JPH051395A - Electrolytic plating method and device therefor - Google Patents
Electrolytic plating method and device thereforInfo
- Publication number
- JPH051395A JPH051395A JP15210091A JP15210091A JPH051395A JP H051395 A JPH051395 A JP H051395A JP 15210091 A JP15210091 A JP 15210091A JP 15210091 A JP15210091 A JP 15210091A JP H051395 A JPH051395 A JP H051395A
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- Prior art keywords
- plating
- tank
- plating solution
- electrode
- plated
- Prior art date
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Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、厚鋼板、中鋼板など、
冷延鋼板のように被めっき材を曲げながら電解めっきを
することができない材料に対してめっきする電解めっき
方法および装置に関する。The present invention relates to thick steel plates, medium steel plates, etc.
The present invention relates to an electrolytic plating method and apparatus for plating a material such as a cold rolled steel sheet that cannot be electrolytically plated while bending a material to be plated.
【0002】[0002]
【従来の技術】従来、厚鋼板、中鋼板など、被めっき材
を曲げながらめっきすることのできない材料に対するめ
っきとしては、溶融亜鉛めっきに代表されるように、大
きなめっき槽に浸漬する方法と、特開平2−18289
3号公報に開示されているようにめっき槽を用いずにペ
ーストめっき液を含浸させた電極パッドによる方法しか
なかった。従って、切断、溶接等の後にめっきをせざる
を得ない。また、ペーストめっきは液めっきに較べてめ
っき能率が劣るとともに電流密度を均一にすることがむ
ずかしいという問題がある。2. Description of the Related Art Conventionally, as a plating method for a material that cannot be plated while bending a material to be plated such as a thick steel plate and a medium steel plate, there is a method of immersing in a large plating tank, as represented by hot dip galvanizing. Japanese Patent Laid-Open No. 2-18289
As disclosed in Japanese Patent Laid-Open No. 3 (1993), there is only a method using an electrode pad which is impregnated with a paste plating solution without using a plating bath. Therefore, plating is unavoidable after cutting and welding. Further, the paste plating has a problem that the plating efficiency is inferior to the liquid plating and it is difficult to make the current density uniform.
【0003】最近では、乾式めっきとして、研掃材周囲
に亜鉛等を付着させ、ブラスティングによるめっき方法
があるが、溶融亜鉛めっき同様、限られためっき金属に
しか適用できない難点がある。Recently, as a dry plating method, there is a plating method in which zinc or the like is attached to the periphery of the abrasive cleaning material, and blasting is used.
【0004】[0004]
【発明が解決しようとする課題】冷延鋼板のめっきは周
知のとおり、鋼板を自由に曲げてめっき液中を通過させ
ると同時に通電させてめっきを行なうことができる。し
かし、厚鋼板、中鋼板などは鋼板を曲げることが不可能
なため、この方法は適用できなかった。現状では、大規
模なめっき槽に浸漬し、低電流密度での能率の低いめっ
き方法にたよらざるを得ない。As is well known in the field of plating of cold-rolled steel sheets, the steel sheets can be freely bent and passed through a plating solution while at the same time being energized. However, this method cannot be applied to thick steel plates, medium steel plates, and the like because it is impossible to bend the steel plates. At present, there is no choice but to rely on a low-efficiency plating method at a low current density by immersing it in a large-scale plating tank.
【0005】本発明は、これらの厚鋼板、中鋼板など
を、曲げることなく処理し、高能率、かつ高品質のめっ
きを得ることができる、電解めっき方法および装置を提
供するものである。The present invention provides an electrolytic plating method and apparatus capable of treating these thick steel plates, medium steel plates and the like without bending to obtain high efficiency and high quality plating.
【0006】[0006]
【課題を解決するための手段】本発明は、厚鋼板、中鋼
板など、被めっき材を曲げてめっきすることのできない
材料についてめっきを可能としたものである。The present invention makes it possible to plate a material such as a thick steel plate and a medium steel plate that cannot be plated by bending a material to be plated.
【0007】すなわち、上記目的を達成するために本発
明の第1の態様によれば、屈曲不能な被めっき材を水平
にめっき槽内のめっき液中に浸漬し、前記被めっき材上
面に電極を対向させてめっき液を循環させつつ電解めっ
きする電解めっき方法であって、前記被めっき材と前記
電極との間に循環中に加温されためっき液を噴出させる
と共に前記めっき槽内のめっき液面を前記電極面よりも
上方に保持し、前記電極を水平移動させてめっきするこ
とを特徴とする電解めっき方法が提供される。That is, according to the first aspect of the present invention, in order to achieve the above object, the inflexible material to be plated is horizontally immersed in the plating solution in the plating bath to form an electrode on the upper surface of the material to be plated. Is a method of electrolytic plating in which the plating solution is circulated by facing each other while the plating solution is circulated between the material to be plated and the electrode while the plating solution is being circulated. There is provided an electrolytic plating method characterized in that a liquid surface is held above the electrode surface and the electrode is horizontally moved for plating.
【0008】また、本発明の第2の態様によれば、めっ
き槽、予備槽および電極ユニットを有して構成され、め
っき液を循環して屈曲不能な被めっき材をめっきする電
解めっき装置であって、前記めっき槽は被めっき材を水
平に装入可能であり、前記予備槽は前記めっき槽に連通
して設けられめっき槽内から流入するめっき液を加熱、
撹拌するためのヒーターおよび撹拌機を有し、前記電極
ユニットは前記被めっき材上面に対向して電極板を有す
ると共にめっき液を加熱するための加熱装置と加熱され
ためっき液を前記被めっき材と電極板との間に噴出する
手段とを有して水平移動可能に配設され、前記めっき
槽、前記予備槽および電極ユニットの間にめっき液を循
環させるための循環系を有することを特徴とする電解め
っき装置が提供される。Further, according to the second aspect of the present invention, there is provided an electrolytic plating apparatus having a plating tank, a preliminary tank and an electrode unit, for circulating a plating solution to plate an inflexible material to be plated. There, the plating tank is capable of horizontally loading the material to be plated, and the preliminary tank is provided in communication with the plating tank and heats the plating solution flowing from the plating tank,
The electrode unit has a heater and an agitator for stirring, the electrode unit has an electrode plate facing the upper surface of the material to be plated, and a heating device for heating the plating solution and the heated plating solution are the material to be plated. And a means for ejecting between the electrode plate and the electrode plate so as to be horizontally movable, and having a circulation system for circulating a plating solution between the plating tank, the auxiliary tank and the electrode unit. An electrolytic plating apparatus is provided.
【0009】以下に本発明をさらに詳細に説明する。The present invention will be described in more detail below.
【0010】まず、本発明の第1の態様を図1および図
2を参照しながら説明する。以下の説明では被めっき材
として厚鋼板(以下、単に鋼板という)を代表例とする
がこれに限るものではない。板厚が約6mm以上のもの
を対称とする。First, a first aspect of the present invention will be described with reference to FIGS. 1 and 2. In the following description, a thick steel plate (hereinafter, simply referred to as a steel plate) is taken as a representative example of the material to be plated, but the material to be plated is not limited to this. A plate having a thickness of about 6 mm or more is symmetrical.
【0011】図1は本発明方法を適用する電解めっき装
置の一例である。この装置は、めっき槽3、予備槽4お
よび電極ユニット1を有して構成される。めっき槽3
は、被めっき材(鋼板2)を水平に装入可能であり、厚
鋼板、中鋼板などのように曲げることの困難な材料を装
入できる大きさを有するものであればよい。FIG. 1 shows an example of an electrolytic plating apparatus to which the method of the present invention is applied. This apparatus has a plating tank 3, a preliminary tank 4, and an electrode unit 1. Plating tank 3
May have a size such that the material to be plated (steel plate 2) can be loaded horizontally and a material that is difficult to bend, such as a thick steel plate and a medium steel plate, can be loaded.
【0012】予備槽4は、ヒーター5および撹拌機6を
有し、前記めっき槽3と連通して設けられる。めっき槽
3内で冷却されためっき液は、めっき槽3から予備槽4
へ流出させ、予備槽4へ流入しためっき液をめっき温度
附近まで加熱・撹拌して均一にすることができる。The preliminary tank 4 has a heater 5 and a stirrer 6, and is provided in communication with the plating tank 3. The plating solution cooled in the plating tank 3 is transferred from the plating tank 3 to the preliminary tank 4
It is possible to heat and stir the plating solution that has flowed out to the preliminary tank 4 to a temperature close to the plating temperature to make it uniform.
【0013】電極ユニット1は、めっき面、すなわち鋼
板2の上面に対向して電極板11を有し(図2参照)、
鋼板2上を電極ユニット1が水平移動しながらめっきを
行なう。このユニット内には加熱装置10を有し、前記
予備槽4で予めめっき温度附近まで加熱されためっき液
を加圧ポンプ7および配管8にて移送し、所定のめっき
温度に加熱する。加熱装置10は特に限定しない。所定
温度に加熱されためっき液は、電極ユニット1を水平移
動してめっきする時に、鋼板2と電極板11との間に噴
出させる。噴出方法は限定しない。The electrode unit 1 has an electrode plate 11 facing the plated surface, that is, the upper surface of the steel plate 2 (see FIG. 2),
Plating is performed while the electrode unit 1 horizontally moves on the steel plate 2. A heating device 10 is provided in this unit, and the plating solution previously heated to a temperature close to the plating temperature in the preliminary tank 4 is transferred by the pressure pump 7 and the pipe 8 and heated to a predetermined plating temperature. The heating device 10 is not particularly limited. The plating solution heated to a predetermined temperature is jetted between the steel plate 2 and the electrode plate 11 when the electrode unit 1 is horizontally moved and plated. The ejection method is not limited.
【0014】前記めっき槽3、前記予備槽4および電極
ユニット1の間には、めっき液を循環させるための循環
系を有する。めっき液は、例えばポンプ7で加圧し、流
速を与えて、循環系を形成し、めっき中に発生するガス
を排除すると同時に、加温して大電流密度とすることに
より高能率なめっきを可能としている。めっき中のめっ
き液面9は、図2に示すように鋼板2上の電極板11の
下面より上方にあれば良い。シール材14は完璧なシー
ルでなくても良い。A circulation system for circulating a plating solution is provided between the plating tank 3, the preliminary tank 4 and the electrode unit 1. The plating solution is pressurized by, for example, the pump 7 to give a flow rate to form a circulation system to eliminate the gas generated during plating, and at the same time, heat it to a high current density to achieve high efficiency plating. I am trying. The plating liquid surface 9 during plating may be above the lower surface of the electrode plate 11 on the steel plate 2 as shown in FIG. The sealing material 14 need not be a perfect seal.
【0015】冷延鋼板では、めっき液の熱により、鋼板
はすぐにめっき液温度近くに上昇する。しかし、厚鋼板
等では鋼板2温度がめっき液温度近くまで上昇するには
時間が必要である。また、本発明ではめっき液表面積が
大きいため、比較的めっき液が冷却しやすいので、めっ
き液をめっき直前で加温することに特長がある。すなわ
ち、鋼板2温度を上昇させなくても、めっき液による鋼
板2表面のみの加温で高能率、高品質のめっきが得られ
る。With cold-rolled steel sheets, the heat of the plating solution causes the steel sheet to immediately rise to a temperature near the plating solution. However, for thick steel plates and the like, it takes time for the temperature of the steel plate 2 to rise close to the temperature of the plating solution. Further, in the present invention, since the surface area of the plating solution is large, the plating solution is relatively easy to cool. Therefore, there is an advantage in heating the plating solution immediately before plating. That is, even if the temperature of the steel sheet 2 is not raised, high efficiency and high quality plating can be obtained by heating only the surface of the steel sheet 2 with the plating solution.
【0016】加温方法として、ガス、電気、蒸気等を用
いることができるが、燃焼ガス、蒸気による加熱の効率
が望ましい。As a heating method, gas, electricity, steam or the like can be used, but the efficiency of heating with combustion gas or steam is desirable.
【0017】また、従来の浸漬型のめっき方法と比較す
ると、めっき液をめっき直前に加温することにより、非
常に大きな電流密度で高品質、かつ迅速なめっきを可能
とすることができる。また、被めっき材がめっき液中に
浸漬されているので、めっき面の変色等はなく、良好な
めっき面が得られる。Further, as compared with the conventional immersion type plating method, by heating the plating solution immediately before plating, it is possible to perform high quality and quick plating with a very large current density. Further, since the material to be plated is immersed in the plating solution, there is no discoloration of the plated surface and a good plated surface can be obtained.
【0018】ここで、本発明の動作例を説明する。Here, an operation example of the present invention will be described.
【0019】まず、鋼板2を水平にめっき槽3に設置す
る。めっき槽3には、極間距離より大きな距離(深さ)
のめっき液を注入しておく(図2に示すように電極ユニ
ット1下面より上に液面9がある)。First, the steel plate 2 is installed horizontally in the plating tank 3. The plating tank 3 has a distance (depth) larger than the distance between contacts.
Of the plating solution (the liquid surface 9 is above the lower surface of the electrode unit 1 as shown in FIG. 2).
【0020】次に、電極ユニット1を鋼板2上の左(ま
たは右)端部に移動し、ポンプ7で予備槽4のめっき液
を汲みあげ加圧して電極ユニット1へ供給し、めっき液
を循環させる。めっき液は、予備槽4で予め加温してあ
る。Next, the electrode unit 1 is moved to the left (or right) end portion on the steel plate 2, and the pump 7 pumps up and pressurizes the plating solution in the auxiliary tank 4 to supply it to the electrode unit 1 to supply the plating solution. Circulate. The plating solution is preheated in the preliminary tank 4.
【0021】電極ユニット1内にめっき液が充満したと
ころで、電極ユニット1を右(または左)に移動させる
と同時に通電する(図示せず)。これでめっきが可能と
なる。When the electrode unit 1 is filled with the plating solution, the electrode unit 1 is moved to the right (or left) and simultaneously energized (not shown). Plating is now possible.
【0022】希望のめっき厚さは、電極ユニット1の走
行速度と電流密度でコントロールできる。電極ユニット
1の走行方法は、電極ユニット1を門型等のフレーム1
3に搭載し走行させることが望ましい(図2参照)。The desired plating thickness can be controlled by the traveling speed of the electrode unit 1 and the current density. The running method of the electrode unit 1 is as follows.
It is desirable to mount it on the vehicle and run it (see Fig. 2).
【0023】電極ユニット1より噴出しためっき液は、
めっき槽3から予備槽4に流入する。予備槽4では、め
っき液のpHなどめっき液の管理を行ない、必要に応じ
てこれにめっき液原料の投入、不純物の除去等を行なう
設備を追加することができる。The plating solution ejected from the electrode unit 1 is
It flows from the plating tank 3 into the preliminary tank 4. In the spare tank 4, the plating solution such as the pH of the plating solution is managed, and if necessary, equipment for adding the plating solution raw material, removing impurities, and the like can be added.
【0024】次に本発明の第2の態様を図1、図2を参
照しながら説明する。めっき槽3などは既に説明したの
で説明を省略する。Next, a second aspect of the present invention will be described with reference to FIGS. Since the plating tank 3 and the like have already been described, description thereof will be omitted.
【0025】図2は、電解めっきを行なう上でもっとも
大切な電極ユニット1の断面図の一例である。予備槽4
にて予め加温されためっき液は、加圧ポンプ7と配管8
により電極ユニット1に供給するようになっている。電
極ユニット1内に設けられたヒーター10により、めっ
き液は、さらに加温されながら電極板11方向に流れ鋼
板2と電極板11との間を通過する。鋼板2と電極板1
1との間にめっき液が充満し、気泡などが発生しにくく
するために、ウイング12を設けることが望ましい。FIG. 2 is an example of a cross-sectional view of the electrode unit 1 which is the most important for performing electrolytic plating. Spare tank 4
The plating solution preheated at
Is supplied to the electrode unit 1. The heater 10 provided in the electrode unit 1 causes the plating solution to flow in the direction of the electrode plate 11 while being further heated, and passes between the steel plate 2 and the electrode plate 11. Steel plate 2 and electrode plate 1
It is desirable to provide the wing 12 so that the plating solution fills the space between the first and second parts and the bubbles are less likely to be generated.
【0026】めっきの前処理としては、従来は、脱脂、
酸洗、中和など煩雑な工程を行なっているが、本発明で
の前処理としてはショットブラストで十分である。As a pretreatment for plating, conventionally, degreasing,
Although complicated steps such as pickling and neutralization are carried out, shot blasting is sufficient as the pretreatment in the present invention.
【0027】本発明は、従来の厚鋼板などへのめっきよ
り、小規模な装置で、より高品質なめっきが迅速にでき
る。According to the present invention, higher quality plating can be performed quickly with a small-scale apparatus, as compared with the conventional plating on thick steel plates.
【0028】[0028]
【実施例】以下に本発明を実施例に基づき具体的に説明
する。EXAMPLES The present invention will be specifically described below based on examples.
【0029】(実施例1)図1および図2に示す装置に
よりNiめっきを行なった。めっき液組成は、スルファ
ミン酸浴であり、以下に示すめっき条件である。
組成 スルファミン酸ニッケル 300g/l
塩化ニッケル 30g/l
ほう酸 30g/l
めっき液温 予備槽温度 40℃、めっき温度 50
〜55℃
電流密度 50A/dm2
めっき液流速 0.5〜0.8m/sec(Example 1) Ni plating was performed by the apparatus shown in FIGS. 1 and 2. The composition of the plating solution was a sulfamic acid bath, and the plating conditions were as follows. Composition Nickel sulfamate 300g / l Nickel chloride 30g / l Boric acid 30g / l Plating solution temperature Preliminary bath temperature 40 ℃, Plating temperature 50
〜55 ℃ Current density 50A / dm 2 Plating solution flow rate 0.5〜0.8m / sec
【0030】電極は、幅500mm、奥行き200mm
のNi板を用い、極間距離は10mmとした。鋼板は、
普通鋼SM50Bで、厚さ15mm、500mm×10
00mmのショットブラスト材を用いた。鋼板両端部
は、電極ユニットを一時停止させてめっきした。めっき
速度(電極ユニット速度)1m/min で約2μm 厚のNi
めっきが得られた。めっき面は良好であり、この場合の
めっき効率は90%以上であった。The electrodes have a width of 500 mm and a depth of 200 mm.
Ni plate was used and the distance between the electrodes was 10 mm. The steel plate is
Regular steel SM50B, thickness 15 mm, 500 mm x 10
A shot blast material of 00 mm was used. Both ends of the steel plate were plated by temporarily stopping the electrode unit. Ni of about 2 μm thickness at plating speed (electrode unit speed) of 1 m / min
A plating was obtained. The plated surface was good, and the plating efficiency in this case was 90% or more.
【0031】[0031]
【発明の効果】本発明は、以上説明したように構成され
ているので、被めっき材を曲げることのできない厚鋼板
等に対し、種々の電気めっきが可能となり、厚鋼板など
の下地処理としての用途が拡大する効果がある。EFFECTS OF THE INVENTION Since the present invention is configured as described above, various kinds of electroplating can be performed on a thick steel plate or the like on which the material to be plated cannot be bent. It has the effect of expanding applications.
【図1】本発明の電解めっき装置の一例を示す一部切欠
き斜視図である。FIG. 1 is a partially cutaway perspective view showing an example of an electrolytic plating apparatus of the present invention.
【図2】図1の電極ユニットの部分断面図である。FIG. 2 is a partial cross-sectional view of the electrode unit of FIG.
1 電極ユニット 2 被めっき材(鋼板) 3 めっき槽 4 めっき予備槽 5 ヒーター 6 撹拌機 7 加圧ポンプ 8 配管 9 めっき液面 10 めっき液加熱装置 11 電極板 12 ウイング 13 電極ユニットフレーム 14 シール材 1 electrode unit 2 Plated material (steel plate) 3 plating tank 4 Plating spare tank 5 heater 6 stirrer 7 Pressurizing pump 8 piping 9 Plating surface 10 Plating solution heating device 11 electrode plate 12 wings 13 electrode unit frame 14 Seal material
Claims (2)
内のめっき液中に浸漬し、前記被めっき材上面に電極を
対向させてめっき液を循環させつつ電解めっきする電解
めっき方法であって、前記被めっき材と前記電極との間
に循環中に加温されためっき液を噴出させると共に前記
めっき槽内のめっき液面を前記電極面よりも上方に保持
し、前記電極を水平移動させてめっきすることを特徴と
する電解めっき方法。1. An electrolytic plating method in which a non-flexible material to be plated is horizontally immersed in a plating solution in a plating tank, and an electrode is opposed to the upper surface of the material to be plated and electrolytic plating is performed while circulating the plating solution. To spray the heated plating solution during circulation between the material to be plated and the electrode, hold the plating solution surface in the plating tank above the electrode surface, and move the electrode horizontally. An electrolytic plating method, characterized by performing the plating.
有して構成され、めっき液を循環して屈曲不能な被めっ
き材をめっきする電解めっき装置であって、前記めっき
槽は被めっき材を水平に装入可能であり、前記予備槽は
前記めっき槽に連通して設けられめっき槽内から流入す
るめっき液を加熱、撹拌するためのヒーターおよび撹拌
機を有し、前記電極ユニットは前記被めっき材上面に対
向して電極板を有すると共にめっき液を加熱するための
加熱装置と加熱されためっき液を前記被めっき材と電極
板との間に噴出する手段とを有して水平移動可能に配設
され、前記めっき槽、前記予備槽および電極ユニットの
間にめっき液を循環させるための循環系を有することを
特徴とする電解めっき装置。2. An electrolytic plating apparatus configured to have a plating tank, a preliminary tank, and an electrode unit and to circulate a plating solution to plate an inflexible material to be plated, wherein the plating tank is made of a material to be plated. It can be loaded horizontally, and the preliminary tank has a heater and a stirrer that are provided in communication with the plating tank to heat and stir the plating solution flowing from the inside of the plating tank. Horizontally movable with an electrode plate facing the top surface of the plating material, a heating device for heating the plating solution, and means for ejecting the heated plating solution between the material to be plated and the electrode plate. And an electroplating apparatus having a circulation system for circulating a plating solution between the plating tank, the auxiliary tank, and the electrode unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15210091A JPH051395A (en) | 1991-06-25 | 1991-06-25 | Electrolytic plating method and device therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15210091A JPH051395A (en) | 1991-06-25 | 1991-06-25 | Electrolytic plating method and device therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH051395A true JPH051395A (en) | 1993-01-08 |
Family
ID=15533055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15210091A Withdrawn JPH051395A (en) | 1991-06-25 | 1991-06-25 | Electrolytic plating method and device therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH051395A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5427028A (en) * | 1993-11-13 | 1995-06-27 | Tokyo Kikai Seisakusho, Ltd. | Printing plates lifting apparatus having storing function |
JP2015127451A (en) * | 2013-12-27 | 2015-07-09 | 山形県 | Production method of high adhesion plating film by scan type electric plating method |
-
1991
- 1991-06-25 JP JP15210091A patent/JPH051395A/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5427028A (en) * | 1993-11-13 | 1995-06-27 | Tokyo Kikai Seisakusho, Ltd. | Printing plates lifting apparatus having storing function |
JP2015127451A (en) * | 2013-12-27 | 2015-07-09 | 山形県 | Production method of high adhesion plating film by scan type electric plating method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980903 |