JPH04206888A - Printed board reinforcing device - Google Patents
Printed board reinforcing deviceInfo
- Publication number
- JPH04206888A JPH04206888A JP33808490A JP33808490A JPH04206888A JP H04206888 A JPH04206888 A JP H04206888A JP 33808490 A JP33808490 A JP 33808490A JP 33808490 A JP33808490 A JP 33808490A JP H04206888 A JPH04206888 A JP H04206888A
- Authority
- JP
- Japan
- Prior art keywords
- board
- protrusions
- circuit board
- printed circuit
- fittings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 title description 8
- 238000005452 bending Methods 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 230000002787 reinforcement Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、映像機器等のプリント回路に使用するプリン
ト基板補強装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a printed circuit board reinforcing device used in printed circuits of video equipment and the like.
従来の技術
近年、映像機器等のプリント基板には、ＩＣ及びチップ
部品が数多く取付けられており、これらの部品の外れを
防ぐため、反りや変形に対するプリン１へ基板の強度ア
ンプが求められている。Background of the Invention In recent years, many IC and chip components have been attached to printed circuit boards for video equipment, etc., and in order to prevent these components from coming off, there is a need for a strength amplifier for the circuit board against warping and deformation. .
以下、従来のプリント基板補強装置について説明する。A conventional printed circuit board reinforcing device will be described below.
第３図に示すように、プリント基板６の両端に金具５を
配し、プリント基板６を介して金具５を取付けねし７で
固定している。As shown in FIG. 3, metal fittings 5 are arranged at both ends of the printed circuit board 6, and the metal fittings 5 are fixed with mounting screws 7 via the printed circuit board 6.
発明か解決しようとする課題
しかしながら」二記の従来の構成では、金具をプリント
基板に取付けるのに取４−１けねしか必要てあり、組立
工数が多く、コストアンプになるという問題点を有して
いた。また、金具とプリント基板との接触面積が広いた
め、その分プリント基板の部品及びパターンを配設する
有効面積が減少するという問題点を有していた。However, in the conventional configuration described in section 2, only 4-1 screws are required to attach the metal fittings to the printed circuit board, which has the problem of increasing assembly man-hours and increasing costs. Was. Furthermore, since the contact area between the metal fittings and the printed circuit board is large, there is a problem in that the effective area for disposing the components and patterns of the printed circuit board is reduced accordingly.
本発明は上記従来の問題点を解決するもので、部品数を
削除し、組立工数の低減を図ると共に、プリン１一基板
の部品及びパターンを配設する有効面積を最大限に活用
でき、さらに、プリント基板の耐変形強度をアンプさせ
たプリント基板補強装置を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and eliminates the number of parts, reduces assembly man-hours, maximizes the effective area for arranging parts and patterns on the printed circuit board, and furthermore An object of the present invention is to provide a printed circuit board reinforcing device that increases the deformation resistance of a printed circuit board.
課題を解決するための手段
この目的を達成するために、本発明のプリント基板補強
装置は、板金をコの字型に折り曲げ、かつ突起を有する
凸部を千鳥型に配設した金具と、突起を挿入する穴を配
設したプリント基板を備え、突起とプリント基板を、半
田により固定する構成を有している。Means for Solving the Problems In order to achieve this object, the printed circuit board reinforcing device of the present invention includes a metal fitting made by bending a sheet metal into a U-shape and having protrusions arranged in a staggered manner, and a metal fitting having protrusions arranged in a staggered manner. The protrusion and the printed circuit board are fixed by soldering.
作用
この構成によって、プリント基板の表面は金具の凸部と
のみ接触し、金具の大部分はプリン１一基板との表面と
接触しないこととなる。Effect: With this configuration, the surface of the printed circuit board comes into contact only with the convex portion of the metal fitting, and most of the metal fitting does not come into contact with the surface of the printed circuit board 1.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。EXAMPLE An example of the present invention will be described below with reference to the drawings.
第１図及び第２図に示すように、金具１は板金をコの字
型に折り曲げ、かつ突起２ａを有する凸部２を千鳥型に
配設した構成である。プリント基板３の両側に金型１を
配し、金型１の凸部２をプリント基板３の表面に接して
突起２ａをプリント基板３の穴４に差し込み、プリント
基板３の裏面に突き出た突起２ａをねしり、プリント基
板３に仮固定した後、突起２ａとプリント基板３の銅箔
部を半ＩＢ付けして、金具１とプリント基板３を固定す
る。As shown in FIGS. 1 and 2, the metal fitting 1 has a structure in which a sheet metal is bent into a U-shape, and convex portions 2 having protrusions 2a are arranged in a staggered manner. The molds 1 are placed on both sides of the printed circuit board 3, the protrusions 2 of the mold 1 are brought into contact with the surface of the printed circuit board 3, and the protrusions 2a are inserted into the holes 4 of the printed circuit board 3. After twisting 2a and temporarily fixing it to the printed circuit board 3, the protrusion 2a and the copper foil part of the printed circuit board 3 are attached with a semi-IB, and the metal fitting 1 and the printed circuit board 3 are fixed.
以」二のように本実施例によれば、突起を有する凸部を
千鳥型に配設した金具をプリント基板に固定することに
より、金具の凸部以外はプリン１一基板に接触しないの
で、プリント基板の部品及びパターンを配置する有効面
積を殆んと減少させずに最大限に活用することができ、
プリント基板の耐変形強度を向上させることができる。As described in 2 below, according to this embodiment, by fixing the metal fitting in which the convex portions having protrusions are arranged in a staggered manner to the printed circuit board, the parts other than the convex portions of the metal fitting do not come into contact with the printed circuit board 1. The effective area for arranging printed circuit board components and patterns can be utilized to the fullest with almost no reduction.
The deformation resistance of the printed circuit board can be improved.
また取付けねしを用いずに容易に金具を取付けることか
でき、コストも（ｌできる。In addition, the metal fittings can be easily attached without using mounting screws, and costs can be reduced.
発明の効果
以上の実施例の説明からも明らかなように本発明は、突
起を有する凸部を千鳥型に配設した金具をプリント基板
と半田により固定する構成により、部品数を削減し組立
工数の低減を図ると共に、プリント基板の部品及びパタ
ーンを配設する有効面積を最大限にでき、プリント基板
の耐変形強度を向上させることができる優れたプリント
基板補強装置を実現できるものである。Effects of the Invention As is clear from the description of the embodiments above, the present invention reduces the number of parts and reduces the number of assembly steps by using a structure in which a metal fitting having protrusions arranged in a staggered manner is fixed to a printed circuit board by soldering. It is possible to realize an excellent printed circuit board reinforcing device that can reduce the amount of stress, maximize the effective area for arranging parts and patterns of the printed circuit board, and improve the deformation resistance of the printed circuit board.
第１図は本発明の一実施例のプリント基板補強装置の金
具とプリント基板を固定する前の状態を示す斜視図、第
２図は同金具をプリント基板に固定させた状態を示す斜
視図、第３図は従来のプリント基板補強装置の構成を示
す斜視図である。
１・・・・・・金具、２・・・・・・凸部、２ａ・・・
・・・突起、３・・・・・・プリント基板、４・・・・
・・穴。FIG. 1 is a perspective view showing a state before fixing a metal fitting and a printed circuit board of a printed circuit board reinforcing device according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a state in which the metal fitting is fixed to a printed circuit board. FIG. 3 is a perspective view showing the configuration of a conventional printed circuit board reinforcing device. 1...Metal fitting, 2...Protrusion, 2a...
...Protrusion, 3...Printed circuit board, 4...
··hole.
Claims (1)
千鳥型に配設した金具と、前記突起を挿入する穴を配設
したプリント基板を備え、前記突起と前記プリント基板
を半田により固定するプリント基板補強装置。A metal fitting made by bending a sheet metal into a U-shape and having protrusions arranged in a staggered manner, and a printed circuit board having holes for inserting the protrusions, and fixing the protrusions and the printed circuit board with solder. Printed circuit board reinforcement equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33808490A JPH04206888A (en) | 1990-11-30 | 1990-11-30 | Printed board reinforcing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33808490A JPH04206888A (en) | 1990-11-30 | 1990-11-30 | Printed board reinforcing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04206888A true JPH04206888A (en) | 1992-07-28 |
Family
ID=18314756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33808490A Pending JPH04206888A (en) | 1990-11-30 | 1990-11-30 | Printed board reinforcing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04206888A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1588596A2 (en) * | 2002-10-04 | 2005-10-26 | Sanmina-SCI Corporation | Circuit board stiffener |
| KR100751321B1 (en) * | 2004-12-01 | 2007-08-22 | 삼성에스디아이 주식회사 | Chassis base assembly and plasma display panel assembly using the same |
| US10338634B2 (en) | 2016-01-29 | 2019-07-02 | Toshiba Memory Corporation | Semiconductor storage device having a support member for a memory controller |
-
1990
- 1990-11-30 JP JP33808490A patent/JPH04206888A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1588596A2 (en) * | 2002-10-04 | 2005-10-26 | Sanmina-SCI Corporation | Circuit board stiffener |
| EP1588596A4 (en) * | 2002-10-04 | 2008-06-04 | Sanmina Sci Corp | Circuit board stiffener |
| KR100751321B1 (en) * | 2004-12-01 | 2007-08-22 | 삼성에스디아이 주식회사 | Chassis base assembly and plasma display panel assembly using the same |
| US10338634B2 (en) | 2016-01-29 | 2019-07-02 | Toshiba Memory Corporation | Semiconductor storage device having a support member for a memory controller |
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