JP7558871B2 - Chip transport device, and mounting device and mounting method using the same - Google Patents

Description

The present invention relates to a chip transport device and a mounting device and mounting method using the same.

When mounting chip components such as semiconductor chips on a substrate, it is well known that the chip components are supplied in a state in which a wafer on a dicing tape is cut into individual pieces (see, for example, Patent Document 1). Figures 12 to 14 show the process of transporting the chip components to a bonding head in this chip supply form.
That is, as shown in FIGS. 12A to 12C, the chip component C is pushed up from the dicing tape DS side by the needle 202, peeled off from the dicing tape DS, and sucked and held by the pickup collet 210.

Generally, the chip component C has electrodes formed on the surface opposite the dicing tape DS. For this reason, if the chip component C is to be mounted face-down on the substrate, the pickup collet 210 can be placed directly below the bonding head in an inverted upside-down state as shown in FIG. 13(a). However, moving the pickup collet directly below the bonding head is difficult to implement due to the complex mechanism and space constraints.

As shown in Fig. 13(b) to Fig. 13(d), after rotating the pickup collet 210, the pickup collet 210 transfers the chip component C to the transfer collet 220, and as shown in Fig. 14(a) to Fig. 14(b), the transfer collet 220 transfers the chip component C to the chip slider 31, which transports the chip component to just below the bonding head. As shown in Fig. 14(b), the chip component C on the chip slider 31 has the surface with the electrodes facing downward, so it is attracted to and held by the bonding head from above and is subjected to face-down mounting.

JP 2008-311329 A JP 2020-057750 A

As microfabrication advances in response to the demand for high integration of semiconductor chips and the like, it is clear that contamination (adhesion of foreign matter or scratches) of the bonding surface (with electrodes) during face-up mounting will have a detrimental effect on product quality after mounting.

On the other hand, as can be seen from the explanation using Figures 12 to 14, when the chip component C attached to the dicing tape DS is to be used for mounting, the bonding surface comes into contact with the pickup collet 210 and the chip slider 31. For this reason, there is a concern that foreign matter may adhere to the bonding surface or scratches may occur due to this contact.

For this reason, a method is desired that prevents the bonding surface from coming into contact with other objects during the process of mounting the chip components attached to the dicing tape on the substrate, and various studies have been conducted. For example, Patent Document 2 shows an example of using a Bernoulli chuck to hold the chip components without contact. However, when trying to hold chip components that are several millimeters square to a dozen or so millimeters square with a Bernoulli chuck, it is necessary to surround the chip components with a guide to prevent lateral slippage, and contact between the chip components and the guide can contaminate the area around the bonding surface and cause foreign matter to adhere to the bonding surface.

The present invention was made in consideration of the above problems, and provides a chip transport device that transports chip components without contaminating the bonding surface when peeling them off from a dicing tape and mounting them on a substrate, as well as a mounting device and mounting method that use the same.

In order to solve the above problem, the present invention provides a method for manufacturing a semiconductor device comprising the steps of:
A chip transport device that transports chip components to be mounted on a substrate,
a floating means for generating an air flow and floating the chip component by wind pressure ,
The floating means is a chip conveying device having a floating airflow generating section which generates an airflow directed vertically upward from directly below the chip component, and an outer peripheral airflow generating section which generates an airflow directed from the outside of the four sides of the chip component toward the upper side in the opposite direction .

The present invention relates to a chip transport device, comprising:
In the chip transport device, the floating airflow generating section has holes for ejecting airflow in the vertical direction, and the peripheral airflow generating section has holes for ejecting airflow facing the opposite side rather than the vertical direction .

The invention described in claim 3 is the chip transport device described in claim 1 or claim 2,
The surface shape of the floating airflow generating portion of the chip transport device is approximately the same as the surface shape of the chip component C.

The invention according to claim 4 is the chip transport device according to claim 1 or 2 ,
In this chip transport device, the flow rate and pressure of the airflow generated by the floating airflow generating section are adjusted so as to float the chip components C to a height of 0.05 mm to 0.2 mm .

The invention described in claim 5 is a chip transport device according to any one of claims 1 to 4, which floats the chip component with the bonding surface facing downward.

The present invention as set forth in claim 6 is a mounting apparatus for peeling off chip components adhered to a dicing tape and mounting the chip components on a substrate, comprising:
This mounting apparatus includes a chip peeling device that peels the chip component from the dicing tape, a chip transport device as described in any one of claims 1 to 5, and a bonding head that adsorbs and holds the chip component transported by the chip transport device and presses it onto the substrate.

The invention described in claim 7 is
A mounting apparatus for peeling off a chip component having an opposite side of the bonding surface from a dicing tape and then mounting the chip component by facing the bonding surface to a substrate,
This mounting device includes a chip peeling device that peels the chip component from the dicing tape with the bonding surface facing downward, a chip transport device as described in claim 5, and a bonding head that adsorbs and holds the chip component transported by the chip transport device on the side opposite the bonding surface and presses it onto the substrate.

The invention described in claim 8 is
A mounting method for mounting a chip component on a substrate, the method comprising the steps of: peeling off a chip component adhered to a dicing tape via an adhesive layer; and mounting the chip component on a substrate using a surface of the chip component opposite to the surface of the chip component adhered to the dicing tape as a bonding surface, the method comprising the steps of:
a chip peeling step of hardening an adhesive layer that adheres the chip component to the bonding surface while facing downward, thereby losing adhesive strength, and dropping the chip component to peel it off;
a chip transport step of transporting the chip components using the chip transport device according to claim 5 ;
and a bonding step of holding the chip component on the side opposite to the bonding surface and pressing it onto the substrate.

The present invention allows chip components to be peeled off from the dicing tape and mounted on a substrate without contaminating the bonding surface, enabling highly reliable mounting.

1 is a schematic diagram showing a configuration of a mounting apparatus according to an embodiment of the present invention. FIG. 2 is an external view showing an example of the configuration of a levitation means according to the embodiment of the present invention. 1A is a cross-sectional view illustrating a floating means according to an embodiment of the present invention; FIG. 1B is a diagram showing a state in which a chip component is floated by an air flow; FIG. 1C is a cross-sectional view of a modified example; and FIG. 1D is a cross-sectional view of another modified example. FIG. 11 is a diagram illustrating modified examples of the floating means according to an embodiment of the present invention, which are intended to stabilize the position of a chip component; (a) shows an example in which a guide is provided to regulate movement in the direction of travel; (b) shows an example in which an airflow is generated from the same guide; (c) shows an example in which the airflow generating sections in front of and behind the chip component are oriented at an angle to regulate movement in the direction of travel; and (d) shows an example in which a suction section is provided near the center of the floating airflow generating section. FIG. 11 is a diagram illustrating a modified example of the levitation means according to an embodiment of the present invention, which aims to stabilize the position of chip components. (a) shows an example in which a guide with an incline is provided to regulate lateral movement relative to the direction of travel, and (b) shows an example in which an airflow is generated from the same guide. 1A to 1C are diagrams illustrating a process from peeling a chip component from a dicing tape to mounting the chip component on a substrate by a mounting apparatus according to an embodiment of the present invention. FIG. 10 is a diagram illustrating the process by which a chip component is handed over to and transported by the floating means in an embodiment of the present invention, showing (a) the state in which the chip component adhered to the dicing tape is aligned with the floating means, (b) the state in which the chip component is peeled off and handed over to the floating means, and (c) the state in which the chip component is held non-contact by the floating means and transported. 1A to 1C are diagrams illustrating the process of transferring a chip component from the floating means to the bonding head in an embodiment of the present invention, showing (a) a state in which the floating means is positioned directly below the bonding head, (b) a state in which the bonding head adsorbs and holds the chip component held by the floating means in a non-contact manner, and (c) a state in which the floating means is retracted while the chip component is held by the bonding head. 1A to 1C are diagrams illustrating the process of mounting a chip component on a substrate using a bonding head according to an embodiment of the present invention, showing (a) the state in which the chip component and substrate have been aligned and are being brought close to each other, (b) the state in which the bonding head is bringing the chip component and substrate into close contact and applying pressure, and (c) the state in which pressure has been applied by the bonding head and the chip component has been mounted on the substrate. 11A to 11C are diagrams for explaining an embodiment of the levitation means of the present invention based on another levitation principle. 1A and 1B are diagrams showing a state in which a chip component is floated with a non-electrode surface facing a floating means in an embodiment of the present invention. This explains the process in which a chip component on a dicing tape is peeled off and held by a pickup collet, and shows (a) the state in which a needle is about to push the chip component up through the dicing tape, (b) the state in which the pickup collet adsorbs and holds the chip component as it is pushed up by the needle and the dicing tape peels off, and (c) the state in which the dicing tape has been completely peeled off and the chip component has been handed over to the pickup collet. This figure explains the process of transferring a chip component held by a pickup collet to an inverting collet, and shows (a) the state in which the pickup collet rotates, (b) the state in which the inverting collet approaches the chip component held by the pickup collet, (c) the state in which the inverting collet is in close contact with the chip component, and (d) the state in which the chip component has been transferred and is adsorbed and held by the inverting collet. This figure explains the process of transferring the chip component held by the inverting collet to a transport mechanism, and shows (a) the state in which the slider is positioned directly below the inverting collet, and (b) the state in which the suction hold by the inverting collet has been released and the chip component has been transferred to the slider.

The following describes an embodiment of the present invention with reference to the drawings. Figure 1 is a schematic diagram of a mounting device 1 according to an embodiment of the present invention.

The mounting device 1 is a device that peels off the individual chip components that are attached to the dicing tape and mounts them on a substrate.

As shown in FIG. 1, the mounting device 1 is made up of a floating means 2, a transport mechanism 3, a chip peeling mechanism 4, a substrate stage 5, a pressure tool 6, and a bonding head 7, and each component is controlled by a control unit (not shown). Here, the combination of the floating means 2 and the transport mechanism 3 constitutes a chip transport device.

The floating means 2 has a function of floating the chip component C on the surface, and can hold the chip component C without contact. In this embodiment, the floating means 2 floats and holds the chip component C by airflow, and as shown in FIG. 2, has a floating airflow generating section 21 and a peripheral airflow generating section 22 on the surface of a plate-shaped floating means main body 20. The cross-sectional view of the floating means 2 is as shown in FIG. 3(a), and as shown in FIG. 3(b), the floating airflow generating section 21 generates an upward airflow. Here, as shown in FIG. 2 and FIG. 3(b), the surface shape of the floating airflow generating section 21 is approximately the same as the surface shape of the chip component C. In addition, the peripheral airflow generating section 22 generates an airflow from the outside directly below the chip component C toward the floating chip component C as shown in FIG. 3(b). In other words, the peripheral airflow generating section 22 generates an airflow from the outside of the floating airflow generating section 21 toward the upper side in the opposite direction. For this reason, it is preferable to provide holes for airflow ejection in the floating airflow generating section 21 in the vertical direction relative to the upper surface of the floating means 2, and provide holes for airflow ejection in the peripheral airflow generating section 22 in the opposite direction rather than in the vertical direction. In FIG. 3(b), the peripheral airflow generating section 22 is disposed outside the chip component C, but as in FIG. 3(c), the floating airflow generating section 21 may be made smaller than the chip component C and the peripheral airflow generating section 22 may be disposed inside the chip component C. Also, in FIG. 3(a), the floating airflow generating section 21 and the peripheral airflow generating section 22 are disposed in close contact with each other, but as in FIG. 3(d), an area that does not generate airflow may be provided between them.

The flow rate and pressure of the airflow generated by the floating airflow generating unit 21 vary depending on factors such as the mass of the chip component C to be floated, but are adjusted to float the chip component C to a height of 0.05 mm to 0.2 mm. The airflow generated by the peripheral airflow generating unit 22 inhibits the chip component C from moving laterally (within the XY plane) on the floating airflow generating unit 21, and while the pressure varies depending on factors such as the mass of the chip component C, it has been found experimentally that the flow rate is preferably in the range of 20% to 200% of the flow rate generated by the floating airflow generating unit 21.

In addition to the above-described examples, various other variations of the floating means 2 can be used. For example, Figs. 4 and 5 show an example in which the floating chip component C is prevented from shifting laterally and its position is stabilized.

Figure 4(a) is an example in which a guide 20G is provided to restrict the movement of the chip component C in the travel direction (X direction) of the levitation means 2, and Figure 4(b) is an example in which an outer peripheral airflow generating section is provided on the guide 20G. In the example in Figure 4(a) in which the guide 20G is provided, the side of the chip component C may come into contact with the guide 20G, but in the example in Figure 4(b), the possibility of the side of the chip component C coming into contact with the guide 20G can be reduced by generating an airflow from the outer peripheral airflow generating section 22. In the example in Figure 4(c), instead of providing a guide 20G, a tapered recess is formed on the upper surface of the levitation means main body 20, and an airflow is generated from the recessed surface, and a vertical airflow is generated from each surface. Furthermore, the example in Figure 4(d) is configured to generate a suction airflow by arranging a pressure reducing section 25 near the center of the levitation airflow generating section 21 (rather than generating an airflow to the outside). In the example of FIG. 4(d), the floating airflow is a combination of a component that floats the chip component C and a component that is directed toward the center of the floating airflow generating section 21, so the lateral position of the chip component C is stabilized.

Figure 5(a) shows a shape that restricts the movement of chip component C in the width direction (Y direction) relative to the traveling direction of levitation means 2. In the example of Figure 5(a), the width of the bottom of the tapered recess is narrower than the width of chip component C, and although the side of chip component C may come into contact with levitation means 2, it is possible to prevent the electrode surface from coming into contact with levitation means 2. Furthermore, as shown in Figure 5(b), by configuring the device to generate airflow from the sloped portion, it is possible to reduce the possibility of the side of chip component C coming into contact with levitation means 2.

The transport mechanism 3 is composed of a rail 30 and a slider 31 that moves along the rail. In this embodiment, the levitation means 2 is disposed on the slider 31, and the levitation means 2 is configured to be able to move back and forth between below the chip peeling mechanism 4 and the bonding head 7. Note that while the levitation means 2 is disposed on the slider 31 in FIG. 1, the slider 31 may also have the function of the levitation means 2.

The chip peeling mechanism 4 is basically composed of a wafer holding means 40 and an energy supplying means 41. The wafer holding means 40 holds the outer periphery of the dicing tape DS to which the wafer W is attached, and in the state shown in FIG. 1, a large number of chip components C obtained by dividing the wafer W are attached to the dicing tape DS. In addition, in FIG. 1, the chip components C are arranged on the lower side of the dicing tape DS in the Z direction, that is, attached to the surface of the dicing tape DS opposite to the surface on the energy supplying means 41 side. In addition, the energy supplying means 41 is for eliminating the adhesive force of the adhesive layer (which attaches the chip components C to the dicing tape DS). For this reason, if the adhesive layer loses its adhesive force by thermal curing, the energy supplying means 41 is preferably a spot heat source or an infrared laser, and a high-temperature tool may be attached to it. On the other hand, if the adhesive force is lost by photocuring, an ultraviolet laser is preferable.

The substrate stage 5 holds the substrate S on which the semiconductor chip C is mounted and adjusts its position in the in-plane direction, and its components are an adsorption table 50, a Y-direction drive unit 51, and an X-direction drive unit 52. The adsorption table 50 has the function of adsorbing and holding the substrate S, the Y-direction drive unit 51 is capable of adjusting the position by sliding the adsorption table 50 in the Y direction, and the X-direction drive unit 52 is capable of adjusting the position by sliding the Y-direction drive unit 51 in the X direction.

The pressure tool 6 is connected to the bonding head 7 and has the function of raising and lowering the bonding head 7 and generating pressure.

The bonding head 7 holds the chip component C and presses it against the substrate S held by the substrate stage 5. As shown in Figures 8 and 9, an attachment tool 72 that holds the chip component C is provided on the lower part 71 of the head. The chip component C can be adsorbed and held by reducing the pressure through a suction hole (not shown) provided in the attachment tool 72.

The bonding head 7 may also have a function for adjusting the angle in the rotational direction relative to the Z direction.

The process by which the mounting device 1 peels off the chip components C from the dicing tape DS and mounts them on the substrate will be described below with reference to Figures 6 to 9. Figure 6 is a flow diagram showing an overview of the operation of each component of the mounting device 1.

In the peeling process Pd in FIG. 6, first, in step S01, the chip peeling mechanism 4 and the floating means 2 are aligned as shown in FIG. 7(a). That is, the floating airflow generating part 21 of the floating means 2 is placed directly under the chip component C to be peeled while it is attached to the dicing tape DS. For this alignment, a top and bottom two-view camera (not shown) may be used.

After alignment in step S01, chip peeling is performed in step S11. In step S11, as shown in FIG. 7(b), energy P that eliminates the adhesive force (of the adhesive layer between the dicing tape DS and the chip component C) is irradiated onto the chip component C through the dicing tape DS, so that the chip component C is peeled off from the dicing tape DS and floated by the airflow generated by the floating means 2. Note that in step S11, before peeling off the chip component C, it is desirable to set the vertical distance between the upper surface of the floating means 2 and the lower surface of the chip component C to about 0.1 mm to 2 mm. If the distance is more than 2 mm, the chip component C may fall at an angle when peeled off from the dicing tape DS, and may come into partial contact with the floating means 2.

The chip components C peeled off from the dicing tape DS in the peeling process Pd are floated by the upward airflow generated from the floating airflow generating unit 21 of the floating means 2, and their positions on the surface of the floating means 2 (in the XY plane) are maintained by the airflow generated from the peripheral airflow generating unit 22. In other words, they are in a non-contact holding state, which is step S21 in the transport process Pt.

In the transport process Pt of FIG. 6, the chip component C is held in a non-contact state by the levitation means 2 in step S21, and then the slider 31 is moved by the transport mechanism 3 to move the chip component C held in a non-contact state by the levitation means 2 in step S22.

The floating means 2, which has moved together with the slider 31, moves to below the bonding head 7 in step S02, and aligns the chip component C so that it is placed directly below the attachment tool 72 of the bonding head 7, as shown in FIG. 8(a). A two-view camera with upper and lower fields of view may also be used for this alignment.

After this, in step S31, as shown in FIG. 8(b), the suction hole (not shown) of the attachment tool 72 is depressurized, so that the chip component C is suction-held by the attachment tool 72, and the process proceeds to the joining process Pb.

After the chip component C is held by the attachment tool 72 in step S31, the floating means 2 is retracted by the transport mechanism 3 to the chip peeling mechanism 4 side (FIG. 8(c)). For this reason, the substrate S is placed under the bonding tool 7 by the substrate stage 5, and in step S32, the chip C held by the attachment tool 72 is aligned with the mounting location of the substrate S (FIG. 9(a)). Since high accuracy is required for this alignment, it is desirable to use a two-view camera (not shown) with a top and bottom field of view. Note that if a two-view camera with a top and bottom field of view is used for alignment in step S02, the two-view camera with a top and bottom field of view used in step S32 may also be used for this purpose.

When the alignment of the mounting location on the substrate S with the chip component C is completed in step S32, in step S33, the bonding head 7 is lowered to bring the chip component C into close contact with the substrate S and apply pressure. Here, by providing a heating means on the lower part 71 of the head, heating can be performed in addition to pressure application.

After performing pressure bonding under the specified conditions in step S33, in step S34, the attachment tool 72 releases the suction and raises the bonding head 7 as shown in Figure 9(c), completing the mounting of the chip component C at the location.

When mounting chip components C at multiple locations on the substrate S, the process from step S01 onward can be carried out while changing the alignment location on the substrate S side in step S32.

As described above, by using the mounting device 1 of this embodiment, not only the bonding surface of the chip component C but also the outer periphery of the chip component C can be transported without coming into contact with other objects. In other words, the bonding surface is not contaminated or otherwise damaged during the process from peeling the chip component from the dicing tape to mounting it on the substrate, and mounting with high bonding reliability can be performed.

In this embodiment, the levitation means 2 is configured to levitate the chip component by airflow, but the present invention is not limited to this, and other configurations are possible as long as the chip component C can be held without sliding sideways while being levitated. For example, an ultrasonic levitation method can be used in the present invention because it can levitate the chip component while also having a holding force. An example is shown in Figure 10, which shows the chip component C being levitated by ultrasonic waves generated by an ultrasonic wave generating source 2S provided in the levitation means main body 20.

In the above explanation, only an example of floating the chip component C with its electrode surface facing downwards has been shown, but the present invention is not limited to this, and it is also possible to float the chip component C with its electrode surface facing upwards. For example, the floating means shown in FIG. 2(a) may be used to float the chip component C as shown in FIG. 11.

REFERENCE SIGNS LIST 1 mounting device 2 floating means 3 transport mechanism 4 chip peeling mechanism 5 substrate stage 6 pressure tool 7 bonding head 20 floating means main body 21 floating airflow generating section 22 peripheral airflow generating section 25 pressure reducing section 30 rail 31 slider 40 wafer holding means 41 energy supply means 50 suction table 51 Y-direction driving section 52 X-direction driving section 71 head lower section 72 attachment tool C chip component E electrode S substrate
DS Dicing Tape
FC: Outer airflow FU: Floating airflow

Claims (8)

A chip transport device that transports chip components to be mounted on a substrate,
a floating means for generating an air flow and floating the chip component by wind pressure,
The floating means is a chip conveying device having a floating airflow generating section that generates an airflow directed vertically upward from directly below the chip component, and an outer peripheral airflow generating section that generates an airflow directed from the outside of the four sides of the chip component toward the upper side in the opposite direction. The chip transport device according to claim 1,
The floating airflow generating section has holes for blowing airflow in a vertical direction,
In the chip transport device, the peripheral airflow generating section has holes for blowing airflow oriented in a direction opposite to the side rather than vertically. The chip transport device according to claim 1 or 2,
A chip transport device in which the surface shape of the floating airflow generating portion is approximately the same as the surface shape of the chip component C. The chip transport device according to claim 1 or 2,
A chip transport device in which the flow rate and pressure of the airflow generated by the floating airflow generating section are adjusted so as to float the chip components C to a height of 0.05 mm to 0.2 mm. The chip transport device according to any one of claims 1 to 4,
A chip transport device that floats the chip component with the bonding surface facing downward. A mounting apparatus that peels off chip components adhered to a dicing tape and then mounts them on a substrate,
a chip peeling device for peeling the chip components from the dicing tape;
A chip transport device according to any one of claims 1 to 5,
a bonding head that sucks and holds the chip component transported by the chip transport device and presses it onto the substrate. A mounting apparatus for peeling off a chip component having an opposite side of the bonding surface from a dicing tape and then mounting the chip component by facing the bonding surface to a substrate,
a chip peeling device that peels the chip component from the dicing tape with the bonding surface facing downward;
The chip transport device according to claim 5 ;
a bonding head that suction-holds the chip component transported by the chip transport device on the side opposite the bonding surface and presses it onto the substrate. A mounting method for mounting a chip component on a substrate, the method comprising the steps of: peeling off a chip component adhered to a dicing tape via an adhesive layer; and mounting the chip component on a substrate using a surface of the chip component opposite to the surface of the chip component adhered to the dicing tape as a bonding surface, the method comprising the steps of:
a chip peeling step of hardening an adhesive layer that adheres the chip component to the bonding surface while facing downward, thereby losing adhesive strength, and dropping the chip component to peel it off;
a chip transport step of transporting the chip components using the chip transport device according to claim 5 ;
and a bonding step of holding the chip component on the side opposite the bonding surface and pressing it onto the substrate.