JP7071839B2 - Bonding equipment - Google Patents

Description

The present invention relates to a bonding apparatus.

In the manufacture of semiconductor devices, a chip bonding method in which a wafer in which a large number of elements are built together is diced and separated into individual semiconductor chips, and these are bonded one by one to a predetermined position such as a lead frame. Has been adopted. A die bonder (bonding device) (for example, Patent Document 1) is used for this chip bonding.

As shown in FIG. 4, the die bonder picks up the chip 2 cut out from the wafer 1 (see FIG. 5) at the pickup position P and transfers (mounts) it to the bonding position Q of the substrate 3 such as a lead frame. Is. The wafer 1 is divided (divided) into a large number of chips 2 by a dicing process. Therefore, the chips 2 are arranged in a matrix as shown in FIG.

As shown in FIG. 4, this die bonder includes a collet (adsorption collet) 4. The collet 4 is a moving mechanism (not shown), and is used to ascend in the arrow A direction and descend in the arrow B direction on the pickup position P, and ascend in the arrow C direction and descend in the arrow D direction on the bonding position Q. , Reciprocating movement in the directions of arrows E and F between the pickup position P and the bonding position Q is possible. In the movement mechanism, the movement of the arrows A, B, C, D, E, and F is controlled by a control means composed of, for example, a microcomputer or the like. The moving mechanism can be configured by various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear motor mechanism.

The suction collet 4 includes a head 6 having a suction hole 5 that opens on the lower surface thereof, the chip 2 is vacuum-sucked through the suction hole 5, and the chip 2 is sucked on the lower end surface (tip surface) of the head 6. When this vacuum suction (evacuation) is released, the tip 2 comes off from the head 6.

Further, the wafer 1 divided (divided) into a large number of chips 2 is arranged on, for example, an XYθ table 8 (see FIG. 6), and a push-up means provided with a push-up pin is arranged on the XYθ table 8. That is, the tip 2 to be picked up is pushed up from below by the pushing-up means, and easily peeled off from the adhesive sheet. In this state, the chip 2 is adsorbed on the adsorbing collet 4 that has descended.

That is, after the collet 4 is positioned above the chip to be picked up, the collet 4 is lowered as shown by the arrow B to pick up the chip 2. After that, the collet 4 is raised as shown by the arrow A.

Next, the collet 4 is moved in the direction of the arrow E to be positioned above the island portion, and then the collet 4 is moved downward as shown by the arrow D to supply the chip 2 to the island portion. After supplying the chip 2 to the island portion, the collet is raised as shown by the arrow C and then returned to the standby position above the pip-up position as shown by the arrow F.

That is, by sequentially moving the collet 4 as shown by arrows A, E, D, C, F, and B, the chip 2 is picked up by the collet 4 at the pickup position, and the chip 2 is transferred to the chip 2 at the bonding position. It will be implemented.

By the way, semiconductor chips include surface mount chips having a large number of bump electrodes. In such a chip, it is necessary to turn the bump electrode upside down and bond it to the island portion (electrode) of the substrate from the state where the bump electrode faces upward. Therefore, some bonding devices (die bonders) are provided with a reversing mechanism (Patent Document 1).

As shown in FIG. 6, the die bonder of Patent Document 2 has a pickup head 12 to which a collet 11 for adsorbing a die (chip) 2 on a wafer 1 is attached to the tip thereof, and a collet 13 that receives the chip 2 from the pickup head 12. The bonding head 14 is provided. A reversing mechanism 15 is arranged on the pickup head 12, and the reversing mechanism 15 reverses the pickup head 12 by 180 °. Further, a push-up unit 16 that pushes up the chip 2 when picking up the chip 2 is arranged at a lower position of the wafer 1.

After the die (chip) 2 is attracted by the collet 11 of the pickup head 12, the collet 11 is raised and moved horizontally to a predetermined position. After that, the pickup head 12 is inverted by 180 °. That is, the chip 2 whose back surface faces downward is oriented so that the back surface faces upward. In this state, the collet 13 of the bonding head 14 sucks the chip 2 and conveys it to the bonding position. Then, the chip 2 is bonded to the substrate 3.

JP-A-2015-177038

The die bonder (bonding device) shown in FIG. 4 is a single operation mode in which the chip 2 is picked up by the suction collet 4 attached to the pickup head and the chip 2 sucked by the suction collet 4 is bonded to the substrate 3. Further, in the bonding device shown in FIG. 6, the chip 2 is picked up by the pickup head 12, the collet 11 of the pickup head 12 is inverted at a predetermined position, and the inverted chip 2 is delivered to the collet 13 of the bonding head 14. After that, it is a single operation mode in which the bonding head 14 bonds to the substrate 3.

As described above, the conventional bonding apparatus includes a device for bonding the chip 2 without inverting it and a device for bonding the chip 2 with the chip 2 inverted, and each operates in a single operation mode. For this reason, each configuration assumes only a single operation mode, and the arrangement position of each configuration unit is fixed.

If you want to change the operation mode, for example, if you want to change the operation mode that is not inverted to the operation mode that is inverted, or if you want to change the operation mode that is inverted to the operation mode that is not inverted, replace or arrange each component unit. It was necessary to make changes and change the control software. Therefore, it has been difficult to optimize the production conditions for a plurality of types of products.

In view of the above problems, the present invention can switch the operation mode, can bond without inverting the chip, can bond by inverting the chip, and optimize production conditions for a plurality of types of products. To provide a bonding apparatus that enables the above.

The bonding device of the present invention is a bonding device that picks up a work at a pickup position, conveys the picked up work to a bonding position, and bonds the work at the bonding position, and holds the pickup head and the bonding head together. The direct mode in which the work is picked up at the pickup position by the bonding head and the work is bonded at the bonding position, and the work picked up at the pickup position by the pickup head is reversed and the inverted work is used as the bonding head. It has a flip mode for bonding at the bonding position, and it is possible to switch between the direct mode and the flip mode. Switching between the work non-recognition mode and the work recognition mode in the direct mode, and the work non-recognition mode and the work in the flip mode. It is possible to switch to the recognition mode, and the work recognition mode in the direct mode and flip mode is performed by the lower imaging mechanism that allows camera imaging from the lower position of the transported workpiece between the pickup position and the bonding position. In the flip mode, the camera image pickup from the lower position by the lower image pickup mechanism and the camera image pickup by the upper image pickup mechanism from the upper position of the transported work are possible, and the lower image pickup mechanism has a work non-recognition mode. In, a retracting mechanism for retracting from the lower position of the work to a position that does not interfere with the movement of each head is connected , and the upper image pickup mechanism is in a position that does not interfere with the movement of each head from the upper position of the work in the work non-recognition mode. A retracting mechanism for retracting to is connected .

According to the bonding apparatus of the present invention, the work can be supplied from the pickup position to the bonding position without being inverted, and the work can be inverted and supplied from the pickup position to the bonding position. Further, each direct mode and flip mode has a work non-recognition mode and a work recognition mode. Moreover, each mode can be switched.

In the bonding apparatus of the present invention, the direct mode can be set to the work non-recognition mode or the work recognition mode, and the flip mode can be set to the work non-recognition mode or the work recognition mode. That is, in the direct mode, if the work non-recognition mode is set, the work can be bonded without inverting the work and without recognizing the work. Further, in the direct mode, if the work recognition mode is set, the work can be recognized and then bonded without inverting the work. In the flip mode, if the work non-recognition mode is set, the work can be inverted and the work can be bonded without being recognized. Further, in the flip mode, if the work recognition mode is set, the work can be inverted, the inverted work can be recognized, and then bonding can be performed.

In the work recognition mode, it can be configured to be performed by a lower image pickup mechanism capable of taking a camera image from a lower position of the conveyed work between the pickup position and the bonding position. In such a lower imaging mechanism, the work can be imaged by a camera from below. Therefore, in the direct mode, the back surface of the work faces downward, so that the back surface of the work can be observed. In the flip mode, the back surface of the work can be observed. In the state before the transfer to the bonding head, the surface of the work faces downward, so that the surface of the work can be observed.

It is preferable that the lower imaging mechanism is connected to a retracting mechanism for retracting from the lower position of the workpiece in the work non-recognition mode. When the retracting mechanism is connected in this way, the retracting mechanism can be retracted from the lower position of the workpiece in the work non-recognition mode, so that the lower imaging mechanism does not interfere with the operation of the pickup head or the bonding head. Therefore, the pickup head and the bonding head can be operated at a low position, and the chip bonding operation can be speeded up.

The work recognition mode can be configured to perform camera imaging from an upper position of the conveyed workpiece between the pickup position and the bonding position by an upper imaging mechanism. In such an upper image pickup mechanism, since the camera image can be taken from above, the back surface of the work inverted via the pickup head can be observed before being transferred to the bonding head in the flip mode.

In the present invention, it is possible to switch between the direct mode and the flip mode, and further, in each mode of the direct mode and the flip mode, it is possible to switch between the work non-recognition mode and the work recognition mode, respectively. It is possible to respond to different production conditions (accuracy, takt time, recognition reference position, etc.) depending on the product. That is, at least two types of bonding operations can be performed with one device, it is easy to optimize production conditions for a plurality of types of products, and it is excellent in versatility.

It is a simplified block diagram of the die bonder of this invention. The direct mode of the present invention is shown, (a) is a simplified diagram of a state in which the lower imaging mechanism is retracted, and (b) is a simplified diagram of a state in which the lower imaging mechanism is not retracted. The flip mode of the present invention is shown, (a) is a simplified diagram of a state in which the lower imaging mechanism is not retracted, and (b) is a simplified diagram of a state in which the lower imaging mechanism is retracted. It is a simplified diagram of a conventional die bonder. It is a simplified perspective view which shows the chip. It is a simplified diagram of another conventional die bonder.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 4. 2 and 3 show a die bonder (bonding device: a semiconductor device manufacturing device) according to the present invention. In such a bonding device, the chip (semiconductor chip) 21 cut out from the wafer is picked up at the pickup position P and transferred (mounted) to the bonding position Q of the substrate 22 such as a lead frame. The wafer is adhered to a wafer sheet stretched on a metal ring (wafer ring), and is divided (divided) into a large number of chips 21 by a dicing process.

As shown in FIG. 1, this die bonder includes a pickup head 25 and a bonding head 26. The pickup head 25 is provided with a suction collet 27 (see FIG. 3) at its tip, and the chip 21 can be picked up by the suction collet 27 at the pickup position P and the chip 21 can be inverted. Similarly, the bonding head 26 also has a suction collet 28 (see FIG. 3) at its tip. The adsorption collets 27 and 28 may be simply referred to as collets 27 and 28 below.

The pickup head 25 is supported by a pickup arm (not shown), and the pickup arm is driven by a moving mechanism (moving means 30) (see FIG. 1) so that the collet 27 of the pickup head 25 is on the pickup position P. , Ascending and descending on the bonding position Q and between the pickup position P and the bonding position Q, and reciprocating between the pickup position P and the bonding position Q are possible.

The bonding head 26 is supported by a bonding arm (not shown), and the bonding arm is driven by a moving mechanism (moving means 31) (see FIG. 1) so that the collet 28 of the bonding head 26 is on the pickup position P. Ascending and descending at, ascending and descending on the bonding position Q, and reciprocating movement between the pickup position P and the bonding position Q are possible.

The movement of each of the moving means 30 and 31 is controlled by the control means 32. The moving means 30 and 31 can be configured by various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear motor mechanism, respectively. The control means 32 is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus centering on a CPU (Central Processing Unit). The ROM stores programs and data executed by the CPU.

Each collet 27, 28 is formed with a suction hole (not shown) that opens in the suction surface 27a, 28a, which is the lower surface, and a vacuum generator (not shown) is connected to the suction hole. Therefore, if the suction surfaces 27a and 28a of the collets 27 and 28 are brought into contact with the tip 21 and the vacuum generator is driven, the air in the suction holes is sucked and the tip 21 is sucked on the suction surfaces 27a and 28a. Can be done. The vacuum generator may be a vacuum generator using a vacuum pump or an ejector type vacuum generator composed of basic parts called a nozzle and a diffuser.

Further, as shown in FIG. 1, the pickup head 25 is provided with a reversing mechanism 33 for reversing the collet 27. The reversing mechanism 33 includes a reversing shaft and a driving unit such as a motor that rotationally drives the reversing shaft. That is, the collet 27 can be switched between a state in which the suction surface 27a faces downward and a state in which the suction surface 27a faces upward.

By the way, in this die bonder, a lower imaging mechanism 35 is arranged between the pickup position P and the bonding position Q, as shown in FIGS. 2 and 3. The lower image pickup mechanism 35 includes an image recognition camera 36 including a CCD camera, a CMOS camera, or the like that captures the chip 21 from below at a predetermined position between the pickup position P and the bonding position Q, and the lower image pickup mechanism 35. As shown in FIG. 1, the mechanism 35 is connected to a retracting mechanism 37 that retracts from the lower position of the work (chip 21). The retracting mechanism 37 can be configured by various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear motor mechanism, and is controlled by the control means 32.

Retracting the lower image pickup mechanism 35 from the lower position means moving the lower image pickup mechanism 35 along the horizontal direction to deviate from the transport locus of the chip 21. Moving along the horizontal direction means moving in a direction orthogonal to the drawing in FIG. 2 and the like, and does not move in the vertical direction. FIG. 2A shows a standby state of the lower image pickup mechanism 35, and FIG. 2B shows a state in which the chip 21 can be imaged by the lower image pickup mechanism 35.

Further, in this die bonder, an upper imaging mechanism 38 capable of imaging the chip 21 from above is arranged in a state where the chip 21 is inverted. The upper image pickup mechanism 38 includes an image recognition camera 39 including a CCD camera, a CMOS camera, and the like that image the chip 21 from above. Further, the upper image pickup mechanism 38 is connected to a retracting mechanism 40 for retracting from the upper position of the work (chip 21). The retracting mechanism 40 can be configured by various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear motor mechanism, and is controlled by the control means 32.

In this die bonder, the work (chip 21) is picked up at the pickup position by the bonding head 26, and the work (chip 21) is bonded at the bonding position Q, and the work (chip 21) is picked up at the pickup position P by the pickup head 25. It has a flip mode in which the work (chip 21) is inverted, the inverted work (chip 21) is transferred to the bonding head 26, and the work (chip 21) is bonded at the bonding position. 2 (a) and 2 (b) show a direct mode, and FIGS. 3 (a) and 3 (b) show a flip mode.

In the direct mode shown in FIG. 2A, the bonding head 26 is used to bond the chip 21 picked up at the pickup position P by the suction collet 28 of the bonding head 26 at the bonding position Q of the substrate 22. In this case, the lower imaging mechanism 35 is retracted via the retracting mechanism 37. That is, the work non-recognition mode of the lower imaging mechanism 35 is set.

As in the direct mode shown in FIG. 2A, the direct mode shown in FIG. 2B uses the bonding head 26 to pick up the chip 21 picked up at the pickup position P by the suction collet 28 of the bonding head 26. , Bonding is performed at the bonding position Q of the substrate 22. In this case, the lower image pickup mechanism 35 is not retracted. Therefore, the bonding head 26 is stopped at the upper position R of the lower imaging mechanism 35. In this state, the chip 21 adsorbed on the collet 28 can be imaged by the lower imaging mechanism 35. In this case, since the chip 21 is not inverted, the back surface of the chip 21 can be imaged. That is, the work recognition mode of the lower imaging mechanism 35 is set.

In the flip mode shown in FIG. 3A, the tip 21 is sucked by the suction collet 27 of the pickup head 25 at the pickup position P, and then the suction collet 27 is inverted to invert the chip 21. That is, the back surface of the chip 21 is facing upward. In this state, the chip 21 with the back surface facing upward can be sucked by the suction collet 27 of the bonding head 26, moved to the bonding head 26, and bonded to the bonding position of the substrate 22. As described above, in the flip mode, the chip 21 is not bonded by the pickup head 25. Therefore, the pickup head 25 only needs to be able to convey the chip 21 to the position where the chip 21 is delivered to the bonding head 26. There is no need to move to the bonding position Q.

In the state shown in FIG. 3A, the lower image pickup mechanism 35 is not retracted. Therefore, the bonding head 26 is stopped at the upper position R of the lower imaging mechanism 35. In this state, the chip 21 adsorbed on the collet 27 can be imaged by the lower imaging mechanism 35. In this case, since the chip 21 is inverted, the surface of the chip 21 can be imaged. That is, the work recognition mode of the lower imaging mechanism 35 is set.

Similar to the flip mode shown in FIG. 3A, the flip mode shown in FIG. 3B sucks the tip 21 by the suction collet 27 of the pickup head 25 at the pickup position P, and then inverts the suction collet 27. The chip 21 is inverted. Therefore, the back surface of the chip 21 is in a state of facing upward, and in this state, the back surface of the chip 21 can be imaged from above by the upper imaging mechanism 38. After that, the chip 21 can be delivered to the suction collet 28 of the bonding head 26 from below, and can be bonded to the bonding position of the substrate 22 by the bonding head 26. In this case, the lower imaging mechanism 35 is in a retracted state and is in the work non-recognition mode of the lower imaging mechanism 35, but the upper imaging mechanism 38 is not retracted and is in the work recognition mode of the upper imaging mechanism 38. ..

Since the retracting mechanism 40 is also connected to the upper imaging mechanism 38, the upper imaging mechanism 38 can be retracted via the retracting mechanism 40 when the inverted chip is not imaged. In this case, the retracted position is a position that does not interfere with the operation of the heads 25 and 26.

As described above, in this die bonder, the direct mode shown in FIG. 2, the flip mode shown in FIG. 3, the work recognition mode of the lower image pickup mechanism 35, the work non-recognition mode of the lower image pickup mechanism 35, and the upper image pickup mechanism 38. It has a work recognition mode and a work non-recognition mode of the upper imaging mechanism 38. Therefore, the control means 32 controls so that these modes can be switched arbitrarily.

In the present invention, it is possible to switch between the direct mode and the flip mode, and further, in each mode of the direct mode and the flip mode, it is possible to switch between the work non-recognition mode and the work recognition mode, respectively. It is possible to respond to different production conditions (accuracy, takt time, recognition reference position, etc.) depending on the product. That is, at least two types of bonding operations can be performed with one device, it is easy to optimize production conditions for a plurality of types of products, and it is excellent in versatility.

The switching of each mode can be switched by the control means 32, and in this case, the mode to be combined can be easily realized only by changing on each software. Further, in a device equipped with a lower imaging mechanism, the chip 21 as a work can be imaged by a camera from below. Therefore, in the direct mode, the back surface of the chip 21 faces downward, so that the back surface of the chip 21 can be observed. In the flip mode, the surface of the chip 21 faces downward, so that the surface of the chip 21 can be observed.

When the retracting mechanism 37 is connected, the work (chip 21) can be retracted from the lower position in the work non-recognition mode, so that the lower imaging mechanism 35 interferes with the operation of the pickup head 25 and the bonding head 26. do not. Therefore, when the lower imaging mechanism 35 is retracted, the amount of increase of the suction collets 27 and 28 can be suppressed, and the reciprocating time between the pickup position P and the bonding position Q can be shortened. Therefore, the speed of the chip bonding operation can be increased.

Since the camera having the upper image pickup mechanism 38 can take an image from above, the back surface of the chip 21 is in a state where the back surface of the chip 21 is facing upward before being transferred to the bonding head in the flip mode. Can be observed from above.

The present invention is not limited to the above embodiment, and various modifications can be made. For example, the retracting mechanism 37 for retracting the lower imaging mechanism 35 and the retracting mechanism 40 for retracting the upper imaging mechanism 38 are omitted. You can do it. That is, when the retracting mechanism 37 is omitted, the lower imaging mechanism 35 remains arranged at a predetermined position, and when the retracting mechanism 40 is omitted, the upper imaging mechanism 38 remains arranged at a predetermined position. Further, in the above embodiment, the reversing mechanism 33 of the pickup head 25, the moving means 30 of the pickup head 25, the evacuation mechanism 37 of the lower imaging mechanism 35, the evacuation mechanism 40 of the upper imaging mechanism 38, and the moving means 31 of the pickup head 25 are provided. Although it was controlled by one control means 32, it may be controlled by a plurality of control means.

In the direct mode of the embodiment, the bonding head 26 is used to perform the process from pickup to bonding of the chip 21, but the pickup head 25 may be used to perform the process from pickup to bonding without inverting the chip 21. good.

21 Chip 25 Pickup head 26 Bonding head 35 Lower image pickup mechanism 37 Evacuation mechanism 38 Upper image pickup mechanism 40 Evacuation mechanism P Pickup position Q Bonding position

Claims (1)

A bonding device that picks up a work at a pickup position, conveys the picked up work to a bonding position, and bonds the work at that bonding position.
Equipped with a pickup head and a bonding head,
The direct mode in which the work is picked up at the pickup position by the bonding head and the work is bonded at the bonding position, and the work picked up at the pickup position by the pickup head is reversed and the inverted work is bonded by the bonding head. It has a flip mode for bonding at the position, and it is possible to switch between the direct mode and the flip mode. Switching between the work non-recognition mode and the work recognition mode in the direct mode, and the work non-recognition mode and the work recognition mode in the flip mode. The work recognition mode in the direct mode and flip mode is performed by the lower imaging mechanism that allows camera imaging from the lower position of the transported workpiece between the pickup position and the bonding position. In the flip mode, the camera image pickup from the lower position by the lower image pickup mechanism and the camera image pickup by the upper image pickup mechanism from the upper position of the transported work are possible, and the lower image pickup mechanism has the work non-recognition mode. A retracting mechanism that retracts from the lower position of the work to a position that does not interfere with the movement of each head is connected , and the upper image pickup mechanism is moved from the upper position of the work to a position that does not interfere with the operation of each head in the work non-recognition mode. A bonding device characterized in that a retracting mechanism for retracting is connected .

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