JP7262693B1 - ワーク検査装置 - Google Patents
ワーク検査装置 Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95692—Patterns showing hole parts, e.g. honeycomb filtering structures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/104—Mechano-optical scan, i.e. object and beam moving
- G01N2201/1042—X, Y scan, i.e. object moving in X, beam in Y
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/02—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
- G01N35/04—Details of the conveyor system
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Abstract
Description
以下、本発明の実施形態を添付図面に基づいて説明する。図1は本発明の第1実施形態に係るワーク検査装置10A(10)を示す上面図である。このようにワーク検査装置10は、ワーク30aを第1受渡位置31において搬入した第1テーブル21を検査位置35に移送する第1ステージ11と、この検査位置35においてワーク30を検査する検査ツール15と、別のワーク30bを第2受渡位置32において搬入した第2テーブル22を第1テーブル21が退避した後の検査位置35に移送する第2ステージ12と、検査前のワーク30を第1受渡位置31及び第2受渡位置32に搬入させるとともに検査後のワーク30a,30bを第1受渡位置31及び第2受渡位置32から搬出させる搬送部25と、を備えている。
次に図6を参照して本発明における第2実施形態について説明する。図6は本発明の第2実施形態に係るワーク検査装置10B(10)を示す上面図である。第2実施形態のワーク検査装置10Bは、上述した第1実施形態の構成に別件検査ツール17(17a,17b)をさらに追加した構成をとる。なお、図6において図1と共通の構成又は機能を有する部分は、同一符号で示し、重複する説明を省略する。
図7は、本発明の第3実施形態に係るワーク検査装置10に適用される、多層配線基板の底面を吸引する吸着治具の縦断面図である。良好な電気接合を得るためには、バンプ37の形状が揃っていることだけでなく、多層配線基板38の反りや厚さのバラツキが無いかもしくは考慮することも求められる。
Claims (6)
- ワークを第1受渡位置において搬入した第1テーブルを、検査位置に移送する第1ステージと、
固定された状態で、前記検査位置において前記ワークを検査する検査ツールと、
別のワークを第2受渡位置において搬入した第2テーブルを、前記第1テーブルが退避した後の前記検査位置に移送する第2ステージと、
互いに平行配置される前記第1ステージ及び前記第2ステージを、前記第1テーブル及び前記第2テーブルの各々の移送方向に対する交差方向に、独立して往復移動させるステージ移動部と、
検査前の前記ワークを前記第1受渡位置及び前記第2受渡位置に搬入させるとともに、検査後の前記ワークを前記第1受渡位置及び前記第2受渡位置から搬出させる搬送部と、を備え、
前記検査ツールが、前記第1テーブルに載置した前記ワークの検査を終了すると、
前記ステージ移動部が、前記検査位置において前記交差方向へ、前記第1ステージを退避させて前記第2ステージに入れ替え、
前記検査ツールが、前記第2テーブルに載置した前記ワークを検査中、前記搬送部が、前記第1受渡位置において検査後の前記ワークを搬出し検査前の前記ワークを搬入し、
前記検査ツールが、前記第2テーブルに載置した前記ワークの検査を終了すると、
前記ステージ移動部が、前記検査位置において前記交差方向へ、前記第2ステージを退避させて前記第1ステージに入れ替え、
前記検査ツールが、前記第1テーブルに載置した前記ワークを検査中、前記搬送部が、前記第2受渡位置において検査後の前記ワークを搬出し検査前の前記ワークを搬入する、工程を実行するワーク検査装置。 - 請求項1に記載のワーク検査装置において、
前記検査位置において前記検査ツールに対する前記第1テーブル及び前記第2テーブルの小刻みな移動を伴って前記ワークが検査されるワーク検査装置。 - 請求項1又は請求項2に記載のワーク検査装置において、
前記ワークは、LSIチップを電気的に接合させるバンプを上面に配列させた多層配線基板であるワーク検査装置。 - 請求項3に記載のワーク検査装置において、
前記第1テーブル及び前記第2テーブルの各々に設置され、前記多層配線基板の底面を吸引する吸着治具を備えるワーク検査装置。 - 請求項1又は請求項2に記載のワーク検査装置において、
前記第1受渡位置及び前記第2受渡位置とは反対側の前記第1ステージ及び前記第2ステージ上に位置する前記ワークを別件検査する別件検査ツールを備えるワーク検査装置。 - 請求項1又は請求項2に記載のワーク検査装置において、
前記搬送部は、
検査前の前記ワークを収容したトレーを取得し、
前記第1受渡位置及び前記第2受渡位置の近傍に前記トレーを交互に位置付けして前記ワークの受け渡しを実行し、
検査後の前記ワークを収容した前記トレーを排出するワーク検査装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2022/039412 WO2024084715A1 (ja) | 2022-10-21 | 2022-10-21 | ワーク検査装置 |
Publications (3)
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JP7262693B1 true JP7262693B1 (ja) | 2023-04-21 |
JPWO2024084715A1 JPWO2024084715A1 (ja) | 2024-04-25 |
JPWO2024084715A5 JPWO2024084715A5 (ja) | 2024-09-11 |
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JP2023504339A Active JP7262693B1 (ja) | 2022-10-21 | 2022-10-21 | ワーク検査装置 |
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US (1) | US11915955B1 (ja) |
JP (1) | JP7262693B1 (ja) |
KR (1) | KR102675684B1 (ja) |
CN (1) | CN118235234A (ja) |
TW (1) | TWI833667B (ja) |
WO (1) | WO2024084715A1 (ja) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002357635A (ja) * | 2001-06-01 | 2002-12-13 | Yamaha Motor Co Ltd | 部品試験装置 |
JP2006090918A (ja) * | 2004-09-27 | 2006-04-06 | Toshiba Corp | バンプ検査方法 |
JP2009038146A (ja) * | 2007-07-31 | 2009-02-19 | Nidec-Read Corp | 基板処理装置 |
JP2009295814A (ja) * | 2008-06-05 | 2009-12-17 | Takaoka Electric Mfg Co Ltd | Icパッケージ基板検査装置 |
JP2013057572A (ja) * | 2011-09-07 | 2013-03-28 | Seiko Epson Corp | ハンドラー及び部品検査装置 |
JP2013160612A (ja) * | 2012-02-03 | 2013-08-19 | Takaoka Electric Mfg Co Ltd | 立体形状計測装置 |
JP2015135285A (ja) * | 2014-01-17 | 2015-07-27 | 株式会社東光高岳 | 連続走査型計測装置 |
JP2015162590A (ja) * | 2014-02-27 | 2015-09-07 | 株式会社新川 | ボンディング装置およびボンディング方法 |
JP2016054256A (ja) * | 2014-09-04 | 2016-04-14 | Towa株式会社 | 切断装置並びに吸着機構及びこれを用いる装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003114251A (ja) | 2001-10-02 | 2003-04-18 | Nec Corp | Lsi検査装置及び方法 |
SG183593A1 (en) * | 2011-03-02 | 2012-09-27 | Rokko Systems Pte Ltd | Improved system for substrate processing |
KR101446170B1 (ko) * | 2013-05-08 | 2014-10-01 | 한미반도체 주식회사 | 반도체 패키지 정렬장치, 반도체 패키지 절단 정렬장치, 및 반도체 패키지 절단 정렬방법 |
EP3222965B1 (en) * | 2016-03-25 | 2020-01-15 | Fogale Nanotech | Chromatic confocal device and method for 2d/3d inspection of an object such as a wafer with variable spatial resolution |
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2022
- 2022-10-21 WO PCT/JP2022/039412 patent/WO2024084715A1/ja active Application Filing
- 2022-10-21 CN CN202280009938.2A patent/CN118235234A/zh active Pending
- 2022-10-21 JP JP2023504339A patent/JP7262693B1/ja active Active
- 2022-10-21 KR KR1020237023751A patent/KR102675684B1/ko active IP Right Grant
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2023
- 2023-06-23 US US18/213,639 patent/US11915955B1/en active Active
- 2023-06-28 TW TW112124129A patent/TWI833667B/zh active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002357635A (ja) * | 2001-06-01 | 2002-12-13 | Yamaha Motor Co Ltd | 部品試験装置 |
JP2006090918A (ja) * | 2004-09-27 | 2006-04-06 | Toshiba Corp | バンプ検査方法 |
JP2009038146A (ja) * | 2007-07-31 | 2009-02-19 | Nidec-Read Corp | 基板処理装置 |
JP2009295814A (ja) * | 2008-06-05 | 2009-12-17 | Takaoka Electric Mfg Co Ltd | Icパッケージ基板検査装置 |
JP2013057572A (ja) * | 2011-09-07 | 2013-03-28 | Seiko Epson Corp | ハンドラー及び部品検査装置 |
JP2013160612A (ja) * | 2012-02-03 | 2013-08-19 | Takaoka Electric Mfg Co Ltd | 立体形状計測装置 |
JP2015135285A (ja) * | 2014-01-17 | 2015-07-27 | 株式会社東光高岳 | 連続走査型計測装置 |
JP2015162590A (ja) * | 2014-02-27 | 2015-09-07 | 株式会社新川 | ボンディング装置およびボンディング方法 |
JP2016054256A (ja) * | 2014-09-04 | 2016-04-14 | Towa株式会社 | 切断装置並びに吸着機構及びこれを用いる装置 |
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Publication number | Publication date |
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WO2024084715A1 (ja) | 2024-04-25 |
TW202418487A (zh) | 2024-05-01 |
KR20240056678A (ko) | 2024-04-30 |
KR102675684B1 (ko) | 2024-06-18 |
TWI833667B (zh) | 2024-02-21 |
CN118235234A (zh) | 2024-06-21 |
JPWO2024084715A1 (ja) | 2024-04-25 |
US11915955B1 (en) | 2024-02-27 |
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