JPH0416450Y2 - - Google Patents
Info
- Publication number
- JPH0416450Y2 JPH0416450Y2 JP1985114780U JP11478085U JPH0416450Y2 JP H0416450 Y2 JPH0416450 Y2 JP H0416450Y2 JP 1985114780 U JP1985114780 U JP 1985114780U JP 11478085 U JP11478085 U JP 11478085U JP H0416450 Y2 JPH0416450 Y2 JP H0416450Y2
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- led board
- light
- wire
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、特に屋外において情報表示用、広告
サイン用などに使用するために耐候性を向上する
目的でガラスバルブに封止される発光ダイオード
を光源とするランプに関するものである。[Detailed description of the invention] [Industrial application field] The present invention is a light emitting diode sealed in a glass bulb for the purpose of improving weather resistance for use in outdoor information displays, advertising signs, etc. This relates to a lamp that uses a light source as a light source.
従来この種の発光ダイオードランプは第２図に
示す構造となつていて、ステム１の二本の内部導
入線２の先端部を折曲げることで発光ダイオード
３が複数個取付けられたLED基板４をマウント
し、さらに直列抵抗器５及び他の一方の極の配線
を行つた後にバルブ６を前記ステムのフレヤー部
７で熱溶着して、前記バルブ６の内部を例えば窒
素ガスなどの不活性ガスに置換して封止し、口金
（図示せず）を取付けて外部導入線９を夫々に前
記口金に配線したものである。
Conventionally, this type of light emitting diode lamp has the structure shown in FIG. After mounting and wiring the series resistor 5 and the other pole, the bulb 6 is heat welded to the flare part 7 of the stem, and the inside of the bulb 6 is filled with an inert gas such as nitrogen gas. They are replaced and sealed, caps (not shown) are attached, and external lead-in wires 9 are wired to the caps, respectively.
しかしながら従来の技術においては、前記
LED基板４をマウントするのに内部導入線２を
折曲げて行うものであるので、該内部導入線２は
ステム１のガラス材との溶着を完全にするために
通常チヤコールなど鉄系の１ミリ径の線材が使用
されているので加工が困難であり、そのために前
記LED基板４が傾いて取付いたり、折曲が不充
分であり輸送中の振動などで前記LED基板４が
脱落するものを生じたり、あるいは、マウント作
業中に前記LED基板４が破損するなどの問題点
を生じていた。
However, in the conventional technology, the above
Since the internal lead-in wire 2 is bent to mount the LED board 4, the internal lead-in wire 2 is usually made of a 1 mm iron-based material such as charcoal to ensure complete welding to the glass material of the stem 1. It is difficult to process the LED board 4 because it uses a wire rod with a large diameter, and as a result, the LED board 4 may be installed at an angle, or the LED board 4 may fall off due to vibration during transportation due to insufficient bending. Otherwise, the LED board 4 may be damaged during mounting work.
本考案は上記した従来の問題点を解決するため
の具体的手段としてバルブに封止された発光ダイ
オードを光源とする発光ダイオードランプにおい
て、前記発光ダイオードを取付ける基板の中心線
上に二本のリベツトを固着し、該リベツトをステ
ムの内部導入線に溶接してマウントしたことを要
旨とする確実にマウントの出来る手段を提供する
ことによつて上記した問題点の解決を計つたもの
である。
The present invention is a specific means for solving the above-mentioned conventional problems, in which two rivets are installed on the center line of the substrate on which the light emitting diode is mounted in a light emitting diode lamp whose light source is a light emitting diode sealed in a bulb. The above-mentioned problems are solved by providing a reliable means of mounting, which is fixed and mounted by welding the rivet to the internal lead-in wire of the stem.
つぎに、本考案を第１図に示す一実施例に基づ
いて詳細に説明する。尚、理解を容易にするため
に従来例と同じ部分については同じ符号を付けて
説明する。
Next, the present invention will be explained in detail based on an embodiment shown in FIG. In order to facilitate understanding, the same parts as in the conventional example will be described with the same reference numerals.
図中符号１で示すものはステムであり、従来例
と同じものであり、同様に二本の内部導入線２及
び外部導入線９が設けられている。しかしながら
前記２本の内部導入線２は従来例のごとく折曲げ
てLED基板４を支持することなく、夫々がほぼ
水平となるまで広げられる様に曲げ加工を成され
ている。一方、発光ダイオード３を複数個配設し
たLED基板４にはその中心線上の位置に中心点
を対称として二本のリベツト１０が固着されてい
る。図ではこのリベツト１０が電源端子も兼ねる
ものであることを明確に示すために、前記発光ダ
イオード３のリードフレーム及び直列抵抗器５の
リード線部を配線した様子が示してあるが、これ
等は当然に前記LED基板４内でプリント配線を
行い、前記リベツト１０を固定するときに同時に
接続を成す様に設計することも自在である。 What is indicated by reference numeral 1 in the figure is a stem, which is the same as in the conventional example, and is similarly provided with two internal lead-in wires 2 and an external lead-in wire 9. However, the two internal lead-in wires 2 are not bent to support the LED board 4 as in the conventional example, but are bent so that they can be spread out until they are almost horizontal. On the other hand, two rivets 10 are fixed to an LED substrate 4 on which a plurality of light emitting diodes 3 are disposed at positions on its center line, symmetrical about the center point. In order to clearly show that this rivet 10 also serves as a power supply terminal, the figure shows how the lead frame of the light emitting diode 3 and the lead wire portion of the series resistor 5 are wired. Naturally, it is also possible to design the LED board 4 so that it is printed and connected at the same time as the rivet 10 is fixed.
以上説明をした様に夫々に加工、組立が行れた
ステム１とLED基板４は組立治具などの適宜な
方法によつて正確な相互位置が与えられて、前記
内部導入線２と前記リベツト１０の二組を夫々に
例えばスポツト溶接などの手段も用いて溶接を行
う。この後のバルブ封入、口金付けなどの工程は
従来例と全く同様であるので以後の説明は省略す
る。尚図中符号１１で示すものはステム１とバル
ブ６を熱溶着を行う時に、前記LED基板４に前
記発光ダイオード３が例えば半田付などで取付ら
れてある場合に、その熱溶着の熱によつて、前記
の半田付が再溶解するのを防止するための例えば
アルミニウムなどで形成された遮熱板である。 As explained above, the stem 1 and the LED board 4, which have been processed and assembled, are given accurate mutual positions using an appropriate method such as an assembly jig, and then the internal lead-in wire 2 and the rivet are aligned. The two sets of 10 are each welded using means such as spot welding. The subsequent steps such as valve sealing and cap attachment are completely the same as in the conventional example, so further explanation will be omitted. In addition, when the stem 1 and the bulb 6 are thermally welded together, the reference numeral 11 in the figure indicates that when the light emitting diode 3 is attached to the LED board 4 by soldering, etc., the heat of the thermal welding is applied. A heat shield plate made of aluminum or the like is used to prevent the solder from being remelted.
以上説明したようにLED基板の中心線上に二
本のリベツトを固着し、該リベツトと内部導入線
を溶接して前記LED基板をマウントすることに
より正確な位置にマウントが可能であり、前記
LED基板の取付工程上に生じる破損も皆無とし、
更には輸送中の振動による前記LED基板の脱落
するという事故も無くするなど優れた効果を奏す
るものである。
As explained above, by fixing two rivets on the center line of the LED board and welding the rivets and the internal lead-in wire to mount the LED board, it is possible to mount the LED board at an accurate position.
There is no damage caused during the installation process of the LED board,
Furthermore, it has excellent effects such as eliminating the accident of the LED board falling off due to vibration during transportation.
第１図は本考案に係る発光ダイオードランプの
一実施例の特にマウントの部品を要部で示す側面
図、第２図は従来例の要部を示す側面図である。
１……ステム、２……内部導入線、３……発光
ダイオード、４……LED基板、５……直列抵抗
器、９……外部導入線。
FIG. 1 is a side view showing the main parts of an embodiment of the light emitting diode lamp according to the present invention, particularly the mount parts, and FIG. 2 is a side view showing the main parts of a conventional example. 1... Stem, 2... Internal lead-in wire, 3... Light emitting diode, 4... LED board, 5... Series resistor, 9... External lead-in wire.
Claims (1)
る発光ダイオードランプにおいて、前記発光ダイ
オードを取付ける基板の中心線上に二本のリベツ
トを固着し、該リベツトをステムの内部導入線に
溶接してマウントしたことを特徴とする発光ダイ
オードランプ。 In a light-emitting diode lamp whose light source is a light-emitting diode sealed in a bulb, two rivets are fixed on the center line of the substrate on which the light-emitting diode is mounted, and the rivets are welded to the internal lead-in wire of the stem to mount it. A light emitting diode lamp featuring
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985114780U JPH0416450Y2 (en) | 1985-07-26 | 1985-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985114780U JPH0416450Y2 (en) | 1985-07-26 | 1985-07-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6223468U JPS6223468U (en) | 1987-02-13 |
| JPH0416450Y2 true JPH0416450Y2 (en) | 1992-04-13 |
Family
ID=30997828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985114780U Expired JPH0416450Y2 (en) | 1985-07-26 | 1985-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416450Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI421439B (en) * | 2008-03-21 | 2014-01-01 | Liquidleds Lighting Corp | Glass package LED bulb and its manufacturing method |
| JP5489630B2 (en) * | 2009-10-09 | 2014-05-14 | スタンレー電気株式会社 | Manufacturing method of light emitting diode |
-
1985
- 1985-07-26 JP JP1985114780U patent/JPH0416450Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6223468U (en) | 1987-02-13 |
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