JP7009306B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP7009306B2 JP7009306B2 JP2018097133A JP2018097133A JP7009306B2 JP 7009306 B2 JP7009306 B2 JP 7009306B2 JP 2018097133 A JP2018097133 A JP 2018097133A JP 2018097133 A JP2018097133 A JP 2018097133A JP 7009306 B2 JP7009306 B2 JP 7009306B2
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- JP
- Japan
- Prior art keywords
- chuck table
- suction
- unit
- cutting
- valve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Gripping On Spindles (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Confectionery (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Description
17 吸着ユニット
18 テーブルベース
19 吸引ポンプ(吸引源)
20 チャックテーブル
60 切削ユニット
61 切削ブレード
72 制御ユニット
73 開閉バルブ制御部
74 判定部
81 主吸引路(吸引路)
81A 一端
81B 他端
82 分岐点
83 第1分岐路
83A 一端
83B 他端
84 第2分岐路
84A 一端
84B 他端
85 第1開閉バルブ
86 第2開閉バルブ
87 圧力センサ(圧力計)
100 ウエーハ(被加工物)
120 ポーラスチャックテーブル
121 テーブル本体
122 吸着部
122A 保持面
150 判定機構
200 パッケージ基板(被加工物)
220 ジグチャックテーブル
221 保持治具
222 治具ベース
223 樹脂シート
223A 保持面
224 逃げ溝
225 吸引孔
Claims (2)
- 被加工物を吸引保持するチャックテーブルがテーブルベースに交換可能に固定される吸着ユニットと、該チャックテーブルに保持された被加工物を切削する切削ユニットと、該チャックテーブルに被加工物が載置されているか否かを判定する判定機構と、を備え、該チャックテーブルは、ポーラス面で被加工物を吸引保持するポーラスチャックテーブルと、保持面に形成された吸引開口で被加工物を吸引保持するジグチャックテーブルとから選択される切削装置であって、
該吸着ユニットは、
一端が吸引源に接続し、他端が第1開閉バルブを介して分岐点に接続する吸引路と、
一端が該分岐点に接続し、他端が該テーブルベースに接続して該チャックテーブルの保持面に負圧を作用させる第1分岐路と、
一端が該分岐点に接続し、他端が該テーブルベースに接続して該チャックテーブルの保持面に負圧を作用させる第2分岐路と、を備え、
該判定機構は、
該第1分岐路に設けられる第2開閉バルブと、
該第1分岐路の該第2開閉バルブと該テーブルベースとの間に設けられ該第1分岐路の圧力を測定する圧力計と、
該第1開閉バルブを開いた状態で、該圧力計で測定される負圧が基準値に至らない場合、該チャックテーブルに被加工物が載置されていないと判定する判定部と、
該ポーラスチャックテーブルが該テーブルベースに固定された状態において、該判定部で判定する際に、該第2開閉バルブを閉じる開閉バルブ制御部と、を備える切削装置。 - 該吸引源は、吸引ポンプである請求項1に記載の切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018097133A JP7009306B2 (ja) | 2018-05-21 | 2018-05-21 | 切削装置 |
KR1020190044210A KR102647455B1 (ko) | 2018-05-21 | 2019-04-16 | 절삭 장치 |
TW108116989A TWI809103B (zh) | 2018-05-21 | 2019-05-16 | 切割裝置 |
CN201910413392.7A CN110517973B (zh) | 2018-05-21 | 2019-05-17 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018097133A JP7009306B2 (ja) | 2018-05-21 | 2018-05-21 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019202353A JP2019202353A (ja) | 2019-11-28 |
JP7009306B2 true JP7009306B2 (ja) | 2022-01-25 |
Family
ID=68622596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018097133A Active JP7009306B2 (ja) | 2018-05-21 | 2018-05-21 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7009306B2 (ja) |
KR (1) | KR102647455B1 (ja) |
CN (1) | CN110517973B (ja) |
TW (1) | TWI809103B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111976041A (zh) * | 2020-07-13 | 2020-11-24 | 大同新成新材料股份有限公司 | 用于半导体石墨晶圆的加工处理装置及其加工方法 |
KR20230135661A (ko) * | 2021-03-18 | 2023-09-25 | 토와 가부시기가이샤 | 가공 장치 및 가공품의 제조 방법 |
JP7464575B2 (ja) | 2021-12-14 | 2024-04-09 | Towa株式会社 | 切断装置、及び切断品の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6027605A (en) | 1998-05-22 | 2000-02-22 | Raines Technologies, Inc. | Plasma etching apparatus and method and apparatus for verifying a wafer |
JP2002517088A (ja) | 1998-05-27 | 2002-06-11 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | 半導体ウエハハンドリング用バッチ式エンドエフェクタ |
JP4851282B2 (ja) | 2006-09-21 | 2012-01-11 | 株式会社ディスコ | 切削装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4851282U (ja) | 1971-10-15 | 1973-07-04 | ||
JP3705670B2 (ja) * | 1997-02-19 | 2005-10-12 | 株式会社荏原製作所 | ポリッシング装置及び方法 |
US6960813B2 (en) * | 2002-06-10 | 2005-11-01 | New Wave Research | Method and apparatus for cutting devices from substrates |
GB2403847B (en) * | 2003-07-01 | 2005-11-16 | Micron Technology Inc | Optical channels for multi-level metal optical imagers and method for manufacturing same |
JP2009043771A (ja) * | 2007-08-06 | 2009-02-26 | Disco Abrasive Syst Ltd | チャックテーブル機構および被加工物の保持方法 |
JP5617065B2 (ja) * | 2011-09-09 | 2014-11-05 | 東京エレクトロン株式会社 | 剥離方法、プログラム、コンピュータ記憶媒体及び剥離システム |
KR102022754B1 (ko) * | 2012-06-15 | 2019-09-18 | 가부시키가이샤 토쿄 세이미쯔 | 다이싱 장치 및 다이싱 방법 |
JP6358564B2 (ja) * | 2012-11-30 | 2018-07-18 | 株式会社ニコン | 搬送システム、露光装置、搬送方法、露光方法及びデバイス製造方法、並びに吸引装置 |
JP6815138B2 (ja) * | 2016-09-06 | 2021-01-20 | 株式会社ディスコ | 吸引保持システム |
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2018
- 2018-05-21 JP JP2018097133A patent/JP7009306B2/ja active Active
-
2019
- 2019-04-16 KR KR1020190044210A patent/KR102647455B1/ko active IP Right Grant
- 2019-05-16 TW TW108116989A patent/TWI809103B/zh active
- 2019-05-17 CN CN201910413392.7A patent/CN110517973B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6027605A (en) | 1998-05-22 | 2000-02-22 | Raines Technologies, Inc. | Plasma etching apparatus and method and apparatus for verifying a wafer |
JP2002517088A (ja) | 1998-05-27 | 2002-06-11 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | 半導体ウエハハンドリング用バッチ式エンドエフェクタ |
JP4851282B2 (ja) | 2006-09-21 | 2012-01-11 | 株式会社ディスコ | 切削装置 |
Also Published As
Publication number | Publication date |
---|---|
CN110517973B (zh) | 2023-08-15 |
KR20190132917A (ko) | 2019-11-29 |
TWI809103B (zh) | 2023-07-21 |
JP2019202353A (ja) | 2019-11-28 |
TW202004880A (zh) | 2020-01-16 |
KR102647455B1 (ko) | 2024-03-13 |
CN110517973A (zh) | 2019-11-29 |
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