JP6838036B2 - Antiviral member - Google Patents
Antiviral member Download PDFInfo
- Publication number
- JP6838036B2 JP6838036B2 JP2018215699A JP2018215699A JP6838036B2 JP 6838036 B2 JP6838036 B2 JP 6838036B2 JP 2018215699 A JP2018215699 A JP 2018215699A JP 2018215699 A JP2018215699 A JP 2018215699A JP 6838036 B2 JP6838036 B2 JP 6838036B2
- Authority
- JP
- Japan
- Prior art keywords
- antimicrobial
- binder
- cured product
- copper
- antiviral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000000840 anti-viral effect Effects 0.000 title claims description 117
- 239000011230 binding agent Substances 0.000 claims description 270
- 239000000463 material Substances 0.000 claims description 122
- 229920005989 resin Polymers 0.000 claims description 90
- 239000011347 resin Substances 0.000 claims description 90
- 239000005749 Copper compound Substances 0.000 claims description 31
- 150000001880 copper compounds Chemical class 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 30
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 238000004140 cleaning Methods 0.000 claims description 14
- 230000000845 anti-microbial effect Effects 0.000 description 275
- 239000000047 product Substances 0.000 description 153
- 239000004599 antimicrobial Substances 0.000 description 104
- 239000000203 mixture Substances 0.000 description 100
- 239000010949 copper Substances 0.000 description 98
- 239000000758 substrate Substances 0.000 description 56
- 241000700605 Viruses Species 0.000 description 47
- 229910052802 copper Inorganic materials 0.000 description 43
- 239000003505 polymerization initiator Substances 0.000 description 43
- 239000007921 spray Substances 0.000 description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 35
- 238000005507 spraying Methods 0.000 description 34
- 238000012360 testing method Methods 0.000 description 33
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 31
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 30
- 239000002612 dispersion medium Substances 0.000 description 29
- 238000013461 design Methods 0.000 description 28
- -1 copper alkoxide Chemical class 0.000 description 27
- 230000000052 comparative effect Effects 0.000 description 26
- 244000005700 microbiome Species 0.000 description 26
- 229920000877 Melamine resin Polymers 0.000 description 24
- 230000000844 anti-bacterial effect Effects 0.000 description 24
- 230000000843 anti-fungal effect Effects 0.000 description 21
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- 239000000243 solution Substances 0.000 description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 18
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 18
- 239000004925 Acrylic resin Substances 0.000 description 16
- 239000003595 mist Substances 0.000 description 16
- 239000003054 catalyst Substances 0.000 description 15
- 229910044991 metal oxide Inorganic materials 0.000 description 15
- 150000004706 metal oxides Chemical class 0.000 description 15
- 239000000178 monomer Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 229940121375 antifungal agent Drugs 0.000 description 14
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 13
- 239000012965 benzophenone Substances 0.000 description 13
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 12
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 235000019441 ethanol Nutrition 0.000 description 12
- 239000003999 initiator Substances 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 12
- 239000004332 silver Substances 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- 238000001035 drying Methods 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 10
- 125000000217 alkyl group Chemical group 0.000 description 10
- 238000011081 inoculation Methods 0.000 description 10
- 238000005259 measurement Methods 0.000 description 10
- 229910052697 platinum Inorganic materials 0.000 description 10
- 229910052725 zinc Inorganic materials 0.000 description 10
- 239000011701 zinc Substances 0.000 description 10
- 150000003839 salts Chemical class 0.000 description 9
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 9
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 125000000524 functional group Chemical group 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 7
- 229910021536 Zeolite Inorganic materials 0.000 description 7
- 150000001298 alcohols Chemical class 0.000 description 7
- 230000001580 bacterial effect Effects 0.000 description 7
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 239000000395 magnesium oxide Substances 0.000 description 7
- 239000002609 medium Substances 0.000 description 7
- 229920000573 polyethylene Polymers 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- 239000000725 suspension Substances 0.000 description 7
- 239000010457 zeolite Substances 0.000 description 7
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 6
- 229920000178 Acrylic resin Polymers 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000004640 Melamine resin Substances 0.000 description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 6
- 229920000180 alkyd Polymers 0.000 description 6
- 230000001747 exhibiting effect Effects 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 230000000813 microbial effect Effects 0.000 description 6
- 229920001225 polyester resin Polymers 0.000 description 6
- 239000004645 polyester resin Substances 0.000 description 6
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N 1-propanol Substances CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 5
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical class N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000004568 cement Substances 0.000 description 5
- 150000004699 copper complex Chemical class 0.000 description 5
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 5
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 230000001771 impaired effect Effects 0.000 description 5
- 229910021645 metal ion Inorganic materials 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 229940100890 silver compound Drugs 0.000 description 5
- 150000003379 silver compounds Chemical class 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 150000003752 zinc compounds Chemical class 0.000 description 5
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 4
- 241000894006 Bacteria Species 0.000 description 4
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 239000004115 Sodium Silicate Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 238000001856 aerosol method Methods 0.000 description 4
- 239000003443 antiviral agent Substances 0.000 description 4
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 4
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 4
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 description 4
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 4
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 4
- 229910052911 sodium silicate Inorganic materials 0.000 description 4
- 238000004611 spectroscopical analysis Methods 0.000 description 4
- 239000002023 wood Substances 0.000 description 4
- WVAFEFUPWRPQSY-UHFFFAOYSA-N 1,2,3-tris(ethenyl)benzene Chemical compound C=CC1=CC=CC(C=C)=C1C=C WVAFEFUPWRPQSY-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 241000228245 Aspergillus niger Species 0.000 description 3
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 241000191967 Staphylococcus aureus Species 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000013068 control sample Substances 0.000 description 3
- 150000001879 copper Chemical class 0.000 description 3
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 3
- 238000006356 dehydrogenation reaction Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 229910052809 inorganic oxide Inorganic materials 0.000 description 3
- 239000010954 inorganic particle Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000004753 textile Substances 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 230000009385 viral infection Effects 0.000 description 3
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 2
- HWJUQYXDQBOQHL-UHFFFAOYSA-N 1-decyl-3-[4-[(1-decylpyridin-1-ium-3-yl)methoxy]butoxymethyl]pyridin-1-ium Chemical compound CCCCCCCCCC[N+]1=CC=CC(COCCCCOCC=2C=[N+](CCCCCCCCCC)C=CC=2)=C1 HWJUQYXDQBOQHL-UHFFFAOYSA-N 0.000 description 2
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 2
- IJALWSVNUBBQRA-UHFFFAOYSA-N 4-Isopropyl-3-methylphenol Chemical compound CC(C)C1=CC=C(O)C=C1C IJALWSVNUBBQRA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- GHXZTYHSJHQHIJ-UHFFFAOYSA-N Chlorhexidine Chemical compound C=1C=C(Cl)C=CC=1NC(N)=NC(N)=NCCCCCCN=C(N)N=C(N)NC1=CC=C(Cl)C=C1 GHXZTYHSJHQHIJ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 239000005750 Copper hydroxide Substances 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- 241000588724 Escherichia coli Species 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000004996 alkyl benzenes Chemical class 0.000 description 2
- 239000012871 anti-fungal composition Substances 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000003429 antifungal agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 238000000889 atomisation Methods 0.000 description 2
- CUFNKYGDVFVPHO-UHFFFAOYSA-N azulene Chemical compound C1=CC=CC2=CC=CC2=C1 CUFNKYGDVFVPHO-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- 239000003729 cation exchange resin Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229960003260 chlorhexidine Drugs 0.000 description 2
- 229910001956 copper hydroxide Inorganic materials 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- BJAIYGWDSCTVJT-UHFFFAOYSA-N copper;butan-1-olate Chemical compound [Cu+2].CCCC[O-].CCCC[O-] BJAIYGWDSCTVJT-UHFFFAOYSA-N 0.000 description 2
- GSCLWPQCXDSGBU-UHFFFAOYSA-L copper;phthalate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O GSCLWPQCXDSGBU-UHFFFAOYSA-L 0.000 description 2
- BDHAOBSBMMJNGS-UHFFFAOYSA-N copper;propan-1-olate Chemical compound [Cu+2].CCC[O-].CCC[O-] BDHAOBSBMMJNGS-UHFFFAOYSA-N 0.000 description 2
- 229940076286 cupric acetate Drugs 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- ACGUYXCXAPNIKK-UHFFFAOYSA-N hexachlorophene Chemical compound OC1=C(Cl)C=C(Cl)C(Cl)=C1CC1=C(O)C(Cl)=CC(Cl)=C1Cl ACGUYXCXAPNIKK-UHFFFAOYSA-N 0.000 description 2
- 229960004068 hexachlorophene Drugs 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 208000015181 infectious disease Diseases 0.000 description 2
- 229910017053 inorganic salt Inorganic materials 0.000 description 2
- 150000008040 ionic compounds Chemical class 0.000 description 2
- 229940035429 isobutyl alcohol Drugs 0.000 description 2
- NFIDBGJMFKNGGQ-UHFFFAOYSA-N isopropylmethylphenol Natural products CC(C)CC1=CC=CC=C1O NFIDBGJMFKNGGQ-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 150000007974 melamines Chemical class 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000879 optical micrograph Methods 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229940105570 ornex Drugs 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- 229960005323 phenoxyethanol Drugs 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000011941 photocatalyst Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- 238000000518 rheometry Methods 0.000 description 2
- 229960004889 salicylic acid Drugs 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- RRKODOZNUZCUBN-CCAGOZQPSA-N (1z,3z)-cycloocta-1,3-diene Chemical compound C1CC\C=C/C=C\C1 RRKODOZNUZCUBN-CCAGOZQPSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- CHHHXKFHOYLYRE-UHFFFAOYSA-M 2,4-Hexadienoic acid, potassium salt (1:1), (2E,4E)- Chemical compound [K+].CC=CC=CC([O-])=O CHHHXKFHOYLYRE-UHFFFAOYSA-M 0.000 description 1
- MWDGNKGKLOBESZ-UHFFFAOYSA-N 2-oxooctanal Chemical compound CCCCCCC(=O)C=O MWDGNKGKLOBESZ-UHFFFAOYSA-N 0.000 description 1
- 125000000590 4-methylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- KHZGUWAFFHXZLC-UHFFFAOYSA-N 5-methylhexane-2,4-dione Chemical compound CC(C)C(=O)CC(C)=O KHZGUWAFFHXZLC-UHFFFAOYSA-N 0.000 description 1
- 229920001817 Agar Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 241000224489 Amoeba Species 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 0 CC(CC(C)Oc1cc[n+](*)cc1)Oc1cc[n+](C)cc1 Chemical compound CC(CC(C)Oc1cc[n+](*)cc1)Oc1cc[n+](C)cc1 0.000 description 1
- 208000035473 Communicable disease Diseases 0.000 description 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 1
- 229920001410 Microfiber Polymers 0.000 description 1
- 102000016943 Muramidase Human genes 0.000 description 1
- 108010014251 Muramidase Proteins 0.000 description 1
- 108010062010 N-Acetylmuramoyl-L-alanine Amidase Proteins 0.000 description 1
- 241001263478 Norovirus Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 201000003176 Severe Acute Respiratory Syndrome Diseases 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- XEFQLINVKFYRCS-UHFFFAOYSA-N Triclosan Chemical compound OC1=CC(Cl)=CC=C1OC1=CC=C(Cl)C=C1Cl XEFQLINVKFYRCS-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 208000036142 Viral infection Diseases 0.000 description 1
- 235000008853 Zanthoxylum piperitum Nutrition 0.000 description 1
- 244000131415 Zanthoxylum piperitum Species 0.000 description 1
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 1
- MBHRHUJRKGNOKX-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)amino]methanol Chemical compound NC1=NC(N)=NC(NCO)=N1 MBHRHUJRKGNOKX-UHFFFAOYSA-N 0.000 description 1
- USDJGQLNFPZEON-UHFFFAOYSA-N [[4,6-bis(hydroxymethylamino)-1,3,5-triazin-2-yl]amino]methanol Chemical compound OCNC1=NC(NCO)=NC(NCO)=N1 USDJGQLNFPZEON-UHFFFAOYSA-N 0.000 description 1
- YGCOKJWKWLYHTG-UHFFFAOYSA-N [[4,6-bis[bis(hydroxymethyl)amino]-1,3,5-triazin-2-yl]-(hydroxymethyl)amino]methanol Chemical compound OCN(CO)C1=NC(N(CO)CO)=NC(N(CO)CO)=N1 YGCOKJWKWLYHTG-UHFFFAOYSA-N 0.000 description 1
- SYDYRFPJJJPJFE-UHFFFAOYSA-N [[4,6-bis[bis(hydroxymethyl)amino]-1,3,5-triazin-2-yl]amino]methanol Chemical compound OCNC1=NC(N(CO)CO)=NC(N(CO)CO)=N1 SYDYRFPJJJPJFE-UHFFFAOYSA-N 0.000 description 1
- SUPOBRXPULIDDX-UHFFFAOYSA-N [[4-amino-6-(hydroxymethylamino)-1,3,5-triazin-2-yl]amino]methanol Chemical compound NC1=NC(NCO)=NC(NCO)=N1 SUPOBRXPULIDDX-UHFFFAOYSA-N 0.000 description 1
- WEAJVJTWVRAPED-UHFFFAOYSA-N [[4-amino-6-[bis(hydroxymethyl)amino]-1,3,5-triazin-2-yl]-(hydroxymethyl)amino]methanol Chemical compound NC1=NC(N(CO)CO)=NC(N(CO)CO)=N1 WEAJVJTWVRAPED-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000008272 agar Substances 0.000 description 1
- 125000003172 aldehyde group Chemical group 0.000 description 1
- 125000004849 alkoxymethyl group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 206010064097 avian influenza Diseases 0.000 description 1
- 229960000686 benzalkonium chloride Drugs 0.000 description 1
- UREZNYTWGJKWBI-UHFFFAOYSA-M benzethonium chloride Chemical compound [Cl-].C1=CC(C(C)(C)CC(C)(C)C)=CC=C1OCCOCC[N+](C)(C)CC1=CC=CC=C1 UREZNYTWGJKWBI-UHFFFAOYSA-M 0.000 description 1
- 229960001950 benzethonium chloride Drugs 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- CADWTSSKOVRVJC-UHFFFAOYSA-N benzyl(dimethyl)azanium;chloride Chemical compound [Cl-].C[NH+](C)CC1=CC=CC=C1 CADWTSSKOVRVJC-UHFFFAOYSA-N 0.000 description 1
- YBHILYKTIRIUTE-UHFFFAOYSA-N berberine Chemical compound C1=C2CC[N+]3=CC4=C(OC)C(OC)=CC=C4C=C3C2=CC2=C1OCO2 YBHILYKTIRIUTE-UHFFFAOYSA-N 0.000 description 1
- 229940093265 berberine Drugs 0.000 description 1
- QISXPYZVZJBNDM-UHFFFAOYSA-N berberine Natural products COc1ccc2C=C3N(Cc2c1OC)C=Cc4cc5OCOc5cc34 QISXPYZVZJBNDM-UHFFFAOYSA-N 0.000 description 1
- WJXDCSSGTLPZDK-UHFFFAOYSA-M butane-1-thiolate;copper(1+) Chemical compound [Cu+].CCCC[S-] WJXDCSSGTLPZDK-UHFFFAOYSA-M 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001734 carboxylic acid salts Chemical class 0.000 description 1
- 229960001927 cetylpyridinium chloride Drugs 0.000 description 1
- NFCRBQADEGXVDL-UHFFFAOYSA-M cetylpyridinium chloride monohydrate Chemical compound O.[Cl-].CCCCCCCCCCCCCCCC[N+]1=CC=CC=C1 NFCRBQADEGXVDL-UHFFFAOYSA-M 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- RFKZUAOAYVHBOY-UHFFFAOYSA-M copper(1+);acetate Chemical compound [Cu+].CC([O-])=O RFKZUAOAYVHBOY-UHFFFAOYSA-M 0.000 description 1
- GDFGBZPSSUEBJH-UHFFFAOYSA-L copper(1+);oxalate Chemical compound [Cu+].[Cu+].[O-]C(=O)C([O-])=O GDFGBZPSSUEBJH-UHFFFAOYSA-L 0.000 description 1
- 229910000009 copper(II) carbonate Inorganic materials 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 1
- AEJIMXVJZFYIHN-UHFFFAOYSA-N copper;dihydrate Chemical compound O.O.[Cu] AEJIMXVJZFYIHN-UHFFFAOYSA-N 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000012258 culturing Methods 0.000 description 1
- 239000011646 cupric carbonate Substances 0.000 description 1
- 235000019854 cupric carbonate Nutrition 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 230000034994 death Effects 0.000 description 1
- 231100000517 death Toxicity 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- BEFDCLMNVWHSGT-UHFFFAOYSA-N ethenylcyclopentane Chemical compound C=CC1CCCC1 BEFDCLMNVWHSGT-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- ZFSXZJXLKAJIGS-UHFFFAOYSA-N halocarban Chemical compound C1=C(Cl)C(C(F)(F)F)=CC(NC(=O)NC=2C=CC(Cl)=CC=2)=C1 ZFSXZJXLKAJIGS-UHFFFAOYSA-N 0.000 description 1
- 229950006625 halocarban Drugs 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000004325 lysozyme Substances 0.000 description 1
- 235000010335 lysozyme Nutrition 0.000 description 1
- 229960000274 lysozyme Drugs 0.000 description 1
- 230000001404 mediated effect Effects 0.000 description 1
- NBTOZLQBSIZIKS-UHFFFAOYSA-N methoxide Chemical compound [O-]C NBTOZLQBSIZIKS-UHFFFAOYSA-N 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004682 monohydrates Chemical class 0.000 description 1
- VHDPPDRSCMVFAV-UHFFFAOYSA-N n,n-dimethylhexadecan-1-amine;hydrobromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[NH+](C)C VHDPPDRSCMVFAV-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 244000052769 pathogen Species 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-M phenolate Chemical compound [O-]C1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-M 0.000 description 1
- 229940031826 phenolate Drugs 0.000 description 1
- 150000007965 phenolic acids Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004302 potassium sorbate Substances 0.000 description 1
- 235000010241 potassium sorbate Nutrition 0.000 description 1
- 229940069338 potassium sorbate Drugs 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 description 1
- 239000004299 sodium benzoate Substances 0.000 description 1
- 235000010234 sodium benzoate Nutrition 0.000 description 1
- 239000008279 sol Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004334 sorbic acid Substances 0.000 description 1
- 235000010199 sorbic acid Nutrition 0.000 description 1
- 229940075582 sorbic acid Drugs 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- SLYPOVJCSQHITR-UHFFFAOYSA-N tioxolone Chemical compound OC1=CC=C2SC(=O)OC2=C1 SLYPOVJCSQHITR-UHFFFAOYSA-N 0.000 description 1
- 229960003070 tioxolone Drugs 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 229960003500 triclosan Drugs 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- Agricultural Chemicals And Associated Chemicals (AREA)
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- Polymerisation Methods In General (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
本発明は、抗微生物部材に関する。 The present invention relates to antimicrobial components.
近年、病原体である種々の微生物を媒介とした感染症が短時間で急激に広がる、いわゆる「パンデミック」が問題になっており、SARS(重症急性呼吸器症候群)や、ノロウィルス、鳥インフルエンザ等のウィルス感染による死者も報告されている。 In recent years, so-called "pandemics", in which infectious diseases mediated by various microorganisms that are pathogens spread rapidly in a short time, have become a problem, such as SARS (Severe Acute Respiratory Syndrome), norovirus, and bird flu. Deaths from viral infections have also been reported.
そこで、様々のウィルスに対して抗ウィルス活性を発揮する抗ウィルス剤の開発が活発に行われており、実際に様々な部材に抗ウィルス活性を有するPd等の金属や有機化合物からなる抗ウィルス剤を含む樹脂等を塗布したり、抗ウィルス剤が担持された材料を含む部材を製造することが行われている。 Therefore, antiviral agents that exert antiviral activity against various viruses are being actively developed, and antiviral agents composed of metals such as Pd and organic compounds that actually have antiviral activity on various members. It is practiced to apply a resin or the like containing the above-mentioned material, or to manufacture a member containing a material on which an antiviral agent is carried.
特許文献1には、基材表面に複数の抗菌金属アイランドを形成することにより抗菌活性を付与した抗菌性基材が開示されている。 Patent Document 1 discloses an antibacterial base material to which antibacterial activity is imparted by forming a plurality of antibacterial metal islands on the surface of the base material.
しかしながら、特許文献1に記載された抗菌性基材では、平均直径が5〜500nmの抗菌金属アイランドが基材表面に固定されていることが開示されているが、スパッタにて抗菌金属を付着させているにすぎず、表面を布等でふき取り清掃すると、抗菌、抗ウィルス活性が低下してしまうという問題があった。 However, in the antibacterial base material described in Patent Document 1, although it is disclosed that antibacterial metal islands having an average diameter of 5 to 500 nm are fixed to the surface of the base material, the antibacterial metal is adhered by sputtering. However, if the surface is wiped clean with a cloth or the like, there is a problem that the antibacterial and antiviral activities are lowered.
本発明は、このような問題に鑑みてなされたものであり、ふき取り清掃した場合でも単位担持量当たりの抗微生物活性が高い抗微生物部材を提供することを目的とする。 The present invention has been made in view of such a problem, and an object of the present invention is to provide an antimicrobial member having high antimicrobial activity per unit carrier amount even when wiped and cleaned.
本発明の抗微生物部材は、基材表面に抗微生物成分を含むバインダ硬化物が固着形成されてなり、前記バインダ硬化物は、基材表面の55%を超え、95%以下の範囲を被覆していることを特徴とする。 In the antimicrobial member of the present invention, a cured binder containing an antimicrobial component is fixedly formed on the surface of the base material, and the cured binder covers a range of more than 55% and 95% or less of the surface of the base material. It is characterized by being.
本発明の抗微生物部材における、抗微生物とは、抗ウィルス、抗菌、抗カビ、防カビを含む概念である。従って、抗微生物成分とは、抗ウィルス成分、抗菌成分、抗カビ成分、防カビ成分を含む概念であり、抗微生物剤とは、抗ウィルス剤、抗菌剤、抗カビ剤、防カビ剤を含む概念であり、抗微生物組成物とは、抗ウィルス性組成物、抗菌組成物、抗カビ組成物、防カビ組成物を含む概念である。 The antimicrobial component in the antimicrobial member of the present invention is a concept including antiviral, antibacterial, antifungal, and antifungal. Therefore, the antimicrobial component is a concept including an antiviral component, an antibacterial component, an antifungal component, and an antifungal component, and the antimicrobial agent includes an antiviral agent, an antibacterial agent, an antifungal agent, and an antifungal agent. It is a concept, and the antimicrobial composition is a concept including an antiviral composition, an antibacterial composition, an antifungal composition, and an antifungal composition.
本明細書において、上記抗微生物部材は、抗ウィルス、抗菌、抗カビ及び防カビのうちいずれか1種の活性を示す部材であってもよく、抗ウィルス、抗菌、抗カビ及び防カビのうち、いずれか2種類の活性を示す部材であってもよく、いずれか3種類の活性を示す部材であってもよく、4種類全ての活性を示す部材であってもよい。
本発明の抗微生物部材における抗微生物特性の中で、特に抗ウィルス、抗カビに有効であり、抗ウィルスが最も高い活性を持つ。
In the present specification, the antimicrobial member may be a member exhibiting any one of antiviral, antibacterial, antifungal and antifungal activity, and among antiviral, antibacterial, antifungal and antifungal members. , A member exhibiting any two types of activity, a member exhibiting any three types of activity, or a member exhibiting all four types of activity.
Among the antimicrobial properties of the antimicrobial member of the present invention, it is particularly effective for antiviral and antifungal, and the antiviral has the highest activity.
本発明の抗微生物部材では、基材表面に抗微生物成分を含むバインダ硬化物が固着形成されてなり、上記バインダ硬化物は、基材表面の55%を超え、95%以下の範囲を被覆しているので、バインダ硬化物により構成される凸状部分が相対的に少なくなり、摩耗により欠損しにくくなるため、ふき取り清掃などで基材表面からの引きはがしの力や摩擦がバインダ硬化物に加わった場合でも、バインダ硬化物が基材表面から失われることがなく、単位担持量当たりの抗微生物活性が高い抗微生物部材を提供することができる。
バインダ硬化物の凹凸面をふき取り清掃すると、凸部分に集中的に摩擦の力が加わり、凸部分が欠損しやすくなるのであるが、本発明では、バインダ硬化物の被覆率が高く平坦化されるため、凸部分の相対量が減り、その結果、摩耗によりバインダ硬化物が欠損することを抑制できるのである。
本発明では、単位担持量当たりの抗微生物活性を高くできるため、必要最小限の抗微生物組成物で十分な抗微生物性能を実現できるのである。
In the antimicrobial member of the present invention, a binder cured product containing an antimicrobial component is fixedly formed on the surface of the base material, and the binder cured product covers a range of more than 55% and 95% or less of the base material surface. Therefore, the convex part composed of the hardened binder is relatively small, and it is difficult to be damaged by wear. Therefore, the force and friction of peeling from the surface of the base material are applied to the hardened binder by wiping and cleaning. Even in this case, the cured binder is not lost from the surface of the base material, and an antimicrobial member having high antimicrobial activity per unit carrying amount can be provided.
When the uneven surface of the cured binder is wiped off and cleaned, a frictional force is concentrated on the convex portion, and the convex portion is likely to be damaged. However, in the present invention, the coverage of the cured binder is high and flattened. Therefore, the relative amount of the convex portion is reduced, and as a result, it is possible to prevent the binder cured product from being lost due to wear.
In the present invention, since the antimicrobial activity per unit loading amount can be increased, sufficient antimicrobial performance can be realized with the minimum necessary antimicrobial composition.
本明細書において、バインダ硬化物は、基材表面の55%を超え、95%以下を覆っており、バインダ硬化物が形成されたバインダ硬化物形成領域と、バインダ硬化物が形成されていないバインダ硬化物非形成領域と、が混在した状態であればよい。すなわち、バインダ硬化物は、基材表面の一部を露出するように、基材表面に固着形成されているのである。バインダ硬化物は島状に形成されていてもよく、また、上記バインダ硬化物が基材表面に固着形成された領域とバインダ硬化物が固着形成されていない領域が混在して設けられた状態であってもよい。 In the present specification, the binder cured product covers more than 55% and 95% or less of the surface of the base material, and the binder cured product forming region in which the binder cured product is formed and the binder in which the binder cured product is not formed are formed. It suffices as long as it is in a state where the cured product non-forming region and the cured product non-forming region are mixed. That is, the binder cured product is fixedly formed on the surface of the base material so as to expose a part of the surface of the base material. The cured binder may be formed in an island shape, and a region in which the cured binder is fixedly formed on the surface of the base material and a region in which the cured binder is not fixedly formed are provided in a mixed state. There may be.
島状とは、基材表面のバインダ硬化物が他のバインダ硬化物と接触しない孤立した状態で存在していることをいう。島状に散在しているバインダ硬化物の形状は特に限定されず、その輪郭を平面視した際、円形、楕円形等の曲線から構成される形状であってもよく、多角形等の形状であってもよく、円形、楕円形等が細い部分を介して繋がり合ったような形状であってもよく、アメーバ状のようなものでもよい。また、島同士が互いに入り組んで接触することなく隣接していてもよい。
また、上記バインダ硬化物は、膜状に形成され、その膜状のバインダ硬化物の形成領域内に硬化物が形成されていない領域が混在して設けられた状態のバインダ硬化物と、島状に形成されたバインダ硬化物が混在していてもよい。
The island shape means that the cured binder on the surface of the base material exists in an isolated state in which it does not come into contact with other cured binders. The shape of the cured binder material scattered in an island shape is not particularly limited, and when the contour is viewed in a plane, it may be a shape composed of curves such as a circle and an ellipse, and a shape such as a polygon. It may be in the shape of a circle, an ellipse, or the like connected to each other through a thin portion, or it may be in the shape of an amoeba. In addition, the islands may be adjacent to each other without being intricately in contact with each other.
Further, the binder cured product is formed in a film shape, and a binder cured product in a state in which a region in which the cured product is not formed is mixed in the formed region of the film-shaped binder cured product and an island-shaped cured product. The hardened binder formed in the above may be mixed.
本発明の抗微生物部材において、上記バインダ硬化物の基材表面に対する被覆率が55%以下であると、バインダ硬化物1個当たりの表面積が小さくなり、基材表面との接触面積が低下するため、バインダ硬化物が脱落しやすくなるのと同時に、バインダ硬化物全体として、凸部分が占める面積が相対的に多くなるため、ふき取り清掃などの物理的負荷によって、凸部分が摩耗して欠損することで、抗微生物成分が含まれるバインダ硬化物が失われてしまい、抗微生物活性が低下してしまう。つまり、抗微生物活性の耐久性が低下してしまうのである。一方、上記バインダ硬化物の基材表面に対する被覆率が95%を超えると、バインダ硬化物の周側面の面積が小さくなってしまい、ウィルス等の微生物との接触確率が下がるため、単位面積当たりの抗微生物活性がやはり低下してしまうのである。
このように、本発明では、バインダ硬化物の基材表面に対する被覆率を、55%を超え、95%以下になるように調整し、バインダ硬化物の凸部分の相対量を減らして、滑りやすくすることで、ふき取り清掃などの物理的負荷が集中しないようにして、バインダ硬化物が摩耗して損傷することを防止して、ふき取り清掃などでも抗微生物活性が低下しないようにすることで、抗微生物活性の耐久性を向上させているのである。
また、バインダ硬化物の基材表面に対する被覆率を、55%を超え、95%以下になるように調整することで、バインダ硬化物による凹凸形状を形成することができ、抗微生物性を示すバインダ硬化物の表面積を大きくすることができるため、抗微生物性を示すバインダ硬化物とウィルス等の微生物との接触確率を高くすることができ、また、バインダ硬化物間の隙間にウィルス等の微生物をトラップさせやすくすることができるため、ウィルス等の微生物を失活させやすい。
In the antimicrobial member of the present invention, when the coverage of the cured binder with respect to the surface of the base material is 55% or less, the surface area per one cured binder becomes small and the contact area with the surface of the base material decreases. At the same time that the hardened binder is easily removed, the convex part occupies a relatively large area as a whole, so that the convex part is worn and damaged by a physical load such as wiping and cleaning. As a result, the binder cured product containing the antimicrobial component is lost, and the antimicrobial activity is reduced. That is, the durability of the antimicrobial activity is reduced. On the other hand, if the coverage of the cured binder to the surface of the substrate exceeds 95%, the area of the peripheral side surface of the cured binder becomes small and the probability of contact with microorganisms such as viruses decreases, so that per unit area. The antimicrobial activity is also reduced.
As described above, in the present invention, the coverage of the cured binder to the surface of the substrate is adjusted to exceed 55% and 95% or less, and the relative amount of the convex portion of the cured binder is reduced to make it slippery. By doing so, the physical load such as wiping and cleaning is prevented from being concentrated, the binder cured product is prevented from being worn and damaged, and the antimicrobial activity is not reduced even by wiping and cleaning. It improves the durability of microbial activity.
Further, by adjusting the coverage of the cured binder to the surface of the base material so as to exceed 55% and 95% or less, it is possible to form an uneven shape due to the cured binder, and the binder exhibits antimicrobial properties. Since the surface area of the cured product can be increased, the contact probability between the cured binder that exhibits antimicrobial properties and microorganisms such as viruses can be increased, and microorganisms such as viruses can be placed in the gaps between the cured binders. Since it can be easily trapped, it is easy to inactivate microorganisms such as viruses.
本発明の抗微生物部材では、上記バインダ硬化物は、上記抗微生物成分として、無機系抗微生物剤及び有機系抗微生物剤からなる群から選択される少なくとも1種を含むことが望ましい。 In the antimicrobial member of the present invention, it is desirable that the cured binder contains at least one selected from the group consisting of an inorganic antimicrobial agent and an organic antimicrobial agent as the antimicrobial component.
本発明の抗微生物部材において、上記バインダ硬化物が、上記抗微生物成分として、無機系抗微生物剤及び有機系抗微生物剤からなる群から選択される少なくとも1種を含んでいると、確実に高い抗微生物活性を有する抗微生物部材を実現することができる。 In the antimicrobial member of the present invention, it is definitely high if the cured binder contains at least one selected from the group consisting of an inorganic antimicrobial agent and an organic antimicrobial agent as the antimicrobial component. It is possible to realize an antimicrobial member having antimicrobial activity.
本発明の抗微生物部材では、上記無機系抗微生物剤は、銀、銅、亜鉛、白金、亜鉛化合物、銀化合物、銅化合物、金属もしくは金属酸化物が担持された金属酸化物触媒、金属イオンでイオン交換されたゼオライト、及び、銅の錯体からなる群から選択される少なくとも1種であることが望ましい。 In the antimicrobial member of the present invention, the inorganic antimicrobial agent is a silver, copper, zinc, platinum, zinc compound, a silver compound, a copper compound, a metal oxide catalyst carrying a metal or a metal oxide, or a metal ion. It is desirable that it is at least one selected from the group consisting of an ion-exchanged zeolite and a copper complex.
本発明の抗微生物部材において、上記無機系抗微生物剤が、銀、銅、亜鉛、白金、亜鉛化合物、銀化合物、銅化合物、金属もしくは金属酸化物が担持された金属酸化物触媒、金属イオンでイオン交換されたゼオライト、及び、銅の錯体、からなる群から選択される少なくとも1種であると、抗微生物剤を粒子状とすることができ、該無機系抗微生物剤がバインダ硬化物から露出し易く、より高い抗微生物活性を有する抗微生物部材となる。 In the antimicrobial member of the present invention, the inorganic antimicrobial agent is a metal oxide catalyst or metal ion carrying silver, copper, zinc, platinum, zinc compound, silver compound, copper compound, metal or metal oxide. When at least one selected from the group consisting of ion-exchanged zeolite and copper complex, the antimicrobial agent can be in the form of particles, and the inorganic antimicrobial agent is exposed from the cured binder. It is an antimicrobial member that is easy to use and has higher antimicrobial activity.
本発明の抗微生物部材では、上記有機系抗微生物剤は、抗微生物樹脂、スルホン酸系界面活性剤、銅のアルコキシド、及び、ビス型第四級アンモニウム塩からなる群から選択される少なくとも1種であることが望ましい。 In the antimicrobial member of the present invention, the organic antimicrobial agent is at least one selected from the group consisting of an antimicrobial resin, a sulfonic acid-based surfactant, a copper alkoxide, and a bis-type quaternary ammonium salt. Is desirable.
本発明の抗微生物部材において、上記有機系抗微生物剤が、抗微生物樹脂、スルホン酸系界面活性剤、銅のアルコキシド、及び、ビス型第四級アンモニウム塩からなる群から選択される少なくとも1種であると、有機系抗微生物剤はバインダ硬化物の全体に広がり易く、高い抗微生物活性を有する抗微生物部材となる。 In the antimicrobial member of the present invention, the organic antimicrobial agent is at least one selected from the group consisting of an antimicrobial resin, a sulfonic acid surfactant, a copper alkoxide, and a bis-type quaternary ammonium salt. Then, the organic antimicrobial agent easily spreads over the entire binder cured product, and becomes an antimicrobial member having high antimicrobial activity.
本発明の抗微生物部材では、上記バインダ硬化物は、無機バインダ及び/又は電磁波硬化型樹脂の硬化物を含むことが望ましい。 In the antimicrobial member of the present invention, it is desirable that the cured binder contains an inorganic binder and / or a cured product of an electromagnetically curable resin.
本発明の抗微生物部材において、上記バインダ硬化物が、無機バインダ及び/又は電磁波硬化型樹脂の硬化物を含むと、比較的容易に密着性に優れたバインダ硬化物を、基材表面に固着させることができる。 In the antimicrobial member of the present invention, when the binder cured product contains an inorganic binder and / or a cured product of an electromagnetic wave curable resin, the binder cured product having excellent adhesion is relatively easily fixed to the surface of the base material. be able to.
本発明の抗微生物部材では、上記電磁波硬化型樹脂は、アクリル樹脂、ウレタンアクリレート樹脂、ポリエーテル樹脂、ポリエステル樹脂、エポキシ樹脂、及び、アルキッド樹脂からなる群から選択される少なくとも1種であることが望ましい。 In the antimicrobial member of the present invention, the electromagnetic wave curable resin is at least one selected from the group consisting of acrylic resin, urethane acrylate resin, polyether resin, polyester resin, epoxy resin, and alkyd resin. desirable.
本発明の抗微生物部材において、上記電磁波硬化型樹脂が、アクリル樹脂、ウレタンアクリレート樹脂、ポリエーテル樹脂、ポリエステル樹脂、エポキシ樹脂、及び、アルキッド樹脂からなる群から選択される少なくとも1種であると、バインダ硬化物は、透明性を有するとともに、基材に対する密着性にも優れる。 In the antimicrobial member of the present invention, the electromagnetic wave curable resin is at least one selected from the group consisting of acrylic resin, urethane acrylate resin, polyether resin, polyester resin, epoxy resin, and alkyd resin. The cured binder has not only transparency but also excellent adhesion to the substrate.
本発明の抗微生物部材では、上記無機バインダは、シリカゾル、アルミナゾル、チタニアゾル、ジルコニアゾル及びケイ酸ナトリウムからなる群から選択される少なくとも1種であることが望ましい。 In the antimicrobial member of the present invention, it is desirable that the inorganic binder is at least one selected from the group consisting of silica sol, alumina sol, titania sol, zirconia sol and sodium silicate.
本発明の抗微生物部材において、上記無機バインダが、シリカゾル、アルミナゾル、チタニアゾル、ジルコニアゾル及びケイ酸ナトリウムからなる群から選択される少なくとも1種であると、抗微生物成分の種類に応じて水を分散媒としたゾル等や有機溶媒を分散媒としたゾルを使い分けることができ、抗微生物成分が良好に分散したバインダ硬化物を形成することができる。 In the antimicrobial member of the present invention, when the inorganic binder is at least one selected from the group consisting of silica sol, alumina sol, titania sol, zirconia sol and sodium silicate, water is dispersed according to the type of antimicrobial component. A sol or the like used as a medium or a sol using an organic solvent as a dispersion medium can be used properly, and a binder cured product in which antimicrobial components are well dispersed can be formed.
本発明の抗微生物部材では、上記バインダ硬化物の基材表面に平行な方向の最大幅は、0.1〜500μmであり、その厚さの平均値は、0.1〜20μmであることが望ましい。 In the antimicrobial member of the present invention, the maximum width of the cured binder in the direction parallel to the surface of the substrate is 0.1 to 500 μm, and the average thickness thereof is 0.1 to 20 μm. desirable.
本発明の抗微生物部材において、上記バインダ硬化物の上記基材の表面に平行な方向の最大幅を0.1〜500μmとすることにより、基材の表面がバインダ硬化物により被覆されていない部分の割合を適切に保つことができ、基材表面に所定パターンの意匠等が形成されている場合でも、意匠等の外観や美観が損なわれてしまうのを防止することができる。 In the antimicrobial member of the present invention, by setting the maximum width of the binder cured product in the direction parallel to the surface of the base material to 0.1 to 500 μm, the surface of the base material is not covered with the binder cured product. Even when a design or the like having a predetermined pattern is formed on the surface of the base material, it is possible to prevent the appearance and aesthetic appearance of the design or the like from being spoiled.
本発明の抗微生物部材においては、上記バインダ硬化物の上記基材の表面に平行な方向の最大幅が0.1μm未満のバインダ硬化物を形成することは技術的に困難であり、バインダ硬化物の基材表面の被覆率も低くなってしまい、抗微生物活性が低下してしまう。一方、上記バインダ硬化物の上記基材の表面に平行な方向の最大幅が500μmを超えると、1個のバインダ硬化物の大きさが大きくなりすぎ、基材表面に所定パターンの意匠等が形成されている場合、バインダ硬化物が邪魔して意匠等が見にくくなり、意匠等の外観や美観が損なわれてしまう。 In the antimicrobial member of the present invention, it is technically difficult to form a binder cured product having a maximum width of less than 0.1 μm in a direction parallel to the surface of the binder cured product, and the binder cured product. The coverage of the surface of the base material is also lowered, and the antimicrobial activity is lowered. On the other hand, if the maximum width of the cured binder product in the direction parallel to the surface of the base material exceeds 500 μm, the size of one cured binder product becomes too large, and a design or the like having a predetermined pattern is formed on the surface of the base material. If this is the case, the cured binder obstructs the design and the like, making it difficult to see the design and the like, and the appearance and appearance of the design and the like are impaired.
本発明の抗微生物部材において、バインダ硬化物の厚さの平均値が0.1〜20μmであると、バインダ硬化物の厚さが薄いので、バインダ硬化物の連続層となりにくく、バインダ硬化物が島状に散在してなるか、もしくは、上記バインダ硬化物が基材表面に固着形成された領域とバインダ硬化物が固着形成されていない領域が混在して設けられた状態にさせ易くなり、意匠等の外観や美観が損なわれてしまうのを防止することができ、高い抗微生物活性を得ることができる。 In the antimicrobial member of the present invention, when the average value of the thickness of the cured binder is 0.1 to 20 μm, the cured binder is thin, so that it is difficult to form a continuous layer of the cured binder, and the cured binder is formed. The design is easily dispersed in an island shape, or a region in which the cured binder is fixedly formed on the surface of the base material and a region in which the cured binder is not fixedly formed are provided in a mixed state. It is possible to prevent the appearance and aesthetics of the above from being spoiled, and it is possible to obtain high antimicrobial activity.
本発明の抗微生物部材において、その厚さの平均値が0.1μm未満のバインダ硬化物を形成するのは技術的に難しく、バインダ硬化物の基材表面の被覆率も低くなってしまい、抗微生物活性が低下してしまう。一方、バインダ硬化物の厚さの平均値が20μmを超えると、バインダ硬化物が厚すぎるので、基材表面に所定パターンの意匠等が形成されている場合、バインダ硬化物が邪魔して意匠等が見にくくなり、意匠等の外観や美観が損なわれてしまう。 In the antimicrobial member of the present invention, it is technically difficult to form a binder cured product having an average thickness of less than 0.1 μm, and the coverage of the surface of the binder cured product on the substrate surface is also lowered. Microbial activity is reduced. On the other hand, if the average thickness of the cured binder material exceeds 20 μm, the cured binder product is too thick. Therefore, if a design or the like having a predetermined pattern is formed on the surface of the base material, the cured binder product interferes with the design or the like. Is hard to see, and the appearance and aesthetics of the design etc. are spoiled.
本発明の抗微生物部材では、表面に抗微生物成分を含むバインダ硬化物が固着している基材の表面のJIS B 0601に準拠した算術平均粗さ(Ra)は、0.1〜5μmであることが望ましい。 In the antimicrobial member of the present invention, the arithmetic mean roughness (Ra) of the surface of the base material on which the binder cured product containing the antimicrobial component is adhered is 0.1 to 5 μm in accordance with JIS B 0601. Is desirable.
本発明の抗微生物部材おいては、表面に抗微生物成分を含むバインダ硬化物が固着している基材の上記バインダ硬化物を含む表面のJIS B 0601に準拠した算術平均粗さ(Ra)が、0.1〜5μmであると、バインダ硬化物を含む基材表面の表面積及び凹凸が適切な範囲となり、ウィルス等の微生物と抗微生物成分が接触する確率が高くなり、また、表面の凹凸の谷間に、ウィルス等の微生物がトラップされ易くなり、その結果、ウィルス等の微生物を失活させ易くなる。 In the antimicrobial member of the present invention, the arithmetic average roughness (Ra) of the surface containing the binder cured product of the base material on which the binder cured product containing the antimicrobial component is adhered to the surface is based on JIS B 0601. If it is 0.1 to 5 μm, the surface area and unevenness of the surface of the base material containing the cured binder will be in an appropriate range, the probability of contact between microorganisms such as viruses and antimicrobial components will increase, and the unevenness of the surface will increase. Microorganisms such as viruses are likely to be trapped in the valley, and as a result, microorganisms such as viruses are likely to be inactivated.
本発明の抗微生物部材おいて、Raが0.1μm未満であると、バインダ硬化物を含む基材表面の表面積及び凹凸が小さくなり、ウィルス等の微生物と抗微生物成分が接触する確率が低くなり、また、表面の凹凸が少なくなるので、ウィルス等の微生物がトラップされにくくなり、その結果、抗微生物活性が低下してしまう。
一方、Raが5μmを超えると、凹凸が大きくなりすぎ、ウィルス等の微生物は凹凸の凹部で抗微生物剤と優先的に接触するため、凸部付近の抗微生物剤が抗微生物活性を発揮しにくくなる。さらに、凹部にはウィルス等の微生物以外にも微細な異物が堆積しやすく、抗微生物剤とウィルス等の微生物の接触が不十分になり、その結果、抗微生物活性が低下するものと思われる。
また、同時にバインダ硬化物における凸部はふき取り清掃などの物理的負荷によって、摩耗して欠損しやすいため、抗微生物成分が失われてしまうことから、凹凸が大きくなり、凸部の高さが高くなりすぎると耐久性が低下する。
In the antimicrobial member of the present invention, when Ra is less than 0.1 μm, the surface area and unevenness of the surface of the base material containing the cured binder become small, and the probability of contact between microorganisms such as viruses and antimicrobial components becomes low. In addition, since the surface irregularities are reduced, it becomes difficult for microorganisms such as viruses to be trapped, and as a result, the antimicrobial activity is lowered.
On the other hand, when Ra exceeds 5 μm, the unevenness becomes too large, and microorganisms such as viruses come into preferential contact with the antimicrobial agent in the concave portion of the unevenness, so that the antimicrobial agent in the vicinity of the convex portion does not easily exert antimicrobial activity. Become. Further, it is considered that fine foreign substances other than microorganisms such as viruses are likely to be deposited in the recesses, resulting in insufficient contact between the antimicrobial agent and microorganisms such as viruses, and as a result, the antimicrobial activity is lowered.
At the same time, the convex parts of the cured binder are easily worn and damaged by a physical load such as wiping and cleaning, so that the antimicrobial component is lost, so that the uneven parts become large and the height of the convex parts is high. If it becomes too much, the durability will decrease.
本発明の抗微生物部材では、バインダ硬化物が島状に散在している場合は、上記島状のバインダ硬化物は、基材の表面1平方メートル当たり0.05×108〜30×108個存在することが望ましい。 In the antimicrobial member of the present invention, when the binder cured product is scattered in an island shape, the island-shaped binder cured product is 0.05 × 10 8 to 30 × 10 8 per square meter of the surface of the base material. It is desirable to exist.
本発明の抗微生物部材おいて、上記バインダ硬化物が島状に散在している場合、上記島状のバインダ硬化物が、基材の表面1平方メートル当たり0.05×108〜30×108個存在すると、バインダ硬化物の大きさが適切に設定されていることとなり、基材表面に形成された意匠等の外観や美観が損なわれてしまうのを防止することができ、単位担持量当たり抗微生物活性の高い抗微生物部材となる。 In the antimicrobial member of the present invention, when the binder cured product is scattered in an island shape, the island-shaped binder cured product is 0.05 × 10 8 to 30 × 10 8 per square meter of the surface of the base material. If there are individual binders, the size of the cured binder is set appropriately, and it is possible to prevent the appearance and aesthetic appearance of the design, etc. formed on the surface of the base material from being spoiled, and per unit carrying amount. It is an antimicrobial member with high antimicrobial activity.
本発明の抗微生物部材おいて、上記バインダ硬化物が島状に散在している場合、上記島状のバインダ硬化物の個数が、基材の表面1平方メートル当たり0.05×108個未満であると、バインダ硬化物の基材表面の被覆率を95%以下とするためには、1個当たりのバインダ硬化物の面積を大きくする必要が生じ、バインダ硬化物の総表面積が小さくなり、バインダ硬化物とウィルス等の微生物との接触確率が低下して抗微生物活性が悪化する。
一方、バインダ硬化物の個数が30×108個を超えると、バインダ硬化物の個数が多すぎるので、バインダ硬化物同士が重なり易くなり、基材表面に所定パターンの意匠等が形成されている場合、基材表面に形成された意匠等の外観や美観が損なわれてしまう。また、バインダ硬化物の平均径が小さくなり、密着性が損なわれるだけでなく、バインダ硬化物に占める凸部分が相対的に多くなり、ふき取り清掃時にバインダ硬化物が摩耗して欠損し、抗微生物性が低下することから、抗微生物性能の物理的な耐久性も低下する。
Keep the antimicrobial member of the present invention, when the binder cured product are scattered like islands, the number of the islands of binder cured product, the surface per square meter 0.05 × 10 than 8 base If there is, in order to reduce the coverage of the substrate surface of the cured binder to 95% or less, it is necessary to increase the area of the cured binder per piece, the total surface area of the cured binder becomes smaller, and the binder becomes smaller. The contact probability between the cured product and microorganisms such as viruses decreases, and the antimicrobial activity deteriorates.
On the other hand, if the number of the binder cured product 30 × 10 more than eight, because the number of the binder cured product is too large, easily overlap binder cured together, design, etc. of a predetermined pattern on the substrate surface is formed In that case, the appearance and aesthetics of the design or the like formed on the surface of the base material are impaired. In addition, the average diameter of the cured binder is reduced, which not only impairs the adhesion, but also the convex portion of the cured binder is relatively large, and the cured binder is worn and lost during wiping and cleaning, resulting in antimicrobial activity. Since the property is reduced, the physical durability of the antimicrobial performance is also reduced.
本発明の抗微生物部材においては、基材表面に抗微生物成分を含む電磁波硬化型樹脂の硬化物が固着されてなり、かつ、上記電磁波硬化型樹脂の硬化物は、基材表面の55〜95%を被覆していることを特徴とする抗微生物部材であることが望ましい。 In the antimicrobial member of the present invention, a cured product of an electromagnetic wave curable resin containing an antimicrobial component is fixed to the surface of the base material, and the cured product of the electromagnetic wave curable resin is 55 to 95 on the surface of the base material. It is desirable that it is an antimicrobial member characterized by covering%.
電磁波硬化型樹脂は、壁やトイレなど、既存の建築物等を構成する基材の表面に抗微生物性を有する未硬化の電磁波硬化型樹脂からなる抗微生物組成物を付着させて、電磁波で硬化させるだけで、抗微生物性を有する硬化物を基材表面に固着させることができるからである。 The electromagnetic wave curable resin is cured by electromagnetic waves by adhering an antimicrobial composition composed of an uncured electromagnetic wave curable resin having antimicrobial properties to the surface of a base material constituting an existing building such as a wall or a toilet. This is because the cured product having antimicrobial properties can be fixed to the surface of the base material simply by allowing it to be allowed to adhere.
本発明の抗微生物部材においては、上記電磁波硬化型樹脂の硬化物は、基材表面の55〜95%を被覆しており、抗微生物性活性を有する電磁波硬化型樹脂の硬化物が島状に分散して基材表面に固着されてなるか、または、抗微生物成分を含む電磁波硬化型樹脂の硬化物が形成された領域と電磁波硬化型樹脂の硬化物が形成されていない領域が混在した状態となっているため、抗微生物活性を示す電磁波硬化型樹脂の硬化物の総表面積が大きくなり、ウィルス等の微生物との接触確率が高くなり、また、抗微生物活性を示す電磁波硬化型樹脂の硬化物の凸部と凸部間に形成される凹部にウィルス等の微生物がトラップされて、ウィルス等の微生物を失活させやすくなるからである。
また、電磁波硬化型樹脂の硬化物の被覆率が高く平坦化されるため、凸部分の相対量が減り、その結果、摩耗により電磁波硬化型樹脂の硬化物が欠損することを抑制できるのである。
In the antimicrobial member of the present invention, the cured product of the electromagnetic wave curable resin covers 55 to 95% of the surface of the base material, and the cured product of the electromagnetic wave curable resin having antimicrobial activity is island-shaped. A state in which a region is dispersed and fixed to the surface of the base material, or a region in which a cured product of an electromagnetic wave curable resin containing an antimicrobial component is formed and a region in which a cured product of an electromagnetic wave curable resin is not formed are mixed. Therefore, the total surface area of the cured product of the electromagnetic wave curable resin exhibiting antimicrobial activity is increased, the contact probability with microorganisms such as viruses is increased, and the electromagnetic wave curable resin exhibiting antimicrobial activity is cured. This is because microorganisms such as viruses are trapped in the convex portions of the object and the concave portions formed between the convex portions, and the microorganisms such as viruses are easily inactivated.
Further, since the coverage of the cured product of the electromagnetic wave curable resin is high and flattened, the relative amount of the convex portion is reduced, and as a result, it is possible to suppress the loss of the cured product of the electromagnetic wave curable resin due to wear.
上記電磁波硬化型樹脂の硬化物は、上記抗微生物成分として、無機系抗微生物剤及び有機系抗微生物剤からなる群から選択される少なくとも1種を含むことが望ましい。 It is desirable that the cured product of the electromagnetic wave curable resin contains at least one selected from the group consisting of an inorganic antimicrobial agent and an organic antimicrobial agent as the antimicrobial component.
上記電磁波硬化型樹脂の硬化物に含まれる上記抗微生物成分は、銅化合物であって、上記銅化合物は、X線光電子分光分析法により、925〜955eVの範囲にあるCu(I)とCu(II)に相当する結合エネルギーを5分間測定することでCu(I)とCu(II)の共存が確認されることが望ましい。Cu(I)およびCu(II)が共存していた方が、それぞれ単独に存在している場合に比べて、抗微生物活性が高いからである。 The antimicrobial component contained in the cured product of the electromagnetic wave curable resin is a copper compound, and the copper compounds are Cu (I) and Cu (Cu (I)) in the range of 925 to 955 eV by X-ray photoelectron spectroscopy. It is desirable that the coexistence of Cu (I) and Cu (II) is confirmed by measuring the binding energy corresponding to II) for 5 minutes. This is because the coexistence of Cu (I) and Cu (II) has higher antimicrobial activity than the case where each of them exists alone.
上記電磁波硬化型樹脂の硬化物に含まれる上記抗微生物成分は、銅化合物であって、上記銅化合物は、X線光電子分光分析法により、925〜955eVの範囲にあるCu(I)とCu(II)に相当する結合エネルギーを5分間測定することで算出される、上記銅化合物中に含まれるCu(I)とCu(II)とのイオンの個数の比率(Cu(I)/Cu(II))が0.4〜50であることが望ましい。 The antimicrobial component contained in the cured product of the electromagnetic wave curable resin is a copper compound, and the copper compounds are Cu (I) and Cu (Cu (I)) in the range of 925 to 955 eV by X-ray photoelectron spectroscopic analysis. The ratio of the number of ions of Cu (I) and Cu (II) contained in the copper compound calculated by measuring the binding energy corresponding to II) for 5 minutes (Cu (I) / Cu (II). )) Is preferably 0.4 to 50.
上記電磁波硬化型樹脂の硬化物に含まれる上記抗微生物成分は、ビス型第四級アンモニウム塩であることが望ましい。高い抗微生物性能を有しているからである。 The antimicrobial component contained in the cured product of the electromagnetic wave curable resin is preferably a bis-type quaternary ammonium salt. This is because it has high antimicrobial performance.
本発明の抗微生物部材では、上記電磁波硬化型樹脂の硬化物は、さらに重合開始剤を含むことが望ましい。重合反応や架橋反応を進行させるとともに、銅(II)を抗微生物性能の高い銅(I)に還元する働きを有するからである。 In the antimicrobial member of the present invention, it is desirable that the cured product of the electromagnetic wave curable resin further contains a polymerization initiator. This is because it has a function of reducing copper (II) to copper (I) having high antimicrobial performance while advancing the polymerization reaction and the cross-linking reaction.
本発明の抗微生物部材においては、上記重合開始剤は、アルキルフェノン系の重合開始剤およびベンゾフェノン系の重合開始剤を含み、アルキルフェノン系の重合開始剤とベンゾフェノン系の重合開始剤の比率は、重量比でアルキルフェノン系の重合開始剤/ベンゾフェノン系の重合開始剤=1/1〜4/1であることが望ましい。電磁波硬化型樹脂の硬化物の架橋密度が高くなり、拭き取り清掃の際に発生する応力や摩耗に対する耐久性が向上するからである。
なお、煮沸したトルエンに硬化物を8時間浸漬して乾燥、浸漬後の硬化物の重量/浸漬前の硬化物の重量×100%で架橋密度を測定すると、実施例1、3の抗ウィルス性部材の架橋密度は、いずれも97%である。一方、実施例1、3と同様の樹脂を用い、アルキルフェノン系の重合開始剤/ベンゾフェノン系の重合開始剤の比率が0.5/1、5/1となると、架橋密度は、それぞれ91%まで低下する。つまり、重量比でアルキルフェノン系の重合開始剤/ベンゾフェノン系の重合開始剤=1/1〜4/1(架橋密度95%以上)であることが最適である。
In the anti-microbial member of the present invention, the above-mentioned polymerization initiator contains an alkylphenone-based polymerization initiator and a benzophenone-based polymerization initiator, and the ratio of the alkylphenone-based polymerization initiator to the benzophenone-based polymerization initiator is determined. It is desirable that the alkylphenone-based polymerization initiator / benzophenone-based polymerization initiator = 1/1 to 4/1 in terms of weight ratio. This is because the crosslink density of the cured product of the electromagnetic wave curable resin is increased, and the durability against stress and abrasion generated during wiping and cleaning is improved.
The cured product was immersed in boiled toluene for 8 hours to dry, and the crosslink density was measured by measuring the weight of the cured product after immersion / the weight of the cured product before immersion × 100%. The crosslink density of each member is 97%. On the other hand, when the same resin as in Examples 1 and 3 is used and the ratio of the alkylphenone-based polymerization initiator / benzophenone-based polymerization initiator is 0.5 / 1 and 5/1, the cross-linking densities are 91%, respectively. Drops to. That is, it is optimal that the alkylphenone-based polymerization initiator / benzophenone-based polymerization initiator = 1/1 to 4/1 (crosslink
本発明の抗微生物部材では、上記抗微生物部材は、拭き取り清掃処理が行われる態様にて使用がなされることが望ましい。拭き取り清掃の際に発生する応力や摩耗に対する耐久性に優れているからである。すなわち、抗微生物部材の拭き取り清掃処理が行われる態様での使用である。 In the antimicrobial member of the present invention, it is desirable that the antimicrobial member is used in a manner in which a wiping and cleaning treatment is performed. This is because it has excellent durability against stress and abrasion generated during wiping and cleaning. That is, it is used in a mode in which the antimicrobial member is wiped and cleaned.
本発明の抗微生物部材では、上記抗微生物部材は、抗ウィルス性部材又は抗カビ部材であることが望ましい。
本発明の抗微生物部材は、抗ウィルス、抗菌、抗カビ(防カビ含む)の特性を有するが、抗ウィルス活性、抗カビ活性に優れ、特に抗ウィルスが最も高い活性を有するからである。
In the antimicrobial member of the present invention, it is desirable that the antimicrobial member is an antiviral member or an antifungal member.
This is because the antimicrobial member of the present invention has antiviral, antibacterial, and antifungal (including antifungal) properties, but is excellent in antiviral activity and antifungal activity, and in particular, antiviral has the highest activity.
(発明の詳細な説明)
以下、本発明の抗微生物部材について詳細に説明する。
本発明の抗微生物部材は、基材表面に抗微生物成分を含むバインダ硬化物が固着形成されてなり、上記バインダ硬化物は、基材表面の55%を超え、95%以下の範囲を被覆していることを特徴とする。
(Detailed description of the invention)
Hereinafter, the antimicrobial member of the present invention will be described in detail.
The antimicrobial member of the present invention is formed by fixing a cured binder containing an antimicrobial component on the surface of the base material, and the cured binder covers a range of more than 55% and 95% or less of the surface of the base material. It is characterized by being.
図1は、本発明の抗微生物部材の一実施形態を模式的に示す平面図である。 FIG. 1 is a plan view schematically showing an embodiment of the antimicrobial member of the present invention.
図1に示すように、本発明の抗微生物部材10では、基材11の表面に、抗微生物性のバインダ硬化物が膜状に形成された膜形成領域12の中にバインダ硬化物が設けられていない膜非形成領域13が混在した状態となっている。
As shown in FIG. 1, in the
本発明の抗微生物部材では、上記バインダ硬化物が基材表面の全体には存在せず、バインダ硬化物が形成されたバインダ硬化物形成領域とバインダ硬化物が形成されていないバインダ硬化物非形成領域が混在しているため、バインダ硬化物の残留応力を抑制することが可能となり、基材と高い密着性を有し、基材から剥がれにくいバインダ硬化物となる。 In the anti-microbial member of the present invention, the binder cured product does not exist on the entire surface of the base material, and the binder cured product forming region where the binder cured product is formed and the binder cured product non-forming where the binder cured product is not formed are formed. Since the regions are mixed, it is possible to suppress the residual stress of the cured binder product, and the cured binder product has high adhesion to the base material and is hard to peel off from the base material.
本発明の抗微生物部材を構成する基材の材料は、特に限定されるものでなく、例えば、金属、ガラス等のセラミック、樹脂、繊維織物、木材等が挙げられる。
また、本発明の抗微生物部材を構成する基材となる部材も、特に限定されるものではなく、建築物内部の内装材、壁材、窓ガラス、ドア等であってもよい、事務機器や家具等であってもよく、上記内装材の外、種々の用途に用いられる化粧板等であってもよい。
The material of the base material constituting the antimicrobial member of the present invention is not particularly limited, and examples thereof include ceramics such as metal and glass, resins, fiber woven fabrics, and wood.
Further, the member serving as a base material constituting the antimicrobial member of the present invention is not particularly limited, and may be an interior material, a wall material, a window glass, a door, etc. inside a building, such as office equipment and the like. It may be furniture or the like, and may be a decorative board or the like used for various purposes in addition to the above-mentioned interior material.
上記化粧板は、基板と基板の表面上に積層された表面樹脂層を有する。
上記化粧板に使用する基板は、特に限定されるものではなく、一般的に化粧板に使用されるコア紙やマグネシアセメント等の不燃板等を使用することができる。コア紙は単独でもよく複数枚のコア紙を積層した積層体としてもよい。コア紙の枚数は特に限定されないが、1〜20枚とすることができる。コア紙としては、例えば、水酸化アルミニウム抄造紙を使用することができる。コア紙には、フェノール樹脂を含浸させることができる。また、コア紙とマグネシアセメント不燃板を積層させて基板とすることもできる。
The decorative board has a substrate and a surface resin layer laminated on the surface of the substrate.
The substrate used for the decorative board is not particularly limited, and a noncombustible board such as core paper or magnesia cement generally used for the decorative board can be used. The core paper may be used alone or as a laminated body in which a plurality of core papers are laminated. The number of core papers is not particularly limited, but may be 1 to 20. As the core paper, for example, aluminum hydroxide papermaking can be used. The core paper can be impregnated with phenol resin. Further, the core paper and the magnesia cement non-combustible plate can be laminated to form a substrate.
マグネシアセメント不燃板は、単独で使用することにより、又は、コア紙の中心部に積層して配置させることにより基板を構成することができる。マグネシアセメント不燃板は、酸化マグネシウム(MgO)と塩化マグネシウム(MgCl2)を混合し、さらに骨材と水を加えて混練し、板状に成形することにより製造されるものである。骨材としては、ロックウール、グラスウール等の無機質繊維、ウッドチップ、パルプ等の有機質繊維を用いることができる。また、マグネシアセメント不燃板の強度を高めるため、中間層として網目状等に形成されたガラス繊維層を設けることができる。 The magnesia cement non-combustible plate can be used alone, or can be laminated on the center of the core paper to form a substrate. The magnesia cement non-combustible plate is manufactured by mixing magnesium oxide (MgO) and magnesium chloride (MgCl 2 ), further adding aggregate and water, kneading, and forming into a plate shape. As the aggregate, inorganic fibers such as rock wool and glass wool and organic fibers such as wood chips and pulp can be used. Further, in order to increase the strength of the magnesia cement non-combustible plate, a glass fiber layer formed in a mesh shape or the like can be provided as an intermediate layer.
また、上記化粧板を構成する表層樹脂層に用いることができる樹脂としては、メラミン樹脂、ジアリルフタレート(DAP)樹脂、ポリエステル樹脂、オレフィン樹脂、塩化ビニル樹脂、アクリル樹脂、エポキシ樹脂、ウレタン樹脂、フェノール樹脂、シリコーン樹脂、フッ素樹脂、グアナミン樹脂などが挙げられる。これらの中では、メラミン樹脂を用いることが望ましい。 The resins that can be used for the surface resin layer constituting the decorative board include melamine resin, diallyl phthalate (DAP) resin, polyester resin, olefin resin, vinyl chloride resin, acrylic resin, epoxy resin, urethane resin, and phenol. Examples thereof include resins, silicone resins, fluororesins, and guanamine resins. Among these, it is desirable to use a melamine resin.
メラミン樹脂は、透光性などの光学的、視覚的特性を損なうことなく、寸法安定性や靭性を改善した樹脂である。メラミン樹脂としては、メラミン及びその誘導体をモノマーとする樹脂であれば公知のものを採用することができる。また、メラミン樹脂は、単一のモノマーからなる樹脂であってもよく、複数のモノマーからなる共重合体であってもよい。メラミンの誘導体としては、例えば、イミノ基やメチロール基、メトキシメチル基、ブトキシメチル基等のアルコキシメチル基などの官能基を有する誘導体が挙げられる。また、メチロール基を有するメラミン誘導体に低級アルコールを反応させて部分的あるいは完全にエーテル化した化合物をモノマーとして用いることができる。モノメチロールメラミン、ジメチロールメラミン、トリメチロールメラミン、テトラメチロールメラミン、ペンタメチロールメラミン、ヘキサメチロールメラミン等のメチロール基を有する誘導体(以下、「メチロール化メラミン」という。)を架橋剤としてメラミンと共重合させてなるメラミン樹脂を用いることができる。 The melamine resin is a resin having improved dimensional stability and toughness without impairing optical and visual characteristics such as translucency. As the melamine resin, any known resin can be adopted as long as it is a resin using melamine and its derivative as a monomer. Further, the melamine resin may be a resin composed of a single monomer or a copolymer composed of a plurality of monomers. Examples of the melamine derivative include derivatives having a functional group such as an alkoxymethyl group such as an imino group, a methylol group, a methoxymethyl group and a butoxymethyl group. Further, a compound obtained by reacting a melamine derivative having a methylol group with a lower alcohol to partially or completely etherify it can be used as a monomer. Derivatives having a methylol group such as monomethylol melamine, dimethylol melamine, trimethylol melamine, tetramethylol melamine, pentamethylol melamine, hexamethylol melamine (hereinafter referred to as "methylolated melamine") are copolymerized with melamine as a cross-linking agent. A melamine resin can be used.
上記表層樹脂層は、模様や色彩が印刷された印刷紙に樹脂が含浸された化粧層であってもよく、填料の量が15%以下で樹脂を含浸した場合には透光性となるオーバーレイ紙に樹脂が含浸されたオーバーレイ層でもよい。表層樹脂層がオーバーレイ層である場合には、化粧層はオーバーレイ層の下に設けられる。
なお、填料とは紙に添加して、白色度や平滑度を調整するための無機粒子(フィラー)であり、炭酸カルシウム、タルク、クレーおよびカオリンから選ばれる少なくとも1種以上が望ましい。填料は無機粒子であるため、填料の含有量は紙の重量と紙を強熱して残存する灰分の重量から計算することができる。
The surface resin layer may be a decorative layer in which a printing paper on which a pattern or a color is printed is impregnated with a resin, and an overlay that becomes translucent when the amount of the filler is 15% or less and the resin is impregnated. An overlay layer in which paper is impregnated with resin may be used. When the surface resin layer is an overlay layer, the decorative layer is provided below the overlay layer.
The filler is an inorganic particle (filler) for adjusting whiteness and smoothness by adding it to paper, and at least one selected from calcium carbonate, talc, clay and kaolin is desirable. Since the filler is an inorganic particle, the content of the filler can be calculated from the weight of the paper and the weight of the ash remaining after the paper is heated strongly.
本発明の抗微生物部材において、上記バインダ硬化物は、上記抗微生物成分として、無機系抗微生物剤及び有機系抗微生物剤からなる群から選択される少なくとも1種を含んでいることが望ましい。
上記バインダ硬化物中には、上記した無機系抗微生物剤が1種類のみ含まれていてもよく、2種類以上の無機系抗微生物剤が含まれていてもよく、上記した有機系抗微生物剤が1種類のみ含まれていてもよく、2種類以上の有機系抗微生物剤が含まれていてもよい。さらに、上記バインダ硬化物中には、上記無機系抗微生物剤と上記無機系抗微生物剤とが2種類以上含まれていてもよい。
In the antimicrobial member of the present invention, it is desirable that the cured binder contains at least one selected from the group consisting of an inorganic antimicrobial agent and an organic antimicrobial agent as the antimicrobial component.
The binder cured product may contain only one type of the above-mentioned inorganic antimicrobial agent, or may contain two or more types of the above-mentioned inorganic antimicrobial agent, and the above-mentioned organic antimicrobial agent. May be contained in only one kind, or two or more kinds of organic antimicrobial agents may be contained. Further, the binder cured product may contain two or more types of the inorganic antimicrobial agent and the inorganic antimicrobial agent.
また、本発明の抗微生物部材において、上記無機系抗微生物剤は、銀、銅、亜鉛、白金、亜鉛化合物、銀化合物、銅化合物、金属もしくは金属酸化物が担持された金属酸化物粒子、金属イオンでイオン交換されたゼオライト、及び、銅の錯体からなる群から選択される少なくとも1種であることが望ましい。 Further, in the antimicrobial member of the present invention, the inorganic antimicrobial agent is a silver, copper, zinc, platinum, zinc compound, silver compound, copper compound, metal or metal oxide particles carrying a metal oxide, or a metal. It is desirable that it is at least one selected from the group consisting of an ion-exchanged zeolite and a copper complex.
上記バインダ硬化物中に含まれている無機系抗微生物剤として、例えば、銀、銅、亜鉛及び白金の少なくとも1種からなる金属が挙げられる。
バインダ硬化物中には、銀、銅、亜鉛及び白金の粒子が単独で含まれていてもよく、銀、銅、亜鉛及び白金のうち、2種類以上の金属粒子が含まれていてもよく、例えば、銀、銅、亜鉛及び白金のうち、少なくとも2種を含む合金の金属粒子が固定されていてもよい。
Examples of the inorganic antimicrobial agent contained in the cured binder include a metal composed of at least one of silver, copper, zinc and platinum.
The cured binder may contain silver, copper, zinc and platinum particles alone, and may contain two or more kinds of metal particles among silver, copper, zinc and platinum. For example, metal particles of an alloy containing at least two of silver, copper, zinc and platinum may be fixed.
上記バインダ硬化物中に含まれている無機系抗微生物剤として、例えば、銅のカルボン酸塩、銅の錯体、銅の水溶性無機塩等の銅化合物等が挙げられる。
上記銅のカルボン酸塩としては、銅のイオン性化合物を使用することができ、酢酸銅、安息香酸銅、フタル酸銅等が挙げられる。
上記銅の水溶性無機塩としては、銅のイオン性化合物を使用することができ、例えば、硝酸銅、硫酸銅等が挙げられる。
その他の銅化合物としては、例えば、銅(メトキシド)、銅エトキシド、銅プロポキシド、銅ブトキシドなどが挙げられ、銅の共有結合性化合物としては銅の酸化物、銅の水酸化物などが挙げられる。銅のカルボン酸塩、銅の水酸化物は、有機バインダ、無機バインダとの親和性が高く、水により溶出しないため、耐水性に優れる。
上記銅のカルボン酸塩としては、酢酸銅(II)、酢酸銅(I)、シュウ酸銅(I)、安息香酸銅(II)、フタル酸銅(II)等が挙げられる。
上記銅の錯体としては、例えば、アセチルアセトンと銅との錯体、5−メチル−2,4−ヘキサンジオン等のβジケトンと銅との錯体、銅(I)(1−ブタンチオレート)、銅(I)(へキサフルオロペンタンジオネートシクロオクタジエン)等が挙げられる。
上記銅の水溶性無機塩としては、例えば、硝酸銅(II)、硫酸銅(II)等が挙げられる。その他の銅化合物としては、例えば、銅(II)(メトキシド)、銅(II)エトキシド、銅(II)プロポキシド、銅(II)ブトキシド等が挙げられる。
Examples of the inorganic antimicrobial agent contained in the cured binder include copper compounds such as copper carboxylates, copper complexes, and copper water-soluble inorganic salts.
As the carboxylic acid salt of copper, an ionic compound of copper can be used, and examples thereof include copper acetate, copper benzoate, and copper phthalate.
As the water-soluble inorganic salt of copper, an ionic compound of copper can be used, and examples thereof include copper nitrate and copper sulfate.
Examples of other copper compounds include copper (methoxydo), copper ethoxydo, copper propoxide, copper butoxide and the like, and copper covalent compounds include copper oxide and copper hydroxide. .. Copper carboxylate and copper hydroxide have high affinity with organic binders and inorganic binders, and are not eluted with water, so they have excellent water resistance.
Examples of the copper carboxylate include copper (II) acetate, copper (I) acetate, copper (I) oxalate, copper (II) benzoate, and copper (II) phthalate.
Examples of the copper complex include a complex of acetylacetone and copper, a complex of β-diketone such as 5-methyl-2,4-hexanedione and copper, copper (I) (1-butanethiolate), and copper ( I) (Hexafluoropentandionate cyclooctadiene) and the like can be mentioned.
Examples of the water-soluble inorganic salt of copper include copper (II) nitrate and copper (II) sulfate. Examples of other copper compounds include copper (II) (methoxide), copper (II) ethoxydo, copper (II) propoxide, copper (II) butoxide and the like.
上記バインダ硬化物中に含まれている金属もしくは金属酸化物が担持された金属酸化物触媒として、例えば、酸化チタン等に白金、パラジウム、ロジウム、ルテニウムなどの白金族、銀、銅などを担持させたものなどが挙げられる。金属もしくは金属酸化物が担持された金属酸化物触媒として、具体的には、例えば、白金担持チタニア触媒、銅担持チタニア触媒、銀担持チタニア触媒、白金担持窒素ドープチタニア触媒、白金担持硫黄ドープチタニア触媒、炭素ドープチタニア触媒、銅担持酸化タングステン触媒、銀担持酸化タングステン触媒等の可視光応答型光触媒が挙げられ、上記銅担持チタニア触媒としては、例えば、特開2006−232729号公報に記載されたCuO/TiO2(重量%比)=1.0〜3.5の範囲で銅を含有するアナターゼ型酸化チタン、特開2012−210557号公報に記載された亜酸化銅(酸化銅(I):Cu2O)と酸化チタンとが複合化した光触媒組成物、特開2013−166705号公報に記載された一価銅化合物及び二価銅化合物を含む混合物を表面に担持した酸化チタン、並びに、国際公開第2013/094573号に記載された結晶性ルチル型酸化チタンを含む酸化チタンと2価銅化合物とを含有する銅及びチタン含有組成物などが挙げられる。 As a metal oxide catalyst in which the metal or metal oxide contained in the cured binder is supported, for example, platinum group such as platinum, palladium, rhodium, ruthenium, silver, copper or the like is supported on titanium oxide or the like. Examples include metal. Specific examples of the metal oxide catalyst carrying a metal or metal oxide include a platinum-supported titania catalyst, a copper-supported titania catalyst, a silver-supported titania catalyst, a platinum-supported nitrogen-doped titania catalyst, and a platinum-supported sulfur-doped titania catalyst. , Carbon-doped titanium dioxide catalyst, copper-supported titanium oxide catalyst, silver-supported titanium oxide catalyst, and other visible light-responsive photocatalysts. Examples of the copper-supported titania catalyst include CuO described in JP-A-2006-232729. Anatase-type titanium oxide containing copper in the range of / TiO 2 (% by weight) = 1.0 to 3.5, and cuprous oxide (copper (I) oxide (I): Cu) described in JP2012-210557A. A photocatalyst composition in which 2O) and titanium oxide are composited, titanium oxide having a surface containing a mixture containing a monovalent copper compound and a divalent copper compound described in JP2013-166705, and international publication. Examples thereof include copper and titanium-containing compositions containing titanium oxide containing crystalline rutyl-type titanium oxide and a divalent copper compound described in No. 2013/094573.
また、無機系抗微生物剤としては、銀、銅、亜鉛、チタン、タングステン等から選ばれる少なくとも1種の金属を含む金属酸化物あるいは金属水和物の粒子を用いることもできる。無機系抗微生物剤の具体例としては、例えば、酸化銅(I)(亜酸化銅)、酸化銅(II)、炭酸銅(II)、水酸化銅(II)、塩化銅(II)、銀イオン及び銅イオンの少なくとも一方で交換されたゼオライト、ナノ銀及び銅の少なくとも一方が担持されたアルミナ、ナノ銀及び銅の少なくとも一方が担持されたシリカ、ナノ銀及び銅の少なくとも一方が担持された酸化亜鉛、ナノ銀及び銅の少なくとも一方が担持された酸化チタン、もしくは酸化タングステン、ナノ銀及び銅の少なくとも一方が担持されたリン酸カルシウム等の無機粒子が挙げられる。銀イオン及び銅イオンの少なくとも一方で交換されたゼオライトは、さらに亜鉛イオン等の他の金属イオンで交換されていてもよい。また、本発明の無機系抗微生物剤としては、銅の錯体であることが望ましい。 Further, as the inorganic antimicrobial agent, particles of a metal oxide or a metal hydrate containing at least one metal selected from silver, copper, zinc, titanium, tungsten and the like can also be used. Specific examples of the inorganic antimicrobial agent include copper (I) oxide (copper oxide), copper (II) oxide, copper (II) carbonate, copper (II) hydroxide, copper (II) chloride, and silver. At least one of the exchanged zeolite, nanosilver and copper at least one of the ions and copper ions was supported, alumina with at least one of the nanosilver and copper, silica with at least one of the nanosilver and copper supported, and at least one of the nanosilver and copper. Examples thereof include titanium oxide in which at least one of zinc oxide, nanosilver and copper is supported, or inorganic particles such as tungsten oxide, calcium phosphate in which at least one of nanosilver and copper is supported. The zeolite exchanged at least one of the silver ion and the copper ion may be further exchanged with another metal ion such as zinc ion. Further, the inorganic antimicrobial agent of the present invention is preferably a copper complex.
本発明の抗微生物部材では、上記有機系抗微生物剤は、抗微生物樹脂、スルホン酸系界面活性剤、銅のアルコキシド、及び、ビス型第四級アンモニウム塩からなる群から選択される少なくとも1種であることが望ましい。 In the antimicrobial member of the present invention, the organic antimicrobial agent is at least one selected from the group consisting of an antimicrobial resin, a sulfonic acid-based surfactant, a copper alkoxide, and a bis-type quaternary ammonium salt. Is desirable.
本発明の抗微生物部材において、上記有機系抗微生物剤としては、例えば、ハロカルバン、クロロフェネシン、塩化リゾチーム、塩酸アルキルジアミノエチルグリシン、イソプロピルメチルフェノール、チモール、ヘキサクロロフェン、ベルベリン、チオキソロン、サリチル酸およびそれらの誘導体、安息香酸、安息香酸ナトリウム、パラオキシ安息香酸エステル、パラクロルメタクレゾール、塩化ベンザルコニウム、フェノキシエタノール、イソプロピルメチルフェノール、石炭酸、ソルビン酸、ソルビン酸カリウム、ヘキサクロロフェン、塩化クロルヘキシジン、トリクロロカルバニリド、チアントール、ヒノキチオール、トリクロサン、トリクロロヒドロキシジフェニルエーテル、クロルヘキシジングルコン酸塩、フェノキシエタノール、レゾルシン、アズレン、サリチル酸、ジンクピリチオン、モノニトログアヤコールナトリウム、ウイキョウエキス、サンショウエキス、塩化セチルピリジニウム、塩化ベンゼトニウム及びウンデシレン酸誘導体、アルキルベンゼンスルホン酸又はその塩等が挙げられる。これらのなかでは、アルキルベンゼンスルホン酸又はその塩が好ましい。 In the anti-microbial member of the present invention, examples of the organic anti-microbial agent include halocarban, chlorophenesine, lysozyme chloride, alkyldiaminoethylglycine hydrochloride, isopropylmethylphenol, timol, hexachlorophene, berberine, tioxolone, salicylic acid and the like. Derivatives of them, benzoic acid, sodium benzoate, paraoxybenzoic acid ester, parachlormethacresol, benzalkonium chloride, phenoxyethanol, isopropylmethylphenol, phenolic acid, sorbic acid, potassium sorbate, hexachlorophene, chlorhexidine chloride, trichlorocarbani Lido, thiantol, hinokithiol, triclosan, trichlorohydroxydiphenyl ether, chlorhexidine phenolate, phenoxyethanol, resorcin, azulene, salicylic acid, zincpyrythion, mononitroguanacol sodium, uikyo extract, sansho extract, cetylpyridinium chloride, benzethonium chloride and undecylene acid derivatives, Examples thereof include alkylbenzene sulfonic acid or a salt thereof. Of these, alkylbenzene sulfonic acid or a salt thereof is preferable.
本発明の抗微生物部材において、抗微生物樹脂は、酸性官能基と樹脂基体とからなる。酸性官能基としては、例えば、スルホン酸基、リン酸基、カルボキシル基、水酸基、ニトロ基などが挙げられる。これらのなかでは、スルホン酸基、リン酸基、カルボキシル基が好ましい。 In the antimicrobial member of the present invention, the antimicrobial resin comprises an acidic functional group and a resin substrate. Examples of the acidic functional group include a sulfonic acid group, a phosphoric acid group, a carboxyl group, a hydroxyl group, a nitro group and the like. Of these, a sulfonic acid group, a phosphoric acid group, and a carboxyl group are preferable.
上記樹脂基体は、ビニル基を有するモノマーの重合体であることが望ましい。
ビニル基を有するモノマーの重合体は、付加重合で合成されるので水などの副生成物がなく、透明度の高い抗微生物樹脂を得ることができる。このため、基材の意匠性に与える影響を小さくすることができる。
The resin substrate is preferably a polymer of a monomer having a vinyl group.
Since the polymer of the monomer having a vinyl group is synthesized by addition polymerization, there is no by-product such as water, and a highly transparent antimicrobial resin can be obtained. Therefore, the influence on the design of the base material can be reduced.
上記ビニル基を有するモノマーは、スチレン、メタクリル酸、メタクリル酸エステル、ジビニルベンゼン、トリビニルベンゼンから選択される1種以上のモノマーであることが望ましい。
スチレン、メタクリル酸、メタクリル酸エステル、ジビニルベンゼン、トリビニルベンゼンは、特に透明度の高い抗微生物樹脂を得ることができる。また、ジビニルベンゼン、トリビニルベンゼンは、モノマーに添加することによって架橋し、三次元網目構造を形成することができる。三次元網目構造を形成することによって、分解しにくくなり、耐久性を高くすることができる。
The monomer having a vinyl group is preferably one or more monomers selected from styrene, methacrylic acid, methacrylic acid ester, divinylbenzene, and trivinylbenzene.
Styrene, methacrylic acid, methacrylic acid ester, divinylbenzene, and trivinylbenzene can be used to obtain an antimicrobial resin having particularly high transparency. Further, divinylbenzene and trivinylbenzene can be crosslinked by adding them to a monomer to form a three-dimensional network structure. By forming a three-dimensional network structure, it becomes difficult to disassemble and durability can be increased.
本発明の抗微生物部材において、酸性官能基と樹脂基体とからなる抗微生物樹脂は、特に限定されるものではないが、例えば、陽イオン交換樹脂をそのままあるいは粉砕などして微細化して使用することができる。陽イオン交換樹脂は、同様に樹脂基体に酸性官能基を有する構成であり、本発明の抗微生物樹脂として利用することができる。 In the antimicrobial member of the present invention, the antimicrobial resin composed of the acidic functional group and the resin substrate is not particularly limited, but for example, the cation exchange resin may be used as it is or after being pulverized to be finely divided. Can be done. The cation exchange resin also has an acidic functional group on the resin substrate, and can be used as the antimicrobial resin of the present invention.
上記ビス型第四級アンモニウム塩としては、例えば、下記一般式(1)で表されるビス型ピリジニウム塩、ビス型キノリニウム塩、ビス型チアゾリウム塩、下記一般式(2)で表される化合物等が望ましい。 Examples of the bis-type quaternary ammonium salt include a bis-type pyridinium salt represented by the following general formula (1), a bis-type quinolinium salt, a bis-type thiazolium salt, and a compound represented by the following general formula (2). Is desirable.
まず、上記一般式(1)で表されるビス型ピリジニウム塩について説明する。
上記一般式(1)で表されるビス型ピリジニウム塩において、X−としては、例えば、Cl−、Br−、I−等が挙げられる。
R1、R2は、炭素数1〜20のアルキル基が好ましく、上記アルキル基は、側鎖を有していてもよい。
上記一般式(1)中、R3で表される有機基は、−CO−O−(CH2)6−O−CO−、−CONH−(CH2)6−CO−、−NH−CO−(CH2)4−CO−NH−、−S−Ph−S−、−CONH−Ph−NHCO−、―NHCO−Ph−CONH−、−O−(CH2)6−O−または−CH2−O−(CH2)4−O−CH2−(但し、Phは、フェニレン基を表す。)で表されるものであることが望ましい。
First, the bis-type pyridinium salt represented by the general formula (1) will be described.
In the bis-type pyridinium salt represented by the general formula (1), examples of X − include Cl − , Br − , I − and the like.
R 1 and R 2 are preferably alkyl groups having 1 to 20 carbon atoms, and the alkyl groups may have a side chain.
In the above general formula (1), the organic group represented by R 3 is -CO-O- (CH 2 ) 6- O-CO-, -CONH- (CH 2 ) 6- CO-, -NH-CO. -(CH 2 ) 4- CO-NH-, -S-Ph-S-, -CONH-Ph-NHCO-, -NHCO-Ph-CONH-, -O- (CH 2 ) 6- O- or -CH It is desirable that it is represented by 2- O- (CH 2 ) 4- O-CH 2- (where Ph represents a phenylene group).
具体的には、ビス型ピリジニウム塩として、下記の一般式(3)〜一般式(10)で示されるものが挙げられる。
また、上記ビス型ピリジニウム塩としては、下記の一般式(11)で表される1,1′−ジデシル−3,3′−[ブタン−1,4−ジイルビス(オキシメチレン)]ジピリジニウム=ジブロミドが特に望ましい。
次に、上記ビス型チアゾリウム塩について説明する。
また、上記ビス型チアゾリウム塩としては、下記の一般式(12)で示されるビス型チアゾリウム塩が挙げられる。
Further, examples of the bis-type thiazolium salt include bis-type thiazolium salts represented by the following general formula (12).
次に、ビス型キノリニウム塩について説明する。
上記ビス型キノリニウム塩としては、一般式(3)〜一般式(10)で表されるビス型ピリジニウム塩を構成する下記の一般式(13)に表されるピリジニウム基を、一般式(14)に示すキノリウム基に置換した化学構造を有するビス型キノリニウム塩が挙げられる。上記ビス型キノリニウム塩において、他の置換基等は、一般式(3)〜一般式(10)で表されるビス型ピリジニウム塩と同様である。
Next, the bis-type quinolinium salt will be described.
As the bis-type quinolinium salt, a pyridinium group represented by the following general formula (13) constituting the bis-type pyridinium salt represented by the general formulas (3) to (10) is used in the general formula (14). Examples thereof include a bis-type quinolinium salt having a chemical structure substituted with the quinolium group shown in. In the above bis-type quinolinium salt, other substituents and the like are the same as those of the bis-type pyridinium salt represented by the general formulas (3) to (10).
さらに、本発明で使用される一般式(2)で表される化合物について説明する。
上記一般式(2)で表される化合物としては、2,3−ビス(ヘキサデシルジメチルアンモニウムブロマイド)−1−プロパノール等が挙げられる。 Examples of the compound represented by the general formula (2) include 2,3-bis (hexadecyldimethylammonium bromide) -1-propanol and the like.
本発明の抗微生物部材では、上記バインダ硬化物は、有機バインダ、無機バインダ、有機・無機ハイブリッドのバインダ及び/又は電磁波硬化型樹脂の硬化物であることが望ましい。上記有機・無機ハイブリッドのバインダとしては有機金属化合物を使用することができる。
本発明の抗微生物部材では、上記抗微生物成分として、無機系抗微生物剤及び有機系抗微生物剤からなる群から選択される少なくとも1種と、バインダである有機バインダ、無機バインダ、有機・無機ハイブリッドのバインダ及び電磁波硬化型樹脂の少なくとも1種と、を混合したものを硬化させることにより、バインダ硬化物を得ることができる。
In the anti-microbial member of the present invention, it is desirable that the cured binder is an organic binder, an inorganic binder, an organic / inorganic hybrid binder and / or a cured product of an electromagnetic curable resin. An organometallic compound can be used as the binder of the organic / inorganic hybrid.
In the antimicrobial member of the present invention, as the antimicrobial component, at least one selected from the group consisting of an inorganic antimicrobial agent and an organic antimicrobial agent, and an organic binder, an inorganic binder, and an organic / inorganic hybrid which are binders. A binder cured product can be obtained by curing a mixture of the binder and at least one of the electromagnetic curable resins.
次に、本発明の抗微生物部材における電磁波硬化型樹脂の硬化物について説明する。
未硬化の電磁波硬化型樹脂であるモノマー又はオリゴマーと重合開始剤と各種添加剤と抗微生物成分とを含んだ抗微生物組成物を用いて基材表面に液滴を形成した後、電磁波を照射することにより、重合開始剤は、開裂反応、水素引き抜き反応、電子移動等の反応を起こし、これにより生成した光ラジカル分子、光カチオン分子、光アニオン分子等が上記モノマーや上記オリゴマーを攻撃してモノマーやオリゴマーの重合反応や架橋反応が進行し、抗微生物成分を含むバインダ硬化物が形成される。このような反応により生成する本発明のバインダ硬化物を構成する樹脂を電磁波硬化型樹脂という。
Next, a cured product of the electromagnetic wave curable resin in the antimicrobial member of the present invention will be described.
After forming droplets on the surface of the substrate using an antimicrobial composition containing a monomer or oligomer which is an uncured electromagnetically curable resin, a polymerization initiator, various additives, and an antimicrobial component, the substrate is irradiated with electromagnetic waves. As a result, the polymerization initiator causes reactions such as cleavage reaction, hydrogen abstraction reaction, and electron transfer, and the photoradical molecule, photocation molecule, photoanion molecule, etc. generated thereby attack the monomer and the oligomer, and the monomer. And the polymerization reaction and the cross-linking reaction of the oligomer proceed, and a binder cured product containing an antimicrobial component is formed. The resin constituting the binder cured product of the present invention produced by such a reaction is called an electromagnetic wave curable resin.
本発明においては、重合開始剤は、銅に対する還元剤として使用することができる。このため、無機バインダ、銅化合物および分散媒からなる抗微生物組成物に重合開始剤を添加してもよい。重合開始剤としては、光重合開始剤であることが望ましい。重合開始剤により、銅(II)を銅(I)に還元することができる。銅(I)の方が銅(II)よりも抗微生物性能が高い。 In the present invention, the polymerization initiator can be used as a reducing agent for copper. Therefore, a polymerization initiator may be added to the antimicrobial composition consisting of an inorganic binder, a copper compound and a dispersion medium. The polymerization initiator is preferably a photopolymerization initiator. Copper (II) can be reduced to copper (I) with a polymerization initiator. Copper (I) has higher antimicrobial performance than copper (II).
このような電磁波硬化型樹脂は、例えば、アクリル樹脂、ウレタンアクリレート樹脂、ポリエーテル樹脂、ポリエステル樹脂、エポキシ樹脂、及び、アルキッド樹脂からなる群から選択される少なくとも1種が望ましい。 As such an electromagnetic curable resin, at least one selected from the group consisting of, for example, acrylic resin, urethane acrylate resin, polyether resin, polyester resin, epoxy resin, and alkyd resin is desirable.
上記アクリル樹脂としては、エポキシ変性アクリレート樹脂、ウレタンアクリレート樹脂(ウレタン変性アクリレート樹脂)、シリコン変性アクリレート樹脂等が挙げられる。
上記ポリエステル樹脂としては、例えば、ポリエチレンテレフタレート(PET)、ポリブチレンテレフタレート(PBT)等が挙げられる。
Examples of the acrylic resin include epoxy-modified acrylate resin, urethane acrylate resin (urethane-modified acrylate resin), and silicon-modified acrylate resin.
Examples of the polyester resin include polyethylene terephthalate (PET) and polybutylene terephthalate (PBT).
上記エポキシ樹脂としては、脂環式エポキシ樹脂、脂環式エポキシ樹脂脂環式エポキシ樹脂やグリシジルエーテル型のエポキシ樹脂グリシジルエーテル型のエポキシ樹脂とオキセタン樹脂を組みわせたもの等が挙げられる。
アルキッド樹脂としては、ポリエステルアルキッド樹脂等が挙げられる。
これらの樹脂は、透明性を有するとともに、基材に対する密着性にも優れる。
Examples of the epoxy resin include an alicyclic epoxy resin, an alicyclic epoxy resin, an alicyclic epoxy resin, a glycidyl ether type epoxy resin, a glycidyl ether type epoxy resin, and an oxetane resin.
Examples of the alkyd resin include polyester alkyd resin and the like.
These resins have transparency and are also excellent in adhesion to a base material.
次に、本発明の抗微生物部材における無機バインダの硬化物について説明する。
無機バインダと抗微生物成分と必要により各種添加剤や分散媒とを混合して抗微生物組成物を用いて基材表面に液滴を形成した後、乾燥させることにより、抗微生物成分を含むバインダ硬化物(無機バインダの硬化物)が形成される。
Next, the cured product of the inorganic binder in the antimicrobial member of the present invention will be described.
Binder curing containing antimicrobial components is performed by mixing an inorganic binder, an antimicrobial component, and if necessary, various additives and dispersion media to form droplets on the surface of the substrate using an antimicrobial composition, and then drying the mixture. An object (a cured product of an inorganic binder) is formed.
液滴は、孤立して基材表面に付着するとバインダ硬化物は島状となり、液滴が基材表面に重畳して付着すると、バインダ硬化物は膜状となり、そのバインダ硬化物は、バインダ硬化物の形成領域とバインダ硬化物が形成されていない非形成領域が混在した形態となる。これは、上記した電磁波硬化型樹脂において同様である。 When the droplets are isolated and adhere to the substrate surface, the binder cured product becomes island-shaped, and when the droplets are superimposed on the substrate surface and adhered, the binder cured product becomes film-like, and the binder cured product becomes binder cured. The form is a mixture of a product-forming region and a non-forming region in which a binder cured product is not formed. This is the same for the electromagnetic wave curable resin described above.
上記無機バインダとしては、シリカゾル、アルミナゾル、チタニアゾル、ジルコニアゾル及びケイ酸ナトリウムからなる群から選択される少なくとも1種であることが望ましい。上記無機バインダにおけるシリカ等の無機酸化物の含有割合は、固形分換算で2〜80重量%が好ましい。
上記無機バインダは、分散媒として、水を用いたものと有機溶媒を用いたものが存在するので、添加する抗微生物成分の種類を考慮して、無機バインダを選択することができ、抗微生物成分が均一に分散した上記抗微生物組成物を得ることができる。
The inorganic binder is preferably at least one selected from the group consisting of silica sol, alumina sol, titania sol, zirconia sol and sodium silicate. The content ratio of the inorganic oxide such as silica in the above-mentioned inorganic binder is preferably 2 to 80% by weight in terms of solid content.
Since there are two types of the above-mentioned inorganic binders, one using water and the other using an organic solvent as the dispersion medium, the inorganic binder can be selected in consideration of the type of the antimicrobial component to be added, and the antimicrobial component can be selected. The above-mentioned antimicrobial composition in which is uniformly dispersed can be obtained.
本発明の抗微生物部材では、上記バインダ硬化物の基材表面に平行な方向の最大幅は、0.1〜500μmであり、その厚さの平均値は、0.1〜20μmであることが望ましい。 In the antimicrobial member of the present invention, the maximum width of the cured binder in the direction parallel to the surface of the substrate is 0.1 to 500 μm, and the average thickness thereof is 0.1 to 20 μm. desirable.
本発明の抗微生物部材において、バインダ硬化物の厚さの平均値が0.1〜20μmであると、バインダ硬化物の厚さが薄いので、バインダ硬化物の連続層となりにくく、バインダ硬化物が島状に散在、もしくは、上記バインダ硬化物が基材表面に固着形成された領域とバインダ硬化物が固着形成されていない領域が混在して設けられた状態にさせ易くなり、意匠等の外観や美観が損なわれてしまうのを防止することができ、高い抗微生物活性を得ることができる。 In the antimicrobial member of the present invention, when the average value of the thickness of the cured binder is 0.1 to 20 μm, the cured binder is thin, so that it is difficult to form a continuous layer of the cured binder, and the cured binder is formed. It becomes easy to make the region scattered in an island shape or the region where the cured binder is fixedly formed on the surface of the base material and the region where the cured binder is not fixedly formed, so that the appearance of the design or the like can be improved. It is possible to prevent the appearance from being spoiled and to obtain high antimicrobial activity.
本発明の抗微生物部材において、その厚さの平均値が0.1μm未満のバインダ硬化物を形成するのは技術的に難しく、バインダ硬化物の基材表面の被覆率も低くなってしまい、抗微生物活性が低下してしまう。一方、バインダ硬化物の厚さの平均値が20μmを超えると、バインダ硬化物が厚すぎるので、基材表面に所定パターンの意匠等が形成されている場合、バインダ硬化物が邪魔して意匠等が見にくくなり、意匠等の外観や美観が損なわれてしまう。 In the antimicrobial member of the present invention, it is technically difficult to form a binder cured product having an average thickness of less than 0.1 μm, and the coverage of the surface of the binder cured product on the substrate surface is also lowered. Microbial activity is reduced. On the other hand, if the average thickness of the cured binder material exceeds 20 μm, the cured binder product is too thick. Therefore, if a design or the like having a predetermined pattern is formed on the surface of the base material, the cured binder product interferes with the design or the like. Is hard to see, and the appearance and aesthetics of the design etc. are spoiled.
また、本発明の抗微生物部材において、上記バインダ硬化物の上記基材の表面に平行な方向の最大幅を0.1〜500μmとすることにより、基材の表面がバインダ硬化物により被覆されていない部分の割合を適切に保つことができ、基材表面に所定パターンの意匠等が形成されている場合でも、意匠等の外観や美観が損なわれてしまうのを防止することができる。 Further, in the antimicrobial member of the present invention, the surface of the binder cured product is covered with the binder cured product by setting the maximum width of the binder cured product in the direction parallel to the surface of the base material to 0.1 to 500 μm. It is possible to appropriately maintain the proportion of the non-existent portion, and even when a design or the like having a predetermined pattern is formed on the surface of the base material, it is possible to prevent the appearance and aesthetic appearance of the design or the like from being impaired.
本発明の抗微生物部材においては、上記バインダ硬化物の上記基材の表面に平行な方向の最大幅が0.1μm未満のバインダ硬化物を形成することは技術的に困難であり、バインダ硬化物の基材表面の被覆率も低くなってしまい、抗微生物活性が低下してしまう。一方、上記バインダ硬化物の上記基材の表面に平行な方向の最大幅が500μmを超えると、1個のバインダ硬化物の大きさが大きくなりすぎ、基材表面に所定パターンの意匠等が形成されている場合、バインダ硬化物が邪魔して意匠等が見にくくなり、意匠等の外観や美観が損なわれてしまう。 In the antimicrobial member of the present invention, it is technically difficult to form a binder cured product having a maximum width of less than 0.1 μm in a direction parallel to the surface of the binder cured product, and the binder cured product. The coverage of the surface of the base material is also lowered, and the antimicrobial activity is lowered. On the other hand, if the maximum width of the cured binder product in the direction parallel to the surface of the base material exceeds 500 μm, the size of one cured binder product becomes too large, and a design or the like having a predetermined pattern is formed on the surface of the base material. If this is the case, the cured binder obstructs the design and the like, making it difficult to see the design and the like, and the appearance and appearance of the design and the like are impaired.
上記バインダ硬化物の基材表面に平行な方向の最大幅やその厚さの平均値は、走査型顕微鏡、レーザー顕微鏡を用いることにより、測定することができる。
具体的には、画像解析・画像計測ソフトウェアを備えた走査型顕微鏡やレーザー顕微鏡を用いることにより、又は、走査型顕微鏡、レーザー顕微鏡で得られた画像を画像解析・画像計測ソフトウェアを用いて画像解析等を行うことにより、上記したバインダ硬化物の基材表面に平行な方向の最大幅やその厚さの平均値を求めることができる。
The maximum width in the direction parallel to the surface of the substrate of the cured binder and the average value thereof can be measured by using a scanning microscope or a laser microscope.
Specifically, by using a scanning microscope or a laser microscope equipped with image analysis / image measurement software, or by using an image analysis / image measurement software to analyze an image obtained by the scanning microscope or a laser microscope. By performing the above, the maximum width in the direction parallel to the surface of the substrate of the cured binder and the average value of the thickness can be obtained.
本発明の抗微生物部材では、表面に抗微生物成分を含むバインダ硬化物が固着している基材の表面のJIS B 0601に準拠した算術平均粗さ(Ra)は、0.1〜5μmであることが望ましい。
上記算術平均粗さ(Ra)は、東京精密製の接触式表面粗さ測定機であるHANDYSURFを用い、8mmの測定長さで測定することにより得ることができる。
In the antimicrobial member of the present invention, the arithmetic mean roughness (Ra) of the surface of the base material on which the binder cured product containing the antimicrobial component is adhered is 0.1 to 5 μm in accordance with JIS B 0601. Is desirable.
The arithmetic mean roughness (Ra) can be obtained by measuring with a measurement length of 8 mm using HANDYSURF, which is a contact type surface roughness measuring machine manufactured by Tokyo Seimitsu Co., Ltd.
本発明の抗微生物部材おいては、表面に抗微生物成分を含むバインダ硬化物が固着している表面のJIS B 0601に準拠した算術平均粗さ(Ra)が、0.1〜5μmであると、バインダ硬化物を含む基材表面の表面積が適切な範囲となり、ウィルス等の微生物と抗微生物成分が接触する確率が高くなり、また、表面の凹凸の谷間に、ウィルス等の微生物がトラップされ易くなり、その結果、ウィルス等の微生物を失活させ易くなる。 In the antimicrobial member of the present invention, the arithmetic average roughness (Ra) according to JIS B 0601 of the surface on which the binder cured product containing the antimicrobial component is adhered is 0.1 to 5 μm. , The surface area of the substrate surface containing the binder cured product is within an appropriate range, the probability of contact between microorganisms such as viruses and antimicrobial components is high, and microorganisms such as viruses are likely to be trapped in the valleys of the surface irregularities. As a result, microorganisms such as viruses are easily inactivated.
本発明の抗微生物部材おいて、Raが0.1μm未満であると、バインダ硬化物を含む基材表面の表面積が小さくなり、ウィルス等の微生物と抗微生物成分が接触する確率が低くなり、また、表面の凹凸が少なくなるので、ウィルス等の微生物がトラップされにくくなり、その結果、抗微生物活性が低下してしまう。
一方、Raが5μmを超えると、凹凸が大きくなりすぎ、ウィルス等の微生物は凹凸の凹部で抗微生物剤と優先的に接触するため、凸部付近の抗微生物剤が抗微生物活性を発揮しにくくなる。さらに、凹部にはウィルス等の微生物以外にも微細な異物が堆積しやすく、抗微生物剤とウィルス等の微生物の接触が不十分になり、その結果、抗微生物活性が低下するものと思われる。
また、同時にバインダ硬化物における凸部はふき取り清掃などの物理的負荷によって、摩耗して欠損しやすいため、抗微生物成分が失われてしまうことから、凹凸が大きくなり、凸部の高さが高くなりすぎると耐久性が低下する。
In the antimicrobial member of the present invention, when Ra is less than 0.1 μm, the surface area of the substrate surface containing the cured binder becomes small, the probability of contact between microorganisms such as viruses and the antimicrobial component becomes low, and the probability of contact with the antimicrobial component becomes low. Since the surface irregularities are reduced, microorganisms such as viruses are less likely to be trapped, and as a result, the antimicrobial activity is reduced.
On the other hand, when Ra exceeds 5 μm, the unevenness becomes too large, and microorganisms such as viruses come into preferential contact with the antimicrobial agent in the concave portion of the unevenness, so that the antimicrobial agent in the vicinity of the convex portion does not easily exert antimicrobial activity. Become. Further, it is considered that fine foreign substances other than microorganisms such as viruses are likely to be deposited in the recesses, resulting in insufficient contact between the antimicrobial agent and microorganisms such as viruses, and as a result, the antimicrobial activity is lowered.
At the same time, the convex parts of the cured binder are easily worn and damaged by a physical load such as wiping and cleaning, so that the antimicrobial component is lost, so that the uneven parts become large and the height of the convex parts is high. If it becomes too much, the durability will decrease.
本発明の抗微生物部材では、上記バインダ硬化物が島状に散在している場合、上記島状のバインダ硬化物は、基材の表面1平方メートル当たり0.05×108〜30×108個存在することが望ましい。 In the antimicrobial member of the present invention, when the cured binders are scattered in an island shape, the cured binders in the island shape are 0.05 × 10 8 to 30 × 10 8 per square meter of the surface of the base material. It is desirable to exist.
本発明の抗微生物部材おいて、上記バインダ硬化物が島状に散在している場合、上記島状のバインダ硬化物が、基材の表面1平方メートル当たり0.05×108〜30×108個存在すると、バインダ硬化物の大きさが適切に設定されていることとなり、基材表面に形成された意匠等の外観や美観が損なわれてしまうのを防止することができ、単位担持量当たり抗微生物活性の高い抗微生物部材となる。 In the antimicrobial member of the present invention, when the binder cured product is scattered in an island shape, the island-shaped binder cured product is 0.05 × 10 8 to 30 × 10 8 per square meter of the surface of the base material. If there are individual binders, the size of the cured binder is set appropriately, and it is possible to prevent the appearance and aesthetic appearance of the design, etc. formed on the surface of the base material from being spoiled, and per unit carrying amount. It is an antimicrobial member with high antimicrobial activity.
本発明の抗微生物部材おいて、上記バインダ硬化物が島状に散在している場合、上記島状のバインダ硬化物の個数が、基材の表面1平方メートル当たり0.05×108個未満であると、バインダ硬化物の基材表面の被覆率を55%を超え、95%以下とするためには、1個当たりのバインダ硬化物の面積を大きくする必要が生じ、バインダ硬化物の総表面積が小さくなり、バインダ硬化物とウィルス等の微生物との接触確率が低下して抗微生物活性が悪化する。
一方、バインダ硬化物の個数が30×108個を超えると、バインダ硬化物の個数がおおすぎるので、バインダ硬化物同士が重なり易くなり、基材表面に所定パターンの意匠等が形成されている場合、基材表面に形成された意匠等の外観や美観が損なわれてしまう。
また、バインダ硬化物の平均径が小さくなり、密着性が損なわれるだけでなく、バインダ硬化物に占める凸部分が相対的に多くなり、ふき取り清掃時にバインダ硬化物が摩耗して欠損し、抗微生物性が低下することから、抗微生物性能の物理的な耐久性も低下する。
Keep the antimicrobial member of the present invention, when the binder cured product are scattered like islands, the number of the islands of binder cured product, the surface per square meter 0.05 × 10 than 8 base If there is, in order to increase the coverage of the substrate surface of the binder cured product to more than 55% and 95% or less, it is necessary to increase the area of the binder cured product per piece, and the total surface area of the binder cured product is increased. Is reduced, the contact probability between the cured binder and microorganisms such as viruses is reduced, and the antimicrobial activity is deteriorated.
On the other hand, if the number of the binder cured product 30 × 10 more than eight, because the number of the binder cured product is too large, easily overlap binder cured together, design, etc. of a predetermined pattern on the substrate surface is formed In that case, the appearance and aesthetics of the design or the like formed on the surface of the base material are impaired.
In addition, the average diameter of the cured binder is reduced, which not only impairs the adhesion, but also the convex portion of the cured binder is relatively large, and the cured binder is worn and lost during wiping and cleaning, resulting in antimicrobial activity. Since the property is reduced, the physical durability of the antimicrobial performance is also reduced.
本発明の抗微生物部材によれば、例えば、建築物内部の内装材、壁材、窓ガラス、ドア、台所用品等や、事務機器や家具等や、種々の用途に用いられる化粧板等に、表面に形成されたパターン、色彩、意匠、色調等を変えることなく、抗微生物機能を付加することができる。 According to the antimicrobial member of the present invention, for example, for interior materials, wall materials, windowpanes, doors, kitchen utensils, etc. inside buildings, office equipment, furniture, etc., decorative boards used for various purposes, etc. The antimicrobial function can be added without changing the pattern, color, design, color tone, etc. formed on the surface.
次に、上記した抗微生物部材の製造方法について説明する。
まず、バインダとして電磁波硬化型樹脂を用いた場合について説明する。
上記抗微生物部材を製造する際には、まず、基材の表面に、抗微生物成分と未硬化の電磁波硬化型樹脂と分散媒と重合開始剤とを含む抗微生物組成物を散布する散布工程を行い、続いて上記散布工程により散布された上記抗微生物組成物を乾燥させて上記分散媒を除去する乾燥工程を行い、最後に上記乾燥工程で分散媒を除去した上記抗微生物組成物中の上記未硬化の電磁波硬化型樹脂に電磁波を照射して上記電磁波硬化型樹脂を硬化させる硬化工程を行い、基材の表面に抗微生物成分を含むバインダ硬化物が基材表面に固着し、バインダ硬化物が基材表面の55%を超え、95%以下の範囲を被覆している抗微生物部材を得ることができる。
Next, the method for producing the above-mentioned antimicrobial member will be described.
First, a case where an electromagnetic wave curable resin is used as a binder will be described.
When producing the antimicrobial member, first, a spraying step of spraying an antimicrobial composition containing an antimicrobial component, an uncured electromagnetically curable resin, a dispersion medium, and a polymerization initiator is performed on the surface of the base material. This is followed by a drying step of drying the antimicrobial composition sprayed by the spraying step to remove the dispersion medium, and finally the above-mentioned antimicrobial composition in the antimicrobial composition from which the dispersion medium has been removed in the drying step. A curing step is performed in which an uncured electromagnetically curable resin is irradiated with an electromagnetic wave to cure the electromagnetically curable resin, and a binder cured product containing an antimicrobial component adheres to the surface of the base material to form a binder cured product. It is possible to obtain an antimicrobial member which covers a range of more than 55% and 95% or less of the surface of the base material.
(1)散布工程
本発明の抗微生物部材を製造する際には、まず、散布工程として、基材の表面に、抗微生物成分と未硬化の電磁波硬化型樹脂と分散媒と重合開始剤とを含む抗微生物組成物を散布する。
(1) Spraying Step When producing the antimicrobial member of the present invention, first, as a spraying step, an antimicrobial component, an uncured electromagnetic wave curable resin, a dispersion medium, and a polymerization initiator are applied to the surface of the base material. Spray the containing antimicrobial composition.
散布の対象となる基材の材料は、特に限定されるものでなく、例えば、金属、ガラス等のセラミック、樹脂、繊維織物、木材等が挙げられる。
また、基材となる部材も、特に限定されるものではなく、建築物内部の内装材、壁材、窓ガラス、ドア等であってもよい、事務機器や家具等であってもよく、上記内装材の外、種々の用途に用いられる化粧板等であってもよい。
The material of the base material to be sprayed is not particularly limited, and examples thereof include ceramics such as metal and glass, resins, textile fabrics, and wood.
Further, the member to be a base material is not particularly limited, and may be an interior material, a wall material, a window glass, a door, etc. inside a building, an office equipment, furniture, etc. In addition to the interior material, it may be a decorative board or the like used for various purposes.
上記抗微生物成分としては、無機系抗微生物剤及び有機系抗微生物剤からなる群から選択される少なくとも1種が挙げられる。
上記無機系抗微生物剤は、銀、銅、亜鉛、白金、亜鉛化合物、銀化合物、銅化合物、金属もしくは金属酸化物が担持された金属酸化物触媒、金属イオンでイオン交換されたゼオライト、及び、銅の錯体からなる群から選択される少なくとも1種であることが望ましく、上記有機系抗微生物剤は、抗微生物樹脂、スルホン酸系界面活性剤、銅のアルコキシド、及び、ビス型第四級アンモニウム塩からなる群から選択される少なくとも1種であることが望ましい。
Examples of the antimicrobial component include at least one selected from the group consisting of inorganic antimicrobial agents and organic antimicrobial agents.
The inorganic antimicrobial agents include silver, copper, zinc, platinum, zinc compounds, silver compounds, copper compounds, metal oxide catalysts carrying metals or metal oxides, zeolite ion-exchanged with metal ions, and It is desirable that the organic antimicrobial agent is at least one selected from the group consisting of copper complexes, and the organic antimicrobial agent is an antimicrobial resin, a sulfonic acid-based surfactant, a copper alkoxide, and a bis-type quaternary ammonium. It is desirable that it be at least one selected from the group consisting of salts.
上記電磁波硬化型樹脂は、アクリル樹脂、ウレタンアクリレート樹脂、ポリエーテル樹脂、ポリエステル樹脂、エポキシ樹脂、及び、アルキッド樹脂からなる群から選択される少なくとも1種であることが望ましい。 The electromagnetic wave curable resin is preferably at least one selected from the group consisting of acrylic resin, urethane acrylate resin, polyether resin, polyester resin, epoxy resin, and alkyd resin.
上記分散媒の種類は特に限定されるものではないが、安定性を考慮した場合にはアルコール類や水を使用する事が好ましい。アルコール類としては、粘性を下げる事を考慮して、例えば、メチルアルコール、エチルアルコール、n−プロピルアルコール、イソプロピルアルコール、n−ブチルアルコール、イソブチルアルコール、sec−ブチルアルコール等のアルコール類が挙げられる。これらのアルコールのなかでは、粘度が高くなりにくいメチルアルコール、エチルアルコールが好ましく、アルコールと水との混合液が望ましい。 The type of the dispersion medium is not particularly limited, but it is preferable to use alcohols or water in consideration of stability. Examples of alcohols include alcohols such as methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, isobutyl alcohol, and sec-butyl alcohol in consideration of lowering the viscosity. Among these alcohols, methyl alcohol and ethyl alcohol, which do not easily increase in viscosity, are preferable, and a mixed solution of alcohol and water is preferable.
本発明においては、重合開始剤は、銅に対する還元剤として使用することができる。このため、無機バインダ、銅化合物および分散媒からなる抗微生物組成物に重合開始剤を添加してもよい。重合開始剤としては、光重合開始剤であることが望ましい。重合開始剤により、銅(II)を銅(I)に還元することができる。銅(I)の方が銅(II)よりも抗微生物性能が高い。
上記重合開始剤は、具体的にはアルキルフェノン系、ベンゾフェノン系、アシルフォスフィンオキサイド系、分子内水素引き抜き型、及び、オキシムエステル系からなる群から選択される少なくとも1種が望ましい。
In the present invention, the polymerization initiator can be used as a reducing agent for copper. Therefore, a polymerization initiator may be added to the antimicrobial composition consisting of an inorganic binder, a copper compound and a dispersion medium. The polymerization initiator is preferably a photopolymerization initiator. Copper (II) can be reduced to copper (I) with a polymerization initiator. Copper (I) has higher antimicrobial performance than copper (II).
Specifically, the polymerization initiator is preferably at least one selected from the group consisting of an alkylphenone type, a benzophenone type, an acylphosphine oxide type, an intramolecular hydrogen abstraction type, and an oxime ester type.
上記アルキルフェノン系の重合開始剤としては、例えば、2,2−ジメトキシ−1,2−ジフェニルエタン−1−オン、1−ヒドロキシ−シクロヘキシル−フェニル−ケトン、2−ヒドロキシ−2−メチル−1−フェニル−プロパン−1−オン、1−[4−(2−ヒドロキシエトキシ)−フェニル]−2−ヒドロキシ−2−メチル−1−プロパン−1−オン、2−ヒロドキシ−1−{4−[4−(2−ヒドロキシ−2−メチル−プロピオニル)−ベンジル]フェニル}−2−メチル−プロパン−1−オン、2−メチル−1−(4−メチルチオフェニル)−2−モルフォリノプロパン−1−オン、2−ベンジル−2−ジメチルアミノ−1−(4−モルフォリノフェニル)−ブタノン−1、2−(ジメチルアミノ)−2−[(4−メチルフェニル)メチル]−1−[4−(4−モルホニル)フェニル]−1−ブタノン等が挙げられる。 Examples of the alkylphenone-based polymerization initiator include 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, and 2-hydroxy-2-methyl-1-. Phenyl-propane-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propane-1-one, 2-hirodoxy-1- {4- [4] -(2-Hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propane-1-one, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1-one , 2-Benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4) -Morhonyl) phenyl] -1-butanone and the like.
アシルフォスフィンオキサイド系の重合開始剤としては、例えば、2,4,6−トリメチルベンゾイル−ジフェニル−フォスフィンオキサイド、ビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド等が挙げられる。 Examples of the acylphosphine oxide-based polymerization initiator include 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide and the like.
分子内水素引き抜き型の重合開始剤としては、例えば、フェニルグリオキシリックアシッドメチルエステル、オキシフェニルサクサン、2−[2−オキソ−2−フェニルアセトキシエトキシ]エチルエステルトオキシフェニル酢酸と2−(2−ヒドロキシエトキシ)エチルエステルとの混合物等が挙げられる。 Examples of the intramolecular hydrogen abstraction type polymerization initiator include phenylglycilic acid methyl ester, oxyphenyl succinate, 2- [2-oxo-2-phenylacetoxyethoxy] ethyl ester tooxyphenylacetic acid and 2- (2). Examples thereof include a mixture with −hydroxyethoxy) ethyl ester.
オキシムエステル系の重合開始剤としては、例えば、1,2−オクタンジオン,1−[4−(フェニルチオ)−,2−(O−ベンゾイルオキシム)]、エタノン,1−[9−エチル−6−(2−メチルベンゾイル)−9H−カルバゾール−3−イル]−,1−(0-アセチルオキシム)等が挙げられる。 Examples of the oxime ester-based polymerization initiator include 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], etanone, 1- [9-ethyl-6-. (2-Methylbenzoyl) -9H-carbazole-3-yl]-, 1- (0-acetyloxime) and the like can be mentioned.
本発明の抗微生物部材においては、上記重合開始剤は、アルキルフェノン系の重合開始剤およびベンゾフェノン系の重合開始剤を含み、アルキルフェノン系の重合開始剤とベンゾフェノン系の重合開始剤の比率は、重量比でアルキルフェノン系の重合開始剤/ベンゾフェノン系の重合開始剤=1/1〜4/1であることが望ましい。電磁波硬化型樹脂の硬化物の架橋密度が高くなり、拭き取り清掃の際に発生する応力や摩耗に対する耐久性が向上するからである。 In the anti-microbial member of the present invention, the above-mentioned polymerization initiator contains an alkylphenone-based polymerization initiator and a benzophenone-based polymerization initiator, and the ratio of the alkylphenone-based polymerization initiator to the benzophenone-based polymerization initiator is determined. It is desirable that the alkylphenone-based polymerization initiator / benzophenone-based polymerization initiator = 1/1 to 4/1 in terms of weight ratio. This is because the crosslink density of the cured product of the electromagnetic wave curable resin is increased, and the durability against stress and abrasion generated during wiping and cleaning is improved.
上記抗微生物組成物中の抗微生物成分の含有割合は、2〜30重量%が望ましく、無機バインダの含有割合は、15〜60重量%が望ましく、分散媒の含有割合は、30〜80重量%が望ましい。この場合、上記抗微生物組成物中のシリカ等の無機酸化物の含有割合は、5〜20重量%となる。 The content ratio of the antimicrobial component in the antimicrobial composition is preferably 2 to 30% by weight, the content ratio of the inorganic binder is preferably 15 to 60% by weight, and the content ratio of the dispersion medium is 30 to 80% by weight. Is desirable. In this case, the content ratio of the inorganic oxide such as silica in the antimicrobial composition is 5 to 20% by weight.
上記抗微生物組成物中には、必要に応じて、紫外線吸収剤、酸化防止剤、光安定剤、接着促進剤、レオロジー調整剤、レベリング剤、消泡剤等が配合されていてもよい。 If necessary, the antimicrobial composition may contain an ultraviolet absorber, an antioxidant, a light stabilizer, an adhesion accelerator, a rheology adjuster, a leveling agent, an antifoaming agent and the like.
上記抗微生物組成物を調製する際には、分散媒に抗微生物成分とモノマー若しくはオリゴマーと重合開始剤を添加した後、ミキサー等で充分に攪拌し、抗微生物成分、未硬化の電磁波硬化型樹脂等、重合開始剤が均一な濃度で分散する組成物とした後、散布することが望ましい。 When preparing the above antimicrobial composition, after adding the antimicrobial component, the monomer or oligomer and the polymerization initiator to the dispersion medium, the mixture is sufficiently stirred with a mixer or the like, and the antimicrobial component and the uncured electromagnetic wave curable resin are prepared. It is desirable to prepare a composition in which the polymerization initiator is dispersed at a uniform concentration, and then spray the composition.
本明細書において、散布とは、上記抗微生物組成物を、分割された状態で基材表面に付着させることをいう。
上記散布方法としては、例えば、スプレー法、二流体スプレー法、静電スプレー法、エアロゾル法等が挙げられる。
As used herein, spraying refers to adhering the antimicrobial composition to the surface of a substrate in a divided state.
Examples of the spraying method include a spray method, a two-fluid spray method, an electrostatic spray method, an aerosol method and the like.
本発明において、スプレー法とは、高圧の空気などのガスや機械的な運動(指やピエゾ素子など)用いて抗微生物組成物を霧の状態で噴霧し、基材表面に上記抗微生物組成物の液滴を付着させることをいう。
本発明において、二流体スプレー法とは、スプレー法の一種であり、高圧の空気などのガスと抗微生物組成物とを混合した後、ノズルから霧の状態で噴霧し、基材表面に上記抗微生物組成物の液滴を付着させることをいう。
本発明において、静電スプレー法とは、帯電した抗微生物組成物を利用する散布方法であり、上記したスプレー法により抗微生物組成物を霧の状態で噴霧するが、上記抗微生物組成物を霧状にするための方式には、上記抗微生物組成物を噴霧器で噴霧するガン型と、帯電した抗微生物組成物の反発を利用した静電霧化方式があり、さらに、ガン型には帯電した抗微生物組成物を噴霧する方式と、噴霧した霧状の抗微生物組成物に外部電極からコロナ放電で電荷を付与する方式とがある。霧状の液滴は、帯電しているため、基材表面に付着し易く、良好に上記抗微生物組成物を、細かく分割された状態で基材表面に付着させることができる。
本発明において、エアロゾル法とは、金属の化合物を含む抗微生物組成物を物理的及び化学的に生成した霧状のものを対象物に吹き付ける手法である。
In the present invention, the spray method refers to spraying an antimicrobial composition in a mist state using a gas such as high-pressure air or mechanical movement (finger, piezo element, etc.), and the antimicrobial composition on the surface of the substrate. It means to attach the droplets of.
In the present invention, the two-fluid spray method is a kind of spray method, in which a gas such as high-pressure air and an antimicrobial composition are mixed and then sprayed from a nozzle in a mist state to the surface of the base material. Adhering droplets of microbial composition.
In the present invention, the electrostatic spray method is a spraying method using a charged antimicrobial composition, in which the antimicrobial composition is sprayed in a mist state by the above spray method, but the antimicrobial composition is atomized. There are a gun type in which the antimicrobial composition is sprayed with a sprayer and an electrostatic atomization method using the repulsion of the charged antimicrobial composition, and the gun type is further charged. There are a method of spraying the antimicrobial composition and a method of applying a charge to the sprayed atomized antimicrobial composition by corona discharge from an external electrode. Since the mist-like droplets are charged, they easily adhere to the surface of the base material, and the antimicrobial composition can be satisfactorily adhered to the surface of the base material in a finely divided state.
In the present invention, the aerosol method is a method of spraying a mist of a physically and chemically produced antimicrobial composition containing a metal compound onto an object.
上記散布工程により、抗微生物成分と未硬化の電磁波硬化型樹脂と分散媒と重合開始剤とを含む抗微生物組成物が基材表面に孤立して、もしくは基材表面の一部を露出した状態で重畳して付着した状態となる。 By the above spraying step, an antimicrobial composition containing an antimicrobial component, an uncured electromagnetic wave curable resin, a dispersion medium, and a polymerization initiator is isolated on the surface of the substrate or a part of the surface of the substrate is exposed. It becomes a state where it is superimposed and adhered.
(2)乾燥工程
上記散布工程により基材の表面に散布された抗微生物成分と未硬化の電磁波硬化型樹脂と分散媒と重合開始剤とを含む抗微生物組成物を乾燥させ、分散媒を蒸発、除去し、抗微生物成分を含むバインダ硬化物を基材表面に仮固定させるとともに、バインダ硬化物の収縮により、抗微生物成分をバインダ硬化物の表面から露出させることができる。乾燥条件としては、60〜100℃、0.5〜5.0分が望ましい。
(2) Drying Step The antimicrobial composition containing the antimicrobial component sprayed on the surface of the base material by the spraying step, the uncured electromagnetically curable resin, the dispersion medium and the polymerization initiator is dried, and the dispersion medium is evaporated. , The binder cured product containing the antimicrobial component can be temporarily fixed to the surface of the substrate, and the antimicrobial component can be exposed from the surface of the binder cured product by shrinkage of the binder cured product. The drying conditions are preferably 60 to 100 ° C. and 0.5 to 5.0 minutes.
(3)硬化工程
上記の抗微生物部材を製造する際には、硬化工程として、上記乾燥工程で分散媒を除去した抗微生物組成物中の上記未硬化の電磁波硬化型樹脂であるモノマーやオリゴマーに電磁波を照射して上記電磁波硬化型樹脂を硬化させ、バインダ硬化物とする。
(3) Curing Step When producing the anti-microbial member, as a curing step, the monomer or oligomer which is the uncured electromagnetically curable resin in the anti-microbial composition from which the dispersion medium has been removed in the drying step is used. The electromagnetic wave curable resin is cured by irradiating it with an electromagnetic wave to obtain a binder cured product.
本発明の抗微生物部材の製造方法において、未硬化の電磁波硬化型樹脂に照射する電磁波としては、特に限定されず、例えば、紫外線(UV)、赤外線、可視光線、マイクロ波、電子線(Electron Beam:EB)等が挙げられるが、これらのなかでは、紫外線(UV)が望ましい。
また、上記電磁波は、光重合開始剤を励起して、銅化合物を還元する働きをもつ。このため、銅(II)を還元して銅(I)の量を増やして抗微生物活性を高くすることができる。
In the method for producing an antimicrobial member of the present invention, the electromagnetic wave irradiating the uncured electromagnetic wave curable resin is not particularly limited, and for example, ultraviolet rays (UV), infrared rays, visible rays, microwaves, and electron beams (Electron Beam). : EB) and the like, but among these, ultraviolet rays (UV) are desirable.
Further, the electromagnetic wave has a function of exciting a photopolymerization initiator and reducing a copper compound. Therefore, copper (II) can be reduced to increase the amount of copper (I) to increase the antimicrobial activity.
本発明の抗微生物部材では、X線光電子分光分析法により、925〜955eVの範囲にあるCu(I)とCu(II)に相当する結合エネルギーを5分間測定することで上記銅化合物中にCu(I)とCu(II)の共存が確認されることが望ましい。Cu(I)とはCu(II)は共存した方がそれぞれ単独の場合よりも抗微生物活性が高いからである。 In the anti-microbial member of the present invention, the binding energies corresponding to Cu (I) and Cu (II) in the range of 925 to 955 eV are measured for 5 minutes by X-ray photoelectron spectroscopic analysis to obtain Cu in the copper compound. It is desirable that the coexistence of (I) and Cu (II) is confirmed. This is because Cu (I) and Cu (II) have higher antimicrobial activity when they coexist than when they are used alone.
本発明の抗微生物部材では、X線光電子分光分析法により、925〜955eVの範囲にあるCu(I)とCu(II)に相当する結合エネルギーを5分間測定することで算出される、上記銅化合物中に含まれるCu(I)とCu(II)とのイオンの個数の比率(Cu(I)/Cu(II))は、0.4〜50であることが望ましい。
また、Cu(I)の銅は、Cu(II)の銅と比較して抗微生物性により優れているため、第1の本発明の抗微生物部材において、X線光電子分光分析法により、925〜955eVの範囲にあるCu(I)とCu(II)に相当する結合エネルギーを5分間測定することで算出される、上記銅化合物中に含まれるCu(I)とCu(II)とのイオンの個数の比率(Cu(I)/Cu(II))が1.0〜4.0であると、より抗微生物性に優れた抗微生物部材となる。
これらの工程により、基材表面に抗微生物成分を含むバインダ硬化物が基材表面に固着し、かつ、上記バインダ硬化物は、基材表面の55%を超え、95%以下の範囲を被覆している本発明の抗微生物部材を製造することができる。
In the anti-microbial member of the present invention, the copper is calculated by measuring the bond energies corresponding to Cu (I) and Cu (II) in the range of 925 to 955 eV for 5 minutes by X-ray photoelectron spectroscopic analysis. The ratio of the number of ions of Cu (I) and Cu (II) contained in the compound (Cu (I) / Cu (II)) is preferably 0.4 to 50.
Further, since the copper of Cu (I) is superior in antimicrobial properties to the copper of Cu (II), the first antimicrobial member of the present invention is subjected to X-ray photoelectron spectroscopic analysis to show that 925 to 5 Ions of Cu (I) and Cu (II) contained in the copper compound calculated by measuring the binding energy corresponding to Cu (I) and Cu (II) in the range of 955 eV for 5 minutes. When the ratio of the number (Cu (I) / Cu (II)) is 1.0 to 4.0, the anti-microbial member has more excellent anti-microbial properties.
By these steps, a cured binder containing an antimicrobial component adheres to the surface of the base material, and the cured binder covers a range of more than 55% and 95% or less of the surface of the base material. The antimicrobial member of the present invention can be produced.
上記抗微生物組成物中には、上記した重合開始剤が添加されているので、電磁波を照射することにより未硬化の電磁波硬化型樹脂であるモノマーやオリゴマーの重合反応や架橋反応等が進行し、銅化合物を含むバインダ硬化物が形成される。
上記散布工程により散布された抗微生物組成物は、基材表面に孤立して、もしくは基材表面の一部を露出した状態で重畳して付着しているので、得られたバインダ硬化物は、当該バインダ硬化物が形成された領域と形成されてない領域が混在した状態となる。
Since the above-mentioned polymerization initiator is added to the above-mentioned antimicrobial composition, the polymerization reaction, the cross-linking reaction, and the like of the monomer or oligomer which is an uncured electromagnetically curable resin proceed by irradiating with electromagnetic waves. A binder cured product containing a copper compound is formed.
Since the antimicrobial composition sprayed by the above spraying step is isolated on the surface of the base material or superposed on the surface of the base material in an exposed state, the obtained binder cured product can be obtained. The region where the binder cured product is formed and the region where the binder cured product is not formed are mixed.
上記バインダ硬化物の基材表面への被覆率は、抗微生物組成物中の抗微生物成分の濃度、分散媒の濃度等や散布の圧力、塗液の噴出速度、散布時間等を操作することにより、調整することができる。スプレーガンを用いて噴射する場合は、スプレーガンのエアー圧力やスプレー塗布幅、スプレーガンの移動速度、塗液の噴出速度、塗布距離を変化させることにより、バインダ硬化物の被覆率を調整できる。 The coverage of the cured binder on the substrate surface can be determined by controlling the concentration of the antimicrobial component in the antimicrobial composition, the concentration of the dispersion medium, the spraying pressure, the ejection speed of the coating liquid, the spraying time, and the like. , Can be adjusted. When spraying using a spray gun, the coverage of the cured binder can be adjusted by changing the air pressure of the spray gun, the spray application width, the moving speed of the spray gun, the ejection speed of the coating liquid, and the coating distance.
次に、バインダとして、無機バインダを用いた場合の抗微生物部材の製造方法について説明する。
上記抗微生物部材を製造する際には、まず、基材の表面に、抗微生物成分と無機バインダと分散媒とを含む抗微生物組成物を散布する散布工程を行い、続いて上記散布工程により散布された上記抗微生物組成物を乾燥させて上記分散媒を除去するとともに、抗微生物組成物を硬化させる乾燥・硬化工程を行い、基材の表面に抗微生物成分を含むバインダ硬化物が固着した抗微生物部材を得ることができる。
Next, a method for producing an antimicrobial member when an inorganic binder is used as the binder will be described.
When producing the antimicrobial member, first, a spraying step of spraying an antimicrobial composition containing an antimicrobial component, an inorganic binder and a dispersion medium is performed on the surface of the base material, and then spraying is performed by the spraying step. The antimicrobial composition was dried to remove the dispersion medium, and a drying / curing step of curing the antimicrobial composition was performed to prevent the cured binder containing the antimicrobial component from adhering to the surface of the substrate. A microbial member can be obtained.
(1)散布工程
本発明の抗微生物部材を製造する際には、まず、散布工程として、基材の表面に、抗微生物成分と無機バインダと分散媒とを含む抗微生物組成物を散布する。
(1) Spraying Step When producing the antimicrobial member of the present invention, first, as a spraying step, an antimicrobial composition containing an antimicrobial component, an inorganic binder and a dispersion medium is sprayed on the surface of the base material.
散布の対象となる基材の材料は、特に限定されるものでなく、例えば、金属、ガラス等のセラミック、樹脂、繊維織物、木材等が挙げられる。
また、基材となる部材も、特に限定されるものではなく、建築物内部の内装材、壁材、窓ガラス、ドア等であってもよい、事務機器や家具等であってもよく、上記内装材の外、種々の用途に用いられる化粧板等であってもよい。
The material of the base material to be sprayed is not particularly limited, and examples thereof include ceramics such as metal and glass, resins, textile fabrics, and wood.
Further, the member to be a base material is not particularly limited, and may be an interior material, a wall material, a window glass, a door, etc. inside a building, an office equipment, furniture, etc. In addition to the interior material, it may be a decorative board or the like used for various purposes.
上記抗微生物成分としては、無機系抗微生物剤及び有機系抗微生物剤からなる群から選択される少なくとも1種が挙げられる。
上記無機系抗微生物剤は、銀、銅、亜鉛、白金、亜鉛化合物、銀化合物、銅化合物、金属もしくは金属酸化物が担持された金属酸化物触媒、金属イオンでイオン交換されたゼオライト、及び、銅の錯体からなる群から選択される少なくとも1種であることが望ましく、上記有機系抗微生物剤は、抗微生物樹脂、スルホン酸系界面活性剤、銅のアルコキシド、及び、ビス型第四級アンモニウム塩からなる群から選択される少なくとも1種であることが望ましい。
Examples of the antimicrobial component include at least one selected from the group consisting of inorganic antimicrobial agents and organic antimicrobial agents.
The inorganic antimicrobial agents include silver, copper, zinc, platinum, zinc compounds, silver compounds, copper compounds, metal oxide catalysts carrying metals or metal oxides, zeolite ion-exchanged with metal ions, and It is desirable that the organic antimicrobial agent is at least one selected from the group consisting of copper complexes, and the organic antimicrobial agent is an antimicrobial resin, a sulfonic acid-based surfactant, a copper alkoxide, and a bis-type quaternary ammonium. It is desirable that it be at least one selected from the group consisting of salts.
上記無機バインダは、シリカゾル、アルミナゾル、チタニアゾル、ジルコニアゾル及びケイ酸ナトリウムからなる群から選択される少なくとも1種であることが望ましい。 The inorganic binder is preferably at least one selected from the group consisting of silica sol, alumina sol, titania sol, zirconia sol and sodium silicate.
上記分散媒の種類は特に限定されるものではないが、アルコール類や水を使用する事が好ましい。アルコール類としては、粘性を下げる事を考慮して、例えば、メチルアルコール、エチルアルコール、n−プロピルアルコール、イソプロピルアルコール、n−ブチルアルコール、イソブチルアルコール、sec−ブチルアルコール等のアルコール類が挙げられる。 The type of the dispersion medium is not particularly limited, but it is preferable to use alcohols or water. Examples of alcohols include alcohols such as methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, n-butyl alcohol, isobutyl alcohol, and sec-butyl alcohol in consideration of lowering the viscosity.
上記抗微生物組成物中の抗微生物成分の含有割合は、2〜30重量%が望ましく、無機バインダの含有割合は、15〜60重量%が望ましく、分散媒の含有割合は、30〜80重量%が望ましい。この場合、上記抗微生物組成物中のシリカ等の無機酸化物の含有割合は、5〜20重量%となる。 The content ratio of the antimicrobial component in the antimicrobial composition is preferably 2 to 30% by weight, the content ratio of the inorganic binder is preferably 15 to 60% by weight, and the content ratio of the dispersion medium is 30 to 80% by weight. Is desirable. In this case, the content ratio of the inorganic oxide such as silica in the antimicrobial composition is 5 to 20% by weight.
上記抗微生物組成物中には、必要に応じて、pH調整剤、接着促進剤、レオロジー調整剤、レベリング剤、消泡剤等が配合されていてもよい。
上記抗微生物組成物を調製する際には、分散媒に抗微生物成分、無機バインダ等を添加した後、ミキサー等で充分に攪拌し、抗微生物成分、無機バインダ等が均一な濃度で分散する組成物とした後、直ちに散布することが望ましい。
If necessary, the antimicrobial composition may contain a pH adjuster, an adhesion accelerator, a rheology adjuster, a leveling agent, an antifoaming agent, and the like.
When preparing the above antimicrobial composition, after adding the antimicrobial component, the inorganic binder, etc. to the dispersion medium, the composition is sufficiently stirred with a mixer or the like to disperse the antimicrobial component, the inorganic binder, etc. at a uniform concentration. It is desirable to spray immediately after making a product.
上記散布方法としては、例えば、スプレー法、二流体スプレー法、静電スプレー法、エアロゾル法等が挙げられる。 Examples of the spraying method include a spray method, a two-fluid spray method, an electrostatic spray method, an aerosol method and the like.
本発明において、スプレー法とは、高圧の空気などのガスや機械的な運動(指やピエゾ素子など)用いて抗微生物組成物を霧の状態で噴霧し、基材表面に上記抗微生物組成物の液滴を付着させることをいう。
本発明において、二流体スプレー法とは、スプレー法の一種であり、高圧の空気などのガスと抗微生物組成物とを混合した後、ノズルから霧の状態で噴霧し、基材表面に上記抗微生物組成物の液滴を付着させることをいう。
本発明において、静電スプレー法とは、帯電した抗微生物組成物を利用する散布方法であり、上記したスプレー法により抗微生物組成物を霧の状態で噴霧するが、上記抗微生物組成物を霧状にするための方式には、上記抗微生物組成物を噴霧器で噴霧するガン型と、帯電した抗微生物組成物の反発を利用した静電霧化方式があり、さらに、ガン型には帯電した抗微生物組成物を噴霧する方式と、噴霧した霧状の抗微生物組成物に外部電極からコロナ放電で電荷を付与する方式とがある。霧状の液滴は、帯電しているため、基材表面に付着し易く、良好に上記抗微生物組成物を、細かく分割された状態で基材表面に付着させることができる。
本発明において、エアロゾル法とは、金属の化合物を含む抗微生物組成物を物理的及び化学的に生成した霧状のものを対象物に吹き付ける手法である。
In the present invention, the spray method refers to spraying an antimicrobial composition in a mist state using a gas such as high-pressure air or mechanical movement (finger, piezo element, etc.), and the antimicrobial composition on the surface of the substrate. It means to attach the droplets of.
In the present invention, the two-fluid spray method is a kind of spray method, in which a gas such as high-pressure air and an antimicrobial composition are mixed and then sprayed from a nozzle in a mist state to the surface of the base material. Adhering droplets of microbial composition.
In the present invention, the electrostatic spray method is a spraying method using a charged antimicrobial composition, in which the antimicrobial composition is sprayed in a mist state by the above spray method, but the antimicrobial composition is atomized. There are a gun type in which the antimicrobial composition is sprayed with a sprayer and an electrostatic atomization method using the repulsion of the charged antimicrobial composition, and the gun type is further charged. There are a method of spraying the antimicrobial composition and a method of applying a charge to the sprayed atomized antimicrobial composition by corona discharge from an external electrode. Since the mist-like droplets are charged, they easily adhere to the surface of the base material, and the antimicrobial composition can be satisfactorily adhered to the surface of the base material in a finely divided state.
In the present invention, the aerosol method is a method of spraying a mist of a physically and chemically produced antimicrobial composition containing a metal compound onto an object.
上記散布工程により、抗微生物成分と無機バインダと分散媒とを含む抗微生物組成物の液滴が基材表面に、孤立した状態で、もしくは基材表面の一部を露出して重畳した状態で付着する。 By the above spraying step, droplets of an antimicrobial composition containing an antimicrobial component, an inorganic binder and a dispersion medium are superposed on the surface of the substrate in an isolated state or with a part of the surface of the substrate exposed and superimposed. adhere to.
(2)乾燥・硬化工程
上記散布工程により散布された抗微生物成分と無機バインダと分散媒とを含む抗微生物組成物を乾燥させ、分散媒を蒸発、除去することにより硬化させ、抗微生物成分を含むバインダ硬化物を基材表面に固定させる。乾燥条件としては、20〜100℃、0.5〜5分が望ましい。
(2) Drying / Curing Step The antimicrobial composition containing the antimicrobial component sprayed by the spraying step, the inorganic binder and the dispersion medium is dried, and the dispersion medium is evaporated and removed to cure the antimicrobial component. The cured binder containing the binder is fixed to the surface of the substrate. The drying conditions are preferably 20 to 100 ° C. and 0.5 to 5 minutes.
なお、乾燥前後で、抗微生物性組成物もしくは硬化物に電磁波を照射して、光重合開始剤を励起してもよい。電磁波としては、特に限定されず、例えば、紫外線(UV)、赤外線、可視光線、マイクロ波、電子線(Electron Beam:EB)等が挙げられるが、これらのなかでは、紫外線(UV)が望ましい。
上記電磁波は、光重合開始剤を励起して、銅化合物を還元する働きをもつ。このため、銅(II)を還元して銅(I)の量を増やして抗微生物活性を高くすることができる。
Before and after drying, the antimicrobial composition or the cured product may be irradiated with electromagnetic waves to excite the photopolymerization initiator. The electromagnetic wave is not particularly limited, and examples thereof include ultraviolet rays (UV), infrared rays, visible rays, microwaves, electron beams (EB), and the like, and among these, ultraviolet rays (UV) are preferable.
The electromagnetic wave has a function of exciting a photopolymerization initiator and reducing a copper compound. Therefore, copper (II) can be reduced to increase the amount of copper (I) to increase the antimicrobial activity.
上記バインダ硬化物の基材表面への被覆率は、抗微生物組成物中の抗微生物成分の濃度、分散媒の濃度等や散布の圧力、塗液の噴出速度、散布時間等を操作することにより、調整することができる。スプレーガンを用いて噴射する場合は、スプレーガンのエアー圧力やスプレー塗布幅、スプレーガンの移動速度、塗液の噴出速度、塗布距離を変化させることにより、バインダ硬化物の被覆率を調整できる。 The coverage of the cured binder on the substrate surface can be determined by controlling the concentration of the antimicrobial component in the antimicrobial composition, the concentration of the dispersion medium, the spraying pressure, the ejection speed of the coating liquid, the spraying time, and the like. , Can be adjusted. When spraying using a spray gun, the coverage of the cured binder can be adjusted by changing the air pressure of the spray gun, the spray application width, the moving speed of the spray gun, the ejection speed of the coating liquid, and the coating distance.
(実施例1)
(1)酢酸銅の濃度が0.7wt%になるように、酢酸銅(II)・一水和物粉末(富士フイルム和光純薬製)を純水に溶解させた後、マグネチックスターラーを用い、600rpmで15分撹拌して酢酸銅水溶液を調製した。紫外線硬化樹脂液は、光ラジカル重合型アクリレート樹脂(ダイセル・オルネクス社製 UCECOAT7200)と光重合開始剤(IGM社製 Omnirad500)を重量比98:2で混合し、ホモジナイザーを用い、8000rpmで30分間撹拌して調製した。
上記0.7wt%酢酸銅水溶液と紫外線硬化樹脂液を重量比1.9:1.0で混合し、マグネチックスターラーを用い、600rpmで2分撹拌して抗ウィルス性組成物を調製した。
なお、IGM社製のOmnirad500は、BASF社のIRGACURE500と同じもので、1−ヒドロキシ−シクロヘキシル−フェニル−ケトン(アルキルフェノン)とベンゾフェノンとの重量比1:1の混合物である。すなわち、アルキルフェノン系重合開始剤とベンゾフェノン系重合開始剤は、重量比1:1で存在している。この光重合開始剤は、水に不溶であり、紫外線により還元力を発現する。
(Example 1)
(1) Dissolve cupric acetate (II) monohydrate powder (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) in pure water so that the concentration of copper acetate is 0.7 wt%, and then use a magnetic stirrer. , 600 rpm for 15 minutes to prepare an aqueous cupric acetate solution. The ultraviolet curable resin solution is prepared by mixing a photoradical polymerization type acrylate resin (UCECOAT7200 manufactured by Daicel Ornex) and a photopolymerization initiator (Omnirad500 manufactured by IGM) at a weight ratio of 98: 2, and stirring at 8000 rpm for 30 minutes using a homogenizer. And prepared.
The 0.7 wt% copper acetate aqueous solution and the ultraviolet curable resin solution were mixed at a weight ratio of 1.9: 1.0 and stirred at 600 rpm for 2 minutes using a magnetic stirrer to prepare an antiviral composition.
The Omnirad 500 manufactured by IGM is the same as the IRGACURE 500 manufactured by BASF, and is a mixture of 1-hydroxy-cyclohexyl-phenyl-ketone (alkylphenone) and benzophenone in a weight ratio of 1: 1. That is, the alkylphenone-based polymerization initiator and the benzophenone-based polymerization initiator are present in a weight ratio of 1: 1. This photopolymerization initiator is insoluble in water and exhibits reducing power by ultraviolet rays.
(2)ついで、3000mm×3000mmの大きさの黒色光沢メラミン板上に、7.5g/分の噴出速度で分散媒を含んだ状態で12.0g/m2に相当する抗ウィルス性組成物をスプレーガン(明治機械製作所製 FINER SPOT G12)を用い、0.1MPaのエアー圧力、液噴出量0.02g/秒、30cm/secのストローク速度で霧状に散布し、抗ウィルス性組成物の液滴を黒色光沢メラミン板表面に付着させた。 (2) Next, an antiviral composition equivalent to 12.0 g / m 2 was placed on a black glossy melamine plate having a size of 3000 mm × 3000 mm and containing a dispersion medium at an ejection rate of 7.5 g / min. Using a spray gun (FINER SPOT G12 manufactured by Meiji Kikai Seisakusho), spray the liquid in a mist form with an air pressure of 0.1 MPa, a liquid ejection amount of 0.02 g / sec, and a stroke speed of 30 cm / sec. Droplets were attached to the surface of a black glossy melamine plate.
(3)この後、黒色光沢メラミン板を80℃で3分間乾燥させ、さらに紫外線照射装置(COATTEC社製 MP02)を用い、30mW/cm2の照射強度で80秒間紫外線を照射することにより、基材である黒色光沢メラミン板表面にその表面の一部が露出するように銅化合物を含むバインダ硬化物が固着形成された抗ウィルス性部材を得た。 (3) After that, the black glossy melamine plate is dried at 80 ° C. for 3 minutes, and further irradiated with ultraviolet rays at an irradiation intensity of 30 mW / cm 2 for 80 seconds using an ultraviolet irradiation device (MP02 manufactured by COATTEC). An antiviral member was obtained in which a cured binder containing a copper compound was fixedly formed on the surface of a black glossy melamine plate as a material so that a part of the surface was exposed.
また、実施例1で得られたバインダ硬化物に含まれる銅化合物に関し、以下の方法で、Cu(I)とCu(II)のイオンの個数の比率(Cu(I)/Cu(II))を測定した。その結果、Cu(I)/Cu(II)=1.9であった。実施例2、比較例1、2も、同じ化合物、組成、硬化条件であるため、Cu(I)/Cu(II)=1.9である。 Further, regarding the copper compound contained in the cured binder obtained in Example 1, the ratio of the number of ions of Cu (I) and Cu (II) (Cu (I) / Cu (II)) by the following method. Was measured. As a result, Cu (I) / Cu (II) = 1.9. Since Example 2 and Comparative Examples 1 and 2 also have the same compound, composition, and curing conditions, Cu (I) / Cu (II) = 1.9.
(Cu(I)/Cu(II)の測定試験)
Cu(I)とCu(II)のイオンの個数の比率は、X線光電子分光分析法(XPS分析法)により計測した。測定条件は以下の通り。
・装置:アルバックファイ製 PHI 5000 Versa probeII
・X線源:Al Kα 1486.6eV
・検出角:45°
・測定径:100μm
・帯電中和:有り
−ワイドスキャン
・測定ステップ:0.8eV
・pass energy:187.8eV
−ナロースキャン
・測定ステップ:0.1eV
・pass energy:46.9eV
測定時間は5分で、Cu(I)のピーク位置は、932.5eV ±0.3eV、Cu(II)のピーク位置は933.8eV ±0.3 eVであり、それぞれのピークの面積を積分して、その比率からCu(I)/Cu(II)を得た。
(Cu (I) / Cu (II) measurement test)
The ratio of the number of ions of Cu (I) and Cu (II) was measured by X-ray photoelectron spectroscopy (XPS analysis method). The measurement conditions are as follows.
・ Equipment: ULVAC-PHI PHI 5000 Versa probeII
-X-ray source: Al Kα 1486.6 eV
・ Detection angle: 45 °
・ Measurement diameter: 100 μm
-Charge neutralization: Yes-Wide scan-Measurement step: 0.8 eV
・ Pass energy: 177.8eV
-Narrow scan / measurement step: 0.1 eV
-Pass energy: 46.9 eV
The measurement time is 5 minutes, the peak position of Cu (I) is 932.5 eV ± 0.3 eV, the peak position of Cu (II) is 933.8 eV ± 0.3 eV, and the areas of each peak are integrated. Then, Cu (I) / Cu (II) was obtained from the ratio.
(実施例2)
スプレーガンを用いて霧状に散布する抗ウィルス性組成物の量を18.5g/m2に変更したほかは、実施例1と同様にして、銅化合物を含むバインダ硬化物が、黒色光沢メラミン板表面に、当該表面の一部を露出するように固着した抗ウィルス性部材を得た。
(Example 2)
Similar to Example 1, the cured binder containing the copper compound was black glossy melamine, except that the amount of the antiviral composition sprayed in the form of a mist using a spray gun was changed to 18.5 g / m 2. An antiviral member fixed to the surface of the plate so as to expose a part of the surface was obtained.
(比較例1)
スプレーガンを用いて霧状に散布する抗ウィルス性組成物の量を7.8g/m2に変更したほかは、実施例1と同様にして、銅化合物を含むバインダ硬化物が基材表面に固着した抗ウィルス性部材を得た。
(Comparative Example 1)
A binder cured product containing a copper compound was applied to the surface of the substrate in the same manner as in Example 1 except that the amount of the antiviral composition sprayed in a mist form using a spray gun was changed to 7.8 g / m 2. A fixed antiviral member was obtained.
(比較例2)
実施例1と同様の抗ウィルス性組成物を用いて、9番のコートバーで基材表面全体に塗布した。この後、実施例1と同様に、80℃で3分間乾燥させ、さらに紫外線照射装置(COATTEC社製 MP02)を用い、30mW/cm2の照射強度で80秒間紫外線を照射して、膜状の銅化合物を含むバインダ硬化物が基材表面に固着形成された抗ウィルス性部材を得た。
(Comparative Example 2)
Using the same antiviral composition as in Example 1, it was applied to the entire surface of the substrate with a No. 9 coat bar. After that, in the same manner as in Example 1, the mixture was dried at 80 ° C. for 3 minutes, and further irradiated with ultraviolet rays at an irradiation intensity of 30 mW / cm 2 for 80 seconds using an ultraviolet irradiation device (MP02 manufactured by COATTEC) to form a film. An antiviral member in which a cured binder containing a copper compound was fixedly formed on the surface of a substrate was obtained.
(試験例1)
(1)塩化銅(I)の濃度が0.34wt%になるように、塩化銅(I)粉末(富士フイルム和光純薬社製)を純水に懸濁させた後、マグネチックスターラーを用い、600rpmで15分撹拌して塩化銅懸濁液を調製する。上記0.34wt%塩化銅(I)懸濁液とポリビニルアルコールを重量比1.9:1.0で混合し、マグネチックスターラーを用い、600rpmで2分撹拌して抗ウィルス性組成物を調製する。
(2)ついで、300mm×300mmの大きさのガラス板を用意し、霧吹きで上記抗ウィルス性組成物をこのガラス板表面に、硬化した場合に当該抗ウィルス性組成物の硬化物がガラス板の表面を75%被覆するまで吹き付ける。
(3)この後、ガラス板を室温で24時間乾燥させ、基材であるガラス板表面にその表面の一部が露出するように銅化合物を含むバインダ硬化物が固着形成された抗ウィルス性部材を得る。
(Test Example 1)
(1) After suspending copper (I) chloride powder (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) in pure water so that the concentration of copper (I) chloride becomes 0.34 wt%, use a magnetic stirrer. , 600 rpm for 15 minutes to prepare a copper chloride suspension. The 0.34 wt% copper (I) chloride suspension and polyvinyl alcohol are mixed at a weight ratio of 1.9: 1.0 and stirred at 600 rpm for 2 minutes using a magnetic stirrer to prepare an antiviral composition. To do.
(2) Next, prepare a glass plate having a size of 300 mm × 300 mm, and when the antiviral composition is cured on the surface of the glass plate by spraying, the cured product of the antiviral composition is formed on the glass plate. Spray until 75% of the surface is covered.
(3) After that, the glass plate is dried at room temperature for 24 hours, and an antiviral member in which a binder cured product containing a copper compound is fixedly formed so that a part of the surface of the glass plate as a base material is exposed. To get.
(比較例3)
酢酸銅(II)の濃度が0.7wt%の水溶液を300mm×300mmの大きさの黒色光沢メラミン板上に、メラミン板表面に乾燥時に乾燥物がメラミン板の表面を75%被覆するまで、酢酸銅(II)水溶液を霧吹きにて吹き付けて付着させる。ついで、紫外線を照射せず、室温で48時間乾燥させる。
(Comparative Example 3)
An aqueous solution having a concentration of copper (II) acetate of 0.7 wt% is placed on a black glossy melamine plate having a size of 300 mm × 300 mm, and acetic acid is applied to the surface of the melamine plate until the dried product covers the surface of the melamine plate by 75% when dried. An aqueous solution of copper (II) is sprayed by mist to adhere. Then, it is dried at room temperature for 48 hours without irradiation with ultraviolet rays.
(実施例3)
(1)光ラジカル重合型アクリレート樹脂(ダイセル・オルネクス社製UCECOAT7200)と光重合開始剤(IGM社製 Omnirad500)と光重合開始剤(IGM社製 Omnirad184)を重量比97:2:1で混合し、ホモジナイザーを用いて、8000rpmで10分間撹拌して紫外線硬化樹脂液を調製する。なお、IGM社製 Omnirad500は、BASF社のIRGACURE500と同じもので、1−ヒドロキシ−シクロヘキシル−フェニル−ケトン(アルキルフェノン)とベンゾフェノンの1:1の混合物である。この光重合開始剤は、水に不溶性であり、紫外線を吸収することで還元力を発現する。一方、光重合開始剤(IGM社製 Omnirad184)は、1−ヒドロキシ−シクロヘキシル−フェニル−ケトン(アルキルフェノン)であり、結局光重合開始剤としては、アルキルフェノンとベンゾフェノンは重量比で2:1の割合で存在している。
(2)水とビス型第四級アンモニウム塩(1,1′−ジデシル−3,3′−[ブタン−1,4−ジイルビス(オキシメチレン)]ジピリジニウム=ジブロミド)と上記紫外線硬化樹脂液を重量比19:0.51:10で混合し、マグネチックスターラーを用い、600rpmで2分撹拌して抗ウィルス性組成物を調製する。
(3)ついで、500mm×500mmの大きさの黒色光沢メラミン板上に、7.5g/分の噴出速度で分散媒を含んだ状態で12.0g/m2に相当する抗ウィルス性組成物をスプレーガン(明治機械製作所製 FINER SPOT G12)を用い、0.1MPaのエアー圧力、30cm/秒のストローク速度で霧状に散布し、抗ウィルス性組成物の液滴を黒色光沢メラミン板表面に島状に散在させる。
(4)この後、黒色光沢メラミン板を80℃で3分間乾燥させ、さらに紫外線照射装置(COATTEC社製 MP02)を用い、30mW/cm2の照射強度で80秒間紫外線を照射することにより、基材である黒色光沢メラミン板表面に銅化合物を含むバインダ硬化物が基材表面に固着した抗ウィルス性部材を得る。
(Example 3)
(1) A photoradical polymerization type acrylate resin (UCECOAT7200 manufactured by Daicel Ornex), a photopolymerization initiator (Omnirad500 manufactured by IGM) and a photopolymerization initiator (Omnirad 184 manufactured by IGM) are mixed at a weight ratio of 97: 2: 1. , Using a homogenizer, stir at 8000 rpm for 10 minutes to prepare an ultraviolet curable resin solution. The Omnirad 500 manufactured by IGM is the same as the IRGACURE 500 manufactured by BASF, and is a 1: 1 mixture of 1-hydroxy-cyclohexyl-phenyl-ketone (alkylphenone) and benzophenone. This photopolymerization initiator is insoluble in water and exhibits reducing power by absorbing ultraviolet rays. On the other hand, the photopolymerization initiator (Omnirad 184 manufactured by IGM) is 1-hydroxy-cyclohexyl-phenyl-ketone (alkylphenone), and after all, as the photopolymerization initiator, alkylphenone and benzophenone have a weight ratio of 2: 1. It exists in proportion.
(2) Water, bis-type quaternary ammonium salt (1,1'-didecyl-3,3'-[butane-1,4-diylbis (oxymethylene)] dipyridinium = dibromid) and the above ultraviolet curable resin solution. Mix at a weight ratio of 19: 0.51: 10 and stir at 600 rpm for 2 minutes using a magnetic stirrer to prepare an antiviral composition.
(3) Next, an antiviral composition equivalent to 12.0 g / m 2 was placed on a black glossy melamine plate having a size of 500 mm × 500 mm and containing a dispersion medium at an ejection rate of 7.5 g / min. Using a spray gun (FINER SPOT G12 manufactured by Meiji Kikai Seisakusho), spray the droplets of the antiviral composition on the surface of the black glossy melamine plate in the form of mist at an air pressure of 0.1 MPa and a stroke speed of 30 cm / sec. Scatter in a shape.
(4) After that, the black glossy melamine plate is dried at 80 ° C. for 3 minutes, and further irradiated with ultraviolet rays at an irradiation intensity of 30 mW / cm 2 for 80 seconds using an ultraviolet irradiation device (MP02 manufactured by COATTEC). An antiviral member is obtained in which a cured binder containing a copper compound adheres to the surface of a base material on the surface of a black glossy melamine plate which is a material.
(実施例4)
スプレーガンを用いて霧状に散布する抗ウィルス性組成物の量を18.5g/m2に変更したほかは、実施例3と同様にしてバインダ硬化物が基材表面に固着した抗ウィルス性部材を得る。
(Example 4)
Antiviral property in which the binder cured product adhered to the surface of the substrate in the same manner as in Example 3 except that the amount of the antiviral composition sprayed in a mist form using a spray gun was changed to 18.5 g / m 2. Get the member.
(実施例5)
スプレーガンを用いて霧状に散布する抗ウィルス性組成物の量を20.0g/m2に変更したほかは、実施例3と同様にしてバインダ硬化物が基材表面に固着した抗ウィルス性部材を得る。
(Example 5)
Antiviral property in which the binder cured product adhered to the surface of the substrate in the same manner as in Example 3 except that the amount of the antiviral composition sprayed in a mist form using a spray gun was changed to 20.0 g / m 2. Obtain a member.
(比較例4)
スプレーガンを用いて霧状に散布する抗ウィルス性組成物の量を7.0g/m2に変更したほかは、実施例3と同様にしてバインダ硬化物が基材表面に固着した抗ウィルス性部材を得る。
(Comparative Example 4)
Antiviral property in which the binder cured product adhered to the surface of the substrate in the same manner as in Example 3 except that the amount of the antiviral composition sprayed in a mist form using a spray gun was changed to 7.0 g / m 2. Obtain a member.
(比較例5)
実施例3と同様の抗ウィルス性組成物を用いて、9番のコートバーで基材表面全体に塗布する。
(Comparative Example 5)
Using the same antiviral composition as in Example 3, the coating bar No. 9 is applied to the entire surface of the substrate.
(抗ウィルス性部材の形状及びバインダ硬化物の分散状態の評価)
得られた抗ウィルス性部材について、光学顕微鏡(キーエンス社製 マイクロスコープ VHX−5000)で写真を撮影した。図2は、実施例2で得られた抗ウィルス性部材を示す光学顕微鏡写真である。基材である黒色光沢メラミン板表面にバインダ硬化物がその表面の一部を露出するように、固着形成されていることが分かる。
図2は、バインダ硬化物が形成された領域とバインダ硬化物が形成されていない領域が混在しているものである。
(Evaluation of the shape of the antiviral member and the dispersed state of the binder cured product)
The obtained antiviral member was photographed with an optical microscope (Microscope VHX-5000 manufactured by KEYENCE CORPORATION). FIG. 2 is an optical micrograph showing the antiviral member obtained in Example 2. It can be seen that the binder cured product is fixedly formed on the surface of the black glossy melamine plate which is the base material so as to expose a part of the surface.
FIG. 2 shows a mixture of a region in which a cured binder is formed and a region in which a cured binder is not formed.
また、実施例1、2及び比較例1で得られた抗ウィルス性部材に関し、画像の2値化処理により、2410291μm2当たり(1552μm□)の基材表面に示すバインダ硬化物の面積を3点測定し、平均表面被覆率を算出した。また、観察範囲とバインダ硬化物の面積から、1mm2あたりのバインダ硬化物の塗布面積(nm2)を算出した。さらに、ふき取り試験後のウィルス不活度を1mm2あたりの塗布面積(μm2)で除して、単位塗布面積当たりのウィルス不活度(×10-6)を計算し、それらの結果を表1に示す。この実施例では、1mm2あたりの、塗布面積で除しているが、メラミン板の面積は実施例1、2、比較例1、2とも同じであるため、1mm2当たりの塗布面積で除して値を比較することで、単位塗布面積当たりのウィルス不活度(抗ウィルス活性)を比較することができる。
比較例2については、バインダ硬化物の膜に穴等の欠損がないことを確認し、面積被覆率を100%として計算した。
Further, with respect to the antiviral members obtained in Examples 1 and 2 and Comparative Example 1, the area of the cured binder shown on the surface of the substrate per 241291 μm 2 (1552 μm □) was determined by binarizing the images. The measurement was performed and the average surface coverage was calculated. Moreover, the coating area (nm 2 ) of the binder cured product per 1 mm 2 was calculated from the observation range and the area of the binder cured product. Furthermore, the virus inactivity after the wiping test is divided by the coating area per 1 mm 2 (μm 2 ) to calculate the virus inactivity per unit coating area (× 10 -6 ), and the results are shown in the table. Shown in 1. In this example, it is divided by the coating area per 1 mm 2 , but since the area of the melamine plate is the same in Examples 1 and 2 and Comparative Examples 1 and 2, it is divided by the coating area per 1 mm 2. By comparing the values, the virus inactivity (antiviral activity) per unit coating area can be compared.
For Comparative Example 2, it was confirmed that there were no defects such as holes in the film of the cured binder, and the area coverage was calculated as 100%.
(抗ウィルス性部材の表面のふき取り処理)
実施例1、2及び比較例1、2で得られた抗ウィルス性部材に対し、水道水を染み込ませたマイクロファイバークロスを用いて、150Paの圧力で5475回の拭き取り試験を実施した。
(Wipe off the surface of antiviral material)
The antiviral members obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were wiped 5475 times at a pressure of 150 Pa using a microfiber cloth impregnated with tap water.
(ファージウィルスを用いた抗ウィルス性評価)
この抗ウィルス性試験は以下のように実施した。
実施例1、2及び比較例1、2で得られた抗ウィルス性部材における、表面ふき取り処理後の抗ウィルス性を評価するために、JIS Z 2801 抗菌加工製品−抗菌性試験方法・抗菌効果を改変した手法を用いた。改変点は、「試験菌液の接種」を「試験ウィルスの接種」に変更した点である。ウィルスを使用することによる変更点についてはすべてJIS L 1922繊維製品の抗ウィルス性試験方法に基づき変更した。測定結果は実施例1、2、比較例1、2で得られた抗ウィルス性部材についてJIS L 1922付属書Bに基づき、大腸菌への感染能力を失ったファージウィルス濃度をウィルス不活度として表示する。ここで、ウィルス濃度の指標として、大腸菌に対して不活性化されたウィルスの濃度(ウィルス不活度)を使用し、このウィルス不活度に基づいて抗ウィルス活性値を算出した。
(Antiviral evaluation using phage virus)
This antiviral test was carried out as follows.
In order to evaluate the antiviral property of the antiviral members obtained in Examples 1 and 2 and Comparative Examples 1 and 2 after the surface wiping treatment, JIS Z 2801 antibacterial processed product-antibacterial test method / antibacterial effect was introduced. A modified method was used. The modification is that "inoculation of test bacterial solution" was changed to "inoculation of test virus". All changes due to the use of viruses were made based on the antiviral test method for JIS L 1922 textile products. The measurement results are based on JIS L 1922 Annex B for the antiviral members obtained in Examples 1 and 2 and Comparative Examples 1 and 2, and the concentration of the phage virus that has lost the ability to infect Escherichia coli is displayed as the virus inactivity. To do. Here, the concentration of the virus inactivated against Escherichia coli (virus inactivity) was used as an index of the virus concentration, and the antiviral activity value was calculated based on this virus inactivity.
以下、手順を具体的に記載する。
(1) 実施例1、2及び比較例1、2で得られた抗ウィルス性部材について、前述の表面ふき取り処理を行った後、当該抗ウィルス性部材を1辺50mm角の正方形に切り出して試験試料とした。この試験試料を滅菌済プラスチックシャーレに置き、試験ウィルス液(>107PFU/mL)を0.4mL接種する。
試験ウィルス液は108PFU/mLのストックを精製水で10倍希釈したものを使用する。
(2) 対照試料として50mm角のポリエチレンフイルムを用意し、試験試料と同様にウィルス液を接種する。
The procedure will be described in detail below.
(1) The antiviral members obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were subjected to the above-mentioned surface wiping treatment, and then the antiviral members were cut into squares having a side of 50 mm square for testing. It was used as a sample. Place the test specimen in sterilized plastic Petri dish,
Test virus solution is used after diluting 10-fold stock of 10 8 PFU / mL with purified water.
(2) Prepare a 50 mm square polyethylene film as a control sample and inoculate the virus solution in the same manner as the test sample.
(3) 接種したウィルスの液の上から40mm角のポリエチレンを被せ、試験ウィルス液を均等に接種させた後、25℃で所定時間反応させる。
(4) 接種直後または反応後、SCDLP培地10mLを加え、ウィルス液を洗い流す。
(5) JIS L 1922付属書Bによってウィルスの感染値を求める。
(3) Cover the inoculated virus solution with 40 mm square polyethylene, inoculate the test virus solution evenly, and then react at 25 ° C. for a predetermined time.
(4) Immediately after inoculation or after the reaction, add 10 mL of SCDLP medium and wash away the virus solution.
(5) Obtain the virus infection value according to JIS L 1922 Annex B.
(6) 以下の計算式を用いて抗ウィルス活性値を算出する。
Mv=Log(Vb/Vc)
Mv:抗ウィルス活性値
Log(Vb):ポリエチレンフイルムの所定時間反応後の感染値の対数値
Log(Vc):試験試料の所定時間反応後の感染値の対数値
参考規格 JIS L 1922、JIS Z 2801
測定方法は、プラーク測定法によった。
得られた抗ウィルス活性値を表1に示す。
(6) Calculate the antiviral activity value using the following formula.
Mv = Log (Vb / Vc)
Mv: Antiviral activity value Log (Vb): Logistic value of the infection value after the reaction of the polyethylene film for a predetermined time Log (Vc): Logistic reference standard of the infection value after the reaction of the test sample for a predetermined time JIS L 1922, JIS Z 2801
The measuring method was a plaque measuring method.
The obtained antiviral activity values are shown in Table 1.
表1には、バインダ硬化物の基材表面の被覆率(%)、平均表面被覆率(%)、3点測定した抗ウィルス性組成物の塗布面積(μm2)、抗ウィルス性組成物の3点の平均塗布面積(μm2)、顕微鏡の測定範囲(顕微鏡の視野)(μm2)、顕微鏡の測定範囲(顕微鏡の視野)(mm2)、抗ウィルス性組成物の1mm2当たりの塗布面積(μm2/mm2)、抗ウィルス活性値、バインダ硬化物の単位面積当たりの抗ウィルス活性値(×10−6)を示している。 Table 1 shows the coverage (%) of the substrate surface of the cured binder, the average surface coverage (%), the coating area of the antiviral composition measured at three points (μm 2 ), and the antiviral composition. Average coating area of 3 points (μm 2 ), measuring range of microscope (micron field) (μm 2 ), measuring range of microscope (micron field) (mm 2 ), coating per 1 mm 2 of antiviral composition The area (μm 2 / mm 2 ), antiviral activity value, and antiviral activity value per unit area of the binder cured product (× 10-6 ) are shown.
図3は、実施例1、2及び比較例1、2で得られた抗ウィルス性部材の表面のふき取り処理後のバインダ硬化物の単位面積当たりの抗ウィルス活性の結果を示すグラフである。図3における横軸は、バインダ硬化物の基材表面への被覆率であり、縦軸は、バインダ硬化物の単位面積当たりの抗ウィルス活性値である。
図4は、実施例1、2及び比較例1、2で得られた抗ウィルス性部材の抗ウィルス活性の結果を示すグラフである。図4では、横軸は、バインダ硬化物の基材表面への被覆率であり、縦軸は、抗ウィルス活性値である。
バインダ硬化物は、概ね均一であるから、抗ウィルス活性値をバインダ硬化物の被覆面積で除した値(×10−6)は、抗ウィルス成分の単位担持量当たりの抗ウィルス活性値として代用することができる。
FIG. 3 is a graph showing the results of antiviral activity per unit area of the binder cured product after wiping the surface of the antiviral member obtained in Examples 1 and 2 and Comparative Examples 1 and 2. The horizontal axis in FIG. 3 is the coverage of the cured binder on the surface of the substrate, and the vertical axis is the antiviral activity value per unit area of the cured binder.
FIG. 4 is a graph showing the results of the antiviral activity of the antiviral members obtained in Examples 1 and 2 and Comparative Examples 1 and 2. In FIG. 4, the horizontal axis is the coverage of the cured binder on the substrate surface, and the vertical axis is the antiviral activity value.
Since the binder cured product is generally uniform, the value obtained by dividing the antiviral activity value by the covering area of the binder cured product (× 10-6 ) is substituted as the antiviral activity value per unit carrier amount of the antiviral component. be able to.
表1及び図3、図4によれば、表面のふき取り処理後のバインダ硬化物の単位面積当たりの抗ウィルス活性値は基材表面への被覆率が55%を超え、95%以下範囲が最も優れていることが分かる。
図3では、縦軸が1mm2当たりのバインダ硬化物の単位面積当たりの抗ウィルス活性値であるが、実用上では面積が1m2以上の基材が使用されるため、実際の抗ウィルス活性値は、106倍となる。ふき取り処理後に、抗ウィルス活性値が3以上、つまりウィルス量を1/1000以下にできるだけの抗ウィルス活性があれば、ウィルス感染を防止できるため実用に耐える。従って、本発明では、1mm2当たりのバインダ硬化物の単位面積当たりの抗ウィルス活性値が3×10−6以上の範囲が実用上有効な範囲となる。
また、本発明の抗ウィルス性部材は、基材表面の抗ウィルス性のバインダ硬化物の被覆率を調整することで、抗ウィルス性のバインダ硬化物の単位担持量(単位面積)当たりの抗ウィルス活性を高くできるため、最小限の抗ウィルス性組成物で実用的な抗ウィルス活性が得られるのである。
また、図4においても、表面のふき取り処理後のバインダ硬化物の単位面積当たりの抗ウィルス活性値は基材表面への被覆率が55%を超え、95%以下範囲が最も優れていることが分かる。
According to Table 1, FIG. 3 and FIG. 4, the antiviral activity value per unit area of the binder cured product after the surface wiping treatment is most in the range of 95% or less, with the coverage on the substrate surface exceeding 55%. It turns out to be excellent.
In FIG. 3, the vertical axis is the antiviral activity value per unit area of the binder cured product per 1 mm 2 , but since a base material having an area of 1 m 2 or more is used in practical use, the actual antiviral activity value. is 10 6 times. After the wiping treatment, if the antiviral activity value is 3 or more, that is, if there is enough antiviral activity to reduce the amount of virus to 1/1000 or less, virus infection can be prevented and it is practically usable. Therefore, in the present invention, a range in which the antiviral activity value per unit area of the binder cured product per 1 mm 2 is 3 × 10 -6 or more is a practically effective range.
Further, the antiviral member of the present invention adjusts the coverage of the antiviral binder cured product on the surface of the base material to prevent the virus per unit carrying amount (unit area) of the antiviral binder cured product. Since the activity can be increased, practical antiviral activity can be obtained with a minimum amount of antiviral composition.
Further, also in FIG. 4, the antiviral activity value per unit area of the binder cured product after the surface wiping treatment is best in the range of 95% or less, with the coverage on the substrate surface exceeding 55%. I understand.
なお、試験例1、比較例3のふき取り処理後の抗ウィルス活性値は、それぞれ3.0、0.1であり、同じ被覆率の実施例2(75.3%)に比べて抗ウィルス活性が低い結果であるが、試験例1では、硬化物中にはCu(I)のみが存在し、Cu(II)のCu(I)の酸化防止効果が働かず、比較例3では乾燥物中にはCu(II)のみが存在しており、バインダを含んでいないため、拭き取り処理で酢酸銅が全て除去されてしまっていると考えられる。 The antiviral activity values of Test Example 1 and Comparative Example 3 after the wiping treatment were 3.0 and 0.1, respectively, and the antiviral activity was higher than that of Example 2 (75.3%) having the same coverage. However, in Test Example 1, only Cu (I) was present in the cured product, the antioxidant effect of Cu (I) of Cu (II) did not work, and in Comparative Example 3, it was in the dried product. Since only Cu (II) is present in the product and does not contain a binder, it is considered that all the copper acetate has been removed by the wiping process.
実施例3〜5、比較例4、5の抗ウィルス性部材に関しても、実施例1〜2及び比較例1〜2と同様に、平均表面被覆率を求め、ファージウィルスを用いた抗ウィルス性試験により抗ウィルス活性値を得た。結果を表2に記載する。 With respect to the antiviral members of Examples 3 to 5 and Comparative Examples 4 and 5, the average surface coverage was determined and the antiviral test using a phage virus was performed in the same manner as in Examples 1 and 2 and Comparative Examples 1 and 2. The antiviral activity value was obtained. The results are shown in Table 2.
表2より明らかなように、実施例3〜5の抗ウィルス性部材では、被覆率55%〜95%で、拭き取り処理後でも抗ウィルス活性として3以上を実現できているが、比較例4の部材では、拭き取り処理により、抗ウィルス性のバインダが摩耗もしくは脱落して、十分な抗ウィルス性能が得られない。また、比較例5の抗ウィルス性部材のように被覆率が高すぎても十分な抗ウィルス活性が得られない。 As is clear from Table 2, the antiviral members of Examples 3 to 5 have a coverage of 55% to 95% and can achieve an antiviral activity of 3 or more even after the wiping treatment, but in Comparative Example 4. In the member, the antiviral binder is worn or dropped by the wiping process, and sufficient antiviral performance cannot be obtained. Further, even if the coverage is too high as in the antiviral member of Comparative Example 5, sufficient antiviral activity cannot be obtained.
上記した実施例及び比較例によれば、実施例1〜5で得た抗ウィルス性部材では、基材である黒色光沢メラミン板表面に抗ウィルス成分を含むバインダ硬化物が固着形成され、かつ、上記バインダ硬化物は、基材表面の55%を超え、95%以下を被覆しているので、抗ウィルス性基材の表面にふき取り清掃などの応力が加えられても、抗ウィルス成分を含むバインダ硬化物が脱落したり、摩耗して欠損しにくく、単位担持量当たり抗ウィルス活性の高い抗ウィルス性部材となることが立証された。 According to the above-mentioned Examples and Comparative Examples, in the antiviral members obtained in Examples 1 to 5, a binder cured product containing an antiviral component was fixedly formed on the surface of a black glossy melamine plate as a base material, and Since the cured binder material covers more than 55% and 95% or less of the surface of the base material, even if stress such as wiping and cleaning is applied to the surface of the antiviral base material, a binder containing an antiviral component. It has been proved that the cured product does not easily fall off or wear out and is not easily damaged, and that it becomes an antiviral member having high antiviral activity per unit carrying amount.
(黄色ブドウ球菌を用いた抗菌性評価)
黄色ブドウ球菌を用いた抗菌性評価を、以下のように実施した。
(1)実施例1〜5及び比較例1〜2、4、5で得られた抗ウィルス性部材を、50mm角の正方形に切り出した試験試料を滅菌済プラスチックシャーレに置き、試験菌液(菌数2.5×105〜10×105/mL)を0.4mL接種する。
試験菌液は、培養器中で温度35±1℃で16〜24時間前培養した培養菌を、さらに斜面培地に移植して、培養器中で温度35±1℃で16〜20時間前培養したものを、1/500NB培地により適宜調整したものを使用する。
(2)対照試料として50mm角のポリエチレンフイルムを用意し、試験試料と同様に試験菌液を接種する。
(3)接種した試験菌液の上から40mm角のポリエチレンフイルムを被せ、試験菌液を均等に接種させた後、温度35±1℃で8±1時間反応させる。
(4)接種直後または反応後、SCDLP培地10mLを加え、試験菌液を洗い出す。
(5)洗い出し液を適宜希釈し、標準寒天培地と混合して生菌数測定用シャーレを作成し、温度35±1℃で40〜48時間培養した後、集落数を測定する。
(6)生菌数の計算
以下の計算式を用いて生菌数を求める。
N=C×D×V
N:生菌数
C:集落数
D:希釈倍率
V:洗い出しに用いたSCDLP培地の液量(mL)
(7) 以下の計算式を用いて抗菌活性値を算出する。
R=(Ut−U0)−(At−U0)=Ut−At
R:抗菌活性値
U0:無加工試験片の接種直後の生菌数の対数値の平均値
Ut:無加工試験片の24 時間後の生菌数の対数値の平均値
At:抗菌加工試験片の24時間後の生菌数の対数値の平均値
参考規格 JIS Z 2801
試験菌はStaphylococcus aureus NBRC12732を使用した。
評価結果を表3及び表4に記載する。
(Evaluation of antibacterial properties using Staphylococcus aureus)
Antibacterial evaluation using Staphylococcus aureus was carried out as follows.
(1) The test sample obtained by cutting out the antiviral members obtained in Examples 1 to 5 and Comparative Examples 1 to 2, 4 and 5 into a square of 50 mm square was placed in a sterilized plastic petri dish, and the test bacterial solution (bacteria) was placed. Number 2.5 x 10 5 to 10 x 10 5 / mL) is inoculated with 0.4 mL.
For the test bacterial solution, the cultured bacteria pre-cultured in the incubator at a temperature of 35 ± 1 ° C. for 16 to 24 hours are further transplanted to the slope medium and pre-cultured in the incubator at a temperature of 35 ± 1 ° C. for 16 to 20 hours. The one that has been appropriately adjusted with 1/500 NB medium is used.
(2) Prepare a 50 mm square polyethylene film as a control sample, and inoculate the test bacterial solution in the same manner as the test sample.
(3) Cover the inoculated test bacterial solution with a 40 mm square polyethylene film, inoculate the test bacterial solution evenly, and then react at a temperature of 35 ± 1 ° C. for 8 ± 1 hour.
(4) Immediately after inoculation or after the reaction, add 10 mL of SCDLP medium and wash out the test bacterial solution.
(5) The wash-out solution is appropriately diluted and mixed with a standard agar medium to prepare a petri dish for measuring the viable cell count. After culturing at a temperature of 35 ± 1 ° C. for 40 to 48 hours, the number of colonies is measured.
(6) Calculation of viable cell count The viable cell count is calculated using the following formula.
N = C × D × V
N: Number of viable bacteria C: Number of colonies D: Dilution ratio V: Liquid volume (mL) of SCDLP medium used for washing out
(7) Calculate the antibacterial activity value using the following formula.
R = (Ut-U0)-(At-U0) = Ut-At
R: Antibacterial activity value U0: Mean value of log value of viable cell count immediately after inoculation of unprocessed test piece Ut: Mean value of log value of viable cell count 24 hours after inoculation of unprocessed test piece At: Antibacterial processed test piece Reference standard JIS Z 2801
Staphylococcus aureus NBRC12732 was used as the test bacterium.
The evaluation results are shown in Tables 3 and 4.
(クロコウジカビを用いた抗カビ性評価)
クロコウジカビを用いた抗カビ性評価を、以下のように実施した。
(1)実施例1〜5及び比較例1〜2、4、5で得られた抗ウィルス性部材を、50mm角の正方形に切り出した試験試料を滅菌済プラスチックシャーレに置き、胞子懸濁液(胞子濃度>2x105個/ml)を0.4mL接種する。
(2)対照試料として50mm角のポリエチレンフイルムを用意し、試験試料と同様に胞子懸濁液を接種する。
(3)接種した胞子懸濁液の上から40mm角のポリエチレンフイルムを被せ、胞子懸濁液を均等に接種させた後、温度26℃で約900LUXの光を照射しながら42時間反応させる。
(4)接種直後または反応後、JIS L 1921 13発光量の測定に従い、ATP量を測定する。
(5)以下の計算式を用いて抗カビ活性値を算出する。
Aa=(LogCt−LogC0)−(LogTt−LogT0)
Aa:抗カビ活性値
LogC0:接種直後の対照試料3検体のATP量の算術平均の常用対数値
LogCt:培養後の対照試料3検体のATP量の算術平均の常用対数値
LogT0:接種直後の試験試料3検体のATP量の算術平均の常用対数値
LogTt:培養後の試験試料3検体のATP量の算術平均の常用対数値
参考規格 JIS Z 2801、JIS L 1921
試験カビはAspergillus niger NBRC105649を使用した。
評価結果を表3及び表4に記載する。
(Evaluation of antifungal properties using Aspergillus niger)
The antifungal property evaluation using Aspergillus niger was carried out as follows.
(1) A test sample obtained by cutting out the antiviral members obtained in Examples 1 to 5 and Comparative Examples 1 to 2, 4 and 5 into a square of 50 mm square was placed on a sterilized plastic petri dish, and a spore suspension (spore suspension). Inoculate 0.4 mL of spore concentration> 2x10 5 cells / ml).
(2) Prepare a 50 mm square polyethylene film as a control sample, and inoculate the spore suspension in the same manner as the test sample.
(3) Cover the inoculated spore suspension with a 40 mm square polyethylene film, inoculate the spore suspension evenly, and then react for 42 hours while irradiating light of about 900 LUX at a temperature of 26 ° C.
(4) Immediately after inoculation or after the reaction, the amount of ATP is measured according to the measurement of JIS L 1921 13 luminescence amount.
(5) Calculate the antifungal activity value using the following formula.
A a = (LogC t- LogC 0 )-(LogT t- LogT 0 )
A a : Antifungal activity value LogC 0 : Arithmetic mean of ATP amount of 3 control samples immediately after inoculation LogC t : Arithmetic mean of ATP of 3 control samples after culture LogT 0 : Arithmetic mean of the ATP amount of the three test samples immediately after inoculation LogT t : Common logarithmic reference standard of the arithmetic mean of the ATP amount of the three test samples after culture JIS Z 2801, JIS L 1921
Aspergillus niger NBRC105649 was used as the test mold.
The evaluation results are shown in Tables 3 and 4.
以上のように、本発明の実施例にかかる抗ウィルス部材は、バインダ硬化物による基材表面の被覆率が55%を超え、95%以下の場合、拭き取り処理後でも優れた抗ウィルス性能を示し、また、バインダ硬化物による基材表面の被覆率が55%を超え、95%以下の場合は、拭き取り処理後でも抗カビ性に優れることが分かる。また、抗菌性についても、同様である。
バインダ硬化物による基材表面の被覆率が55%を超え、95%以下の場合は、抗微生物バインダ硬化物の凸に相当する部分が平坦形状に近くなるため、表面が平滑な状態となり、拭き取り時の摩耗による抗微生物バインダ硬化物の欠損が少なくなり、拭き取り処理後でも、抗ウィルス、抗菌、抗カビ性に優れるのではないかと推定している。なお、バインダ硬化物の基材表面の被覆率を調整することによる拭き取り処理後の抗微生物活性の改善効果は、抗ウィルス性、抗カビ性の方が、抗菌性よりも高く、本発明の効果が特に高いと言える。このように、実施例1〜5の抗ウィルス性部材は、抗菌、抗カビ部材としても使用できる。
As described above, the antiviral member according to the embodiment of the present invention exhibits excellent antiviral performance even after wiping treatment when the coverage of the substrate surface with the binder cured product exceeds 55% and is 95% or less. Further, when the coverage of the surface of the base material with the cured binder exceeds 55% and is 95% or less, it can be seen that the antifungal property is excellent even after the wiping treatment. The same applies to antibacterial properties.
When the coverage of the substrate surface with the cured binder exceeds 55% and is 95% or less, the portion corresponding to the convexity of the cured antimicrobial binder becomes close to a flat shape, so that the surface becomes smooth and wiped off. It is presumed that the loss of the cured anti-microbial binder due to wear during time is reduced, and that it is excellent in antiviral, antibacterial, and antifungal properties even after wiping. The effect of improving the antimicrobial activity after wiping treatment by adjusting the coverage of the surface of the cured binder material is higher in antiviral and antifungal properties than in antibacterial properties, and the effect of the present invention. Can be said to be particularly high. As described above, the antiviral members of Examples 1 to 5 can also be used as antibacterial and antifungal members.
10 抗微生物部材
11 基材
12 膜形成領域
13 膜非形成領域
10
Claims (2)
前記バインダ硬化物は、電磁波硬化型樹脂の硬化物からなり、
前記バインダ硬化物は、前記基材表面に、島状に散在してなるか、または、前記バインダ硬化物が前記基材表面に固着形成された領域と前記バインダ硬化物が形成されていない領域が混在して設けられてなり、
前記バインダ硬化物が、基材表面の塗布面積の55%を超え、95%以下の範囲を被覆していることを特徴とする抗ウィルス性部材。 A binder cured product containing a copper compound as an antiviral component is fixedly formed on the surface of the base material.
The binder cured product is made of a cured product of an electromagnetic wave curable resin.
The binder cured product is scattered on the surface of the base material in an island shape, or a region in which the binder cured product is fixedly formed on the surface of the base material and a region in which the binder cured product is not formed are formed. It is provided in a mixed manner
An antiviral member , wherein the cured binder covers a range of more than 55% and 95% or less of the coating area on the surface of the base material.
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