester is applied to the test pad 20 so that the IC chip 12 is released.
You can test the behavior of.

After the test is completed, if the short-circuit bar 22 is left in a cut state, the IC chip 12 is still left.
There is a risk of electrostatic damage. Therefore, in the present embodiment, as shown in FIG. 3, the conductive tape 24 is adhered on the short-circuit bar 22 along the slit 18 used for cutting. However, FIG. 3 shows a state in which the TAB tapes of the respective frames are joined to each other to form a long tape shape again as described later. By attaching the conductive tape 24 along the slits in this manner, each test pad 20 is connected to the short-circuit region 14, and each lead wire and the IC chip 12 are connected.
The electrodes of are short-circuited to each other. As a result, since the lead wires are held at the same potential, the semiconductor device after the electrical test is also resistant to electrostatic breakdown, and, for example, the short-circuit region 14
Is connected to the ground, the electrostatic damage of the IC chip 12 can be effectively prevented.

If the TAB tape is cut into individual frames and separated, the following inconveniences occur in the subsequent handling. Therefore, in this embodiment, only the TAB tape of the frame which is determined to be a good product after the IC test is re-bonded. 3-5 illustrate several methods of rebonding TAB tape in this manner.

FIG. 3 shows a method of joining the respective frames 10 of the TAB tape with the conductive tape 26. This TA
As described above, each frame of the B tape is attached with the conductive tape 24 along the slit 18 after cutting the short-circuit bar 22.
The electrodes of the IC chip 12 are short-circuited to each other. Then, the conductive tape 26 for joining the respective frames is attached so as to overlap the short-circuit area 14 of each frame. As a result, all the electrodes of the IC chip bonded to all the frames are short-circuited, and electrostatic damage to the IC chip can be effectively prevented. Here, it should be noted that the respective tops are joined so that the sprocket holes 16 at the joints between the tops are continuous with a predetermined shape and interval.

The TAB tape thus obtained does not include defective pieces and all the bonded IC chips can be mounted on the substrate, so that there is no waste. Further, in the TAB tape of this embodiment, since each frame is joined in a long shape, it is possible to wind the reel and handle it. Therefore, handling is easy and a carrier for transportation is not required. Further, in the conventional TAB tape, it was necessary to wind the conductive tape together to prevent electrostatic breakdown, but according to this embodiment, such troublesome work is not necessary.

In FIG. 4, the conductive tape 26 is not attached only to the joints of the respective pieces of the TAB tape as shown in FIG. 3, but the TAB excluding the sprocket hole and the IC chip is removed.
The case where the conductive tape 30 is attached to the entire tape 28 is shown. According to this method, when each frame is cut separately, the conductive tape 2 is cut along the slit.
Since there is no need to attach No. 4, there is an advantage that one working process can be reduced.

Further, FIG. 5 shows a plurality of types of ICs in one frame.
An example in which a conductive tape 32 is attached to the entire TAB tape 30 to which chips are bonded is shown.

[0030]

As described above, according to the present invention, after the lead wire is cut and the semiconductor device is electrically isolated from the short circuit area, an electrical test is performed, and then the cut lead wire is made conductive. By electrically connecting using an adhesive tape, each lead wire can be completely short-circuited, and thus the semiconductor device can be effectively prevented from being destroyed by static electricity even after an electrical test. Can be provided.

Further, according to the present invention, by bonding the respective pieces on which the semiconductor device is mounted by using the adhesive member so that the sprocket holes are continuous in a predetermined shape and at a predetermined interval,
It is possible to join only good pieces that have passed the test to form a long piece, which makes handling easier in the subsequent processing, and by electrically connecting the short-circuit area, It is possible to completely short-circuit all the electrodes of the bonded semiconductor device, and thus it is possible to provide a TAB tape that can effectively prevent electrostatic breakdown of all the semiconductor devices.

[Brief description of drawings]

FIG. 1 is a single frame T on which a lead wire and a short circuit area are formed.
It is the top view shown about a part of AB tape.

FIG. 2A is a TAB dedicated TAB tape cut into individual pieces for testing a semiconductor device.
FIG. 3B is a plan view showing a state of being housed in a carrier, and FIG.

FIG. 3 is a plan view showing an example of a TAB tape in which the top and the vicinity of the joint between the tops are joined with a conductive tape.

FIG. 4 is a plan view showing an example of a TAB tape in which a conductive tape is bonded to substantially the whole of each frame when bonding each frame.

FIG. 5 is a plan view showing an example of a TAB tape in which a conductive tape is bonded to almost all of each frame when bonding each frame, and a plurality of IC chips are bonded to one frame. is there.

6A to 6D are schematic views showing a method of processing a TAB tape as a reel.

7A and 7B are diagrams showing a method of processing by cutting a TAB tape into individual frames after IC chip bonding and processing.

FIG. 8: TAB with test pads shorted together
It is a schematic plan view of a tape.

FIG. 9 is a schematic plan view of the TAB tape in a state where the short circuit of the test pad is cut.

FIG. 10 is a perspective view schematically showing a method of winding a conductive tape having the same width as the TAB tape together when winding the conventional TAB tape around a reel.

[Explanation of symbols]

 10 TAB tape 12 IC chip 14 short-circuit area 16 sprocket hole 18 slit 20 test pad 22 short-circuit bar 24 conductive tape 26 conductive tape 28 TAB tape 30 TAB tape 32 conductive tape

Claims (4)

[Claims] 1. A TAB tape in which a plurality of lead wires and a short-circuit area in which one end of each lead wire is commonly connected are formed in each frame and a semiconductor device is bonded to the lead wires, and the lead wires are cut. The TAB tape is characterized in that the semiconductor device is electrically isolated from the short-circuited area, an electrical test is performed, and then the cut lead wires are electrically connected using a conductive adhesive tape. 2. A TAB provided with a sprocket hole, a plurality of lead wires and a short-circuit region in which one ends thereof are commonly connected, and a semiconductor device is joined to the lead wires.
In the tape, the tops on which the semiconductor device is mounted are joined using an adhesive member so that the sprocket holes are continuous in a predetermined shape and at a predetermined interval, and the short-circuit regions are electrically connected to each other. TA characterized by
B tape. 3. The TAB tape according to claim 2, wherein the adhesive member is a conductive adhesive tape, the frames are joined by the conductive adhesive tape, and the short-circuit areas of the frames are electrically connected to each other. 4. The TAB according to claim 2 or 3, wherein the lead wires are electrically connected by a conductive adhesive tape at a portion cut during a test of the semiconductor device.
tape.