JPH05259364A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH05259364A JPH05259364A JP4086508A JP8650892A JPH05259364A JP H05259364 A JPH05259364 A JP H05259364A JP 4086508 A JP4086508 A JP 4086508A JP 8650892 A JP8650892 A JP 8650892A JP H05259364 A JPH05259364 A JP H05259364A
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- semiconductor device
- external stress
- deformation
- deformed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置に係り、特
にパッケージ本体から導出されるリード端子の材料に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a material for a lead terminal led out from a package body.
【０００２】[0002]
【従来の技術】従来、半導体装置のリード端子部は、４
２ＡＬＬＯＹ（鉄−ニッケル合金）または、銅合金等を
材料としている。しかし、このような材料をリード端子
部に使用した場合、次のような問題がある。すなわち、
リード端子部に外部応力が加えられて変形したとき、そ
のリード端子部は再度外部応力を加えて成形しなけれ
ば、元の形状に復元することはない。このようにリード
端子が変形された状態で基板に表面実装されれば所定の
接点用ランドに接続されず、導通不良となるなどの問題
がある。2. Description of the Related Art Conventionally, a semiconductor device has four lead terminals.
The material is 2ALLOY (iron-nickel alloy) or copper alloy. However, when such a material is used for the lead terminal portion, there are the following problems. That is,
When an external stress is applied to the lead terminal portion to deform the lead terminal portion, the lead terminal portion cannot be restored to the original shape unless the lead terminal portion is applied with the external stress again to be molded. If the lead terminals are thus surface-mounted on the substrate in a deformed state, there is a problem in that they are not connected to a predetermined contact land and a conduction failure occurs.
【０００３】このような課題を解決するものとして、例
えば、特開平 2−219208号や特開平3−109758号公報に
示すようなものがある。すなわち、これらの公報に記載
の装置は、リード端子部に導電性形状記憶合金を使用し
たものであり、この導電性形状記憶合金は、変形しても
加熱することによって元の形状に復元する特性を有する
ものである。この特性を利用して、半導体装置を基板に
表面実装するときに行うハンダ付けの際の加熱によっ
て、外部応力による変形を元の形状に復元させ、所定の
接点用ランドに接続させている。As a means for solving such a problem, there are, for example, those disclosed in JP-A-2-219208 and JP-A-3-109758. That is, the devices described in these publications use a conductive shape memory alloy in the lead terminal portion, and this conductive shape memory alloy has a characteristic of being restored to its original shape by being heated even if it is deformed. Is to have. By utilizing this characteristic, the deformation due to the external stress is restored to the original shape by heating at the time of soldering when the semiconductor device is surface-mounted on the substrate, and the semiconductor device is connected to a predetermined contact land.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな構成を有する従来例の場合には、次のような問題が
ある。すなわち、形状記憶合金の形状を復元するために
は上述のように加熱してやらなければならない。従っ
て、基板表面への実装前の常温で行われる、例えば、電
気特性試験等においては、リード端子が変形したままの
状態で試験を行わなければならず、正確な試験を行うこ
とができないという問題がある。However, the conventional example having such a structure has the following problems. That is, in order to restore the shape of the shape memory alloy, it has to be heated as described above. Therefore, for example, in an electrical characteristic test, which is performed at room temperature before mounting on the surface of a board, the test must be performed with the lead terminals deformed, and an accurate test cannot be performed. There is.
【０００５】このような場合、試験前に半導体装置を加
熱することにより、元の形状に復元しても、試験を行う
温度まで下げてから試験を行わなければならず、試験工
程が増えることとなり、さらに、その工程中のハンドリ
ングにおいて、元の形状に復元したリード端子に新たな
変形を与える可能性もある。In such a case, even if the semiconductor device is restored to its original shape by heating the semiconductor device before the test, the test must be performed after the temperature is lowered to the test temperature, which increases the number of test steps. Moreover, in the handling during the process, there is a possibility that the lead terminal restored to the original shape may be newly deformed.
【０００６】また、上述のように表面実装の際のハンダ
付け時の加熱を利用して、変形したリード端子の形状を
復元する場合においても、例えば、リード端子の変形
が、図４（ａ）に示すようにパッケージ本体から導出さ
れたリード端子部２ａが隣のリード端子２ｂと接触する
ような状態で変形していた場合、図４（ｂ）のようにま
だ固まっていないハンダを伴って元の形状に復元するこ
ととなり、端子間にハンダ・ブリッジ４を作るという問
題がある。Further, when the deformed shape of the lead terminal is restored by utilizing the heating at the time of soldering in the surface mounting as described above, for example, the deformation of the lead terminal is caused as shown in FIG. 4 (a). As shown in FIG. 4, when the lead terminal portion 2a led out from the package body is deformed so as to come into contact with the adjacent lead terminal 2b, there is still unhardened solder as shown in FIG. There is a problem that the solder bridge 4 is formed between the terminals.
【０００７】本発明は、このような事情に鑑みてなされ
たものであって、外部応力に対するリード端子の変形が
生じにくい半導体装置を提供することを目的とする。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor device in which deformation of the lead terminal due to external stress does not easily occur.
【０００８】[0008]
【課題を解決するための手段】本発明は、このような目
的を達成するために、次のような構成をとる。すなわ
ち、本発明は、パッケージ本体から導出されたリード端
子部が導電性超弾性体合金で形成されたものである。The present invention has the following constitution in order to achieve such an object. That is, in the present invention, the lead terminal portion led out from the package body is formed of a conductive superelastic alloy.
【０００９】[0009]
【作用】本発明の作用は次のとおりである。超弾性体合
金の特性は、外部応力により変形してもその外部応力が
除かれれば、自力で元の形状に復元するものである。The operation of the present invention is as follows. The characteristic of the superelastic alloy is that even if the superelastic alloy is deformed by an external stress, the original shape is restored by itself if the external stress is removed.
【００１０】これを、図３に通常の金属材料、形状記憶
合金、超弾性体合金を比較して説明する。通常の金属材
料では、図３（ａ）に示すように荷重（外部応力）を加
えていき、弾性領域を越えると、除荷しても永久変形が
残ってしまう。また、形状記憶合金では、図３（ｂ）に
示すように弾性領域以上の荷重が加えられた後、除荷し
ても変形が残っており、加熱してやることにより自力で
元の形状に復元する。そして、超弾性体合金では、図３
（ｃ）に示すように弾性領域以上の荷重を加えた後、除
荷すると受けた変形は自力で元の形状に復元する。This will be described in comparison with ordinary metal materials, shape memory alloys, and superelastic alloys in FIG. In a normal metal material, a load (external stress) is applied as shown in FIG. 3A, and if it exceeds the elastic region, permanent deformation remains even after unloading. Further, in the shape memory alloy, as shown in FIG. 3B, after the load in the elastic region or more is applied, the deformation remains even if the load is unloaded, and the shape is restored to the original shape by heating. . And in the case of superelastic alloy,
As shown in (c), when a load in the elastic region or more is applied and then unloading, the received deformation restores to its original shape by itself.
【００１１】半導体装置の変形を受け易いリード端子部
を上述の特性を有する導電性の超弾性体合金をその材料
としてやることにより、何らかの外部応力を受けてもそ
の外部応力が除かれれば自力で元の形状に復元するの
で、リード端子の変形による不都合を除去することがで
きる。By using a conductive superelastic alloy having the above-mentioned characteristics as the material for the lead terminal portion that is easily deformed in the semiconductor device, even if some external stress is applied, the external stress can be removed by itself. Since the original shape is restored by, the inconvenience due to the deformation of the lead terminal can be eliminated.
【００１２】[0012]
【実施例】以下、図面を参照して本発明の一実施例を説
明する。本実施例では、半導体装置の１つであるＱＦＰ
（Quad Flat Package ）について説明する。図１は、本
実施例に係るＱＦＰの外観を示す斜視図である。図中、
１１はパッケージ本体である。パッケージ本体１１の各
側面からは、リード端子１２が導出されている。リード
端子部１２の先端部１２ｂは、基板に表面実装したとき
に基板上の所定の接点ランドにハンダ付けされる接続部
であり、各接続部１２ｂは、同一平面で接続されるよう
にリード端子１２を屈曲成形しておく。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In this embodiment, QFP, which is one of the semiconductor devices, is used.
(Quad Flat Package) is explained. FIG. 1 is a perspective view showing the external appearance of the QFP according to this embodiment. In the figure,
Reference numeral 11 is a package body. The lead terminal 12 is led out from each side surface of the package body 11. The tip portion 12b of the lead terminal portion 12 is a connection portion that is soldered to a predetermined contact land on the board when surface-mounted on the board, and each connection portion 12b is connected to the lead terminal so as to be connected on the same plane. 12 is bent and formed.
【００１３】上述のリード端子１２の材料として、例え
ば、Ni-Ti 、Cu-Al-Ni、Au-Cd 、Ag-Cd 、Cu-Zn-Al、Cu
-Sn 、Fe-Pt 、Fe-Pd 、In-Tl 、Ni-Al 等の超弾性体合
金を使用する。これらの超弾性体合金は、図２に示すよ
うに何らかの外部応力を受けたことにより変形させられ
たときも、外部応力が除かれると自力で元の形状に復元
する特性を有するので、製造工程中のハンドリング等
で、例えば、シューターの側壁にぶつかったり、落下さ
せる等の外部応力が加えられても、リード端子の変形状
態を持続せず、正常な形状の状態で試験を行うことがで
き、また、基板に表面実装したときもリード端子がハン
ダ付けされずに起こる導通不良などを回避することがで
きる。As the material of the above-mentioned lead terminal 12, for example, Ni-Ti, Cu-Al-Ni, Au-Cd, Ag-Cd, Cu-Zn-Al, Cu is used.
-Use superelastic alloys such as Sn, Fe-Pt, Fe-Pd, In-Tl, and Ni-Al. As shown in FIG. 2, these superelastic alloys have the characteristic of recovering their original shape by themselves when the external stress is removed even when they are deformed by being subjected to some external stress. For example, even if external stress such as hitting or dropping the side wall of the shooter is applied by handling inside, the deformed state of the lead terminal does not continue, and the test can be performed in a normal shape state, Further, it is possible to avoid a conduction failure or the like which occurs when the lead terminals are not soldered even when they are surface-mounted on the substrate.
【００１４】なお、本発明は、ＱＦＰに限らず、パッケ
ージ本体からリード端子が導出された各種の半導体装置
に適用することができる。The present invention is not limited to QFP, but can be applied to various semiconductor devices in which lead terminals are led out from the package body.
【００１５】[0015]
【発明の効果】以上の説明から明らかなように、本発明
によれば、リード端子を導電性超弾性体合金で形成した
ので、外部応力によってリード端子が永久変形すること
がなく、リード端子の変形による影響を回避することが
できる半導体装置を実現することができる。As apparent from the above description, according to the present invention, since the lead terminal is formed of the conductive superelastic alloy, the lead terminal is not permanently deformed by external stress, and the lead terminal A semiconductor device that can avoid the influence of deformation can be realized.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明の一実施例に係るＱＦＰの外観を示す斜
視図である。FIG. 1 is a perspective view showing the appearance of a QFP according to an embodiment of the present invention.
【図２】本実施例に係るＱＦＰの特徴的な効果をもたら
す動作を示す図である。FIG. 2 is a diagram showing an operation that brings about a characteristic effect of the QFP according to the present embodiment.
【図３】金属材料の特性を示す図である。FIG. 3 is a diagram showing characteristics of a metal material.
【図４】従来技術によるハンダ・ブリッジの発生を説明
する図である。FIG. 4 is a diagram illustrating generation of a solder bridge according to a conventional technique.
１ パッケージ本体 ２ａ 変形した状態のリード端子部 ２ｂ 正常な形状のリード端子部 ３ ハンダ付け部 ４ ハンダ・ブリッジ １１ パッケージ本体 １２ リード端子部 １２ｂ 接続部 1 Package Main Body 2a Deformed Lead Terminal Section 2b Normal Shaped Lead Terminal Section 3 Solder Attaching Section 4 Solder Bridge 11 Package Body 12 Lead Terminal Section 12b Connection Section
Claims (1)
子部が導電性超弾性体合金で形成されたことを特徴とす
る半導体装置。1. A semiconductor device, wherein a lead terminal portion led out from a package body is formed of a conductive superelastic alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4086508A JPH05259364A (en) | 1992-03-09 | 1992-03-09 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4086508A JPH05259364A (en) | 1992-03-09 | 1992-03-09 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05259364A true JPH05259364A (en) | 1993-10-08 |
Family
ID=13888925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4086508A Pending JPH05259364A (en) | 1992-03-09 | 1992-03-09 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05259364A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100791649B1 (en) * | 1999-01-29 | 2008-01-03 | 사이트라인 테크놀로지스 리미티드 | Propulsion of a probe in the colon using a flexible sleeve |
-
1992
- 1992-03-09 JP JP4086508A patent/JPH05259364A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100791649B1 (en) * | 1999-01-29 | 2008-01-03 | 사이트라인 테크놀로지스 리미티드 | Propulsion of a probe in the colon using a flexible sleeve |
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