JP7188984B2 - Method for manufacturing optical wavelength conversion component - Google Patents

Description

The present disclosure includes a light wavelength conversion component having a light wavelength conversion member capable of converting the wavelength of light, and a light wavelength conversion component that is used in various optical devices such as headlamps, lighting, and projectors. The present invention relates to a method for manufacturing a light emitting device and an optical wavelength conversion component.

Conventionally, in headlamps and various lighting equipment, blue light emitted from a light emitting diode (LED) or a semiconductor laser (LD: Laser Diode) is wavelength-converted by a phosphor, which is a light wavelength conversion member, to produce a white light. The main stream is a device that obtains

Resin-based and glass-based phosphors are known as such phosphors, but in recent years, the output of light sources has been increasing, and phosphors are required to have higher durability. , attention is focused on ceramic phosphors.

Further, the phosphor described above is arranged on, for example, a substrate and fixed to the substrate or the like with resin or glass (see Patent Document 1). In the following description, a component having a phosphor fixed to a substrate or the like is referred to as a light wavelength conversion component, and a device including the light wavelength conversion component and a light emitting element such as an LD is referred to as a light emitting device.

WO2009/069671

By the way, the conventional technology described above has the following problems, and improvements have been desired.
Specifically, conventionally, the phosphor is fixed to a substrate or the like with resin or glass having low thermal conductivity. When the temperature rises, the heat may not be sufficiently released to the outside (that is, heat dissipation). In that case, the luminescence intensity is reduced due to so-called temperature quenching of the phosphor.

As a countermeasure, the inventors of the present application are conducting research on fixing the phosphor using a metal frame with high thermal conductivity. We were faced with the problem that discoloration occurs in light

For example, the coefficient of thermal expansion differs between a ceramic phosphor and a metal frame. ) can have problems with the expansion and contraction of the metal frame. That is, the metal frame undergoes plastic deformation by repeating expansion and contraction, and as a result, the light emitted from the light wavelength conversion member may be discolored.

Specifically, the heat is transferred at the start of light emission. When the phosphor receives the incident light from the light emitting element, the temperature of the phosphor first rises, and then the heat propagates to the surrounding metal frame. However, since heat propagation takes time, a situation arises in which the phosphor is relatively hot and the metal frame is relatively cold. Similarly, when the light emission is stopped, heat is transferred to the metal frame, which cools down easily, whereas the phosphor does not cool down easily. .

In a situation where the phosphor is at a relatively high temperature and the metal frame is at a relatively low temperature, the volume expansion of the phosphor is large, whereas the expansion of the metal frame is small. It cannot withstand and undergoes plastic deformation.

The plastic deformation tends to occur on the through-hole side of the metal frame, which is softened due to high temperature. Transforms into a raised shape. The raised portion of the metal frame tends to reflect incident light and emitted light from the phosphor, but the light reflected there usually has a long wavelength change, and as a result, the color of the light emitted from the light emitting device is changed. There was a problem that

In other words, when plastic deformation occurs in the metal frame, there is a problem that the chromaticity of the light emitted from the light emitting device (more specifically, the light wavelength conversion component) changes from the intended chromaticity.
The present disclosure has been made in view of the above problems, and an object thereof is to provide an optical wavelength conversion component, a light emitting device, and a method for manufacturing an optical wavelength conversion component that can suppress discoloration of light emitted from the optical wavelength conversion component. to do.

(1) A first aspect of the present disclosure includes a light wavelength conversion member that converts the wavelength of light and has one surface and the other surface, a frame-shaped metal frame that surrounds the light wavelength conversion member and has a through hole, It relates to an optical wavelength conversion component with

This optical wavelength conversion component is fixed to a metal frame, and one surface and the other surface of the optical wavelength conversion member itself are arranged on one side and the other side of the through hole, respectively. are placed. Further, at least one of the one surface and the other surface of the optical wavelength conversion member protrudes from the surface of the metal frame in the penetrating direction.

In the first aspect, since at least one of the one surface and the other surface of the optical wavelength conversion member protrudes from the surface in the penetrating direction of the metal frame, the light emitting device (more specifically, the optical wavelength conversion component ) can suppress the discoloration of the light emitted from. In other words, it is possible to prevent the chromaticity of the light emitted from the light wavelength conversion component to deviate from the intended chromaticity.

Specifically, even if the metal frame and the wavelength conversion member have different coefficients of thermal expansion and the metal frame is plastically deformed due to repeated temperature changes, one surface and the other surface of the light wavelength conversion member At least one of the surfaces (or both) protrudes from the surface in the penetrating direction of the metal frame, so that the phenomenon in which the light emitted from the optical wavelength conversion component hits the metal frame and is reflected is less likely to occur. This makes it difficult for the reflected light reflected by the metal frame and the emitted light emitted from the optical wavelength conversion member to mix, so that discoloration of the light emitted from the optical wavelength conversion component can be suppressed.

In addition, chromaticity is chromaticity calculated|required by the chromaticity diagram using the XYZ color system of International Commission on Illumination (CIE).
(2) In the second aspect of the present disclosure, the optical wavelength conversion member may be in direct contact with the metal frame in the through hole.

In the second aspect, since the optical wavelength conversion member is fixed to the metal frame while being in direct contact with the metal frame, there is an effect that the temperature of the optical wavelength conversion member is less likely to rise. That is, since the thermal conductivity of the metal frame is higher than that of the conventional resin or glass described above, even if the temperature of the light wavelength conversion member rises, the heat is easily transferred to the metal frame side ( heat is radiated). Therefore, it is possible to prevent the temperature of the optical wavelength conversion member from rising excessively, so that the temperature quenching can be suitably suppressed.

(3) In the third aspect of the present disclosure, the side surface of the metal frame of the optical wavelength conversion member that is in contact with the inner peripheral surface forming the through hole may be inclined with respect to one surface of the optical wavelength conversion member.
Since the side surface of the light wavelength conversion member is inclined with respect to one surface in this manner, the contact area between the side surface of the light wavelength conversion member and the inner peripheral surface of the metal frame is increased. Therefore, heat dissipation from the optical wavelength conversion member to the metal frame is improved. Also, the bondability between the optical wavelength conversion member and the metal frame is improved.

(4) In the fourth aspect of the present disclosure, the side surface of the light wavelength conversion member may be tapered with respect to one surface of the light wavelength conversion member.
With this configuration, unevenness in heat dissipation on the side surfaces of the optical wavelength conversion member (that is, side surfaces along the entire circumference) is reduced, and the temperature of the optical wavelength conversion member becomes more uniform.

Here, the tapered shape means along the thickness direction of the light wavelength conversion member, that is, from one surface side to the other surface side of the light wavelength conversion member, or from the other surface side to one surface. Towards the side, a shape with a decreasing (or tapering) radial dimension is shown.

(5) In the fifth aspect of the present disclosure, the angle between one surface of the light wavelength conversion member and the side surface in contact with the inner peripheral surface forming the through hole of the metal frame of the light wavelength conversion member is 80°. It may be in the range of 100° or more.

As is clear from experimental examples described later, when the angle between one surface and the side surface (that is, the angle of inclination of the side surface with respect to the one surface) is less than 80° or more than 100°, the light wavelength conversion member is The range of 80° or more and 100° or less is preferable because the end portion (that is, the edge portion) is easily cracked.

Here, the edge portion is an angle portion formed by a side surface and one surface or the other surface when the light wavelength conversion member is broken in the thickness direction. Although the edge portions are present on both one surface side and the other surface side, it is the portion with an acute angle (edge angle) that is likely to crack.

(6) In the sixth aspect of the present disclosure, the angle between the one surface of the light wavelength conversion member and the side surface of the light wavelength conversion member may be in the range of 85° or more and 95° or less.
As is clear from the experimental examples described later, when the angle between one surface and the side surface (that is, the angle of inclination of the side surface with respect to the one surface) is in the range of 85° or more and 95° or less, optical wavelength conversion This range is suitable because it has excellent overall performance as a part.

Specifically, as will be described later, when the other conditions are the same, the smaller the angle between one surface and the side surface (hereinafter sometimes referred to as the “light-emitting side edge angle”), the smaller the area of the one surface. Since the (e.g., light-emitting area) increases, the light-emitting intensity increases.

Also, the fixing strength increases as the light-emitting side edge angle increases. Note that the fixing strength in this case is the fixing strength when a force is applied from the other surface side opposite to the one surface to the one surface side.

Therefore, in view of these factors, the range of angles described above is generally preferable.
(7) In the seventh aspect of the present disclosure, the material constituting the metal frame is at least one metal selected from Al (aluminum), Cu (copper), Ni (nickel), and Fe (iron), or at least one It may also be a metal composite or alloy containing the different metals.

The seventh aspect exemplifies suitable materials for forming the metal frame.
As the material of the metal frame, a material having a thermal conductivity higher than that of the optical wavelength conversion member is used within the operating temperature range of the optical wavelength conversion component. As the material of the metal frame, a material having a coefficient of thermal expansion larger than that of the light wavelength conversion member is used within the operating temperature range.

As the metal, any one of the simple substances (Al, Cu, Ni, Fe) can be used. Examples of metal composites containing at least one of the above metals and alloys containing at least one of the above metals include copper tungsten (Cu—W), copper molybdenum (Cu—Mo), brass, and beryllium copper alloys. , copper-chromium alloy, copper-zirconium alloy, copper-iron alloy, aluminum alloy, stainless steel, and the like can be used.

(8) In the eighth aspect of the present disclosure, the material forming the metal frame may be Al or an Al alloy.
When the material forming the metal frame is Al or an Al alloy, there is an effect that it is easy to manufacture (that is, easy to crush) when manufacturing the optical wavelength conversion component as described later. Moreover, even when the light emitted from the light wavelength conversion member strikes Al or Al alloy, the wavelength of the reflected light is less likely to change. As a result, the chromaticity of the light output from the light wavelength conversion member changes. It has the advantage of being difficult to Furthermore, there is also an effect that the thermal conductivity is high.

The Al alloy is an alloy containing Al as a main component. In addition, a main component is a component with most content (for example, volume %).
(9) A ninth aspect of the present disclosure is a light-emitting device comprising the light wavelength conversion component according to any one of the first to eighth aspects, and a light-emitting element that irradiates the light wavelength conversion member with light. .

In the ninth aspect, by irradiating light from the light emitting element with the light wavelength conversion member, light whose wavelength has been converted by the light wavelength conversion member (that is, fluorescence) can be emitted to the outside or the like.
Since this light-emitting device includes the optical wavelength conversion component, the above-described effects of the optical wavelength conversion component can be exhibited.

As the light-emitting element of the light-emitting device, for example, known elements such as LED and LD can be used.
(10) In the tenth aspect of the present disclosure, the light wavelength conversion member may protrude from the surface of the metal frame on the light emitting element side.

As a result, the light emitting element can be easily arranged so as to be in contact with the surface of the light wavelength conversion member, so that the light can be efficiently incident on the light wavelength conversion member from the light emitting element.
(11) An eleventh aspect of the present disclosure relates to a method for manufacturing an optical wavelength conversion component according to any one of the first to eighth aspects.

In this method of manufacturing an optical wavelength conversion component, the optical wavelength conversion member is arranged at a position facing the opening of the through hole of the metal frame, and overlapped with the inner peripheral portion of the metal frame (that is, the portion on the through hole side). arranging the outer peripheral portion of the optical wavelength conversion member; and pressing the optical wavelength conversion member into the through hole of the metal frame to crush the inner peripheral portion of the metal frame with the outer peripheral portion of the optical wavelength conversion member. is doing.

That is, in the eleventh aspect, the optical wavelength conversion member can be fixed to the metal frame by pushing the optical wavelength conversion member into the through hole of the metal frame. Also, at that time, the inner peripheral portion of the metal frame is crushed by the outer peripheral portion of the optical wavelength conversion member.

Therefore, in the eleventh aspect, there is an effect that the optical wavelength conversion component can be manufactured by a simple method.
In the eleventh aspect, as the material of the optical wavelength conversion member, a material harder than the metal frame is used so that the metal frame can be crushed. For example, a ceramic member can be used as the light wavelength conversion member.

(12) In the twelfth aspect of the present disclosure, after the inner peripheral portion of the metal frame is crushed by the outer peripheral portion of the optical wavelength conversion member, the optical wavelength conversion member is further pushed into the through hole of the metal frame to pierce the metal frame. good too.
In the twelfth aspect, by pushing the optical wavelength conversion member into the through-hole of the metal frame and penetrating the metal frame, the surface of the optical wavelength conversion member that is pushed into protrudes from the surface of the metal frame in the penetrating direction. can be done. This makes it possible to easily manufacture the optical wavelength conversion component having the configuration described above.

<Each configuration of the present disclosure will be described below>
- A member made of ceramic (that is, a ceramic sintered body) can be adopted as the above-mentioned "optical wavelength conversion member".

As this ceramic sintered body, for example, a polycrystalline body in which the volume of Al ₂ O ₃ crystal grains and the crystal grains of the component represented by the chemical formula A ₃ B ₅ O ₁₂ :Ce is the largest (that is, the main component) A ceramic sintered body can be employed.

As this ceramic sintered body, A and B in A ₃ B ₅ O ₁₂ can be at least one element selected from the following element group.
A: Sc, Y, lanthanoids (excluding Ce)
B: Al, Ga
In addition, "A ₃ B ₅ O ₁₂ :Ce" indicates that a part of the element A in A ₃ B ₅ O ₁₂ is solid-solution substituted with Ce, and having such a structure This makes the compound exhibit fluorescent properties.

・The hardness of the metal frame can be in the range of 15 to 400Hv.
- For example, a range of 10 to 30 μm can be adopted as the dimension by which the light wavelength conversion member protrudes from the metal frame.

FIG. 2 is a cross-sectional view of the light-emitting device including the optical wavelength conversion component of the first embodiment cut in the thickness direction; FIG. 2A is a plan view of the optical wavelength conversion component of the first embodiment, and FIG. 2B is a cross-sectional view thereof taken along line AA. It is explanatory drawing which shows the manufacturing process of the optical wavelength conversion component of 1st Embodiment. FIG. 4A is a cross-sectional view of a light-emitting device provided with the optical wavelength conversion component of the second embodiment cut in the thickness direction, and FIG. 4B is a cross-section of the light-emitting device provided with the light wavelength conversion component of the third embodiment cut in the thickness direction. FIG. 4C is a cross-sectional view of a light-emitting device provided with a light wavelength conversion component according to a fourth embodiment taken along the thickness direction. FIG. 5A is a cross-sectional view of the optical wavelength conversion component of the fifth embodiment taken along the thickness direction, and FIG. 5B is a cross-sectional view of the optical wavelength conversion component of the modification taken along the thickness direction. 6A is a cross-sectional view of the optical wavelength conversion component of the sixth embodiment cut along the axis, and FIG. 6B is a cross-sectional view of the light wavelength conversion component of the seventh embodiment cut along the axis. 7A is a cross-sectional view of the optical wavelength conversion component of the seventh embodiment cut in the thickness direction, and FIG. 7B is a cross-sectional view of a part of the light emitting device including the light wavelength conversion component of the seventh embodiment cut in the thickness direction. be. 8A is a cross-sectional view of the light emitting device of the eighth embodiment taken along the thickness direction, FIG. 8B is a plan view of the light wavelength conversion member thereof, and FIG. 8C is a cross-sectional view of the light emitting device of the modification taken along the thickness direction. . FIG. 9 is an explanatory diagram showing experimental conditions and experimental results of Experimental Example 4; FIG. 11 is an explanatory diagram showing an experimental method of Experimental Example 5; FIG. 9 is an explanatory diagram showing experimental conditions and experimental results of Experimental Example 5; FIG. 9 is an explanatory diagram showing experimental conditions and experimental results of Experimental Example 6; FIG. 10 is an explanatory diagram showing experimental conditions and experimental results of Experimental Example 7; FIG. 14A is a cross-sectional view of an optical wavelength conversion component of an application example cut in the thickness direction, FIG. 14B is a cross-sectional view of an optical wavelength conversion component of another application example cut in the thickness direction, and FIG. It is sectional drawing which fracture|ruptured the wavelength conversion component in the thickness direction.

Next, embodiments of the optical wavelength conversion component, the light emitting device, and the method for manufacturing the optical wavelength conversion component of the present disclosure will be described.
[1. First Embodiment]
[1-1. Light-emitting device]
First, a light-emitting device provided with the optical wavelength conversion component of the first embodiment will be described.

As shown in FIG. 1, the light emitting device 1 of the first embodiment includes a box-shaped ceramic package (container) 3 such as alumina, and a light emitting element 5 such as an LD disposed inside the container 3. and a plate-shaped light wavelength conversion component 9 arranged so as to cover the opening 7 of the container 3 .

Further, the optical wavelength conversion component 9 is composed of an optical wavelength conversion member 11 for converting the wavelength of light and a metal frame 13 for holding the optical wavelength conversion member 11, as will be described in detail later. An outer peripheral portion 15 of the metal frame 13 is joined to a frame-shaped end face 17 on the opening side of the container 3 .

In this light emitting device 1, the light (L) emitted from the light emitting element 5 in the direction of the arrow in FIG. converted to light. That is, the light wavelength conversion member 11 emits fluorescence with a wavelength different from the wavelength of the light emitted (that is, irradiated) from the light emitting element 5 . The direction of the arrow of L is the direction of the light emitted from the light emitting element 5 (the same applies hereinafter).

For example, blue light emitted from the LD is wavelength-converted by the light wavelength conversion member 11, and white light is emitted from the light wavelength conversion member 11 to the outside (for example, the upper part of FIG. 1) as a whole.
[1-2. Optical wavelength conversion parts]
Next, the optical wavelength conversion component 9 will be explained.

As shown in FIG. 2, the optical wavelength conversion component 9 of the first embodiment includes a plate-shaped optical wavelength conversion member 11 made of ceramic and a plate-shaped metal frame that surrounds and holds the optical wavelength conversion member 11. 13. A detailed description will be given below.

<Light wavelength conversion member>
The light wavelength conversion member 11 is a rectangular (for example, square) member in plan view (that is, when viewed in the plate thickness direction, which is the vertical direction in FIG. 2B).

As for the dimensions of the light wavelength conversion member 11, for example, length 1.0 mm×width 1.0 mm×thickness 0.18 mm can be adopted.
The light wavelength conversion member 11 is composed of, for example, Al ₂ O ₃ crystal grains, crystal grains of a component represented by the chemical formula A ₃ B ₅ O ₁₂ :Ce (that is, A ₃ B ₅ O ₁₂ :Ce crystal grains), It is composed of a ceramic sintered body that is a polycrystalline body containing as a main component.

In addition, A and B in the chemical formula A ₃ B ₅ O ₁₂ :Ce represent each element (but different elements) constituting the substance represented by the chemical formula A ₃ B ₅ O ₁₂ :Ce, O is oxygen, Ce is cerium.
As the light wavelength conversion member 11, one having a ratio of A ₃ B ₅ O ₁₂ :Ce in the entire ceramics sintered body of 3 to 70% by volume of the ceramics sintered body can be used.

Also, this ceramic sintered body has a garnet structure represented by A ₃ B ₅ O ₁₂ :Ce composed of at least one element selected from the following element group.
A: Sc, Y, lanthanoids (excluding Ce)
B: Al, Ga
Furthermore, in the ceramic sintered body, the concentration of Ce in A ₃ B ₅ O ₁₂ :Ce is 5 mol % or less relative to the element A (excluding 0).

In addition, as the ceramic sintered body described above, for example, the proportion of YAG (Y ₃ Al ₅ O ₁₂ ) in the ceramic sintered body is 30% by volume, and the Ce concentration is 0.3 mol% with respect to Y in YAG. A sintered body can be employed.

<Metal frame>
The metal frame 13 is a rectangular frame-shaped plate material in plan view, and a rectangular (for example, square) through-hole 19 is formed in the center of the metal frame 13 so as to penetrate in the plate thickness direction.

The metal frame 13 is made of a metal such as Al, and its hardness (eg, Vickers hardness) is lower than that of the light wavelength conversion member 11 . In other words, the metal frame 13 is made of a softer material than the light wavelength conversion member 11 . In the range of 25° C. to 300° C., the coefficient of thermal expansion of the metal frame 13 is higher than that of the optical wavelength conversion member 11 .

The outer diameter of the metal frame 13 is, for example, 10 mm long×10 mm wide×0.15 mm thick.
Further, the through-hole 19 is similar in plan view to the outer peripheral shape of the metal frame 13, and the width of the portion surrounding the through-hole 19 (that is, the frame portion 14 of the metal frame 13) is the same. That is, in plan view, the center (center of gravity) of the through-hole 19 coincides with the center (center of gravity) of the metal frame 13 . The dimensions of the through hole 19 are, for example, 1.0 mm long×1.0 mm wide.

<Optical wavelength conversion parts>
In the optical wavelength conversion component 9, the optical wavelength conversion member 11 is arranged in the through hole 19 of the metal frame 13, and one surface of the optical wavelength conversion member 11 in the thickness direction (for example, the upper outer surface in FIG. 2B) 11a) and the other surface (for example, the lower inner surface 11b in FIG. 2B) are exposed to the outside (that is, the outside of the through hole 19).

The outer surface 11a is an emission surface (that is, a light emitting surface) from which light is emitted from the light wavelength conversion member 11 to the outside, and the inner surface 11b is an incidence surface for light to enter the light wavelength conversion member 11 from the light emitting element 5 side. (that is, the light receiving surface).

In particular, in the first embodiment, the inner surface 11b of the optical wavelength conversion member 11 is the inner surface 13b of the metal frame 13 in the penetrating direction of the through hole 19 of the metal frame 13 (vertical direction in FIG. 2B: thickness direction of the metal frame 13). (bottom surface in FIG. 2B). That is, it protrudes toward the light emitting element 5 side in FIG.

That is, most of the optical wavelength conversion member 11 is arranged inside the through hole 19 of the metal frame 13 and a part protrudes outside the through hole 19 .
The dimension by which the inner surface 11b of the light wavelength conversion member 11 protrudes from the inner surface 13b of the metal frame 13 is, for example, in the range of 20 to 30 μm.

Further, the side surface 11c of the light wavelength conversion member 11, that is, the strip-shaped side surface 11c connecting the outer periphery of the outer surface 11a and the outer periphery of the inner surface 11b is in direct contact with the inner peripheral surface 19a of the through hole 19 of the metal frame 13.
[1-3. Method for manufacturing optical wavelength conversion component]
Next, a method for manufacturing the optical wavelength conversion component 9 will be described.

As shown in FIG. 3A, first, the metal frame 13 having the through holes 19 was arranged on the base 21 . Although not shown, the through hole 19 was formed by punching out the center of a rectangular metal plate made of Al, for example, with a press machine.

Next, the optical wavelength conversion member 11 was arranged at a position facing the opening 23 of the through hole 19 of the metal frame 13 (upper side in FIG. 3A). At this time, the entire periphery of the outer peripheral portion 27 of the optical wavelength conversion member 11 (that is, a rectangular (peripheral part of the outer circumference) was arranged.

At this stage, the inner diameter of the through-hole 19 is smaller than the inner diameter after being pushed (that is, the inner diameter of the through-hole 19 in the optical wavelength conversion component 9) to be described later. 0.97 mm square.

Next, as shown in FIG. 3B, the optical wavelength conversion member 11 was pressed into the through hole 19 of the metal frame 13 by the pressing machine 29 . At that time, the inner peripheral portion 25 of the metal frame 113 was crushed by the outer peripheral portion 27 of the optical wavelength conversion member 11 .

Next, as shown in FIG. 3C , a frame 28 was placed on another base 22 , and the metal frame 13 with the light wavelength conversion member 11 pressed therein was placed on the frame 28 . Note that the light wavelength conversion member 11 was positioned within the range of the through hole 30 of the frame 28 in plan view.

In this state, the optical wavelength conversion member 11 was further pushed into the through hole 19 of the metal frame 13 by the pressing machine 29 so that the inner surface 11b of the optical wavelength conversion member 11 penetrated the metal frame 13 . In other words, the inner surface 11b of the optical wavelength conversion member 11 is made to protrude downward from the inner surface 13b of the metal frame 13 .

The outer surface 11a of the light wavelength conversion member 11 and the outer surface 13a of the metal frame 13 were arranged to be flush with each other.
As a result, the optical wavelength conversion component 9 of the first embodiment was obtained.
[1-4. effect]
Next, effects of the first embodiment will be described.

(1) In the first embodiment, the optical wavelength conversion member 11 is fixed to the metal frame 13 in direct contact with the metal frame 13 having high thermal conductivity. It has the effect of making it difficult to rise. Therefore, it is possible to prevent the temperature of the optical wavelength conversion member 11 from rising excessively, so that the temperature quenching can be suitably suppressed.

(2) In the first embodiment, the inner surface 11b of the light wavelength conversion member 11 protrudes from the surface (that is, the inner surface 13b) of the metal frame 13 in the penetrating direction. ) can suppress the discoloration of the light emitted from.

That is, in the first embodiment, the inner surface 11b of the optical wavelength conversion member 11 protrudes from the inner surface 13b of the metal frame 13 in the penetrating direction of the through hole 19, so that the metal frame 13 is plastically deformed due to changes in temperature. Even in this case, the phenomenon that the light emitted from the optical wavelength conversion component 11 hits the plastically deformed portion of the metal frame 13 and is reflected is less likely to occur.

This makes it difficult for the reflected light reflected by the metal frame 13 and the emitted light emitted from the light wavelength conversion member 11 to mix, and as a result, discoloration of the light emitted from the light wavelength conversion component 9 can be suppressed. . In other words, it is possible to prevent the chromaticity of the light emitted from the light wavelength conversion component 9 from changing from the intended chromaticity.

(3) In the first embodiment, for example, Al (or an Al alloy) is used as a material for forming the metal frame 13. Therefore, when the optical wavelength conversion component 9 is manufactured, it is easy to manufacture (that is, crushed). easy).

Further, even when the light emitted from the light wavelength conversion member 11 hits the metal frame 13, the wavelength of the reflected light is less likely to change. It has the advantage of being difficult to change. Furthermore, there is also an effect that the thermal conductivity is high.

(4) Since the light-emitting device 1 of the first embodiment includes the optical wavelength conversion component 9, the above-described effects of the optical wavelength conversion component 9 can be exhibited.
(5) In the method for manufacturing the optical wavelength conversion component 9 of the first embodiment, by pushing the optical wavelength conversion member 11 into the through hole 19 of the metal frame 13, the outer peripheral portion 27 of the optical wavelength conversion member 11 is pressed into the metal frame. The optical wavelength conversion member 11 can be easily fixed to the metal frame 13 by crushing the inner peripheral portion 25 of 13 .

Further, after the inner peripheral portion 25 of the metal frame 13 is crushed by the outer peripheral portion 27 of the optical wavelength conversion member 11, the optical wavelength conversion member 11 is pushed into the through hole 19 of the metal frame 13 to pierce the metal frame 13. The inner surface 11b of the optical wavelength conversion member 11 can be made to protrude from the inner surface 13b of the metal frame 13 .

By inserting the optical wavelength conversion member 11 into the through-hole 19 of the metal frame 13 and penetrating the metal frame 13, burrs around the through-hole 19 generated during the crushing can be removed.

This makes it possible to easily manufacture the optical wavelength conversion component 9 of the first embodiment.
[2. Second Embodiment]
Next, the second embodiment will be described, but descriptions of the same contents as in the first embodiment will be omitted or simplified. In addition, the same numbers are used to describe the same configurations as in the first embodiment.

As shown in FIG. 4A, a light-emitting device 31 of the second embodiment includes a container 3, a light-emitting element 5 arranged inside the container 3, and an opening 7 of the container 3, as in the first embodiment. and an optical wavelength conversion component 9 arranged so as to cover it.

Also, the optical wavelength conversion component 9 is composed of an optical wavelength conversion member 11 and a metal frame 13 . The light wavelength conversion member 11 is arranged in the through hole 19, and the inner surface 11b of the light wavelength conversion member 11 protrudes from the inner surface 13b of the metal frame 13 toward the light emitting element 5 (downward in FIG. 4A).

In the second embodiment, the top surface 5 a of the light emitting element 5 is in close contact with the inner surface 11 b of the light wavelength conversion member 11 , and the bottom surface 5 b of the light emitting element 5 is in close contact with the bottom surface 3 a of the container 3 .
The second embodiment has the same effect as the first embodiment. In addition, in the second embodiment, the light emitting element 5 is arranged so as to be in close contact with the inner surface 11b of the light wavelength conversion member 11, so that the light emitted from the light emitting element 5 is efficiently directed toward the light wavelength conversion member 11 side. Well fed. Therefore, there is an advantage that the light emission intensity of the light wavelength conversion member 11 is high.
[3. Third Embodiment]
Next, the third embodiment will be described, but descriptions of the same contents as those of the second embodiment will be omitted or simplified. The same numbers are used to describe the same configurations as in the second embodiment.

As shown in FIG. 4B, the light emitting device 41 of the third embodiment is basically the same as that of the second embodiment, but in the light wavelength conversion component 43, the projection direction of the light wavelength conversion member 11 is different from the third embodiment. This is the opposite of the second embodiment.

That is, in the third embodiment, the outer surface 11a of the light wavelength conversion member 11 protrudes from the outer surface 13a of the metal frame 13 to the side opposite to the light emitting element 5 (upward in FIG. 4B).
The third embodiment has the same effect as the second embodiment.
[4. Fourth Embodiment]
Next, the fourth embodiment will be described, but descriptions of the same contents as in the third embodiment will be omitted or simplified. The same numbers are used to describe the same configurations as in the third embodiment.

As shown in FIG. 4C, the light emitting device 51 of the fourth embodiment is basically the same as that of the third embodiment, but in the light wavelength conversion component 53, the projection direction of the light wavelength conversion member 11 is different from that of the third embodiment. 3 embodiment.

That is, in the fourth embodiment, the outer surface 11a of the light wavelength conversion member 11 protrudes from the outer surface 13a of the metal frame 13 to the side opposite to the light emitting element 5 (upward in FIG. 4C), and the inner surface 11b of the light wavelength conversion member 11 protrudes from the outer surface 13a. protrudes from the inner surface 13b of the metal frame 13 toward the light emitting element 5 (downward in FIG. 4C).

The fourth embodiment has the same effect as the third embodiment.
[5. Fifth Embodiment]
Next, the fifth embodiment will be described, but descriptions of the same contents as in the first embodiment will be omitted or simplified. In addition, the same numbers are used to describe the same configurations as in the first embodiment.

As shown in FIG. 5A, an optical wavelength conversion component 61 of the fifth embodiment is obtained by fitting an optical wavelength conversion member 11 similar to that of the first embodiment into a through hole 19 of a metal frame 13 having a square frame shape. is. The outer surface 11a of the light wavelength conversion member 11 protrudes from the outer surface 13a of the metal frame 13 upward in FIG.

In addition, in the fifth embodiment, the opening end of the metal frame 13 on the through hole 19 side, that is, the opening end on the side opposite to the side where the optical wavelength conversion member 11 protrudes (lower side in FIG. 5A) is provided with the optical wavelength conversion member. An overlapping portion 63 overlapping the outer peripheral portion 27 of 11 is provided.

The overlapping portion 63 is a portion where the outer peripheral portion 27 of the light wavelength conversion member 11 and the inner peripheral portion 25 of the metal frame 13 overlap in plan view, and is formed in a rectangular frame shape along the inner periphery of the through hole 19 . It is
Light is emitted from the light emitting element 5 to the inner surface 11b of the light wavelength conversion member 11 (that is, the surface on the side where the overlapping portion 63 is provided).

The fifth embodiment has the same effect as the first embodiment. In addition, in the fifth embodiment, an overlapping portion 63 is formed on the inner peripheral portion 25 of the metal frame 13 so as to overlap the outer peripheral portion 27 of the optical wavelength conversion member 11 . Therefore, when the metal frame 13 and the optical wavelength conversion member 11 have different coefficients of thermal expansion, a gap is less likely to occur between the metal frame 13 and the optical wavelength conversion member 11 even if the temperature changes.

Therefore, when the light wavelength conversion member 11 is irradiated with light from the light emitting element 5 to convert the light wavelength, light leaks from the gap between the metal frame 13 and the light wavelength conversion member 11 even if the temperature changes. Hateful. As a result, it is possible to easily obtain light having the intended chromaticity, which is a remarkable effect.

FIG. 5B shows a modification of the fifth embodiment, and the optical wavelength conversion component 71 of this modification is upside down from the optical wavelength conversion component 61 of the fifth embodiment.
That is, the inner surface 11b of the light wavelength conversion member 11 protrudes downward in FIG. Note that the overlapping portion 63 is provided on the outer surface 11a side (upper side in FIG. 5B).

Then, light is emitted from the light emitting element 5 to the inner surface 11b of the light wavelength conversion member 11 (that is, the surface on the side without the overlapping portion 63).
This modification has the same effect as the fifth embodiment.
[6. Sixth Embodiment]
Next, the sixth embodiment will be described, but descriptions of the same contents as in the first embodiment will be omitted or simplified. In addition, the same numbers are used to describe the same configurations as in the first embodiment.

As shown in FIG. 6A, in the optical wavelength conversion component 81 of the sixth embodiment, the optical wavelength conversion member 11 similar to that of the first embodiment is placed on the tip side (upper side of FIG. 6A) of a cylindrical metal frame 83. It is fixed to the plate-like portion 85 .

Specifically, the metal frame 83 is integrally formed of a rectangular tubular portion 87 and a plate portion 85 that covers the tip side of the tubular portion 87. The plate portion 85 (first A light wavelength conversion member 11 is fixed in a through hole 19 (similar to the embodiment).

In the sixth embodiment, the inner surface 11b of the light wavelength conversion member 11 protrudes from the inner surface 85a of the plate-like portion 85 downward in FIG. 6A, that is, toward the light emitting element 5 (see FIG. 1).
The sixth embodiment has the same effect as the first embodiment.
[7. Seventh embodiment]
Next, the seventh embodiment will be described, but descriptions of the same contents as in the first embodiment will be omitted or simplified. In addition, the same numbers are used to describe the same configurations as in the first embodiment.

As shown in FIG. 6B, in the optical wavelength conversion component 91 of the seventh embodiment, the optical wavelength conversion member 11 similar to that of the first embodiment is placed on the tip side (upper side of FIG. 6B) of a cylindrical metal frame 93. It is fixed.

Specifically, the metal frame 93 has a rectangular cylindrical shape, and the optical wavelength conversion member 11 is fixed so as to cover an opening 97 on the tip end side of a through hole 95 provided in the axial direction of the metal frame 93 .
In the seventh embodiment, the through-hole 95 has a larger inner diameter on the front end side than on the rear end side, and a stepped portion with a different inner diameter forms an overlapping portion 99 . The overlapping portion 99 is a portion where the outer peripheral portion 27 of the light wavelength conversion member 11 and the inner peripheral portion 25 of the metal frame 93 overlap when viewed from the axial direction, as in the fifth embodiment. .

The seventh embodiment has the same effect as the first embodiment. Moreover, the overlapping portion 99 provides the same effect as the fifth embodiment.
[8. Eighth Embodiment]
Next, the eighth embodiment will be described, but descriptions of the same contents as in the first embodiment will be omitted or simplified. In addition, the same numbers are used to describe the same configurations as in the first embodiment.

As shown in FIG. 7A, in the optical wavelength conversion component 101 of the eighth embodiment, the optical wavelength conversion member 11 and the light emitting element 5 are arranged in the through holes 19 of the metal frame 13 having a square frame shape in plan view. It is.
That is, in the through hole 19, the light wavelength conversion member 11 and the light emitting element 5 are stacked from above in FIG. 7A. Also, the side surfaces of the light wavelength conversion member 11 and the light emitting element 5 are in contact with the inner peripheral surface of the through hole 19 . The thickness of the metal frame 13 is set to a thickness that can accommodate the light wavelength conversion member 11 and the light emitting element 5 .

Further, the outer surface 11a of the light wavelength conversion member 11 protrudes from the outer surface 13a of the metal frame 13 upward in FIG.
The eighth embodiment has the same effect as the first embodiment. In addition, in the eighth embodiment, the light emitting element 5 is arranged in the through hole 19 so as to be in close contact with the inner surface 11b of the light wavelength conversion member 11. Therefore, the light emitted from the light emitting element 5 is The light is more efficiently supplied to the light wavelength conversion member 11 side. Therefore, there is an advantage that the light emission intensity of the light wavelength conversion member 11 is high.
[9. Ninth Embodiment]
Next, the ninth embodiment will be described, but descriptions of the same contents as in the fifth embodiment will be omitted or simplified. The same numbers are used to describe the same configurations as in the fifth embodiment.

As shown in FIG. 7B, in the light emitting device 111 of the ninth embodiment, the light wavelength conversion member 11 is arranged in the through hole 19 of the metal frame 13 having a square frame shape in plan view. A light emitting element 5 is arranged in close contact with the side surface 11b.

Also, the metal frame 13 is provided with an overlapping portion 63 as in the fifth embodiment, and the light emitting element 5 is arranged on the inner peripheral side of the overlapping portion 63 .
A cylindrical portion 113 is joined to the outer periphery of the metal frame 13 on the side of the light emitting element 5 .

The ninth embodiment has the same effect as the first embodiment. Also, since the light wavelength conversion member 11 and the light emitting element 5 are in close contact with each other, the same effects as those of the eighth embodiment can be obtained. Furthermore, since the overlapping portion 63 is provided, the same effects as those of the fifth embodiment can be obtained.
[10. Tenth Embodiment]
Next, the tenth embodiment will be described, but descriptions of the same contents as in the first embodiment will be omitted or simplified. In addition, the same numbers are used to describe the same configurations as in the first embodiment.
[10-1. Configuration of Light Emitting Device]
As shown in FIG. 8A, in a light-emitting device 121 of the eighth embodiment, a light-emitting element 5 (for example, an LED) is arranged on a bottom surface 123a of a box-shaped base 123, and a metal An optical wavelength conversion component 129 consisting of a frame 125 and an optical wavelength conversion member 127 is arranged. Although the shape of this light wavelength conversion member 127 is different from that of the first embodiment, the material is the same.

Specifically, the metal frame 125 is a rectangular frame-shaped plate member in a plan view (when viewed from the top and bottom direction in FIG. 8A), and the light wavelength conversion member 127 is the metal frame 125, as in the first embodiment. It is fixed to the square through-hole 131 in plan view.

Particularly in the tenth embodiment, the shape of the light wavelength conversion member 127 is different from that of the third embodiment, and the side surface 126 thereof is tapered. That is, the side surface 126 is inclined within the range of a predetermined angle (light-emitting side edge angle) θ with respect to the outer surface (that is, one surface that is the light-emitting surface) 127a.

Specifically, as shown in FIG. 8B, the light wavelength conversion member 127 is a plate material having a square shape in plan view, and its four side surfaces 126a, 126b, 126c, and 126d (collectively referred to as 126) are formed as shown in FIG. 8A. Furthermore, it is inclined at a predetermined angle (that is, the edge angle on the light emitting side) θ with respect to the light emitting surface 127a of the light wavelength conversion member 127 .

The light emitting surface 127a is one surface of the light wavelength conversion member 127 in the thickness direction (the surface opposite to the other surface on which the light emitting element 5 is arranged).
Here, all side surfaces 126 are inclined at similar angles with respect to the light emitting surface 127a. That is, the shape of the side surface 126 of the light wavelength conversion member 127 is a so-called tapered shape that is inclined at the same angle with respect to the light emitting surface 127a.

The light-emitting side edge angle θ is, for example, in the range of 75° to 105°. Note that FIG. 8A illustrates a case where the light emitting side edge angle θ is an acute angle. When the light-emitting side edge angle θ is 90°, the side surface 126 is not inclined with respect to the light-emitting surface 127a.

On the other hand, the inner peripheral surface 131a forming the through-hole 131 into which the optical wavelength conversion member 127 is fitted (that is, the inner peripheral surface 131a in contact with the side surface 126) is arranged so as to match the shape of the side surface 126 of the optical wavelength conversion member 127. It is inclined at the same angle as the side surface 126 (that is, the light-emitting side edge angle θ). In other words, the shape of the inner peripheral surface 131a forming the through-hole 131 also has a tapered shape similar to the side surface 126 of the light wavelength conversion member 127. As shown in FIG.

Further, similarly to the third embodiment, the light emitting surface 127a of the light wavelength conversion member 127 is positioned outside (FIG. 8A) above the outer surface 125a (upper surface in FIG. 8A) of the metal frame 125 by, for example, 10 to 30 μm. Outstanding in range.

The light-receiving surface 127b of the light wavelength conversion member 127 and the light-emitting surface 5a of the light-emitting element 5 have the same shape in plan view, and the light-receiving surface 127b and the light-emitting surface 5a are in close contact with each other. Note that the light receiving surface 127b of the optical wavelength conversion member 127 and the inner surface 125b of the metal frame 125 (the lower surface in FIG. 8A) are on the same plane.
[10-2. Method for manufacturing optical wavelength conversion component]
A method of manufacturing the optical wavelength conversion component 129 of the tenth embodiment is basically the same as that of the first embodiment.

Specifically, a through hole 131 having a diameter slightly smaller than the outer diameter of the light wavelength conversion member 127 is opened in the metal frame 125, and the light wavelength conversion member 127 is press-fitted into the through hole 131 from above in FIG. 8A. .

That is, the optical wavelength conversion member 127 is press-fitted into the through hole 131 with the side of the light receiving surface 127 b having a smaller outer diameter of the optical wavelength conversion member 127 facing the through hole 131 .
Separately from this method, a tapered through hole 131 matching the outer shape of the light wavelength conversion member 127 is provided in the metal frame 125, and the light wavelength conversion member 127 is fitted into the through hole 131. It may be joined to the metal frame 125 with an adhesive or the like.
[10-3. effect]
The tenth embodiment has the same effect as the first embodiment. Further, in the tenth embodiment, compared with the first embodiment, the side surface 126 of the light wavelength conversion member 127 has a larger area in contact with the metal frame 125, so the heat dissipation from the light wavelength conversion member 127 to the metal frame 125 is improved. There is an effect that it is even better.

Further, when the optical wavelength conversion member 127 and the metal frame 125 are bonded by press-fitting or an adhesive agent, the contact area is widened, so that there is an effect of excellent bondability.
Furthermore, in the tenth embodiment, since the side surface 126 of the optical wavelength conversion member 127 is tapered, unevenness in heat dissipation is reduced over the entire circumference, and the temperature of the optical wavelength conversion member 127 becomes more uniform.

Furthermore, in the tenth embodiment, since the light-emitting side edge angle θ is an acute angle, the light-emitting surface 127a has a large area (light-emitting area) and the light emission intensity is high.
[10-4. Modification]
Also, FIG. 8C shows a modification in which the light-emitting side edge angle θ is an obtuse angle.

In this case, the tip side of the light wavelength conversion member 127 with a small outer diameter, that is, the side of the light emitting surface 127a having an obtuse edge angle θ on the light emitting side protrudes outward (upward in FIG. 8C) from the outer surface 125a of the metal frame 125. there is

Even in such a modified example, as described above, there is an effect that the heat dissipation from the light wavelength conversion member 107 to the metal frame 105 is further excellent.
Furthermore, since the light emitting side edge angle θ is an obtuse angle, the light wavelength converting member 127 falls off from the metal frame 125 when an external force is applied to the light wavelength converting member 127 from the light receiving surface 127b side toward the light emitting surface 127a side. are restrained from doing so. That is, there is an advantage that the fixing strength when the optical wavelength conversion member 127 is fixed to the metal frame 125 is improved.
[11. Experimental example]
Next, an experimental example conducted to confirm the effects of the present disclosure will be described.

<Experimental example 1>
Experimental Example 1 examines changes in chromaticity when a light wavelength conversion member is irradiated with laser light for an example of the present disclosure and a comparative example (not an example of the present disclosure).

In addition, chromaticity is chromaticity calculated|required by the chromaticity diagram using the XYZ color system of International Commission on Illumination (CIE).
As a sample of the present disclosure example, an optical wavelength conversion component similar to that of the first embodiment was used as follows.

As the light wavelength conversion member (that is, phosphor), a rectangular plate made of a ceramic sintered body was used as in the first embodiment. The dimensions of this light wavelength conversion member are length 1 mm×width 1 mm×thickness 0.22 mm.

As the light wavelength conversion member, a light wavelength conversion member in which the ratio of YAG (Y3Al5O12) in the ceramic sintered body is 30% by volume and the Ce concentration is 0.3 mol% with respect to Y in YAG was used ( The same applies to other experimental examples below).

As the metal frame, a rectangular frame-shaped plate made of Al was used as in the first embodiment. The dimensions of this metal frame are an outer diameter of 10 mm long×10 mm wide×0.2 mm thick, and an inner diameter of the through hole of 1 mm long×1 mm wide.

In the disclosed example, the outer surface of the light wavelength conversion member protrudes by 20 μm from the outer surface of the metal frame.
In Experimental Example 1, the optical wavelength conversion member of the sample was irradiated with a laser beam. Specifically, a laser device with an output of 3 W (output density: 30 W/mm ² ) was used, and laser light was repeatedly irradiated 1000 times. In other words, the light emission and extinguishing of the light wavelength conversion member were repeated.

As a laser device, a device that generates blue LD light with a wavelength of 465 nm was used, and the laser light irradiation time was 10 minutes.
Then, the chromaticity of light output from each sample was measured with a color illuminance meter.

As a result, the chromaticity change rate was less than 1% in the optical wavelength conversion component of the example of the present disclosure (that is, the optical wavelength conversion member with the outer surface protruding from the outer surface of the metal frame).
In Experimental Example 1, the chromaticity when the light wavelength conversion member was similarly irradiated with a laser beam was used as a reference, and the ratio of the chromaticity changed from the reference (that is, the laser light was applied to the light wavelength conversion member alone, which is the reference). The ratio of the change in the chromaticity of the light emitted from the light wavelength conversion component when the light wavelength conversion component is irradiated with laser light to the chromaticity of the light emitted from the light wavelength conversion component itself when light is irradiated) is the color degree change rate.

Further, as Comparative Example 1, a light wavelength conversion component having a metal frame and a light wavelength conversion member having the same thickness was produced, and irradiated with a laser beam in the same manner as described above to determine the rate of change in chromaticity.
As a result, in the case of Comparative Example 1, the rate of change in chromaticity was as large as 5%.

Furthermore, as Comparative Example 2, an optical wavelength conversion component having a metal frame having a thickness larger than that of the optical wavelength conversion member (that is, the metal frame is 20 μm thicker than the optical wavelength conversion member) was manufactured, and a laser beam was emitted in the same manner as described above. After irradiation, the rate of change in chromaticity was determined.

As a result, in the case of Comparative Example 2, the rate of change in chromaticity was as large as 10%.
From this experimental result, it can be seen that in the case of the example of the present disclosure, the change in chromaticity is smaller than in Comparative Examples 1 and 2, which is preferable.

<Experimental example 2>
In Experimental Example 2, changes in emission intensity due to temperature quenching of the optical wavelength conversion member were examined for the disclosed example and the comparative example.

As a sample of the present disclosure example, an optical wavelength conversion component similar to that of the first embodiment was used as described below.
As the light wavelength conversion member, a rectangular plate made of a ceramic sintered body was used as in the first embodiment. The dimensions of this light wavelength conversion member are length 1 mm×width 1 mm×thickness 0.22 mm.

As the metal frame, a rectangular frame-shaped plate made of Al was used as in the first embodiment. The dimensions of this metal frame are an outer diameter of 10 mm long×10 mm wide×0.2 mm thick, and an inner diameter of the through hole of 1 mm long×1 mm wide.

In the disclosed example, the outer surface of the light wavelength conversion member protrudes by 20 μm from the outer surface of the metal frame.
In Experimental Example 2, the light wavelength conversion member of the sample was irradiated with a laser beam, and the emission intensity was measured.

Specifically, a device that generates blue LD light with a wavelength of 465 nm was used as a laser device for irradiating laser light, and the laser light was applied for 1 minute at an output of 5 W (therefore, output density: 50 W/mm ² ). Then, the light output from the opposite side of the light wavelength conversion member was condensed by a lens, and the emitted light intensity was measured by a power sensor.

As a comparative example, a light wavelength conversion member without a metal frame was irradiated with laser light in the same manner as described above, and the emission intensity was measured.
In this experimental result, when the emission intensity in the example of the present disclosure is taken as 100%, the emission intensity in the comparative example was 75%.

From this experimental result, it can be seen that temperature quenching is less likely to occur in the example of the present disclosure than in the comparative example.
<Experimental example 3>
In Experimental Example 3, changes in the chromaticity of light output from the optical wavelength conversion component were examined for the disclosed example and the comparative example.

In the same manner as in Experimental Example 2, laser light was applied to the optical wavelength conversion component of the present disclosure example having a shape similar to that of the first, second, and fourth embodiments. As a result, in the examples of the present disclosure, although the metal frame expanded during light emission, the surface of the metal frame in the thickness direction did not swell more than the surface of the light wavelength conversion member in the thickness direction (that is, the projecting portion). rice field.

On the other hand, in the case of the comparative example in which both surfaces in the thickness direction of the light wavelength conversion member are on the same plane as both surfaces of the metal frame, the metal frame expands during light emission, and the surface in the thickness direction of the metal frame becomes It swelled more than the surface of the light wavelength conversion member in the thickness direction.

As for the chromaticity, the example of the present disclosure was suitable because the rate of change in chromaticity was smaller than that of the comparative example.
<Experimental example 4>
Experimental Example 4 examines the temperature quenching of optical wavelength conversion members having different light-emitting side edge angles θ in the sample of the present disclosure example.

In Experimental Example 4, as shown in FIG. 9, a rectangular plate made of a ceramic sintered body of the same material as in the first embodiment was used as the light wavelength conversion member (141). The dimensions of this light wavelength conversion member are length 1 mm×width 1 mm×thickness 0.22 mm. The vertical and horizontal dimensions are the dimensions of the side (that is, the light receiving surface) in contact with the light emitting element (143), and the shape and dimensions of the light receiving surface are the same for each sample (the same applies hereinafter).

As the metal frame (145), a rectangular frame-shaped plate material made of Al was used as in the first embodiment. The dimensions of this metal frame are an outer diameter of 10 mm long×10 mm wide×0.20 mm thick.
In this Experimental Example 4, a square plate made of a ceramic sintered body of the same material as in the first embodiment and a square frame-shaped plate made of Al similar to that in the first embodiment were tested. As an example sample, a sample of an optical wavelength conversion component similar to that of the tenth embodiment was produced. That is, as shown in FIG. 9, seven kinds of samples (Nos. 5 to 11) were prepared in which the edge angle θ (that is, the edge angle θ on the light emitting side) was changed every 5° within the range of 105° to 75°. did.

Then, the optical wavelength conversion member of each sample of Experimental Example 4 was irradiated with a laser beam. Specifically, the output of the laser device that irradiates the laser light (therefore, the output density) was gradually increased, and the output of the laser device at which temperature quenching occurred was determined.

As a laser device, a device that generates blue LD light with a wavelength of 465 nm was used, and the output of the laser device was increased in steps of 0.1 W starting from 0.5 W. The holding time of the laser output in each step was 5 minutes.

The results are shown in the laser output column of FIG. The numerical value of the laser output [W] shown in FIG. 9 is the laser output at which the optical wavelength conversion member could emit light without temperature quenching in each sample. As is clear from FIG. 9, the smaller or larger the emission-side edge angle θ from 90°, the more the heat dissipation from the light wavelength conversion member to the metal frame is improved, and the effect that temperature quenching is less likely to occur can be obtained. .

<Experimental example 5>
In Experimental Example 5, the same samples (Nos. 5 to 11) as in Experimental Example 4 were used to examine the strength of the edge portions.

Specifically, as shown in FIG. 10, the light wavelength conversion component (155) is placed on the substrate (153) with the side from which the light wavelength conversion member (151) protrudes downward, and is pressed by a press machine. The light wavelength conversion member was pressed downward from the light emitting element arrangement side (upper side) of the light wavelength conversion member, and the light wavelength conversion member was punched out from the metal frame (157).

Then, it was examined whether chipping occurred in the edge portion of each sample (more specifically, the edge portion having an angle of 90° or less among the edge portions) when punched out. Specifically, 100 samples for the experiment were prepared for each sample, punched out, and the number of cracks among the 100 samples was investigated.

The results are shown in FIG. In FIG. 11, less than 3 pieces out of 100 pieces are indicated by "◯", and 3 to 5 pieces are indicated by "Δ".
As is clear from FIG. 11, when the light-emitting side edge angle .theta. That is, the strength of the light wavelength conversion member is large, which is preferable.

<Experimental example 6>
In Experimental Example 6, the same samples (Nos. 5 to 11) as in Experimental Example 4 were used to examine the emission intensity of the light wavelength conversion member.

Specifically, the light wavelength conversion member of each sample was irradiated with laser light. Specifically, the output of a laser device for irradiating laser light was set constant (for example, 3 W), and the intensity of light output from each sample (emission intensity) was determined. Specifically, the output light was condensed by a lens, and its emission intensity was measured by a power sensor.

The results are shown in FIG. In FIG. 12, the luminescence intensity of each sample is shown as a percentage relative to 100% of the luminescence intensity of a light wavelength conversion component having a light-emitting side edge angle θ of 90°.

As is clear from FIG. 12, when the area of the light-receiving surface is the same, it is possible to obtain the effect that the smaller the light-emitting side edge angle θ, the higher the light emission intensity.
<Experimental example 7>
In Experimental Example 7, the same samples (Nos. 5 to 11) as in Experimental Example 4 were used to examine the fixing strength of the light wavelength conversion member.

Specifically, in the same manner as in Experimental Example 5, the light wavelength conversion member was punched out from the metal frame using a pressing machine. Then, the maximum strength (maximum pressure) when each sample was punched was examined.
The results are shown in FIG. As is clear from FIG. 13, it is possible to obtain the effect that the maximum pressure (and thus the fixing strength) increases as the light-emitting side edge angle θ increases.

Therefore, when comprehensively judging the experimental results of Experimental Examples 4 to 7 described above, it can be seen that the light emitting side edge angle θ in the range of 85° to 95° is generally most preferable when the areas of the light receiving surfaces are the same. .
In other words, this range is preferable because edge portion intensity, emission intensity, and fixation intensity are high.
[12. Other embodiments]
The present disclosure is by no means limited to the above-described embodiments, and it goes without saying that various aspects can be implemented without departing from the scope of the present disclosure.

(1) Applications of light wavelength conversion parts and light emitting devices include various uses such as phosphors, light wavelength conversion devices, headlamps, lighting, and optical devices such as projectors.
(2) The light wavelength conversion member is not limited to the ceramic sintered body described above, and various ceramic sintered bodies having higher hardness than the metal frame can be used.

(3) The metal frame is not limited to Al or Al alloy, and various materials having higher thermal conductivity and lower hardness than the light wavelength conversion member can be used.
(4) The configuration of the optical wavelength conversion component that supports the optical wavelength conversion member of the metal frame is not limited to the configurations of the above-described embodiments, and various configurations are possible.

For example, as shown in FIGS. 14A and 14B, optical wavelength changing parts 161 and 171 of the application example, another frame member 163 made of metal, for example, is attached to the outer periphery of the metal frame 13 to which the optical wavelength conversion member 11 is fixed. 173 may be integrated and fixed by bonding or the like.

The direction in which the optical wavelength converting member 11 of the optical wavelength transforming component 161 protrudes is upward in FIG. 14A, and the protruding direction of the optical wavelength converting member 11 in the optical wavelength transforming component 171 is downward in FIG. 14B.
Further, for example, as shown in FIG. 14C, an optical wavelength changing component 181 of still another application example, the metal frame 13 and the optical wavelength conversion member 11 arranged in the through hole 19 of the metal frame 13 are combined with a brazing material. You may fix integrally by joining using a etc.

The direction in which the light wavelength converting member 11 of the light wavelength transforming component 181 protrudes is downward in FIG. 14C.
(5) In addition, in the tenth embodiment and its modification described above, the side surface 126 of the light wavelength conversion member 127 is inclined when the light emitting surface 127a side, which is one surface, protrudes from the outer surface 125a of the metal frame 125. However, in a mode in which the light receiving surface 127b side, which is the other surface of the light wavelength conversion member 127, protrudes from the inner surface 125b of the metal frame 125, the side surface 126 of the light wavelength conversion member 127 is inclined. It is good also as a form with. Also in this form, the same effects as described above can be obtained.

Furthermore, both the light emitting surface 127a side, which is one surface of the light wavelength conversion member 127, and the light receiving surface 127b side, which is the other surface, protrude from the outer surface 125a and the inner surface 125b of the metal frame 125. 3, the side surface 126 of the light wavelength conversion member 127 may be inclined.

(6) It should be noted that the function of one component in each of the above embodiments may be assigned to a plurality of components, or the function of a plurality of components may be performed by one component. Also, part of the configuration of each of the above embodiments may be omitted. Also, at least a part of the configuration of each of the above embodiments may be added, replaced, or the like with respect to the configuration of another embodiment. It should be noted that all aspects included in the technical idea specified by the wording in the claims are embodiments of the present disclosure.

1, 31, 41, 51, 111, 121... Light emitting device 5, 143... Light emitting element 9, 43, 53, 61, 71, 81, 91, 101, 121, 129, 131, 161, 171, 181... Light wavelength Conversion parts 11, 127, 141 Optical wavelength conversion member 13, 83, 93, 125, 145 Metal frame 19, 95, 131 Through hole 23, 97 Opening 25 Inner circumference 27 Outer circumference

Claims (9)

an optical wavelength conversion member that converts the wavelength of light and has one surface and the other surface;
a frame-shaped metal frame surrounding the light wavelength conversion member and having a through hole;
with
The optical wavelength conversion member is fixed to the metal frame, and the one surface and the other surface of the optical wavelength conversion member themselves are located on one side and the other side of the through hole in the penetrating direction, respectively. It is arranged to be on the side,
Furthermore, at least one of the one surface and the other surface of the optical wavelength conversion member protrudes from the surface of the metal frame in the penetrating direction,
optical wavelength conversion components ,
A method for manufacturing an optical wavelength conversion component for manufacturing
arranging the optical wavelength conversion member at a position facing the opening of the through hole of the metal frame, and arranging the outer peripheral portion of the optical wavelength conversion member so as to overlap with the inner peripheral portion of the metal frame;
pressing the optical wavelength conversion member into the through hole of the metal frame to crush the inner peripheral portion of the metal frame with the outer peripheral portion of the optical wavelength conversion member;
having
A method for manufacturing an optical wavelength conversion component. the optical wavelength conversion member is in direct contact with the metal frame in the through hole;
A method for manufacturing an optical wavelength conversion component according to claim 1 . A side surface of the optical wavelength conversion member that is in contact with an inner peripheral surface forming the through hole of the metal frame is inclined with respect to the one surface of the optical wavelength conversion member,
3. A method for manufacturing an optical wavelength conversion component according to claim 1. The side surface of the optical wavelength conversion member is tapered with respect to the one surface of the optical wavelength conversion member,
4. A method for manufacturing an optical wavelength conversion component according to claim 3. The angle between the one surface of the optical wavelength conversion member and the side surface of the metal frame of the optical wavelength conversion member in contact with the inner peripheral surface forming the through hole is in the range of 80° or more and 100° or less. is
A method for manufacturing an optical wavelength conversion component according to any one of claims 1 to 4. The angle between the one surface of the light wavelength conversion member and the side surface of the light wavelength conversion member is in the range of 85° or more and 95° or less.
6. A method for manufacturing an optical wavelength conversion component according to claim 5. The material constituting the metal frame is at least one metal selected from Al, Cu, Ni, and Fe, or a metal composite or alloy containing the at least one metal.
A method for manufacturing an optical wavelength conversion component according to any one of claims 1 to 6. The material constituting the metal frame is Al or an Al alloy,
8. A method for manufacturing an optical wavelength conversion component according to claim 7. After crushing the inner peripheral portion of the metal frame with the outer peripheral portion of the optical wavelength conversion member, further pushing the optical wavelength conversion member into the through hole of the metal frame to pierce the metal frame;
having
A method for manufacturing an optical wavelength conversion component according to any one of claims 1 to 8 .

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