JPH0412428A - Fuse element - Google Patents
Fuse elementInfo
- Publication number
- JPH0412428A JPH0412428A JP11365290A JP11365290A JPH0412428A JP H0412428 A JPH0412428 A JP H0412428A JP 11365290 A JP11365290 A JP 11365290A JP 11365290 A JP11365290 A JP 11365290A JP H0412428 A JPH0412428 A JP H0412428A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- fuse element
- oxide film
- point fusible
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002844 melting Methods 0.000 claims abstract description 32
- 230000008018 melting Effects 0.000 claims abstract description 26
- 229910000743 fusible alloy Inorganic materials 0.000 claims abstract description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 14
- 239000001301 oxygen Substances 0.000 claims abstract description 14
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 3
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 229910052737 gold Inorganic materials 0.000 claims abstract description 3
- 229910052738 indium Inorganic materials 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims abstract description 3
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 3
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 3
- 229910052718 tin Inorganic materials 0.000 claims abstract description 3
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 3
- 229910052709 silver Inorganic materials 0.000 claims abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 6
- 239000000956 alloy Substances 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 3
- 229910052745 lead Inorganic materials 0.000 abstract description 2
- 239000007791 liquid phase Substances 0.000 abstract 1
- 239000007790 solid phase Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910002056 binary alloy Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/06—Fusible members characterised by the fusible material
Landscapes
- Fuses (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電流ヒユーズに使用するヒユーズエレメントに
関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a fuse element used in a current fuse.
（従来の技術）
電流ヒユーズにおいては、過電流が流れると、ヒユーズ
エレメント自体のジュール熱によってヒユーズエレメン
トが溶断し、通電を遮断する。(Prior Art) In a current fuse, when an overcurrent flows, the fuse element melts due to the Joule heat of the fuse element itself, cutting off current flow.
ところで、電子部品を搭載した回路基板髪、当該基板に
装着した電流ヒユーズによって保護する場合、電流ヒユ
ーズエレメントの溶融温度が余り高いと、ヒユーズエレ
メントの溶断時に、回路基板が熱的に損傷しやすく、回
路基板の継続使用が不可能となる。By the way, when a circuit board equipped with electronic components is protected by a current fuse attached to the board, if the melting temperature of the current fuse element is too high, the circuit board is likely to be thermally damaged when the fuse element melts. Continued use of the circuit board becomes impossible.
従って、電流ヒユーズエレメントには、比較的融点の低
い低融点可溶合金を使用することが望ましく、その融点
は回路基板のはんだ付は温度を勘案して２５０℃〜３０
０℃にすることが妥当である。Therefore, it is desirable to use a low melting point fusible alloy with a relatively low melting point for the current fuse element.
It is appropriate to set the temperature to 0°C.
しかしながら、回路基板を保護対象とする電流ヒユーズ
においては、電子部品のコンパクト性との均衡上、ヒユ
ーズニレメン１へを極細化する必要があり、かかる極細
の低融点可溶合金線では、引っ張り強度が弱く、ヒユー
ズの製作中、運搬中等でのヒユーズエレメントの断線が
懸念される。However, in current fuses that protect circuit boards, it is necessary to make the fuse element 1 extremely thin in order to balance the compactness of electronic components, and such ultra-fine low melting point fusible alloy wires have low tensile strength. There is a concern that the fuse element may break during fuse manufacturing, transportation, etc.
本発明の目的は、低融点可溶合金線を電流ヒユーズエレ
メントとして使用可能ならしめることにある。An object of the present invention is to enable a low melting point fusible alloy wire to be used as a current fuse element.
（課題を解決するための手段）
本発明に係わるヒユーズエレメントは融点が２３０℃〜
３３０℃の低融点可溶合金体の表面に酸化被膜を設け、
表面積１ａｎ”当たりの酸素量を３゜０ ｐｐｍ以下で
且つ１ｇ当たりの酸素量を５０ｐｐｍ以下としたことを
特徴とする構成である。(Means for solving the problem) The fuse element according to the present invention has a melting point of 230°C ~
An oxide film is provided on the surface of the low melting point fusible alloy body at 330°C,
The structure is characterized in that the amount of oxygen per an inch of surface area is 3°0 ppm or less and the amount of oxygen per gram is 50 ppm or less.
（作用）
低融点可溶合金体表面の酸化被膜は、低融点可溶合金よ
りも硬く、従って、ヤング率が高く、ヒユーズエレメン
トに作用する力の相当部分を酸化被膜に負荷でき、低融
点可溶合金体に作用する応力を良く軽減できる。従って
、ヒユーズエレメントの断線が生じにくくなる。また、
１ｇ当たりの酸素量を５０ｐｐｍ以下としているので、
低融点可溶合金体の脆弱化を防止できる。更に、表面１
ａＴ当たりの酸素量を３．Ｏｐｐｍ以下としているので
、ヒユーズエレメントの溶断迅速性を充分保持でき、電
流ヒユーズの作動性を良く確保できる。(Function) The oxide film on the surface of the low-melting point fusible alloy is harder than the low-melting point fusible alloy, and therefore has a high Young's modulus, and a considerable portion of the force acting on the fuse element can be applied to the oxide film, making the low melting point possible. The stress acting on the molten alloy can be effectively reduced. Therefore, disconnection of the fuse element is less likely to occur. Also,
Since the amount of oxygen per gram is 50 ppm or less,
It is possible to prevent weakening of the low melting point fusible alloy body. Furthermore, surface 1
The amount of oxygen per aT is 3. Since it is set to less than Oppm, the speed of blowing out the fuse element can be maintained sufficiently, and the operability of the current fuse can be ensured well.
（実施例の説明）
図面は本発明の一実施例を用いた電流ヒユーズの一例を
示している。DESCRIPTION OF THE EMBODIMENTS The drawings show an example of a current fuse using an embodiment of the present invention.
図において、Ａは本発明に係わるヒユーズエレメントを
示し、融点が２３０６Ｃ〜３３０℃の低融点可溶合金体
の表面に酸化被膜を設け、表面積１ｃＩｒ１２当たりの
酸素量を３．０ｐｐｍ以下で且つ１ｇ当たりの酸素量を
５Ｑｐｐｍ以下としである。低融点可溶金属にはＰｂと
Ｓｎ、Ｉｎ、Ｓｂ、Ｂｉ、Ｃｄ、Ｚｎ、Ｐｄ、Ｐｔ、Ａ
ｇ、Ａｕ、Ｃｕとの二元または二元以上の合金を用いる
ことができる。In the figure, A indicates a fuse element according to the present invention, in which an oxide film is provided on the surface of a low melting point fusible alloy body with a melting point of 2306C to 330C, and the amount of oxygen per 1cIr12 surface area is 3.0ppm or less and per 1g. The amount of oxygen is 5Qppm or less. Low melting point soluble metals include Pb, Sn, In, Sb, Bi, Cd, Zn, Pd, Pt, A
A binary or more than binary alloy of g, Au, and Cu can be used.
合金組成には、ヒユーズエレメントの即断性、組織の安
定性などの面から、液相線と同相線との温度差の小さい
ものを使用することが好ましく、例えば、Ｐｂ９５重景
％重量ｎ５重量％（Ｐ ｂ −５Ｓｎと略称し、以下こ
の表現法で全ての合金組成を表す。）、Ｐｂ−５８ｎ−
１，５Ａｇ、Ｐｂ−２゜５Ａｇ、Ｐｂ−５Ｉｎ、Ｐｂ−
５Ｉｎ−２，５Ａｇ等を使用できる。ヒユーズエレメン
トの形状は、ワイヤー状、リボン状等になし得、ワイヤ
ー状の場合、線形は通常０．０５〜０．３ ｍｎ＋φ、
リボン状の場合厚は通常０．０３−０．２ｍｍ、巾は通
常０．５−３．０ｍｍである。For the alloy composition, it is preferable to use an alloy with a small temperature difference between the liquidus line and the in-phase line from the viewpoints of quick disconnection of the fuse element, stability of the structure, etc. For example, Pb95 weight% weight n5 weight% (abbreviated as Pb-5Sn, hereinafter all alloy compositions will be expressed using this expression), Pb-58n-
1,5Ag, Pb-2゜5Ag, Pb-5In, Pb-
5In-2, 5Ag, etc. can be used. The shape of the fuse element can be wire-shaped, ribbon-shaped, etc., and in the case of wire-shaped, the linear shape is usually 0.05 to 0.3 mn+φ,
In the case of a ribbon, the thickness is usually 0.03-0.2 mm, and the width is usually 0.5-3.0 mm.
図において、２はセラミックス板等の絶縁基板、３．３
は、導体であり、銅箔と絶縁基板との積層板の銅箔のエ
ツチングによって形成できる。４．４は導体３．３には
んだ又は導電性接着剤５によって固着した電極であり、
これらの電極４．４間に上記ヒユーズエレメントＡを溶
接（電気溶接、超音波溶接、レーザー溶接、冷間溶接）
によって橋設しである。上記はんだ付けに用いるはんだ
等の融点はヒユーズエレメントの融点よりも低くしであ
る。６は絶縁層、例えばエポキシ樹脂のモールド層であ
る。In the figure, 2 is an insulating substrate such as a ceramic plate, 3.3
is a conductor and can be formed by etching the copper foil of a laminate of copper foil and an insulating substrate. 4.4 is an electrode fixed to the conductor 3.3 with solder or conductive adhesive 5;
Weld the above fuse element A between these electrodes 4.4 (electric welding, ultrasonic welding, laser welding, cold welding)
The bridge was established by The melting point of the solder used for the soldering is lower than the melting point of the fuse element. 6 is an insulating layer, for example a mold layer of epoxy resin.
上記ヒユーズエレメントＡには、表面に酸化被膜を設け
てあり、この酸化被膜が低融点可溶合金体自体よりも硬
く、ヤング率が高いから、ヒユーズエレメントに作用す
る力の相当部分を酸化被膜に負荷でき、それだけ低融点
可溶合金体に作用する力従って、応力を良く減じうる。The above fuse element A has an oxide film on its surface, and since this oxide film is harder than the low melting point fusible alloy itself and has a high Young's modulus, a considerable portion of the force acting on the fuse element is transferred to the oxide film. The higher the load, the more the force acting on the low melting point fusible alloy body, and therefore the stress can be better reduced.
また１ｇ当たりの酸化量を５０ｐｐｍ以下に抑えである
から、ヒユーズエレメントの脆弱化を良く防止できる。Furthermore, since the amount of oxidation per gram is suppressed to 50 ppm or less, weakening of the fuse element can be effectively prevented.
従って、ヒユーズエレメントを極細化しても、ヒユーズ
エレメントの断線を防止できる。Therefore, even if the fuse element is made extremely thin, breakage of the fuse element can be prevented.
上記ヒユーズエレメントに過電流が流れると、ヒユーズ
エレメントはその過電流によるジュール熱によって溶断
する。この溶断温度を２３０℃〜３３０℃としであるか
ら、回路基板の熱的損傷を防止できる。この場合、表面
積ｆａｎ２当たりの酸素量を５０ｐｐｍ以下に抑えであ
るから、溶断をスムーズに行わせえ、電流を迅速に遮断
でき、ヒユーズエレメントの表面に酸化被膜を設けたに
もかかわらず、電流ヒユーズの迅速作動性を良く保証で
きる。When an overcurrent flows through the fuse element, the fuse element is blown out by Joule heat caused by the overcurrent. Since this fusing temperature is set at 230° C. to 330° C., thermal damage to the circuit board can be prevented. In this case, since the amount of oxygen per surface area fan2 is suppressed to 50 ppm or less, the fuse can be blown smoothly and the current can be cut off quickly. The rapid operation of the system can be well guaranteed.
このことは次ぎの試験結果からも明らかである。This is also clear from the following test results.
（試験結果）
低融点可溶合金体として、Ｐｂ−５８ｎ−１゜５Ａｇ、
Ｐｂ−２，５Ａｇ、Ｐｂ−５Ｉｎ、Ｐｂ−５Ｉｎ−２，
５Ａｇを用い、表面積１ ａ＋Ｖ当たりの酸素量２．８
ｐｐｍ〜３．０ｐｐｍ、１ｇ当たりの酸素量４５ ｐｐ
ｍ〜５０ ｐｐｍ、線径０．１ｍｍのヒユーズエレメン
トを製作した。これらのヒューズエレメントを用い、図
において、セラミックス基板の厚みを約０ 、６ ｎｕ
ｎ、エポキシ樹脂の厚みを約２．０ｍｍにして電流ヒユ
ーズを製作した。これらの各電流ヒユーズにおいて、そ
の電流ヒユーズのヒユーズエレメント（低融点可溶合金
）の融点よりも２〜３℃高い温度のバス中に浸漬し、該
浸漬後からヒユーズ溶断時までの時間を測定したところ
、全て２゜０秒以下であった。(Test results) As a low melting point fusible alloy body, Pb-58n-1゜5Ag,
Pb-2,5Ag, Pb-5In, Pb-5In-2,
Using 5Ag, the amount of oxygen per surface area 1 a+V is 2.8
ppm~3.0ppm, oxygen amount per 1g 45 ppm
A fuse element with a wire diameter of 0.1 mm and a wire diameter of 0.1 mm was manufactured. Using these fuse elements, the thickness of the ceramic substrate can be reduced to approximately 0.6 nu as shown in the figure.
A current fuse was manufactured using an epoxy resin with a thickness of approximately 2.0 mm. Each of these current fuses was immersed in a bath at a temperature 2 to 3 degrees Celsius higher than the melting point of the fuse element (low melting point fusible alloy) of the current fuse, and the time from the immersion until the fuse was blown was measured. However, all the times were less than 2°0 seconds.
本発明に係わるヒユーズエレメントにおいて、溶接性の
向上、酸化進行の抑制のために、酸化被膜上にＡｇ又は
ΔＵを蒸着、メツキ等により被覆しても良い。In the fuse element according to the present invention, Ag or ΔU may be coated on the oxide film by vapor deposition, plating, etc. in order to improve weldability and suppress progress of oxidation.
また、ヒユーズエレメントを回路基板の導体間に直接、
溶接、はんだ付けなどにより橋設することもできる。In addition, the fuse element can be placed directly between the conductors of the circuit board.
Bridges can also be constructed by welding, soldering, etc.
（発明の効果）
本発明に係わるヒユーズエレメントは、上述したとおり
の構成であり、低融点可溶合金体の表面に酸化被膜を、
ヒユーズエレメントの即断性を充分に保持させうる範囲
内の厚みで形成しであるから、ヒユーズの作動性を良く
保証して低融点可溶合金体（ヒユーズエレメント）の強
度を増強でき、極細の低融点可溶合金線を電流ヒユーズ
エレメントとして使用できる。従って、回路基板のコン
バク１へ化を損なうことなく、ヒユーズ溶断時発生熱に
よる回路基板の熱的損傷を防止しうる。(Effects of the Invention) The fuse element according to the present invention has the configuration as described above, and has an oxide film on the surface of the low melting point fusible alloy body.
Because the fuse element is formed with a thickness within a range that can sufficiently maintain the quick blowing property, it is possible to guarantee the operability of the fuse and increase the strength of the low melting point fusible alloy body (fuse element). Melting point fusible alloy wire can be used as the current fuse element. Therefore, thermal damage to the circuit board due to the heat generated when the fuse blows can be prevented without impairing the integrity of the circuit board.
図面は本発明に係わるヒユーズニレメン１−を使用した
電流ヒユーズを示す説明図である。
Ａ・・・ヒユーズエレメントThe drawing is an explanatory diagram showing a current fuse using the fuse element 1- according to the present invention. A... Fuse element
Claims (2)
面に酸化被膜を設け、表面積１ｃｍ＾２当たりの酸素量
を３．０ｐｐｍ以下で且つ１ｇ当たりの酸素量を５０ｐ
ｐｍ以下としたことを特徴とするヒューズエレメント。(1) An oxide film is provided on the surface of a low melting point fusible alloy body with a melting point of 230 to 330°C, and the amount of oxygen per 1 cm^2 of surface area is 3.0 ppm or less and the amount of oxygen per 1 g is 50 p.
A fuse element characterized by being less than pm.
ｂとＳｎ、Ｉｎ、Ｓｂ、Ｂｉ、Ｃｄ、Ｚｎ、Ｐｄ、Ｐｔ
、Ａｇ、Ａｕ、Ｃｕとの二元または二元以上の合金であ
ることを特徴とするヒューズエレメント。(2) In claim (1), the low melting point fusible metal body is P
b and Sn, In, Sb, Bi, Cd, Zn, Pd, Pt
, Ag, Au, and Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2113652A JP2860819B2 (en) | 1990-04-27 | 1990-04-27 | Fuse element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2113652A JP2860819B2 (en) | 1990-04-27 | 1990-04-27 | Fuse element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0412428A true JPH0412428A (en) | 1992-01-17 |
| JP2860819B2 JP2860819B2 (en) | 1999-02-24 |
Family
ID=14617700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2113652A Expired - Fee Related JP2860819B2 (en) | 1990-04-27 | 1990-04-27 | Fuse element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2860819B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000021278A (en) * | 1998-06-30 | 2000-01-21 | Yazaki Corp | Low melting point material fusing device and circuit breaking device |
| JP2002260518A (en) * | 2001-03-05 | 2002-09-13 | Dowa Mining Co Ltd | Zinc alloy for fuse, fuse and method for manufacturing fuse |
| US6774761B2 (en) * | 2002-03-06 | 2004-08-10 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
| US6819215B2 (en) * | 2002-03-06 | 2004-11-16 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
| US6963264B2 (en) * | 2002-07-11 | 2005-11-08 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and wire member for a thermal fuse element |
| US7042327B2 (en) * | 2002-10-30 | 2006-05-09 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and wire member for a thermal fuse element |
| KR100822184B1 (en) * | 2001-09-19 | 2008-04-16 | 삼성에스디아이 주식회사 | Thermal fuse for secondary cell |
| JP2013175361A (en) * | 2012-02-24 | 2013-09-05 | Kyocera Corp | Current fuse and electronic apparatus |
-
1990
- 1990-04-27 JP JP2113652A patent/JP2860819B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000021278A (en) * | 1998-06-30 | 2000-01-21 | Yazaki Corp | Low melting point material fusing device and circuit breaking device |
| JP2002260518A (en) * | 2001-03-05 | 2002-09-13 | Dowa Mining Co Ltd | Zinc alloy for fuse, fuse and method for manufacturing fuse |
| KR100822184B1 (en) * | 2001-09-19 | 2008-04-16 | 삼성에스디아이 주식회사 | Thermal fuse for secondary cell |
| US6774761B2 (en) * | 2002-03-06 | 2004-08-10 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
| US6819215B2 (en) * | 2002-03-06 | 2004-11-16 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
| US6911892B2 (en) | 2002-03-06 | 2005-06-28 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
| US6963264B2 (en) * | 2002-07-11 | 2005-11-08 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and wire member for a thermal fuse element |
| US7042327B2 (en) * | 2002-10-30 | 2006-05-09 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and wire member for a thermal fuse element |
| JP2013175361A (en) * | 2012-02-24 | 2013-09-05 | Kyocera Corp | Current fuse and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2860819B2 (en) | 1999-02-24 |
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