JPH0453157A - Method of positioning burn-in board of ic inserter/ remover - Google Patents

Abstract

PURPOSE:To prevent leads from bending and IC sockets from being destroyed during insertion thereof by moving a burn-in board by two line pitches in a row direction and positioning a reference plate by pressing an IC socket against a reference plate by two lines by means of a positioning head. CONSTITUTION:The pitch of an IC socket in the longitudinal direction of a BT board 1 is made to be a line pitch, and the pitch in the lateral direction thereof is made to be a row pitch. Positioning in the direction of a line is performed in a state in which a tapered positioning head 12 is pressed against a section between IC sockets of first and second lines by driving a cylinder 13 and the sockets of first and second lines are pressed against a reference plate 3a. The board 1 is fixed by driving BT board clamps 14a. 14b. ICs are inserted into or removed from an IC socket 2. After insertion or removal of first and second lines are performed, the board 1 is set free by driving the clamps 14a. 14b. Next, a head 12 is moved to a section between third and fourth lines by driving a motor 6. The above-described operations are performed repeatedly.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for positioning a burn-in board (hereinafter referred to as BT board) of an IC insertion/extraction machine used in a bias test process of an IC manufacturing process.

[Conventional technology]

Conventionally, the BT board positioning method of an IC insertion/extraction machine is as shown in the plan view of FIG.
(Reference play using the two outer sides of C socket 2 as the reference plane)
3a, 3b to determine the position of the BT board. As shown in the plan view of Fig. 5, reference holes 4a to 4d are drilled near the four corners of the BT board 1, and these reference holes (not shown) are The method used was to insert and position a tapered bottle.

[Problem to be solved by the invention]

In the conventional BT board positioning method described above, as the size of the BT board increases, errors including the cumulative mounting position of the IC socket mounted on the BT board are corrected by using a device on the IC socket in a normal state. IC insertion is greater than the allowable clearance for IC insertion.
There are disadvantages in that the IC leads may be bent and the IC socket may be damaged during insertion.

In contrast to the conventional BT board positioning method described above, the present invention provides a reference plate that guides the IC socket portion of the BT board in parallel to the row direction of the BT board, and uses a positioning head provided on the opposite side of the reference plate to The difference is that positioning can be performed by pressing the IC socket against the reference plate for each row pitch.

[Means to solve the problem]

f) Burn-in board positioning method for an IC insertion/extraction machine of the present invention positions a burn-in board on which IC sockets are mounted in the row and column directions in the bias test process of the IC manufacturing process, and inserts an IC into the IC socket. In a burn-in board positioning method for an IC insertion/extraction machine that performs automatic insertion or automatic extraction, a reference plate is provided parallel to the IC sockets in the column direction of the burn-in board, and the burn-in board is moved in the column direction by two row pitches, and the burn-in board is moved in parallel with the reference plate. A method of positioning IC sockets by pressing them against the reference plate in two rows using tapered positioning heads provided on opposing sides, or a method of moving the burn-in board one row at a time in the column direction and aligning two thousand faces almost at right angles. This is a method of positioning IC sockets by pressing them against a reference plate one row at a time using a positioning head with a holder.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view of an IC insertion/extraction machine for explaining Embodiment 1 of the present invention. Figure 2 is A-A of Figure 1! FIG. The BT board 1 is set on the board holder 5, and the hook 9a attached to the moving platform 8, which moves along the trajectory of the ball screw 7 that is linked with the motor 6, is hooked onto the frame 10 of the BT board 1, and the motor 6 Pull out the BT board 1 from the board rack 5 onto the bearing rail 11.

If the IC sockets, 7 tops, and 1 holes in the longitudinal direction of the BT board 1 are distinguished by the row pitch, and the IC socket pitch in the short direction is called the column pitch, there is a taper between the IC sockets in the 1st and 2nd rows. The shaped positioning head 12 is connected to the cylinder 13.
The IC sockets of the first and second rows are pressed against the reference plate 3a and positioned in the row direction, and the BT board clamps 14a and 14b are driven to fix the BT board 1, and the IC sockets of the first and second rows are pressed against the reference plate 3a. The IC is inserted into or removed from the socket 2.

After inserting or extracting the first and second lines,
Drive the BT board clamps 14a and 14b to free the BT board 1, then drive the motor 6 to move the positioning head 12 to the middle of the third and fourth rows,
By repeating zero or more operations of clamping the BT board 1, insertion or removal of one BT board can be completed.

After the insertion or extraction is completed, press the pressing part 9b of the claw 9a against the BT board 1 and push it into the board rack 5 in the opposite direction to when it was pulled out, and then move the claw 9a to a position where it will not interfere with the board rack 5 rising in the elevator. After the elevator lift is completed, all the set BTs can be removed by repeatedly inserting or removing the
Can complete work on the board.

FIG. 3 is a plan view for explaining Embodiment 2 of the present invention. By shaping the positioning head 12, which positions the BT board 1 in the row direction, so that the IC socket 2 is sandwiched between two approximately perpendicularly opposing 2,000 sides as shown in FIG. 3, positioning can be performed row by row. Therefore, even when the row pitch of the IC sockets mounted on the BT board 1 is large, there is an advantage that positioning can be easily performed.

〔Effect of the invention〕

As explained above, the present invention is capable of positioning the BT board by positioning each IC socket in row pitch units from the opposite side of the reference plate that guides the IC socket part of the BT board, which is provided parallel to the longitudinal direction of the BT board. This eliminates the influence of cumulative errors in the mounting position of IC sockets that are mounted on IC sockets, secures the permissible clearance that allows ICs to be inserted into IC sockets under normal conditions using equipment, and prevents leads during insertion. This has the effect of eliminating the problem of bending and damage to the IC socket.

Moving table, 9a--Claw, 9b...Pushing part, 1o-
・・Frame, 11・−・Bearing rail, 12・・・
・Positioning head, 13...Cylinder, 14a, 14
b-...BT board clamp.

Claims (1)

[Claims] 1. In the bias test step of the IC manufacturing process, a burn-in board on which IC sockets are mounted in the row and column directions is positioned, and an IC is automatically inserted into or extracted from the IC socket. In a burn-in board positioning method for an IC insertion/extraction machine, a reference plate is provided parallel to the IC sockets in the column direction of the burn-in board, the burn-in board is moved in the column direction by two row pitches, and a taper is provided on the side facing the reference plate. A burn-in board positioning method for an IC insertion/extraction machine, characterized in that IC sockets are pressed against the reference plate in two rows by a shaped positioning head for positioning. 2. The burn-in of the IC inserting/extracting machine according to claim 1, wherein the burn-in board is moved in the column direction one row at a pitch, and the IC sockets are pressed and positioned one row at a time against the reference plate by a positioning head having two planes facing each other at substantially right angles. How to position the board.