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JPH04245409A - Inductor device - Google Patents

Inductor device

Info

Publication number
JPH04245409A
JPH04245409A JP992291A JP992291A JPH04245409A JP H04245409 A JPH04245409 A JP H04245409A JP 992291 A JP992291 A JP 992291A JP 992291 A JP992291 A JP 992291A JP H04245409 A JPH04245409 A JP H04245409A
Authority
JP
Japan
Prior art keywords
wiring
component mounting
hole
ferromagnetic
mounting board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP992291A
Other languages
Japanese (ja)
Inventor
Junichi Tanahashi
棚橋淳一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP992291A priority Critical patent/JPH04245409A/en
Publication of JPH04245409A publication Critical patent/JPH04245409A/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

PURPOSE:To lower the cost of the title device and to increase its reliability by a method wherein a spiral interconnection which acts electromagnetically as effective as an inductor by utilizing a multilayer interconnection and a through hole in an electronic-component mounting board is formed around a ferromagnetic-material chip which is mounted on and fixed to the board. CONSTITUTION:A ferromagnetic-material chip 2 is fixed to an electronic- component mounting board 1 by a mounting operation using a solder. An electric current flowing in a wiring print 3 is passed sequentially through a through hole 7, a wiring print 4, a through hole 8, a wiring print 5 and a through hole 9 and reaches a wiring print 6. The electric current flows graphically in a spiral shape; it is influenced by a magnetic field from the ferromagnetic-material chip 6 and yields the same effect as an inductor. Thereby, the inductor can be surface-mounted, the electrical connection of a lead-wire part to a wiring part at the board is eliminated, the cost of the title device is lowered and the reliability of the title device can be enhanced.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、電磁気学的にインダク
タンスを実現する電子素子からなるインダクト装置に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an induct device comprising electronic elements that realize inductance electromagnetically.

【0002】0002

【従来の技術】従来のインダクタ装置は、強磁性体の周
囲を、リード線で螺旋状に巻つけ、そのリード線の両端
を電気部品実装基板上の穴に半田で固定するように構成
されている。
[Prior Art] A conventional inductor device is constructed in such a way that a lead wire is wound spirally around a ferromagnetic material, and both ends of the lead wire are fixed to holes on an electrical component mounting board with solder. There is.

【0003】0003

【発明が解決しようとする課題】しかしながら、上記従
来例では、強磁性体の周囲を、リード線で螺旋状に巻つ
け、そのリード線の両端を電気部品実装基板上の穴に半
田で固定するように構成されているため、次のような問
題点があった。
[Problem to be Solved by the Invention] However, in the above conventional example, a lead wire is wound spirally around the ferromagnetic material, and both ends of the lead wire are fixed to holes on the electrical component mounting board with solder. Due to this structure, there were the following problems.

【0004】第1に、最近のように、インダクタ装置以
外の電気部品、たとえば、LSi、抵抗、コンデンサな
どは、面実装化が進んでいるため、インダクタ装置のみ
通常部品であると、混在した部品実装はコストが高くな
る。
First, recently, electrical components other than inductors, such as LSIs, resistors, and capacitors, have been increasingly surface-mounted. Implementation is expensive.

【0005】第2に、リード線部の部品を電気部品実装
基板上の配線と共通化できないため、リード線部の部品
代分コストが高くなる。
[0005]Secondly, since the components of the lead wire section cannot be shared with the wiring on the electrical component mounting board, the cost for the components of the lead wire section increases.

【0006】第3に、リード線部と電気部品実装基板上
の配線部とを電気的に接続しなければならないため、構
成が複雑になり、信頼性が低下する。
Third, since the lead wire section and the wiring section on the electrical component mounting board must be electrically connected, the structure becomes complicated and reliability decreases.

【0007】本発明は、上記のような問題点を解決しよ
うとするものである。すなわち、本発明は、コストダウ
ンを図ることができるとともに、電気的信頼性の高いイ
ンダクタ装置を提供することを目的とするものである。
The present invention aims to solve the above problems. That is, an object of the present invention is to provide an inductor device that can reduce costs and has high electrical reliability.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
に、本発明は、電気部品実装基板に実装固定された強磁
性体チップを有し、かつ、その強磁性体チップの周囲に
、該電気部品実装基板の多層配線とスルーホールとを利
用して形成されて電磁気的にインダクタと同効の作用を
する螺旋状の配線を有するものとした。
[Means for Solving the Problems] In order to achieve the above object, the present invention has a ferromagnetic chip mounted and fixed on an electrical component mounting board, and has a ferromagnetic chip mounted around the ferromagnetic chip. The spiral wiring is formed using the multilayer wiring and through holes of the electrical component mounting board and has the same electromagnetic effect as an inductor.

【0009】[0009]

【作用】本発明によれば、電気部品実装基板上に実装固
定された強磁性体チップの周囲に、該電気部品実装基板
の多層配線とスルーホールとを利用して形成された螺旋
状の配線を有するので、電磁気的には、その螺旋状の配
線が螺旋状のリード線と同様な作用をする。
[Operation] According to the present invention, a spiral wiring is formed around a ferromagnetic chip mounted and fixed on an electrical component mounting board using the multilayer wiring and through holes of the electrical component mounting board. Therefore, electromagnetically, the spiral wiring has the same effect as a spiral lead wire.

【0010】0010

【実施例】図1は本発明の一実施例を示した平面図であ
り、図2はその拡大断面図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is an enlarged sectional view thereof.

【0011】同図において、1は電気部品実装基板であ
る。2は強磁性体チップで、半田による実装で電気部品
実装基板1に固定されている。3は最上面の配線プリン
ト、4,5は中間層の配線プリント、6は最下面の配線
プリント、7,8,9はスルーホールで、電気的に接続
されている。
In the figure, reference numeral 1 denotes an electrical component mounting board. A ferromagnetic chip 2 is fixed to the electrical component mounting board 1 by soldering. 3 is a wiring print on the top surface, 4 and 5 are wiring prints on the intermediate layer, 6 is a wiring print on the bottom surface, and 7, 8, and 9 are through holes that are electrically connected.

【0012】そして、前記配線プリント3,4,5,6
は、強磁性体チップ2から見て、その周囲に欠円弧状に
形成されている。
[0012] Then, the wiring prints 3, 4, 5, 6
is formed in a truncated arc shape around the ferromagnetic chip 2 when viewed from the ferromagnetic chip 2.

【0013】したがって、配線プリント3を流れる電流
は、順次、スルーホール7、配線プリント4、スルーホ
ール8、配線プリント5、スルーホール9を通り、配線
プリント6に達する。この電流は図形的に、螺旋状に流
れることになる。そこで、強磁性体チップ2からの磁界
の影響を受け、インダクタと同様の効果を生むことにな
る。また電流の流れる方向が逆でも、同様の効果を生む
Therefore, the current flowing through the wiring print 3 passes through the through hole 7, the wiring print 4, the through hole 8, the wiring print 5, and the through hole 9, and reaches the wiring print 6 in this order. This current flows in a spiral pattern. Therefore, it is influenced by the magnetic field from the ferromagnetic chip 2 and produces an effect similar to that of an inductor. The same effect is produced even if the direction of current flow is reversed.

【0014】図3は中間層の配線パターンを示したもの
で、10,11はスルーホール、12は配線プリントで
ある。
FIG. 3 shows the wiring pattern of the intermediate layer, in which 10 and 11 are through holes, and 12 is a wiring print.

【0015】なお本発明のもう1つの実施例として、電
気部品実装基板に穴をあけ、その穴の中に強磁性体チッ
プをうめ込むことにより、より効果的な磁界の効果を上
げるものが挙げられる。つまり、プリント配線およびス
ルーホールを、順次、螺旋状に電流が流れている中心部
に強磁性体チップが固定されるようにするのである。ま
た図2では4層プリント板を例としたが、何層のプリン
ト板であっても、同様にして実施することができる。さ
らに、スルーホールの位置及びプリント配線の形状も、
特定のものに限定する必要はなく、電流が螺旋状に流れ
れば、同様の効果が得られる。
[0015] As another embodiment of the present invention, a hole is made in the electrical component mounting board and a ferromagnetic chip is embedded in the hole to increase the effect of the magnetic field. It will be done. In other words, the ferromagnetic chip is fixed to the center of the printed wiring and through-holes, where current flows in a spiral manner. Further, in FIG. 2, a four-layer printed board is used as an example, but the same method can be applied to any printed board with any number of layers. Furthermore, the position of the through hole and the shape of the printed wiring are also
There is no need to limit it to a specific one, and the same effect can be obtained if the current flows spirally.

【0016】[0016]

【発明の効果】以上説明したように、本発明によれば、
電気部品実装基板に強磁性体チップを実装固定し、その
周囲に、該電気部品実装基板の多層配線とスルーホール
とを利用して、螺旋状の配線を実現し、インダクタと同
様の効果を上げることができるので、最近の面実装のL
Si,抵抗、コンデンサなどの電子部品と同様に、面実
装がインダクタでも実現可能となり、このため、電子部
品を全て面実装でき、コストダウンを図ることができる
[Effects of the Invention] As explained above, according to the present invention,
A ferromagnetic chip is mounted and fixed on an electrical component mounting board, and around it, using the multilayer wiring and through holes of the electrical component mounting board, a spiral wiring is realized to achieve the same effect as an inductor. Since it is possible to use the recent surface mount L
Similar to electronic components such as Si, resistors, and capacitors, surface mounting is also possible with inductors. Therefore, all electronic components can be surface mounted, and costs can be reduced.

【0017】またリード線部の部品と、電気部品実装基
板上の配線とを共通化できるため、リード線部の部品代
分コストが低減される。
Furthermore, since the parts of the lead wire section and the wiring on the electrical component mounting board can be shared, the cost for the parts of the lead wire section is reduced.

【0018】さらに、リード線部と、電気部品実装基板
上の配線部との電気的接続がなくなり、プリント配線の
みで実現できるため、電気的信頼性が向上する。
Furthermore, electrical reliability is improved because there is no electrical connection between the lead wire section and the wiring section on the electrical component mounting board, and it can be realized only by printed wiring.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の一実施例を示した平面図である。FIG. 1 is a plan view showing an embodiment of the present invention.

【図2】図1の拡大断面図である。FIG. 2 is an enlarged cross-sectional view of FIG. 1;

【図3】中間層の配線パターンを示した平面図である。FIG. 3 is a plan view showing a wiring pattern of an intermediate layer.

【符号の説明】[Explanation of symbols]

1…電気部品実装基板            2…強
磁性体チップ3,4,5,6…配線プリント    7
,8,9…スルーホール
1...Electrical component mounting board 2...Ferromagnetic chip 3, 4, 5, 6...Wiring print 7
, 8, 9...Through hole

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  電気部品実装基板に実装固定された強
磁性体チップを有し、かつ、その強磁性体チップの周囲
に、該電気部品実装基板の多層配線とスルーホールとを
利用して形成されて電磁気的にインダクタと同効の作用
をする螺旋状の配線を有することを特徴とするインダク
タ装置。
Claim 1: A ferromagnetic chip mounted and fixed on an electrical component mounting board, and formed around the ferromagnetic chip using multilayer wiring and through holes of the electrical component mounting board. An inductor device characterized in that it has a spiral wiring that electromagnetically has the same effect as an inductor.
JP992291A 1991-01-30 1991-01-30 Inductor device Pending JPH04245409A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP992291A JPH04245409A (en) 1991-01-30 1991-01-30 Inductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP992291A JPH04245409A (en) 1991-01-30 1991-01-30 Inductor device

Publications (1)

Publication Number Publication Date
JPH04245409A true JPH04245409A (en) 1992-09-02

Family

ID=11733585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP992291A Pending JPH04245409A (en) 1991-01-30 1991-01-30 Inductor device

Country Status (1)

Country Link
JP (1) JPH04245409A (en)

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