JP7386742B2 - exposure equipment - Google Patents

Description

The present invention relates to an exposure apparatus.

2. Description of the Related Art Conventionally, an exposure apparatus has been used to expose a pattern onto a base material such as a printed circuit board. In the exposure apparatus, the position on the base material at which the pattern is exposed is determined based on reference marks (alignment marks) formed on the base material in advance. Furthermore, Patent Document 1 discloses an exposure drawing apparatus that includes a mark forming section that forms alignment marks on both main surfaces of a substrate, and a drawing section that draws a circuit pattern on the substrate based on the alignment marks. . In this apparatus, the circuit patterns on both main surfaces are drawn in accurate correspondence using alignment marks on both main surfaces.

Note that Patent Document 2 discloses a pattern forming apparatus that transfers a pattern carried on one main surface of a transparent flat plate onto a substrate. This device is provided with a holding stage that holds the flat plate by vacuum suction while contacting the other main surface of the flat plate. A light guide hole is formed in the holding stage, and a transparent window member is provided inside the light guide hole. In the imaging section, the flat plate is imaged through the window member in order to align the flat plate and the substrate. Further, the air pressure in the gap space surrounded by the other main surface of the flat plate, the surface of the window member, and the side wall surface of the light guide hole is increased. This prevents the flat plate from being bent into the gap space.

Japanese Patent Application Publication No. 2008-292915 Patent No. 5793410

By the way, in an exposure apparatus that holds a base material on a holding plate, when exposing a pattern on the first main surface of the base material, a reference mark is formed on the second main surface that contacts the holding plate, and then the base material It is conceivable to expose a pattern on the second main surface in accordance with the position of the pattern on the first main surface by inverting the reference mark and referring to the reference mark. In this case, an opening for forming a reference mark is provided in the holding plate, and a mark forming section, which is an optical unit, is arranged at a position facing the base material through the opening.

However, in such an exposure apparatus, there is a possibility that unnecessary objects such as dust may enter the opening and adhere to the surface of the light-transmitting member disposed closest to the holding plate in the mark forming section. If unnecessary matter adheres to the light-transmitting member, it becomes impossible to appropriately form the reference mark. In addition, a mark imaging section, which is another optical unit, is arranged in place of the mark forming section, and while the reference mark on the main surface on the holding plate side is imaged by the mark imaging section, a pattern is exposed on the main surface on the opposite side. Similar problems arise in devices.

The present invention has been made in view of the above problems, and an object of the present invention is to suppress the attachment of unnecessary substances to the surface of a light-transmitting member in an optical unit.

The invention according to claim 1 is an exposure apparatus, comprising: an exposure section that exposes a pattern to a plate-like or film-like base material; and a holding plate that contacts one main surface of the base material; By irradiating light onto the main surface of the base material through a table that holds the base material and an opening provided in the holding plate, a reference mark to be referred to during pattern exposure by the exposure section is set on the main surface. an optical unit that images a reference mark formed on a surface or on the main surface of the base material through the opening; a light-transmitting member disposed closest to the holding plate in the optical unit; a gas supply section that supplies a predetermined gas between the light transmitting member and the holding plate, the gas supplied by the gas supply section flowing across the opening between the transparent member and the holding plate; .

The invention according to claim 2 is the exposure apparatus according to claim 1, in which the gas extends between the light-transmitting member and the holding plate in one direction along the holding plate, and the gas flows. A gas flow path is provided.

The invention according to claim 3 is the exposure apparatus according to claim 2, in which the flow area of the gas flow path is smaller than the area of the opening.

The invention according to claim 4 is the exposure apparatus according to any one of claims 1 to 3, wherein the holding plate attracts the substrate through a plurality of suction ports connected to a negative pressure space. The gas that has crossed the opening flows into the negative pressure space.

The invention according to claim 5 is the exposure apparatus according to any one of claims 1 to 4, wherein the optical unit includes a mark forming section that forms the reference mark on the main surface of the base material. When the exposure section exposes a pattern on the other main surface of the base material held on the table, the optical unit forms the reference mark on the main surface, and the exposure section , the reference mark is referred to when exposing a pattern on the main surface.

The invention according to claim 6 is an exposure apparatus according to any one of claims 1 to 5, which has the same configuration as the optical unit and has another opening provided in the holding plate. further comprising another optical unit for forming a reference mark on the substrate or imaging a reference mark on the substrate, the optical unit being used for one type of substrate and for another type of substrate. The other optical unit is used for the material.

The invention according to claim 7 is an exposure apparatus, comprising: an exposure section that exposes a pattern to a plate-like or film-like base material; and a holding plate that contacts one main surface of the base material; By irradiating light onto the main surface of the base material through a table that holds the base material and an opening provided in the holding plate, a reference mark to be referred to during pattern exposure by the exposure section is set on the main surface. A positive pressure is created inside the opening by supplying a predetermined gas between an optical unit formed on a surface, a light-transmitting member disposed closest to the holding plate in the optical unit, and the holding plate. and a gas supply section.

According to the present invention, it is possible to prevent unnecessary substances from adhering to the surface of the light-transmitting member in the optical unit.

FIG. 2 is a diagram showing the configuration of an exposure apparatus. It is a top view showing a table unit. It is a figure showing the inside of a table unit. It is a sectional view of a table unit. It is a sectional view of a table unit. It is an enlarged view showing the vicinity of the annular lid part. It is a figure showing the flow of operation of exposing a pattern to a base material. It is a figure which shows the base material on a table unit. It is a figure which shows the base material on a table unit. FIG. 7 is a diagram showing a table unit in another example of the exposure apparatus. It is a figure which shows the base material on a table unit. It is a figure which shows the base material on a table unit.

FIG. 1 is a diagram showing the configuration of an exposure apparatus 1 according to one embodiment of the present invention. In FIG. 1, three mutually orthogonal directions are indicated by arrows as an X direction, a Y direction, and a Z direction (the same applies to other figures). In the example of FIG. 1, the X and Y directions are horizontal, and the Z direction is vertical. In the following description, the Z direction will be referred to as a "vertical direction," but depending on the design of the exposure apparatus 1, the Z direction may be a direction inclined with respect to the vertical direction.

The exposure device 1 is a direct drawing device that irradiates a photosensitive material on a base material 9 with light to draw patterns such as wiring on the photosensitive material. The base material 9 is a printed circuit board or the like, and has a plate shape, for example. The exposure apparatus 1 includes a control section 2, an exposure section 3, a table unit 4, a table lifting mechanism 61, and a table moving mechanism 62. The control unit 2 is, for example, a computer having a CPU or the like. The control section 2 controls the exposure section 3, the table unit 4, the table lifting mechanism 61, and the table moving mechanism 62. The table unit 4 holds the base material 9 below the exposure section 3 ((-Z) side). Details of the table unit 4 will be described later.

The exposure section 3 includes a plurality of drawing heads 31 and a plurality of imaging sections 36. The plurality of drawing heads 31 and the plurality of imaging sections 36 are supported by a support section (not shown) and are arranged above the table unit 4 (on the (+Z) side). The plurality of drawing heads 31 are arranged in the X direction (hereinafter referred to as the "width direction"). Each drawing head 31 includes a light source 32 and a light modulation section 33. The light source 32 includes, for example, a semiconductor laser, a solid laser, a gas laser, or the like, and emits laser light toward the light modulation section 33 . The light modulator 33 modulates the light from the light source 32. The light modulated by the light modulation section 33 is irradiated onto an upwardly facing main surface 91 (hereinafter referred to as "first main surface 91") of the base material 9 held by the table unit 4. As the light modulation section 33, for example, a DMD (digital mirror device) in which a plurality of light modulation elements are two-dimensionally arranged is used. The light modulation section 33 may be a modulator or the like in which a plurality of light modulation elements are arranged one-dimensionally.

The plurality of imaging units 36 are arranged in the width direction on the (-Y) side of the drawing head 31. In the example of FIG. 1, two imaging units 36 are provided. Each imaging section 36 is supported by the support section via an imaging section moving mechanism 37. The imaging unit 36 can be moved in the width direction by the imaging unit moving mechanism 37. In the exposure operation described below, reference marks 921 (see FIG. 9), which are alignment marks, are formed on each side (ends in the width direction) of the base material 9. The two imaging units 36 are arranged at the same positions as the reference marks 921 on both sides of the base material 9 in the width direction, and the reference marks 921 are imaged by the imaging units 36 .

The table elevating mechanism 61 includes a motor, a cylinder, or the like, and moves the table unit 4 in the Z direction (that is, in the vertical direction). The table moving mechanism 62 includes a guide rail, a guide block, a motor (for example, a linear motor), a linear scale, and the like. The table moving mechanism 62 moves the table unit 4 together with the table lifting mechanism 61 in the Y direction (hereinafter referred to as the "moving direction"). Thereby, on the first main surface 91 of the base material 9 held by the table unit 4, the irradiation position of the light from the plurality of drawing heads 31 scans in the movement direction. In the exposure apparatus 1 , a pattern is drawn (exposed) on the first main surface 91 of the base material 9 by controlling each drawing head 31 in synchronization with the movement of the table unit 4 by the table moving mechanism 62 . In the exposure apparatus 1, the table elevating mechanism 61 may be omitted, and a rotation mechanism that rotates the table unit 4 about an axis parallel to the Z direction may be provided.

FIG. 2 is a plan view showing a part of the table unit 4. As shown in FIG. The table unit 4 includes a table 41 and a plurality of mark forming sections 5. The table 41 includes a table main body 42 and a holding plate 43. The table main body 42 has a substantially plate shape in which a negative pressure space 421 (see FIG. 5), which will be described later, is formed inside. The plurality of mark forming parts 5 are held by the table main body 42 and covered by a holding plate 43. In the example of FIG. 2, a plurality of mark forming parts 5 are arranged along the width direction (X direction) at the (+Y) side end of the table main body 42.

Specifically, a pair of mark forming parts 5 are arranged at positions spaced apart by the same distance on both sides from the center of the table 41 in the width direction, and another pair of mark forming parts 5 are arranged at positions spaced apart by a distance different from the said distance. 5 is placed. In the table unit 4 of FIG. 2, a plurality of pairs of mark forming sections 5 are provided. The plurality of mark forming parts 5 may be provided at the (-Y) side end of the table main body 42. Details of the internal structure of the table body 42 and the configuration of the mark forming section 5 will be described later.

The holding plate 43 has a thin plate shape, and is made of metal such as aluminum, for example. The holding plate 43 is placed on the upper surface of the table body 42. Approximately the entire table body 42 is covered by the holding plate 43. A plurality of (many) suction ports 431 are uniformly provided throughout the holding plate 43 . The plurality of suction ports 431 are connected to the negative pressure space 421. When exposing a pattern to the first main surface 91 of the base material 9 , the second main surface 92 (see FIG. 1 ) of the base material 9 on the opposite side to the first main surface 91 comes into contact with the holding plate 43 . The second main surface 92 is sucked by the plurality of suction ports 431 . In this way, the holding plate 43 is a suction plate that suctions and holds the base material 9 using the plurality of suction ports 431.

FIG. 3 is an enlarged view of the area A1 surrounded by the broken line in FIG. 2, and shows the inside of the table unit 4 with the holding plate 43 removed. 4 is a cross-sectional view of the table unit 4 at the position IV-IV in FIG. 3, and FIG. 5 is a cross-sectional view of the table unit 4 at the position V-V in FIG.

A negative pressure space 421 is formed in the table main body 42 shown in FIG. The negative pressure space 421 is a recess that is depressed downward on the upper (+Z side) surface of the table main body 42 . The negative pressure space 421 is connected to a pressure reduction mechanism having a pump or the like, and the pressure of the negative pressure space 421 is reduced. Thereby, the base material 9 placed on the holding plate 43 is sucked and held through the plurality of suction ports 431. In one example, the table body 42 is provided with a plurality of mutually independent negative pressure spaces 421, and the negative pressure spaces 421 are actually depressurized depending on the size of the base material 9 placed on the holding plate 43. is selected. Further, a plurality of holding holes 422 are formed in the table main body 42, passing through the table body 42 in the vertical direction. Each mark forming part 5 has a substantially cylindrical shape, and is inserted into the holding hole 422 and fixed to the table main body 42. In the example of FIG. 3, a plurality of protrusions 423 are provided that protrude from the bottom surface of the negative pressure space 421, and the upper part of the mark forming section 5 is supported by the protrusions 423.

The plurality of mark forming units 5 are optical units for forming reference marks 921, and have the same configuration. As shown in FIGS. 4 and 5, each mark forming section 5 includes a light source 51, an illumination optical system 52, a mask 53, a projection optical system 54, and a lens barrel 55. The lens barrel 55 has a substantially cylindrical shape with a bottom, and houses the light source 51, the illumination optical system 52, the mask 53, and the projection optical system 54. A light source 51 is attached to the bottom 551 of the lens barrel 55 . Inside the lens barrel 55, a light source 51, an illumination optical system 52, a mask 53, and a projection optical system 54 are arranged along the optical axis J1 in order from the bottom 551 toward the holding plate 43 side. The light source 51 is, for example, a semiconductor laser and emits laser light. The light source 51 may be an LED or the like other than a semiconductor laser. The wavelength band of the light emitted by the light source 51 is, for example, approximately the same as the wavelength band of the light emitted by the light source 32 of the drawing head 31, and in this embodiment, the light emitted by the light source 51 and the light source 32 is ultraviolet light. . The illumination optical system 52 irradiates the mask 53 with light from the light source 51.

A predetermined pattern is formed on the mask 53 using a material that blocks the light. The projection optical system 54 guides the light that has passed through the mask 53 toward the holding plate 43 along the optical axis J1. In the holding plate 43, an opening 432 (hereinafter referred to as "plate opening 432") is provided at a position intersecting the optical axis J1. The light from the mask 53 is irradiated onto the second main surface 92 of the base material 9 through the plate opening 432. Actually, an image of the mask 53 is formed on the second principal surface 92 by the projection optical system 54. In FIGS. 4 and 5, the base material 9 is indicated by a two-dot chain line.

In this embodiment, the lens barrel 55 is separable into a plurality of parts, and the part closest to the holding plate 43 is an annular lid part 56 having a substantially annular shape centered on the optical axis J1. FIG. 6 is an enlarged view showing the vicinity of the annular lid portion 56 in FIG. 4. As shown in FIG.

The annular lid portion 56 includes a lid main body 57 and a central annular portion 58. The lid main body 57 has a substantially annular shape centered on the optical axis J1. In the lid main body 57, the inner diameter of the upper portion is larger than that of the lower portion. That is, the lid body 57 is provided with a large diameter hole 571 located on the upper side and a small diameter hole 572 located on the lower side, and the diameter of the large diameter hole 571 is larger than the diameter of the small diameter hole 572.

As shown in FIGS. 3 and 5, two arcuate projections 573 projecting upward are provided around the large diameter hole 571 on the upper surface of the lid main body 57. The two arc-shaped protrusions 573 are arc-shaped with the optical axis J1 as the center and have the same radius, and the angle of the arc is smaller than 180 degrees. The two arcuate protrusions 573 are symmetrical with respect to a plane that is perpendicular to the X direction and includes the optical axis J1. The upper ends of the two arcuate protrusions 573 contact the lower surface of the holding plate 43. As shown in FIG. 3, a gap 574 is provided between the two ends of the two arcuate protrusions 573 on the (+Y) side and between the two ends on the (-Y) side. It will be done. Further, on the upper surface of the lid main body 57, an annular region around the two arcuate protrusions 573 is slightly separated from the lower surface of the holding plate 43, as shown in FIG. The space between the annular region and the lower surface of the holding plate 43 is directly connected to the negative pressure space 421 .

In the projection optical system 54 shown in FIG. 6, a lens 541 disposed closest to the holding plate 43 (hereinafter referred to as "outermost lens 541") is disposed within a large diameter hole 571. The outermost lens 541 is a light-transmitting member disposed closest to the holding plate 43 in the mark forming section 5 . The outer peripheral portion of the lower surface of the outermost lens 541 contacts the upper edge of the small diameter hole portion 572 .

The central annular portion 58 has a substantially annular shape centered on the optical axis J1, and is inserted into the large diameter hole portion 571. In the central annular portion 58, the inner diameter of the upper portion is smaller than that of the lower portion. That is, the central annular portion 58 is provided with a small diameter hole 581 located on the upper side and a large diameter hole 582 located on the lower side, and the diameter of the small diameter hole 581 is smaller than the diameter of the large diameter hole 582. The small diameter hole portion 581 faces the plate opening 432 of the holding plate 43 in the vertical direction. The outer peripheral portion of the upper surface of the outermost lens 541 expands outward in the radial direction (radial direction centered on the optical axis J1) from the lower end of the small diameter hole portion 581 to the upper end of the large diameter hole portion 582 in the central annular portion 58. It comes into contact with a substantially annular surface. As a result, the outermost lens 541 is held between the lid main body 57 and the central annular portion 58 in the vertical direction.

As shown in FIG. 3, a groove portion 583 is provided on the upper surface of the central annular portion 58 and extends throughout the Y direction. A portion of the groove portion 583 overlaps with the small diameter hole portion 581. For example, the depth of the groove portion 583 is smaller than the depth of the small diameter hole portion 581 in the vertical direction. Further, the width of the groove portion 583 in the X direction is smaller than the diameter of the small diameter hole portion 581. Both ends of the groove 583 in the longitudinal direction are connected to two gaps 574 provided between the two arcuate protrusions 573, respectively. The width of the gap 574 in the X direction is preferably larger than the width of the groove 583.

The area on the upper surface of the central annular portion 58 excluding the groove portion 583 and the small diameter hole portion 581 is close to the lower surface of the holding plate 43 . In other words, the upper part of the groove 583 is approximately closed by the holding plate 43 except for the position facing the plate opening 432. As will be described later, a predetermined gas is supplied to the groove 583, and the gas flows along the groove 583. In this way, a gas flow path defined by the groove 583 of the central annular portion 58 is provided between the outermost lens 541 and the holding plate 43. In this embodiment, the flow area of the gas flow path (the cross-sectional area perpendicular to the longitudinal direction of the groove portion 583) is smaller than the opening area of the plate opening 432. Note that on the upper surface of the central annular portion 58, the gas flow path may extend in a direction other than the Y direction.

As shown in FIG. 3, a communication hole 584 extending in the vertical direction is provided in the bottom surface of the groove portion 583. As shown in FIG. 6, an annular space 585 is formed between the outer circumference of the outermost lens 541 and the inner circumferential surface of the large diameter hole portion 582, and the communication hole 584 is connected to the annular space 585. Furthermore, a communication hole 576 is provided on the outer circumferential surface of the lid body 57 and extends horizontally toward the optical axis J1. The communication hole 576 connects to the inner peripheral surface of the small diameter hole portion 572. In the lid main body 57, a communication hole 577 extending downward is provided in a substantially annular surface that expands radially inward from the lower end of the large diameter hole 571 to the upper end of the small diameter hole 572. Both ends of the communication hole 577 are connected to the annular space 585 and the communication hole 576. A communicating hole 552 connected to a communicating hole 576 is provided in the lens barrel 55 . As shown in FIG. 4, the table body 42 is provided with a communication hole 424 that connects to the communication hole 552. As shown in FIG.

The exposure apparatus 1 further includes a gas supply section 71. The gas supply section 71 includes a pump and the like, and supplies a predetermined clean gas (hereinafter referred to as "clean gas") to the communication hole 424 of the table body 42. The clean gas is, for example, clean air that has passed through a filter or the like. The clean gas may be a gas other than air that does not contain unnecessary substances. In this embodiment, the gas supply unit 71 supplies clean gas to the communication hole 424 at a constant flow rate. The flow rate of the clean gas may be varied as necessary. The clean gas supplied to the communication hole 424 fills the annular space 585 through the communication holes 552, 576, and 577 in FIG. 6, and is further supplied to the groove 583 through the communication hole 584. The clean gas flows along the groove 583 from the communication hole 584 toward both ends of the groove 583 .

When the holding plate 43 does not hold the base material 9, a part of the clean gas flowing from the communication hole 584 toward the optical axis J1 in the groove 583 is discharged (spouted) to the outside from the plate opening 432 of the holding plate 43. be done. In other words, the inside of the plate opening 432 has a positive pressure higher than atmospheric pressure. This prevents or suppresses unnecessary objects from entering the plate opening 432 from the upper surface side of the holding plate 43. The remainder of the clean gas passes between the small diameter hole 581 of the central annular portion 58 and the plate opening 432, that is, crosses the plate opening 432 on the lower side of the holding plate 43. Therefore, even if unnecessary materials enter the plate opening 432, the unnecessary materials are swept away along the groove portion 583 together with the clean gas that crosses the plate opening 432.

The clean gas that has crossed the plate opening 432 reaches the space between the upper surface of the lid main body 57 and the holding plate 43 through one gap 574 between the arcuate protrusions 573, and is discharged into the negative pressure space 421. be done. In addition, the clean gas flowing from the communication hole 584 in the groove 583 toward the side opposite to the optical axis J1 is transmitted to the other gap 574 between the arcuate protrusions 573 and between the lid main body 57 and the holding plate 43. It passes through the space and is discharged to the negative pressure space 421.

When the holding plate 43 holds the base material 9, the plate opening 432 is closed by the base material 9, so that almost all of the clean gas flowing from the communication hole 584 toward the optical axis J1 in the groove portion 583 is , across plate opening 432. The clean gas passes through one gap 574 between the arcuate protrusions 573 and the upper surface of the lid main body 57, and is discharged into the negative pressure space 421. By providing the clean gas discharge path in this way, excessively high pressure is prevented inside the plate opening 432, and lifting of the base material 9 on the holding plate 43 is prevented or suppressed. . In other words, the table 41 is provided with a structure that releases the pressure of the clean gas supplied between the mark forming section 5 and the holding plate 43, thereby preventing the flatness of the base material 9 from decreasing during pattern exposure. or suppressed. The clean gas flowing from the communicating hole 584 toward the side opposite to the optical axis J1 within the groove portion 583 is the same as when the holding plate 43 does not hold the base material 9.

In reality, if the cross-sectional area of the groove 583 serving as the gas flow path is too small with respect to the opening area of the plate opening 432, the base material 9 will be easily lifted. Furthermore, if the cross-sectional area of the groove 583 is excessively large compared to the opening area of the plate opening 432, the pressure inside the plate opening 432 will be low, and unnecessary objects will easily enter the plate opening 432, or In order to maintain a predetermined positive pressure inside the device, it becomes necessary to supply a large amount of clean gas. Therefore, it is preferable that the ratio between the opening area of the plate opening 432 and the cross-sectional area of the groove portion 583 be determined in consideration of the above. In one example, the ratio is 1:0.8.

FIG. 7 is a diagram showing the flow of operations in which the exposure apparatus 1 exposes a pattern onto the base material 9. As shown in FIG. When the exposure apparatus 1 of FIG. 1 exposes a pattern on the substrate 9, first, the table 41 is placed at a position on the (-Y) side of the exposure section 3 (hereinafter referred to as the "transfer position"). The base material 9 is placed and held thereon by an external transport mechanism (step S11). At this time, the position of the base material 9 with respect to the holding plate 43 is adjusted to some extent by using a backing plate 49 provided on the holding plate 43 shown in FIG. 2 and the like. Here, it is assumed that the second main surface 92 of the base material 9 contacts the holding plate 43 and the first main surface 91 faces the exposure section 3. Note that in the base material 9, a photosensitive material is provided on both the first main surface 91 and the second main surface 92.

Subsequently, the table moving mechanism 62 of FIG. 1 starts to continuously move the table 41 in the moving direction. Further, the plurality of drawing heads 31 are controlled in synchronization with the movement of the table 41, and modulated light is emitted toward the first main surface 91 of the base material 9. Thereby, as shown in FIG. 8, a pattern 911 is exposed on the first main surface 91 of the base material 9 (step S12). In FIG. 8, for convenience of illustration, a pattern 911 and a reference mark 921, which will be described later, are schematically shown (the same applies to FIGS. 9, 11, and 12, which will be described later).

When the pattern 911 is exposed over approximately the entire first principal surface 91, the movement of the table 41 in the movement direction is stopped. Note that the exposure apparatus 1 is provided with a mechanism for moving the plurality of drawing heads 31 or the table 41 in the width direction, and each time the movement of the table 41 in the movement direction (main scanning) is completed, the plurality of drawing heads 31 or the table 41 are moved in the width direction. The pattern 911 may be exposed to the first main surface 91 by intermittently moving the table 41 in the width direction (sub-scanning).

Further, among the plurality of pairs of mark forming parts 5 shown in FIG. 2, a pair of mark forming parts 5 facing both sides (both ends in the width direction) of the base material 9 is selected. Then, in each of the pair of mark forming sections 5, an image of the mask 53 is formed at a position facing the plate opening 432 on the second main surface 92 by emitting laser light from the light source 51 (see FIG. 4). Ru. Thereby, as shown in FIG. 8, a pair of reference marks 921 are formed on the second main surface 92 (step S13).

In the exposure apparatus 1, the positions of the exposure section 3 and each mark forming section 5 are calibrated in advance, and on the base material 9 on the table 41, the pattern 911 on the first main surface 91 and the reference on the second main surface 92 are calibrated. The relative position (position in the X direction and Y direction) with respect to the mark 921 becomes a preset position. The formation of the reference mark 921 on the second main surface 92 is preferably performed in parallel to the exposure of the pattern 911 on the first main surface 91. If the position of the base material 9 on the table 41 is not moved between the exposure of the pattern 911 and the formation of the reference mark 921, the formation of the reference mark 921 may be performed before or after the exposure of the pattern 911. good.

When the exposure of the pattern 911 on the first main surface 91 and the formation of the reference mark 921 on the second main surface 92 are completed, the table 41 is placed at the transfer position, and the base material 9 is removed from the table 41 by an external transport mechanism. taken out. After the base material 9 is reversed by the transport mechanism, it is placed on the table 41 and held (step S14). As a result, as shown in FIG. 9, the first main surface 91 comes into contact with the holding plate 43, and the second main surface 92 faces the exposure section 3.

Subsequently, the table 41 is moved in the moving direction by the table moving mechanism 62, and the pair of reference marks 921 are arranged below the two imaging units 36. In FIG. 9, the imaging unit 36 is indicated by a two-dot chain line. The two imaging units 36 are arranged at the same position in the width direction as the pair of mark forming units 5 used in step S13, and each imaging unit 36 images the reference mark 921 on the second main surface 92. (Step S15). The control unit 2 obtains the position and inclination of the pair of reference marks 921 with respect to the table 41 based on the captured images of the two imaging units 36 . As a result, the position and inclination of the pattern 911 on the first main surface 91 with respect to the table 41 are acquired. Note that if the reference mark 921 formed on the photosensitive material of the second main surface 92 cannot be confirmed in the image captured by the imaging unit 36, even if the reference mark 921 is developed in step S14. good. Further, depending on the accuracy required to obtain the position of the pattern 911 on the first main surface 91, only one reference mark 921 may be used.

Thereafter, the plurality of drawing heads 31 are controlled while the table 41 is continuously moved in the movement direction, and a pattern is exposed on the second main surface 92 of the base material 9 (step S16). At this time, the drawing data used to expose the pattern is corrected in accordance with the position and inclination of the pattern 911 on the first principal surface 91. Thereby, the position and inclination of the pattern on the second main surface 92 are accurately aligned with the pattern 911 on the first main surface 91. When the exposure of the pattern on the second main surface 92 is completed, the table 41 is placed at the transfer position, and the base material 9 is taken out from the table 41 by an external transport mechanism (step S17). With the above operations, the pattern exposure operation by the exposure apparatus 1 is completed.

In the exposure apparatus 1, when exposing a pattern to another base material 9 having a different width in the width direction from the above-described base material 9, in step S13, the other pair of mark forming units 5 forms the reference mark 921. used for. The other pair of mark forming parts 5 face both sides of the other base material 9 on the table 41 . Then, in step S15, the reference mark 921 on the second main surface 92 is imaged by the two imaging sections 36 arranged at the same position in the width direction as the other pair of mark forming sections 5, and the reference mark 921 on the second main surface 92 is imaged. In exposing the pattern on the surface 92, alignment with the pattern 911 on the first main surface 91 is performed. In this way, by using one mark forming section 5 for one type of base material 9 and using another mark forming section 5 for another type of base material 9, the exposure apparatus 1 can , it is possible to expose patterns to various types of substrates 9.

As described above, in the exposure apparatus 1, the reference mark 921 is formed on the main surface of the base material 9 by irradiating light onto the main surface of the base material 9 through the plate opening 432 provided in the holding plate 43. A forming section 5 is provided. In the exposure operation in the exposure apparatus 1, when the exposure section 3 exposes a pattern on the first main surface 91 of the base material 9 held on the table 41, the mark forming section 5 creates a reference mark on the second main surface 92. 921 is formed. Further, when the exposure section 3 exposes a pattern on the second main surface 92, the reference mark 921 is referred to. This makes it possible to accurately align the position and inclination of the pattern on the second main surface 92 with the pattern 911 on the first main surface 91. Furthermore, it is also possible to efficiently form the reference mark 921.

Further, clean gas is supplied between the outermost lens 541 and the holding plate 43 by the gas supply section 71, and the clean gas flows across the plate opening 432 between the outermost lens 541 and the holding plate 43. . Thereby, it is possible to suppress unnecessary substances from adhering to the surface of the outermost lens 541 in the mark forming section 5. Furthermore, by creating a positive pressure inside the plate opening 432, it becomes difficult for unnecessary substances to enter into the plate opening 432, and it is possible to further suppress unnecessary substances from adhering to the surface of the outermost lens 541. When the base material 9 is held on the holding plate 43, the clean gas flows across the plate opening 432, that is, the clean gas is discharged from between the outermost lens 541 and the holding plate 43. This prevents excessively high pressure within the plate opening 432. As a result, the flatness of the base material 9 is prevented or suppressed from being lifted and the flatness of the base material 9 is prevented from being lowered, and it becomes possible to appropriately perform pattern exposure.

In the exposure apparatus 1, a gas flow path (groove portion 583) extending in one direction along the support plate 43 is provided between the outermost lens 541 and the holding plate 43, and clean gas flows through the gas flow path. In this way, by allowing the clean gas to flow through the dedicated gas flow path, the flow rate of the clean gas across the plate opening 432 can be easily increased compared to the case where no gas flow path is provided. As a result, attachment of unnecessary substances to the outermost lens 541 can be more reliably suppressed.

Furthermore, since the flow path area of the gas flow path is smaller than the area of the plate opening 432, a certain amount of clean gas is ejected from the plate opening 432, further preventing unnecessary substances from entering the plate opening 432. Can be suppressed. The clean gas that has crossed the plate opening 432 flows into the negative pressure space 421 of the table main body 42, so that the clean gas can be appropriately discharged.

FIG. 10 is a diagram showing another example of the exposure apparatus, and shows a table unit 4a. The table unit 4a in FIG. 10 differs from the table unit 4 in FIG. 2 in that a mark imaging section 5a is provided in place of the mark forming section 5. The other configuration of the exposure apparatus 1 having the table unit 4a is the same as that in FIG. 1, and the same components are given the same reference numerals.

The mark imaging section 5a is an optical unit for imaging the reference mark 921, and the light source 51 in the mark forming section 5 in FIG. 4 is replaced with an imaging element. Further, the mask 53 and the illumination optical system 52 are omitted, and the projection optical system 54 forms an image of the area facing the plate opening 432 on the main surface of the base material 9 on the imaging surface of the imaging element. The structure around the outermost lens 541 of the projection optical system 54, ie, the structure of the annular lid portion 56, is the same as that shown in FIG. Note that in the mark imaging section 5a, a light source for illumination (a light source in a wavelength band that does not expose the photosensitive material of the base material 9) may be provided as necessary.

In an example of an exposure operation in the exposure apparatus 1 having the table unit 4a, the exposure section 3 exposes a pattern 911 on the first main surface 91 of the base material 9, as shown in FIG. Further, a plurality of (two in FIG. 11) reference marks 921 are formed on the first main surface 91 by the exposure section 3. Subsequently, the base material 9 is turned over, and the first main surface 91 contacts the holding plate 43. At this time, as shown in FIG. 12, each reference mark 921 is arranged at a position facing the plate opening 432, and the reference mark 921 is imaged by the mark imaging section 5a. Note that in the table unit 4a, it is preferable that the plate opening 432 is made larger than that in the table unit 4, so that a wide imaging area by the mark imaging section 5a is secured on the base material 9.

The control unit 2 obtains the positions and inclinations of the plurality of reference marks 921 with respect to the table 41 based on the captured images of the plurality of mark imaging units 5a. As a result, the position and inclination of the pattern 911 on the first main surface 91 with respect to the table 41 are acquired. Thereafter, a pattern is exposed on the second main surface 92 of the base material 9. At this time, the drawing data used to expose the pattern is corrected in accordance with the position and inclination of the pattern 911 on the first principal surface 91. Thereby, the position and inclination of the pattern on the second main surface 92 are accurately aligned with the pattern 911 on the first main surface 91.

As described above, the exposure apparatus 1 is provided with the mark imaging section 5a that images the reference mark 921 formed on the main surface of the base material 9 through the plate opening 432. In the exposure operation in the exposure apparatus 1 , when the exposure unit 3 exposes a pattern to the first main surface 91 of the base material 9 held on the table 41 , the reference mark 921 is also formed on the first main surface 91 . Further, when the exposure section 3 exposes a pattern on the second main surface 92, the reference mark 921 is imaged by the mark imaging section 5a and is referred to when exposing the pattern. This makes it possible to accurately align the position and inclination of the pattern on the second main surface 92 with the pattern 911 on the first main surface 91.

Also, in the table unit 4a, the gas supply unit 71 supplies clean gas between the outermost lens 541 and the holding plate 43, and the clean gas is supplied to the plate opening between the outermost lens 541 and the holding plate 43. 432. Thereby, it is possible to suppress unnecessary substances from adhering to the surface of the outermost lens 541 in the mark imaging section 5a. Furthermore, by creating a positive pressure inside the plate opening 432, it becomes difficult for unnecessary substances to enter into the plate opening 432, and it is possible to further suppress unnecessary substances from adhering to the surface of the outermost lens 541.

The exposure apparatus 1 described above can be modified in various ways.

In the mark forming section 5 and mark imaging section 5a, which are optical units, another light-transmitting member such as a light-transmitting plate may be provided between the outermost lens 541 and the holding plate 43. In this case, clean gas is supplied between the light-transmitting member and the holding plate 43 in order to prevent unnecessary substances from adhering to the surface of the light-transmitting member. As described above, in the exposure apparatus 1, the gas supply section 71 supplies clean gas between the light-transmitting member disposed closest to the holding plate 43 in the optical unit and the holding plate 43, and the clean gas is supplied to the light-transmitting member. It is important that there is a positive pressure inside the plate opening 432 due to clean gas flowing across the plate opening 432 and/or between the member and the retaining plate 43.

In the annular lid portion 56 of FIG. 3, it is also possible to omit the groove portion 583 that forms the gas flow path. Even in this case, the clean gas supplied from the communication hole 584 to the upper surface of the central annular portion 58 spreads around the upper surface, so that the clean gas flows across the plate opening 432 and It becomes possible to create positive pressure inside.

When the table 41 holds the base material 9 by a method other than suction (for example, mechanical chuck), a dedicated exhaust flow path is provided in the table body 42, etc., into which the clean gas that has crossed the plate opening 432 flows. may be provided.

In the exposure apparatus 1, an optical unit is provided on the exposure table 41, which faces the exposure unit 3 with the substrate 9 in between. An optical unit may be provided on the table. In this case, while the base material 9 is held on the holding plate of the other table, the optical unit irradiates the main surface of the base material 9 with light through the plate opening of the holding plate, or The main surface is imaged.

In the mark forming section 5, a reference mark 921 is formed by irradiating light onto the second principal surface 92 provided with the photosensitive material, but a high-intensity laser beam is emitted from the mark forming section 5, The reference mark 921 may be formed by partially scraping the second main surface 92 on which no photosensitive material is provided.

The reference mark 921 imaged by the mark imaging unit 5a may be formed in another device. In this case, for example, when exposing a pattern on the first main surface 91, the reference mark 921 is imaged by the imaging section 36 that images the first main surface 91, and when exposing a pattern on the second main surface 92, , the reference mark 921 is imaged by the mark imaging unit 5a. This makes it possible to accurately align the position and inclination of the pattern on the second main surface 92 with the pattern 911 on the first main surface 91.

In the above embodiment, a case has been described in which the exposure device 1 is a direct drawing device, but the exposure section 3 of the exposure device 1 projects a pattern formed on a mask or the like onto a base material 9 to expose the pattern. It may be something.

In the exposure apparatus 1, the position of the table unit 4 may be fixed, and the exposure section 3 may move in the movement direction when exposing a pattern onto the base material 9.

The base material 9 on which the pattern is exposed may be a semiconductor substrate, a glass substrate, or the like in addition to a printed circuit board. Further, the base material 9 may be in the form of a film such as a flexible substrate.

The configurations of the above embodiment and each modification may be combined as appropriate unless mutually contradictory.

1 Exposure device 3 Exposure section 5 Mark forming section 5a Mark imaging section 9 Base material 41 Table 43 Holding plate 71 Gas supply section 91 First main surface 92 Second main surface 421 Negative pressure space 431 Suction port 432 Plate opening 541 Outermost lens 583 Groove 911 Pattern 921 Reference mark

Claims (7)

An exposure device,
an exposure section that exposes a pattern on a plate-like or film-like base material;
a table that holds the base material and has a holding plate that contacts one main surface of the base material;
forming a reference mark to be referred to in pattern exposure by the exposure unit on the main surface by irradiating the main surface of the base material with light through an opening provided in the holding plate; an optical unit that images a reference mark formed on the main surface of the base material through the aperture;
a gas supply unit that supplies a predetermined gas between a light-transmitting member disposed closest to the holding plate in the optical unit and the holding plate;
Equipped with
An exposure apparatus characterized in that the gas supplied by the gas supply section flows across the opening between the light-transmitting member and the holding plate. The exposure apparatus according to claim 1,
An exposure apparatus characterized in that a gas flow path is provided between the light-transmitting member and the holding plate, extending in one direction along the holding plate, and through which the gas flows. The exposure apparatus according to claim 2,
An exposure apparatus characterized in that a flow area of the gas flow path is smaller than an area of the opening. The exposure apparatus according to any one of claims 1 to 3,
The holding plate is a suction plate that suctions and holds the base material with a plurality of suction ports connected to a negative pressure space,
An exposure apparatus characterized in that the gas that has crossed the opening flows into the negative pressure space. The exposure apparatus according to any one of claims 1 to 4,
The optical unit is a mark forming section that forms the reference mark on the main surface of the base material,
When the exposure unit exposes a pattern on the other main surface of the base material held on the table, the optical unit forms the reference mark on the main surface,
An exposure apparatus characterized in that the exposure section refers to the reference mark when exposing a pattern on the main surface. The exposure apparatus according to any one of claims 1 to 5,
The apparatus further includes another optical unit having the same configuration as the optical unit and forming a reference mark on the base material through another opening provided in the holding plate or imaging the reference mark on the base material. ,
An exposure apparatus characterized in that the optical unit is used for one type of base material, and the other optical unit is used for another type of base material. An exposure device,
an exposure section that exposes a pattern on a plate-like or film-like base material;
a table that holds the base material and has a holding plate that contacts one main surface of the base material;
an optical unit that forms a reference mark on the main surface to be referenced in pattern exposure by the exposure unit by irradiating light onto the main surface of the base material through an opening provided in the holding plate;
a gas supply unit that supplies a predetermined gas between the light-transmitting member disposed closest to the holding plate in the optical unit and the holding plate to make the inside of the opening a positive pressure;
An exposure apparatus comprising:

Images