JPH04184887A - Connecting method and its device - Google Patents
Connecting method and its deviceInfo
- Publication number
- JPH04184887A JPH04184887A JP30859390A JP30859390A JPH04184887A JP H04184887 A JPH04184887 A JP H04184887A JP 30859390 A JP30859390 A JP 30859390A JP 30859390 A JP30859390 A JP 30859390A JP H04184887 A JPH04184887 A JP H04184887A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- anisotropic conductive
- conductive adhesive
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 239000000853 adhesive Substances 0.000 claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 125000006850 spacer group Chemical group 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 21
- 239000002245 particle Substances 0.000 description 17
- 239000004973 liquid crystal related substance Substances 0.000 description 11
- 239000012212 insulator Substances 0.000 description 8
- 239000011324 bead Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は異方性導電接着剤を用いた接続方法とこの接続
に用いる接続装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a connection method using an anisotropic conductive adhesive and a connection device used for this connection.
異方性導電接着剤は絶縁性を有する接着剤に導電粒を混
入したものからなり、対向する電極間のみを導通させる
。以下液晶表示装置を構成する液晶パネルに異方性導電
接着剤を適用した例を用いて説明する。The anisotropic conductive adhesive is made of an insulating adhesive mixed with conductive particles, and provides conduction only between opposing electrodes. An example in which an anisotropic conductive adhesive is applied to a liquid crystal panel constituting a liquid crystal display device will be described below.
第１の基板にＩＣチップを搭載し、このＩＣチップに接
続する電極を第２の基板に設ける電極に接続する液晶パ
ネルが、例えば実開昭６２−１３２５２４号公報に提案
されている。この公報に記載の液晶パネルを、第２図の
平面図と第３図の要部断面図とを用いて説明する。A liquid crystal panel in which an IC chip is mounted on a first substrate and an electrode connected to the IC chip is connected to an electrode provided on a second substrate is proposed, for example, in Japanese Utility Model Application Publication No. 132524/1983. The liquid crystal panel described in this publication will be explained using a plan view in FIG. 2 and a cross-sectional view of main parts in FIG.
第１の基板１１を第２の基板１３より大きくし、この第
１の基板１１の延長部に形成する第１の電極１５上に、
突起電極３５を介してＩＣチップ２９を接続する。この
ＩＣチップ２９の駆動信号は入力電極３９から供給する
。さらにＩＣチップ２９から液晶表示装置を駆動するた
めの信号は、第１の基板１１に形成する第１の電極１５
から、第２の基板１６に形成する第２の電極１７に伝達
しなければならない。この第１の電極１５と第２の電極
１７との接続は、液晶４１の封止と第１の電極１５と第
２の電極１７との接続を兼ねる異方性導電接着剤１９を
用いる。異方性導電接着剤１９は絶縁性を有する接着剤
３６に導電性を有する導電粒３１を分散させ、対向する
第１の電極１５と第２の電極１７との間のみを導電粒３
１により導通させ、絶縁性を有する接着剤３３が液晶４
１の封止剤としての役割をもつ。The first substrate 11 is made larger than the second substrate 13, and on a first electrode 15 formed on an extension of this first substrate 11,
The IC chip 29 is connected via the protruding electrode 35. A drive signal for this IC chip 29 is supplied from an input electrode 39. Furthermore, the signal for driving the liquid crystal display device from the IC chip 29 is transmitted to the first electrode 15 formed on the first substrate 11.
From there, it must be transmitted to the second electrode 17 formed on the second substrate 16. The connection between the first electrode 15 and the second electrode 17 is made using an anisotropic conductive adhesive 19 which serves both to seal the liquid crystal 41 and to connect the first electrode 15 and the second electrode 17. The anisotropic conductive adhesive 19 has conductive particles 31 dispersed in an adhesive 36 having an insulating property, and the conductive particles 3 are formed only between the first electrode 15 and the second electrode 17 that face each other.
The adhesive 33 having insulation properties is made conductive by the liquid crystal 4.
It has the role of 1 sealant.
第１の基板１１に形成する第１の電極１５は、第２の基
板１３と対向する領域、すなわち液晶表示装置の表示領
域は、例えば酸化インジウムスズ（ＩＴＯ）のような透
明導電膜で形成する。しかしながら非表示領域の第１の
電極１５は配線抵抗を低減するため、Ｃｒ、Ｎｉなどの
金属膜の単層膜か、あるいは透明導電膜上に金属膜を形
成する積層膜を用いる。The first electrode 15 formed on the first substrate 11 is formed of a transparent conductive film such as indium tin oxide (ITO) in the area facing the second substrate 13, that is, the display area of the liquid crystal display device. . However, for the first electrode 15 in the non-display area, in order to reduce wiring resistance, a single layer film of a metal film such as Cr or Ni, or a laminated film in which a metal film is formed on a transparent conductive film is used.
金属膜を第１の電極１５として用いると、この金属膜表
面に形成される酸化膜のため、第１の電極１５と第２の
電極１７との間の接続抵抗が高くなったり、まったく導
通が取れないという課題を有する。When a metal film is used as the first electrode 15, the connection resistance between the first electrode 15 and the second electrode 17 may increase or there may be no conduction at all due to the oxide film formed on the surface of the metal film. The problem is that it cannot be taken.
本発明の目的は上≦１１を解決して、電極としてすくな
くとも一方の基板に形成する金属膜な備え、２つの基板
に形成する電極どうしを異方性導電接着剤を用いて接続
するときの、接続信頼性が高い接続方法と、この接続に
用いる接続装置とを提供することにある。An object of the present invention is to solve the above ≦11, and to provide a metal film formed on at least one substrate as an electrode, and to connect electrodes formed on two substrates using an anisotropic conductive adhesive. It is an object of the present invention to provide a connection method with high connection reliability and a connection device used for this connection.
上記課題を解決するため本発明の異方性導電接着剤を用
いる接続方法と接続装置とは、下記記載の方法と装置と
を採用する。In order to solve the above problems, the method and device described below are adopted as the connection method and device using the anisotropic conductive adhesive of the present invention.
（イ）電極としてすくなくとも一方の基板に形成する金
属膜を備え、２枚の基板の電極どうしン異方性導電接着
剤で接続する方法は、この異方性導電接着剤を硬化させ
るとき、圧力と振動とを印加する。(b) A method in which a metal film is formed on at least one substrate as an electrode and the electrodes on two substrates are connected using an anisotropic conductive adhesive is that when the anisotropic conductive adhesive is cured, pressure is applied. and vibration are applied.
（ロ） 振動を発生する超音波発生装置と、圧力な２つ
の基板に印加するためのエアバックと、エアバックと２
つの基板とを挟持する基台とを有する接続装置。(b) An ultrasonic generator that generates vibrations, an airbag for applying pressure to the two substrates, and an airbag and two
A connection device having a base that holds two substrates.
以下図面な用いて本発明の詳細な説明する。 The present invention will be described in detail below with reference to the drawings.
第１図は本発明の接続方法と接続装置とを示す断面図で
ある。FIG. 1 is a sectional view showing a connecting method and a connecting device according to the present invention.
第１の電極１５を有する第１の基板１１と、第２の電極
１７を有する第２の基板１３とに配向膜（図示せず）を
形成し、この配向膜を形成した第１の基板１１と第２の
基板１３とにラビング処理を施す。その後第２の基板１
６の第２の電極１７上に異方性導電接着剤１９を、スク
リーン印刷法で形成し、温度８０℃で仮焼成する。An alignment film (not shown) is formed on the first substrate 11 having the first electrode 15 and the second substrate 13 having the second electrode 17, and the first substrate 11 on which the alignment film is formed is and the second substrate 13 are subjected to a rubbing process. Then the second substrate 1
An anisotropic conductive adhesive 19 is formed on the second electrode 17 of No. 6 by a screen printing method, and is pre-baked at a temperature of 80°C.
異方性導電接着剤１９は、絶縁性を有するエポキシ系の
接着剤に導電粒を分散させたものを用いる。この導電粒
の接着剤への含有量は３〜１０重量％が好ましい。さら
に導電粒の大ぎさは２〜１０μｍ程度のものを用いる。The anisotropic conductive adhesive 19 is an insulating epoxy adhesive in which conductive particles are dispersed. The content of the conductive particles in the adhesive is preferably 3 to 10% by weight. Further, the size of the conductive particles used is about 2 to 10 μm.
導電粒としては、カーボン粒子、金属粒子、合成樹脂や
ガラスなどの表面に金属被膜を形成した導電ビーズが使
用できるが、粒径を均一化できる導電ビーズが好適であ
る。導電ビーズはスチレンとジビニルベンゼンとの共重
合体表面に、Ｎｉ、ｋｌ、Ａｕ、Ａｇ等の導電膜を単層
、もしくは多層にメツキしたものな用いる。As the conductive particles, carbon particles, metal particles, conductive beads having a metal coating formed on the surface of synthetic resin, glass, etc. can be used, but conductive beads whose particle size can be made uniform are suitable. The conductive beads are made of a copolymer of styrene and divinylbenzene and plated with a conductive film of Ni, Kl, Au, Ag, etc. in a single layer or in multiple layers.
その後第１の基板１１と第２の基板１３とのギャップ制
御を行なうスペーサ剤（図示せず）を散布し、第１の基
板１１と第２の基板１６とを貼り合わせる。Thereafter, a spacer agent (not shown) for controlling the gap between the first substrate 11 and the second substrate 13 is spread, and the first substrate 11 and the second substrate 16 are bonded together.
その後第１図に示す装置に配置し、加圧と同時に振動な
印加して、温度１２０−１５０’ｃで異方性導電接着剤
を硬化させる。このとき印加する圧力は０．３〜３．０
ｋｇ／ｃ！、振動は周波数が２０ ＫＨｚ。Thereafter, it is placed in the apparatus shown in FIG. 1, and the anisotropic conductive adhesive is cured at a temperature of 120-150'C by applying pressure and vibration at the same time. The pressure applied at this time is 0.3 to 3.0
kg/c! , the vibration frequency is 20 KHz.
振幅が１μｍ程度が良い。振幅が大きすぎると配向膜が
破壊し、表示品位が劣化する。It is preferable that the amplitude is about 1 μm. If the amplitude is too large, the alignment film will be destroyed and the display quality will deteriorate.
次に本発明の接続方法に用いる装置について説明する。Next, a device used in the connection method of the present invention will be explained.
振動を与える超音波発生装置６７上に第１の基台２３を
配置し、この第１の基台２３上に位置合わせをした第１
の基板１１と第２の基板１３とを載置する。さらにこの
第２の基板１６上に、平板２５を介してエアバック２１
を配置し、さらに第２の基台２４を配置し、ストッパー
２７で固定する。その後エアバック２１に圧縮空気を注
入し、第１の基板１１と第２の基板１３とに圧力を印加
する。異方性導電接着剤１９の硬化時に加熱すると、エ
アバック２１内の空気が膨張してエアバック２１内の圧
力が上昇する。この圧力上昇を防ぐため、外部にレギュ
ンータを設け、エアバック２１内の圧力が一定になるよ
うに調整している。The first base 23 is placed on the ultrasonic generator 67 that gives vibration, and the first base 23 is positioned on the first base 23.
The substrate 11 and the second substrate 13 are placed. Furthermore, an airbag 21 is placed on this second substrate 16 via a flat plate 25.
, and then the second base 24 is placed and fixed with a stopper 27. After that, compressed air is injected into the air bag 21 to apply pressure to the first substrate 11 and the second substrate 13. When the anisotropic conductive adhesive 19 is heated during curing, the air inside the air bag 21 expands and the pressure inside the air bag 21 increases. In order to prevent this pressure increase, a regulator is provided outside to adjust the pressure inside the airbag 21 to be constant.
本発明の異方性４電接着剤な用いた接続方法においては
、異方性導電接着剤の硬化時に圧力と振動とを印加して
いる。このため金属膜からなる電極表面の酸化膜が破壊
され、電極間の接続において導通不良の発生がなく、さ
らに接続抵抗が低くなる。In the connection method using the anisotropic conductive adhesive of the present invention, pressure and vibration are applied when the anisotropic conductive adhesive is cured. Therefore, the oxide film on the surface of the electrode made of a metal film is destroyed, and there is no occurrence of conduction failure in the connection between the electrodes, and the connection resistance is further reduced.
第４図は異なる異方性導電接着剤に本発明を適用した実
施例を示す断面図である。FIG. 4 is a sectional view showing an example in which the present invention is applied to a different anisotropic conductive adhesive.
第１の基板１１に設ける第１の電極１５と、第２の基板
１３に設げる第２の電極１７との電極ピッチが小さくな
ると、導電粒どうしが接触して隣接する電極が短絡する
。これを防ぐため異方性導電接着剤１９を構成する導電
粒３１の表面に、例えば樹脂からなる薄膜の絶縁体４３
を設ける。導電粒３１の表面に絶縁体４６を設けること
により、導電粒６１が接触しても電極間の短絡は発生し
ない。導電粒３１表面の絶縁体４３は、本発明により、
第１の電極１５と第２の電極１７とに挾み込まれた導電
粒６１のみの絶縁体４３が破壊できる。When the electrode pitch between the first electrode 15 provided on the first substrate 11 and the second electrode 17 provided on the second substrate 13 becomes smaller, the conductive grains come into contact with each other and adjacent electrodes are short-circuited. In order to prevent this, a thin film insulator 43 made of resin, for example, is placed on the surface of the conductive particles 31 constituting the anisotropic conductive adhesive 19.
will be established. By providing the insulator 46 on the surface of the conductive particles 31, a short circuit between the electrodes will not occur even if the conductive particles 61 come into contact. According to the present invention, the insulator 43 on the surface of the conductive particles 31 is
The insulator 43 consisting only of the conductive particles 61 sandwiched between the first electrode 15 and the second electrode 17 can be destroyed.
これは加熱と加圧だけでなく、第１の基板１１を介して
振動が導電粒３１に伝達されることによって、導電粒６
１表面の絶縁体４６が破壊されるためである。電極がな
い領域の導電粒６１表面の絶縁体４３は、破壊されず絶
縁性を保ち、電極間の短絡は発生しない。この結果、電
極ピッチが小さな高密度の電極間の接続においても本発
明は有効である。This is achieved not only by heating and pressurizing, but also by transmitting vibrations to the conductive particles 31 via the first substrate 11.
This is because the insulator 46 on one surface is destroyed. The insulator 43 on the surface of the conductive particles 61 in the area where no electrode is present is not destroyed and maintains its insulation properties, and no short circuit occurs between the electrodes. As a result, the present invention is effective even in connection between high-density electrodes with a small electrode pitch.
さらに異方性導電接着剤による隣接する電極どうしの短
絡を防ぐため、基板に形成する電極の表面に絶縁体を形
成し、この絶縁体を導電粒で破壊して対向する電極間を
接続する接続にも本発明は適用できる。Furthermore, in order to prevent short circuits between adjacent electrodes due to the anisotropic conductive adhesive, an insulator is formed on the surface of the electrodes formed on the substrate, and this insulator is destroyed by conductive particles to connect the opposing electrodes. The present invention is also applicable to
以上の説明においては、液晶パネルの２つの基板に形成
した基板間の接続に異方性導電接着剤を用いた例で説明
したが、液晶パネルの久方電極とフレキシブルプリント
基板との接続や、半導体チップと基板との接続など異方
性導電接着剤を用いる接続に、本発明は適用できる。In the above explanation, an example was explained in which an anisotropic conductive adhesive was used for connection between two substrates of a liquid crystal panel. The present invention can be applied to connections using an anisotropic conductive adhesive, such as connections between semiconductor chips and substrates.
さらに振動の印加は、異方性導電接着剤の硬化時間の初
めから終りまでのすべての時間に振動を印加する必要は
なく、硬化時間の初期に振動を印加し、その後は振動の
印加な止めても良い。硬化時間の初期における振動の印
加により、金属膜表面の酸化膜を破壊することが可能で
、導通不良がなく、かつ接続抵抗が低抵抗な接続が得ら
れる。Furthermore, it is not necessary to apply vibration all the time from the beginning to the end of the curing time of the anisotropic conductive adhesive, but instead apply vibration at the beginning of the curing time and then stop applying vibration. It's okay. By applying vibration at the beginning of the curing time, it is possible to destroy the oxide film on the surface of the metal film, and a connection with no conduction defects and low connection resistance can be obtained.
〔発明の効果〕
以上の説明で明らかなように、異方性導電接着剤を用い
た本発明の接続方法および接続装置では、異方性導電接
着剤の硬化時に圧力と振動とを加えているので、電極の
金属膜表面の酸化膜を破壊して接続している。したがっ
て異方性導電接着剤を用いる電極どうしの接続において
、導通不良の発生がなく、かつ接続抵抗が低く接続信頼
性が高い接続が得られる。[Effects of the Invention] As is clear from the above explanation, in the connection method and connection device of the present invention using an anisotropic conductive adhesive, pressure and vibration are applied when the anisotropic conductive adhesive is cured. Therefore, the oxide film on the surface of the metal film of the electrode is destroyed to make the connection. Therefore, when connecting electrodes using an anisotropic conductive adhesive, it is possible to obtain a connection with no conduction failure, low connection resistance, and high connection reliability.
第１図は本発明の異方性導電接着剤を用いた接続方法と
接続装置とを示す断面図、第２図は液晶表示装置を示す
平面図、第３図は液晶表示装置を示す断面図、第４図は
本発明の他の実施例を示す断面図である。
１１・・・・・・第１の基板、
１６・・・・・・第２の基板、
１９・・・・・・異方性導電接着剤。
１１ 第１の基板
１３．第２の基板
１９、異方杜導電Ｊｆ者剤
第２Ｆ！！Ｊ
第３図
３１’ １９ ３３
第４図
−４８・FIG. 1 is a sectional view showing a connection method and connection device using the anisotropic conductive adhesive of the present invention, FIG. 2 is a plan view showing a liquid crystal display device, and FIG. 3 is a sectional view showing a liquid crystal display device. , FIG. 4 is a sectional view showing another embodiment of the present invention. 11...First substrate, 16...Second substrate, 19...Anisotropic conductive adhesive. 11 First substrate 13. Second board 19, anisotropic conductive Jf agent 2nd F! ! J Fig. 3 31' 19 33 Fig. 4-48・
Claims (2)
属膜を備え、２つの基板の該電極どうしを異方性導電接
着剤を用いて接続する方法において、該異方性導電接着
剤を硬化させるとき、圧力と振動とを印加することを特
徴とする接続方法。(1) In a method in which a metal film is formed on at least one substrate as an electrode and the electrodes of two substrates are connected using an anisotropic conductive adhesive, when the anisotropic conductive adhesive is cured. , a connection method characterized by applying pressure and vibration.
ることを特徴とする接続装置。(2) A connection characterized by having an ultrasonic generator that generates vibrations, an airbag that applies pressure to two substrates, and a base that holds the airbag and the two substrates. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30859390A JPH04184887A (en) | 1990-11-16 | 1990-11-16 | Connecting method and its device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30859390A JPH04184887A (en) | 1990-11-16 | 1990-11-16 | Connecting method and its device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04184887A true JPH04184887A (en) | 1992-07-01 |
Family
ID=17982911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30859390A Pending JPH04184887A (en) | 1990-11-16 | 1990-11-16 | Connecting method and its device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04184887A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330712A (en) * | 1995-06-01 | 1996-12-13 | Teikoku Tsushin Kogyo Co Ltd | Method of fitting electronic chip part to substrate |
| JP2009182365A (en) * | 2009-05-21 | 2009-08-13 | Hitachi Chem Co Ltd | Manufacturing method of circuit board, and circuit connection material |
| JP2010004067A (en) * | 2009-09-16 | 2010-01-07 | Hitachi Chem Co Ltd | Circuit connection material |
-
1990
- 1990-11-16 JP JP30859390A patent/JPH04184887A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330712A (en) * | 1995-06-01 | 1996-12-13 | Teikoku Tsushin Kogyo Co Ltd | Method of fitting electronic chip part to substrate |
| JP2009182365A (en) * | 2009-05-21 | 2009-08-13 | Hitachi Chem Co Ltd | Manufacturing method of circuit board, and circuit connection material |
| JP2010004067A (en) * | 2009-09-16 | 2010-01-07 | Hitachi Chem Co Ltd | Circuit connection material |
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