JPH04162700A - Position sensing method of wiring board - Google Patents
Position sensing method of wiring boardInfo
- Publication number
- JPH04162700A JPH04162700A JP2289978A JP28997890A JPH04162700A JP H04162700 A JPH04162700 A JP H04162700A JP 2289978 A JP2289978 A JP 2289978A JP 28997890 A JP28997890 A JP 28997890A JP H04162700 A JPH04162700 A JP H04162700A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- board
- position detection
- wiring
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 7
- 239000004020 conductor Substances 0.000 claims abstract description 91
- 238000001514 detection method Methods 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 37
- 238000003384 imaging method Methods 0.000 claims description 10
- 239000012777 electrically insulating material Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 abstract description 15
- 239000000463 material Substances 0.000 abstract description 4
- 230000002411 adverse Effects 0.000 abstract description 3
- 239000003365 glass fiber Substances 0.000 abstract description 2
- 239000011810 insulating material Substances 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
概 要
本発明は、透光性の電気絶縁性材料から成る基板の一方
表面に配線用導体を形成するとともに、他方表面に配線
用導体が形成されていない位置で、その一方表面に前記
配線用導体の形成と同時に位置検出用導体を形成し、こ
の位置検出用導体は、基板の自動実装時に把持するため
などに用いられて完成後に分断されて廃棄される部分に
、形成されていてもよく、前記他方表面側から基板に向
けて光源から光を照射し、前記一方表面側にはテレビカ
メラを設けて位置検出用導体の像を撮像し、これによっ
て基板の正確な位置、また配線用導体の正確な位置を検
出し、その検出結果に基づいて、チップ部品などの面実
装部品を、基板に正確に位置決めして取付けることが可
能となる。[Detailed Description of the Invention] Overview The present invention includes forming a wiring conductor on one surface of a substrate made of a translucent electrically insulating material, and forming a wiring conductor on the other surface at a position where no wiring conductor is formed. A position detection conductor is formed on one surface at the same time as the wiring conductor is formed. , a light source may be irradiated from the other surface side toward the substrate, and a television camera may be provided on the one surface side to capture an image of the position detection conductor, thereby determining the accuracy of the substrate. It becomes possible to accurately position and mount surface-mounted components such as chip components on a board based on the detection results.
産業上の利用分野
本発明は、たとえば面実装部品などを取付ける配線基板
の自動実装のためなどに実施することができる位置検出
方法に関する。INDUSTRIAL APPLICATION FIELD The present invention relates to a position detection method that can be implemented, for example, for automatic mounting of wiring boards on which surface-mounted components are mounted.
従来の技術
典型的な先行技術は第５図に示されており、その一部の
断面は、第６図に示されている。電気絶縁性材料の基板
１の一方表面には、面実装部品であるチップ部品の集積
回路の端子を接続するために、多数のランド２が形成さ
れており、その付近には、そのランド２の形成と同時に
、位置検出用導体３が形成される。基板１の表面には、
ランド２以外の残余の領域に、フラックスなどの透光性
の保護層４が形成され、この保護層４は位置検出用導体
３を覆う。光源５から矢符６で示されるように光を照射
し、その反射光７をテレビカメラ８によって撮像し、こ
れによって基板１およびランド２の正確な位置を検出す
る。基板１は、取付は部材９によって、搬送手段に取付
けられて、第５図の左右方向に搬送される。Prior Art A typical prior art is shown in FIG. 5, a portion of which is shown in cross section in FIG. A large number of lands 2 are formed on one surface of a substrate 1 made of an electrically insulating material in order to connect terminals of integrated circuits of chip components that are surface-mounted components. Simultaneously with the formation, the position detection conductor 3 is formed. On the surface of the substrate 1,
A transparent protective layer 4 made of flux or the like is formed in the remaining area other than the land 2, and this protective layer 4 covers the position detection conductor 3. Light is emitted from a light source 5 as shown by an arrow 6, and the reflected light 7 is imaged by a television camera 8, thereby detecting the accurate positions of the substrate 1 and lands 2. The substrate 1 is attached to a conveying means by an attachment member 9, and is conveyed in the left-right direction in FIG.
発明が解決すべき課題
このような先行技術では、基板１上の位置検出用導体３
は、第７図（１）で示されるようにたとえば真円に形成
されているけれども、その上に保護層４が形成され、ま
た半田付けなどの影響によって、保護層４の表面には凹
凸ができている。したがってテレビカメラ８によって撮
像した画像を２値化した撮像結果３ａは、明瞭な真円の
輪郭を有していない、またその像３ａの２値化した結果
には、反射光の強度のばらつきによって、位置検出用導
体３として検出されない部分が生じることもあり得る。Problems to be Solved by the Invention In such prior art, the position detection conductor 3 on the substrate 1
As shown in FIG. 7(1), the protective layer 4 is formed, for example, in a perfect circle, but the surface of the protective layer 4 has irregularities due to the effects of soldering, etc. is made of. Therefore, the image capture result 3a obtained by binarizing the image captured by the television camera 8 does not have a clear perfect circular outline. , there may be a portion that is not detected as the position detection conductor 3.
したがってこのような検出結果の像３ａを２値化して画
像処理し、その図心を演算して求めても、基板１および
ランド２の正確な位置を検出することは困難である。こ
れによってその基板１に集積回路を自動的に正確に位置
決めして半田付けすることが困難となる。Therefore, it is difficult to detect the accurate positions of the substrate 1 and the lands 2 even if the image 3a of such a detection result is binarized and processed and its centroid is calculated. This makes it difficult to automatically accurately position and solder the integrated circuit to the substrate 1.
本発明の目的は、配線基板の位置を正確に検出すること
ができるようにした配線基板の位置検出方法を提供する
ことである。An object of the present invention is to provide a method for detecting the position of a wiring board, which enables accurate detection of the position of the wiring board.
課題を解決するための手段
本発明は、透光性の電気絶縁性材料の基板の一方゛表面
に、配線用導体を形成し、この一方表面にはまた、他方
表面に配線用導体が形成されない位置で、前記配線用導
体の形成と同時に位置検出用導体を形成し、
前記他方表面側から基板に光を照射し、前記一方表面側
から、撮像手段によって前記位置検出用導体の像を撮像
して、位置検出用導体の位置を検出することを特徴とす
る配線基板の位置検出方法である。Means for Solving the Problems The present invention forms a wiring conductor on one surface of a substrate made of a translucent electrically insulating material, and no wiring conductor is formed on the other surface of the substrate. forming a position detection conductor simultaneously with the formation of the wiring conductor; irradiating the substrate with light from the other surface side; and capturing an image of the position detection conductor from the one surface side using an imaging means; This is a method for detecting the position of a wiring board, characterized in that the position of a position detecting conductor is detected.
作 用
本発明に従えば、面実装部品などの電子部品が実装され
る基板は、透光性の電気絶縁性材料から成り、その一方
表面には、電子部品が半田付けによって取付けられるた
めのランドおよびその他の配線用導体が形成され、この
一方表面にはまた、位置検出用導体が形成され、配線用
導体と位置検出用導体とは、同時に形成され、たとえば
単一の共通マスクを用いて、ホトエツチングの手法で形
成され、したがって配線用導体と位置検出用導体との相
対的な位置は、高精度であり、この基板の他方表面側か
ら基板に光を照射し、位置検出用導体は、その他方表面
に配線用導体が形成されていなり位置に、上述のように
形成されており、したがって他方表面側からの光は、基
板を透過し、位置検出用導体によって部分的に遮断され
、一方表面側に設けられている撮像手段によって、その
位置検出用導体の像が撮像される。したがって位置検出
用導体の表面に透光性のフラックスなどのような保護層
が形成されていても、撮像手段によって位置検出用導体
の輪郭を明確に検出することができ、またその位置検出
用導体の表面の保護層に凹凸が存在していても、そのよ
うな凹凸に悪影響されることなく、位置検出用導体の形
状を正確に検出することができる。したがってこの位置
検出用導体の図心などを正確に演算して求め、配線基板
の位置および配線用導体の位置を高精度で検出すること
ができる。これによって基板の前記一方表面の配線用導
体に面実装部品などの電子部品を高精度で自動的に実装
することが可能となる。According to the present invention, the substrate on which electronic components such as surface-mounted components are mounted is made of a translucent electrically insulating material, and on the other hand, lands are provided on the surface to which electronic components are attached by soldering. and other wiring conductors are formed, and a position detection conductor is also formed on this one surface, and the wiring conductor and the position detection conductor are formed simultaneously, for example, using a single common mask. The wiring conductor and the position detection conductor are formed using a photo-etching method, so the relative positions of the wiring conductor and the position detection conductor are highly accurate. The wiring conductor is formed on one surface as described above, and the light from the other surface passes through the substrate and is partially blocked by the position detection conductor, and the light from the other surface side is partially blocked by the position detection conductor. An image of the position detection conductor is captured by an imaging means provided on the side. Therefore, even if a protective layer such as transparent flux is formed on the surface of the position detection conductor, the outline of the position detection conductor can be clearly detected by the imaging means, and the position detection conductor Even if there are irregularities in the protective layer on the surface, the shape of the position detection conductor can be accurately detected without being adversely affected by such irregularities. Therefore, the centroid of the position detection conductor can be accurately calculated and determined, and the position of the wiring board and the position of the wiring conductor can be detected with high precision. This makes it possible to automatically mount electronic components such as surface mount components on the wiring conductor on the one surface of the substrate with high precision.
実施例
第１図は本発明の一実施例の一部の斜視図であり、第２
図は第１図の切断面線■−■から見た一部の断面図であ
る。基板１１は、搬送方向１２に沿って複数、連続して
おり、この基板１１の一方表面１１ａ上には、本体部１
７に、面実装部品であるチップ部品の集積回路の端子が
半田付けなどによって接続されるための配線用導体であ
るランド１３が形成され、この一方表面１１ａにはまた
そのランド１３に連なる配線用導体が形成される。Embodiment FIG. 1 is a perspective view of a part of an embodiment of the present invention, and FIG.
The figure is a partial cross-sectional view taken along the section line ■--■ in FIG. A plurality of substrates 11 are continuous along the conveyance direction 12, and a main body 1 is disposed on one surface 11a of the substrate 11.
A land 13 is formed on the surface 11a as a wiring conductor to which the terminal of an integrated circuit of a chip component, which is a surface-mounted component, is connected by soldering or the like. A conductor is formed.
基板１１は、たとえばガラス繊維、紙繊維、ガラスエポ
キシ樹脂、紙フエノール樹脂などの材料から成り、透光
性であり、電気絶縁性である。 基板１１にはまた、ミ
シン目などの分断部分１４によって分断可能な被把持部
１５が形成され、この被把持部１５には、本発明に従う
位置検出用導体１６が形成される。基板１１の他方表面
１１ｂにおいて、前記配線用導体１３が形成されている
本体部１７では、その他の配線用導体が形成されていて
もよいけれども、被把持部１５では、その他方表面１１
ｂでは導体は形成されていない。配線用導体１３および
位置検出用導体１６は、たとえば銅またはアルミニウム
などの材料から成り、単一のマスクを用いてホトエツチ
ングの手法によって、形成される。したがって配線用導
体１３と位置検出用導体１６との相対的な位置は、高精
度である。基板１１の一方表面１１ａ上には、透光性の
フラックスなどのような保護層１８が形成される。集積
回路との接続を行う配線用導体１３は、保護層１８から
露出しており、また位置検出用導体１６は露出している
。基板１１の他方表面１１ｂに配線用導体が形成されて
いるとき、保護層が同様に形成されてもよい。この保護
層１８は、それが覆っている配線用導体の酸化などを防
ぐ働きをする。保護層１８は、上述のように位置検出用
導体１６を露出しており、このとき保護層１８は遮光性
であってもよい。本発明の他の実施例として、保護層１
８は位置検出用導体１６を覆っていてもよく、このとき
、保護層１８は透光性の材料から成る。The substrate 11 is made of a material such as glass fiber, paper fiber, glass epoxy resin, or paper phenolic resin, and is transparent and electrically insulating. The substrate 11 is also formed with a gripped portion 15 that can be separated by a dividing portion 14 such as a perforation, and a position detection conductor 16 according to the present invention is formed on this gripped portion 15. On the other surface 11b of the substrate 11, other wiring conductors may be formed in the main body portion 17 on which the wiring conductor 13 is formed, but in the gripped portion 15, the other surface 11
No conductor is formed in b. The wiring conductor 13 and the position detection conductor 16 are made of a material such as copper or aluminum, and are formed by photoetching using a single mask. Therefore, the relative positions of the wiring conductor 13 and the position detection conductor 16 are highly accurate. A protective layer 18 made of translucent flux or the like is formed on one surface 11a of the substrate 11. The wiring conductor 13 for connection with the integrated circuit is exposed from the protective layer 18, and the position detection conductor 16 is exposed. When a wiring conductor is formed on the other surface 11b of the substrate 11, a protective layer may be similarly formed. This protective layer 18 functions to prevent oxidation of the wiring conductor that it covers. The protective layer 18 exposes the position detection conductor 16 as described above, and at this time the protective layer 18 may have a light blocking property. As another embodiment of the present invention, the protective layer 1
8 may cover the position detection conductor 16, and in this case, the protective layer 18 is made of a translucent material.
基板１１の他方表面１１ｂ側（第１図および第２図の下
方）には光源２０が設けられ、この光源２０からは、基
板１１に光が照射される。基板１１の一方表面１１ａ側
（第１図および第２図の上方）には、撮像手段であるテ
レビカメラ２１が配置され、このテレビカメラ２１によ
って位置検出用導体１６の像を撮像することができる。A light source 20 is provided on the other surface 11b side of the substrate 11 (lower side in FIGS. 1 and 2), and the light source 20 irradiates the substrate 11 with light. A television camera 21 serving as an imaging means is arranged on the one surface 11a side of the substrate 11 (above FIGS. 1 and 2), and the television camera 21 can take an image of the position detection conductor 16. .
第３図は、本発明の一実施例の簡略化した全体の平面図
である。基板１１の前記他方表面１１ｂは、第２図に示
される搬送手段２３上に乗載され被把持部１５の側部は
、ベルト状の取付は部材２４によって搬送手段２３上に
取付けられて把持される。基板１１の本体部１７の被把
持部１５とは反対側（第３図の上方）の部分もまた、取
付は部材２５によって、搬送手段２３に取付けられて把
持される。こうして搬送手段２３とともに、取付は部材
２４．２５が搬送方向１２に移動して基板１１が搬送さ
れる。この搬送方向１２の途中に、前述の光源２０およ
びテレビカメラ２１が、固定位置で設けられる。FIG. 3 is a simplified overall plan view of one embodiment of the invention. The other surface 11b of the substrate 11 is mounted on a conveyance means 23 shown in FIG. Ru. A portion of the body portion 17 of the substrate 11 on the side opposite to the gripped portion 15 (upper part in FIG. 3) is also attached to the conveying means 23 and gripped by the attachment member 25. In this way, together with the transport means 23, the mounting members 24, 25 move in the transport direction 12, and the substrate 11 is transported. In the middle of this conveyance direction 12, the aforementioned light source 20 and television camera 21 are provided at fixed positions.
基板１１の被把持部１５にはまた、複数の位置決め孔２
６が形成されており、この位置決め孔２６には、第４図
に明らかに示されるように、固定位置に設けられた複数
の位置決めピン２７が、たとえば電磁ソレノイド２８に
よって駆動されて挿入可能である。テレビカメラ２１に
よる位置検出用導体１６の撮像時に、その位置決めピン
２７が第４図の下方に突出されて位置決め孔２６に挿通
し、このとき搬送手段２３、したがって基板１１は停止
された状態となる。The gripped portion 15 of the substrate 11 also has a plurality of positioning holes 2.
6 is formed, and a plurality of positioning pins 27 provided at fixed positions can be inserted into this positioning hole 26 by being driven by, for example, an electromagnetic solenoid 28, as clearly shown in FIG. . When the television camera 21 takes an image of the position detection conductor 16, the positioning pin 27 is projected downward in FIG. .
こうして搬送手段２３が停止され、位置決め孔２６に位
置決めピン２７が挿通した状態で、光源２０から光が基
板１１に照射され、テレビカメラ２１は、光源２０とは
反対側で、すなわち第１図および第２図の上方で、位置
検出用導体１６を撮像する。こうしてテレビカメラ２１
は、位置検出用導体１６の言わば影絵を撮像することに
なり、位置検出用導体１６の輪郭を正確に捕らえること
が可能となる。またそのテレビカメラ２１による位置検
出用導体１６の撮像は、位置検出用導体１６の表面の凹
凸などに悪影響されることはない。In this way, the conveying means 23 is stopped, and with the positioning pin 27 inserted into the positioning hole 26, light is irradiated from the light source 20 to the substrate 11, and the television camera 21 is placed on the opposite side from the light source 20, that is, as shown in FIG. An image of the position detection conductor 16 is taken in the upper part of FIG. In this way, TV camera 21
In this case, a so-called silhouette image of the position detection conductor 16 is captured, and the outline of the position detection conductor 16 can be accurately captured. Further, the imaging of the position detection conductor 16 by the television camera 21 is not adversely affected by the unevenness of the surface of the position detection conductor 16.
テレビカメラ２１によって撮像された位置検出用導体１
６の像は、２値化さ′れ、その像の画像処理を行うこと
によって図心を求め、これによって基板１１上に形成さ
れている位置検出用導体１６および配線用導体１３の正
確な位置を検出することが可能となる。このようにして
位置検出用導体１６および配線用導体１３の基板１１と
の相対的な位置を高精度に検出し、後続の工程で、位置
決め孔１６にピンを挿入した状態で配線用導体１３に、
微細な集積回路などの電子部品を、高精度で実装するこ
とが可能になる。Position detection conductor 1 imaged by television camera 21
The image 6 is binarized, and the image is processed to obtain the centroid, thereby determining the accurate positions of the position detection conductor 16 and the wiring conductor 13 formed on the substrate 11. It becomes possible to detect. In this way, the relative positions of the position detection conductor 16 and the wiring conductor 13 with respect to the substrate 11 are detected with high precision, and in the subsequent process, the wiring conductor 13 is inserted with the pin inserted into the positioning hole 16. ,
It becomes possible to mount electronic components such as minute integrated circuits with high precision.
本発明の他の実施例として、位置決め孔２６、位置決め
ビン２７および電磁ソレノイド２８などは省略されても
よく、また搬送手段２３による基板１１の搬送状態のま
まで、位置検出用導体１６をテレビカメラ２１によって
撮像するようにしてもよい。As another embodiment of the present invention, the positioning hole 26, the positioning pin 27, the electromagnetic solenoid 28, etc. may be omitted, and the position detection conductor 16 can be connected to the TV camera while the board 11 is being transported by the transport means 23. 21 may be used.
テレビカメラ２１に代えて、位置検出用導体１６を検出
するためのその他の撮像手段、たとえばラインイメージ
センサなとであってもよい。Instead of the television camera 21, other imaging means for detecting the position detection conductor 16, such as a line image sensor, may be used.
発明の効果
以上のように本発明によれば、透光性の電気絶縁性材料
の基板の一方表面に配線用導体を形成するとともに、そ
れと同時に位置検出用導体を形成し、この位置検出用導
体は、基板の他方表面に配線用導体が形成されない位置
に形成されており、この他方表面側から基板に光を照射
し、その基板を透過した光を、基板の前記一方表面側か
らテレビカメラなどの撮像手段によって撮像し、位置検
出用導体の位置を検出するようにしたので、撮像手段に
よって位置検出用導体の形状を正確に撮像して把握し、
したがってその図心などを正確に演算して求めることが
可能となり、これによって位置検出用導体の位置、した
がって配線基板の位置を正確に検出することが可能にな
る。Effects of the Invention As described above, according to the present invention, a wiring conductor is formed on one surface of a substrate made of a translucent electrically insulating material, and at the same time a position detection conductor is formed. is formed on the other surface of the board at a position where no wiring conductor is formed, and the board is irradiated with light from this other surface side, and the light transmitted through the board is transmitted from the one surface side of the board to a television camera, etc. Since the position of the position detection conductor is detected by imaging with the imaging means, the shape of the position detection conductor can be accurately imaged and grasped by the imaging means.
Therefore, it becomes possible to accurately calculate and obtain the centroid, etc., and thereby it becomes possible to accurately detect the position of the position detection conductor, and therefore the position of the wiring board.
【図面の簡単な説明】
第１図は本発明の一実施例の斜視図、第２図は第１図の
切断面線■−■から見た断面図、第３図はその実施例の
全体の平面図、第４図はその断面図、第５図は先行技術
の斜視図、第６図は第５図の位置検出用導体３付近の断
面図、第７図は第５図のテレビカメラ８による撮像結果
を説明するための図である。
１１・基板、ｌｌａ・一方表面、ｌｌｂ 他方表面、
１２・搬送方向、１３ 配線用導体、１６・位置検出用
導体、２０・・光源、２トテレビカメラ
代理人 弁理士 画数 圭一部
白
第６図
第７図[Brief Description of the Drawings] Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a cross-sectional view taken from the section line ■-■ in Fig. 1, and Fig. 3 is the whole of the embodiment. 4 is a sectional view thereof, FIG. 5 is a perspective view of the prior art, FIG. 6 is a sectional view of the vicinity of the position detection conductor 3 of FIG. 5, and FIG. 7 is a television camera of FIG. 5. FIG. 11・Substrate, lla・one surface, llb other surface,
12.Transportation direction, 13. Wiring conductor, 16.Position detection conductor, 20..Light source, 2.TV camera representative, patent attorney, number of strokes, Keiichi Shiro, Figure 6, Figure 7
Claims (1)
導体を形成し、この一方表面にはまた、他方表面に配線
用導体が形成されない位置で、前記配線用導体の形成と
同時に位置検出用導体を形成し、 前記他方表面側から基板に光を照射し、 前記一方表面側から、撮像手段によつて前記位置検出用
導体の像を撮像して、位置検出用導体の位置を検出する
ことを特徴とする配線基板の位置検出方法。[Scope of Claims] A wiring conductor is formed on one surface of a substrate made of a translucent electrically insulating material, and the wiring conductor is also formed on this one surface at a position where the wiring conductor is not formed on the other surface. Forming a position detection conductor simultaneously with the formation of the conductor, irradiating light onto the substrate from the other surface side, capturing an image of the position detection conductor from the one surface side using an imaging means, and detecting the position. 1. A method for detecting the position of a wiring board, the method comprising detecting the position of a conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2289978A JPH04162700A (en) | 1990-10-25 | 1990-10-25 | Position sensing method of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2289978A JPH04162700A (en) | 1990-10-25 | 1990-10-25 | Position sensing method of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04162700A true JPH04162700A (en) | 1992-06-08 |
Family
ID=17750195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2289978A Pending JPH04162700A (en) | 1990-10-25 | 1990-10-25 | Position sensing method of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04162700A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0718624A2 (en) * | 1994-12-19 | 1996-06-26 | AT&T Corp. | Method and apparatus for illuminating translucent and semi-transparent material |
| JP2000021680A (en) * | 1998-07-06 | 2000-01-21 | Tdk Corp | Manufacture of multilayer chip component and device |
-
1990
- 1990-10-25 JP JP2289978A patent/JPH04162700A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0718624A2 (en) * | 1994-12-19 | 1996-06-26 | AT&T Corp. | Method and apparatus for illuminating translucent and semi-transparent material |
| EP0718624A3 (en) * | 1994-12-19 | 1997-07-30 | At & T Corp | Method and apparatus for illuminating translucent and semi-transparent material |
| JP2000021680A (en) * | 1998-07-06 | 2000-01-21 | Tdk Corp | Manufacture of multilayer chip component and device |
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