JPH04356999A - Electronic equipment cabinet - Google Patents

Abstract

PURPOSE:To provide an electronic equipment cabinet which is small in depth dimension while maintaining high natural air cooling capacity. CONSTITUTION:A unit 7, where electronic circuit packages 8 are mounted, is rotated and supported capably of removal by two unit rotating and supporting mechanisms 10, which are provided between the sections near to the rears of the sides 7 of the unit and the front end faces of an upper shelf plate 3 and a lower shelf plate 4, and further it is so made as to be loaded, with the side of inserting or extracting the package 8 directed to one side. A convection derivative 2, which extends obliquely from the vicinity of the top of the rear of the unit 7 on the lower stage to the vicinity of the bottom of the package inserting/extracting face of the unit on the upper stage, is provided in the space between the lower shelf plate 4 of the unit 7 on the upper stage and the upper shelf plate 3 of the unit 7 on the lower stage so as to separate the air current to the unit 7 on the upper stage and the unit 7 on the lower stage and improve the air current.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention provides a case in which a plurality of sets of upper shelf boards and lower shelf boards are provided with gaps between adjacent sets, and each set of upper shelf board and lower shelf board is provided with a plurality of sets of upper shelf boards and lower shelf boards. The present invention relates to an electronic device housing in which one or more units for mounting an electronic circuit package are mounted between boards.

0002

2. Description of the Related Art FIG. 8 is a schematic front view showing an example of a conventional electronic device housing, and FIG. 9 is a schematic side view showing the inside thereof.

The housing body 31 includes a cover 32 provided with a cold air intake slit 33 for natural cooling on the front surface. An electronic circuit package 35 is located inside the housing body 31.
A convection guide plate 36 is disposed between the upper end of the front surface (package insertion/extraction surface) of the lower unit 34 and the lower end of the back surface of the upper unit 34, and The natural air cooling effect of the units 34 is enhanced by partitioning between the units 34.

A gap 37 between the rear surface of the unit and the housing body 31 is used as an exhaust flow path for air whose temperature has increased due to heat generated by the unit 34, and as a rear surface cable area. Note that the arrow 38 indicates the flow of air.

[0005]

[Problems to be Solved by the Invention] In the conventional electronic device case described above, the depth of the case (Fig. 9 (indicated by D) is large, the installation depth becomes large, and the installation space has to be enlarged.

[0006] An object of the present invention is to provide an electronic device housing having a small depth dimension while maintaining a high natural air cooling capacity.

[0007]

[Means for Solving the Problems] The electronic device housing of the present invention includes a portion of each unit near the intersection of one unit side surface and the back surface of the unit, and the front surfaces of the upper and lower shelf boards that house the unit. A unit rotation support mechanism is provided between the end face or the vicinity thereof to removably rotationally support the unit, and each unit is mounted in the housing with its front package insertion/extraction surface facing one side of the housing body. The space between the upper and lower units includes the rear surface of the lower unit when it is mounted inside the housing with the lower unit facing the one side. diagonally from near the top end toward near the bottom end of the package insertion/extraction surface of the upper unit located directly above the lower unit when the unit is mounted in the housing body toward the one side surface. an upper unit positioned directly above the lower unit from near the upper end of the package insertion/extraction surface of the unit when the lower unit is mounted in the housing body facing the one side surface; A convection guide plate is attached that extends obliquely toward the vicinity of the lower end of the rear surface of the unit when the unit is mounted in the housing body toward the one side surface.

[0008]

[Operation] By providing a unit rotation support mechanism that allows the unit to be removed, and by mounting the unit so that its package insertion/extraction surface faces one side of the housing body,
The depth of the casing can be reduced, allowing the casing to be installed in a narrow space or close to a wall even in the case of a unit with a large depth, and unit replacement and package maintenance can be easily performed in the small space in front of the casing. . In addition, by installing a convection guide plate so as to extend diagonally from near the upper end of the unit back surface (or package insertion/extraction surface) of the lower unit to near the lower end of the package insertion/extraction surface (or unit back surface) of the upper tier unit, High natural air cooling capacity can be secured as before.

[0009]

Embodiments Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an electronic device housing according to an embodiment of the present invention with a cover 5 removed, FIG. 2 is a front view with the cover 5 removed, and FIG. 3 is a perspective view of the electronic device shown in FIG. of the casing,
A sectional view taken along a plane parallel to the side surface, FIG. 4 is a diagram showing the unit rotation support mechanism 10, and FIG. 5 is a view showing the unit rotation support mechanism 1.
0 and a unit lock mechanism 16. FIG.

Inside the housing body 1, two sets of upper shelf boards 3 and lower shelf boards 4 are provided with a gap maintained between them. A unit 7 on which an electronic circuit package 8 is mounted is mounted between the upper shelf board 3 and the lower shelf board 4. The upper shelf board 3 and the lower shelf board 4 are composed of two boards with a small width so that air can pass through them. The gap is set to a value necessary for cooling the electronic circuit package 8 mounted within the unit 7. The unit 7 is removable by two unit rotation support mechanisms 10 provided between a portion of one unit side surface 9 of the unit 7 near the back of the unit and the front end surfaces of the upper shelf board 3 and the lower shelf board 4. The electronic circuit package 8 is rotatably supported, and is mounted so that the insertion/extraction surface of the electronic circuit package 8, that is, the front of the unit, faces one side of the housing body 1 (the right side in the figure). As shown in FIGS. 4 and 5, this unit rotation support mechanism 10 includes a U-shaped hinge 11 fixed to the upper (lower) part of the side surface 9 of the unit close to the rear surface of the unit, and having concentric through holes 11a and 11b.
and is fixed to the front end surface of the upper shelf board 3 (lower shelf board 4),
An L-shaped hinge 12 having a through hole 12a and a hinge 11
and 12, and has a spacer 13 having a through hole 13a, and a stopper portion 14a having an outer diameter larger than the diameter of the through holes 11a and 11b of the hinge 11.
4a is located inside the hinge 11.
and 11b, an L-shaped pin 14 that passes through the through holes 12a and 13a, and a spring 15 that is wound around the pin 14 and located inside the hinge 11 to bias the stopper portion 14a of the pin 14 and press it against the hinge 11. It consists of unit 7
When mounting this on the electronic device housing, the spacer 13 is passed through the pin 14 and the pin 14 is pushed against the spring force of the spring 15.
When the tip of the pin 14 is pulled back and the tip of the pin 14 is aligned with the through hole 12a of the hinge 12, and the hand is released from the pin 14, the pin 14 passes through the through hole 12a of the hinge 12, and the unit 7 is attached to the upper shelf board. 3 and the lower shelf board 4. When removing the unit 7 from the electronic device housing, move the pin 14 against the spring force of the spring 15 to remove the pin 14 from the through hole 12a of the hinge 12, and then move the unit 7 laterally. Just let it happen. unit 7
Between the unit side surface 9 and the front end surface of the lower shelf board 4 is a mechanism completely similar to the unit rotation support mechanism 10, consisting of a U-shaped hinge 17, an L-shaped hinge 18, an L-shaped pin 19, and a spring 20. , a unit locking mechanism 1 that locks the unit 7 mounted on the electronic device casing so that it does not rotate.
6 is provided. The operation of the unit lock mechanism 16 is exactly the same as the operation of the unit rotation support mechanism 10. In the gap between the lower shelf board 4 of the upper unit 7 and the upper shelf board 3 of the lower unit 7, the air flow to the upper unit 7 and the lower unit 7 is separated to further improve the air flow. For this purpose, there is a rectangular cutout extending diagonally from near the upper end of the unit back surface of the lower unit 7 to near the lower end of the package insertion/extraction surface of the upper step unit 7, and triangular plate parts extending downward from both longitudinal ends of the rectangular cutout. A convection guiding plate 21 is provided. Therefore, the cold air that entered the housing body 1 through the slit 6 of the cover 5 moves the bottom of the unit 7 outward through the ceiling opening and the side slit 2 of the housing body 1, as shown by the arrows in FIGS. 2 and 3. Pass through,
The unit 7 is efficiently cooled. Note that two fall prevention stands 22 are provided at the bottom of the housing body 1.

This embodiment has the following effects.

(1) Since the unit 7 is mounted so that its package insertion/extraction surface faces one side of the housing body 1,
The depth dimension of the casing is smaller than before.

(2) Since the convection guiding plate 21 is installed diagonally from near the upper end of the unit back surface of the lower unit 7 to near the lower end of the package insertion/extraction surface of the upper unit 7, the convection guide plate 21 has a high natural Air cooling capacity can be secured.

(3) The air inlet and outlet are at the front of the housing body 1;
Because they are located on the side and top surfaces, the casing can be installed closely against a wall.

(4) Since the unit rotation support mechanism 10 and the unit lock mechanism 16 are provided, the unit 7 and the electronic circuit package 8 can be easily replaced and maintained from the front of the housing body 1.

FIG. 6 is a diagram showing another example of the unit rotation support mechanism, and FIG. 7 is an exploded view of the unit rotation support mechanism 23 in FIG.

A hinge mounting plate 26 is attached between the upper fence plate 3 and the lower fence plate 4, and between the hinge attachment plate 26 and the unit side surface 9, two unit rotation support mechanisms 23 consisting of hinges 24 and 25 are installed. is provided. The hinge 24 consists of a flat plate part 24a and a cylindrical part 24c having a hole 24b,
The hinge 25 consists of a flat plate part 25a and a cylindrical part 25c having a pin 25b that fits into the hole 24b. When removing the unit 7 from the state shown in FIG. 6, move the unit 7 upward and remove the pin 25b. What is necessary is to release the engagement between the hole 24b and the hole 24b.

In some cases, it is also possible to provide a plurality of units 7 between a set of upper shelf board 3 and lower shelf board 4. Furthermore, the triangular plate portion of the convection guide plate 21 may be omitted. Further, the convection guide plate 21 may be provided so as to extend obliquely from near the upper end of the package insertion/extraction surface of the lower unit 7 to near the lower end of the unit back surface of the upper unit 7. Furthermore, the unit rotation support mechanism can also be provided between the back surface of the unit, the lower surface of the upper shelf board 3, and the upper surface of the lower shelf board 4.

[0020]

[Effects of the Invention] As explained above, the present invention provides a unit rotation support mechanism that allows the unit to be removed, and also installs the unit so that its package insertion/extraction surface faces one side of the housing body. This makes it possible to reduce the depth of the casing, allowing the casing to be installed in a narrow space or close to a wall even when the unit has a large depth, and allows for unit replacement and package maintenance in the small space in front of the casing. It is easy to carry out, and the convection guide plate is installed diagonally from near the upper end of the unit back surface (package insertion/extraction surface) of the lower unit to near the bottom end of the package insertion/extraction surface (unit back surface) of the upper tier unit. This has the effect of ensuring the same air cooling capacity as before.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an electronic device housing with a cover 5 removed, according to an embodiment of the present invention.

FIG. 2 is a front view of the electronic device housing of FIG. 1 with a cover 5 removed.

FIG. 3 is a cross-sectional view of the electronic device housing of FIG. 1 taken along a plane parallel to a side surface.

FIG. 4 is a diagram showing the unit rotation support mechanism 10.

FIG. 5 is a diagram showing a unit rotation support mechanism 10 and a unit lock mechanism 16.

FIG. 6 is a diagram showing another example of the unit rotation support mechanism.

7 is an exploded view of the unit rotation support mechanism 23 in FIG. 6. FIG.

FIG. 8 is a front view of a conventional electronic device housing.

9 is a side view showing the inside of the electronic device housing of FIG. 8. FIG.

[Explanation of symbols]

1 Housing body 2 Slit 3 Upper shelf board 4 Lower shelf board 5 Cover 6 Slit 7 Unit 8 Electronic circuit package 9 Unit side surface 10 Unit rotation support mechanism 11 U-shaped hinge 12 L-shaped hinge 13 Spacer 11a, 11b, 12a, 13a Through hole 14
L-shaped pin 14a Stopper part 15 Spring 16 Unit lock mechanism 17 U-shaped hinge 18 L-shaped hinge 19 Pin 20 Spring 21 Convection guide plate 22 Fall prevention stand 23 Unit rotation support mechanism 24, 25 Hinge 24a, 25a Flat plate part 24b Hole 24c Cylindrical portion 25b Pin 25c Cylindrical portion 26 Hinge mounting plate

Claims (1)

[Claims] Claim 1: A plurality of sets of upper shelf boards and lower shelf boards are provided inside the housing body, with gaps between adjacent sets, and an electronic circuit package is provided between each set of upper shelf board and lower shelf board. In an electronic device case that is equipped with one or more units, each unit has a portion near the intersection of one side of the unit and the back of the unit, and upper and lower shelf boards that accommodate the unit. A unit rotation support mechanism for removably rotatably supporting the unit is provided between the front end face of the unit or its vicinity, and each unit has its front package insertion/extraction surface facing toward one side of the housing body. It is designed to be installed inside the main body of the housing.
The gap includes an upper unit located directly above the lower unit from near the upper end of the back surface of the lower unit when the lower unit is mounted in the housing body facing the one side surface. extends diagonally toward the vicinity of the lower end of the package insertion/extraction surface of the unit when it is mounted in the housing body facing the one side surface, or the lower unit is mounted toward the one side surface side of the housing body. The upper unit located directly above the lower unit is mounted in the housing body from near the upper end of the package insertion/extraction surface of the unit when mounted in the housing body, toward the one side surface side. An electronic device casing, characterized in that a convection guide plate is attached to the unit, the convection guide plate extending obliquely toward the vicinity of the lower end of the rear surface of the unit.