JPH04333222A - Thermal diffusion treatment device - Google Patents
Thermal diffusion treatment deviceInfo
- Publication number
- JPH04333222A JPH04333222A JP10297191A JP10297191A JPH04333222A JP H04333222 A JPH04333222 A JP H04333222A JP 10297191 A JP10297191 A JP 10297191A JP 10297191 A JP10297191 A JP 10297191A JP H04333222 A JPH04333222 A JP H04333222A
- Authority
- JP
- Japan
- Prior art keywords
- heater
- core tube
- furnace core
- temperature
- thermal diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009792 diffusion process Methods 0.000 title claims description 6
- 235000012431 wafers Nutrition 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は半導体ウェハーの熱拡散
処理装置に関し、特に急速降温の機構を有する熱拡散処
理装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal diffusion processing apparatus for semiconductor wafers, and more particularly to a thermal diffusion processing apparatus having a rapid temperature cooling mechanism.
【０００２】0002
【従来の技術】従来の熱拡散処理装置（以下、処理装置
とする）では、図４の断面図に示すように、ヒーター２
への電力を切ることにより降温を行なったり、又はこれ
と合わせて炉芯管１とヒーター２との間に空気導入口４
より空気を導入し、空冷することによって降温を行なっ
ていた。[Prior Art] In a conventional thermal diffusion processing apparatus (hereinafter referred to as processing apparatus), as shown in the cross-sectional view of FIG.
The temperature can be lowered by cutting off the power to the furnace core tube 1 and the heater 2.
The temperature was lowered by introducing more air and air cooling.
【０００３】0003
【発明が解決しようとする課題】上述した従来の処理装
置では、ヒーターへの電力を切ることにより降温を行な
ったり、これと合わせて空気導入口より炉芯管とヒータ
ーとの間に空気を導入し降温を行なっているが、炉芯管
とヒーターは隔離されていないのでヒーターからの輻射
熱の為、急速に降温できないという問題があり、そのた
めウェハー処理時間を要し、また出炉中の酸化による膜
質の劣化が生じていた。[Problems to be Solved by the Invention] In the conventional processing equipment described above, the temperature is lowered by cutting off the power to the heater, and at the same time, air is introduced between the furnace core tube and the heater through the air inlet. However, since the furnace core tube and heater are not isolated, there is a problem that the temperature cannot be lowered rapidly due to radiant heat from the heater, which increases the wafer processing time and also reduces the film quality due to oxidation during unloading. deterioration had occurred.
【０００４】0004
【課題を解決するための手段】本発明の処理装置は、遮
蔽板を炉芯管とヒータとの間に挿入することにより、炉
芯管をヒーターから遮断し、輻射熱の影響を取り除き、
急速に降温することが可能な機構を有している。[Means for Solving the Problems] The processing apparatus of the present invention inserts a shielding plate between the furnace core tube and the heater to isolate the furnace core tube from the heater and remove the influence of radiant heat.
It has a mechanism that can rapidly lower the temperature.
【０００５】[0005]
【実施例】次に本発明について図面を参照して説明する
。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings.
【０００６】図１は本発明の実施例１の断面図である。
炉芯管１とヒーター２との間に遮蔽板３を挿入し、ヒー
ター２からの輻射熱の影響を取り除き、炉芯管１とヒー
ター２との間に空気導入口４から空気を導入し、急速降
温を行なう。図２は急速降温を行なわない時の断面図で
あり、遮蔽板３は下降させて炉芯管１とヒーター２との
間には無い。遮蔽板３には耐熱性の板材を使用し、送り
ねじ等の上下機構を備えている。また図３は実施例２の
断面図であり、遮蔽板３の内面に断熱板５を取り付け熱
伝導の影響も取り除いている。FIG. 1 is a sectional view of Embodiment 1 of the present invention. A shielding plate 3 is inserted between the furnace core tube 1 and the heater 2 to remove the influence of radiant heat from the heater 2, and air is introduced from the air inlet 4 between the furnace core tube 1 and the heater 2 to rapidly Cool down the temperature. FIG. 2 is a cross-sectional view when rapid temperature reduction is not performed, and the shielding plate 3 has been lowered and is no longer between the furnace core tube 1 and the heater 2. The shielding plate 3 is made of a heat-resistant plate material and is equipped with a vertical mechanism such as a feed screw. Further, FIG. 3 is a sectional view of the second embodiment, in which a heat insulating plate 5 is attached to the inner surface of the shielding plate 3 to eliminate the influence of heat conduction.
【０００７】[0007]
【発明の効果】以上説明したように本発明は、遮蔽板を
炉芯管とヒーターとの間に挿入したので輻射熱の影響が
無くなり、従来よりも急速に降温することが可能となる
。これによりウェハー処理時間を著しく短縮できる。
また従来と同じ時間でより低い温度まで降温することが
可能なので、出炉中の酸化による膜質劣化の改善，炉内
位置での熱履歴改善により製品の品質向上という効果を
有する。As explained above, in the present invention, since the shielding plate is inserted between the furnace core tube and the heater, the influence of radiant heat is eliminated, and the temperature can be lowered more rapidly than in the past. This can significantly reduce wafer processing time. In addition, since it is possible to lower the temperature to a lower temperature in the same time as conventional methods, it has the effect of improving product quality by improving film quality deterioration due to oxidation during unloading and improving the thermal history inside the furnace.
【図１】本発明の実施例１の断面図である。FIG. 1 is a sectional view of Example 1 of the present invention.
【図２】実施例１で急速降温を行なわない時の断面図で
ある。FIG. 2 is a cross-sectional view when rapid temperature reduction is not performed in Example 1.
【図３】本発明の実施例２の断面図である。FIG. 3 is a sectional view of Example 2 of the present invention.
【図４】従来の熱拡散処理装置の断面図である。FIG. 4 is a sectional view of a conventional thermal diffusion processing apparatus.
１ 炉芯管 ２ ヒーター ３ 遮蔽板 ４ 空気導入口 ５ 断熱材 1 Furnace core tube 2 Heater 3. Shielding plate 4 Air intake port 5 Insulation material
Claims (1)
いて、炉芯管とヒーターとの間に熱遮蔽板を挿入自在と
したことを特徴とする熱拡散処理装置。1. A thermal diffusion processing apparatus for semiconductor wafers, characterized in that a heat shielding plate can be freely inserted between a furnace core tube and a heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10297191A JPH04333222A (en) | 1991-05-09 | 1991-05-09 | Thermal diffusion treatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10297191A JPH04333222A (en) | 1991-05-09 | 1991-05-09 | Thermal diffusion treatment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04333222A true JPH04333222A (en) | 1992-11-20 |
Family
ID=14341646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10297191A Pending JPH04333222A (en) | 1991-05-09 | 1991-05-09 | Thermal diffusion treatment device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04333222A (en) |
-
1991
- 1991-05-09 JP JP10297191A patent/JPH04333222A/en active Pending
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