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JPH046999A - Manufacture of ultrasonic probe - Google Patents

Manufacture of ultrasonic probe

Info

Publication number
JPH046999A
JPH046999A JP2106380A JP10638090A JPH046999A JP H046999 A JPH046999 A JP H046999A JP 2106380 A JP2106380 A JP 2106380A JP 10638090 A JP10638090 A JP 10638090A JP H046999 A JPH046999 A JP H046999A
Authority
JP
Japan
Prior art keywords
piezoelectric body
electrode
forming
ultrasonic probe
composite piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2106380A
Other languages
Japanese (ja)
Other versions
JP2914714B2 (en
Inventor
Satoshi Tezuka
智 手塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2106380A priority Critical patent/JP2914714B2/en
Publication of JPH046999A publication Critical patent/JPH046999A/en
Application granted granted Critical
Publication of JP2914714B2 publication Critical patent/JP2914714B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

PURPOSE:To improve electric isolation state among components by forming a laminator comprising an acoustic matching layer, an electrode, a composite piezoelectric body of half-finished state, an electrode, and a packing layer and slitting the layer so as to form the arrangement of the pillar shaped piezoelectric body and component electrodes simultaneously. CONSTITUTION:A flat piezoelectric ceramic 1 is cut off unidirectionally at a prescribed interval, an organic material 3 is packed in gaps 2, and both faces are polished to form a composite piezoelectric body 4 in half-finished state. After silver electrodes 5, 6 are formed entirely on both faces of the piezoelectric body 4, an acoustic matching layer 7 is formed on the surface of the electrode 5, a packing member 8 is adhered on the surface of the electrode 6 to form an intermediate laminator. Then the laminator is cut off for all the layers simultaneously in a direction in crossing with the 1st cutting direction and a material 9 with low acoustic coupling is packed in produced gaps. Thus, the electric and acoustic isolation state among adjacent components is improved.

Description

【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) 本発明は、複合圧電体を応用した超音波プローブの製造
方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a method of manufacturing an ultrasonic probe using a composite piezoelectric material.

(従来の技術) 従来から、無機材料によって形成された柱状圧電体の周
囲を有機材料で覆った構造の複合圧電体が開発されてい
る。このような複合圧電体は、その構造から無機圧電体
に特有な高電気機械結合係数、および有機材料に特有な
低音響インピーダンスという2つの特性を有するため、
超音波診断装置等に使われる種々の超音波プローブに応
用されている。
(Prior Art) Composite piezoelectric bodies have been developed that have a structure in which a columnar piezoelectric body made of an inorganic material is covered with an organic material. Due to its structure, such composite piezoelectric materials have two characteristics: a high electromechanical coupling coefficient that is unique to inorganic piezoelectric materials, and a low acoustic impedance that is unique to organic materials.
It is applied to various ultrasonic probes used in ultrasonic diagnostic equipment and the like.

第2図は、このような複合圧電体の一例を示している。FIG. 2 shows an example of such a composite piezoelectric body.

同図において、21は圧電セラミックス等無機材料によ
って形成された柱状圧電体、22は該柱状圧電体21を
取り巻く有機材料である。この複合圧電体は、次のよう
な方法(ダイシング法)によって簡便に製造できるため
、特に注目されている。即ち、まず圧電セラミックス板
等の無機圧電体を、交差状2方向に所定の間隔で厚み方
向に切断し、微細な柱状体21にする。次いで、該切断
によって形成された間隙に有機材料22を充填すること
により、第2図の該複合圧電体が得られる。
In the figure, 21 is a columnar piezoelectric body formed of an inorganic material such as piezoelectric ceramics, and 22 is an organic material surrounding the columnar piezoelectric body 21. This composite piezoelectric material is attracting particular attention because it can be easily manufactured by the following method (dicing method). That is, first, an inorganic piezoelectric material such as a piezoelectric ceramic plate is cut in the thickness direction at predetermined intervals in two intersecting directions to form fine columnar bodies 21 . Next, by filling the gap formed by the cutting with an organic material 22, the composite piezoelectric body shown in FIG. 2 is obtained.

従来の超音波プローブの製造方法においては、上記第2
図の構造を有する複合圧電体を形成した後、その上下面
に、複数個の電極が相互に分離して形成されている。そ
の場合、各電極は例えば]行または1列の柱状圧電体2
1・・・を覆うように設けられ、一つの電極および該電
極で覆われた各行または各列の柱状圧電体21・・・が
−っのトランスジューサ素子を構成する。
In the conventional method of manufacturing an ultrasonic probe, the second
After forming a composite piezoelectric body having the structure shown in the figure, a plurality of electrodes are formed on the upper and lower surfaces of the composite piezoelectric body to be separated from each other. In that case, each electrode may include, for example] a row or a column of piezoelectric columns 2
1..., one electrode and each row or column of columnar piezoelectric bodies 21 covered with the electrode constitute a transducer element.

(発明が解決しようとする課題) 上記のように第2図の複合圧電体を形成した後、相互に
分離された複数の電極を形成することにより、多数個の
トランデューサー素子を有する超音波プローブを製造す
る方法には次のような問題がある。
(Problem to be Solved by the Invention) After forming the composite piezoelectric body shown in FIG. 2 as described above, an ultrasonic probe having a large number of transducer elements is formed by forming a plurality of mutually separated electrodes. The manufacturing method has the following problems.

即ち、個々のトランデューサー素子のピッチ間隔が非常
に小さい超音波プローブの製造に適用する場合、柱状圧
電体とその上部に形成される電極との位置が旨く一致せ
ず、該柱状圧電体が隣接する2つの電極下に跨って存在
する事態を生じ易い。
That is, when applied to the manufacture of an ultrasonic probe in which the pitch interval of individual transducer elements is very small, the positions of the columnar piezoelectric bodies and the electrodes formed on the top thereof do not match well, and the columnar piezoelectric bodies are adjacent to each other. It is easy to cause a situation where the electrode straddles the two electrodes.

かかる事態が生じると、各素子間の電気的分離は困難と
なる。
When such a situation occurs, it becomes difficult to electrically isolate each element.

また、このような方法で形成された電極は、単純に構造
上分離されているだけであるから、各素子間の音響的な
分離が不充分であるという欠点もある。
Further, since the electrodes formed by this method are simply separated structurally, there is also a drawback that acoustic separation between each element is insufficient.

本発明は上記問題点に鑑みてなされたもので、その目的
は、複合圧電体を用いた超音波プローブを製造する際に
、各素子間における電気的および音響的分離を改良でき
る方法を提供することである。
The present invention has been made in view of the above problems, and its purpose is to provide a method that can improve electrical and acoustic isolation between each element when manufacturing an ultrasonic probe using a composite piezoelectric material. That's true.

〔発明の構成〕[Structure of the invention]

(課題を解決するための手段) 上記目的を達成するため、本発明による製造方法は次の
5工程を具備している。
(Means for Solving the Problems) In order to achieve the above object, the manufacturing method according to the present invention includes the following five steps.

第1工程では、平板状の無機圧電体をある1方向だけに
ついて所定の間隔で厚み方向に切断し、所定幅の間隙を
形成する。
In the first step, a flat inorganic piezoelectric material is cut in the thickness direction at predetermined intervals in only one direction to form gaps of a predetermined width.

第2工程では、第1工程で形成された間隙に有機材料を
充填することにより、半完成複合圧電体を形成する。こ
の工程で形成される複合圧電体は、第2図の完成複合圧
電体に充填された縦方向および横方向の有機材料22の
うちの何れか一方のみを有している。この工程で形成さ
れる複合圧電体を特に「半完成」という理由はここにあ
る。必要に応じ、該半完成複合圧電体の表裏両面を研磨
することにより、厚みの調整を行なう。
In the second step, a semi-finished composite piezoelectric body is formed by filling the gap formed in the first step with an organic material. The composite piezoelectric body formed in this step has only one of the vertical and horizontal organic materials 22 filled in the completed composite piezoelectric body of FIG. This is why the composite piezoelectric body formed in this process is called "semi-finished." If necessary, the thickness is adjusted by polishing both the front and back surfaces of the semi-finished composite piezoelectric body.

第3工程では、この半完成複合圧電体の表裏両面に、電
極用の金属膜を積層形成する。ここで形成される金属膜
は同等分割されておらず、一体性を有している。
In the third step, metal films for electrodes are laminated on both the front and back surfaces of this semi-finished composite piezoelectric body. The metal film formed here is not equally divided but has integrity.

第4工程では、前記第3工程までで形成された積層体を
、前記第1工程の切断方向と交差する方向に所定の素子
間隔で厚み方向に全層同時に切断し、各素子間に所定幅
の間隙を形成して個々の素子を相互に分離する。
In the fourth step, the laminate formed up to the third step is simultaneously cut in the thickness direction at a predetermined element interval in a direction crossing the cutting direction in the first step, and a predetermined width is set between each element. Gaps are formed to separate the individual elements from each other.

第5工程では、前記第4工程によって形成された間隙に
、音響カップリングの低い材料を充填することにより、
完成複合圧電体を形成すると同時に、各素子間の音響的
分離を行う。
In the fifth step, by filling the gap formed in the fourth step with a material having low acoustic coupling,
At the same time as forming the completed composite piezoelectric body, acoustic isolation between each element is performed.

なお、前記第3工程までで形成された積層体において、
該工程終了後に該表面に音響整合層を形成する工程と、
該積層体の裏面にバッキング層を形成する工程のうちの
少なくとも一方を行い、こうして形成された積層体につ
いて引き続き前記第4工程以降の加工を行ってもよい。
In addition, in the laminate formed up to the third step,
forming an acoustic matching layer on the surface after the step;
At least one of the steps of forming a backing layer on the back surface of the laminate may be performed, and the laminate thus formed may be subsequently processed in the fourth and subsequent steps.

また、前記各素子間の電気的および音響的分離状態をさ
らに向上させるため、前記第5工程で充填される音響カ
ップリングの低い材料として、前記第2工程で充填され
る有機材料とは異種の柔軟な材質を用いてもよい。
In addition, in order to further improve the electrical and acoustic isolation between the respective elements, a material with low acoustic coupling that is filled in the fifth step is a material that is different from the organic material that is filled in the second step. A flexible material may also be used.

(作 用) 既述したように、本発明の前記第2工程終了時に得られ
る複合圧電体は半完成状態である。そして、前記第4工
程において初めて、複合圧電体を構成する各柱状圧電体
の配列と各電極とが同時に分離形成される。従って、各
素子を構成する柱状圧電体と電極とは自己整合で形成さ
れ、両者の位置は必然的に一致する。
(Function) As described above, the composite piezoelectric body obtained at the end of the second step of the present invention is in a semi-finished state. Then, in the fourth step, the arrangement of each columnar piezoelectric body and each electrode constituting the composite piezoelectric body are simultaneously separated and formed. Therefore, the columnar piezoelectric bodies and electrodes constituting each element are formed in self-alignment, and their positions necessarily coincide.

また、前記第4工程で形成された各素子間の間隙には、
第5工程において音響カップリングの低い材料が充填さ
れる。これによって第2図と同様の複合圧電体が完成さ
れると同時に、電極間にも該材料が充填されることにな
るから、各素子間の音響的分離も達成される。
In addition, in the gaps between each element formed in the fourth step,
In the fifth step, a material with low acoustic coupling is filled. As a result, a composite piezoelectric body similar to that shown in FIG. 2 is completed, and at the same time, since the material is also filled between the electrodes, acoustic isolation between each element is also achieved.

さらに、上記の方法を採用することにより、第5工程で
充填される充填材、即ち各素子間隙に充填される材料は
、各素子間の音響的分離に関してより効果的な音響カッ
プリングの低い材料を、自由に選択できるようになる。
Furthermore, by employing the above method, the filler filled in the fifth step, that is, the material filled in each element gap, is a material with low acoustic coupling that is more effective in terms of acoustic isolation between each element. be able to freely choose.

(実施例) 次に、第1図A−Eを参照して本発明の一実施例を説明
する。
(Embodiment) Next, an embodiment of the present invention will be described with reference to FIGS. 1A to 1E.

まず、平板状圧電セラミックス1をある1方向だけにつ
いて、所定の間隔で厚み方向に切断し、所定幅の間隙2
を形成する(第1図A図示)。
First, a flat piezoelectric ceramic 1 is cut in the thickness direction only in one direction at predetermined intervals, and gaps 2 of a predetermined width are cut.
(as shown in FIG. 1A).

こうして形成された該間隙2にエポキシ樹脂等の有機材
料3を充填し、該表裏両面共に研磨によって厚みの調整
を行い、半完成状態の複合圧電体4を形成する(同図B
図示)。
The gap 2 thus formed is filled with an organic material 3 such as an epoxy resin, and the thickness is adjusted by polishing both the front and back surfaces to form a composite piezoelectric body 4 in a semi-finished state (FIG.
(Illustrated).

次に、該半完成状態の複合圧電体の表裏両面に、銀電極
5.6を一面に渡って形成する(同図C図示)。また、
ここでトランデューサー各素子に相当する位置からの電
極の引出しを行う。但し、この電極引出しは全工程終了
後でも可能である。
Next, silver electrodes 5.6 are formed over both the front and back surfaces of the semi-finished composite piezoelectric body (as shown in C in the figure). Also,
Here, electrodes are drawn out from positions corresponding to each transducer element. However, this electrode extraction is possible even after all steps are completed.

次に、上部電極5の表面にエポキシ樹脂等の音響整合層
7を形成する(同図り図示)。また、下部電極6の表面
にはバッキング材8を接着させる。
Next, an acoustic matching layer 7 made of epoxy resin or the like is formed on the surface of the upper electrode 5 (as shown in the figure). Further, a backing material 8 is adhered to the surface of the lower electrode 6.

こうして、音響整合層7/銀電極5/半完成状態の複合
圧電体4/銀電極6/バツキング材8からなる中間積層
体が構成される。
In this way, an intermediate laminate consisting of acoustic matching layer 7/silver electrode 5/semi-finished composite piezoelectric material 4/silver electrode 6/backing material 8 is constructed.

次に、該積層体を最初の圧電セラミックスの切断方向と
交差する方向(必ずしも直交する必要はない)に、所定
の素子ピッチで厚み方向に全層同時に切断しくバッキン
グ材層表層の一部まで切り込む場合もあり得る)、生じ
た間隙に音響カップリングの低い材料9を充填させる(
同図E図示)。
Next, the laminate is simultaneously cut in the thickness direction at a predetermined element pitch in a direction intersecting (not necessarily orthogonal to) the first cutting direction of the piezoelectric ceramic, up to a part of the surface layer of the backing material layer. In some cases, the resulting gap is filled with a material 9 with low acoustic coupling (
(Illustrated in E of the same figure).

ここで該材料9は、前記複合体4を構成している有機材
料3よりも柔軟な有機材料を充填することが望ましい。
Here, the material 9 is desirably filled with an organic material that is more flexible than the organic material 3 constituting the composite 4.

以上のようにして所望の超音波プローブが製造される。A desired ultrasonic probe is manufactured in the manner described above.

上記実施例の方法では、音響整合層7/電極5/半完成
状態の複合圧電体4/電極6/バツキング層8、という
構成の積層体を形成後、これを全層に渡って所望の素子
間隔で切断することにより、複合圧電体を構成する柱状
圧電体の配列と各素子電極が同時に形成され、両者の位
置が容易に一致する。従って、従来のように柱状圧電体
が2つの電極下に跨って存在することがなくなり、超音
波プローブ各素子間の電気的分離状態を改良することが
できる。
In the method of the above embodiment, after forming a laminate having the structure of acoustic matching layer 7/electrode 5/semi-finished composite piezoelectric material 4/electrode 6/backing layer 8, this is layered over all layers to form a desired element. By cutting at intervals, the array of columnar piezoelectric bodies constituting the composite piezoelectric body and each element electrode are formed at the same time, and the positions of both can be easily matched. Therefore, the columnar piezoelectric body does not exist straddling the two electrodes as in the prior art, and the state of electrical isolation between each element of the ultrasonic probe can be improved.

また、上述の素子形成後、分離された各電極間隙にも音
響カップリングの低い材料が充填されるため、超音波プ
ローブ各素子間の音響的分離状態も改良される。
Further, after the above-described elements are formed, the separated electrode gaps are also filled with a material having low acoustic coupling, so that the acoustic isolation between the elements of the ultrasonic probe is also improved.

さらに、各素子間隙に充填される材料は、各素子間の音
響的分離に関してより効果的な音響カップリングの低い
材料を自由に選択できるようになるため、音響的カップ
リングの低減等音響的分離状態が尚−層改良され、該超
音波プローブとしての機能の信頼性が確保される。
Furthermore, the material filled in each element gap can be freely selected to be a material with low acoustic coupling that is more effective in terms of acoustic isolation between each element, resulting in reduced acoustic coupling and other acoustic isolation. The condition is further improved and the reliability of the function of the ultrasonic probe is ensured.

なお、例えばリニア電子スキャンプローブ等の場合、音
響整合層7を切断分離することは不要である。このよう
な場合には、同図Cの状態で電極を形成した後、先に各
素子ピッチでの切断および該間隙への音響カップリング
が低い材料の充填を行い、その後に音響整合層を形成す
ればよい。或いは、同図りの状態で音響整合層を形成1
7た後、裏面から各素子ピッチでの切断(音響整合層は
除く)および音響カップリングが低い材料の充填を行っ
てもよい。
Note that, for example, in the case of a linear electronic scan probe or the like, it is not necessary to cut and separate the acoustic matching layer 7. In such a case, after forming the electrodes in the state shown in Figure C, first cut at each element pitch and fill the gaps with a material with low acoustic coupling, and then form the acoustic matching layer. do it. Alternatively, form an acoustic matching layer in the same state 1
7, cutting from the back surface at each element pitch (excluding the acoustic matching layer) and filling with a material with low acoustic coupling may be performed.

また、音響整合層が不必要な場合は、上記音響整合層7
を形成する工程(同図D)を省略することができる。
In addition, if the acoustic matching layer is unnecessary, the acoustic matching layer 7
The step of forming (D in the same figure) can be omitted.

〔発明の効果〕〔Effect of the invention〕

以上詳述したように、本発明は複合圧電体を応用した超
音波プローブ(主としてアレイ型超音波プローブ)にお
いて、隣接する素子間の電気的および音響的分離状態を
容易に実現する上で極めて顕著な効果を奏するものであ
る。
As detailed above, the present invention is extremely effective in easily realizing electrical and acoustic isolation between adjacent elements in an ultrasound probe (mainly an array type ultrasound probe) that applies a composite piezoelectric material. This has the following effects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図A−Eは本発明の一実施例を製造工程に沿って示
す説明図、第2図は従来の製造方法で用いられている複
合圧電体を示す斜視図である。 1・・・平板状圧電セラミックス、2・・・平板状圧電
セラミックスの切断により形成された間隙、3・・・有
機材料(複合圧電体構成用)、4・・・半完成状態の複
合圧電体、5・・・表面銀電極、6・・・裏面銀電極、
7・・・音響整合層、8・・・バッキング層(材)、9
・・・音響カップリングの低い材料、21・・・柱状圧
電体、22・・・有機材料(複合圧電体構成用)出願人
代理人 弁理士 鈴江武彦 第2図 第1図
FIGS. 1A to 1E are explanatory diagrams showing an embodiment of the present invention along the manufacturing process, and FIG. 2 is a perspective view showing a composite piezoelectric body used in a conventional manufacturing method. DESCRIPTION OF SYMBOLS 1... Flat piezoelectric ceramic, 2... Gap formed by cutting the flat piezoelectric ceramic, 3... Organic material (for composite piezoelectric body composition), 4... Composite piezoelectric body in a semi-finished state , 5... Surface silver electrode, 6... Back surface silver electrode,
7... Acoustic matching layer, 8... Backing layer (material), 9
... Material with low acoustic coupling, 21 ... Column piezoelectric material, 22 ... Organic material (for composite piezoelectric material composition) Applicant's representative Patent attorney Takehiko Suzue Figure 2 Figure 1

Claims (3)

【特許請求の範囲】[Claims] (1)平板状の無機圧電体をある1方向だけについて所
定の間隔で厚み方向に切断し、所定幅の間隙を形成する
第1工程と、 前記第1工程で形成された間隙に有機材料を充填するこ
とにより、半完成複合圧電体を形成する第2工程と、 該半完成複合圧電体の表裏両面に、電極用の一体的な金
属膜を積層形成する第3工程と、前記第3工程までで形
成された積層体を、前記第1工程の切断方向と交差する
方向に所定の素子間隔で厚み方向に全層同時に切断し、
各素子間に所定幅の間隙を形成して個々の素子を相互に
分離する第4工程と、 前記第4工程によって形成された間隙に、音響カップリ
ングの低い材料を充填することにより、完成複合圧電体
を形成すると同時に、各素子間の音響的分離を行う第5
工程とを具備することを特徴とする超音波プローブの製
造方法。
(1) A first step of cutting a flat inorganic piezoelectric material in the thickness direction at predetermined intervals in only one direction to form gaps of a predetermined width, and applying an organic material to the gaps formed in the first step. a second step of forming a semi-finished composite piezoelectric body by filling; a third step of laminating an integral metal film for an electrode on both the front and back surfaces of the semi-finished composite piezoelectric body; and the third step. simultaneously cutting all layers of the laminate formed in the above steps in the thickness direction at a predetermined element interval in a direction crossing the cutting direction of the first step;
A fourth step of forming a gap of a predetermined width between each element to separate the individual elements from each other, and filling the gap formed in the fourth step with a material with low acoustic coupling to produce a finished composite. A fifth layer that forms a piezoelectric material and at the same time provides acoustic isolation between each element.
A method for manufacturing an ultrasonic probe, comprising the steps of:
(2)前記第3工程と第4工程との間に、第3工程で得
られた積層体の表面に音響整合層を形成する工程および
/または該積層体の裏面にバッキング層を形成する工程
が含まれる請求項1記載の超音波プローブの製造方法。
(2) Between the third step and the fourth step, a step of forming an acoustic matching layer on the surface of the laminate obtained in the third step and/or a step of forming a backing layer on the back surface of the laminate. The method for manufacturing an ultrasonic probe according to claim 1, comprising:
(3)前記第5工程で充填される音響カップリングの低
い材料が、前記第2工程で充填される有機材料とは異種
の柔軟な材質である請求項1または2記載の超音波プロ
ーブの製造方法。
(3) Manufacturing the ultrasonic probe according to claim 1 or 2, wherein the material with low acoustic coupling filled in the fifth step is a flexible material different from the organic material filled in the second step. Method.
JP2106380A 1990-04-24 1990-04-24 Ultrasonic probe manufacturing method Expired - Lifetime JP2914714B2 (en)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2106380A JP2914714B2 (en) 1990-04-24 1990-04-24 Ultrasonic probe manufacturing method

Publications (2)

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JPH046999A true JPH046999A (en) 1992-01-10
JP2914714B2 JP2914714B2 (en) 1999-07-05

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ID=14432107

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010214118A (en) * 2009-03-18 2010-09-30 General Electric Co <Ge> Method and apparatus for using single-crystal piezoelectric material within ultrasonic probe
JP2012170760A (en) * 2011-02-24 2012-09-10 Konica Minolta Medical & Graphic Inc Ultrasound probe and ultrasound diagnostic apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010214118A (en) * 2009-03-18 2010-09-30 General Electric Co <Ge> Method and apparatus for using single-crystal piezoelectric material within ultrasonic probe
US8978216B2 (en) 2009-03-18 2015-03-17 General Electric Company Method for forming an acoustical stack for an ultrasound probe
JP2012170760A (en) * 2011-02-24 2012-09-10 Konica Minolta Medical & Graphic Inc Ultrasound probe and ultrasound diagnostic apparatus

Also Published As

Publication number Publication date
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