JP7325018B2 - UV-curable resin composition, method for producing light-emitting device, light-emitting device, and touch panel - Google Patents

Description

TECHNICAL FIELD The present invention relates to an ultraviolet curable resin composition, a method for manufacturing a light emitting device, a light emitting device and a touch panel, and more particularly, an ultraviolet curable resin composition containing a photopolymerizable compound and a photopolymerization initiator, and the ultraviolet curable resin. The present invention relates to a method for manufacturing a light-emitting device using the composition, a light-emitting device including an optical component made from the ultraviolet-curable resin composition, and a touch panel including the light-emitting device.

In a light-emitting device including a light-emitting element such as an organic EL element as a light source, for example, an organic EL element is arranged on a supporting substrate, a transparent substrate is arranged so as to face the supporting substrate, and a transparent substrate is arranged between the supporting substrate and the transparent substrate. is filled with a suitable encapsulant. The sealing material is produced, for example, by an inkjet method.

For example, in Patent Document 1, a polymerizable compound and a polymerization initiator are contained, the viscosity at 25° C. is 5 to 50 mPa s, the surface tension at 25° C. is 15 to 35 mN/m, and the cured product is 25 A sealant for an organic EL display element is disclosed, which is characterized by a Poisson's ratio at 0.28 to 0.40 (see claim 1 of Document 1).

WO2018/074506

When a resin composition is molded by injecting droplets of the resin composition onto an appropriate substrate by an inkjet method, the landing position of the droplets on the substrate may deviate from the designed position. Such misalignment can be caused by the ejected droplets separating before reaching the substrate or by the droplets being swept away by air currents. misalignment may occur.

An object of the present invention is to use an ultraviolet curable resin composition that can be molded by an inkjet method and is less likely to cause deviation in the position where droplets reach when ejected by an inkjet method, and the ultraviolet curable resin composition. An object of the present invention is to provide a method for manufacturing a light-emitting device, a light-emitting device including an optical component made from the ultraviolet-curable resin composition, and a touch panel including the light-emitting device.

An ultraviolet curable resin composition according to one aspect of the present invention contains a photopolymerizable compound (A) and a photopolymerization initiator (B). The photopolymerizable compound (A) has a dielectric constant of 8.0 or less at 25°C and a frequency of 10 kHz, and a viscosity of 50 mPa·s or less at 25°C. The ultraviolet curable resin composition is molded by an inkjet method.

A method for manufacturing a light-emitting device according to one aspect of the present invention is a method for manufacturing a light-emitting device including a light source and an optical component that transmits light emitted by the light source, and the ultraviolet-curable resin composition is molded by an inkjet method. forming a coating film, and irradiating the coating film with ultraviolet rays to produce the optical component.

A light-emitting device according to an aspect of the present invention includes a light source and an optical component that transmits light emitted by the light source, and the optical component is made of a cured product of the ultraviolet-curable resin composition.

A touch panel according to an aspect of the present invention includes the light emitting device and a touch sensor.

According to one aspect of the present invention, there is provided an ultraviolet curable resin composition that can be molded by an inkjet method and is less likely to shift the position at which droplets reach when ejected by an inkjet method, and the ultraviolet curable resin composition. can provide a method for producing a light-emitting device using the above, a light-emitting device comprising an optical component made from the ultraviolet-curable resin composition, and a touch panel comprising the above-mentioned light-emitting device.

FIG. 1A is a schematic cross-sectional view showing a first example of an organic EL light-emitting device according to one embodiment of the invention. FIG. 1B is a schematic cross-sectional view showing a second example of the same organic EL light emitting device. FIG. 2 is a schematic cross-sectional view showing a touch panel according to one embodiment of the present invention.

An embodiment of the present invention will be described below.

The ultraviolet curable resin composition (hereinafter also referred to as composition (X)) according to this embodiment contains a photopolymerizable compound (A) and a photopolymerization initiator (B). The photopolymerizable compound (A) has a dielectric constant of 8.0 or less at 25°C and a frequency of 10 kHz, and a viscosity of 50 mPa·s or less at 25°C. Composition (X) is molded by an inkjet method.

According to this embodiment, a cured product can be produced by molding the composition (X) and then curing the composition (X). This cured product can be applied, for example, to an optical component that transmits light emitted by a light source in the light emitting device 1 (see FIGS. 1A and 1B). In the present embodiment, since it is not necessary to heat the composition (X) to cure it, the light source and the like in the light-emitting device 1 are less likely to be damaged by heat, especially when optical components in the light-emitting device 1 are produced.

Further, when the viscosity of the photopolymerizable compound (A) at 25° C. is 50 mPa·s or less, the viscosity of the composition (X) can be easily reduced. Therefore, the composition (X) can be easily molded by an inkjet method, and therefore the composition (X) can be easily molded with high positional accuracy. In addition, when the composition (X) is molded by an inkjet method, foreign matter is less likely to be mixed into the composition (X) and its cured product, compared with the case where the composition (X) is molded by a printing method involving contact such as a screen printing method. Therefore, the yield in manufacturing the optical component is less likely to deteriorate.

Furthermore, in the present embodiment, since the photopolymerizable compound (A) has a dielectric constant of 8.0 or less at 25° C. and a frequency of 10 kHz, droplets of the composition (X) ejected by an inkjet method The trajectory is less susceptible to electric and magnetic fields. Therefore, even if the object to which the composition (X) is applied is charged or magnetized, it is difficult for the trajectory of the droplet to be bent or the droplet to be repelled by the member due to the interaction between the member and the droplet. , the landing position of the droplet on the target is less likely to deviate from the designed position. Therefore, the composition (X) can be easily molded with higher positional accuracy, and defects are less likely to occur in optical parts and the like produced from the composition (X).

As described above, in the present embodiment, when molding the composition (X) on a member made of an inorganic material, the member is previously subjected to a treatment that accompanies electrification or magnetization such as plasma treatment for the purpose of improving wettability. Even in this case, it is easy to mold the composition (X) with high positional accuracy. That is, even if the member is charged or magnetized by the above treatment, the trajectory of the droplets of the composition (X) ejected by the inkjet method is less affected by the electric field and the magnetic field. Misalignment is less likely to occur. As a result, it is possible to reduce the labor and equipment for the treatment such as static elimination of the member, and it is easy to increase the efficiency of producing an optical component or the like from the composition (X).

Further, when the photopolymerizable compound (A) has a dielectric constant of 8.0 or less at 25° C. and a frequency of 10 kHz, the dielectric constant of the cured product of the composition (X) and the optical component can be easily lowered. Therefore, the optical components are less likely to cause problems in the light emitting device 1 . That is, for example, if the display device including the optical component is a touch panel, if the relative dielectric constant of the optical component is high, it may affect the sensitivity of the touch panel and cause malfunction. Since it is easy to lower the dielectric constant of the optical component, it is possible to prevent malfunction.

The dielectric constant of the photopolymerizable compound (A) at 25° C. and a frequency of 10 kHz is more preferably 7.5 or less, and even more preferably 7.0 or less. The dielectric constant of the photopolymerizable compound (A) is preferably as low as possible, ideally 0.

The relative permittivity of the cured product at a temperature of 25° C. and a frequency of 100 kHz is preferably 3.0 or less. In this case, malfunction of the light-emitting device 1 such as the touch panel due to the optical component can be particularly prevented. The dielectric constant of the cured product is more preferably 2.8 or less, particularly preferably 2.7 or less. The dielectric constant of the cured product is preferably as low as possible, ideally 0.

It is preferred that the composition (X) does not contain a solvent, or that the content of the solvent (percentage of the solvent to the entire composition (X)) is 1% by mass or less. In this case, the composition (X) and the cured product of the composition (X) are less likely to generate outgassing derived from the solvent. Therefore, the composition (X) is less likely to change in viscosity due to volatilization of the solvent, thereby enhancing the storage stability of the composition (X). In addition, voids due to outgassing are less likely to occur in the light emitting device 1 . Therefore, water is less likely to reach the light source through the gap, and the light source is less likely to deteriorate due to water. In addition, a drying step for removing the solvent from the composition (X) and the cured product can be eliminated during the production of the optical component. There may be a drying step for removing the solvent from at least one of the composition (X) and the cured product. In this case, at least one of reducing the heating temperature and shortening the heating time in the drying step is possible. can be done. Therefore, outgassing from the optical components can be suppressed without lowering the manufacturing efficiency of the optical components. Furthermore, if the composition (X) does not contain a solvent, or if the solvent content is 1% by mass or less, when the composition (X) is molded particularly by an inkjet method, the composition (X ), the thickness of the optical component is less likely to be reduced due to evaporation of the solvent. The solvent content is more preferably 0.5% by mass or less, even more preferably 0.3% by mass or less, and particularly preferably 0.1% by mass or less. It is particularly preferred that the composition (X) contains no solvent or only unavoidably mixed solvents.

The cured product of composition (X) preferably has a glass transition temperature of 80° C. or higher. That is, it is preferable that the composition (X) has the property of becoming a cured product having a glass transition temperature of 80° C. or higher when cured. In this case, the cured product can have good heat resistance. Therefore, for example, when the cured product is subjected to a treatment that involves a temperature rise, the cured product is less likely to deteriorate. Therefore, for example, when a passivation layer or the like is formed by a vapor deposition method such as a plasma CVD method so as to cover an optical component manufactured from the composition (X), the optical component hardly deteriorates even if the optical component is heated. In addition, by increasing the heat resistance, the optical component can be adapted to in-vehicle applications that require strict heat resistance. The glass transition temperature of the cured product is more preferably 90°C or higher, and even more preferably 100°C or higher. The glass transition temperature of this cured product can be achieved by the composition of composition (X) described in detail below.

The viscosity of composition (X) at 25° C. is preferably 40 mPa·s or less. In this case, the composition (X) can be easily molded by an inkjet method at room temperature. This viscosity is more preferably 30 mPa·s or less, more preferably 25 mPa·s or less, even more preferably 20 mPa·s or less, and particularly preferably 15 mPa·s or less. This viscosity is preferably 1 mPa·s or more, and more preferably 5 mPa·s or more.

It is also preferable that the composition (X) has a viscosity at 40° C. of 40 mPa·s or less. In this case, even if the viscosity of the composition (X) at room temperature is any value, the viscosity of the composition (X) can be lowered by slightly heating the composition (X). Therefore, if heated, the composition (X) can be easily molded by an inkjet method. Moreover, since the viscosity of the composition (X) can be lowered without significantly heating the composition (X), changes in the composition of the composition (X) due to volatilization of the components in the composition (X) can be suppressed. This viscosity is more preferably 30 mPa·s or less, more preferably 25 mPa·s or less, even more preferably 20 mPa·s or less, and particularly preferably 15 mPa·s or less. This viscosity is preferably 1 mPa·s or more, and more preferably 5 mPa·s or more.

Such a low viscosity of composition (X) is achievable by the composition of composition (X) described in detail below.

The volatility when 20 mg of composition (X) is heated at 100° C. for 30 minutes using a thermogravimetric analyzer is preferably 40% or less. The volatility of composition (X) is the weight loss of composition (X) after treatment relative to the weight of composition (X) before treatment (the weight of composition (X) before treatment and after treatment weight difference) is defined as a percentage. In this case, the low volatility of the composition (X) can improve the storage stability of the composition (X). In addition, outgassing is less likely to occur from the cured product of the composition (X) and optical parts. Therefore, voids due to outgassing are less likely to occur in the light emitting device 1 . The volatility of the composition (X) was measured by heating 20 mg of the composition (X) at 100 ° C. for 30 minutes using a thermogravimetric analyzer, and comparing the weight before treatment to the weight after treatment. It can be obtained by calculating the amount. The volatility when 20 mg of composition (X) is heated at 100° C. for 30 minutes using a thermogravimetric analyzer is more preferably 30% or less, and if it is 20% or less More preferred. Although the lower limit of volatility of composition (X) is not particularly limited, it may be, for example, 0.1% or more.

The present embodiment will be described in more detail below.

1. Light-Emitting Device First, the structure of the light-emitting device 1 will be described in the case where the optical component is the encapsulant 5 that seals the light-emitting element 4 that is the light source in the light-emitting device 1 . The light-emitting device 1 includes a light-emitting element 4 and a sealing material 5 covering the light-emitting element 4 . The sealing material 5 may cover the light emitting element 4 while being in direct contact with the light emitting element 4, or may cover the light emitting element 4 while some layer is interposed between the sealing material 5 and the light emitting element 4. good. The light emitting device 1 may be, for example, a lighting device or a display device (display).

Light emitting element 4 includes, for example, a light emitting diode. Light-emitting diodes include, for example, at least one of organic EL elements (organic light-emitting diodes) and micro light-emitting diodes. When the light-emitting element 4 includes an organic light-emitting diode, the light-emitting device 1 including the light-emitting element 4 is, for example, an organic EL display. If the light emitting element 4 comprises a micro light emitting diode, the light emitting device 1 comprising the light emitting element 4 is for example a micro LED display. Note that EL means electroluminescence, and LED means light emitting diode.

A first example of the structure of the light emitting device 1 will be described with reference to FIG. This light emitting device 1 is of a top emission type. A light-emitting device 1 includes a support substrate 2 , a transparent substrate 3 facing the support substrate 2 with a gap therebetween, a light-emitting element 4 on the surface of the support substrate 2 facing the transparent substrate 3 , and the support substrate 2 and the transparent substrate 3 . and a sealing material 5 filled between them. In the first example, the light-emitting device 1 also includes a passivation layer 6 that covers the surface of the support substrate 2 facing the transparent substrate 3 and the light-emitting elements 4 . That is, the passivation layer 6 is interposed between the light emitting element 4 and the sealing material 5 covering the light emitting element 4 .

The support substrate 2 is made of, for example, a resin material, but is not limited to this. The transparent substrate 3 is made of a translucent material. The transparent substrate 3 is, for example, a glass substrate or a transparent resin substrate. When the light-emitting element 4 includes an organic EL element, the organic EL element includes, for example, a pair of electrodes and an organic light-emitting layer between the electrodes. The organic light emitting layer includes, for example, a hole injection layer, a hole transport layer, an organic light emitting layer and an electron transport layer, and these layers are laminated in the order described above. Although only one light-emitting element 4 is shown in FIG. good. Passivation layer 6 is preferably made of silicon nitride or silicon oxide.

A second example of the structure of the light emitting device 1 will be described with reference to FIG. Elements common to those in the first example shown in FIG. 1 are denoted by the same reference numerals in FIG. 2 as those in FIG. 1, and detailed description thereof will be omitted as appropriate. The light emitting device 1 shown in FIG. 2 is also of the top emission type. The light-emitting device 1 includes a support substrate 2, a transparent substrate 3 facing the support substrate 2 with a gap therebetween, a light-emitting element 4 on the surface of the support substrate 2 facing the transparent substrate 3, and a seal covering the light-emitting element 4. Material 5 is provided.

When the light-emitting element 4 includes an organic EL element, the organic EL element includes, for example, a pair of electrodes 41 and 43 and an organic light-emitting layer 42 between the electrodes 41 and 43, as in the first example. The organic light emitting layer 42 includes, for example, a hole injection layer 421, a hole transport layer 422, an organic light emitting layer 423 and an electron transport layer 424, and these layers are laminated in the order described above.

The light-emitting device 1 includes a plurality of light-emitting elements 4 , and the plurality of light-emitting elements 4 form an array 9 (hereinafter referred to as element array 9 ) on the support substrate 2 . The element array 9 also comprises partition walls 7 . The partition wall 7 is located on the support substrate 2 and partitions between the two adjacent light emitting elements 4 . The partition wall 7 is produced by molding a photosensitive resin material by photolithography, for example. The element array 9 also includes connection wirings 8 that electrically connect the electrodes 43 and the electron transport layers 424 of the adjacent light emitting elements 4 to each other. The connection wiring 8 is provided on the partition wall 7 .

The light emitting device 1 also comprises a passivation layer 6 covering the light emitting element 4 . Passivation layer 6 is preferably made of silicon nitride or silicon oxide. Passivation layer 6 includes a first passivation layer 61 and a second passivation layer 62 . The first passivation layer 61 covers the light emitting elements 4 by covering the element array 9 while being in direct contact with the element array 9 . The second passivation layer 62 is arranged on the side opposite to the element array 9 with respect to the first passivation layer 61, and a space is provided between the second passivation layer 62 and the first passivation layer 61. ing. A sealing material 5 is filled between the first passivation layer 61 and the second passivation layer 62 . That is, the first passivation layer 61 is interposed between the light emitting element 4 and the sealing material 5 covering the light emitting element 4 .

Furthermore, a second sealing material 52 is filled between the second passivation layer 62 and the transparent substrate 3 . The second sealing material 52 is made of, for example, a transparent resin material. The material of the second sealing material 52 is not particularly limited. The material of the second sealing material 52 may be the same as or different from that of the sealing material 5 .

A method for producing an optical component using the composition (X) and a method for producing the light-emitting device 1 will be described.

In the present embodiment, the composition (X) is molded by an inkjet method to form a coating film, and then the composition (X) is irradiated with ultraviolet rays and then heated to produce an optical component. preferably. In this embodiment, the composition (X) can be applied and molded by an inkjet method.

When applying the composition (X) by an inkjet method, if the composition (X) has a sufficiently low viscosity at room temperature, the composition (X) can be molded by applying the composition (X) by an inkjet method without heating. In the case where the composition (X) has a property of decreasing the viscosity when heated, the composition (X) may be heated and then applied by an ink jet method for molding. The heating temperature of the composition (X) is, for example, 20°C or higher and 50°C or lower.

When the coating film obtained by molding the composition (X) is irradiated with light to be cured, the light with which the coating film is irradiated is, for example, ultraviolet rays. Ultraviolet light means light having a wavelength in the range of 200 nm or more and 410 nm or less. The wavelength of the light with which the coating film is irradiated is preferably in the range of 350 nm or more and 410 nm or less, more preferably 385 nm or more and 405 nm or less. Light with a wavelength of 395 nm is a representative example of the light with which the coating film is irradiated. The wavelength of the light with which the coating film is irradiated is not limited to the above description as long as the coating film can be cured.

The irradiation intensity of the light applied to the coating film is preferably 20 mW/m ² or more and 20 W/cm ² or less. The irradiation intensity of light is not limited to the above description as long as the coating film can be cured.

The shape of the portion irradiated with light when the coating film is irradiated with light may be an area type having a certain area, or may be a line type. In the case of the line type, the entire coating film can be irradiated with light by moving the coating film with respect to the light source or by moving the light source with respect to the coating film. In this case, it is easy to adjust the time during which the coating film is irradiated with light, and by adjusting this time, it is easy to adjust the integrated amount of light.

More specifically, for example, first, the support substrate 2 is prepared. A partition wall is formed on one surface of the support substrate 2 by photolithography using, for example, a photosensitive resin material. Subsequently, a plurality of light emitting elements 4 are provided on one surface of the support substrate 2 . The light emitting element 4 can be produced by an appropriate method such as a vapor deposition method or a coating method. In particular, it is preferable to fabricate the light-emitting element 4 by a coating method such as an inkjet method. Thus, an element array 9 is produced on the support substrate 2 .

Next, a first passivation layer 61 is provided over the device array 9 . The first passivation layer 61 can be produced by a vapor deposition method such as a plasma CVD method.

Next, the composition (X) is formed on the first passivation layer 61 by, for example, an inkjet method to form a coating film. If the inkjet method is applied to both the formation of the light-emitting element 4 and the application of the composition (X), the manufacturing efficiency of the light-emitting device 1 can be particularly improved. Subsequently, the coating film is cured by irradiating it with ultraviolet rays to produce the sealing material 5 which is an optical component. The thickness of the optical component is, for example, 5 μm or more and 50 μm or less.

The thickness of the optical component is preferably 4 μm or more and 50 μm or less, more preferably 4 μm or more and 15 μm or less. As described above, in the present embodiment, it is easy to form small droplets of the composition (X) at a high density by an ink jet method, so it is easy to realize a thin optical component having a thickness of 4 μm or more and 15 μm or less. When the encapsulant 5 is thinned in this manner, tensile stress and compressive stress are less likely to occur in the optical components in the light emitting device 1 . Therefore, it becomes easier to realize a flexible light emitting device 1 .

Before forming a coating film of the composition (X) on the first passivation layer 61, the first passivation layer 61 may be subjected to at least one of atmospheric pressure plasma treatment and UV ozone treatment. In this case, the affinity between the first passivation layer 61 and the composition (X) can be enhanced. Further, even if the first passivation layer 61 after the treatment is not subjected to the static elimination treatment, as described above, in the present embodiment, the photopolymerizable compound (A) has a dielectric constant of 8.0 at 25° C. and a frequency of 10 kHz. Since it is 0 or less, the trajectory of droplets of the composition (X) jetted by an ink jet method is less susceptible to electric and magnetic fields. Therefore, defects are less likely to occur in coating films and optical parts produced from the composition (X). Note that the first passivation layer 61 may be subjected to static elimination treatment. Defects are less likely to occur in the coating film and the optical parts if the static elimination treatment is performed.

A second passivation layer 62 is then provided over the optical components. The second passivation layer 62 can be produced by a vapor deposition method such as a plasma CVD method.

Next, an ultraviolet curable resin material is provided on one surface of the support substrate 2 so as to cover the second passivation layer 62, and the transparent substrate 3 is placed on this resin material. The transparent substrate 3 is, for example, a glass substrate or a transparent resin substrate.

Next, the transparent substrate 3 is irradiated with ultraviolet rays from the outside. Ultraviolet rays pass through the transparent substrate 3 and reach the ultraviolet curable resin material. Thereby, the ultraviolet curable resin material is cured, and the second sealing material 52 is produced.

Note that the optical component produced from the composition (X) according to this embodiment is not limited to the encapsulant 5 for the light emitting element 4 . Composition (X) can be used to produce various optical components that transmit light emitted by a light source. For example, the optical component may be a color resist. That is, for example, the composition (X) may contain a phosphor, and a color resist for a color filter may be produced from the composition (X). In this case, particularly by using the ink jet method, it is easy to form the color resist in the color filter with high density and accuracy. This color filter can be provided in a display device such as an organic EL display or a micro LED display, which is the light emitting device 1, for example.

Next, the configuration of the touch panel 100 including the light emitting device 1 and the touch sensor 10 will be described with reference to FIG.

The light emitting device 1 is, for example, a display device. A touch sensor 10 is arranged on the light emitting device 1 . The touch panel 100 further includes a polarizing plate 11 and a protective layer 12 . In the touch panel 100, the light emitting device 1, the touch sensor 10, the polarizing plate 11 and the protective layer 12 are laminated in this order.

A touch sensor 10 is arranged on a transparent substrate 3 included in the light emitting device 1 . The touch sensor 10 may be capacitive or pressure sensitive. In the present embodiment, by reducing the dielectric constant of the resin composition (X), malfunction of the touch sensor 10 can be easily suppressed. In particular, when the touch sensor 10 is of the capacitance type, it is easy to suppress malfunction of the touch sensor 10 .

A polarizing plate 11 is arranged on the touch sensor 10 . The polarizing plate 11 can improve the visibility of the touch panel 100 . The polarizing plate 11 may be plate-like or film-like. As the polarizing plate 11, a known polarizing plate used for displays can be used. Although the material of the polarizing plate 11 is not particularly limited, it is made of resin, for example.

A protective layer 12 is arranged on the polarizing plate 11 . The protective layer 12 can protect the polarizing plate 11 . The protective layer 12 may be plate-like or film-like. Although the material of the protective layer 12 is not particularly limited, it is made of resin or glass, for example.

2. Ultraviolet Curing Resin Composition The components contained in the composition (X) will be described in detail. In the following description, “(meth)acrylic” is a generic term for “acrylic” and “methacrylic”.

The photopolymerizable compound (A) is a component capable of undergoing a polymerization reaction upon irradiation with ultraviolet rays in the presence or absence of the photopolymerization initiator (B). The photoinitiator (B) may contain a curing catalyst. The photopolymerizable compound (A) contains, for example, at least one component selected from the group consisting of monomers, oligomers and prepolymers.

The photopolymerizable compound (A) contains, for example, at least one of a radically polymerizable compound (A1) and a cationically polymerizable compound (W). When the photopolymerizable compound (A) contains the radical polymerizable compound (A1), the photopolymerization initiator (B) preferably contains the radical photopolymerization initiator (B1). When the photopolymerizable compound (A) contains the cationic polymerizable compound (W), the photopolymerization initiator (B) preferably contains a photocationic polymerization initiator (B2) (cationic curing catalyst).

When the photopolymerizable compound (A) contains the radically polymerizable compound (A1), the radically polymerizable compound (A1) preferably contains the acrylic compound (Y). Acrylic compound (Y) has one or more (meth)acryloyl groups in one molecule.

The viscosity of the entire acrylic compound (Y) at 25° C. is preferably 50 mPa·s or less. In this case, the acrylic compound (Y) can particularly lower the viscosity of the composition (X). The viscosity of the acrylic compound (Y) as a whole is more preferably 30 mPa·s or less, and particularly preferably 20 mPa·s or less. Further, the viscosity of the acrylic compound (Y) as a whole is, for example, 3 mPa·s or more.

It is also preferable that the viscosity of the entire acrylic compound (Y) at 40° C. is 50 mPa·s or less. In this case, the acrylic compound (Y) can particularly lower the viscosity of the composition (X) when heated. The viscosity of the acrylic compound (Y) as a whole is more preferably 30 mPa·s or less, and particularly preferably 20 mPa·s or less. Further, the viscosity of the acrylic compound (Y) as a whole is, for example, 3 mPa·s or more.

The percentage of components having a boiling point of 270° C. or higher in the acrylic compound (Y) is preferably 80% by mass or higher. In this case, the storage stability of the composition (X) is particularly unlikely to be impaired, and outgassing is particularly unlikely to occur from the cured product. More preferably, the percentage of components having a boiling point of 280° C. or higher in the acrylic compound (Y) is 80 mass % or higher.

The acrylic compound (Y) preferably contains a component having a viscosity of 20 mPa·s or less at 25°C. In this case, the viscosity of composition (X) can be particularly lowered.

The ratio of the component having a viscosity of 20 mPa·s or less at 25° C. to the total amount of the acrylic compound (Y) is preferably 50% by mass or more and 100% by mass or less. In this case, the viscosity of the composition (X) can be particularly lowered, and the composition (X) can be particularly easily molded by an inkjet method. This proportion is more preferably 60% by mass or more, and even more preferably 70% by mass or more. Further, this ratio is more preferably 95% by mass or less, and even more preferably 90% by mass or less.

The component having a viscosity of 20 mPa·s or less at 25°C preferably contains a compound having a glass transition temperature of 80°C or more. In this case, the glass transition temperature of the cured product can be increased while the viscosity of the composition (X) is lowered. This component preferably contains a compound having a glass transition temperature of 90°C or higher, and more preferably contains a compound having a glass transition temperature of 100°C or higher. Although the upper limit of the glass transition temperature of the compound contained in this component is not limited, it is, for example, 150° C. or less.

A compound that the acrylic compound (Y) may contain will be described.

The acrylic compound (Y) preferably contains a polyfunctional acrylic compound (Y1) having two or more radically polymerizable functional groups containing (meth)acryloyl groups in one molecule. In this case, the polyfunctional acrylic compound (Y1) can increase the glass transition temperature of the cured product, and therefore can increase the heat resistance of the cured product. The proportion of the polyfunctional acrylic compound (Y1) is preferably 50% by mass or more and 100% by mass or less with respect to the entire acrylic compound (Y). The acrylic compound (Y) may contain only the polyfunctional acrylic compound (Y1).

The polyfunctional acrylic compound (Y1) includes, for example, 1,3-butylene glycol di(meth)acrylate, 1,4-butanediol oligoacrylate, diethylene glycol diacrylate, 1,6-hexanediol oligoacrylate, neopentyl glycol diacrylate, Triethylene glycol diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, cyclohexanedimethanol diacrylate, tricyclodecanedimethanol diacrylate, bisphenol A polyethoxy diacrylate, bisphenol F polyethoxy diacrylate, pentatriestol tetra Acrylates, propoxylated (2) neopentyl glycol diacrylate, trimethylolpropane triacrylate, tris(2-hydroxyethyl) isocyanurate triacrylate, pentaerythritol triacrylate, ethoxylated (3) trimethylolpropane triacrylate, propoxylated ( 3) glyceryl triacrylate, pentaerythritol tetraacrylate, ditrimethylolpropane tetraacrylate, ethoxylated (4) pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, 2-(2-ethoxyethoxy)ethyl acrylate, hexadiol diacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, tripropylene glycol triacrylate, bispentaerythritol hexaacrylate, ethylene glycol diacrylate, 1,6-hexanediol diacrylate, ethoxylated 1,6-hexanediol diacrylate, polypropylene glycol diacrylate Acrylates, 1,4-butanediol diacrylate, 1,9-nonanediol diacrylate, tetraethylene glycol diacrylate, 2-n-butyl-2-ethyl-1,3-propanediol diacrylate, neopentyl hydroxypivalate Glycol diacrylate, hydroxypivalic acid trimethylolpropane triacrylate, ethoxylated phosphoric acid triacrylate, ethoxylated tripropylene glycol diacrylate, neopentyl glycol-modified trimethylolpropane diacrylate, stearic acid-modified pentaerythritol diacrylate, tetramethylolpropane triacrylate acrylates, tetramethylolmethane triacrylate, caprolactone-modified trimethylolpropane triacrylate, propoxylate glyceryl triacrylate, tetramethylolmethane tetraacrylate, ethoxylated pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, caprolactone-modified dipentaerythritol hexaacrylate, di Pentaerythritol hydroxypentaacrylate, neopentyl glycol oligoacrylate, trimethylolpropane oligoacrylate, pentaerythritol oligoacrylate, ethoxylated neopentyl glycol di(meth)acrylate, propoxylated neopentyl glycol di(meth)acrylate, tripropylene glycol di( It contains at least one compound selected from the group consisting of meth)acrylates, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, and 2-(2-vinyloxyethoxy)ethyl acrylate.

The acrylic equivalent of the polyfunctional acrylic compound (Y1) is preferably 150 g/eq or less, more preferably 90 g/eq or more and 150 g/eq or less. The weight average molecular weight of the polyfunctional acrylic compound (Y1) is, for example, 100 or more and 1000 or less, more preferably 200 or more and 800 or less.

The polyfunctional acrylic compound (Y1) preferably contains a compound (Y11) having a structure represented by formula (200) below.

CH ₂ =CR ¹ -COO-(R ³ -O) _n -CO-CR ² =CH ₂ (200)
In formula (200), each of R ¹ and R ² is hydrogen or a methyl group, n is an integer of 1 or more, R ³ is an alkylene group having 1 or more carbon atoms, and when n is 2 or more, A plurality of R ³ may be the same or different from each other.

Since compound (Y11) has the structure represented by formula (200), particularly because R ³ in formula (200) has 3 or more carbon atoms, it is difficult to increase the affinity of the cured product with water. Therefore, the phosphor (C) is less likely to be degraded by water. The carbon number of R ³ is, for example, 1 or more and 15 or less, preferably 3 or more and 15 or less. In addition, the compound (Y11) has a structure represented by formula (200), particularly two (meth)acryloyl groups in one molecule, so that the glass transition temperature of the cured product can be increased. , the heat resistance of the cured product can be enhanced. Also, n in formula (200) is an integer of 1 or more and 12 or less, for example.

The percentage ratio of compound (Y11) to acrylic compound (Y) is preferably 50% by mass or more. In this case, it is particularly difficult to increase the affinity of the cured product for water. The percentage ratio of the compound (Y11) to the acrylic compound (Y) is, for example, 100% by mass or less, or 95% by mass or less, preferably 80% by mass or less.

Compound (Y11) preferably contains a component having a boiling point of 270° C. or higher. That is, the acrylic compound (Y) preferably contains a component having a structure represented by formula (200) and a boiling point of 270° C. or higher. In this case, the acrylic compound (Y) is difficult to volatilize from the composition (X) during storage of the composition (X) and when the composition (X) is heated. Therefore, the storage stability of composition (X) is less likely to be impaired. Further, even if the compound (Y11) remains unreacted in the cured product of the composition (X), outgassing due to the compound (Y11) is less likely to occur from the cured product. Therefore, voids due to outgassing are less likely to occur in the light emitting device 1 . If there is a gap in the light-emitting device 1, moisture may enter the light-emitting element 4 through the gap. The boiling point is the boiling point under normal pressure obtained by converting the boiling point under reduced pressure, and can be determined, for example, by the method shown in Science of Petroleum, Vol. II. P.1281 (1938). It is more preferable if compound (Y11) contains a component having a boiling point of 280° C. or higher.

The percentage ratio of compound (Y11) to acrylic compound (Y) is preferably 50% by mass or more. In this case, the storage stability of composition (X) is effectively enhanced, outgassing from the cured product is effectively reduced, and the affinity of the cured product for water is particularly difficult to increase. The percentage ratio of the compound (Y11) to the acrylic compound (Y) is, for example, 100% by mass or less, or 95% by mass or less, preferably 80% by mass or less.

The viscosity of compound (Y11) at 25° C. is preferably 25 mPa·s or less. In this case, compound (Y11) can lower the viscosity of composition (X). The viscosity of compound (Y11) at 25° C. is more preferably 25 mPa·s or less, still more preferably 20 mPa·s or less, and particularly preferably 15 mPa·s or less. The viscosity of compound (Y11) at 25° C. is, for example, 1 mPa·s or more, preferably 3 mPa·s or more, and more preferably 5 mPa·s or more.

Compound (Y11) is at least one compound selected from the group consisting of, for example, alkylene glycol di(meth)acrylates, polyalkylene glycol di(meth)acrylates, and alkylene oxide-modified alkylene glycol di(meth)acrylates. contains.

Alkylene glycol di(meth)acrylate is a compound in which n is 1 in formula (200). In this case, R ³ in formula (200) preferably has 4 to 12 carbon atoms. R ³ may be linear or branched. In particular, alkylene glycol di(meth)acrylates are 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, neopentyl glycol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol diacrylate. Acrylates, 1,10-decanediol diacrylate, 1,4-butanediol dimethacrylate, 1,3-butylene glycol dimethacrylate, neopentyl glycol dimethacrylate, 1,6-hexanediol dimethacrylate, 1,9-nonanediol It preferably contains at least one compound selected from the group consisting of dimethacrylate, 1,10-decanediol dimethacrylate, and 1,12-dodecanediol dimethacrylate. In addition, the alkylene glycol di(meth)acrylate is the product number SR213 manufactured by Sartomer, the product number V195 manufactured by Osaka Organic Chemical Industry Co., Ltd., the product number SR212 manufactured by Sartomer, the product number SR247 manufactured by Sartomer, and the product name Light manufactured by Kyoei Chemical Industry Co., Ltd. Acrylate NP-A, product number SR238NS manufactured by Sartomer, product number V230 manufactured by Osaka Organic Chemical Industry Co., Ltd., product number HDDA manufactured by Daicel, product number 1,6HX-A manufactured by Kyoei Chemical Industry Co., Ltd., product number manufactured by Osaka Organic Chemical Industry Co., Ltd. V260, product number 1,9-ND-A manufactured by Kyoei Chemical Industry Co., Ltd., product number A-NOD-A manufactured by Shin-Nakamura Chemical Industry Co., Ltd., product number CD595 manufactured by Sartomer, product number SR214NS manufactured by Sartomer, Shin-Nakamura Chemical Industry Co., Ltd. Product number BD manufactured by Sartomer, product number SR297 manufactured by Sartomer, product number SR248 manufactured by Sartomer, product name Light Ester NP manufactured by Kyoei Chemical Industry, product number SR239NS manufactured by Sartomer, product name Light Ester 1,6HX manufactured by Kyoei Chemical Industry, Shin-Nakamura Chemical Industry Co., Ltd. product number HD-N, Kyoei Chemical Industry Co., Ltd. product name Light Ester 1,9ND, Shin-Nakamura Chemical Industry Co., Ltd. product number NOD-N, Kyoei Chemical Industry Co., Ltd. product name Light Ester 1,10DC, It preferably contains at least one compound selected from the group consisting of product number DOD-N manufactured by Shin-Nakamura Chemical Co., Ltd. and product number SR262 manufactured by Sartomer.

Polyalkylene glycol di(meth)acrylate is, for example, a compound in which n is 2 or more in formula (200). n is, for example, 2 to 10, preferably 2 to 7, more preferably 2 to 6, and more preferably 2 to 3. The carbon number of R ³ is, for example, 2-7, preferably 2-5. The higher the number of carbon atoms, the higher the hydrophobicity of the cured product, and the more difficult it is for the cured product to permeate moisture. Polyalkylene glycol di(meth)acrylates are especially diethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, hexaethylene glycol dimethacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, tripropylene glycol diacrylate, It preferably contains at least one compound selected from the group consisting of propylene glycol dimethacrylate, tritetramethylene glycol diacrylate, polyethylene glycol 200 dimethacrylate and polyethylene glycol 200 diacrylate. In addition, the polyalkylene glycol di(meth)acrylate is particularly available as product number SR230 manufactured by Sartomer, product number SR508NS manufactured by Sartomer, product number DPGDA manufactured by Daicel, product number SR306NS manufactured by Sartomer, product number TPGDA manufactured by Daicel, Osaka Organic Product number V310HP manufactured by Kagaku Kogyo Co., Ltd., product number APG200 manufactured by Shin-Nakamura Chemical Industry Co., Ltd., product name Light Acrylate PTMGA-250 manufactured by Kyoei Chemical Industry Co., Ltd., product number SR231NS manufactured by Sartomer, product name Light Ester 2EG manufactured by Kyoei Chemical Industry Co., Ltd., Product number SR205NS manufactured by Sartomer, product name Light Ester 3EG manufactured by Kyoei Chemical Industry, product number SR210NS manufactured by Sartomer, product name Light Ester 4EG manufactured by Kyoei Chemical Industry, product name Acryester HX manufactured by Mitsubishi Chemical Corporation, and Shin-Nakamura Chemical Industry. It is preferable to contain at least one compound selected from the group consisting of product number 3PG manufactured by Co., Ltd.

Alkylene oxide-modified alkylene glycol di(meth)acrylates include, for example, propylene oxide-modified neopentyl glycol. Further, the alkylene oxide-modified alkylene glycol di(meth)acrylate contains, for example, product number EBECRYL145 manufactured by Daicel.

When the acrylic compound (Y) contains the compound (Y11) having the structure represented by the formula (200), the compound (Y11) preferably does not contain compounds in which the value of n in the formula (200) is 5 or more. . It is particularly preferred not to include compounds in which the value of n in formula (200) is greater than 5 when (R ³ —O) _n is a polyethylene glycol skeleton. Even when the compound (Y11) contains a compound in the formula (200) in which the value of n is greater than 5, the percentage of the compound in the formula (200) in which the value of n is greater than 5 relative to the acrylic compound (Y) is 20. % or less is preferable. Further, even when the compound (Y11) contains a compound having a value of n greater than 5 in the formula (200), the compound (Y11) preferably does not contain a compound having a value of n greater than 9. It is further preferred not to include compounds with a value greater than 7. In these cases, the increase in viscosity of composition (X) is particularly difficult to occur.

It is particularly preferred if the polyfunctional acrylic compound (Y1) contains a polyalkylene glycol di(meth)acrylate. Polyalkylene glycol di (meth) acrylate has a low viscosity and is difficult to volatilize, so it can contribute to lowering the viscosity of the composition (X), and improves the storage stability of the composition (X) and prevents the cured product from It can contribute to the reduction of outgassing.

When the polyfunctional acrylic compound (Y1) contains polyalkylene glycol di(meth)acrylate, the ratio of polyalkylene glycol di(meth)acrylate to the acrylic compound (Y) is 40% by mass or more and 80% by mass or less. is preferred. When the proportion of polyalkylene glycol di(meth)acrylate is 40% by mass or more, the viscosity of composition (X) can be effectively reduced. When the proportion of polyalkylene glycol di(meth)acrylate is 80% by mass or less, the proportion of compounds having three or more (meth)acryloyl groups in the molecule increases, reactivity of composition (X), and The glass transition temperature of the cured product can be increased. This ratio is more preferably 42% by mass or more and 75% by mass or less, and even more preferably 45% by mass or more and 70% by mass or less.

The polyfunctional acrylic compound (Y1) may contain a compound having three or more radically polymerizable functional groups containing (meth)acryloyl groups in one molecule. In this case, the polyfunctional acrylic compound (Y1) can contain, for example, at least one selected from the group consisting of trimethylolpropane triacrylate, trimethylolpropane trimethacrylate and pentaerythritol tetra(meth)acrylate. In this case, the glass transition temperature of the cured product can be particularly increased, and therefore the heat resistance of the cured product can be particularly increased.

The polyfunctional acrylic compound (Y1) preferably contains pentaerythritol tetra(meth)acrylate. In this case, the glass transition temperature of the cured product can be particularly increased, and the reactivity of the composition (X) can be improved. When the reactivity of the composition (X) is improved, the composition (X) can be easily cured in an oxygen-containing environment such as an air atmosphere.

When the polyfunctional acrylic compound (Y1) contains pentaerythritol tetra (meth) acrylate, the ratio of pentaerythritol tetra (meth) acrylate to the acrylic compound (Y) is 0.5% by mass or more and 10% by mass or less. is preferred. In this case, both high reactivity and low viscosity of composition (X) can be achieved. This ratio is more preferably 1% by mass or more and 9% by mass or less, and even more preferably 2% by mass or more and 8% by mass or less.

The polyfunctional acrylic compound (Y1) may have at least one of a benzene ring, an alicyclic ring and a polar group. A polar group is, for example, at least one of an OH group and an NHCO group. In this case, shrinkage during curing of the composition (X) can be particularly reduced. Furthermore, adhesion between the cured product and inorganic compounds such as silicon nitride and silicon oxide can be enhanced. The polyfunctional acrylic compound (Y1) is particularly selected from the group consisting of tricyclodecanedimethanol diacrylate, bisphenol A polyethoxy diacrylate, bisphenol F polyethoxy diacrylate, trimethylolpropane triacrylate and pentaerythritol triacrylate. It preferably contains one compound. These compounds can particularly reduce shrinkage when the composition (X) is cured. Furthermore, these compounds can also enhance the adhesion between the cured product and inorganic compounds such as silicon nitride and silicon oxide.

When the adhesion between the cured product and the inorganic material is enhanced, when the color resist 1 is superimposed on a film made of an inorganic material (inorganic film) such as a SiN film, the adhesion between the color resist 1 and the inorganic film is high. is easy to obtain. Strictly speaking, since the adhesion between the resin matrix in which the photopolymerizable compound (A) is cured and the inorganic compound increases, when the phosphor (C) is an inorganic particle such as the quantum dot phosphor (C1) Therefore, the adhesiveness between the resin matrix and the phosphor (C) tends to increase in the cured product.

It is particularly preferable if the polyfunctional acrylic compound (Y1) contains polyalkylene glycol di(meth)acrylate and pentaerythritol tetra(meth)acrylate. In this case, the composition (X) has a low viscosity and excellent reactivity. Therefore, the composition (X) can be easily cured in an oxygen-containing environment such as an air atmosphere.

The acrylic compound (Y) also preferably contains a monofunctional acrylic compound (Y2) having only one (meth)acryloyl group as the radically polymerizable functional group in one molecule. The monofunctional acrylic compound (Y2) can suppress shrinkage during curing of the composition (X).

The amount of the monofunctional acrylic compound (Y2) relative to the total amount of the acrylic compound (Y) is preferably more than 0% by mass and 50% by mass or less. When the amount of the monofunctional acrylic compound (Y2) is more than 0% by mass, the shrinkage of the composition (X) during curing can be suppressed. In addition, when the amount of the monofunctional acrylic compound (Y2) is 50% by mass or less, the amount of the polyfunctional acrylic compound (Y1) can be 50% by mass or more, so that the heat resistance of the cured product can be particularly improved. More preferably, the amount of the monofunctional acrylic compound (Y2) is 5% by mass or more, and more preferably 30% by mass or less.

Monofunctional acrylic compounds (Y2) include, for example, tetrahydrofurfuryl acrylate, isobornyl acrylate, 2-hydroxyethyl acrylate, 4-hydroxybutyl acrylate, isobutyl acrylate, t-butyl acrylate, isooctyl acrylate, and 2-methoxyethyl acrylate. , methoxytriethylene glycol acrylate, 2-ethoxyethyl acrylate, 3-methoxybutyl acrylate, ethoxyethyl acrylate, butoxyethyl acrylate, ethoxydiethylene glycol acrylate, methoxydixylethyl acrylate, ethyl diglycol acrylate, cyclic trimethylolpropane formal monoacrylate, imido acrylate, isoamyl acrylate, ethoxylated succinic acid acrylate, trifluoroethyl acrylate, ω-carboxypolycaprolactone monoacrylate, cyclohexyl acrylate, 2-(2-ethoxyethoxy) ethyl acrylate, stearyl acrylate, diethylene glycol monobutyl ether acrylate, lauryl acrylate, isodecyl acrylate, 3,3,5-trimethylcyclohexanol acrylate, isooctyl acrylate, octyl/decyl acrylate, tridecyl acrylate, caprolactone acrylate, ethoxylated (4) nylphenol acrylate, methoxypolyethylene glycol (350) monoacrylate, Methoxypolyethylene glycol (550) monoacrylate, phenoxyethyl acrylate, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, benzyl acrylate, methylphenoxyethyl acrylate, 4-t-butylcyclohexyl Acrylate, caprolactone-modified tetrahydrofurfuryl acrylate, tribromophenyl acrylate, ethoxylated tribromophenyl acrylate, 2-phenoxyethyl acrylate, ethylene oxide adduct of 2-phenoxyethyl acrylate, propylene oxide adduct of 2-phenoxyethyl acrylate, acryloyl Morpholine, morpholin-4-yl acrylate, dicyclopentanyl acrylate, phenoxydiethylene glycol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 1,4-cyclohexanedimethanol monoacrylate, 3-methacryloyloxymethylcyclohexene oxide and 3-acryloyloxymethylcyclohexene oxide.

The monofunctional acrylic compound (Y2) may contain at least one compound selected from the group consisting of compounds having an alicyclic structure and compounds having a cyclic ether structure.

Compounds having an alicyclic structure include, for example, phenoxyethyl acrylate, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, benzyl acrylate, methylphenoxyethyl acrylate, 4-t-butyl cyclohexyl acrylate, caprolactone-modified tetrahydrofurfuryl acrylate, tribromophenyl acrylate, ethoxylated tribromophenyl acrylate, 2-phenoxyethyl acrylate, ethylene oxide adduct of 2-phenoxyethyl acrylate, propylene oxide adduct of 2-phenoxyethyl acrylate, from acryloylmorpholine, morpholin-4-yl acrylate, isobornyl acrylate, dicyclopentanyl acrylate, phenoxydiethylene glycol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, and 1,4-cyclohexanedimethanol monoacrylate containing at least one compound selected from the group consisting of

The number of ring members of the cyclic ether structure in the compound having the cyclic ether structure is preferably 3 or more, more preferably 3 or more and 4 or less. The number of carbon atoms contained in the cyclic ether structure is preferably 2 or more and 9 or less, more preferably 2 or more and 6 or less. The compound having a cyclic ether structure contains, for example, at least one compound selected from the group consisting of 3-methacryloyloxymethylcyclohexene oxide and 3-acryloyloxymethylcyclohexene oxide.

The acrylic compound (Y) may contain a compound having silicon in its molecular skeleton. In this case, the adhesion between the cured product and the inorganic material is improved. Compounds having silicon in the molecular skeleton include, for example, 3-(trimethoxysilyl)propyl acrylate (eg product number KBM5103 manufactured by Shin-Etsu Chemical Co., Ltd.) and (meth)acrylic group-containing alkoxysilane oligomer (eg manufactured by Shin-Etsu Chemical Co., Ltd. KR-513) containing at least one compound selected from the group consisting of product number KR-513).

The acrylic compound (Y) may contain a compound having phosphorus in its molecular skeleton. In this case, the adhesion between the cured product and the inorganic material is improved. Compounds having phosphorus in the molecular backbone include acid phosphooxy (meth)acrylates, such as acid phosphooxy polyoxypropylene glycol monomethacrylate.

The acrylic compound (Y) may contain a compound having nitrogen in its molecular skeleton. In this case, the adhesion between the cured product and the inorganic material is improved. In addition, the reactivity of the acrylic compound (Y) is likely to be improved, so outgassing is less likely to occur from the cured product. The compound having nitrogen in the molecular skeleton is selected from the group consisting of compounds having a morpholine skeleton such as acryloylmorpholine and morpholin-4-yl acrylate, diethylacrylamide, dimethylaminopropylacrylamide and pentamethylpiperidyl methacrylate. Contains at least one chemical compound.

It is particularly preferred that the acrylic compound (Y) contains a compound having a morpholine skeleton. In this case, the reactivity of the composition (X) can be further improved, and the curability of the composition (X) under an air atmosphere can be further improved. It is particularly preferred if the acrylic compound (Y) contains at least one of acryloylmorpholine and morpholin-4-yl acrylate. In this case, shrinkage of the composition (X) during curing can be suppressed. Also, acryloylmorpholine and morpholin-4-yl acrylate have low viscosities, so these compounds are less likely to increase the viscosity of composition (X). Furthermore, since these compounds are difficult to volatilize, the storage stability of the composition (X) can be easily improved.

The ratio of the compound having a morpholine skeleton to the acrylic compound (Y) is preferably 5% by mass or more and 50% by mass or less. In this case, there is an advantage that outgassing is less likely to occur from the cured product of the composition (X). This ratio is more preferably 7% by mass or more and 45% by mass or less, and even more preferably 10% by mass or more and 40% by mass or less.

Acrylic compound (Y) may contain a compound having an isobornyl skeleton. The compound having an isobornyl skeleton can contain, for example, one or more compounds selected from the group consisting of isobornyl acrylate and isobornyl methacrylate.

The acrylic compound (Y) may contain a component consisting of a compound having at least one skeleton selected from the group consisting of a dicyclopentadiene skeleton, a dicyclopentanyl skeleton, a dicyclopentenyl skeleton, and a bisphenol skeleton. Specifically, the acrylic compound (Y) may contain at least one compound selected from the group consisting of, for example, tricyclodecanedimethanol diacrylate, bisphenol A polyethoxy diacrylate and bisphenol F polyethoxy diacrylate. good. In this case, the adhesion between the cured product and the inorganic material can be enhanced.

The acrylic compound (Y) may contain a compound represented by the following formula (100). In this case, the reactivity of the composition (X) can be increased, and the adhesion between the cured product and the inorganic material can be improved.

In formula (100), R ⁰ is H or a methyl group. X is a single bond or a divalent hydrocarbon group. Each of R ¹ to R ¹¹ is H, an alkyl group or -R ¹² -OH, R ¹² is an alkylene group and at least one of R ¹ to R ¹¹ is an alkyl group or -R ¹² -OH. R ¹ to R ¹¹ are not chemically bonded to each other.

Specifically, for example, the acrylic compound (Y) contains at least one compound selected from the group consisting of a compound represented by the following formula (110), a compound represented by the formula (120), and a compound represented by the formula (130). You may

The radically polymerizable compound (A1) may contain a radically polymerizable compound (Z) other than the acrylic compound (Y). The amount of the radically polymerizable compound (Z) with respect to the total amount of the acrylic compound (Y) and the radically polymerizable compound (Z) is, for example, 10% by mass or less. The radically polymerizable compound (Z) includes a polyfunctional radically polymerizable compound (Z1) having two or more radically polymerizable functional groups per molecule and a monofunctional compound having only one radically polymerizable functional group per molecule. Either one or both of the radically polymerizable compound (Z2) can be contained. The polyfunctional radically polymerizable compound (Z1) is, for example, a group consisting of aromatic urethane oligomers, aliphatic urethane oligomers, epoxy acrylate oligomers, polyester acrylate oligomers and other special oligomers having two or more ethylenic double bonds in one molecule. It may contain at least one compound selected from In addition, the components that the polyfunctional radically polymerizable compound (Z1) may contain are not limited to those described above. Monofunctional radically polymerizable compounds (Z2) include, for example, N-vinylformamide, vinylcaprolactam, vinylpyrrolidone, phenyl glycidyl ether, p-tert-butylphenyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, allyl glycidyl ether, 1,2-butylene oxide, 1,3-butadiene monoxide, 1,2-epoxidedecane, epichlorohydrin, 1,2-epoxydecane, styrene oxide, cyclohexene oxide, 3-vinylcyclohexene oxide, 4-vinylcyclohexene It contains at least one compound selected from the group consisting of oxide, N-vinylpyrrolidone and N-vinylcaprolactam. In addition, the components that the monofunctional radically polymerizable compound (Z2) may contain are not limited to those described above.

When the radically polymerizable compound (A1) contains the radically polymerizable compound (Z), the radically polymerizable compound (Z) may contain a compound having nitrogen in its molecular skeleton. Compounds having nitrogen in the molecular skeleton include, for example, at least one compound selected from the group consisting of N-vinylformamide, N-vinylpyrrolidone and N-vinylcaprolactam. In this case, as in the case where the acrylic compound (Y) contains a compound having nitrogen in its molecular skeleton, the adhesion between the cured product and the inorganic material is improved.

In other words, the radically polymerizable compound (A1) preferably contains a compound having nitrogen in its molecular skeleton. The compound having nitrogen in its molecular skeleton may contain a compound contained in the acrylic compound (Y), or may contain a compound contained in the radically polymerizable compound (Z). In this case, the adhesion between the cured product and the inorganic material is improved. The ratio of the compound having nitrogen in the molecular skeleton to the entire radically polymerizable compound (A1) is preferably 5% by mass or more and 80% by mass or less. When this ratio is 5% by mass or more, the adhesion between the cured product and the inorganic material is particularly likely to be improved. When this ratio is 80% by mass or less, the compound having nitrogen in the molecular skeleton is less likely to inhibit the storage stability of the composition (X), and the satellite when the composition (X) is jetted by an inkjet method. difficult to generate. Therefore, the inkjet properties of the composition (X) are less likely to be impaired. Furthermore, outgassing due to compounds having nitrogen in the molecular skeleton can be suppressed. This ratio is more preferably 10% by mass or more and 70% by mass or less, more preferably 20% by mass or more and 60% by mass or less, and particularly preferably 25% by mass or more and 50% by mass.

When the photopolymerizable compound (A) contains the cationically polymerizable compound (W), the cationically polymerizable compound (W) is, for example, a polyfunctional cationically polymerizable compound (W1) and a monofunctional cationically polymerizable compound (W2). contains at least one of

The polyfunctional cationically polymerizable compound (W1) is one or both of a polyfunctional cationically polymerizable compound (W11) having no siloxane skeleton and a polyfunctional cationically polymerizable compound (W12) having a siloxane skeleton. can contain

The polyfunctional cationically polymerizable compound (W11) does not have a siloxane skeleton and has two or more cationically polymerizable functional groups per molecule. The number of cationically polymerizable functional groups per molecule of the polyfunctional cationically polymerizable compound (W11) is preferably 2 to 4, more preferably 2 to 3.

The cationic polymerizable functional group is, for example, at least one group selected from the group consisting of epoxy group, oxetane group and vinyl ether group.

The polyfunctional cationically polymerizable compound (W11) is, for example, from the group consisting of polyfunctional alicyclic epoxy compounds, polyfunctional heterocyclic epoxy compounds, polyfunctional oxetane compounds, alkylene glycol diglycidyl ethers, and alkylene glycol monovinyl monoglycidyl ethers. It contains at least one selected compound.

The polyfunctional alicyclic epoxy compound contains, for example, one or both of a compound represented by the following formula (1) and a compound represented by the following formula (20).

In formula (1), each of R ¹ to R ¹⁸ is independently a hydrogen atom, a halogen atom, or a hydrocarbon group. The number of carbon atoms in the hydrocarbon group is preferably within the range of 1-20. The hydrocarbon group is, for example, an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group, or a propyl group; an alkenyl group having 2 to 20 carbon atoms such as a vinyl group or an allyl group; or an ethylidene group or a propylidene group. 20 alkylidene groups. The hydrocarbon group may contain an oxygen atom or a halogen atom. Each of R ¹ to R ¹⁸ is independently preferably a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, more preferably a hydrogen atom or a methyl group, most preferably a hydrogen atom.

In formula (1), X is a single bond or a divalent organic group, and the organic group is, for example, --CO--O-- _CH.sub.2-- .

Examples of the compound represented by formula (1) include the compound represented by formula (1a) below and the compound represented by formula (1b) below.

In formula (20), each of R ¹ to R ¹² is independently a hydrogen atom, a halogen atom, or a hydrocarbon group having 1 to 20 carbon atoms. Halogen is, for example, fluorine, chlorine, bromine or iodine. The hydrocarbon group having 1 to 20 carbon atoms is, for example, an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group and a propyl group; an alkenyl group having 2 to 20 carbon atoms such as a vinyl group and an allyl group; or an ethylidene group and a propylidene group. It is an alkylidene group having 2 to 20 carbon atoms such as a group. The hydrocarbon group having 1 to 20 carbon atoms may contain an oxygen atom or a halogen atom.

Each of R ¹ to R ¹² is independently preferably a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, more preferably a hydrogen atom or a methyl group, most preferably a hydrogen atom.

Examples of compounds represented by formula (20) include tetrahydroindene diepoxide represented by formula (20a) below.

A polyfunctional heterocyclic epoxy compound contains, for example, a trifunctional epoxy compound as represented by the following formula (2).

The polyfunctional oxetane compound contains, for example, a bifunctional oxetane compound represented by the following formula (3).

Alkylene glycol diglycidyl ether contains, for example, at least one compound selected from the group consisting of compounds represented by the following formulas (4) to (7).

Alkylene glycol monovinyl monoglycidyl ether contains, for example, a compound represented by the following formula (8).

More specifically, the polyfunctional cationic polymerizable compound (W11) is, for example, Celoxide 2021P and Celoxide 8010 manufactured by Daicel, TEPIC-VL manufactured by Nissan Chemical, OXT-221 manufactured by Toagosei, and 1, manufactured by Yokkaichi Gosei. It can contain at least one component selected from the group consisting of 3-PD-DEP, 1,4-BG-DEP, 1,6-HD-DEP, NPG-DEP and butylene glycol monovinyl monoglycidyl ether.

The polyfunctional cationically polymerizable compound (W11) also preferably contains a polyfunctional alicyclic epoxy compound. In this case, the composition (X) can have a particularly high cationic polymerization reactivity.

The polyfunctional alicyclic epoxy compound preferably contains either one or both of the compound represented by formula (1) and the compound represented by formula (20). In this case, composition (X) can have higher cationic polymerization reactivity.

When the polyfunctional alicyclic epoxy compound contains the compound represented by formula (1), the compound represented by formula (1) preferably contains the compound represented by formula (1a). In this case, the composition (X) can have a higher cationic polymerization reactivity and a particularly low viscosity.

In addition, in particular, the compound represented by formula (20) has a low viscosity, so when the compound represented by formula (20) is contained, the composition (X) can have good ultraviolet curability, and in particular It can have a low viscosity. Furthermore, the compound represented by formula (20) has a property of being difficult to volatilize in spite of having a low viscosity. Therefore, even if the composition (X) contains the compound represented by the formula (20), the composition (X) is unlikely to change in composition due to volatilization of the compound represented by the formula (20). Therefore, by containing the compound represented by formula (20), the composition (X) can have a low viscosity without impairing the storage stability.

The compound represented by formula (20) can be synthesized, for example, by oxidizing a cyclic olefin compound having a tetrahydroindene skeleton using an oxidizing agent.

The compound of formula (20) can contain four stereoisomers based on the configuration of the two epoxy rings. Compounds of formula (20) may include any of the four stereoisomers. That is, the compound represented by formula (20) can contain at least one component selected from the group consisting of four stereoisomers. In the compound represented by the formula (20), the ratio of the total amount of the exo-endo form and the endo-endo form among the four stereoisomers is 10% by mass or less with respect to the entire epoxy compound (A1). is preferred, and 5% by mass or less is more preferred. In this case, the heat resistance of the cured product can be improved. The proportion of a specific stereoisomer in the compound represented by formula (20) can be determined based on the peak area ratio appearing in the chromatogram obtained by gas chromatography.

In order to reduce the amounts of the exo-endo form and the endo-endo form in the compound represented by the formula (20), a method of precision distillation of the compound represented by the formula (20), column chromatography using silica gel or the like as a packing material Any suitable method can be applied, such as a method applying graphics.

When the composition (X) contains the polyfunctional cationically polymerizable compound (W11), the ratio of the polyfunctional cationically polymerizable compound (W11) to the total amount of the resin component is preferably in the range of 5 to 95% by mass. . The resin component refers to a cationically polymerizable compound in the composition (X), and includes a polyfunctional cationically polymerizable compound (W1) and a monofunctional cationically polymerizable compound (W2). If the proportion of the polyfunctional cationically polymerizable compound (W11) is 5% by mass or more, the composition (X) can have particularly excellent reactivity during the cationic photopolymerization reaction, and thereby the cured product has high strength. (hardness). Further, if the proportion of the polyfunctional cationically polymerizable compound (W11) is 95% by mass or less, when the composition (X) contains the moisture absorbent (E), the moisture absorbent (E ) can be particularly easily dispersed uniformly. The proportion of the polyfunctional cationically polymerizable compound (W11) is more preferably 12% by mass or more, more preferably 15% by mass or more, even more preferably 20% by mass or more, and even more preferably 25% by mass or more. is particularly preferred. The proportion of this polyfunctional cationically polymerizable compound (W11) is more preferably 85% by mass or less, and even more preferably 60% by mass or less. For example, it is preferable that the proportion of the polyfunctional cationic polymerizable compound (W11) is within the range of 20 to 60% by mass.

When the polyfunctional cationically polymerizable compound (W11) contains a polyfunctional alicyclic epoxy compound, the polyfunctional alicyclic epoxy compound may be a part of the polyfunctional cationically polymerizable compound (W11), or the entire may be The ratio of the polyfunctional alicyclic epoxy compound to the polyfunctional cationically polymerizable compound (W11) is preferably within the range of 15 to 100% by mass. When this proportion is 15% by mass or more, the polyfunctional alicyclic epoxy compound can particularly contribute to improving the ultraviolet curability of the composition (X).

The polyfunctional cationically polymerizable compound (W12) has a siloxane skeleton and two or more cationically polymerizable functional groups per molecule. The number of cationically polymerizable functional groups per molecule of the polyfunctional cationically polymerizable compound (W12) is preferably 2 to 6, more preferably 2 to 4. The polyfunctional cationically polymerizable compound (W12) can contribute to improving the cationic polymerization reactivity of the composition (X), and can contribute to improving the resistance to heat discoloration of the cured product and the optical component. The polyfunctional cationically polymerizable compound (W12) can also contribute to lower elastic modulus of cured products and optical parts. When the composition (X) contains a moisture absorbent (E), the polyfunctional cationic polymerizable compound (W12) also contributes to improving the dispersibility of the moisture absorbent (E) in the composition (X) and in the cured product. can.

The polyfunctional cationic polymerizable compound (W12) is preferably liquid at 25°C. In particular, the viscosity at 25° C. of the polyfunctional cationic polymerizable compound (W12) is preferably in the range of 10 to 300 mPa·s. In this case, an increase in the viscosity of composition (X) can be suppressed.

The cationically polymerizable functional group possessed by the polyfunctional cationically polymerizable compound (W12) is, for example, at least one group selected from the group consisting of an epoxy group, an oxetane group and a vinyl ether group.

The siloxane skeleton of the polyfunctional cationically polymerizable compound (W12) may be linear, branched, or cyclic. The number of Si atoms in the siloxane skeleton is preferably within the range of 2-14. In this case, composition (X) can have a particularly low viscosity. The number of Si atoms is more preferably within the range of 2-10, more preferably within the range of 2-7, and particularly preferably within the range of 3-6.

The polyfunctional cationically polymerizable compound (W12) contains, for example, at least one of the compound represented by formula (10) and the compound represented by formula (11).

R in each of formulas (10) and (11) is a single bond or a divalent organic group, preferably an alkylene group. Y is a siloxane skeleton, which may be linear, branched, or cyclic, and the number of Si atoms is preferably within the range of 2 to 14, preferably within the range of 2 to 10. is more preferable, more preferably in the range of 2 to 7, and particularly preferably in the range of 3 to 6. n is an integer of 2 or more, preferably in the range of 2-4.

More specifically, for example, the polyfunctional cationic polymerizable compound (W12) contains a compound represented by the following formula (10a).

R in formula (10a) is a single bond or a divalent organic group, preferably an alkylene group having 1 to 4 carbon atoms. n in formula (10a) is an integer of 0 or more. n is preferably in the range of 0 to 12, more preferably in the range of 0 to 8, still more preferably in the range of 0 to 5, and particularly in the range of 1 to 4 preferable.

The compound represented by formula (10a) preferably contains a compound represented by formula (30) below. That is, the polyfunctional cationic polymerizable compound (W12) preferably contains a compound represented by the following formula (30).

More specifically, the polyfunctional cationic polymerizable compound (W12) is, for example, Shin-Etsu Chemical Co., Ltd. product numbers X-40-2669, X-40-2670, X-40-2715, X-40-2732, X -Containing at least one component selected from the group consisting of 22-169AS, X-22-169B, X-22-2046, X-22-343, X-22-163, and X-22-163B is preferred.

The polyfunctional cationically polymerizable compound (W12) preferably has an alicyclic epoxy structure, and it is particularly preferable if the polyfunctional cationically polymerizable compound (W12) contains a compound represented by formula (10a). The compound represented by the formula (10a) can particularly contribute to improving the cationic polymerization reactivity and lowering the viscosity of the composition (X). can contribute. When the composition (X) contains the moisture absorbent (E), it can particularly contribute to improving the dispersibility of the moisture absorbent (E) in the composition (X).

When the composition (X) contains the polyfunctional cationically polymerizable compound (W12), the ratio of the polyfunctional cationically polymerizable compound (W12) to the total amount of the resin component is preferably in the range of 5 to 95% by mass. . In this case, especially when the composition (X) contains the moisture absorbent (E), the dispersibility of the moisture absorbent (E) in the composition (X) and in the cured product is particularly improved, and the composition (X) can have a particularly high photocationic polymerization reactivity.

The monofunctional cationically polymerizable compound (W2) has only one cationically polymerizable functional group per molecule. The cationic polymerizable functional group is, for example, at least one group selected from the group consisting of epoxy group, oxetane group and vinyl ether group.

The viscosity of the monofunctional cationically polymerizable compound (W2) at 25° C. is preferably 8 mPa·s or less. In this case, the monofunctional cationic polymerizable compound (W2) can reduce the viscosity of the composition (X) even if the composition (X) does not contain a solvent. In particular, the viscosity of the monofunctional cationic polymerizable compound (W2) at 25° C. is preferably in the range of 0.1 to 8 mPa·s.

The monofunctional cationically polymerizable compound (W2) can contain, for example, at least one compound selected from the group consisting of compounds represented by the following formulas (12) to (17) and limonene oxide.

The ratio of the monofunctional cationically polymerizable compound (W2) to the total amount of the resin component is preferably within the range of 5 to 50% by mass. If the ratio of the monofunctional cationically polymerizable compound (W2) is 5% by mass or more, the viscosity of the composition (X) can be particularly reduced. Further, when the ratio of the monofunctional cationically polymerizable compound (W2) is 50% by mass or less, the composition (X) can have particularly excellent reactivity during the photocationic polymerization reaction, and thereby, the cured product can have high strength (hardness). The proportion of the monofunctional cationically polymerizable compound (W2) is more preferably 10% by mass or more, and even more preferably 15% by mass or more. The proportion of the monofunctional cationically polymerizable compound (W2) is more preferably 40% by mass or less, even more preferably 35% by mass or less, and particularly preferably 30% by mass or less. If the ratio of the monofunctional cationically polymerizable compound (W2) is particularly 35% by mass or less, the amount of volatilization of the components in the composition (X) during storage of the composition (X) can be effectively reduced. Therefore, even if the composition (X) is stored for a long period of time, the properties of the composition (X) are unlikely to be impaired. Furthermore, it is possible to particularly suppress the generation of tack in the cured product. For example, it is preferable that the ratio of the monofunctional cationic polymerizable compound (W2) is within the range of 10 to 35% by mass.

Further, particularly when the composition (X) contains the polyfunctional cationically polymerizable compound (W11) and the polyfunctional cationically polymerizable compound (W12), the total amount of the resin component is is in the range of 30 to 60% by mass, the ratio of the polyfunctional cationically polymerizable compound (W12) is in the range of 15 to 30% by mass, and the ratio of the monofunctional cationically polymerizable compound (W2) is in the range of 15 to 40% by mass. % is preferred. In this case, good storage stability, low viscosity, and good cationic polymerization reactivity of the composition (X) can be achieved in a well-balanced manner. well achievable.

If the cationic polymerizable compound (W) contains the compound represented by the formula (3) and the compound represented by the formula (16), a photocured product can be produced from the composition (X) by adjusting the ratio of the two. It is possible to realize a low viscosity and an improvement in the storage stability of the composition (X) while appropriately adjusting the easiness of progress of the curing reaction when the composition (X) is used.

The amount of the compound represented by formula (16) is appropriately adjusted so that the composition (X) has the properties described above. For example, the amount of the compound represented by formula (16) is preferably 10% by mass or more and 40% by mass or less with respect to the total amount of the resin component.

The cationically polymerizable compound (W) preferably contains a compound (f1) represented by the following formula (30) (hereinafter also referred to as an aromatic epoxy compound (f1)).

In formula (30), X is at least one selected from the group consisting of halogen, H, a hydrocarbon group and an alkylene glycol group, and when there are multiple Xs in one molecule, they may be the same or different. may Hydrocarbon groups are, for example, alkyl groups or aryl groups. When X is a hydrocarbon group, the number of carbon atoms in X is in the range of 1 to 10, for example. R is a single bond or a divalent organic group. When R is a divalent organic group, the divalent organic group is, for example, an alkylene group, an oxyalkylene group, a carbonyloxyalkylene group (eg -CO-O-CH ₂ -), or -C(Ph) ₂ -O —CH ₂ — group. Y is H or a monovalent organic group. When Y is a monovalent organic group, the monovalent organic group is for example an alkyl group or an aryl group.

When the cationically polymerizable compound (W) contains the aromatic epoxy compound (f1), the aromatic epoxy compound (f1) has a low viscosity, so the aromatic epoxy compound (f1) reduces the viscosity of the composition (X). easy to let In addition, the aromatic epoxy compound (f1) is difficult to volatilize, so even if the composition (X) is stored, the composition (X) is unlikely to change in composition due to volatilization of the aromatic epoxy compound (f1). . Therefore, the aromatic epoxy compound (f1) tends to improve the storage stability of the composition (X). In addition, since the aromatic epoxy compound (f1) has high reactivity, it is difficult for unreacted components to remain in the cured product, so that outgassing is less likely to occur from the cured product. Furthermore, the aromatic epoxy compound (f1) tends to increase the glass transition temperature of the cured product, and therefore tends to increase the heat resistance of the cured product.

In addition, the aromatic epoxy compound (f1) is less likely to produce defective droplets called satellites when the composition (X) is ejected by an inkjet method. A satellite is a droplet that separates from the original droplet and adheres to a position different from the original droplet adhesion position on the application target when the droplet is ejected by the ink jet method. If satellites are generated, the dimensional accuracy of the cured product produced from the composition (X) is deteriorated.

R in formula (30) is preferably a single bond or an alkylene group. When n in formula (30) is 2 or 3, at least one of the multiple Rs in formula (30) is preferably a single bond or an alkylene group. In these cases, the reactivity of the aromatic epoxy compound (f1) tends to be high, so that the curability of the composition (X) tends to be high when the composition (X) is irradiated with ultraviolet rays.

The aromatic epoxy compound (f1) preferably contains, for example, at least one compound selected from the group consisting of compounds represented by formulas (301) to (318) below.

In particular, the aromatic epoxy compound (f1) may contain at least one component selected from the group consisting of compounds represented by formulas (301) to (305), (312), (314) and (318). preferable. These compounds tend to have high reactivity due to the fact that at least one epoxy group (oxirane) in the compound and the benzene ring are bonded via a single bond or an alkylene group. easy to enhance.

The ratio of the aromatic epoxy compound (f1) to the total cationically polymerizable compound (W) is preferably 5% by mass or more. In this case, the above effects of the aromatic epoxy compound (f1) are particularly likely to be obtained. This proportion is also preferably 95% by mass or less. In this case, the storage stability of the composition (X) tends to be good. This ratio is more preferably 10% by mass or more and 90% by mass or less, and even more preferably 20% by mass or more and 85% by mass or less.

Preferable compounds that the photopolymerizable compound (A) may contain are as described above. In the present embodiment, as described above, the photopolymerizable compound (A) has a dielectric constant at 25° C. and a frequency of 10 kHz. 8.0 or less, and the viscosity at 25°C is 50 mPa·s or less. Therefore, the photopolymerizable compound (A) preferably contains a compound having a low dielectric constant and a low viscosity. In particular, the photopolymerizable compound (A) is isobornyl acrylate, isobornyl methacrylate, dicyclopentanyl acrylate, dicyclopentanyl methacrylate, adamantyl acrylate, adamantyl methacrylate, methyl acrylate, butyl acrylate, lauryl acrylate, polyethylene glycol di methacrylate, polyethylene glycol diacrylate, 1,6 hexanediol diacrylate, 1,9 nonanediol diacrylate, 1,10 decanediol diacrylate, 3-allyloxymethyl-3-ethyloxetane, 3-ethyl-3 {[( At least one selected from the group consisting of 3-ethyloxetan-3-yl)methoxy]methyl}oxetane, 2-ethylhexyloxetane, 1,4-cyclohexanedimethanol divinyl ether, diethylene glycol divinyl ether, and triethylene glycol divinyl ether It preferably contains a compound.

The photopolymerizable compound (A) has a dielectric constant of 7.0 or less at 25° C. and a frequency of 10 kHz, and a component (P) comprising at least one compound having a viscosity of 50 mPa·s or less at 25° C. It is preferable to contain The component (P) particularly tends to lower the dielectric constant and the viscosity of the photopolymerizable compound (A). Component (P) is isobornyl acrylate, isobornyl methacrylate, dicyclopentanyl acrylate, dicyclopentanyl methacrylate, adamantyl acrylate, adamantyl methacrylate, methyl acrylate, butyl acrylate, lauryl acrylate, 1,6-hexanediol diol. It preferably contains at least one compound selected from the group consisting of acrylates, 1,9-nonanediol diacrylate, 1,10-decanediol diacrylate and 1,4-cyclohexanedimethanol divinyl ether.

The ratio of the component (P) to the photopolymerizable compound (A) is preferably 50% by mass or more. In this case, the component (P) particularly tends to lower the dielectric constant and the viscosity of the photopolymerizable compound (A). In order to reduce the dielectric constant and viscosity of the photopolymerizable compound (A), the proportion of component (P) is ideally 100% by mass. Of course, the photopolymerizable compound (A) may contain a compound other than the component (P) for the purpose of adjusting properties other than the dielectric constant and viscosity of the photopolymerizable compound (A). In that case, the ratio of the component (P) to the photopolymerizable compound (A) is, for example, 80% by mass or less.

The ratio of the compound having a dielectric constant of more than 7.0 at 25° C. and a frequency of 10 kHz in the photopolymerizable compound (A) is 0% by mass or more and 13% by mass or less. is preferred. In this case, it is particularly easy to lower the dielectric constant of the photopolymerizable compound. In order to reduce the dielectric constant of the photopolymerizable compound (A), the proportion of compounds having a dielectric constant of more than 7.0 at 25° C. and a frequency of 10 kHz is ideally 0% by mass. Of course, for the purpose of adjusting properties other than the dielectric constant of the photopolymerizable compound (A), the photopolymerizable compound (A) has a dielectric constant of more than 7.0 at 25° C. and a frequency of 10 kHz. It may contain a compound. In that case, the ratio of the compound having a dielectric constant of more than 7.0 at 25° C. and a frequency of 10 kHz to the photopolymerizable compound (A) is, for example, 5% by mass or more.

As described above, when the photopolymerizable compound (A) contains the radical polymerizable compound (A1), the photopolymerization initiator (B) preferably contains the radical photopolymerization initiator (B1). The radical photopolymerization initiator (B1) is not particularly limited as long as it is a compound that generates radical species when irradiated with ultraviolet rays. Photoradical polymerization initiators (B1) include, for example, aromatic ketones, acylphosphine oxide compounds, aromatic onium salt compounds, organic peroxides, thio compounds (thioxanthone compounds, thiophenyl group-containing compounds, etc.), and hexaarylbiimidazole. compounds, oxime ester compounds, borate compounds, azinium compounds, metallocene compounds, active ester compounds, compounds having a carbon-halogen bond, and alkylamine compounds. The amount of the radical photopolymerization initiator (B1) relative to 100 parts by mass of the composition (X) is, for example, 1 part by mass or more and 10 parts by mass or less.

The radical photopolymerization initiator (B1) preferably contains a photobleaching initiator. In this case, the light transmittance of the cured product tends to increase.

The photobleaching initiator contains, for example, at least one of a photobleaching oxime ester compound and an acylphosphine oxide compound.

The oxime ester compound having photobleaching properties contains, for example, at least one of a compound represented by the following formula (401) and a compound represented by the following formula (402). Among these, the compound represented by the formula (402) has particularly high sensitivity, so that the photocurability of the composition (X) is particularly likely to be enhanced.

The acylphosphine oxide compound is, for example, at least one selected from the group consisting of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)diphenylphosphine oxide. contains.

The radical photopolymerization initiator (B1) may contain a sensitizer as part of the radical photopolymerization initiator (B1). The sensitizer can promote the radical generation reaction of the radical photopolymerization initiator (B1), improve the reactivity of radical polymerization, and improve the crosslink density. Sensitizers are, for example, 9,10-dibutoxyanthracene, 9-hydroxymethylanthracene, thioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, anthraquinone, 1,2- dihydroxyanthraquinone, 2-ethylanthraquinone, 1,4-diethoxynaphthalene, p-dimethylaminoacetophenone, p-diethylaminoacetophenone, p-dimethylaminobenzophenone, p-diethylaminobenzophenone, 4,4′-bis(dimethylamino)benzophenone, It can contain at least one compound selected from the group consisting of 4,4'-bis(diethylamino)benzophenone, p-dimethylaminobenzaldehyde, and p-diethylaminobenzaldehyde. In addition, the component which a sensitizer may contain is not restricted to the above.

The content of the sensitizer in the composition (X) is, for example, 0.1 parts by mass or more and 5 parts by mass or less, preferably 0.1 parts by mass with respect to 100 parts by mass of the solid content of the composition (X) part or more and 3 parts by mass or less. If the content of the sensitizer is within this range, the composition (X) can be cured in the air, and it is necessary to cure the composition (X) in an inert atmosphere such as a nitrogen atmosphere. Gone.

The composition (X) may contain a polymerization accelerator in addition to the radical photopolymerization initiator (B1). Polymerization accelerators include, for example, ethyl p-dimethylaminobenzoate, 2-ethylhexyl p-dimethylaminobenzoate, methyl p-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, butoxy p-dimethylaminobenzoate. Contains amine compounds such as ethyl. In addition, the components that the polymerization accelerator may contain are not limited to those mentioned above.

When the photopolymerizable compound (A) contains the cationic polymerizable compound (W), the composition (X) preferably further contains a sensitizer. In this case, the composition (X) can have a particularly high cationic polymerization reactivity. The sensitizer contains, for example, one or both of 9,10-dibutoxyanthracene and 9,10-diethoxyanthracene. The ratio of the sensitizer to the cationic polymerizable compound (W) is preferably in the range of more than 0% by mass and 1% by mass or less. In this case, the sensitizer is less likely to impair the transparency of the cured product, so that the cured product can have good transparency.

As described above, when the photopolymerizable compound (A) contains the cationic polymerizable compound (W), the photopolymerization initiator (B) preferably contains the photocationic polymerization initiator (B2). The photocationic polymerization initiator (B2) is not particularly limited as long as it is a catalyst that generates protonic acid or Lewis acid upon receiving light irradiation. The photocationic polymerization initiator (B2) can contain at least one of an ionic photoacid-generating cationic curing catalyst and a nonionic photoacid-generating cationic curing catalyst.

The ionic photoacid-generating cationic curing catalyst can contain at least one of onium salts and organometallic complexes. Examples of onium salts include aromatic diazonium salts, aromatic halonium salts, and aromatic sulfonium salts. Examples of organometallic complexes include iron-arene complexes, titanocene complexes, and arylsilanol-aluminum complexes. The ionic photoacid-generating cationic curing catalyst can contain at least one of these components.

The nonionic photoacid-generating cationic curing catalyst is, for example, at least one selected from the group consisting of nitrobenzyl esters, sulfonic acid derivatives, phosphoric acid esters, phenolsulfonic acid esters, diazonaphthoquinones, and N-hydroxyimide phosphonates. can contain the components of The components that the nonionic photoacid-generating cationic curing catalyst can contain are not limited to those described above.

More specific examples of compounds that can be contained in the photocationic polymerization initiator (B2) include Midori Chemical DPI series (105, 106, 109, 201, etc.), BI-105, MPI series (103, 105, 106, 109, etc.), BBI series (101, 102, 103, 105, 106, 109, 110, 200, 210, 300, 301, etc.), TSP series (102, 103, 105, 106, 109, 200, 300, 1000, etc.) ), HDS-109, MDS series (103, 105, 109, 203, 205, 209, etc.), BDS-109, MNPS-109, DTS series (102, 103, 105, 200, etc.), NDS series (103, 105 , 155, 165, etc.), DAM series (101, 102, 103, 105, 201, etc.), SI series (105, 106, etc.), PI-106, NDI series (105, 106, 109, 1001, 1004, etc.), PAI series (01, 101, 106, 1001, 1002, 1003, 1004, etc.), MBZ-101, PYR-100, NB series (101, 201, etc.), NAI series (100, 1002, 1003, 1004, 101, 105 , 106, 109, etc.), TAZ series (100, 101, 102, 103, 104, 107, 108, 109, 110, 113, 114, 118, 122, 123, 203, 204, etc.), NBC-101, ANC- 101, TPS -ACETATATE, DTS -ACETATE, DI -BOC BISPHINOL A, TERT -BUTYL Lithocholate, Tert -Butyl Deoxycholate, Tert -Butyl Cholate, BX , BC -2, MPI -103, BDS -105, TPS -103, NAT -103, BMS-105, and TMS-105;
Cyracure UVI-6970, Cyracure UVI-6974, Cyracure UVI-6990, and Cyracure UVI-950 manufactured by Union Carbide, USA;
Irgacure 250, Irgacure 261 and Irgacure 264 from BASF;
CG-24-61 manufactured by Ciba-Geigy;
Adeka Optomer SP-150, Adeka Optomer SP-151, Adeka Optomer SP-170 and Adeka Optomer SP-171 manufactured by ADEKA Corporation;
DAICAT II manufactured by Daicel Corporation;
UVAC1590 and UVAC1591 manufactured by Daicel Cytec Co., Ltd.;
CI-2064, CI-2639, CI-2624, CI-2481, CI-2734, CI-2855, CI-2823, CI-2758, and CIT-1682 manufactured by Nippon Soda Co., Ltd.;
PI-2074, a tetrakis(pentafluorophenyl)borate toluyl cumyl iodonium salt from Rhodia;
FFC509 manufactured by 3M;
CD-1010, CD-1011 and CD-1012 manufactured by Sartomer, USA;
CPI-100P, CPI-101A, CPI-110P, CPI-110A and CPI-210S from Sun-Apro Corporation; and UVI-6992 and UVI-6976 from The Dow Chemical Company. The photocationic polymerization initiator (B2) can contain at least one compound selected from the group consisting of these compounds.

The ratio of the cationic photopolymerization initiator (B2) to the cationic polymerizable compound (W) is preferably within the range of 1 to 4% by mass. When this proportion is 1% by mass or more, the composition (X) can have particularly good cationic polymerization reactivity. In addition, when this ratio is 4% by mass or less, the composition (X) can have good storage stability, and since it does not contain an excessive amount of the photocationic polymerization initiator (B2), the production cost can be reduced. is possible.

The resin composition (X) may contain a moisture absorbent (E). The hygroscopic agent (E) can impart hygroscopicity to the cured product of the resin composition (X). The hygroscopic agent (E) is preferably hygroscopic inorganic particles. The moisture absorbent (E) can contain, for example, one or more components selected from the group consisting of zeolite particles, silica gel particles, calcium chloride particles and titanium oxide nanotube particles. The moisture absorbent (E) preferably contains zeolite particles, particularly preferably zeolite particles having an average particle size of 200 nm or less.

The zeolite particles preferably contain sodium ions. For this purpose, the zeolite particles are preferably produced from zeolite containing sodium ions, and among zeolites containing sodium ions, at least one selected from the group consisting of A-type zeolite, X-type zeolite and Y-type zeolite more preferably manufactured from a material of It is particularly preferred that the zeolite particles are produced from 4A-type zeolite among A-type zeolites. In these cases, the zeolite particles have a crystal structure suitable for moisture adsorption.

The pH of the zeolite particles is preferably 7 or more and 10 or less. In this case, the crystals of the zeolite particles are less likely to be destroyed, and the zeolite particles are less likely to inhibit curing when the composition (X) is cured. The pH of the zeolite particles was obtained by adding 0.05 g of the zeolite particles to 99.95 g of ion-exchanged water, heating the resulting dispersion at 90° C. for 24 hours, and measuring the pH of the supernatant of the dispersion with a pH measuring instrument. It is a value obtained by measuring with As a pH measuring device, for example, a compact pH meter <LAQUAtwin> B-711 manufactured by Horiba, Ltd. can be used. In order for the pH of the zeolite particles to be 7 or more and 10 or less, the zeolite particles are preferably made of FAU Y-type zeolite having protons as counter cations.

The average particle diameter of the moisture absorbent (E) is preferably 10 nm or more and 200 nm or less. If this average particle diameter is 200 nm or less, the cured product can have particularly high transparency. Also, if the average particle size is 10 nm or more, the moisture absorbent (E) can maintain good moisture absorption. The average particle diameter is the median diameter calculated from the measurement result by the dynamic light scattering method, that is, the cumulative 50% diameter (D50). As a measuring device, Nanotrac Wave series manufactured by Microtrac Bell Co., Ltd. can be used. The average particle diameter of the moisture absorbent (E) is preferably 150 nm or less, more preferably 100 nm or less, and particularly preferably 70 nm or less. Also, the average particle size of the moisture absorbent (E) is preferably 20 nm or more, more preferably 50 nm or more. In this case, the cured product can have particularly good transparency and hygroscopicity.

It is also preferable that the cumulative 90% diameter (D90) of the moisture absorbent (E) is 100 nm or less. In this case, the cured product can have particularly high transparency.

The ratio of the moisture absorbent (E) to the total amount of the composition (X) is preferably 1% by mass or more and 20% by mass or less. If the proportion of the hygroscopic agent (E) is 1% by mass or more, the cured product can have particularly high hygroscopicity. In addition, if the proportion of the moisture absorbent (E) is 20% by mass or less, the viscosity of the composition (X) can be particularly reduced, and the composition (X) must have a sufficiently low viscosity to the extent that it can be applied by an inkjet method. can also The proportion of the moisture absorbent (E) is more preferably 3% by mass or more, and particularly preferably 5% by mass or more. Moreover, the proportion of the moisture absorbent (E) is more preferably 15% by mass or less, and particularly preferably 13% by mass or less.

When the resin composition (X) contains the moisture absorbent (E), the resin composition (X) may contain the dispersant (G). The dispersant (G) is a surfactant that can be adsorbed by the moisture absorbent (E). The dispersant (G) comprises, for example, an adsorptive group that can be adsorbed to the particles of the moisture absorbent (E), and a chain-like or comb-shaped molecule that is attached to the particles of the moisture absorbent (E) by the adsorption group being adsorbed to the particles of the moisture absorbent (E). It has a skeleton and a tail. The dispersant (G) includes, for example, an acrylic dispersant whose tail is an acrylic molecular chain, a urethane dispersant whose tail is a urethane molecular chain, and a polyester dispersant whose tail is a polyester molecular chain. It can contain one or more ingredients selected from the group consisting of agents. The dispersant (G) can satisfactorily disperse the moisture absorbent (E) in the resin composition (X) and in the cured product. Thereby, even if the cured product of the resin composition (X) contains the moisture absorbent (E), it is possible to prevent the transparency of the cured product from being lowered by the moisture absorbent (E). Further, the dispersant (G) can suppress aggregation of the moisture absorbent (E) during storage of the resin composition (X). Therefore, the storage stability of the resin composition (X) can be prevented from being lowered by the moisture absorbent (E). In addition, it is possible to prevent the dispersant (G) from lowering the adhesion between the cured product of the resin composition (X) and the member made of an inorganic material. It is believed that this is because the dispersant (G) is easily adsorbed by the moisture absorbent (E) and hardly affects the interface between the cured product and the member made of inorganic material. Therefore, when the resin composition (X) contains the dispersant (G), the encapsulant 5 can have high adhesion to the glass substrate. In addition, the adhesion between the inorganic material member and the sealing material 5 can be improved. The ratio of the dispersant (G) to 100 parts by mass of the moisture absorbent (E) is preferably 5% by mass or more and 60% by mass or less. If the amount of the dispersant (G) is 5% by mass or more, the advantage of the dispersant (G) can be particularly exhibited. If the amount of the dispersant (G) is 60% by mass or less, the adhesion between the cured product of the resin composition (X) and the member made of an inorganic material can be improved.

As described above, it is preferable that the composition (X) does not contain a solvent, or that the content of the solvent is 1% by mass or less. Therefore, outgassing is less likely to occur from the composition (X) and the cured product. In addition, the storage stability of composition (X) tends to be further enhanced.

Composition (X) can be prepared by mixing the above components. Composition (X) is preferably liquid at 25°C.

Specific examples of the present embodiment will be presented below. However, this embodiment is not limited only to the following examples.

1. Preparation of Composition A composition was prepared by mixing the components shown in the table below. The details of the components shown in the table are as follows.

The viscosity of each component below is a value measured using a rheometer (manufactured by Anton Paar Japan, Model No. DHR-2) under conditions of a temperature of 25° C. and a shear rate of 1000 s ⁻¹ . The relative permittivity of each component below was measured using a dielectric constant meter (manufactured by Nippon Luft Co., Ltd., model number MODEL871) at 25° C. and a frequency of 10 kHz.
-SR506NS: manufactured by Sartomer. isobornyl acrylate. Dielectric constant 4.7. Viscosity 8 mPa·s.
-SR423NS: manufactured by Sartomer. Isobornyl methacrylate. Dielectric constant 4.5. Viscosity 11 mPa·s.
-FA513AS: manufactured by Hitachi Chemical Co., Ltd. Dicyclopentanyl acrylate. Viscosity 13 mPa·s.
-FA513M: manufactured by Hitachi Chemical Co., Ltd. Dicyclopentanyl methacrylate. Dielectric constant 4.6. Viscosity 17 mPa·s.
-ADMA: manufactured by Osaka Organic Chemical Industry Co., Ltd. adamantyl acrylate. Dielectric constant 4.9. Viscosity 11 mPa·s.
-MADMA: manufactured by Osaka Organic Chemical Industry Co., Ltd. Adamantyl methacrylate. Dielectric constant 4.9. Viscosity 12mPa・s
- MA: methyl acrylate. Dielectric constant 6.1. Viscosity 5 mPa·s.
- BA: butyl acrylate. Dielectric constant of 5.1. Viscosity 4 mPa·s.
- LA: Lauryl acrylate. Dielectric constant 3.6. Viscosity 4 mPa·s.
- SR833S: tricyclodecanedimethanol diacrylate. Dielectric constant 5.6. Viscosity 130 mPa·s.
- PEGDMA: polyethylene glycol dimethacrylate. Dielectric constant 8.8. Viscosity 14 mPa·s.
- PEGDA: polyethylene glycol diacrylate. Dielectric constant 9.0. Viscosity of 20 mPa·s.
- A-HD-N: 1,6 hexanediol diacrylate. Dielectric constant 5.8. Viscosity 6 mPa·s.
- A-NOD-N: 1,9 nonanediol diacrylate. Dielectric constant of 5.3. Viscosity 8 mPa·s.
- A-DOD-N: 1,10 decanediol diacrylate. Dielectric constant of 5.1. Viscosity 9 mPa·s.
- SR295NS: pentaerythritol tetraacrylate. Dielectric constant 11.0. Viscosity 340 mPa·s.
- SR351S: trimethylolpropane triacrylate. Dielectric constant 8.5. Viscosity 100 mPa·s.
- TAIC: triallyl isocyanurate. Dielectric constant 2.7. Viscosity 100 mPa·s.
-ALEOX: 3-allyloxymethyl-3-ethyloxetane. Dielectric constant of 9.5. Viscosity 3 mPa·s.
-Celoxide 8010: (3,3',4,4'-diepoxy)bicyclohexyl manufactured by Daicel. Dielectric constant of 9.1. Viscosity 80 mPa·s.
- OXT221: manufactured by Toagosei Co., Ltd. 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane. Dielectric constant 8.9. Viscosity 10 mPa·s.
- OXT212: manufactured by Toagosei Co., Ltd. 2-ethylhexyloxetane. Dielectric constant 7.8. Viscosity 4 mPa·s.
-TEPIC-VL: manufactured by Nissan Chemical Co., Ltd. 1,3,5-tris(4,5-epoxypentyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione. Dielectric constant 4.7. Viscosity 7000mPa·s.
-CHDVE: 1,4-cyclohexanedimethanol divinyl ether. Dielectric constant 6.2. Viscosity 4.5 mPa·s.
- DEGDVE: diethylene glycol divinyl ether. Dielectric constant 7.2. Viscosity 2 mPa·s.
- TEGDVE: triethylene glycol divinyl ether. Dielectric constant 7.9. Viscosity 4 mPa·s.
-184: manufactured by BASF. Trade name Irgacure 184. 1-Hydroxy-cyclohexyl-phenyl-ketone.
-TPO: manufactured by BASF. Product name: Irgacure TPO. 2,4,6-trimethylbenzoyl-diphenylphosphine oxide.
-DTS-200: manufactured by Midori Chemical. Product number DTS-200. _{C6H5 - SC6H4 - S} +( _C6H5 ) _2.B ( _C6F5 ) _{4 .}

2. Evaluation Tests The following evaluation tests were conducted for Examples and Comparative Examples. The results are shown in the table.

(1) Viscosity The viscosity of the composition was measured using a rheometer (manufactured by Anton Paar Japan, Model No. DHR-2) under conditions of a temperature of 25° C. and a shear rate of 1000 s ⁻¹ .

(2) Glass transition temperature of cured product A coating film is prepared by applying the composition, and this coating film is irradiated in an air atmosphere using a UV irradiator (manufactured by Ushio Inc., model number E075IIHD, peak wavelength 395 nm). A film with a thickness of 100 μm was produced by photocuring the film by irradiating it with ultraviolet rays under the condition of 100 mW/cm ² .

Using a viscoelastic spectrometer "DMS6100" manufactured by Seiko Instruments Inc., the glass transition temperature of the film obtained above was measured. At this time, dynamic viscoelasticity measurement (DMA) is performed with a tensile module at a frequency of 10 Hz, and the temperature at which tan δ when the temperature is raised from room temperature to 200 ° C. at a temperature increase rate of 5 ° C./min is the glass transition temperature. temperature.

(3) Inkjet property The composition was placed in a cartridge of an inkjet printer (manufactured by Ricoh Co., Ltd., model number MH2420), and it was confirmed that the composition in the cartridge could be ejected from the nozzle of the inkjet printer.

A silicon nitride film was formed on a glass plate as a substrate by plasma CVD, and the silicon nitride film was subjected to oxygen plasma treatment. Subsequently, a test pattern was continuously printed by ejecting the composition from a nozzle of an inkjet printer toward the silicon nitride film. Visually observe the coating film of the composition, "A" when the coating film is smooth, "B" when unevenness is observed in part of the coating film, "C" when unevenness is observed throughout the coating film ”, evaluated. It can be judged that the smaller the unevenness of the coating film, the less the disturbance of the trajectory of the droplets of the composition discharged from the nozzle.

(4) Relative permittivity of composition The relative permittivity of the composition was measured using a permittivity meter (Nippon Luft Co., Ltd., model number MODEL871) under conditions of a temperature of 25°C and a frequency of 10 kHz.

(5) Dielectric Constant of Cured Product The composition was applied onto an aluminum substrate having dimensions of 80 mm×40 mm×1 mmt to prepare a coating film having a thickness of 10 μm. This coating film is irradiated with UV rays for 15 seconds under the conditions of 100 mW/cm ² using a UV irradiator (manufactured by Ushio Inc., model number E075IIHD, peak wavelength 395 nm) in an air atmosphere to cure the film. made. The dielectric constant of this film was measured by an electrode contact method using an LCR meter (manufactured by Agilent, product number E4980A) and a jig (16034 test fixture) under conditions of a temperature of 25° C. and a frequency of 100 kHz.

1 light emitting device 10 touch sensor 100 touch panel

Claims (11)

Containing a photopolymerizable compound (A) and a photopolymerization initiator (B),
The photopolymerizable compound (A) has a dielectric constant of 8.0 or less at 25° C. and a frequency of 10 kHz, and a viscosity of 50 mPa s or less at 25° C.,
For producing optical parts that are molded by the inkjet method and transmit the light emitted by the light source,
UV curable resin composition. The photopolymerizable compound (A) contains at least one of a radically polymerizable compound and a cationically polymerizable compound,
The ultraviolet curable resin composition according to claim 1. The photopolymerizable compound (A) includes isobornyl acrylate, isobornyl methacrylate, dicyclopentanyl acrylate, dicyclopentanyl methacrylate, adamantyl acrylate, adamantyl methacrylate, methyl acrylate, butyl acrylate, lauryl acrylate, polyethylene glycol di methacrylate, polyethylene glycol diacrylate, 1,6 hexanediol diacrylate, 1,9 nonanediol diacrylate, 1,10 decanediol diacrylate, 3-allyloxymethyl-3-ethyloxetane, 3-ethyl-3 {[( At least one selected from the group consisting of 3-ethyloxetan-3-yl)methoxy]methyl}oxetane, 2-ethylhexyloxetane, 1,4-cyclohexanedimethanol divinyl ether, diethylene glycol divinyl ether, and triethylene glycol divinyl ether containing a compound
The ultraviolet curable resin composition according to claim 1 or 2. The photopolymerizable compound (A) is a component (P ),
The ratio of the component (P) to the photopolymerizable compound (A) is 50% by mass or more.
The ultraviolet curable resin composition according to any one of claims 1 to 3. Component (P) includes isobornyl acrylate, isobornyl methacrylate, dicyclopentanyl acrylate, dicyclopentanyl methacrylate, adamantyl acrylate, adamantyl methacrylate, methyl acrylate, butyl acrylate, lauryl acrylate, and 1,6-hexanediol. containing at least one compound selected from the group consisting of diacrylate, 1,9-nonanediol diacrylate, 1,10-decanediol diacrylate and 1,4-cyclohexanedimethanol divinyl ether;
The ultraviolet curable resin composition according to claim 4. The ratio of the compound having a dielectric constant of more than 7.0 at 25° C. and a frequency of 10 kHz in the photopolymerizable compound (A) is 0% by mass or more and 13% by mass or less. is
The ultraviolet curable resin composition according to any one of claims 1 to 5. At least one of the viscosity at 25 ° C. and the viscosity at 40 ° C. is 40 mPa s or less,
The ultraviolet curable resin composition according to any one of claims 1 to 6. Does not contain a solvent, or has a solvent content of 1% by mass or less,
The ultraviolet curable resin composition according to any one of claims 1 to 7. A method for manufacturing a light-emitting device comprising a light source and an optical component for transmitting light emitted by the light source,
Forming a coating film by molding the ultraviolet curable resin composition according to any one of claims 1 to 8 by an inkjet method,
Producing the optical component by irradiating the coating film with ultraviolet light,
A method for manufacturing a light-emitting device. A light source and an optical component that transmits light emitted by the light source, wherein the optical component is made of a cured product of the ultraviolet curable resin composition according to any one of claims 1 to 8 .
Luminescent device. A light emitting device according to claim 10 and a touch sensor,
touch panel.

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