JP6834227B2 - Light deflector, image display device, image projection device, light writing device, object recognition device, vehicle - Google Patents

Description

The present invention relates to an optical deflector, an image display device, an image projection device, an optical writing device, an object recognition device, and a vehicle .

As a means for deflecting and scanning an optical beam, a small optical deflector in which a movable portion having a reflecting surface on a substrate and an elastic beam portion are integrally formed has been developed by applying semiconductor manufacturing technology.
In such an optical deflector, there is known a configuration in which a piezoelectric material is sandwiched between electrodes, a voltage is applied, and a movable portion is rotated by expansion and contraction of the piezoelectric material.

In an optical deflector having such a configuration, it is required to have a large scanning angle and vibrate at high speed. However, when the scanning angle is improved, there is a problem that peeling easily proceeds between the electrode and the wiring member due to the piezoelectric member being repeatedly deformed at high speed, especially at the end of the piezoelectric material having a large swing width.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an optical deflector that suppresses the progress of peeling and cracking and reduces failures even when the piezoelectric member is repeatedly deformed. To do.

In order to solve the above-mentioned problems, in the optical deflector of the present invention, a mirror portion having a reflecting surface, a support portion in which a plurality of elastic portions are continuously formed in a meandering shape to support the mirror portion, and the elastic portion. connecting a plurality of pressure electrostatic drive unit provided separately, the pressure electrostatic drive unit and at least partially covers the insulating film, at least two pressure electric drive unit via an opening provided in the insulating film It has a connection portion which, the said pressure electric drive unit includes a lower electrode, a piezoelectric portion, and an upper electrode, is laminated, and the connecting portion and the upper electrode of the piezoelectric driving unit abuts surface, said abutting in the plane along the stacked direction of the upper electrode, the surface and the piezoelectric portion is in contact of the connecting portion and the pressure electrostatic drive unit, said surface along the stacked direction The abutment is made on a surface adjacent to the surface along the laminated direction, which is in a direction different from that of the above.

According to the optical deflector of the present invention, even when the piezoelectric member is repeatedly deformed, the progress of peeling and cracking is suppressed to reduce the occurrence of failure.

It is the schematic of an example of an optical scanning system. It is a hardware block diagram of an example of an optical scanning system. It is a functional block diagram of an example of a drive device. It is a flowchart of an example of processing which concerns on an optical scanning system. It is a schematic diagram of an example of an automobile equipped with a head-up display device. It is the schematic of an example of a head-up display device. It is the schematic of an example of an image forming apparatus equipped with an optical writing apparatus. It is the schematic of an example of an optical writing apparatus. It is a schematic diagram of an example of an automobile equipped with a laser radar device. It is the schematic of an example of a laser radar apparatus. It is a schematic diagram of an example of a packaged light deflector. It is a top view when the example of the light deflector is seen from the + Z direction. FIG. 12 is a cross-sectional view taken along the line PP'of the optical deflector shown in FIG. It is a QQ'cross-sectional view of the light deflector shown in FIG. It is a figure which shows an example of the structure of the piezoelectric drive part which concerns on embodiment of this invention. It is sectional drawing which shows an example of the structure of the piezoelectric drive part shown in FIG. It is a schematic diagram which schematically represented the deformation of the 2nd drive part of an optical deflector. (A) is a graph showing an example of the waveform of the drive voltage A applied to the piezoelectric drive unit group A of the optical deflector, and (b) is applied to the piezoelectric drive unit group B of the optical deflector. It is a graph which shows an example of the waveform of the drive voltage B, and (c) is the graph which shows the example which superposed the waveform of the drive voltage of (a), and the waveform of the drive voltage of (b). It is a figure which shows an example of the manufacturing method of the piezoelectric drive part shown in FIG. It is a figure which shows the modification of the structure of the piezoelectric drive part. It is a figure which shows the other modification of the structure of the piezoelectric drive part. It is a figure which shows the modification of a light deflector. It is a figure which shows the other modification of the light deflector. It is a figure which shows an example of the structure of the conventional piezoelectric drive part. It is a figure which shows the RR'cross section of the conventional example shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail.
[Optical scanning system]
First, with reference to FIGS. 1 to 4, an optical scanning system to which the driving device according to the embodiment of the present invention is applied will be described in detail.
FIG. 1 shows a schematic view of an example of an optical scanning system. As shown in FIG. 1, the optical scanning system 10 is a system in which the light emitted from the light source device 12 is deflected by the reflecting surface 14 of the optical deflector 13 under the control of the driving device 11 to lightly scan the scanned surface 15. Is.
The optical scanning system 10 includes a driving device 11, a light source device 12, and an optical deflector 13 having a reflecting surface 14.

The drive device 11 is an electronic circuit unit including, for example, a CPU (Central Processing Unit) and an FPGA (Field-Programmable Gate Array). The light deflector 13 is, for example, a MEMS (Micro Electromechanical Systems) device having a reflecting surface 14 and capable of moving the reflecting surface 14. The light source device 12 is, for example, a laser device that irradiates a laser. The surface to be scanned 15 is, for example, a screen.
The drive device 11 generates control commands for the light source device 12 and the light deflector 13 based on the acquired optical scanning information, and outputs a drive signal to the light source device 12 and the light deflector 13 based on the control commands.

The light source device 12 irradiates the light source based on the input drive signal. The light deflector 13 moves the reflecting surface 14 in at least one of the uniaxial direction and the biaxial direction based on the input drive signal.
As a result, for example, by controlling the drive device 11 based on the image information which is an example of the optical scanning information, the reflecting surface 14 of the optical deflector 13 is reciprocated in a predetermined range in the biaxial direction and incident on the reflecting surface 14. By deflecting the irradiation light from the light source device 12 and scanning the light, an arbitrary image can be projected on the surface to be scanned 15.
The details of the optical deflector and the details of the control by the drive device of this embodiment will be described later.
Next, a hardware configuration of an example of the optical scanning system 10 will be described with reference to FIG.
FIG. 2 is a hardware configuration diagram of an example of the optical scanning system 10.
As shown in FIG. 2, the optical scanning system 10 includes a driving device 11, a light source device 12, and an optical deflector 13, each of which is electrically connected.

[Drive]
Of these, the drive device 11 includes a CPU 20, a RAM 21 (Random Access Memory), a ROM 22 (Read Only Memory), an FPGA 23, an external I / F 24, a light source device driver 25, and an optical deflector driver 26.

The CPU 20 is an arithmetic unit that reads programs and data from a storage device such as the ROM 22 onto the RAM 21 and executes processing to realize overall control and functions of the drive device 11.
The RAM 21 is a volatile storage device that temporarily holds programs and data.
The ROM 22 is a non-volatile storage device that can retain programs and data even when the power is turned off, and stores processing programs and data executed by the CPU 20 to control each function of the optical scanning system 10. There is.
The FPGA 23 is a circuit that outputs a control signal suitable for the light source device driver 25 and the light deflector driver 26 according to the processing of the CPU 20.
The external I / F 24 is, for example, an interface with an external device, a network, or the like. The external device includes, for example, a host device such as a PC (Personal Computer) and a storage device such as a USB memory, an SD card, a CD, a DVD, an HDD, and an SSD. The network is, for example, a CAN (Controller Area Network) of an automobile, a LAN (Local Area Network), the Internet, or the like. The external I / F 24 may be configured to enable connection or communication with an external device, and an external I / F 24 may be prepared for each external device.

The light source device triber is an electric circuit that outputs a drive signal such as a drive voltage to the light source device 12 according to an input control signal.
The optical deflector driver 26 is an electric circuit that outputs a drive signal such as a drive voltage to the optical deflector 13 according to an input control signal.
In the drive device 11, the CPU 20 acquires optical scanning information from the external device or network via the external I / F 24. The configuration may be such that the CPU 20 can acquire the optical scanning information, and the optical scanning information may be stored in the ROM 22 or FPGA 23 in the driving device 11, or the SSD or the like may be newly stored in the driving device 11. A storage device may be provided and the optical scanning information may be stored in the storage device.
Here, the optical scanning information is information indicating how the surface to be scanned 15 is optical-scanned. For example, when displaying an image by optical scanning, the optical scanning information is image data. Further, for example, when optical writing is performed by optical scanning, the optical scanning information is write data indicating the writing order and the writing location. In addition, for example, when object recognition is performed by optical scanning, the optical scanning information is irradiation data indicating the timing and irradiation range of irradiating the light for object recognition.
The drive device 11 according to the present embodiment can realize the functional configuration described below by the instruction of the CPU 20 and the hardware configuration shown in FIG.

[Functional configuration of drive unit]
Next, the functional configuration of the drive device 11 of the optical scanning system 10 will be described with reference to FIG. FIG. 3 is a functional block diagram of an example of a driving device of an optical scanning system.
As shown in FIG. 3, the drive device 11 has a control unit 30 and a drive signal output unit 31 as functions.
The control unit 30 is realized by, for example, a CPU 20, an FPGA 23, or the like, acquires optical scanning information from an external device, converts the optical scanning information into a control signal, and outputs the optical scanning information to the drive signal output unit 31. For example, the control unit 30 constitutes a control means, acquires image data as optical scanning information from an external device or the like, generates a control signal from the image data by a predetermined process, and outputs the control signal to the drive signal output unit 31.
The drive signal output unit 31 constitutes an application means, is realized by the light source device driver 25, the light deflector driver 26, and the like, and outputs a drive signal to the light source device 12 or the light deflector 13 based on the input control signal. .. The drive signal output unit 31 (application means) may be provided for each target for outputting the drive signal, for example.
The drive signal is a signal for controlling the drive of the light source device 12 or the light deflector 13. For example, in the light source device 12, it is a drive voltage that controls the irradiation timing and irradiation intensity of the light source. Further, for example, in the optical deflector 13, it is a drive voltage that controls the timing and the movable range of moving the reflecting surface 14 included in the optical deflector 13. The driving device may acquire the irradiation timing and the light receiving timing of the light source from an external device such as the light source device 12 or the light receiving device, and synchronize these with the driving of the light deflector 13.

[Optical scanning process]
Next, with reference to FIG. 4, a process in which the optical scanning system 10 lightly scans the surface to be scanned 15 will be described. FIG. 4 is a flowchart of an example of processing related to the optical scanning system.
In step S11, the control unit 30 acquires optical scanning information from an external device or the like.
In step S12, the control unit 30 generates a control signal from the acquired optical scanning information and outputs the control signal to the drive signal output unit 31.
In step S13, the drive signal output unit 31 outputs a drive signal to the light source device 12 and the light deflector 13 based on the input control signal.
In step S14, the light source device 12 irradiates light based on the input drive signal. Further, the light deflector 13 moves the reflecting surface 14 based on the input drive signal. By driving the light source device 12 and the light deflector 13, light is deflected in an arbitrary direction and light-scanned.
In the optical scanning system 10, one drive device 11 has a device and a function of controlling the light source device 12 and the light deflector 13, but the drive device for the light source device and the drive device for the light deflector , May be provided separately.
Further, in the optical scanning system 10, one drive device 11 is provided with a function of a control unit 30 of a light source device 12 and an optical deflector 13 and a function of a drive signal output unit 31, but these functions are separate. It may exist, and for example, a drive signal output device having a drive signal output unit 31 may be provided separately from the drive device 11 having the control unit 30. Among the above-mentioned optical scanning systems 10, an optical deflection system that performs optical deflection may be configured by an optical deflector 13 having a reflecting surface 14 and a driving device 11.

[Image projection device]
Next, with reference to FIGS. 5 and 6, an image projection device to which the driving device of the present embodiment is applied will be described in detail.
FIG. 5 is a schematic view of an embodiment of an automobile 400 equipped with a head-up display device 500, which is an example of an image projection device. Further, FIG. 6 is a schematic view of an example of the head-up display device 500.
The image projection device is a device that projects an image by optical scanning, for example, a head-up display device.
As shown in FIG. 5, the head-up display device 500 is installed near, for example, a windshield (windshield 401, etc.) of an automobile 400. The projected light L emitted from the head-up display device 500 is reflected by the windshield 401 and heads toward the observer (driver 402) who is the user.
As a result, the driver 402 can visually recognize the image or the like projected by the head-up display device 500 as a virtual image. A combiner may be installed on the inner wall surface of the windshield so that the user can visually recognize the virtual image by the projected light reflected by the combiner.

As shown in FIG. 6, the head-up display device 500 emits laser light from red, green, and blue laser light sources 501R, 501G, and 501B. The emitted laser light passes through an incident optical system composed of collimator lenses 502, 503, 504 provided for each laser light source, two dichroic mirrors 505, 506, and a light amount adjusting unit 507. It is deflected by an optical deflector 13 having a reflecting surface 14.
Then, the deflected laser beam is projected onto the screen via a projection optical system including a free curved mirror 509, an intermediate screen 510, and a projection mirror 511.
In the head-up display device 500, the laser light sources 501R, 501G, 501B, the collimator lenses 502, 503, 504, and the dichroic mirrors 505 and 506 are unitized by an optical housing as a light source unit 530.
The head-up display device 500 projects the intermediate image displayed on the intermediate screen 510 onto the windshield 401 of the automobile 400, so that the driver 402 visually recognizes the intermediate image as a virtual image.
The laser light of each color emitted from the laser light sources 501R, 501G, and 501B is regarded as substantially parallel light by the collimator lenses 502, 503, and 504, respectively, and is combined by two dichroic mirrors 505 and 506. The combined laser light is two-dimensionally scanned by the light deflector 13 having the reflecting surface 14 after the light amount is adjusted by the light amount adjusting unit 507. The projected light L two-dimensionally scanned by the light deflector 13 is reflected by the free-form surface mirror 509, corrected for distortion, and then condensed on the intermediate screen 510 to display an intermediate image. The intermediate screen 510 is composed of a microlens array in which microlenses are two-dimensionally arranged, and magnifies the projected light L incident on the intermediate screen 510 in microlens units.
The light deflector 13 reciprocates the reflecting surface 14 in the biaxial direction, and two-dimensionally scans the projected light L incident on the reflecting surface 14. The drive control of the light deflector 13 is performed in synchronization with the light emission timing of the laser light sources 501R, 501G, and 501B.
The head-up display device 500 as an example of the image projection device has been described above, but the image projection device is a device that projects an image by performing optical scanning by an optical deflector 13 having a reflecting surface 14. Good.
For example, it is mounted on a projector that is placed on a desk or the like and projects an image on a display screen, or is mounted on a mounting member mounted on an observer's head or the like, and is projected onto a reflection / transmission screen of the mounting member, or an eyeball is used as a screen. The same can be applied to a head-mounted display device or the like that projects an image.
Further, the image projection device is not only a vehicle or a mounting member, but also a moving body such as an aircraft, a ship, or a mobile robot, or a work robot that operates a drive target such as a manipulator without moving from the place. It may be mounted on a non-moving body.

[Optical writing device]
Next, with reference to FIGS. 7 and 8, the optical writing device to which the driving device 11 of the present embodiment is applied will be described in detail.
FIG. 7 is an example of an image forming apparatus incorporating the optical writing apparatus 600. Further, FIG. 8 is a schematic view of an example of the optical writing device.
As shown in FIG. 7, the optical writing device 600 is used as a constituent member of an image forming device represented by a laser printer 650 or the like having a printer function using a laser beam. In the image forming apparatus, the optical writing device 600 performs optical writing on the photoconductor drum by lightly scanning the photoconductor drum which is the surface to be scanned 15 with one or a plurality of laser beams.
As shown in FIG. 8, in the optical writing device 600, the laser light from the light source device 12 such as a laser element passes through an imaging optical system 601 such as a collimator lens and then is subjected to an optical deflector 13 having a reflecting surface 14. It is deflected in the uniaxial direction or the biaxial direction.
Then, the laser beam deflected by the light deflector 13 passes through the scanning optical system 602 including the first lens 602a, the second lens 602b, and the reflection mirror portion 602c, and then passes through the surface to be scanned 15 (for example, a photoconductor drum or a photosensitive member). (Paper) is irradiated and optical writing is performed. The scanning optical system 602 forms a spot-shaped light beam on the surface to be scanned 15.
Further, the light deflector 13 having the light source device 12 and the reflecting surface 14 is driven under the control of the driving device 11.
As described above, the optical writing device 600 can be used as a constituent member of an image forming device having a printer function by laser light.
Further, by making the scanning optical system different so that light scanning can be performed not only in the uniaxial direction but also in the biaxial direction, the laser beam is deflected to the thermal media to scan the light, and the laser label device for printing by heating and the like. It can be used as a constituent member of the image forming apparatus of.
The optical deflector 13 having a reflecting surface 14 applied to the optical writing device consumes less power for driving than a rotating multifaceted mirror using a polygon mirror or the like, so that the power saving of the optical writing device can be reduced. It is advantageous to.
Further, since the wind noise when the optical deflector 13 vibrates is smaller than that of the rotating multifaceted mirror, it is advantageous for improving the quietness of the optical writing device. The optical writing device requires an overwhelmingly smaller installation space than a rotating multi-sided mirror, and the amount of heat generated by the optical deflector 13 is also small, so that it is easy to miniaturize, which is advantageous for miniaturizing the image forming apparatus. Is

[Object recognition device]
Next, with reference to FIGS. 9 and 10, an object recognition device to which the driving device of the present embodiment is applied will be described in detail.
FIG. 9 is a schematic view of an automobile equipped with a laser radar device, which is an example of an object recognition device. Further, FIG. 10 is a schematic view of an example of a laser radar device.
The object recognition device is a device that recognizes an object in the target direction, for example, a laser radar device.
As shown in FIG. 9, the laser radar device 700 is mounted on, for example, an automobile 701, and by lightly scanning the target direction and receiving the reflected light from the target object 702 existing in the target direction, the target object is received. Recognize 702.
As shown in FIG. 10, the laser light emitted from the light source device 12 is reflected through an incident optical system composed of a collimating lens 703, which is an optical system in which divergent light is substantially parallel light, and a plane mirror 704. The optical deflector 13 having the surface 14 scans in one or two axial directions.
Then, the object 702 in front of the apparatus is irradiated through the light projecting lens 705 or the like, which is a light projecting optical system. The drive of the light source device 12 and the light deflector 13 is controlled by the drive device 11. The reflected light reflected by the object 702 is photodetected by the photodetector 709.
That is, the reflected light is received by the image sensor 707 via the condenser lens 706 or the like which is a light receiving optical system, and the image sensor 707 outputs a detection signal to the signal processing circuit 708. The signal processing circuit 708 performs predetermined processing such as binarization and noise processing on the input detection signal, and outputs the result to the distance measuring circuit 710.
The distance measuring circuit 710 is based on the time difference between the timing when the light source device 12 emits the laser light and the timing when the laser light is received by the photodetector 709, or the phase difference for each pixel of the light receiving image sensor 707. The presence or absence of the 702 is recognized, and the distance information to the object 702 is calculated.
Since the light deflector 13 having the reflecting surface 14 is less likely to be damaged and is smaller than the multifaceted mirror, it is possible to provide a compact radar device having high durability.
Such a radar A radar device can be attached to, for example, a vehicle, an aircraft, a ship, a robot, or the like, and can lightly scan a predetermined range to recognize the presence or absence of an obstacle and the distance to the obstacle.
In the above-mentioned object recognition device, the laser radar device 700 as an example has been described, but the object recognition device performs light scanning by controlling a light deflector 13 having a reflecting surface 14 by a driving device 11, and performs light detection. Any device that recognizes the object 702 by receiving the reflected light by the device is sufficient, and is not limited to the above-described embodiment.
For example, biometric authentication that recognizes an object by calculating object information such as shape from distance information obtained by light scanning the hand or face and referring to it as a record, or recognizing an intruder by light scanning the target range. It can also be applied to a security sensor, a component of a three-dimensional scanner that calculates and recognizes object information such as a shape from distance information obtained by optical scanning, and outputs it as three-dimensional data.

[Packaging]
Next, with reference to FIG. 11, the packaging of the optical deflector controlled by the driving device of the present embodiment will be described.
FIG. 11 is a schematic diagram of an example of a packaged light deflector.
As shown in FIG. 11, the optical deflector 13 is attached to the attachment member 802 arranged inside the package member 801 and is packaged by covering a part of the package member with the transmission member 803 and sealing the package member 803. Will be done.
Further, the package is sealed with an inert gas such as nitrogen. As a result, deterioration of the light deflector 13 due to oxidation is suppressed, and durability against changes in the environment such as temperature is further improved.
Next, the details of the optical deflector used in the optical deflection system, the optical scanning system, the image projection device, the optical writing device, and the object recognition device described above and the details of the control by the driving device of the present embodiment will be described. ..

[Details of optical deflector]
First, the optical deflector will be described in detail with reference to FIGS. 12 to 14.
FIG. 12 is a plan view of another type of light deflector capable of light deflecting in the biaxial direction. FIG. 13 is a cross-sectional view taken along the line PP'of FIG. FIG. 14 is a cross-sectional view taken along the line QQ'of FIG. As shown in FIG. 12, the optical deflector 13, a mirror unit 101 for reflecting the light beam L incident, is connected to the mirror unit 101, and drives the mirror unit 101 to the first shaft O ₁ around parallel to the Y axis It has first drive units 110a and 110b.
The optical deflector 13 also has a first support portion 120 that supports the mirror portion 101 and the first drive portions 110a and 110b.
The optical deflector 13 is also connected to the first support portion 120 and _{drives the mirror portion 101 and the first support portion 120 around the second axis O 2} parallel to the X axis, and the second drive units 130a and 130b. It has a second support portion 140, which is a frame body portion that supports the two drive portions 130a and 130b.
The first driving portion 110a in the present embodiment, and 110b, a mirror unit 101, and the first supporting portion 120 constitute a movable portion rotates about a second axis _{O 2.} Further, the second drive units 130a and 130b support the movable portion with respect to the second support portion 140.
The optical deflector 13 includes an electrode connecting portion 150 electrically connected to the first driving units 110a and 110b and the second driving units 130a and 130b and a driving device, and the electrode connecting portions 150 to the first driving units 110a and 110b. It has an electrode wiring 151 which is an extended current-carrying path.

The optical deflector 13 is, for example, formed by molding one SOI (Silicon On Insulator) substrate by etching or the like, and on the molded substrate, the reflecting surface 14, the first piezoelectric drive units 112a, 112b, and the second piezoelectric drive unit 131a. By forming ~ 131f, 132a to 132f, the electrode connecting portion 150, etc., each constituent portion is integrally formed.
The formation of each of the above-mentioned constituent parts may be performed after molding the SOI substrate, or may be performed during molding of the SOI substrate.

As shown in FIGS. 13 and 14, the SOI substrate includes, for example, a silicon support layer 161 which is a first silicon layer made of single crystal silicon (Si), and a silicon oxide layer 162 formed on the upper part of the silicon support layer 161. , A silicon substrate having a silicon active layer 163, which is a second silicon layer formed on the silicon oxide layer 162.

Since the silicon active layer 163 has a small thickness in the Z-axis direction with respect to the X-axis direction or the Y-axis direction, the member composed of only the silicon active layer 163 has a function as an elastic portion having elasticity.

The SOI substrate does not necessarily have to be flat, and may have a curvature or the like. Further, the member used for forming the optical deflector 13 is not limited to the SOI substrate as long as it is a substrate that can be integrally molded by etching or the like and can be partially elastic.

The mirror portion 101 is composed of, for example, a circular mirror portion base 102 and a reflecting surface 14 formed on the + Z side surface of the mirror portion base. The mirror part substrate 102 is composed of, for example, a silicon active layer 163.
The reflective surface 14 is made of, for example, a metal thin film containing aluminum, gold, silver and the like. Further, the mirror portion 101 may have ribs for reinforcing the mirror portion formed on the surface of the mirror portion base 102 on the −Z side.
The rib is composed of, for example, a silicon support layer 161 and a silicon oxide layer 162, and can suppress distortion of the reflective surface 14 caused by movement.

The first drive units 110a and 110b have two torsion bars 111a and 111b that are connected to the mirror unit 102 at one end and extend in the first axial direction to movably support the mirror unit 101, and one end is a torsion bar. It is composed of first piezoelectric drive portions 112a and 112b, which are connected and the other end is connected to the inner peripheral portion of the first support portion.

As shown in FIG. 13, the torsion bars 111a and 111b are composed of the silicon active layer 163. Further, the first piezoelectric driving portions 112a and 112b are formed by sequentially laminating the lower electrode 201, the piezoelectric portion 202, and the upper electrode 203 on the + Z side surface of the silicon active layer 163 which is an elastic portion.
The upper electrode 203 and the lower electrode 201 are made of, for example, gold (Au) or platinum (Pt).
The piezoelectric portion 202 is composed of, for example, a piezoelectric film using PZT (lead zirconate titanate), which is a piezoelectric material.
In the following description, when it is particularly necessary, the wording of the lower electrode 201, the piezoelectric portion 202, and the upper electrode 203 as a group is used as the piezoelectric driving unit.

The first support portion 120 is, for example, a rectangular support formed so as to surround the mirror portion 101, which is composed of, for example, a silicon support layer 161, a silicon oxide layer 162, and a silicon active layer 163.

The second drive units 130a and 130b are composed of, for example, a plurality of second piezoelectric drive units 131a to 131f and 132a to 132f connected so as to be folded back, and one end of the second drive units 130a and 130b is a first support. It is connected to the outer peripheral portion of the portion 120, and the other end is connected to the inner peripheral portion of the second support portion 140.
At this time, the connection points between the second drive unit 130a and the first support unit 120, the connection points between the second drive unit 130b and the first support unit 120, the connection points between the second drive unit 130a and the second support unit 140, and the second support unit 140. The connection points between the two drive units 130b and the second support unit 140 are point-symmetrical with respect to the center of the reflecting surface 14.

As shown in FIG. 14, the second drive portions 130a and 130b are configured by forming the lower electrode 201, the piezoelectric portion 202, and the upper electrode 203 in this order on the + Z side surface of the silicon active layer 163 which is an elastic portion. .. The upper electrode 203 and the lower electrode 201 are made of, for example, gold (Au) or platinum (Pt). The piezoelectric portion 202 is, for example, a piezoelectric material using PZT (lead zirconate titanate), which is a piezoelectric material.

The second support portion 140 is composed of, for example, a silicon support layer 161, a silicon oxide layer 162, and a silicon active layer 163, and includes a mirror portion 101, a first drive portion 110a, 110b, a first support portion 120, and a second drive portion 130a. , 130b is a rectangular support formed so as to surround the 130b.

The electrode connection portion 150 is formed, for example, on the + Z side surface of the second support portion 140, and the first piezoelectric drive portions 112a and 112b, the upper electrodes 203 and the lower electrodes 201 of the second piezoelectric drive portions 131a to 131f are formed. , And the drive device 11 is electrically connected to the drive device 11 via an electrode wiring 151 configured by using aluminum (Al) or the like.
The upper electrode 203 or the lower electrode 201 may be directly connected to the electrode connecting portion 150, or the electrodes may be connected to each other and indirectly connected to each other.

Further, in the present embodiment, the case where the piezoelectric portion 202 is formed only on one surface (the surface on the + Z side) of the silicon active layer 163 which is the elastic portion has been described as an example, but the other surface of the elastic portion (for example, the −Z side) has been described. It may be provided on both one surface and the other surface of the elastic portion.

Further, the shape of each component is not limited to the shape of the embodiment as long as the mirror portion 101 can be driven around the first axis or the second axis. For example, the torsion bars 111a and 111b and the first piezoelectric drive units 112a and 112b may have a shape having a curvature.

As shown in FIG. 14, the first piezoelectric drive units 112a and 112b and the second piezoelectric drive units 131a to 131f and 132a to 132f all cover at least a part of the surface of the second piezoelectric drive unit. It has an insulating layer 153 as an insulating film.
The insulating layer 153 is a layer-related insulating layer that is a protective film formed so as to maintain insulation between the upper electrode 203 and the lower electrode 201, and is configured by using _{, for example, SiO 2.}
The insulating layer 153 is formed with an opening 154 for connecting the electrode wiring 151 as shown in FIG. 15 and will be described later.

In the present embodiment, as shown in FIG. 15, the electrode wiring 151 has a function as a connecting portion for connecting two adjacent second piezoelectric drive units 131a and the second piezoelectric drive unit 131b.
In the following description, the case where the second piezoelectric drive unit 131a and the second piezoelectric drive unit 131b are connected will be described as an example, but the same applies to the second piezoelectric drive units 131a to 131f and the second piezoelectric drive units 132a to 132f. It has a configuration.

The electrode wiring 151 is a connection portion for applying a voltage to the upper electrode 203 via an opening 154 formed in the insulating layer 153, and a barrier layer having a function as a passivation film described later is provided on the most −Z side layer. I have. In the present embodiment, the electrode wiring 151 has a laminated structure in which a conductive layer such as Al or an Al alloy is laminated on an upper layer of SiO2 which is a barrier layer. If the side surface 203b of the upper electrode 203 is in contact with the side surface 203b as in the present embodiment, the lowermost layer of the electrode wiring 151 may be used as an insulating barrier layer in this way, so that the protection of the entire substrate is improved.
The opening 154 is an opening made in the insulating layer 153 by a technique such as etching. In order to provide such an opening 154, it is desirable to adjust the width and length of the lower electrode 201 so that the lower electrode 201 is larger than the piezoelectric portion 202 and the piezoelectric portion 202 is larger than the upper electrode 203. ..
The opening 154 is formed at a position including a portion where the upper electrode 203 and the piezoelectric portion 202 overlap and a portion where the piezoelectric portion 202 does not overlap when viewed from the + Z direction side. In other words, the opening 154 is formed at the end of the upper electrode 203 in the X direction so as to cover a part of the upper electrode 203 on the + Z direction side and a part of the piezoelectric portion 202 on the + Z direction side.

The end of the electrode wiring 151 is in contact with the upper electrode 203 and the piezoelectric portion 202, and connects the upper electrodes 203 and the piezoelectric portion 202 of the two adjacent second piezoelectric drive portions 131a and 131b. Further, as shown in FIG. 16, the electrode wiring 151 is arranged so as to abut on the upper surface 203a and the side surface 203b of the upper electrode 203 and also on the upper surface 202a of the piezoelectric portion 202.

[Details of drive unit control]
Next, the details of the control of the drive device 11 for driving the first drive units 110a and 110b and the second drive units 130a and 130b of the optical deflector will be described.

The second piezoelectric drive units 131a to 131f of the first drive units 110a and 110b and the second drive units 130a and 130b are deformed in proportion to the potential of the applied voltage when a positive or negative voltage is applied in the polarization direction (for example). , Expansion and contraction), and exerts the so-called inverse piezoelectric effect. The first drive units 110a and 110b and the second drive units 130a and 130b move the mirror unit 101 by utilizing the above-mentioned inverse piezoelectric effect.

At this time, the angle at which the light flux incident on the reflecting surface 14 of the mirror portion 101 is deflected is called a deflection angle. The runout angle when no voltage is applied to the piezoelectric portion is set to zero, a positive runout angle is defined as a deflection angle larger than that angle, and a negative runout angle is defined as a smaller deflection angle.

First, the control of the drive device for driving the first drive unit will be described.
In the first drive units 110a and 110b, when a drive voltage is applied in parallel to the piezoelectric parts 202 of the first piezoelectric drive parts 112a and 112b via the upper electrode 203 and the lower electrode 201, the respective piezoelectric parts 202 Deform. Due to the action of the deformation of the piezoelectric portion 202, the first piezoelectric driving portions 112a and 112b are bent and deformed.
As a result, the two torsion bars 111a, the driving force of the first shaft _{O 1} around acts on the mirror portion 101 through a torsion of 111b, the mirror unit 101 is movable in the first axis _{O 1} around. The drive voltage applied to the first drive units 110a and 110b is controlled by the drive device 11.

Therefore, the drive device 11 applies a drive voltage having a predetermined sine waveform to the first piezoelectric drive units 112a and 112b of the first drive units 110a and 110b in parallel to move the mirror unit 101 around the first axis. It can be moved in a cycle of a drive voltage having a predetermined sinusoidal waveform.

In particular, for example, when the frequency of the sinusoidal waveform voltage is set to about 20 kHz, which is about the same as the resonance frequency of the torsion bars 111a and 111b, mechanical resonance due to the twist of the torsion bars 111a and 111b is utilized. The mirror unit 101 can be resonated and vibrated at about 20 kHz.

Next, control of the driving device for driving the second driving unit will be described with reference to FIGS. 17 to 21.

FIG. 17 is a schematic view schematically showing the driving of the second driving unit 130b of the optical deflector. The area represented by the diagonal line is the mirror portion 101 or the like.

Of the plurality of second piezoelectric drive units 131a to 131f included in the second drive unit 130a, the second piezoelectric drive unit, that is, the second piezoelectric drive unit, which is an even number from the second piezoelectric drive unit (131a) closest to the mirror unit. The piezoelectric drive units 131b, 131d, and 131f are designated as the piezoelectric drive unit group A.
Further, among the plurality of second piezoelectric drive units 132a to 132f included in the second drive unit 130b, the second piezoelectric drive unit, which is an odd number from the second piezoelectric drive unit (132a) having the closest distance to the mirror unit, That is, the second piezoelectric drive units 132a, 132c, and 132e are similarly designated as the piezoelectric drive unit group A. When the drive voltage is applied in parallel to the piezoelectric drive unit group A, as shown in FIG. 15A, the piezoelectric drive unit group A is bent and deformed in the same direction, and the mirror unit has a positive deflection angle. 101 moves around the second axis O _2.

Further, among the plurality of second piezoelectric drive units 131a to 131f included in the second drive unit 130a, the second piezoelectric drive unit that is the odd number from the second piezoelectric drive unit (131a) that is closest to the mirror unit, that is, The second piezoelectric drive units 131a, 131c, and 131e are designated as the piezoelectric drive unit group B.
Further, among the plurality of second piezoelectric drive units 132a to 132f included in the second drive unit 130b, the second piezoelectric drive unit which is an even number from the second piezoelectric drive unit (132a) which is the closest to the mirror unit. That is, 132b, 132d, and 132f are similarly referred to as the piezoelectric drive unit group B. When the drive voltage is applied in parallel to the piezoelectric drive unit group B, as shown in FIG. 15B, the piezoelectric drive unit group B is bent and deformed in the same direction, and the mirror unit has a negative deflection angle. 101 moves around the second axis O _2.

As shown in FIGS. 17A and 17B, in the second drive unit 130a or 130b, the plurality of piezoelectric portions 202 included in the piezoelectric drive unit group A or the plurality of piezoelectric portions 202 included in the piezoelectric drive unit group B are bent. By deforming, the amount of movement due to bending deformation can be accumulated, and the runout angle around the second axis of the mirror portion 101 can be increased.

For example, as shown in FIG. 12, the second drive units 130a and 130b are connected to the first support portion point-symmetrically with respect to the center point of the first support portion. Therefore, when a drive voltage is applied to the piezoelectric drive unit group A, a driving force is generated at the connection portion between the first support unit and the second drive unit 130a in the second drive unit 130a, and a driving force is generated in the second drive unit 130b to move in the + Z direction. A driving force that moves in the −Z direction is generated at the connection portion between the 1 support portion and the second drive portion 130b, and the amount of movement is accumulated so that the swing angle around _{the second axis O 2 of the mirror portion 101 can be increased.}

Further, when no voltage is applied, or when the movable amount of the mirror portion 101 by the piezoelectric drive group A due to the voltage application and the movable amount of the mirror portion 101 by the piezoelectric drive group B due to the voltage application are balanced, the runout angle Is zero.

By applying a drive voltage to the second piezoelectric drive units 131a to 131f so as to continuously repeat FIGS. 17 (a) to 17 (b), the mirror unit 101 can be driven around _{the second axis O 2.} it can.

[Drive voltage]
The drive voltage applied to the second drive units 130a and 130b is controlled by the drive device 11.
With reference to FIG. 16, the drive voltage applied to the piezoelectric drive unit group A (hereinafter, drive voltage A) and the drive voltage applied to the piezoelectric drive unit group B (hereinafter, drive voltage B) will be described. Further, the application means for applying the drive voltage A (first drive voltage) is referred to as the first application means, and the application means for applying the drive voltage B (second drive voltage) is referred to as the second application means.

FIG. 18A is an example of the waveform of the drive voltage A applied to the piezoelectric drive unit group A of the optical deflector. FIG. 18B is an example of the waveform of the drive voltage B applied to the piezoelectric drive unit group B of the optical deflector. FIG. 18C is a diagram in which the waveform of the drive voltage A and the waveform of the drive voltage B are superimposed.

As shown in FIG. 18A, the waveform of the drive voltage A applied to the piezoelectric drive unit group A is, for example, a sawtooth waveform, and the frequency is, for example, 60 Hz.
Further, in the waveform of the drive voltage A, the time width of the rising period in which the voltage value increases from the minimum value to the next maximum value is TrA, and the falling period in which the voltage value decreases from the maximum value to the next minimum value. When the time width of is TfA, for example, the ratio of TrA: TfA = 9: 1 is preset. At this time, the ratio of TrA to one cycle is called the symmetry of the drive voltage A.

As shown in FIG. 18B, the waveform of the drive voltage B applied to the piezoelectric drive unit group B is, for example, a sawtooth waveform, and the frequency is, for example, 60 Hz.
Further, in the waveform of the drive voltage B, the time width of the rising period in which the voltage value increases from the minimum value to the next maximum value is TrB, and the falling period in which the voltage value decreases from the maximum value to the next minimum value. When the time width of is TfB, for example, the ratio of TfB: TrB = 9: 1 is preset. At this time, the ratio of TfB to one cycle is called the symmetry of the drive voltage B.
Further, as shown in FIG. 18C, for example, the period TA of the waveform of the drive voltage A and the period TB of the waveform of the drive voltage B are set to be the same.

The sawtooth waveforms of the drive voltage A and the drive voltage B are generated, for example, by superimposing sine waves.
Further, in the present embodiment, the drive voltage of the sawtooth waveform is used as the drive voltages A and B, but the present invention is not limited to this, and the drive voltage of the waveform with the apex of the sawtooth waveform rounded and the sawtooth waveform It is also possible to change the waveform according to the device characteristics of the optical deflector, such as the drive voltage of the waveform with the linear region of. In this case, the symmetry is the ratio of the rise time to one cycle or the ratio of the fall time to one cycle. At this time, which of the rise time and the fall time is used as a reference may be arbitrarily set.

Next, a method of manufacturing such a drive unit will be described.
In the following description, the second piezoelectric drive unit 131a will be described in particular, but the present invention is not limited to this configuration, and the same applies to the portion of the optical deflector 13 using the piezoelectric material. It has a configuration.
As shown in FIG. 19A, the lower electrode material 1904 and the piezoelectric material 1905 are formed on an SOI substrate on which a silicon support layer 161, a silicon oxide layer 162, and a silicon active layer 163 are laminated as substrate materials. , And the upper electrode material 1906 are formed in layers.
Next, as shown in FIG. 19B, the upper electrode material 1906 is patterned, the piezoelectric material 1905 is patterned, and the lower electrode material 1904 is patterned by dry etching to obtain the shape of the piezoelectric member of the piezoelectric drive unit 131a. Form.
Further, as shown in FIG. 19C, SiO ₂ is formed on the entire surface as the insulating material 1908 by the CVD method.
When the insulating material 1908 is formed, as shown in FIG. 19D, an opening 154 is formed in the insulating material 1908 as a contact hole by dry etching. At this time, the opening 154 includes a portion where the upper electrode material 1906 and the piezoelectric material 1905 are overlapped with each other when viewed from the Z direction, and a portion where the piezoelectric material 1905 is formed and the upper electrode material 1906 does not exist. Is formed in.

A wiring pattern is formed on the insulating material 1908 by using the wiring member 1910 (FIG. 19E). At this time, by filling the inside of the opening 154 with the wiring member 1910, the wiring pattern is formed in such a manner that the wiring member 1910 is in contact with both the upper electrode material 1906 and the piezoelectric material 1905.
After the wiring pattern is formed by the wiring member 1910, the passivation film 1911 is formed on the entire substrate as shown in FIG. 19 (f). The passivation film is formed, for example, by forming SiN into a film by a CVD method.
The passivation film 1911 has a function as a protective film for protecting the patterned substrate from gas, moisture and the like from the outside world.

The passivation film 1911 and the insulating material 1908 are processed by dry etching as shown in FIG. 19 (g) according to the structure to be formed on the silicon active layer 163, specifically, the structure shown in FIG. Further, as shown in FIG. 19H, the silicon support layer 161 of the portion where the second piezoelectric drive portion 131a is formed is removed by etching from the −Z direction side, and the warp of the beam-shaped portion due to the piezoelectric member or the like is caused. Process so that it is likely to occur.
When the silicon support layer 161 is processed in the region where the silicon active layer 163 is removed by etching in this way, the silicon support layer 161 is removed and a so-called punched portion is formed. Similarly, by processing the silicon support layer 161 in the portion where the silicon active layer 163 remains, the silicon active layer 163 remains and the second piezoelectric drive unit 131a can be easily deformed when it expands and contracts by applying a voltage. ..

According to such a manufacturing method, deformation of the opening 154 due to repeated voltage application to the second piezoelectric drive units 131a to 131f can be suppressed, so that the opening 154 is less likely to be peeled off even when operated for a long time, and reliability is high. -It is possible to provide an optical deflector with excellent durability.

By the way, in the conventional optical deflector, as shown in FIGS. 24 and 25, the beam-shaped member 1700 corresponding to the second piezoelectric drive unit has a lower electrode 1702, a piezoelectric film 1703, and an upper portion on the silicon active layer 1701. It is formed by laminating the electrode 1704.
The beam-shaped member 1700 comes into contact with the upper electrode 1704 via the insulating film 1707 formed so as to cover the upper electrode 1703, the contact hole 1705 opened in a part of the insulating film 1707, and the contact hole 1705. It has a wiring 1706 and.

In the beam-shaped member 1700, a contact hole 1705 is provided on the upper electrode 1704 as shown in FIG. 25 as a cross-sectional view of RR'. Further, the wiring 1706 is held so as to abut only on the upper electrode 1704.

When the beam-shaped member 1700 moves up and down, the piezoelectric film 1703 sandwiched between the upper electrode 1704 and the lower electrode 1702 expands and contracts to cause the vertical movement. That is, even in the portion where the contact hole 1705 is formed, the beam-shaped member 1700 vibrates in the vertical direction as the piezoelectric film 1703 expands and contracts.
By repeatedly performing such deformation, repeated stress is generated in the vicinity of the contact hole 1705, which may cause a failure such as peeling or cracking between the wiring 1706 and the upper electrode 1704. In particular, as shown in FIG. 24, in the conventional optical deflector, since the piezoelectric film expands and contracts in the entire circumference surrounding the contact hole 1705, peeling or cracking between the wiring 1706 and the upper electrode 1704 is likely to occur.
In order to prevent such peeling and cracking from occurring, it is desirable to reduce the expansion and contraction of the piezoelectric film around the contact hole 1705, or to improve the adhesion between the upper electrode 1704 and the wiring 1706. It is generally known that such adhesion force varies greatly depending on the contact area and the roughness of the contact surface.

Therefore, in the present embodiment, the mirror portion 101 having the reflecting surface 14, the support portions 120 in which the plurality of elastic portions 130a and 130b are continuously formed in a meandering shape to support the mirror portion 101, and the elastic portions 130a and 130b. Through a plurality of second piezoelectric drive units 131a to 131f individually provided, an insulating film 153 that at least partially covers the second piezoelectric drive units 131a to 131f, and an opening 154 provided in the insulating film 153. It has at least two connecting portions for connecting the second piezoelectric driving portions 131a and 131b.
Further, in the second piezoelectric drive unit 131a and 131b, the lower electrode 201, the piezoelectric portion 202 and the upper electrode 203 are laminated, and the electrode wiring 151 is the upper electrode 203 and the piezoelectric portion of the second piezoelectric drive unit 131a. It abuts on 202.

Such a configuration will be described in more detail. As shown in FIGS. 15 and 16, in the present embodiment, the opening 154 is formed so that the electrode wiring 151 abuts on the piezoelectric portion 202 and the upper electrode 203. Therefore, the electrode wiring 151 comes into contact with the upper surface 203a of the upper electrode 203, the side surface 203b, and the upper surface 202a of the piezoelectric portion 202.
As described above, the deformation of the piezoelectric portion 202 occurs when a voltage is applied between the upper electrode 203 and the lower electrode 201. However, in the present embodiment, openings 154 are provided at both ends of the upper electrode 203. Furthermore, the opening 154 is formed so as to overlap the end of the upper electrode 203 in the ± X direction.
As described above, if the opening 154 is also formed in the portion where the upper electrode 203 is not formed, the piezoelectric portion 202 is deformed because the upper electrode 203 is not formed in the portion shown by the alternate long and short dash line in the enlarged view of FIG. Does not occur. That is, the expansion and contraction of the piezoelectric film can be reduced around the opening 154 which is a contact hole.
With such a configuration, peeling and progress of cracks between the upper electrode 203 and the electrode wiring 151 are suppressed, and the occurrence of failure is reduced.

In addition to the above effects, the contact area between the electrode wiring 151 and the upper electrode 203 is improved by such a configuration, and the contact area with the rough upper electrode 203 is improved, so that the contact force is improved and the second piezoelectric drive unit 131a Even when deformation occurs repeatedly, the progress of peeling and cracks is suppressed to further reduce the occurrence of failures.
Further, since the electrode wiring 151 is fixed in such a manner that it is surrounded by the side surface 203b of the upper electrode 203 and the upper surface 202a of the piezoelectric portion 202, the force acting in the peeling direction is dispersed and the adhesion is further improved.

Further, in the present embodiment, the electrode wiring 151 is arranged so as to connect the adjacent second piezoelectric drive portions 131a and 131b to the folded portions of the second piezoelectric drive portions 131a to 131f formed in a meandering shape.
With this configuration, the electrode wiring 151 is arranged in the folded-back portion 133 in which the second piezoelectric drive portions 131a and 131b are less likely to be deformed. Therefore, the progress of peeling and cracking due to the deformation of the second piezoelectric drive portions 131a and 131b is suppressed. , The occurrence of failures is reduced.

As a modification of the present embodiment, the positional relationship of the opening 154 will be described.
In the following modifications, the same configurations as those in the first embodiment will be numbered the same, and the description thereof will be omitted as appropriate.
In this modification, the opening 154 is arranged at the end of the second piezoelectric drive units 131a to 131f in the Y direction. Further, as shown in FIG. 20, the electrode wiring 151 is arranged in the folded-back portion 133 in which the second piezoelectric drive portions 131a and 131b are less likely to be deformed.
Furthermore the width _{W 1} of the folded portion 133 and the width _{W 2} to the -Y direction side of the opening 154 from the + Y direction side of the end portion of the folded portion _133, W 2 _<2W 1/3, satisfy the relationship.
In the folded-back portion 133, the influence of the displacement of the second piezoelectric drive portion becomes smaller when it is outside of either the + Y direction or the −Y direction. Therefore, it is more preferable that the position of the opening 154 is outside of either the + Y direction or the −Y direction.

Further, as another modification of the present embodiment, as shown in FIGS. 21A and 21B, the opening 154 includes at least two sides orthogonal to each other among the four sides of the rectangular upper electrode 203. It may be configured to be in contact with each other. In other words, the configuration may be formed so as to cover one of the four corners of the upper electrode 203.
According to such a configuration, the contact area with the side surface 203b of the upper electrode 203, which contributes most to the adhesion between the upper electrode 203 and the electrode wiring 151, can be improved, so that the second piezoelectric drive units 131a and 131b can be improved. The occurrence of failures is reduced by suppressing the progress of peeling and cracks due to deformation of the wire.

Further, the shape of the opening 154 may be a so-called L-shape in which rectangles orthogonal to each other are combined. With such a configuration, the contact area between the upper electrode 203 and the side surface 203b can be expanded while suppressing the area of the opening 154, and the progress of peeling and cracking can be further suppressed.

Although the embodiment of the present invention and its modification have been described above, the above-described embodiment and its modification show one application example of the present invention. The present invention is not limited to the above-described embodiment and its modifications as they are, and can be embodied by making various modifications and changes at the implementation stage without departing from the gist thereof.
For example, in the above-described embodiment and its modification, the drive device 11 always applies a drive voltage having a waveform having a positive voltage value to the piezoelectric portion, but the drive voltage is applied to the piezoelectric portion and the piezoelectric portion is deformed. The configuration is not limited to this as long as it occurs. As an example, the drive device 11 may apply a drive voltage having a waveform having a negative voltage value to the piezoelectric portion at all times, or may alternately apply a positive voltage value and a negative voltage value.
Further, the shape of the contact hole may be any shape as long as the electrode wiring can come into contact with the upper electrode and the piezoelectric portion.
In the above embodiment and a modification thereof, as shown in FIG. 12, the optical deflector 13 is a cantilever type optical deflector in which the first piezoelectric drive portions 112a and 112b extend from the torsion bars 111a and 111b in the + X direction. Although it is used, the present invention is not limited to this as long as the reflective surface 14 is movable by the piezoelectric portion to which the voltage is applied.
For example, as shown in FIG. 22, a type of light having first piezoelectric drive portions 212a, 212b extending in the + X direction and first piezoelectric drive portions 212c, 212d extending in the −X direction from torsion bars 211a, 211b. A deflector may be used. Further, when the reflecting surface is moved only in the uniaxial direction, the reflecting surface 14 may be provided on the movable portion 220 as shown in FIG. 23. At this time, the reflecting surface 14 may be provided on the entire surface of the movable portion 220.

10 ... Optical scanning system, 11 ... Drive device, 12 ... Light source device, 13 ... Optical deflector, 14 ... Reflection surface, 15 ... Scanned surface, 30 ... Control unit (example of control means), 31 ... Drive signal output unit (Example of application means), 101 ... Mirror unit, 102 ... Mirror substrate, 110a, 100b ... First drive unit a, b, 111a, b ... Torsion bar a, b, 112a, 112b ... First piezoelectric drive unit, 120 ... 1st support part, 130a, 130b ... Elastic part (2nd drive part), 131a to 131f ... Piezoelectric drive part (2nd piezoelectric drive part a), 132a to 132f ... Piezoelectric drive part (2nd piezoelectric drive part b) , 140 ... second support, 150 ... electrode connection, 151 ... connection (electrode wiring), 161 ... silicon support layer, 162 ... silicon oxide layer, 163 ... silicon active layer, 201 ... lower electrode, 202 ... piezoelectric part , 203 ... Upper electrode, 400 ... Automobile, 500 ... Head-up display device (image projection device), 600 ... Optical writing device, 650 ... Laser printer (image forming device), 700 ... Laser radar device (object recognition device)

Japanese Unexamined Patent Publication No. 2015-055829 Japanese Patent No. 5598578 Japanese Patent No. 5316203 Japanese Patent No. 4926596

Claims (12)

A mirror part with a reflective surface and
A support portion in which a plurality of elastic portions are continuously formed in a meandering shape to support the mirror portion,
A plurality of piezoelectric drive portions individually provided on the elastic portion,
An insulating film that at least partially covers the piezoelectric drive unit,
It has a connecting portion for connecting at least two piezoelectric driving portions via an opening provided in the insulating film.
In the piezoelectric drive portion, a lower electrode, a piezoelectric portion, and an upper electrode are laminated.
The surface of the connection portion and the upper electrode of the piezoelectric drive unit abuts on the surface of the upper electrode along the laminated direction, and the connection portion and the piezoelectric portion of the piezoelectric drive unit come into contact with each other. The abutting surface is an optical deflector that abuts on a surface adjacent to the surface along the laminated direction along a direction different from the surface along the laminated direction. In the optical deflector according to claim 1,
The upper electrode and the piezoelectric portion are laminated so that the upper surface of the piezoelectric portion is in contact with the upper electrode.
The connection portion and the upper electrode of the piezoelectric drive portion are brought into contact with each other at a contact position on the side surface of the upper electrode in the laminated direction.
An optical deflector characterized in that the connection portion and the piezoelectric portion of the piezoelectric drive portion abut at a contact position on an upper surface different from the side surface in the laminated direction. In the optical deflector according to claim 1 or 2.
The openings are formed at both ends of the piezoelectric drive unit, respectively.
The optical deflector is characterized in that the connecting portion is arranged so as to connect the adjacent piezoelectric portion to the folded portion of the elastic portion formed in a meandering shape. In the optical deflector according to any one of claims 1 to 3.
The connection portion is an optical deflector characterized in that two or more layers of wiring members are laminated and formed. In the optical deflector according to claim 4,
A light deflector characterized in that the wiring member formed in the lowermost layer among the wiring members is a barrier layer. In the optical deflector according to any one of claims 1 to 5,
The optical deflector is characterized in that the mirror portion rotates about a predetermined first axis and is rotatably supported around a second axis orthogonal to the first axis. In the optical deflector according to claim 6,
A support beam having one end connected to the mirror portion and extending in the direction of the first axis,
An elastic portion connected to the other end of the support beam and extending in the direction of the second axis,
A light deflector characterized by having. The optical deflector according to claim 6 or 7,
A light source that irradiates light of a plurality of different wavelengths toward the mirror portion,
An optical path synthesizing means for synthesizing the optical paths of light into one,
An image display device characterized by irradiating the light deflector with the synthesized light and reflecting it on the reflecting surface to scan and draw an image on the projection surface. The light deflector according to any one of claims 1 to 7 is provided.
An image projection device that scans the light emitted to the mirror unit by driving the mirror unit. An optical writing device having the optical deflector according to any one of claims 1 to 7. An object recognition device having the light deflector according to any one of claims 1 to 7. A vehicle having the image projection device according to claim 9 or the object recognition device according to claim 11.

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