JPH04103809A - Manufacture for tappet - Google Patents
Manufacture for tappetInfo
- Publication number
- JPH04103809A JPH04103809A JP22358890A JP22358890A JPH04103809A JP H04103809 A JPH04103809 A JP H04103809A JP 22358890 A JP22358890 A JP 22358890A JP 22358890 A JP22358890 A JP 22358890A JP H04103809 A JPH04103809 A JP H04103809A
- Authority
- JP
- Japan
- Prior art keywords
- tappet
- bottom wall
- lower half
- half part
- upper half
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000003466 welding Methods 0.000 claims abstract description 16
- 239000000919 ceramic Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 9
- 238000010894 electron beam technology Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 12
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000005219 brazing Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000002485 combustion reaction Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000011195 cermet Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Valve-Gear Or Valve Arrangements (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は内燃機関をはじめ、産業用機被に月いるタベツ
Fに関するものである。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a tabetsu F used in industrial aircraft covers, including internal combustion engines.
「従来の技術」
近年、都市における大気汚染の原因は工場、焼却炉、暖
房器具、発電所など各種固定燃焼装置や近年急速に増加
した自動車、航空機などの移動発生源からの排出ガスで
ある。``Conventional Technology'' In recent years, air pollution in cities has been caused by exhaust gases from various fixed combustion devices such as factories, incinerators, heating appliances, and power plants, as well as from mobile sources such as automobiles and aircraft, which have increased rapidly in recent years.
こうし九公害の原因の一端である自動車においては、デ
ィーゼルエンジンが、排ガス規制の要請によシEGRを
採用した。その結果、内燃機関の摺動部品であるタペッ
トは、耐摩耗性の必要性が求められ、研究がなされてい
る。In automobiles, which are one of the causes of these nine types of pollution, diesel engines have adopted EGR as required by exhaust gas regulations. As a result, tappets, which are sliding parts of internal combustion engines, are required to have wear resistance, and research is being carried out.
かかる点に鑑み、タペットの金属製部品の必要部分にセ
ラミックチップをロー付けする技術が%開平2−658
09号公報として開示されている。この技術では、セラ
ミック以外の金属部分が一体にて構成されておル、ロー
付けと同時に硬化する金属を用いてその硬度t’HRc
46以上にしたものである。In view of this, the technique of brazing ceramic chips to the necessary parts of the metal parts of the tappet was developed in %K. 2-658.
It is disclosed as Publication No. 09. In this technology, the metal parts other than the ceramic are integrally constructed, and the hardness of the metal is t'HRc, which hardens at the same time as brazing.
46 or higher.
「発明が解決しようとする課題」
しかしながらタベツFにおいて、冒−付は熱熱理によっ
て鈍らない様な材料は、鉄鋼材料の中では比較的高価な
材料である。``Problem to be Solved by the Invention'' However, in Tabetsu F, the material whose adhesion does not dull due to heat treatment is a relatively expensive material among steel materials.
tた、これらの材料は、加工性もめまりよくなく、特に
深穴加工等が必要な場合は加工時間が長く、加工費も高
い。In addition, these materials do not have good workability, and especially when deep hole drilling is required, the processing time is long and the processing cost is high.
本発明は、セラミックチップの接合されたタペットを低
コストで提供することを目的とする。An object of the present invention is to provide a tappet with bonded ceramic chips at low cost.
「課Mt−解決するための手段」
そこで本発明は、上記の課題を解決する之めに、カムに
接触しセラミックチップのロー付けされた底壁と、Vリ
ンダ−ブロックのガイド孔に摺接するガイド部とからな
る有底筒状のタペットにおいて、ガイド部を構成する上
半部と底壁に連なる下半部とに分割し、上半部と下半部
管内側から溶接して一体とするタペットの製造方法でお
る。"Section Mt - Means for Solving" Therefore, in order to solve the above problems, the present invention makes sliding contact with the bottom wall that contacts the cam and has the ceramic chip brazed thereon, and the guide hole of the V cylinder block. In a bottomed cylindrical tappet consisting of a guide part, the tappet is divided into an upper half that constitutes the guide part and a lower half that connects to the bottom wall, and the upper half and lower half are welded together from the inside of the tube. This is a tappet manufacturing method.
溶接方法としては、熱の集中度が高い、電子ビーム溶接
又はレーザー溶接を用いるのがよい。As the welding method, it is preferable to use electron beam welding or laser welding, which has a high degree of heat concentration.
また、セラミックとしては、窒化珪素、ジルコニア、ア
ルミナ、超硬、サーメット等の摺動特性の優れた材料全
てを含む。Further, ceramics include all materials with excellent sliding properties such as silicon nitride, zirconia, alumina, carbide, and cermet.
ロー付は方法は、噸ヲミックの表面にメタフイズ熱理し
た後銀ロー、アルミロー等の金属ローによりロー付けす
る方法、活性金属のチタン、ジルコニウム等を含む銀ロ
ーにてメタルを直接接合する方法等の公知の手法にて行
う。Methods for brazing include methods of metamorphizing the surface of the wamic and then brazing with metal solder such as silver solder or aluminum solder, or directly joining metal with silver solder containing active metals such as titanium and zirconium. This is done using a known method.
超硬、サーメットは、金属ローにより直接接合する方法
にて行うか、必要に応じてセラミックスと金属の熟11
張差に起因するロー付は時の残留応力を1!和する為に
銅、ニッケル等を介在させてもよい。Carbide and cermet can be bonded directly using a metal solder, or if necessary,
The residual stress of brazing due to tension difference is 1! Copper, nickel, etc. may be interposed to improve the balance.
上手部と下半部の接合部は、凹凸嵌合が望ましい。It is desirable that the joint between the upper part and the lower half be a concave-convex fit.
「作用」
その作用は、タペットの金属部分を上半部と下半部に分
割し、下半部にセラミックチップをロー付は接合してい
るので、セラミックチップとのロー付は接合に適する高
価な金属材料金下半部にのみ使用すればよく、材料のコ
スト低減を図ることができる。``Function'' The function is that the metal part of the tappet is divided into an upper half and a lower half, and a ceramic chip is joined to the lower half by brazing. It is sufficient to use only the lower half of the metallic material gold, which can reduce the cost of the material.
そして、加工性の点についても、金属部分を上下に分割
することで、下半部の筒状部分の深さを浅くすることが
でき、加工性が悪い材料を使用しても比較的加工が容易
である。一方、下半部は、単純なパイプ状か又はそれに
近い形状になるため、加工が非常に容易である。従って
全体的に加工コストの低減金回ることができる。In terms of workability, by dividing the metal part into upper and lower parts, the depth of the lower cylindrical part can be made shallower, making it relatively easy to work with materials that are difficult to work with. It's easy. On the other hand, the lower half is very easy to process because it has a simple pipe shape or a similar shape. Therefore, overall processing costs can be reduced.
更に、下半部のデッVエロッドとの接触面(底壁の裏面
)の硬さが不足するときには、必要に応じて少なくとも
その接触面を電子ビーム焼入れやレーザー焼入れ等によ
夕部分的に硬化させることによって、耐摩耗性について
の要求を満足させ得る。Furthermore, if the hardness of the contact surface (back surface of the bottom wall) with the lower half of the deck V-rod is insufficient, at least that contact surface can be partially hardened by electron beam hardening, laser hardening, etc., if necessary. By doing so, the requirements for wear resistance can be satisfied.
そして更に、内側より溶接することによシ、Vりンダブ
ロックのガイド孔に摺接するガイド部にS*の余盛シが
生ずる心配もない。外周より溶接した場合は、その余盛
を削p加工しなければならないのに対して、この点でも
コスト低減が図れる。Furthermore, by welding from the inside, there is no need to worry about excess S* forming on the guide portion that comes into sliding contact with the guide hole of the V cylinder block. If welding is performed from the outer periphery, the extra material must be machined, but this also helps reduce costs.
また、上半部と下半部の接合部を凹凸嵌合する光め、上
手部と下半部の同軸度及び同心度をあげることができる
。Furthermore, the concentricity and concentricity of the upper and lower halves can be increased by fitting the upper and lower halves together.
「実施例」 以下に本発明の実施例を図面を参照しつつ説明する。"Example" Embodiments of the present invention will be described below with reference to the drawings.
[実施例1〉
第1図に示したようにタベツ)1は、円筒上のガイド部
3と底壁2によす有底筒状である。[Example 1] As shown in FIG. 1, the tube 1 has a cylindrical shape with a bottom and a cylindrical guide portion 3 and a bottom wall 2.
!El!2には、セラミックチップが接合されている。! El! A ceramic chip is bonded to 2.
そして、底壁2の内側面の中央には、プッシュロッド6
の下端を受ける半球状の凹部8が形成されている。A push rod 6 is provided at the center of the inner surface of the bottom wall 2.
A hemispherical recess 8 is formed to receive the lower end of.
しかして、本発明の製造方法によって得られたタベツ)
1は、ガイド部8を構成する上半部8aと底壁に連なる
下半部8bとに分割して、端面どうし凹凸嵌合し、該上
半部8&と下半部8btデッFa、ロッド611.つま
pは内側よ〕嵌合部を溶接して形成したものである。Accordingly, the tabetsu obtained by the production method of the present invention)
1 is divided into an upper half part 8a constituting the guide part 8 and a lower half part 8b connected to the bottom wall, and the end faces are fitted with concavities and convexities, and the upper half part 8& and the lower half part 8b are connected to the rod 611. .. The tab P is formed by welding the fitting part from the inside.
上半部の金属材料としては、JIS 840Cが好ま
しい、下半部の材料としては、JIS8NCM68 G
、JIS 5K024等が好ましい。The metal material for the upper half is preferably JIS 840C, and the material for the lower half is JIS8NCM68G.
, JIS 5K024, etc. are preferable.
セラミックチップ4Fi、81sN4含有率90重量−
の常圧焼結窒化珪素の円板t−研削加工して用いる。該
セラミックナツプ4は、前記下半部8bとの接合面を予
め蒸着法によりメタフィズ処理してもよい。Ceramic chip 4Fi, 81sN4 content 90 weight-
A disc of pressureless sintered silicon nitride is processed by T-grinding and used. The surface of the ceramic nap 4 to be joined to the lower half portion 8b may be subjected to metafusing treatment in advance by a vapor deposition method.
次に製造工程を説明する。Next, the manufacturing process will be explained.
先ず、上半部8aと下半部8bとは、別々に切削加工等
によって作られる。上半部8aは、全長45W1外径φ
20■、内径φ16mの円筒上となっている。下半部8
bは、外径φ20■、上半部8aとのはめあい部外径φ
16m111%はめあい長さ1mm、jEI!から接合
面まで10mとなっていて、そして接合面に、チタン、
噌すプデン、鋼が物理蒸着法のスパッタリングで蒸着し
である厚さ15謹、外径φ20■のセラミックチップ4
を銀ローを介してロー付けされる。First, the upper half part 8a and the lower half part 8b are made separately by cutting or the like. The upper half 8a has a total length of 45W1 and an outer diameter of φ
20 cm, and has a cylindrical shape with an inner diameter of 16 m. lower half 8
b is the outer diameter φ20■, the outer diameter φ of the fitting part with the upper half 8a
16m 111% fit length 1mm, jEI! It is 10m from the joint surface to the joint surface, and titanium,
Ceramic chip 4 with a thickness of 15 cm and an outer diameter of 20 mm, made of steel deposited by sputtering using the physical vapor deposition method.
The silver is soldered via solder.
ロー付は後の下半部の硬度は、HRC4Gであった。The hardness of the lower half after brazing was HRC4G.
こうしてできた上半部8at−下半部8bとを電子ビー
ふ溶接(図示省略)によって、内側よシ溶接した。溶接
余盛5は、内側に0.8−程度となったが、Vりンダグ
ロックのガイド孔に摺接する外周面には、余盛が生じて
いなかった。The thus-formed upper half 8at and lower half 8b were welded from the inside by electronic beam welding (not shown). Although the welding reinforcement 5 was about 0.8 - on the inner side, no excess was generated on the outer circumferential surface that slidably contacts the guide hole of the V cylinder lock.
溶接後の下半部の硬度は、HRC40であった。The hardness of the lower half after welding was HRC40.
「実施例2」
実施例10底壁の径をセラミックチップとの接合面へ近
づくほど大きくシ、セラミツクチ。"Example 2" Example 10 The diameter of the bottom wall was made larger as it approached the bonding surface with the ceramic chip.
プの径も該底壁の径にあわせて大きくしたもので他の点
は、同様である。The diameter of the tube is also increased to match the diameter of the bottom wall, but other points are the same.
「効果」
本発明の製造方法を用いて製作されたタペットは、材料
のコスト低減かつ加工賃用の削減、更に内側よシ溶接す
ることにより、外周より溶接するのに比べ余盛を加工除
去する必要がな〈産業上極めて有用な!ベット製造方法
である。"Effects" Tappets manufactured using the manufacturing method of the present invention reduce material costs and processing fees, and by welding from the inside, excess material can be removed by processing compared to welding from the outside. No need (extremely useful in industry! This is a bet manufacturing method.
111図は本発明の第1実施例である。@2図は、第2
実施例でおる。
1・・φタペット、2・・・底壁、8・・・ガイド部、
8a・・・上半部、8b・・・下半部、4・・・セラミ
ックチップ、5・・・S*部余盛、6・・・デッVエロ
ッド、7・・・カム、8・・・凹部第1図
第2図FIG. 111 shows a first embodiment of the present invention. @Figure 2 is the second
This is an example. 1...φ tappet, 2...bottom wall, 8...guide part,
8a...Upper half, 8b...Lower half, 4...Ceramic chip, 5...S* section excess, 6...Deck V Erod, 7...Cam, 8...・Concavity Fig. 1 Fig. 2
Claims (2)
底壁と、シリンダーブロックのガイド孔に摺接するガイ
ド部とからなる有底筒状のタペットにおいて、ガイド部
を構成する上半部と底壁に連なる下半部とに分割し、上
半部と下半部を内側から溶接して一体とするタペットの
製造方法。(1) In a bottomed cylindrical tappet consisting of a bottom wall that contacts the cam and is brazed with a ceramic chip, and a guide section that slides into guide hole of the cylinder block, the upper half and bottom wall that make up the guide section A method for manufacturing a tappet in which the tappet is divided into a lower half that is connected to the tappet, and the upper and lower halves are welded from the inside to be integrated.
る請求項(1)のタペットの製造方法。(2) The tappet manufacturing method according to claim (1), wherein the welding means is electron beam welding or laser welding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22358890A JPH04103809A (en) | 1990-08-24 | 1990-08-24 | Manufacture for tappet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22358890A JPH04103809A (en) | 1990-08-24 | 1990-08-24 | Manufacture for tappet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04103809A true JPH04103809A (en) | 1992-04-06 |
Family
ID=16800521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22358890A Pending JPH04103809A (en) | 1990-08-24 | 1990-08-24 | Manufacture for tappet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04103809A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020049092A (en) * | 2000-12-19 | 2002-06-26 | 이계안 | Tappet structure for rubbing reduction |
CN114893271A (en) * | 2022-06-07 | 2022-08-12 | 湖州通源机械零部件有限公司 | Plug-in tappet welding structure and process thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS628307B2 (en) * | 1977-09-12 | 1987-02-21 | Shinnittetsu Kagaku | |
JPS6375303A (en) * | 1986-09-19 | 1988-04-05 | Riken Corp | Combination valve lifter |
-
1990
- 1990-08-24 JP JP22358890A patent/JPH04103809A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS628307B2 (en) * | 1977-09-12 | 1987-02-21 | Shinnittetsu Kagaku | |
JPS6375303A (en) * | 1986-09-19 | 1988-04-05 | Riken Corp | Combination valve lifter |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020049092A (en) * | 2000-12-19 | 2002-06-26 | 이계안 | Tappet structure for rubbing reduction |
CN114893271A (en) * | 2022-06-07 | 2022-08-12 | 湖州通源机械零部件有限公司 | Plug-in tappet welding structure and process thereof |
CN114893271B (en) * | 2022-06-07 | 2024-04-19 | 湖州通源机械零部件有限公司 | Production process of plug-in tappet welding structure |
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