JP7029340B2 - フィルタ装置及びプラズマ処理装置 - Google Patents
フィルタ装置及びプラズマ処理装置 Download PDFInfo
- Publication number
- JP7029340B2 JP7029340B2 JP2018077094A JP2018077094A JP7029340B2 JP 7029340 B2 JP7029340 B2 JP 7029340B2 JP 2018077094 A JP2018077094 A JP 2018077094A JP 2018077094 A JP2018077094 A JP 2018077094A JP 7029340 B2 JP7029340 B2 JP 7029340B2
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- coil
- coils
- filter device
- simulations
- central axis
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32577—Electrical connecting means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
- H01J37/32706—Polarising the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
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- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Filters And Equalizers (AREA)
- Filtering Of Dispersed Particles In Gases (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Description
<第1のシミュレーションの設定>
コイル6001の各々のコイル長:114mm
コイル6001の各々の巻線部の断面形状:10mm×1mmの平角形状(幅×厚み)
コイル6001の各々の巻線部の内径:114mm
コイル6001の各々の巻線部のターン間ピッチ:8mm
コイル6001の各々の外周面とフレーム6401との間の径方向の距離:13mm
コイル6001の各々に接続するコンデンサの静電容量:5600pF
<第3~第6のシミュレーションの共通設定>
コイル6003Aの巻線部の形状:3mm×9mmの平角形状
コイル6003Aの巻線部の内径:65mm
コイル6003Aの巻線部のターン間ピッチ:17.5mm
コイル6003Aに接続するコンデンサの静電容量:5600pF
コイル6003Bの巻線部の形状:3mm×9mmの平角形状
コイル6003Bの巻線部の内径:74mm
コイル6003Bの巻線部のターン間ピッチ:25.5mm
コイル6003Bに接続するコンデンサの静電容量:5600pF
コイル6003Cの巻線部の形状:3mm×9mmの平角形状
コイル6003Cの巻線部の内径:83mm
コイル6003Cの巻線部のターン間ピッチ:33.5mm
コイル6003Cの外周面とフレーム6403との間の径方向の距離:13mm
コイル6003Cに接続するコンデンサの静電容量:5600pF
<第3のシミュレーションの設定>
コイル6003Aのコイル長:122.5mm
コイル6003Bのコイル長:124.45mm
コイル6003Cのコイル長:126.21mm
コイル6003Cのコイル長とコイル6003Aのコイル長の差の、コイル6003Aのコイル長に対する割合:3%
<第4のシミュレーションの設定>
コイル6003Aのコイル長:122.5mm
コイル6003Bのコイル長:125.4mm
コイル6003Cのコイル長:128.7mm
コイル6003Cのコイル長とコイル6003Aのコイル長の差の、コイル6003Aのコイル長に対する割合:5%
<第5のシミュレーションの設定>
コイル6003Aのコイル長:122.5mm
コイル6003Bのコイル長:128.5mm
コイル6003Cのコイル長:133.4mm
コイル6003Cのコイル長とコイル6003Aのコイル長の差の、コイル6003Aのコイル長に対する割合:9%
<第6のシミュレーションの設定>
コイル6003Aのコイル長:122.5mm
コイル6003Bのコイル長:136.5mm
コイル6003Cのコイル長:147mm
コイル6003Cのコイル長とコイル6003Aのコイル長の差の、コイル6003Aのコイル長に対する割合:20%
<第7~第9のシミュレーションの共通設定>
コイル6007Aのコイル長:122.5mm
コイル6007Aの巻線部の形状:3mm×13.5mmの平角形状
コイル6007Aの巻線部の内径:65mm
コイル6007Aの巻線部のターン間ピッチ:17.5mm
コイル6007Aに接続するコンデンサの静電容量:5600pF
コイル6007Bのコイル長:125mm
コイル6007Bの巻線部の形状:3mm×16mmの平角形状
コイル6007Bの巻線部の内径:74mm
コイル6007Bの巻線部のターン間ピッチ:20mm
コイル6007Bに接続するコンデンサの静電容量:5600pF
コイル6007Cのコイル長:123.2mm
コイル6007Cの巻線部の形状:3mm×18mmの平角形状
コイル6007Cの巻線部の内径:83mm
コイル6007Cの巻線部のターン間ピッチ:22mm
コイル6007Cの外周面とフレーム6407との間の径方向の距離:13mm
コイル6007Cに接続するコンデンサの静電容量:5600pF
<第10~第13のシミュレーションの共通設定>
コイル6010の各々のコイル長:114mm
コイル6010の各々の巻線部の形状:10mm×1mmの平角形状
コイル6010の各々の巻線部の内径:114mm
コイル6010の各々の巻線部のターン間ピッチ:8mm
コイル6010の各々の外周面とフレームとの間の径方向の距離:13mm
コイル6010の各々に接続するコンデンサの静電容量:5600pF
<第14~第18のシミュレーションの共通設定>
コイル群CG1のコイル60の各々のコイル長:152mm
コイル群CG1のコイル60の各々の形状:3mm×0.8mmの平角形状
コイル群CG1のコイル60の各々の内径:51mm
コイル群CG1のコイル60の各々のターン間ピッチ:16mm
コイル群CG1の軸線方向において隣り合うターン間の間隙の距離:2mm
コイル群CG1の各コイル60に接続するコンデンサの静電容量:5600pF
コイル群CG2のコイル60の各々のコイル長:152mm
コイル群CG2のコイル60の各々の形状:3mm×0.8mmの平角形状
コイル群CG2のコイル60の各々の内径:60mm
コイル群CG2のコイル60の各々のターン間ピッチ:18.5mm
コイル群CG2の軸線方向において隣り合うターン間の間隙の距離:5.5mm
コイル群CG2の各コイル60に接続するコンデンサの静電容量:5600pF
コイル群CG3のコイル60の各々のコイル長:152mm
コイル群CG3のコイル60の各々の形状:3mm×0.8mmの平角形状
コイル群CG3のコイル60の各々の内径:69mm
コイル群CG3のコイル60の各々のターン間ピッチ:21mm
コイル群CG3の軸線方向において隣り合うターン間の間隙の距離:12mm
コイル群CG3のコイル60の各々の外周面とフレーム64との間の径方向の距離:13mm
コイル群CG3の各コイル60に接続するコンデンサの静電容量:5600pF
<第19~第23のシミュレーションの共通設定>
コイル6019Aのコイル長:122mm
コイル6019Aの巻線部の内径:65mm
コイル6019Aの巻線部のターン間ピッチ:17.5mm
コイル6019Aに接続するコンデンサの静電容量:5600pF
コイル6019Bのコイル長:122mm
コイル6019Bに接続するコンデンサの静電容量:5600pF
コイル6019Cのコイル長:122mm
コイル6019Cの外周面とフレーム6419との間の径方向の距離:13mm
コイル6019Cに接続するコンデンサの静電容量:5600pF
<第19のシミュレーションの設定>
コイル6019Aの巻線部の形状:3mm×9mmの平角形状
コイル6019Bの巻線部の形状:3mm×9mmの平角形状
コイル6019Bの巻線部の内径:74mm
コイル6019Bの巻線部のターン間ピッチ:20mm
コイル6019Cの巻線部の形状:3mm×9mmの平角形状
コイル6019Cの巻線部の内径:83mm
コイル6019Cの巻線部のターン間ピッチ:22mm
<第20のシミュレーションの設定>
コイル6019Aの巻線部の形状:6mm×9mmの平角形状
コイル6019Bの巻線部の形状:6mm×9mmの平角形状
コイル6019Bの巻線部の内径:80mm
コイル6019Bの巻線部のターン間ピッチ:21.1mm
コイル6019Cの巻線部の形状:6mm×9mmの平角形状
コイル6019Cの巻線部の内径:95mm
コイル6019Cの巻線部のターン間ピッチ:24.5mm
<第21のシミュレーションの設定>
コイル6019Aの巻線部の形状:12mm×9mmの平角形状
コイル6019Bの巻線部の形状:12mm×9mmの平角形状
コイル6019Bの巻線部の内径:92mm
コイル6019Bの巻線部のターン間ピッチ:23.9mm
コイル6019Cの巻線部の形状:12mm×9mmの平角形状
コイル6019Cの巻線部の内径:119mm
コイル6019Cの巻線部のターン間ピッチ:29.8mm
<第22のシミュレーションの設定>
コイル6019Aの巻線部の形状:18mm×9mmの平角形状
コイル6019Bの巻線部の形状:18mm×9mmの平角形状
コイル6019Bの巻線部の内径:104mm
コイル6019Bの巻線部のターン間ピッチ:26.6mm
コイル6019Cの巻線部の形状:18mm×9mmの平角形状
コイル6019Cの巻線部の内径:143mm
コイル6019Cの巻線部のターン間ピッチ:34.7mm
<第23のシミュレーションの設定>
コイル6019Aの巻線部の形状:24mm×9mmの平角形状
コイル6019Bの巻線部の形状:24mm×9mmの平角形状
コイル6019Bの巻線部の内径:116mm
コイル6019Bの巻線部のターン間ピッチ:29.2mm
コイル6019Cの巻線部の形状:24mm×9mmの平角形状
コイル6019Cの巻線部の内径:167mm
コイル6019Cの巻線部のターン間ピッチ:39.3mm
<第24~第27のシミュレーションの共通設定>
コイル6024の各々の巻数:14.25ターン
コイル6024の各々の巻線部の形状10mm×1mmの平角形状
コイル6024の各々の巻線部の内径:114mm
コイル6024の各々の巻線部のターン間ピッチ:8mm
コイル6024の各々の外周面とフレームとの間の径方向の距離:13mm
コイル6024の各々に接続するコンデンサの静電容量:5600pF
Claims (9)
- 複数のコイルと、
前記複数のコイルとグランドとの間にそれぞれ接続された複数のコンデンサと、
電気的に接地されており、前記複数のコイルをその中に収容したフレームと、
を備え、
前記複数のコイルは、各々が二以上のコイルを含む複数のコイル群を構成し、
前記複数のコイル群の各々において、前記二以上のコイルは、それぞれの巻線部が中心軸線の周りで螺旋状に延在し、且つ、それぞれのターンが該中心軸線が延びる軸線方向に沿って順に且つ繰り返し配列されるように、設けられており、
前記複数のコイル群は、前記中心軸線に対して同軸に設けられており、
前記複数のコイル群のうち任意の一つのコイル群の前記二以上のコイルの各々のターン間のピッチは、前記複数のコイル群のうち該一つのコイル群よりも内側に設けられたコイル群の前記二以上のコイルの各々のターン間のピッチよりも、大きく、
前記複数のコイルのターン間のピッチは、該複数のコイルのインダクタンスが略同一となるように設定されている、
フィルタ装置。 - 前記複数のコイルは、略同一のコイル長を有する、請求項1に記載のフィルタ装置。
- 前記複数のコイルのうち最大のコイル長を有するコイルと最小のコイル長を有するコイルとの間のコイル長の差は、該最小のコイル長の3%以下である、請求項2に記載のフィルタ装置。
- 前記複数のコイルの巻線部は、一端及び前記複数のコンデンサ側の他端をそれぞれ有しており、該複数のコイルの該巻線部の該一端は、前記中心軸線に直交する面に沿って設けられている、請求項2又は3に記載のフィルタ装置。
- 前記複数のコイルは、該複数のコイルの前記巻線部の前記一端から前記軸線方向に沿って延びる引出線を有し、
前記複数のコイル群の各々において、前記二以上のコイルの前記引出線は、前記中心軸線に対して周方向に、等間隔に設けられている、
請求項4に記載のフィルタ装置。 - 前記複数のコイルの前記引出線は、前記中心軸線に対して90°以上270°以下の角度を有する角度範囲内に設けられている、請求項5に記載のフィルタ装置。
- 前記複数のコイル群のうち径方向において隣り合う任意の二つのコイル群の間の間隙の該径方向における距離は、1.5mm以下である、請求項1~6の何れか一項に記載のフィルタ装置。
- 前記複数のコイル群のうち最も外側に設けられたコイル群の前記二以上のコイルの内径は、前記複数のコイル群のうち最も内側に設けられたコイル群の前記二以上のコイルの内径の1.83倍以下である、請求項1~7の何れか一項に記載のフィルタ装置。
- チャンバ本体と、
前記チャンバ本体内に設けられたステージであって、下部電極及び複数のヒータを有する、該ステージと、
前記下部電極に電気的に接続された高周波電源と、
前記複数のヒータに電力を与えるためのヒータコントローラと、
請求項1~8の何れか一項に記載のフィルタ装置と、
を備え、
前記フィルタ装置の複数のコイルの各々は、前記複数のヒータのうち対応のヒータと前記ヒータコントローラとの間で電気的に接続されている、
プラズマ処理装置。
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