JP7515093B2 - CONTROL SYSTEM, SUBSTRATE MANUFACTURING SYSTEM, CONTROL METHOD, AND PROGRAM - Google Patents

Description

The present disclosure generally relates to a control system, a substrate manufacturing system, a control method, and a program. More specifically, the present disclosure relates to a control system that controls an application unit that applies a conductive bonding material to a substrate, and a substrate manufacturing system, a control method, and a program that use the same.

Patent Document 1 discloses an electronic component mounting system that mounts electronic components on a circuit board. This electronic component mounting system is equipped with a solder applicator that dispenses solder from a dispenser. The solder applicator has a function for inspecting the printed state of the solder printed on each electrode of the circuit board, and applies additional solder to electrodes where the amount of printed solder does not meet a predetermined standard amount.

JP 2014-103192 A

However, in the electronic component mounting system (circuit board manufacturing system) described in Patent Document 1, the solder application device (application section) applies solder (joint material) to the center position of the electrode (circuit board side electrode) corresponding to the solder section determined to have an insufficient amount of solder. Therefore, in this electronic component mounting system, even if the electronic component mounting device (mounting section) corrects the mounting position of the component after applying the solder, there is still a possibility that the component will be mounted in a position that is offset from the solder.

The present disclosure has been made in consideration of the above points, and aims to provide a control system, a board manufacturing system, a control method, and a program that can reduce the possibility of mounting a component in a position that is offset from the bonding material.

A control system according to one aspect of the present invention is a control system for controlling an application unit. The application unit applies a conductive bonding material from a head by facing the head to a board-side electrode provided on a board. The control system acquires board-side position information and component-side position information, and executes a determination process for determining an application position of the bonding material based on a position of the component-side electrode in the first coordinate system based on the component-side position information. The board-side position information is information representing a position of the board-side electrode on the board in the first coordinate system. The component-side position information is information representing a position of a component-side electrode of a component mounted on the board-side electrode in a second coordinate system. The position of the component-side electrode in the second coordinate system is set based on a component-side reference point. The application position is determined so as to match the position of the board-side reference point in the board-side position information with the position of the component-side reference point. In the determination process, a portion of the board-side electrode where the component-side electrode overlaps is determined as the application position.

A substrate manufacturing system according to one aspect of the present disclosure includes the above-described control system and the coating unit. The coating unit applies the bonding material from the head by positioning the head facing the coating position determined by the control system.

A control method according to an aspect of the present disclosure is a control method for controlling an applicator. The applicator applies a conductive bonding material from a head by facing the head to a board-side electrode provided on a board. The control method acquires board-side position information and component-side position information, and executes a determination process for determining an application position of the bonding material based on a position of the component-side electrode in the first coordinate system based on the component-side position information. The board-side position information is information representing a position of the board-side electrode on the board in the first coordinate system. The component-side position information is information representing a position of a component-side electrode of a component mounted on the board-side electrode in a second coordinate system. The position of the component-side electrode in the second coordinate system is set based on a component-side reference point. The application position is determined so as to match the position of the board-side reference point in the board-side position information with the position of the component-side reference point. In the determination process, a portion of the board-side electrode where the component-side electrode overlaps is determined as the application position.

A program according to an aspect of the present disclosure is a program for controlling an application unit. The application unit applies a conductive bonding material from a head by facing the head to a board-side electrode provided on a board. The program is a program for causing a computer system to execute a determination process. The determination process is a process of acquiring board-side position information and component-side position information, and determining an application position of the bonding material based on a position of the component-side electrode in the first coordinate system based on the component-side position information. The board-side position information is information representing a position of the board-side electrode on the board in the first coordinate system. The component-side position information is information representing a position of a component-side electrode of a component mounted on the board-side electrode in a second coordinate system. The position of the component-side electrode in the second coordinate system is set based on a component-side reference point. The application position is determined so as to match the position of the board-side reference point in the board-side position information with the position of the component-side reference point. In the determination process, a portion of the board-side electrode where the component-side electrode overlaps is determined as the application position.

The present disclosure has the advantage of reducing the possibility of mounting components in a position that is misaligned with the bonding material.

FIG. 1 is an explanatory diagram of a process for determining a bonding material application position by a control system according to an embodiment of the present disclosure. FIG. 2 is a block diagram showing a schematic configuration of a substrate manufacturing system using the above control system. FIG. 3 is an external perspective view of a coating unit in the substrate manufacturing system. FIG. 4 is a flow chart for explaining the operation of the above-mentioned substrate manufacturing system. FIG. 5 is a flow chart for explaining the operation of the control system. 6A and 6B are conceptual diagrams each showing an example of mounting of components when the application position of the bonding material is determined by the control system of the comparative example. 7A and 7B are conceptual diagrams each showing an example of mounting of components when the application position of the bonding material is determined by a control system according to an embodiment of the present disclosure. FIG. 8 is a conceptual diagram showing the application position of the bonding material when the application position of the bonding material is determined by a control system of a modified example of the embodiment of the present disclosure. 9A and 9B are block diagrams each showing a schematic configuration of a substrate manufacturing system according to a modified example of an embodiment of the present disclosure.

(1) Overview The control system 1 according to the present embodiment is used in a board manufacturing system 100 as shown in FIG. 2. The board manufacturing system 100 is used in a manufacturing line for manufacturing a board 6. In the present embodiment, the board 6 is, for example, a rectangular printed wiring board. In the present disclosure, "manufacturing a board" refers to manufacturing a board 6 on which components 7 are mounted by bonding component-side electrodes 71 of components 7 to corresponding board-side electrodes 61 provided on the board 6 with a bonding material A1 as shown in FIG. 1. In addition, in the present disclosure, a "component" refers to a surface-mounted electronic component such as a capacitor, resistor, inductor, transformer, IC (Integrated Circuit), connector, or switch. Note that the component 7 is not limited to the above electronic component, and may be another component as long as it has a component-side electrode 71 and can be mounted on the board-side electrode 61 of the board 6.

The control system 1 is a control system that controls the applicator 3. As shown in FIG. 3, the applicator 3 faces a head 31 to a board-side electrode 61 provided on a board 6, and applies a conductive bonding material A1 from the head 31. The bonding material A1 is, for example, solder such as cream solder, or a conductive paste. In this disclosure, "controlling the applicator" does not only mean directly controlling the applicator 3, but also includes indirectly controlling the applicator 3 by outputting control data to the applicator 3.

In other words, unlike a configuration in which the application unit 3 prints the bonding material A1 all at once onto the multiple board-side electrodes 61 provided on the substrate 6, the application unit 3 is configured to apply the bonding material A1 sequentially to each of the multiple board-side electrodes 61.

The control system 1 executes a determination process to determine the application position of the bonding material A1 based on the board-side position information and the component-side position information. In this embodiment, the determination process is executed for each of the multiple board-side electrodes 61 provided on the board 6. In other words, the application position of the bonding material A1 is determined for each of the multiple board-side electrodes 61. In this embodiment, the determination process is a feedforward process executed using the inspection results of the inspection unit 2 (described later) located upstream of the application unit 3.

The substrate-side position information is information that represents the position of the substrate-side electrode 61 in the first coordinate system C1. As shown in FIG. 1, the "first coordinate system" in this disclosure is an orthogonal coordinate system in which the longitudinal direction of the substrate 6 is the X direction, the lateral direction of the substrate 6 is the Y direction, and the thickness direction of the substrate 6 is the Z direction. That is, in this embodiment, the first coordinate system C1 is an orthogonal coordinate system in which one surface of the substrate 6 (here, the surface on which the substrate-side electrode 61 is provided) is the XY plane. The origin of the first coordinate system C1 may be set to, for example, any point on the one surface of the substrate 6 (for example, any vertex of the one surface of the substrate 6).

The component-side position information is information that represents the position in the second coordinate system C2 of the component-side electrode 71 of the component 7 mounted on the board-side electrode 61. The "second coordinate system" in this disclosure is an orthogonal coordinate system in which the longitudinal direction of the component 7 is the x-direction, the lateral direction of the component 7 is the y-direction, and the thickness direction of the component 7 is the z-direction. In other words, the second coordinate system C2 is an orthogonal coordinate system in which one surface of the component 7 (here, the surface on which the component-side electrode 71 is provided) is the xy plane. The origin of the second coordinate system C2 may be set to, for example, any point on the one surface of the component 7 (for example, any vertex of the one surface of the component 7). The first coordinate system C1 and the second coordinate system C2 are different coordinate systems.

In FIG. 1 and other drawings, arrows and the like representing the first coordinate system C1 are merely shown for the purpose of explanation and have no substance. Similarly, arrows and the like representing the second coordinate system C2 in FIG. 1 are merely shown for the purpose of explanation and have no substance. In FIG. 1 and each of FIGS. 6A to 8 described later, "61" indicates the substrate side electrode 61 after the substrate 6 expands or contracts, that is, the substrate side electrode when a positional shift occurs. In FIG. 1 and each of FIGS. 6A to 8 described later, "63" indicates a virtual substrate side electrode when the substrate 6 does not expand or contract, that is, when no positional shift occurs. The expansion and contraction of the substrate 6 will be described in detail in "(3.3) Comparison" described later.

As described above, the control system 1 of this embodiment determines the application position of the bonding material A1 based on the board-side position information and the component-side position information. In other words, by referring to the position of the component-side electrode 71 of the component 7, the control system 1 can easily determine the application position of the bonding material A1 at the location of the board-side electrode 61 that overlaps with the component-side electrode 71 when mounting the component 7 on the board 6. Therefore, the control system 1 of this embodiment has the advantage that, when mounting the component 7, it is easy to place the component-side electrode 71 on the bonding material A1 applied to the board-side electrode 61, and the possibility of mounting the component 7 at a position shifted from the bonding material A1 can be reduced.

(2) Basic Configuration The basic configuration of the control system 1 and the board manufacturing system 100 according to this embodiment will be described below. As shown in FIG. 2, the board manufacturing system 100 includes a control system 1, an inspection unit 2, a coating unit 3, a mounting unit 4, and a reflow unit 5. In this embodiment, each of these is configured as a unique device. In this embodiment, the board manufacturing system 100 is configured by connecting the inspection unit 2, the coating unit 3, the mounting unit 4, and the reflow unit 5 in series from the upstream side. Then, a board 6 having a plurality of board-side electrodes 61 on one surface is supplied to the inspection unit 2 by a conveying mechanism such as a belt conveyor. The board 6 is conveyed by the conveying mechanism in the order of the inspection unit 2, the coating unit 3, the mounting unit 4, and the reflow unit 5.

The inspection unit 2, coating unit 3, mounting unit 4, and reflow unit 5 are connected to the control system 1 via a communication network N1. The control system 1 transmits and receives signals to and from other functional units (here, the inspection unit 2, coating unit 3, mounting unit 4, and reflow unit 5) that constitute the board manufacturing system 100 via the communication network N1. The communication network N1 may be a wired communication network or a wireless communication network. Furthermore, the communication network N1 may be a network that combines a wired communication network and a wireless communication network.

The control system 1 is composed of, for example, one computer, and includes a control unit 11, a memory unit 12, and a communication unit 13.

The control unit 11 mainly comprises a computer system having a processor and memory. The functions of the control unit 11 are realized by the processor of the computer system executing a program recorded in the memory of the computer system. The program may be recorded in the memory, or may be provided via a telecommunications line such as the Internet, or may be recorded on a non-transitory recording medium such as a memory card and provided.

The memory unit 12 stores, for example, information referenced for control by the control unit 11. In this embodiment, the memory unit 12 stores component data. The component data is information about the components 7 to be mounted on the substrate 6, and is referenced directly or indirectly by the application unit 3 and the mounting unit 4. The component data also includes data for each component 7. For example, if the dimensions of the components 7 vary depending on the manufacturer even for the same type of components 7, the component data will include data for the components 7 for each manufacturer.

The component data includes component-side position information such as the outer shape, size, number of component-side electrodes 71, position of the component-side electrodes 71, and dimensions of the component-side electrodes 71. In this embodiment, the component-side position information is specified by the coordinates of the component-side reference point 72 (see FIG. 1) of the component 7 in the second coordinate system C2 as the center, and the distance from the component-side reference point 72. That is, in this embodiment, the position of the component-side electrode 71 in the second coordinate system C2 is set based on the component-side reference point 72. The component data also includes mounting operation information that specifies the conditions of the mounting operation of the component 7 by the mounting unit 4. The mounting operation information includes, for example, the type of suction nozzle used corresponding to the type of component 7, the suction speed of the suction nozzle, and the mounting speed of the suction nozzle. The suction speed is the speed at which the suction nozzle picks up and removes the component 7 from the component supply unit (e.g., a tape feeder). The mounting speed is the speed at which the suction nozzle places the picked-up component 7 on the board 6. In addition, the component data includes information indicating the mounting position of the component 7 on the board 6 to be manufactured. The mounting position of the component 7 is expressed, for example, by coordinates in the first coordinate system C1.

The communication unit 13 is a communication interface that communicates with the inspection unit 2, application unit 3, mounting unit 4, and reflow unit 5 using a wired communication method via the communication network N1.

In this embodiment, the control system 1 functions as a management computer that manages these functional units by sending and receiving signals between the inspection unit 2, the application unit 3, the mounting unit 4, and the reflow unit 5. For example, the control system 1 acquires the inspection results from the inspection unit 2. The control system 1 then outputs the acquired inspection results or data calculated based on the acquired inspection results to the application unit 3, the mounting unit 4, or the reflow unit 5. As a result, the application unit 3, the mounting unit 4, or the reflow unit 5 executes control based on the data acquired from the control system 1. In other words, the control system 1 directly or indirectly feeds forward the downstream device based on the data acquired from the upstream device. The control system 1 also directly or indirectly feedback controls the upstream device based on the data acquired from the downstream device. Below, the function of the control system 1 to control the application unit 3 will be mainly described.

In addition, in this embodiment, the control system 1 controls the application unit 3 by outputting data representing the application position of the bonding material A1 determined by the determination process to the application unit 3 via the communication network N1. The determination process will be described in detail in "(3.2) Operation of the control system" below.

The inspection unit 2 detects the position of the board side electrode 61 provided on the board 6, and outputs the inspection result indicating the position of the board side electrode 61 on the board 6 to the control system 1 via the communication network N1. In other words, the inspection unit 2 inspects the position of the board side electrode 61 in the first coordinate system C1. The inspection unit 2 has a positioning unit that positions the board 6 transported by the transport mechanism at a predetermined position, and a camera that captures the board 6 positioned in the positioning unit. The inspection unit 2 detects the position of the board side electrode 61 on the board 6 by image processing the image capture result of the camera. In this embodiment, the position of the board side electrode 61 on the board 6 is detected based on a recognition mark that is previously attached to the board 6. The recognition mark is provided, for example, at a corner of the mounting surface of the board 6. In addition, the recognition mark is provided, for example, in the vicinity of the board side electrode 61 on which a component that requires mounting accuracy is mounted among the multiple board side electrodes 61. In this case, for example, a pair of recognition marks are provided to sandwich the board side electrode 61. The inspection unit 2 outputs the inspection results to the control system 1 as board side position information.

As shown in FIG. 3, the application unit 3 includes a head 31 and a drive mechanism 32. The head 31 includes a camera for capturing an image of the substrate 6, and a discharge mechanism for discharging the bonding material A1 (solder in this case), such as a jet dispenser. The drive mechanism 32 is configured to slide the head 31 in each of the X, Y, and Z directions by a built-in motor. The application unit 3 faces the head 31 to the application position determined by the control system 1, and applies the bonding material A1 from the head 31. In this embodiment, the application unit 3 applies the bonding material A1 to the coordinates (X coordinate, Y coordinate) in the first coordinate system C1 of the substrate 6 determined by the control system 1.

The application unit 3 recognizes the position of the substrate 6 by capturing an image of the substrate 6 with a camera while the substrate 6 is positioned in the positioning unit. Then, the head 31 is moved by the drive mechanism 32 to a position facing the substrate side electrode 61 to be applied. At this time, the head 31 moves in the X and Y directions in the first coordinate system C1, that is, on the XY plane (virtual plane). Also, at this time, the head 31 moves to above the substrate side electrode 61 to be applied, which is the substrate side electrode 61 to be applied, and is determined by the control system 1. Then, the head 31 is lowered toward the substrate side electrode 61 by the drive mechanism 32, and applies the bonding material A1 to the application position of the substrate side electrode 61 to be applied by discharging the bonding material A1 in the lowered state. At this time, the head 31 moves in the Z direction in the first coordinate system C1. After that, the head 31 is raised by the drive mechanism 32 in a direction away from the substrate side electrode 61. The head 31 then repeats the above operation until bonding material A1 has been applied to all of the substrate-side electrodes 61 to be applied.

The mounting unit 4 has a positioning unit that positions the board 6 transported by the transport mechanism, a head, and a drive mechanism. The head has a camera that captures an image of the board 6, and a suction nozzle that picks up the component 7. The drive mechanism is configured to slide the head in each of the X, Y, and Z directions using an attached motor. The mounting unit 4 mounts the component 7 on the board 6 so that the component-side electrodes 71 of the component 7 overlap the corresponding board-side electrodes 61.

With the target board 6 positioned in the positioning section, the mounting section 4 recognizes the position of the board 6 by capturing an image of the board 6 with a camera. The head then moves to the component supply section by the drive mechanism, and picks up the target component 7 with the suction nozzle. The head then moves to a position facing the target board side electrode 61. The head then moves down toward the board side electrode 61 by the drive mechanism, and places the component 7 on the board side electrode 61 (the bonding material A1 applied to the board side electrode 61) in the lowered state. The head then moves up by the drive mechanism in a direction away from the board side electrode 61. The head then repeats the above operations until components 7 have been mounted on all of the target board side electrodes 61.

In this embodiment, before mounting the component 7 on the board 6, the mounting unit 4 obtains the inspection results from the inspection unit 2, i.e., the board-side position information, from the control system 1. In other words, the control system 1 further has a mounting control function of outputting information for control based on the board-side position information to the mounting unit 4 which mounts the component 7 on the board 6. Also, in this embodiment, the mounting control function is realized by outputting to the mounting unit 4 the board-side position information used by the control system 1 to determine the application position. In other words, in this embodiment, the "information for control based on the board-side position information" is the board-side position information itself.

Therefore, by referring to the board-side position information, the mounting unit 4 is able to grasp the positions of the board-side electrodes 61 on the board 6 on which the component 7 is to be mounted. Therefore, the mounting unit 4 is able to mount the component 7 on the board 6 so that the component-side electrodes 71 of the component 7 corresponding to the board-side electrodes 61 overlap. For example, the mounting unit 4 corrects the mounting position of the component 7 by referring to the board-side position information, and mounts the component 7 at the corrected mounting position. For example, when mounting a component 7 corresponding to two board-side electrodes 61, the mounting position is corrected by finding the center position shift between the two board-side electrodes 61 by referring to the board-side position information.

The reflow unit 5 heats the board 6 on which the component 7 is mounted by the mounting unit 4, thereby bonding the component 7 to the board 6. Specifically, the reflow unit 5 heats and melts the bonding material A1 by passing the board 6, which is transported by a transport mechanism, through a heating chamber having one or more heating zones, each of which is heated under a predetermined temperature condition. The melted bonding material A1 wets the board side electrode 61 and the component side electrode 71, and then cools and solidifies. As a result, the component side electrode 71 is bonded to the board side electrode 61 via the bonding material A1. The reflow unit 5 may perform a process of cooling the bonding material A1 with a cooler after the process of heating the bonding material A1 in the heating chamber.

(3) Operation Hereinafter, the operation of the control system 1 and the substrate manufacturing system 100 of the present embodiment will be described.

(3.1) Operation of the Substrate Manufacturing System First, the basic operation of the substrate manufacturing system 100 will be described with reference to FIG. 4. First, the inspection unit 2 performs an inspection of the substrate 6 transported by the transport mechanism (S1). This detects the positions of the substrate-side electrodes 61 on the substrate 6. The inspection result in the inspection unit 2 is output to the control system 1 as substrate-side position information (S2). Then, the substrate 6 inspected in the inspection unit 2 is transported to the coating unit 3 by the transport mechanism.

The control system 1 acquires information (component-side position information) of the components 7 to be mounted on the board 6 transported to the application unit 3 from the storage unit 12. Then, the control system 1 executes a determination process (described below) for each of all board-side electrodes 61 of the board 6 based on this component-side position information and the board-side position information acquired from the inspection unit 2. Application position information regarding the application positions determined by the determination process is output from the control system 1 to the application unit 3.

The coating unit 3 applies the bonding material A1 to each of the substrate-side electrodes 61 of the substrate 6 transported by the transport mechanism at a coating position based on the coating position information acquired from the control system 1 (S3). The substrate 6 to which the bonding material A1 has been applied by the coating unit 3 is transported to the mounting unit 4 by the transport mechanism.

The mounting unit 4 mounts components 7 so that the component electrodes 71 of the corresponding components 7 overlap with each of the board electrodes 61 of the board 6 transported by the transport mechanism (S4). The board 6 on which the components 7 have been mounted by the mounting unit 4 is transported to the reflow unit 5 by the transport mechanism.

Then, the reflow unit 5 performs a reflow process by heating the board 6 transported by the transport mechanism (S5). This melts the bonding material A1 applied to each of all board-side electrodes 61, and the component-side electrodes 71 are bonded to the board-side electrodes 61 by the molten bonding material A1. This completes the mounting of the component 7 on the board 6.

(3.2) Operation of the Control System Next, the operation of the control system 1 will be described with reference to FIG. 5. The control system 1 executes the following determination process before the substrate 6 is transported to the coating unit 3 by the transport mechanism. The determination process is executed for each of all substrate-side electrodes 61 of the substrate 6. When executing the determination process, the control system 1 acquires substrate-side position information to be used in the determination process (S11). In this embodiment, the control system 1 acquires the inspection result in the inspection unit 2 as substrate-side position information via the communication network N1. In addition, in this embodiment, the substrate-side reference point 62 shown in FIG. 1 is used as the substrate-side position information. The substrate-side reference point 62 is obtained from the positions in the first coordinate system C1 of the plurality of substrate-side electrodes 61 on which the components 7 are mounted. Specifically, when the component 7 has two substrate-side electrodes 71, the component 7 also has two substrate-side electrodes 61 on which the components 7 are mounted. The midpoint of the line segment connecting the center points of the two substrate-side electrodes 61 is the substrate-side reference point 62.

Next, the control system 1 acquires the component-side position information (S12). In this embodiment, the control system 1 acquires the component-side position information of the component 7 to be mounted by reading the component-side position information from the storage unit 12. Note that the above steps S11 and S12 may be reversed. In this embodiment, the component-side reference point 72 shown in FIG. 1 is used as the component-side position information. The component-side reference point 72 is determined from the positions of the multiple component-side electrodes 71 of the component 7 in the second coordinate system C2. Specifically, when the component 7 has two component-side electrodes 71, the midpoint of the line segment connecting the center points of the two component-side electrodes 71 becomes the component-side reference point 72.

Then, the control system 1 determines the application position of the bonding material A1 based on the board-side position information and the component-side position information (S13). In this embodiment, the application position is determined so as to match the position of the board-side reference point 62 in the board-side position information with the position of the component-side reference point 72. That is, in this embodiment, the control system 1 converts the position of the component-side reference point 72 in the second coordinate system C2 to a position in the first coordinate system C1 by calculation. Then, when the position of the board-side reference point 62 in the first coordinate system C1 and the position of the component-side reference point 72 in the first coordinate system C1 match, the control system 1 determines the position where the corresponding component-side electrodes 71 overlap in the board-side electrodes 61 as the application position of the bonding material A1. After that, the control system 1 indirectly controls the application unit 3 by outputting application position information including the determined application position to the application unit 3 via the communication network N1 (S14).

(3.3) Comparison The advantages of the control system 1 of this embodiment will be described below with reference to FIGS. 6A to 7B, along with a comparison with a control system of a comparative example. The control system of the comparative example is different from the control system 1 of this embodiment in that it determines the application position of the bonding material A1 without using component-side position information. The control system of the comparative example may cause a mounting failure of the component 7 when the position of the board-side electrode 61 on the board 6 is shifted. The position shift of the board-side electrode 61 may occur when the board 6 expands or contracts due to temperature change or warping of the board 6. In addition, due to miniaturization of the component 7, a flexible board such as a film-like board may be required as the board 6. If the board 6 is a board that is easily deformed such as a flexible board, the board 6 is easily stretched, and as a result, the position shift of the board-side electrode 61 is more likely to occur.

In the control system of the comparative example, the application position of the bonding material A1 is determined using only the board-side position information in the determination process. That is, in the control system of the comparative example, the center of the board-side electrode 61 is determined as the application position, for example, based on the board-side position information (i.e., the position of the board-side electrode 61 on the board 6). At this time, the control system of the comparative example does not refer to information about the component 7. Therefore, even if the position of the board-side electrode 61 shifts due to, for example, the expansion and contraction of the board 6, the control system of the comparative example simply determines a predetermined specific position of the board-side electrode 61 (here, the center of the board-side electrode 61) as the application position.

Here, in a board manufacturing system equipped with a control system of the comparative example instead of the control system 1 of this embodiment, it is assumed that a component 7 having two component-side electrodes 71 is mounted on any two board-side electrodes 61 of a board 6. It is also assumed that the board 6 extends in the X direction, so that the distance between the two board-side electrodes 61 is longer than the normal distance. The "normal distance" here refers to the distance between two virtual board-side electrodes 63 when the board 6 does not expand or contract. In this case, the control system of the comparative example determines the center of each of the two board-side electrodes 61 as the application position of the bonding material A1 by referring only to the board-side position information in the determination process. Then, the application unit 3 applies the bonding material A1 to the application position (i.e., the center of the board-side electrode 61) determined by the control system of the comparative example for each of the two board-side electrodes 61, as shown in FIG. 6A. Here, the distance between the centers of the two bonding materials A1 is longer than the distance between the centers of the two component-side electrodes 71. Therefore, as shown in FIG. 6B, even if the mounting section 4 places one of the two component side electrodes 71 on one of the two bonding materials A1, it cannot place the other component side electrode 71 on the other bonding material A1. Even if the other component side electrode 71 can be placed on the other bonding material A1, the component 7 will be placed on the bonding material A1 in an unstable state. Even if the board 6 is heated in the reflow section 5 in this state, the mounting of the component 7 will be completed without sufficient electrical connection between the board side electrode 61 and the component side electrode 71, which may lead to a mounting failure of the component 7.

Next, assume that a component 7 having two component-side electrodes 71 is mounted on two board-side electrodes 61 in a board manufacturing system 100 equipped with the control system 1 of this embodiment under the same conditions as above. In this case, the control system 1 refers to not only the board-side position information but also the component-side position information in the determination process. As a result, as shown in FIG. 7A, when the board-side reference point 62 and the component-side reference point 72 coincide with each other, the control system 1 determines the overlapping portion of the corresponding component-side electrode 71 in each of the two board-side electrodes 61 as the application position of the bonding material A1. Here, the control system 1 determines the application position of the bonding material A1 in each of the two board-side electrodes 61 as a position closer to the other board-side electrode 61 than the center. Since the application positions are determined in this manner, the distance between the centers of the two bonding materials A1 is approximately the same as the distance between the centers of the two component-side electrodes 71. Therefore, as shown in FIG. 7B, the mounting section 4 can stably place the corresponding component-side electrode 71 at the application position of the bonding material A1 on each of the two board-side electrodes 61. If the board 6 is heated in the reflow section 5 in this state, the mounting of the component 7 can be completed with sufficient electrical connection between the board-side electrode 61 and the component-side electrode 71, making it less likely that mounting defects will occur with the component 7.

As described above, the control system 1 of this embodiment has the advantage that when mounting the component 7, the component-side electrode 71 can be easily placed on the bonding material A1 applied to the board-side electrode 61, reducing the possibility of mounting the component 7 at a position offset from the bonding material A1.

(4) Modifications The above-described embodiment is merely one of various embodiments of the present disclosure. The above-described embodiment can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. In addition, functions similar to those of the control system 1 may be embodied in a control method, a computer program, or a non-transitory recording medium on which a computer program is recorded, etc.

The control method according to one embodiment is a control method for controlling the applicator 3. The applicator 3 applies conductive bonding material A1 from a head 31 facing a board-side electrode 61 provided on a board 6. The control method determines the application position of the bonding material A1 based on board-side position information and component-side position information. The board-side position information is information that represents the position of the board-side electrode 61 on the board 6 in a first coordinate system C1. The component-side position information is information that represents the position of a component-side electrode 71 of a component 7 mounted on the board-side electrode 61 in a second coordinate system C2.

The program according to one embodiment is a program for controlling the applicator 3. The applicator 3 applies conductive bonding material A1 from the head 31 by facing the head 31 to a board-side electrode 61 provided on the board 6. The program is a program for causing a computer system to execute a determination process. The determination process is a process for determining the application position of the bonding material A1 based on board-side position information and component-side position information. The board-side position information is information representing the position of the board-side electrode 61 on the board 6 in a first coordinate system C1. The component-side position information is information representing the position of the component-side electrode 71 of the component 7 mounted on the board-side electrode 61 in a second coordinate system C2.

Below, we list some variations of the above-mentioned embodiment. The variations described below can be applied in appropriate combinations.

The substrate manufacturing system 100 in the present disclosure includes a computer system, for example, in the control system 1. The computer system is mainly composed of a processor and a memory as hardware. The processor executes a program recorded in the memory of the computer system, thereby realizing the function of the control system 1 in the present disclosure. The program may be pre-recorded in the memory of the computer system, may be provided through an electric communication line, or may be provided by being recorded in a non-transitory recording medium such as a memory card, an optical disk, or a hard disk drive that can be read by the computer system. The processor of the computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI). The multiple electronic circuits may be integrated in one chip or may be distributed across multiple chips. The multiple chips may be integrated in one device or may be distributed across multiple devices.

In addition, it is not essential for the control system 1 that multiple functions are concentrated in one housing, and the components of the control system 1 may be distributed across multiple housings. Furthermore, at least some of the functions of the control system 1 may be realized, for example, by the cloud (cloud computing) or the like.

In the above-described embodiment, at least some of the functions of the substrate manufacturing system 100 that are distributed among multiple devices may be consolidated within a single housing. For example, in the above-described embodiment, the inspection unit 2, coating unit 3, mounting unit 4, and reflow unit 5 are each realized by a unique device, but all of these functions may be consolidated into a single device, or may be distributed among two or more devices.

In the above embodiment, the control system 1 is realized by a single computer, but this is not intended to be limiting. For example, the control system 1 may be realized by a computer system provided in any one of the multiple devices that respectively constitute the inspection unit 2, the application unit 3, the mounting unit 4, and the reflow unit 5.

In the above embodiment, the substrate 6 to be manufactured by the substrate manufacturing system 100 is one substrate, but this is not intended to be limiting. For example, the substrate 6 to be manufactured by the substrate manufacturing system 100 may be multiple substrates. In this case, the multiple substrates are sequentially transported by the transport mechanism to the inspection unit 2, the coating unit 3, the mounting unit 4, and the reflow unit 5 while being attached to a table, for example, with double-sided tape. In this case, the multiple substrates are treated as substrates 6. That is, the process by the substrate manufacturing system 100 is performed for each of the multiple substrates, and the components 7 are mounted on each of the multiple substrates. The substrate 6 is not limited to a rectangular shape, and may be of other shapes such as a circular shape. Furthermore, the substrate 6 may be an irregular substrate that combines various shapes, for example, as used in electronic devices such as smartphones.

In the above embodiment, the board-side reference point 62 is the midpoint of a line segment connecting the center points of the multiple (here, two) board-side electrodes 61, but this is not intended to be limiting. In other words, the board-side reference point 62 may be any point that serves as a reference for determining the position of the board-side electrode 61 on the board 6.

In the above embodiment, the component-side reference point 72 is the center of a line segment connecting the centers of multiple (here, two) component-side electrodes 71, but this is not intended to be limiting. For example, the component-side reference point 72 may be the center of the outline of the component 7, or may be a center that is virtually set on the component 7. In other words, the component-side reference point 72 may be any point that serves as a reference for determining the position of the component-side electrode 71 on the component 7.

In the above embodiment, the control system 1 uses the board-side reference point 62 obtained from the position of the board-side electrode 61 in the first coordinate system C1 as the board-side position information, but this is not intended to be limiting. For example, the control system 1 may use the recognition mark provided on the board 6 as the board-side position information. For example, if the board 6 is a board that expands and contracts uniformly in the X direction or the Y direction, the control system 1 can estimate the positional deviation of the board-side electrode 61 from the positional deviation of the recognition mark by using the recognition mark as the board-side position information. On the other hand, if the board 6 is, for example, the irregular board described above, the degree of expansion and contraction differs depending on the position of the board 6, so it is preferable that the control system 1 obtains the board-side reference point 62 from the position of the board-side electrode 61 in the first coordinate system C1 and uses the obtained board-side reference point 62 as the board-side position information. In addition, the control system 1 may use a combination of the recognition mark and the board-side reference point 62 as the board-side position information.

In the above embodiment, the control system 1 determines the application position of the bonding material A1 by aligning the board-side reference point 62 with the component-side reference point 72, but this is not intended to be limiting. For example, the control system 1 may determine the application position of the bonding material A1 by aligning the board-side reference area determined from the position of the board-side electrode 61 with the component-side reference area determined from the position of the component-side electrode 71. The board-side reference area is, for example, a circular area that includes the board-side reference point 62. The component-side reference area is, for example, a circular area that includes the component-side reference point 72. Of course, both the board-side reference area and the component-side reference area may be areas of a shape other than a circle.

In the above embodiment, the control system 1 may further have an adjustment function. The adjustment function is a function of adjusting the application position based on the angle θ between the reference line L1 of the substrate 6 and the straight line L2 connecting the substrate side electrode 61 and another substrate side electrode 61 in the first coordinate system C1 (see FIG. 8). For example, when the substrate 6 expands and contracts unevenly, the substrate side electrode 61 may not only be misaligned in one of the X direction and the Y direction, but may also be misaligned in both the X direction and the Y direction. In this case, there is a possibility that the bonding material A1 cannot be applied to the substrate side electrode 61 by simply adjusting the application position assuming only the misalignment in one of the X direction and the Y direction of the substrate side electrode 61. Therefore, the control system 1 can solve the above problem by adjusting the application position using the adjustment function.

An example of the adjustment of the application position by the adjustment function will be described below with reference to FIG. 8. In FIG. 8, it is assumed that the position of one of the two board-side electrodes 61 (the left side in the figure) is shifted in both the X and Y directions due to uneven expansion and contraction of the board 6. In this case, the control system 1 adjusts the application position of the bonding material A1 on one board-side electrode 61 based on the angle θ between the reference line L1 and the straight line L2. Here, the reference line L1 is a straight line connecting the center of one board-side electrode 61 (i.e., the virtual board-side electrode indicated by "63" in FIG. 8) when the board 6 does not expand and contract, and the center of the other board-side electrode 61. This configuration has the advantage of reducing the possibility of mounting the bonding material A1 at a position shifted from the board-side electrode 61.

In the above-described embodiment, the board manufacturing system 100 may further include a printing unit 8 as shown in FIG. 9A. The printing unit 8 is disposed, for example, upstream of the inspection unit 2. The printing unit 8 performs screen printing using a mask plate to collectively print the bonding material A1 (e.g., cream solder) on two or more board side electrodes 61 to be printed among the multiple board side electrodes 61 of the board 6. In this case, the application unit 3 may apply the bonding material A1 to the board side electrodes 61 excluding the board side electrodes 61 to be printed by the printing unit 8 among the multiple board side electrodes 61.

For example, when components 7 of different sizes are mixed among the components 7 to be mounted on the board 6, the bonding material A1 to be used for the components 7 of relatively small size may be applied by the application unit 3, and the bonding material A1 to be used for the remaining components 7 may be printed by the printing unit 8. In this case, the process of applying the bonding material A1 by the application unit 3 and the process of printing the bonding material A1 by the printing unit 8 may be reversed. In other words, in FIG. 9A, the printing unit 8 may be disposed downstream of the application unit 3.

The printing unit 8 may also print the bonding material A1 on all of the board-side electrodes 61 of the board 6 at once. In this case, the application unit 3 may apply the bonding material A1 to, for example, board-side electrodes 61 among the multiple board-side electrodes 61 that have a defective printing result by the printing unit 8 (for example, bonding material A1 has not been applied or the amount of bonding material A1 applied is insufficient). In this case, it is preferable to provide an application inspection unit 9 (described later) between the printing unit 8 and the application unit 3 so that the board-side electrodes 61 that have a defective printing result by the printing unit 8 can be identified.

In the above-described embodiment, the substrate manufacturing system 100 may further include a coating inspection unit 9 as shown in FIG. 9B. The coating inspection unit 9 is a device that performs a process of inspecting the substrate 6 to which the bonding material A1 has been applied by the coating unit 3, that is, a so-called SPI (Solder Paste Inspection) process, and has, for example, a camera that captures the substrate 6 in a state in which the bonding material A1 has been applied. The coating inspection unit 9 is disposed downstream of the coating unit 3. The coating inspection unit 9 then captures images of the substrate 6 transported from the coating unit 3, for example, from multiple directions with a camera, to inspect whether the position, area, and height of the bonding material A1 are within the allowable range. The coating inspection unit 9 then outputs the inspection results to the mounting unit 4 via the communication network N1. Based on the inspection results of the coating inspection unit 9, the mounting unit 4 mounts the component 7 on the substrate 6 so that the component-side electrode 71 is placed on the portion of the substrate-side electrode 61 to which the bonding material A1 has been applied. This configuration has the advantage that it is possible to mount the component 7 based on the application position of the bonding material A1, rather than the position of the board-side electrode 61, thereby improving the mounting accuracy of the component 7 on the board 6.

In the above embodiment, the "information for performing control based on board-side position information" in the mounting control function of the control system 1 was the board-side position information itself, but this is not intended to be limiting. For example, the "information for performing control based on board-side position information" may be information generated based on the board-side position information. For example, the control system 1 may generate correction data representing the difference between the position of the board-side electrode 61 when there is no expansion or contraction and the current position of the board-side electrode 61 based on the board-side position information, and output the generated correction data to the mounting unit 4 via the communication network N1. In this case, the mounting unit 4 that has acquired the correction data corrects the mounting position of the component 7 using the correction data, and then mounts the component 7 on the board 6.

In addition, the control system 1 may output data regarding the application position determined in the determination process to the mounting unit 4 via the communication network N1. In this case, the mounting unit 4 that has acquired this data can use this data to correct the mounting position of the component 7, thereby mounting the component 7 based on the application position of the bonding material A1.

In the above embodiment, the control system 1 uses two-dimensional information (XY coordinates) in the first coordinate system C1 as the board-side position information, and two-dimensional information (xy coordinates) in the second coordinate system C2 as the component-side position information, but this is not intended to be limiting. For example, the control system 1 may use three-dimensional information (XYZ coordinates) in the first coordinate system C1 as the board-side position information, and three-dimensional information (xyz coordinates) in the second coordinate system C2 as the component-side position information.

In the above embodiment, the control system 1 executes the determination process by referring to the component side position information included in the component data stored in the storage unit 12. In other words, in the above embodiment, the component side position information is stored in the storage unit 12, which stores information used by the mounting unit 4 that mounts the component 7 on the board 6. In addition, in the above embodiment, the control system 1 determines the application position using the component side position information stored in the storage unit 12. In other words, in the above embodiment, the control system 1 determines the application position of the bonding material A1 by sharing the component data with the mounting unit 4, but this is not intended to be limiting. For example, the control system 1 may have component side position information as data separate from the component data used by the mounting unit 4, and use this component side position information to determine the application position of the bonding material A1.

In the above embodiment, the part data (part-side position information) is stored in the memory unit 12 of the control system 1, but this is not intended to be limiting. For example, the part data may be stored in a storage device that is a device different from the control system 1 and is connected to the control system 1 via the communication network N1. In this case, in the determination process, the control system 1 refers to the part-side position information by reading the part-side position information from the storage device via the communication network N1.

The above-mentioned board manufacturing system 100 includes a control system 1, an inspection unit 2, a coating unit 3, a mounting unit 4, and a reflow unit 5, but is not limited to this. For example, the board manufacturing system 100 may include a control system 1 and a coating unit 3, and may not include other functional units. The board manufacturing system 100 may include a control system 1, an inspection unit 2, and a coating unit 3, and may not include other functional units. The board manufacturing system 100 may include a control system 1, a coating unit 3, and a mounting unit 4, and may not include other functional units. In other words, the board manufacturing system 100 only needs to include at least the control system 1 and the coating unit 3, and it is optional whether or not to include each of the inspection unit 2, the mounting unit 4, and the reflow unit 5.

(summary)
As described above, the control system (1) according to the first aspect is a control system that controls the application unit (3). The application unit (3) applies a conductive bonding material (A1) from a head (31) facing a board-side electrode (61) provided on a board (6). The control system (1) determines the application position of the bonding material (A1) based on board-side position information and component-side position information. The board-side position information is information that represents the position of the board-side electrode (61) in a first coordinate system (C1). The component-side position information is information that represents the position of a component-side electrode (71) of a component (7) mounted on the board-side electrode (61) in a second coordinate system (C2).

This embodiment has the advantage of reducing the possibility of mounting the component (7) at a position offset from the bonding material (A1).

In the control system (1) according to the second aspect, in the first aspect, the position of the component-side electrode (71) in the second coordinate system (C2) is set based on the component-side reference point (72). The application position is determined so as to align the position of the board-side reference point (62) in the board-side position information with the position of the component-side reference point (72).

This embodiment has the advantage that the position of the board-side electrode (61) that overlaps with the component-side electrode (71) can be determined as the application position, which makes it easier to improve the accuracy of mounting the component (7) to the bonding material (A1).

In the control system (1) according to the third aspect, in the second aspect, the component-side position information is stored in a memory unit (12) that stores information used by a mounting unit (4) that mounts a component (7) on a substrate (6). The control system (1) uses the component-side position information stored in the memory unit (12) to determine the application position.

This aspect has the advantage that the information used in the mounting unit (4) can be shared, eliminating the need to prepare component-side position information separately.

The control system (1) according to the fourth aspect, in any of the first to third aspects, uses a substrate-side reference point (62) determined from the position of the substrate-side electrode (61) in the first coordinate system (C1) as substrate-side position information.

This embodiment has the advantage that it is easier to grasp the position of the board side electrode (61) on the board (6) more accurately, which in turn makes it easier to improve the accuracy of mounting the component (7) to the bonding material (A1).

The control system (1) according to the fifth aspect further has an adjustment function in any one of the first to fourth aspects. The adjustment function is a function for adjusting the application position based on the angle (θ) between the reference line (L1) of the substrate (6) and the straight line (L2) connecting the substrate side electrode (61) and the other substrate side electrode (61) in the first coordinate system (C1).

This embodiment has the advantage that, when the position of the substrate side electrode (61) is shifted in both the X and Y directions of the first coordinate system (C1) due to distortion of the substrate (6), the possibility of mounting the bonding material (A1) at a position shifted from the substrate side electrode (61) can be reduced.

The control system (1) according to the sixth aspect is any one of the first to fifth aspects, and further has a mounting control function. The mounting control function is a function for outputting information for performing control based on board-side position information to a mounting unit (4) that mounts a component (7) on a board (6).

This aspect has the advantage that the mounting unit (4) can easily correct the mounting position of the component (7) relative to the bonding material (A1) based on the board-side position information.

In the control system (1) according to the seventh aspect, in the sixth aspect, the mounting control function is realized by outputting the substrate side position information used to determine the application position to the mounting unit (4).

This aspect has the advantage that the mounting unit (4) can share the board-side position information, so the mounting unit (4) does not need to acquire new board-side position information.

The substrate manufacturing system (100) according to the eighth aspect includes a control system (1) according to any one of the first to seventh aspects and an application unit (3). The application unit (3) applies the bonding material (A1) from a head (31) by facing the application position determined by the control system (1).

This embodiment has the advantage of reducing the possibility of mounting the component (7) at a position offset from the bonding material (A1).

The substrate manufacturing system (100) according to the ninth aspect is the eighth aspect, and further includes an inspection unit (2). The inspection unit (2) inspects the position of the substrate side electrode (61) in the first coordinate system (C1). The control system (1) acquires the inspection result of the inspection unit (2) as substrate side position information.

This embodiment has the advantage of reducing the possibility of mounting the component (7) at a position offset from the bonding material (A1).

The substrate manufacturing system (100) according to the tenth aspect is the eighth or ninth aspect, and further includes a mounting unit (4). The mounting unit (4) mounts the component (7) on the substrate (6).

This embodiment has the advantage of reducing the possibility of mounting the component (7) at a position offset from the bonding material (A1).

The control method according to the eleventh aspect is a control method for controlling an applicator (3). The applicator (3) applies a conductive bonding material (A1) from a head (31) facing a board-side electrode (61) provided on a board (6). The control method determines an application position of the bonding material (A1) based on board-side position information and component-side position information. The board-side position information is information representing the position of the board-side electrode (61) in a first coordinate system (C1). The component-side position information is information representing the position of a component-side electrode (71) of a component (7) mounted on the board-side electrode (61) in a second coordinate system (C2).

This embodiment has the advantage of reducing the possibility of mounting the component (7) at a position offset from the bonding material (A1).

The program according to the twelfth aspect is a program for controlling the applicator (3). The applicator (3) applies a conductive bonding material (A1) from a head (31) facing a board-side electrode (61) provided on a board (6). The program is a program for causing a computer system to execute a determination process. The determination process is a process for determining an application position of the bonding material (A1) based on board-side position information and component-side position information. The board-side position information is information representing the position of the board-side electrode (61) in a first coordinate system (C1). The component-side position information is information representing the position of the component-side electrode (71) of the component (7) mounted on the board-side electrode (61) in a second coordinate system (C2).

This embodiment has the advantage of reducing the possibility of mounting the component (7) at a position offset from the bonding material (A1).

The configurations according to the second to seventh aspects are not essential for the control system (1) and may be omitted as appropriate. Furthermore, the configurations according to the ninth and tenth aspects are not essential for the substrate manufacturing system (100) and may be omitted as appropriate.

REFERENCE SIGNS LIST 1 control system 12 memory unit 2 inspection unit 3 application unit 31 head 4 mounting unit 6 substrate 61 substrate side electrode 62 substrate side reference point 7 component 71 component side electrode 72 component side reference point 8 printing unit 100 substrate manufacturing system A1 bonding material C1 first coordinate system C2 second coordinate system L1 reference line L2 straight line θ angle

Claims (12)

A control system for controlling an application unit that applies a conductive bonding material from a head by causing the head to face a substrate-side electrode provided on a substrate,
acquiring board-side position information representing a position of the board-side electrode in a first coordinate system and component-side position information representing a position of a component-side electrode of a component mounted on the board-side electrode in a second coordinate system , and executing a determination process for determining an application position of the bonding material based on the position of the component-side electrode in the first coordinate system based on the component-side position information;
the position of the component-side electrode in the second coordinate system is set based on a component-side reference point, and the application position is determined so as to align the position of the board-side reference point in the board-side position information with the position of the component-side reference point;
In the determination process, a portion of the board-side electrode where the component-side electrode overlaps is determined as the application position .
Control system. the component-side position information is stored in a storage unit that stores information used in a mounting unit that mounts the component on the board;
determining the application position using the component side position information stored in the storage unit;
The control system of claim 1 . The component side position information is acquired from the storage unit.
The control system of claim 2. a substrate-side reference point obtained from the position of the substrate-side electrode in the first coordinate system is used as the substrate-side position information;
A control system according to any one of claims 1 to 3. the control unit further has an adjustment function of adjusting the application position based on an angle between a reference line of the substrate and a straight line connecting the substrate-side electrode and another substrate-side electrode in the first coordinate system.
A control system according to any one of claims 1 to 4. a mounting control function that outputs information for performing control based on the board side position information to a mounting unit that mounts the component on the board;
A control system according to any one of claims 1 to 5. The mounting control function is realized by outputting the substrate side position information used to determine the application position to the mounting unit.
7. The control system of claim 6. A control system according to any one of claims 1 to 7;
the application unit which applies the bonding material from the head by causing the head to face the application position determined by the control system,
Circuit board manufacturing system. an inspection unit that inspects the position of the substrate-side electrode in the first coordinate system,
The control system acquires an inspection result from the inspection unit as the substrate side position information.
The substrate manufacturing system according to claim 8 . Further comprising a mounting unit for mounting the component on the board.
The substrate manufacturing system according to claim 8 or 9. A control method for controlling an application unit that applies a conductive bonding material from a head by causing the head to face a substrate-side electrode provided on a substrate, the control method comprising:
acquiring board-side position information representing a position of the board-side electrode in a first coordinate system and component-side position information representing a position of a component-side electrode of a component mounted on the board-side electrode in a second coordinate system, and executing a determination process for determining an application position of the bonding material based on the position of the component-side electrode in the first coordinate system based on the component-side position information;
the position of the component-side electrode in the second coordinate system is set based on a component-side reference point, and the application position is determined so as to align the position of the board-side reference point in the board-side position information with the position of the component-side reference point;
In the determination process, a portion of the board-side electrode where the component-side electrode overlaps is determined as the application position.
Control methods. A program for controlling an application unit that applies a conductive bonding material from a head by causing the head to face a substrate-side electrode provided on a substrate,
In the computer system,
acquiring board-side position information representing a position of the board-side electrode in a first coordinate system and component-side position information representing a position of a component-side electrode of a component mounted on the board-side electrode in a second coordinate system, and executing a determination process for determining an application position of the bonding material based on the position of the component-side electrode in the first coordinate system based on the component-side position information;
the position of the component-side electrode in the second coordinate system is set based on a component-side reference point, and the application position is determined so as to align the position of the board-side reference point in the board-side position information with the position of the component-side reference point;
In the determination process, a portion of the board-side electrode where the component-side electrode overlaps is determined as the application position.
Program.

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