JP6826922B2

JP6826922B2 - Mounting structure of heat generating parts

Info

Publication number: JP6826922B2
Application number: JP2017052161A
Authority: JP
Inventors: 賢一郎一杉; 晃弘村野; 輝男鎌倉
Original assignee: Shindengen Electric Manufacturing Co Ltd
Current assignee: Shindengen Electric Manufacturing Co Ltd
Priority date: 2017-03-17
Filing date: 2017-03-17
Publication date: 2021-02-10
Anticipated expiration: 2037-03-17
Also published as: JP2018157050A

Description

この発明は、発熱部品の実装構造に関する。 The present invention relates to a mounting structure for heat generating components.

従来より、通電により発熱する発熱部品を放熱部品上に配すると共に、発熱部品を回路基板に接続した発熱部品の実装構造がある。このような実装構造では、発熱部品において生じた熱を放熱部品に逃がすことができる。
特許文献１には、放熱部品（ヒートシンク）の配置面上に、回路基板（プリント配線基板）と、回路基板に接続されて大電流が流れる複数の発熱部品（発熱性電子部品）と、回路基板を介して発熱部品に接続されて大電流を流すためのインサートモールド基板と、を配した発熱部品の実装構造が開示されている。この実装構造では、回路基板と隣り合う位置において、発熱部品の本体部、及び、インサートモールド基板とが放熱部品の配置面上に重ねて配されている。 Conventionally, there is a mounting structure of a heat generating component in which a heat generating component that generates heat by energization is arranged on the heat radiating component and the heat generating component is connected to a circuit board. In such a mounting structure, the heat generated in the heat generating component can be released to the heat radiating component.
Patent Document 1 describes a circuit board (printed wiring board), a plurality of heat-generating components (heat-generating electronic components) connected to the circuit board to allow a large current to flow, and a circuit board on the arrangement surface of the heat-dissipating component (heat sink). The mounting structure of the heat-generating component in which the insert-molded substrate is connected to the heat-generating component via the above and a large current is passed is disclosed. In this mounting structure, the main body of the heat generating component and the insert mold substrate are arranged so as to be overlapped on the arrangement surface of the heat radiating component at a position adjacent to the circuit board.

特開２００４―１０３８１６号公報Japanese Unexamined Patent Publication No. 2004-103816

しかしながら、従来の実装構造では、発熱部品の数が多くなると、回路基板に形成される配線（基板配線）も多数必要となり、多数の発熱部品と共に「回路」を構成する回路基板の配線パターンが複雑になってしまう。例えば特許文献１の実装構造では、回路基板に小電流を流すための基板配線だけではなく、大電流を流すための基板配線も、多数形成されているため、回路基板における配線パターンが複雑になりやすい。その結果、放熱部品上における回路基板の占有面積が大きくなってしまい、実装構造を含む製品の小型化を阻害する、という問題がある。 However, in the conventional mounting structure, when the number of heat-generating components increases, a large number of wirings (board wirings) formed on the circuit board are required, and the wiring pattern of the circuit board that constitutes the "circuit" together with the large number of heat-generating components is complicated. Become. For example, in the mounting structure of Patent Document 1, not only the board wiring for passing a small current through the circuit board but also a large number of board wirings for passing a large current are formed, so that the wiring pattern on the circuit board becomes complicated. Cheap. As a result, the occupied area of the circuit board on the heat radiating component becomes large, which hinders the miniaturization of the product including the mounting structure.

上記した占有面積を小さく抑えるためには、例えば、回路基板の基板配線を細く形成することが考えられる。しかしながら、この場合には、基板配線における電気抵抗が大きくなり、基板配線による電気的な損失が大きくなるため、好ましくない。
また、基板配線を細く形成することなく、上記した占有面積を小さく抑えるためには、例えば、回路基板の層数を増やす、すなわち回路基板を多層配線基板で構成することが考えられる。しかしながら、この場合には、回路基板のうち多層化すべき領域が回路基板の一部に限られる場合に、回路基板の残部が無駄に多層化されてしまうため、実装構造を含む製品の製造コストが無駄に増加してしまう。 In order to keep the occupied area small, for example, it is conceivable to form the board wiring of the circuit board thinly. However, in this case, the electrical resistance in the board wiring becomes large, and the electrical loss due to the board wiring becomes large, which is not preferable.
Further, in order to keep the occupied area small without forming the board wiring thin, for example, it is conceivable to increase the number of layers of the circuit board, that is, to configure the circuit board with a multilayer wiring board. However, in this case, when the region of the circuit board to be multi-layered is limited to a part of the circuit board, the rest of the circuit board is unnecessarily multi-layered, so that the manufacturing cost of the product including the mounting structure is high. It will increase in vain.

本発明は、上述した事情に鑑みたものであって、製品の小型化を図ると共に、電気的な損失を低く抑えることができ、さらに、製品の製造コストを低く抑えることが可能な発熱部品の実装構造を提供することを目的とする。 The present invention has been made in view of the above circumstances, and is a heat-generating component capable of reducing the size of a product, suppressing electrical loss, and further reducing the manufacturing cost of the product. The purpose is to provide a mounting structure.

本発明の一態様は、本体部及び本体部から突出するリードを有する発熱部品と、厚さ方向に間隔をあけて配列された複数の回路基板と、配置面を有するベース部と、前記配置面から突出するように前記ベース部に設けられた放熱部と、を備え、複数の前記回路基板が、前記リードによって接続され、前記発熱部品の本体部が、前記放熱部の表面に配され、複数の前記回路基板が、前記放熱部の突出方向の先端よりも低い位置において、前記放熱部の突出方向に間隔をあけて配列された発熱部品の実装構造である。 One aspect of the present invention includes a main body, a heat-generating component having leads protruding from the main body, a plurality of circuit boards arranged at intervals in the thickness direction, a base having an arrangement surface, and the arrangement surface. A plurality of the circuit boards are connected by the leads, and the main body portion of the heat generating component is arranged on the surface of the heat radiating portion, and a plurality of said circuit boards are provided with a heat radiating portion provided on the base portion so as to project from the base portion. This is a mounting structure of heat-generating components in which the circuit board is arranged at a position lower than the tip of the heat-dissipating portion in the protruding direction at intervals in the protruding direction of the heat-dissipating portion .

本発明によれば、複数の回路基板がその厚さ方向に間隔をあけて配列されると共に発熱部品のリードによって接続されるため、発熱部品の数が多くなっても、発熱部品と共に製品の回路を構成する回路基板の配線（基板配線）を、複数の回路基板に分けて形成できる。このため、発熱部品の数が多くなることで、発熱部品と共に製品の回路を構成する基板配線のパターンが複雑になっても、回路基板の占有面積を小さく抑えることができる。したがって、実装構造を含む製品の小型化を図ることができる。
また、基板配線の太さや厚さを十分に確保でき、基板配線による電気的な損失を小さく抑えることもできる。
また、多数の発熱部品と共に製品の回路を構成する基板配線を複数の回路基板に分けて形成できるため、基板配線を回路基板の一部領域に密集させても、基板配線が一つの回路基板のみに形成される場合と比較して、実装構造を含む製品の製造コストを低く抑えることができる。 According to the present invention, since a plurality of circuit boards are arranged at intervals in the thickness direction and connected by leads of heat-generating components, even if the number of heat-generating components increases, the circuit of the product together with the heat-generating components. The wiring (board wiring) of the circuit board constituting the above can be formed by dividing it into a plurality of circuit boards. Therefore, as the number of heat-generating components increases, the occupied area of the circuit board can be kept small even if the board wiring pattern that constitutes the circuit of the product together with the heat-generating components becomes complicated. Therefore, it is possible to reduce the size of the product including the mounting structure.
In addition, the thickness and thickness of the board wiring can be sufficiently secured, and the electrical loss due to the board wiring can be suppressed to a small value.
In addition, since the board wiring that constitutes the product circuit together with a large number of heat-generating components can be formed by dividing it into a plurality of circuit boards, even if the board wiring is densely packed in a part of the circuit board, only one circuit board is used. The manufacturing cost of the product including the mounting structure can be kept low as compared with the case where it is formed in.

本発明の一実施形態に係る発熱部品の実装構造を示す斜視図である。It is a perspective view which shows the mounting structure of the heat generating component which concerns on one Embodiment of this invention. 図１のII−II矢視断面図である。FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 図１の分解斜視図である。It is an exploded perspective view of FIG. 本発明の他の実施形態に係る発熱部品の実装構造を示す断面図である。It is sectional drawing which shows the mounting structure of the heat generating component which concerns on other embodiment of this invention. 本発明の他の実施形態に係る発熱部品の実装構造を示す断面図である。It is sectional drawing which shows the mounting structure of the heat generating component which concerns on other embodiment of this invention. 本発明の他の実施形態に係る発熱部品の実装構造を示す断面図である。It is sectional drawing which shows the mounting structure of the heat generating component which concerns on other embodiment of this invention.

〔第一実施形態〕
以下、図１−３を参照して本発明の一実施形態について説明する。
図１−３に示すように、本実施形態に係る発熱部品の実装構造は、発熱部品３と、複数の回路基板４，５と、を備える。また、本実施形態に係る発熱部品の実装構造は、ベース部１と、放熱部２と、を備える。 [First Embodiment]
Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1-3.
As shown in FIG. 1-3, the mounting structure of the heat generating component according to the present embodiment includes the heat generating component 3 and a plurality of circuit boards 4 and 5. Further, the mounting structure of the heat generating component according to the present embodiment includes a base portion 1 and a heat radiating portion 2.

ベース部１は、配置面１１を有する。配置面１１は、例えば湾曲した面に形成されてもよいが、本実施形態では平坦な面に形成されている。また、本実施形態のベース部１は板状に形成されている。ベース部１は、任意の材料によって構成されてよいが、本実施形態では、熱伝導率が高い材料（例えば銅やアルミニウムなど）によって構成されている。ベース部１は、例えば発熱部品３や回路基板４，５等を収容する筐体（ケース）を構成してもよい。 The base portion 1 has an arrangement surface 11. The arrangement surface 11 may be formed on, for example, a curved surface, but in the present embodiment, it is formed on a flat surface. Further, the base portion 1 of the present embodiment is formed in a plate shape. The base portion 1 may be made of any material, but in the present embodiment, it is made of a material having high thermal conductivity (for example, copper or aluminum). The base portion 1 may form, for example, a housing (case) for accommodating the heat generating component 3, the circuit boards 4, 5, and the like.

放熱部２は、ベース部１の配置面１１から突出するようにベース部１に設けられている。放熱部２は、ベース部１と同様に、熱伝導率が高い材料（例えば銅やアルミニウムなど）によって構成されている。放熱部２は、ベース部１と共にヒートシンク（放熱部２品）を構成している。本実施形態において、放熱部２はベース部１と一体に形成されている。 The heat radiating portion 2 is provided on the base portion 1 so as to protrude from the arrangement surface 11 of the base portion 1. Like the base portion 1, the heat radiating portion 2 is made of a material having high thermal conductivity (for example, copper or aluminum). The heat radiating unit 2 constitutes a heat sink (two heat radiating units) together with the base unit 1. In the present embodiment, the heat radiating portion 2 is integrally formed with the base portion 1.

放熱部２の頂面２１（放熱部２の突出方向の先端の面）には、発熱部品３が配される。放熱部２の頂面２１は、ベース部１の配置面１１に平行する平坦に形成されている。同一の放熱部２の頂面２１には、後述の発熱部品３が一つだけ配されてもよいが、本実施形態では発熱部品３が複数配される。 The heat generating component 3 is arranged on the top surface 21 of the heat radiating unit 2 (the surface at the tip of the heat radiating unit 2 in the protruding direction). The top surface 21 of the heat radiating portion 2 is formed flat so as to be parallel to the arrangement surface 11 of the base portion 1. Only one heat generating component 3 described later may be arranged on the top surface 21 of the same heat radiating unit 2, but in the present embodiment, a plurality of heat generating components 3 are arranged.

図２に例示する本実施形態の放熱部２の断面形状は、放熱部２の突出方向に向けて先細りとなる台形状となっているが、例えば長方形状など任意の形状であってよい。
放熱部２は、ベース部１の厚さ方向（放熱部２の突出方向）から見た平面視で、例えばドット状（島状）などの任意の形状に形成されてよいが、本実施形態では、配置面１１に沿って一方向に延びる帯状に形成されている。 The cross-sectional shape of the heat radiating portion 2 of the present embodiment illustrated in FIG. 2 is a trapezoidal shape that tapers in the protruding direction of the heat radiating portion 2, but may be any shape such as a rectangular shape.
The heat radiating portion 2 may be formed in an arbitrary shape such as a dot shape (island shape) in a plan view seen from the thickness direction of the base portion 1 (protruding direction of the heat radiating portion 2), but in the present embodiment. , It is formed in a band shape extending in one direction along the arrangement surface 11.

放熱部２は、例えばベース部１の配置面１１に一つだけ設けられてもよいが、本実施形態のように複数設けられてもよい。本実施形態では、帯状に形成された二つの放熱部２が、その長手方向において平行するように、互いに間隔をあけて配されている。 For example, only one heat radiating portion 2 may be provided on the arrangement surface 11 of the base portion 1, but a plurality of heat radiating portions 2 may be provided as in the present embodiment. In the present embodiment, the two heat radiating portions 2 formed in a band shape are arranged at intervals from each other so as to be parallel to each other in the longitudinal direction thereof.

発熱部品３は、通電により発熱する部品である。発熱部品３は、回路基板４，５に電気接続されることで、回路基板４，５と共に製品の回路を構成する。本実施形態において、発熱部品３は、放熱部２の頂面２１に配されている。
発熱部品３は、本体部３１と、本体部３１から突出するリード３２，３３と、を備える。 The heat generating component 3 is a component that generates heat when energized. The heat generating component 3 is electrically connected to the circuit boards 4 and 5 to form a product circuit together with the circuit boards 4 and 5. In the present embodiment, the heat generating component 3 is arranged on the top surface 21 of the heat radiating unit 2.
The heat generating component 3 includes a main body portion 31 and leads 32 and 33 protruding from the main body portion 31.

本体部３１は、通電によって主に発熱する部分であり、所定の容積を有する塊である。本体部３１は任意の形状に形成されてよいが、本実施形態では平面視長方形の板状に形成されている。
本体部３１の内部には、主な発熱源であるスイッチング素子等の半導体素子（不図示）が設けられている。半導体素子の複数の電極は、それぞれリード３２，３３に接続されている。本体部３１は、前述した放熱部２の頂面２１に配される。本体部３１は、例えば放熱部２の頂面２１に直接接触してもよいし、図１、図３に例示する放熱シート６を介して放熱部２の頂面２１に配されてもよい。 The main body 31 is a portion that mainly generates heat when energized, and is a mass having a predetermined volume. The main body 31 may be formed in any shape, but in the present embodiment, it is formed in the shape of a rectangular plate in a plan view.
A semiconductor element (not shown) such as a switching element, which is a main heat generating source, is provided inside the main body 31. A plurality of electrodes of the semiconductor element are connected to leads 32 and 33, respectively. The main body 31 is arranged on the top surface 21 of the heat dissipation portion 2 described above. The main body 31 may be in direct contact with, for example, the top surface 21 of the heat radiating unit 2, or may be arranged on the top surface 21 of the heat radiating unit 2 via the heat radiating sheet 6 illustrated in FIGS. 1 and 3.

放熱シート６は、熱伝導率の高い材料で構成されるとよい。また、放熱シート６は、電気的な絶縁性を有する材料で構成されてもよい。この場合、放熱部２の頂面２１に対向する本体部３１の表面に導電性を有する部位（例えば半導体素子を搭載するダイパッド）が露出していても、発熱部品３の本体部３１と放熱部２との電気的な絶縁を確保することができる。図１−２において、本体部３１はネジ７によって放熱部２の頂面２１に押し付けられるように固定されているが、これに限ることはない。
上記したように、発熱部品３が放熱部２の頂面２１に配されていることで、発熱部品３において発生した熱を放熱部２に効率よく逃がすことができる。 The heat radiating sheet 6 is preferably made of a material having high thermal conductivity. Further, the heat radiating sheet 6 may be made of a material having an electrically insulating property. In this case, even if a conductive portion (for example, a die pad on which a semiconductor element is mounted) is exposed on the surface of the main body 31 facing the top surface 21 of the heat radiating portion 2, the main body 31 and the heat radiating portion of the heat generating component 3 are exposed. It is possible to secure electrical insulation with 2. In FIG. 1-2, the main body 31 is fixed so as to be pressed against the top surface 21 of the heat radiating portion 2 by the screw 7, but the present invention is not limited to this.
As described above, since the heat generating component 3 is arranged on the top surface 21 of the heat radiating section 2, the heat generated in the heat radiating component 3 can be efficiently released to the heat radiating section 2.

発熱部品３のリード３２，３３は、本体部３１が放熱部２の頂面２１に配された状態で、本体部３１から放熱部２の頂面２１に沿う方向に突出している。リード３２，３３は、放熱部２の頂面２１に沿って放熱部２の頂面２１からはみ出す位置まで突出している。リード３２，３３は、その長手方向における中途部において折り曲げられている。これにより、リード３２，３３の突出方向の先端部は、ベース部１の厚さ方向においてベース部１の配置面１１に近づく方向に延びている。ただし、リード３２，３３の先端部は、ベース部１の配置面１１に対して電気的に絶縁されるように間隔をあけて位置している。リード３２，３３の先端部は、回路基板４，５に接続される。 The leads 32 and 33 of the heat generating component 3 project from the main body 31 in the direction along the top surface 21 of the heat radiating portion 2 in a state where the main body 31 is arranged on the top surface 21 of the heat radiating portion 2. The leads 32 and 33 project along the top surface 21 of the heat radiating unit 2 to a position protruding from the top surface 21 of the heat radiating unit 2. The leads 32 and 33 are bent in the middle portion in the longitudinal direction thereof. As a result, the tip portions of the leads 32 and 33 in the protruding direction extend in the thickness direction of the base portion 1 in the direction approaching the arrangement surface 11 of the base portion 1. However, the tips of the leads 32 and 33 are positioned at intervals so as to be electrically insulated from the arrangement surface 11 of the base portion 1. The tips of the leads 32 and 33 are connected to the circuit boards 4 and 5.

本実施形態の発熱部品３は、複数（図示例では三つ）のリード３２，３３を備える。複数のリード３２，３３は、本体部３１から同じ方向に突出している。また、複数のリード３２，３３は、本体部３１が放熱部２の頂面２１に配された状態で、放熱部２の頂面２１に沿ってリード３２，３３の突出方向に直交する方向に間隔をあけて配列されている。複数のリード３２，３３の長さは、例えば互いに異なってもよいが、本実施形態では互いに等しい。 The heat generating component 3 of the present embodiment includes a plurality of leads 32 and 33 (three in the illustrated example). The plurality of leads 32 and 33 project in the same direction from the main body 31. Further, the plurality of leads 32, 33 have the main body 31 arranged on the top surface 21 of the heat radiating unit 2 in a direction orthogonal to the protruding direction of the leads 32, 33 along the top surface 21 of the heat radiating unit 2. They are arranged at intervals. The lengths of the plurality of leads 32, 33 may be different from each other, for example, but in the present embodiment, they are equal to each other.

本実施形態において、発熱部品３のリード３２，３３には、大電流が流れる大電流用リード３２と、大電流よりも小さい小電流が流れる小電流用リード３３と、がある。ここで、大電流は例えば電源電流であり、小電流は例えば信号電流である。
発熱部品３の半導体素子がＭＯＳトランジスタである場合、大電流用リード３２は、ＭＯＳトランジスタのソース電極やドレイン電極に接続されるリードである。また、小電流用リード３３は、ＭＯＳトランジスタのゲート電極に接続されるリードである。図示例の発熱部品３は、二つの大電流用リード３２と、一つの小電流用リード３３を有するが、大電流用リード、一つの小電流用リード３３の数はこれに限らない。 In the present embodiment, the leads 32 and 33 of the heat generating component 3 include a large current lead 32 through which a large current flows and a small current lead 33 through which a small current smaller than the large current flows. Here, the large current is, for example, a power supply current, and the small current is, for example, a signal current.
When the semiconductor element of the heat generating component 3 is a MOS transistor, the large current lead 32 is a lead connected to the source electrode and the drain electrode of the MOS transistor. Further, the small current lead 33 is a lead connected to the gate electrode of the MOS transistor. The heat generating component 3 of the illustrated example has two large current leads 32 and one small current lead 33, but the number of large current leads and one small current lead 33 is not limited to this.

同一の放熱部２の頂面２１には、一つの発熱部品３だけが配されてもよいが、本実施形態では複数の発熱部品３が配されている。複数の発熱部品３の本体部３１は、帯状に形成された同一の放熱部２の長手方向に配列されている。この状態において、複数の発熱部品３のリード３２，３３は、同一の放熱部２に対して同じ方向（放熱部２の幅方向）に突出し、同一の放熱部２の長手方向に配列されている。 Only one heat generating component 3 may be arranged on the top surface 21 of the same heat radiating unit 2, but in the present embodiment, a plurality of heat generating components 3 are arranged. The main body 31 of the plurality of heat generating components 3 is arranged in the longitudinal direction of the same heat radiating portion 2 formed in a band shape. In this state, the leads 32 and 33 of the plurality of heat generating parts 3 project in the same direction (width direction of the heat radiating portion 2) with respect to the same heat radiating portion 2 and are arranged in the longitudinal direction of the same heat radiating portion 2. ..

また、本実施形態では、複数の発熱部品３が、二つの放熱部２のそれぞれに対して上記したように配されている。各放熱部２に配された発熱部品３のリード３２，３３は、互いの放熱部２に向けて延びるように本体部３１から突出している。すなわち、本実施形態において、二つの放熱部２に配された発熱部品３のリード３２，３３の先端部は、二つの放熱部２の間に位置している。 Further, in the present embodiment, a plurality of heat generating parts 3 are arranged for each of the two heat radiating portions 2 as described above. Leads 32 and 33 of the heat generating component 3 arranged in each heat radiating portion 2 project from the main body 31 so as to extend toward the heat radiating portion 2 of each other. That is, in the present embodiment, the tip ends of the leads 32 and 33 of the heat generating component 3 arranged in the two heat radiating parts 2 are located between the two heat radiating parts 2.

複数の回路基板４，５は、その厚さ方向に間隔をあけて配列されている。本実施形態において、複数の回路基板４，５は、放熱部２の頂面２１よりも低い位置（配置面１１側）において、放熱部２の突出方向に間隔をあけて配列されている。複数の回路基板４，５は、発熱部品３のリード３２，３３によって接続されている。具体的に、発熱部品３のリード３２，３３（特に先端部）は、各回路基板４，５を貫通した状態で、半田等によって各回路基板４，５に対して接続されている。これにより、複数の回路基板４，５は、発熱部品３のリード３２，３３によって連結されている。 The plurality of circuit boards 4 and 5 are arranged at intervals in the thickness direction thereof. In the present embodiment, the plurality of circuit boards 4 and 5 are arranged at positions lower than the top surface 21 of the heat radiating unit 2 (on the side of the arrangement surface 11) at intervals in the protruding direction of the heat radiating unit 2. The plurality of circuit boards 4 and 5 are connected by leads 32 and 33 of the heat generating component 3. Specifically, the leads 32 and 33 (particularly the tip portion) of the heat generating component 3 are connected to the circuit boards 4 and 5 by solder or the like while penetrating the circuit boards 4 and 5. As a result, the plurality of circuit boards 4 and 5 are connected by the leads 32 and 33 of the heat generating component 3.

放熱部２の突出方向に配列される回路基板４，５の数は、例えば三つ以上であってよいが、本実施形態では二つである。本実施形態では、第一回路基板４と第二回路基板５とが、放熱部２の突出方向と反対の方向に順番に配列されている。発熱部品３のリード３２，３３（特に先端部）は、第一回路基板４と第二回路基板５とに順番に貫通している。 The number of circuit boards 4 and 5 arranged in the protruding direction of the heat radiating unit 2 may be, for example, three or more, but is two in the present embodiment. In the present embodiment, the first circuit board 4 and the second circuit board 5 are arranged in order in the direction opposite to the protruding direction of the heat radiating portion 2. The leads 32 and 33 (particularly the tip portion) of the heat generating component 3 penetrate the first circuit board 4 and the second circuit board 5 in order.

本実施形態において、第一回路基板４は、平面視で、放熱部２に干渉しない大きさに形成されると共に、放熱部２に干渉しない（放熱部２と重ならない）位置に配されている。具体的に、第一回路基板４は、平面視で、二つの放熱部２の間に配することが可能な大きさに形成され、二つの放熱部２の間に配されている。 In the present embodiment, the first circuit board 4 is formed in a size that does not interfere with the heat radiating unit 2 in a plan view, and is arranged at a position that does not interfere with the heat radiating unit 2 (does not overlap with the heat radiating unit 2). .. Specifically, the first circuit board 4 is formed in a size that can be arranged between the two heat radiating portions 2 in a plan view, and is arranged between the two heat radiating portions 2.

本実施形態において、第一回路基板４は、大電流が流れる大電流用配線（不図示）を有する大電流回路基板である。第一回路基板４は、例えば大電流よりも小さい小電流を流すための小電流配線を有してもよいが、本実施形態では小電流配線を有さない。
前述した発熱部品３の大電流用リード３２は、第一回路基板４の大電流用配線に半田等で接合され、大電流用配線と電気接続されている。一方、発熱部品３の小電流用リード３３は、第一回路基板４の大電流用配線に電気接続されていない。具体的に、発熱部品３の小電流用リード３３は、大電流用配線と電気的に絶縁されるように第一回路基板４に形成されたダミー配線（不図示）に半田等で接合されている。 In the present embodiment, the first circuit board 4 is a large current circuit board having a large current wiring (not shown) through which a large current flows. The first circuit board 4 may have, for example, a small current wiring for passing a small current smaller than a large current, but the first circuit board 4 does not have the small current wiring in this embodiment.
The large current lead 32 of the heat generating component 3 described above is joined to the large current wiring of the first circuit board 4 by solder or the like, and is electrically connected to the large current wiring. On the other hand, the small current lead 33 of the heat generating component 3 is not electrically connected to the large current wiring of the first circuit board 4. Specifically, the small current lead 33 of the heat generating component 3 is joined to a dummy wiring (not shown) formed on the first circuit board 4 so as to be electrically insulated from the large current wiring by solder or the like. There is.

第二回路基板５は、前述の第一回路基板４とベース部１の配置面１１との間に配されている。本実施形態において、第二回路基板５は、平面視で、第一回路基板４よりも大きく形成されている。
また、第二回路基板５は、平面視で、放熱部２に干渉する大きさに形成されると共に、放熱部２に干渉する（放熱部２と重なる）位置に配されている。このため、第二回路基板５には、その厚さ方向に貫通して放熱部２を挿通させる挿通孔５１が形成されている。具体的には、第二回路基板５が、平面視で、ベース部１の配置面１１のうち二つの放熱部２を設けた領域及び二つの放熱部２の間の領域を含む領域よりも大きく形成されている。このため、第二回路基板５には、二つの放熱部２をそれぞれ挿通させる二つの挿通孔５１が形成されている。
平面視した第二回路基板５の大きさは、図示例の大きさに限らず、例えば図示例よりもさらに大きくてもよい。この場合、第二回路基板５のうち図示例の領域よりも外側の領域には、例えば、複数の発熱部品３、二つの回路基板４，５と共に回路を構成する各種の電子部品、電気部品が実装されていてもよい。 The second circuit board 5 is arranged between the first circuit board 4 described above and the arrangement surface 11 of the base portion 1. In the present embodiment, the second circuit board 5 is formed larger than the first circuit board 4 in a plan view.
Further, the second circuit board 5 is formed in a size that interferes with the heat radiating unit 2 in a plan view, and is arranged at a position that interferes with the heat radiating unit 2 (overlaps with the heat radiating unit 2). Therefore, the second circuit board 5 is formed with an insertion hole 51 that penetrates in the thickness direction and allows the heat radiating portion 2 to pass through. Specifically, the second circuit board 5 is larger than the region including the region provided with the two heat radiating portions 2 and the region between the two heat radiating portions 2 in the arrangement surface 11 of the base portion 1 in a plan view. It is formed. Therefore, the second circuit board 5 is formed with two insertion holes 51 through which the two heat radiating portions 2 are inserted.
The size of the second circuit board 5 in a plan view is not limited to the size of the illustrated example, and may be further larger than that of the illustrated example, for example. In this case, in a region of the second circuit board 5 outside the region shown in the illustrated example, for example, a plurality of heat generating components 3, various electronic components and electrical components forming a circuit together with the two circuit boards 4 and 5 are present. It may be implemented.

本実施形態において、第二回路基板５は、第一回路基板４の大電流用配線に流れる大電流よりも小さい小電流が流れる小電流用配線（不図示）を有する小電流回路基板である。第二回路基板５は、例えば大電流を流すための大電流用配線を有してもよいが、本実施形態では、大電流用配線を有さない。
前述した発熱部品３の小電流用リード３３は、第二回路基板５の小電流用配線に半田等で接合され、小電流用配線と電気接続されている。一方、発熱部品３の大電流用リード３２は、第二回路基板５の小電流用配線に電気接続されていない。具体的に、発熱部品３の大電流用リード３２は、小電流用配線と電気的に絶縁されるように第二回路基板５に形成されたダミー配線（不図示）に半田等で接合されている。 In the present embodiment, the second circuit board 5 is a small current circuit board having a small current wiring (not shown) in which a small current smaller than the large current flowing in the large current wiring of the first circuit board 4 flows. The second circuit board 5 may have, for example, a wiring for a large current for passing a large current, but in the present embodiment, it does not have a wiring for a large current.
The small current lead 33 of the heat generating component 3 described above is joined to the small current wiring of the second circuit board 5 by solder or the like, and is electrically connected to the small current wiring. On the other hand, the large current lead 32 of the heat generating component 3 is not electrically connected to the small current wiring of the second circuit board 5. Specifically, the large current lead 32 of the heat generating component 3 is joined to a dummy wiring (not shown) formed on the second circuit board 5 so as to be electrically insulated from the small current wiring by solder or the like. There is.

本実施形態において、二つの回路基板４，５は、発熱部品３のリード３２，３３に接続されていることで、放熱部２の頂面２１に配された発熱部品３のリード３２，３３によって支持されている。これにより、第二回路基板５を、ベース部１の配置面１１に対して間隔をあけて配することができる。第二回路基板５は、例えば不図示のスペーサをベース部１と第二回路基板５との間に設けることで、ベース部１の配置面１１上に間隔をあけて配されてもよい。 In the present embodiment, the two circuit boards 4 and 5 are connected to the leads 32 and 33 of the heat generating component 3, so that the leads 32 and 33 of the heat generating component 3 arranged on the top surface 21 of the heat radiating unit 2 It is supported. As a result, the second circuit board 5 can be arranged at intervals with respect to the arrangement surface 11 of the base portion 1. The second circuit board 5 may be arranged at intervals on the arrangement surface 11 of the base portion 1, for example, by providing a spacer (not shown) between the base portion 1 and the second circuit board 5.

本実施形態の実装構造において、複数の発熱部品３、及び、これに電気接続される二つの回路基板４，５の配線（大電流配線、小電流配線）によって構成される回路としては、例えば３相ブリッジ回路などが挙げられる。すなわち、本実施形態の実装構造は、例えば３相交流モータを駆動制御する電源装置などの製品に適用することが可能である。 In the mounting structure of the present embodiment, for example, 3 is a circuit composed of a plurality of heat generating components 3 and wirings (large current wiring, small current wiring) of two circuit boards 4 and 5 electrically connected thereto. Examples include a phase bridge circuit. That is, the mounting structure of the present embodiment can be applied to a product such as a power supply device that drives and controls a three-phase AC motor, for example.

次に、上記した本実施形態の実装構造の組立手順の一例について説明する。
発熱部品３の実装構造を組み立てる際には、はじめに、複数の回路基板４，５がその厚さ方向に間隔をあけて配列されるように、発熱部品３のリード３２，３３を複数の回路基板４，５に接合する。 Next, an example of the procedure for assembling the mounting structure of the present embodiment described above will be described.
When assembling the mounting structure of the heat generating component 3, first, the leads 32 and 33 of the heat generating component 3 are arranged on a plurality of circuit boards so that the plurality of circuit boards 4 and 5 are arranged at intervals in the thickness direction. Join to 4 and 5.

リード３２，３３を回路基板４，５に接合する際には、はじめに、図３に示すように、複数の発熱部品３のリード３２，３３の先端部を第一回路基板４に貫通させた上で、半田等により複数の発熱部品３のリード３２，３３の先端部を第一回路基板４に接合する。複数の発熱部品３のリード３２，３３は、第一回路基板４に対して同じ方向に貫通するため、一回の半田フロー工程によって、複数の発熱部品３のリード３２，３３を第一回路基板４に一括して接合することができる。
その後、複数の発熱部品３のリード３２，３３の先端部を第二回路基板５に貫通させた上で、半田等により複数の発熱部品３のリード３２，３３の先端部を第二回路基板５に接合する。この際、複数の発熱部品３のリード３２，３３は、第一回路基板４の場合と同様に、一回の半田フロー工程によって第二回路基板５に一括して接合することができる。 When joining the leads 32 and 33 to the circuit boards 4 and 5, first, as shown in FIG. 3, the tips of the leads 32 and 33 of the plurality of heat generating components 3 are passed through the first circuit board 4. Then, the tips of the leads 32 and 33 of the plurality of heat generating components 3 are joined to the first circuit board 4 by soldering or the like. Since the leads 32 and 33 of the plurality of heat generating components 3 penetrate in the same direction with respect to the first circuit board 4, the leads 32 and 33 of the plurality of heat generating components 3 are passed through the first circuit board by one solder flow process. It can be joined to 4 at once.
After that, the tips of the leads 32 and 33 of the plurality of heat generating components 3 are passed through the second circuit board 5, and then the tips of the leads 32 and 33 of the plurality of heat generating components 3 are passed through the second circuit board 5 by soldering or the like. Join to. At this time, the leads 32 and 33 of the plurality of heat generating components 3 can be collectively joined to the second circuit board 5 by a single solder flow step, as in the case of the first circuit board 4.

発熱部品３のリード３２，３３を複数の回路基板４，５に接合させた状態において、各発熱部品３の本体部３１は、複数の回路基板４，５の配列方向（回路基板の厚さ方向）において、同じ方向に向く複数の回路基板４，５の第一主面４２，５２側（特に第一回路基板４の第一主面４２側）に位置している。また、各発熱部品３の本体部３１は、回路基板４，５の厚さ方向から見た平面視で、第一回路基板４と重ならないように、かつ、第二回路基板５の挿通孔５１と重なるように位置している。 In a state where the leads 32 and 33 of the heat generating component 3 are joined to the plurality of circuit boards 4 and 5, the main body 31 of each heat generating component 3 is arranged in the arrangement direction of the plurality of circuit boards 4 and 5 (thickness direction of the circuit board). ), It is located on the first main surface 42, 52 side (particularly, the first main surface 42 side of the first circuit board 4) of the plurality of circuit boards 4 and 5 facing the same direction. Further, the main body 31 of each heat generating component 3 is viewed in a plan view from the thickness direction of the circuit boards 4 and 5, so as not to overlap the first circuit board 4 and the insertion hole 51 of the second circuit board 5. It is located so that it overlaps with.

その後、一体に固定された複数の発熱部品３及び複数の回路基板４，５をベース部１の配置面１１上に配する。この際、ベース部１上に設けられた放熱部２を第二回路基板５の挿通孔５１に挿通させた上で、複数の発熱部品３の本体部３１を放熱部２の頂面２１に配する。複数の発熱部品３は、図１，図３に例示する放熱シート６を介して放熱部２の頂面２１に配されてもよい。
最後に、各発熱部品３の本体部３１をネジ７等によって放熱部２の頂面２１に固定することで、発熱部品３の実装構造の組立が完了する。 After that, a plurality of heat-generating components 3 and a plurality of circuit boards 4 and 5 fixed integrally are arranged on the arrangement surface 11 of the base portion 1. At this time, after the heat radiating portion 2 provided on the base portion 1 is inserted into the insertion hole 51 of the second circuit board 5, the main body portions 31 of the plurality of heat generating parts 3 are arranged on the top surface 21 of the heat radiating portion 2. To do. The plurality of heat generating components 3 may be arranged on the top surface 21 of the heat radiating portion 2 via the heat radiating sheet 6 illustrated in FIGS. 1 and 3.
Finally, by fixing the main body 31 of each heat generating component 3 to the top surface 21 of the heat radiating portion 2 with screws 7 or the like, the assembly of the mounting structure of the heat generating component 3 is completed.

以上説明したように、本実施形態の実装構造では、複数の回路基板４，５がベース部１の配置面１１上に重ねて配されている。このため、回路基板４，５に接続される発熱部品３の数が多くなっても、発熱部品３と共に製品の回路を構成する回路基板４，５の配線（基板配線）を、複数の回路基板４，５に分けて形成することができる。これにより、発熱部品３の数が多くなることで、発熱部品３と共に製品の回路を構成する基板配線のパターンが複雑になっても、ベース部１の配置面１１上における回路基板４，５の占有面積を小さく抑えることができる。
また、基板配線の太さや厚さを十分に確保でき、基板配線による電気的な損失を小さく抑えることもできる。 As described above, in the mounting structure of the present embodiment, a plurality of circuit boards 4 and 5 are arranged so as to be overlapped on the arrangement surface 11 of the base portion 1. Therefore, even if the number of heat-generating components 3 connected to the circuit boards 4 and 5 increases, the wiring (board wiring) of the circuit boards 4 and 5 constituting the product circuit together with the heat-generating components 3 can be provided on a plurality of circuit boards. It can be formed by dividing it into 4 and 5. As a result, even if the number of heat-generating components 3 increases and the pattern of the board wiring that constitutes the circuit of the product together with the heat-generating components 3 becomes complicated, the circuit boards 4 and 5 on the arrangement surface 11 of the base portion 1 The occupied area can be kept small.
In addition, the thickness and thickness of the board wiring can be sufficiently secured, and the electrical loss due to the board wiring can be suppressed to a small value.

また、本実施形態の実装構造では、多数の発熱部品３と共に製品の回路を構成する基板配線を複数の回路基板４，５に分けて形成できる。このため、基板配線を一部領域に密集させても、基板配線が一つの回路基板のみに形成される場合と比較して、実装構造を含む製品の製造コストを低く抑えることができる。
具体的に説明すれば、例えば、発熱部品３と共に製品の回路を構成する基板配線を、一つの回路基板の一部領域に密集させる場合には、回路基板の一部領域だけではなく、他の領域も多層化する必要がある。その結果として、実装構造を含む製品の製造コストが高くなってしまう。
これに対し、本実施形態の実装構造では、発熱部品３と共に製品の回路を構成する基板配線を複数の回路基板４，５に分けて形成できる。このため、基板配線を一部領域に密集させる場合には、複数の回路基板４，５を一部領域においてのみ重ねて配すればよく、各回路基板４，５を無駄に多層化する（各回路基板４，５の層数を無駄に増やす）必要が無い。したがって、実装構造を含む製品の製造コストを低く抑えることができる。 Further, in the mounting structure of the present embodiment, the board wiring constituting the circuit of the product can be divided into a plurality of circuit boards 4 and 5 together with a large number of heat generating components 3. Therefore, even if the board wiring is densely packed in a part of the area, the manufacturing cost of the product including the mounting structure can be suppressed low as compared with the case where the board wiring is formed only on one circuit board.
Specifically, for example, when the board wiring that constitutes the circuit of the product together with the heat generating component 3 is densely packed in a part of one circuit board, not only a part of the circuit board but also another area. The area also needs to be multi-layered. As a result, the manufacturing cost of the product including the mounting structure becomes high.
On the other hand, in the mounting structure of the present embodiment, the board wiring constituting the circuit of the product together with the heat generating component 3 can be formed by dividing it into a plurality of circuit boards 4 and 5. Therefore, when the board wiring is densely packed in a part of the area, it is sufficient to arrange the plurality of circuit boards 4 and 5 so as to be overlapped only in a part of the area, and each of the circuit boards 4 and 5 is uselessly multi-layered (each There is no need to uselessly increase the number of layers of the circuit boards 4 and 5. Therefore, the manufacturing cost of the product including the mounting structure can be kept low.

また、本実施形態の実装構造では、発熱部品３がベース部１の配置面１１と同じ側に向く回路基板４，５の第一主面４２，５２側に配される。このため、発熱部品３、及び、発熱部品３と共に製品の回路を構成する各種の電気部品、電子部品を、回路基板４，５の第一主面４２，５２に効率よく実装できる。すなわち、各種の電気部品、電子部品を、発熱部品３と共に一回の半田フロー工程によって一つの回路基板４，５（特に第二回路基板５）に半田付けすることが可能となる。したがって、実装構造の組立を容易かつ効率よく行うことができる。 Further, in the mounting structure of the present embodiment, the heat generating component 3 is arranged on the first main surfaces 42 and 52 of the circuit boards 4 and 5 facing the same side as the arrangement surface 11 of the base portion 1. Therefore, the heat generating component 3 and various electric components and electronic components constituting the circuit of the product together with the heat generating component 3 can be efficiently mounted on the first main surfaces 42 and 52 of the circuit boards 4 and 5. That is, various electric parts and electronic parts can be soldered to one circuit board 4 and 5 (particularly the second circuit board 5) by one solder flow process together with the heat generating part 3. Therefore, the mounting structure can be assembled easily and efficiently.

また、本実施形態の実装構造では、複数の回路基板４，５が発熱部品３のリード３２，３３によって接続されている。このため、発熱部品３を各回路基板４，５に直接電気接続することができる。本実施形態では、発熱部品３の大電流用リード３２を第一回路基板４の大電流用配線に電気接続している。また、発熱部品３の小電流用リード３３を第二回路基板５の小電流用配線に電気接続している。このため、回路基板４，５同士を別途部品によって電気接続する必要が無くなる。すなわち、実装構造を構成する部品点数を減らすことができる。また、部品点数が減ることで、実装構造を含む製品の製造コストを低く抑えることができると共に、実装構造の組立工数を減らすこともできる。 Further, in the mounting structure of the present embodiment, a plurality of circuit boards 4 and 5 are connected by leads 32 and 33 of the heat generating component 3. Therefore, the heat generating component 3 can be directly electrically connected to the circuit boards 4 and 5. In the present embodiment, the large current lead 32 of the heat generating component 3 is electrically connected to the large current wiring of the first circuit board 4. Further, the small current lead 33 of the heat generating component 3 is electrically connected to the small current wiring of the second circuit board 5. Therefore, it is not necessary to electrically connect the circuit boards 4 and 5 with separate parts. That is, the number of parts constituting the mounting structure can be reduced. Further, by reducing the number of parts, the manufacturing cost of the product including the mounting structure can be suppressed low, and the man-hours for assembling the mounting structure can be reduced.

また、本実施形態の実装構造では、複数の回路基板４，５が、放熱部２の突出方向の先端（頂面２１）よりも低い位置において、放熱部２の突出方向に間隔をあけて配列されている。このため、発熱部品３の本体部３１を、回路基板４，５よりもベース部１の配置面１１から放熱部２の突出方向に離れた位置において、放熱部２の表面に配することができる。これにより、発熱部品３の実装構造を組み立てる際に、発熱部品３のリード３２，３３を複数の回路基板４，５に接合させた後に、発熱部品３の本体部３１をネジ止め等によって放熱部２に固定することができる。すなわち、発熱部品３がベース部１と回路基板４，５との間に配される場合と比較して、発熱部品３の実装構造を簡単に組み立てることができる。 Further, in the mounting structure of the present embodiment, the plurality of circuit boards 4 and 5 are arranged at positions lower than the tip (top surface 21) of the heat radiating unit 2 in the protruding direction at intervals in the protruding direction of the heat radiating unit 2. Has been done. Therefore, the main body 31 of the heat generating component 3 can be arranged on the surface of the heat radiating portion 2 at a position farther from the arrangement surface 11 of the base portion 1 in the protruding direction of the heat radiating portion 2 than the circuit boards 4 and 5. .. As a result, when assembling the mounting structure of the heat generating component 3, after the leads 32 and 33 of the heat generating component 3 are joined to the plurality of circuit boards 4 and 5, the main body 31 of the heat generating component 3 is screwed or the like to dissipate heat. It can be fixed to 2. That is, as compared with the case where the heat generating component 3 is arranged between the base portion 1 and the circuit boards 4 and 5, the mounting structure of the heat generating component 3 can be easily assembled.

また、本実施形態の実装構造では、発熱部品３の本体部３１が放熱部２の頂面２１に配される。このため、発熱部品３の実装構造を組み立てる際には、別途スペーサを用いることなく、発熱部品３の本体部３１を放熱部２の頂面２１に配するだけで、複数の回路基板４，５をベース部１の配置面１１に対して間隔をあけて配することができる。 Further, in the mounting structure of the present embodiment, the main body portion 31 of the heat generating component 3 is arranged on the top surface 21 of the heat radiating portion 2. Therefore, when assembling the mounting structure of the heat generating component 3, a plurality of circuit boards 4 and 5 are simply arranged on the top surface 21 of the heat radiating section 2 without using a separate spacer. Can be arranged at intervals with respect to the arrangement surface 11 of the base portion 1.

さらに、本実施形態の実装構造では、第二回路基板５に、放熱部２を挿通させる挿通孔５１が形成されている。このため、第二回路基板５に対する発熱部品３の取付位置を自由に設定することができる。具体的には、発熱部品３の本体部３１が第二回路基板５の第一主面５２上に位置するように、発熱部品３を第二回路基板５に取り付けても、発熱部品３の本体部３１を放熱部２の頂面２１に配することができる。
また、第二回路基板５がベース部１の配置面１１のほぼ全体を覆うような大きさであり、放熱部２がベース部１の配置面１１の縁以外の領域（例えば中央領域）に設けられる場合であっても、発熱部品３の本体部３１を放熱部２の頂面２１に配することができる。すなわち、発熱部品３の実装構造を、ベース部１の配置面１１の縁以外の任意の領域（例えば中央領域）に設けることができる。言い換えれば、ベース部１上における実装構造のレイアウトの自由度向上を図ることができる。 Further, in the mounting structure of the present embodiment, the second circuit board 5 is formed with an insertion hole 51 through which the heat radiating portion 2 is inserted. Therefore, the mounting position of the heat generating component 3 with respect to the second circuit board 5 can be freely set. Specifically, even if the heat generating component 3 is attached to the second circuit board 5 so that the main body 31 of the heat generating component 3 is located on the first main surface 52 of the second circuit board 5, the main body of the heat generating component 3 is generated. The portion 31 can be arranged on the top surface 21 of the heat radiating portion 2.
Further, the second circuit board 5 has a size that covers almost the entire arrangement surface 11 of the base portion 1, and the heat dissipation portion 2 is provided in a region (for example, a central region) other than the edge of the arrangement surface 11 of the base portion 1. Even in such a case, the main body portion 31 of the heat generating component 3 can be arranged on the top surface 21 of the heat radiating portion 2. That is, the mounting structure of the heat generating component 3 can be provided in an arbitrary region (for example, a central region) other than the edge of the arrangement surface 11 of the base portion 1. In other words, it is possible to improve the degree of freedom in the layout of the mounting structure on the base portion 1.

さらに、本実施形態の実装構造では、第一回路基板４が大電流用配線を有する大電流回路基板であり、第二回路基板５が小電流配線を有する小電流回路基板である。この場合には、同一の回路基板４，５に、同じ厚さや太さの配線を形成できる。具体的には、大電流回路基板には太さや厚さが大きい大電流用配線だけを形成し、小電流回路基板には太さや厚さが小さい小電流配線を形成だけを形成することができる。すなわち、異なる太さや厚さの配線を同一の回路基板４，５に形成する場合と比較して、各回路基板４，５を安価に製造できる。
また、大電流用配線と小電流配線とを、別個の回路基板４，５に形成することで、実装構造を含む製品の回路における配線同士の電磁気的な干渉を抑制し、製品の回路におけるノイズ発生を好適に抑えることができる。 Further, in the mounting structure of the present embodiment, the first circuit board 4 is a large current circuit board having the wiring for a large current, and the second circuit board 5 is a small current circuit board having the wiring for a small current. In this case, wiring having the same thickness and thickness can be formed on the same circuit boards 4 and 5. Specifically, it is possible to form only the wiring for large current having a large thickness and thickness on the large current circuit board, and to form only the wiring for small current having a small thickness and thickness on the small current circuit board. .. That is, each circuit board 4 and 5 can be manufactured at low cost as compared with the case where wirings having different thicknesses and thicknesses are formed on the same circuit boards 4 and 5.
Further, by forming the large current wiring and the small current wiring on separate circuit boards 4 and 5, electromagnetic interference between the wirings in the product circuit including the mounting structure is suppressed, and noise in the product circuit is suppressed. Occurrence can be suppressed suitably.

また、本実施形態の実装構造によれば、平面視で、大電流回路基板である第一回路基板４が、小電流回路基板である第二回路基板５よりも小さいことで、実装構造を含む製品の製造コストを低く抑えることができる。以下、この点について説明する。
大電流回路基板に形成される大電流用配線の太さや厚さは、小電流回路基板に形成される小電流配線よりも大きいため、大電流回路基板の厚さは、小電流回路基板よりも厚くなる。回路基板４，５の厚さは厚いほど高価となるが、平面視した大電流回路基板の大きさを、小電流回路基板よりも小さくすることで、実装構造を含む製品の製造コストを低く抑えることができる。 Further, according to the mounting structure of the present embodiment, the first circuit board 4 which is a large current circuit board is smaller than the second circuit board 5 which is a small current circuit board in a plan view, so that the mounting structure is included. The manufacturing cost of the product can be kept low. This point will be described below.
Since the thickness and thickness of the large current wiring formed on the large current circuit board is larger than that of the small current wiring formed on the small current circuit board, the thickness of the large current circuit board is larger than that of the small current circuit board. It gets thicker. The thicker the circuit boards 4 and 5 are, the more expensive they are. However, by making the size of the large current circuit board in a plan view smaller than that of the small current circuit board, the manufacturing cost of the product including the mounting structure can be kept low. be able to.

また、本実施形態の実装構造では、小電流回路基板である第二回路基板５が、ベース部１の配置面１１と大電流回路基板である第一回路基板４との間に配されている。このため、大電流回路基板の大電流配線に大電流が流れることで生じた熱が、小電流回路基板に影響することを好適に抑制できる。以下、この点について説明する。
大電流回路基板の大電流配線で生じた熱は、発熱部品３のリード３２，３３及び本体部３１を放熱経路として放熱部２に逃がすことができる。この放熱経路の途中には小電流回路基板が位置しないため、大電流回路基板の熱が小電流回路基板に伝わることを好適に抑制することができる。 Further, in the mounting structure of the present embodiment, the second circuit board 5 which is a small current circuit board is arranged between the arrangement surface 11 of the base portion 1 and the first circuit board 4 which is a large current circuit board. .. Therefore, it is possible to preferably suppress the heat generated by the large current flowing through the large current wiring of the large current circuit board from affecting the small current circuit board. This point will be described below.
The heat generated by the large current wiring of the large current circuit board can be dissipated to the heat radiating unit 2 through the leads 32 and 33 of the heat generating component 3 and the main body 31 as heat radiating paths. Since the small current circuit board is not located in the middle of this heat dissipation path, it is possible to suitably suppress the heat transfer of the large current circuit board to the small current circuit board.

以上、本発明の詳細について説明したが、本発明は上述した実施形態に限定されるものではなく、本発明の主旨を逸脱しない範囲において種々の変更を加えることができる。 Although the details of the present invention have been described above, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

本発明の実装構造において、放熱部２は、例えば図４−５に示すように、ベース部１と別個に形成され、ベース部１に対して着脱可能又は着脱不能に取り付けられてもよい。放熱部２をベース部１に固定する場合、その固定手法は、ネジ止めや接着など任意であってよい。
放熱部２をベース部１と別個に形成する場合には、同一種類のベース部１に対し、様々な形状や大きさを有する放熱部２を取り付けることができる。すなわち、ベース部１の汎用性が向上し、実装構造を含む製品の製造コスト削減を図ることができる。 In the mounting structure of the present invention, the heat radiating portion 2 may be formed separately from the base portion 1 and attached to the base portion 1 in a detachable or non-detachable manner, for example, as shown in FIG. 4-5. When the heat radiating portion 2 is fixed to the base portion 1, the fixing method may be arbitrary such as screwing or bonding.
When the heat radiating portion 2 is formed separately from the base portion 1, the heat radiating portion 2 having various shapes and sizes can be attached to the base portion 1 of the same type. That is, the versatility of the base portion 1 is improved, and the manufacturing cost of the product including the mounting structure can be reduced.

本発明の実装構造では、例えば図４に示すように、平面視した大きさが第二回路基板５よりも小さい第一回路基板４が、ベース部１の配置面１１と第二回路基板５との間に配されてもよい。また、本発明の実装構造では、例えば第一回路基板４が小電流回路基板であり、第二回路基板５が大電流回路基板であってもよい。 In the mounting structure of the present invention, for example, as shown in FIG. 4, the first circuit board 4 whose plan view size is smaller than that of the second circuit board 5 is the arrangement surface 11 of the base portion 1 and the second circuit board 5. It may be arranged between. Further, in the mounting structure of the present invention, for example, the first circuit board 4 may be a small current circuit board and the second circuit board 5 may be a large current circuit board.

本発明の実装構造では、回路基板に、放熱部を挿通させるための挿通孔が形成されなくてもよい。例えば図５に示すように、放熱部２がベース部１の配置面１１の縁領域に設けられる場合には、第二回路基板５がベース部１の配置面１１のほぼ全体を覆うような大きさであっても、第二回路基板５に挿通孔を形成することなく、第二回路基板５を放熱部２の頂面２１よりも低い位置に配したり、発熱部品３の本体部３１を放熱部２の頂面２１に配したりすることができる。 In the mounting structure of the present invention, the circuit board does not have to have an insertion hole for inserting the heat radiating portion. For example, as shown in FIG. 5, when the heat radiating portion 2 is provided in the edge region of the arrangement surface 11 of the base portion 1, the size of the second circuit board 5 covers almost the entire arrangement surface 11 of the base portion 1. Even so, the second circuit board 5 is arranged at a position lower than the top surface 21 of the heat radiating portion 2 without forming an insertion hole in the second circuit board 5, or the main body portion 31 of the heat generating component 3 is arranged. It can be arranged on the top surface 21 of the heat radiating unit 2.

本発明の実装構造において、発熱部品の本体部は、放熱部の頂面に配されることに限らず、少なくとも放熱部の表面に配されればよい。例えば図６に示すように、発熱部品３Ａの本体部３１は、放熱部２Ａの側面２１Ａに配されてもよい。この場合、発熱部品３Ａのリード３２Ａ，３３Ａは、上記実施形態のように折り曲げられずに、本体部３１からベース部１の配置面１１に近づく方向（複数の回路基板４，５の配列方向）に真っ直ぐに延びてよい。 In the mounting structure of the present invention, the main body of the heat generating component is not limited to being arranged on the top surface of the heat radiating portion, but may be arranged at least on the surface of the heat radiating portion. For example, as shown in FIG. 6, the main body 31 of the heat generating component 3A may be arranged on the side surface 21A of the heat radiating portion 2A. In this case, the leads 32A and 33A of the heat generating component 3A are not bent as in the above embodiment, but are in the direction of approaching the arrangement surface 11 of the base portion 1 from the main body portion 31 (arrangement direction of the plurality of circuit boards 4 and 5). May extend straight to.

本発明の実装構造において、放熱部の突出方向（回路基板の厚さ方向）に間隔をあけて配列される複数の回路基板には、複数の大電流回路基板や複数の小電流回路基板が含まれてよい。この場合、各回路基板における配線の数をさらに減らすことができ、ベース部の配置面上における回路基板の占有面積をさらに小さく抑えることができる。また、各回路基板に形成される配線の太さや厚さをさらに確保しやすくなり、配線による電気的な損失をさらに小さく抑えることもできる。 In the mounting structure of the present invention, the plurality of circuit boards arranged at intervals in the protruding direction (thickness direction of the circuit board) of the heat radiating portion include a plurality of large current circuit boards and a plurality of small current circuit boards. You can do it. In this case, the number of wirings in each circuit board can be further reduced, and the area occupied by the circuit board on the arrangement surface of the base portion can be further suppressed. In addition, it becomes easier to secure the thickness and thickness of the wiring formed on each circuit board, and the electrical loss due to the wiring can be further suppressed.

本発明の実装構造では、例えば同一の回路基板に大電流配線及び小電流配線の両方が形成されてもよい。この場合には、同一の発熱部品の全てのリードが、同一の回路基板の配線に電気接続されてもよい。また、例えば、幾つかの発熱部品のリードが一の回路基板の配線に電気接続され、残りの発熱部品のリードが他の回路基板の配線に電気接続されてもよい。 In the mounting structure of the present invention, for example, both the large current wiring and the small current wiring may be formed on the same circuit board. In this case, all the leads of the same heat generating component may be electrically connected to the wiring of the same circuit board. Further, for example, the leads of some heat-generating components may be electrically connected to the wiring of one circuit board, and the leads of the remaining heat-generating components may be electrically connected to the wiring of another circuit board.

本発明の実装構造では、少なくとも厚さ方向に配列された複数の回路基板が発熱部品のリードによって接続されていればよい。すなわち、本発明の実装構造は、上記実施形態のベース部や放熱部を備えなくてもよい。 In the mounting structure of the present invention, at least a plurality of circuit boards arranged in the thickness direction may be connected by leads of heat-generating components. That is, the mounting structure of the present invention does not have to include the base portion and the heat radiating portion of the above embodiment.

１ベース部
２，２Ａ放熱部
３，３Ａ発熱部品
４第一回路基板（大電流回路基板、回路基板）
５第二回路基板（小電流回路基板、回路基板）
１１配置面
２１頂面（表面）
２１Ａ側面（表面）
３１本体部
３２，３２Ａ大電流用リード（リード）
３３，３３Ａ小電流用リード（リード）
４２，５２第一主面
５１挿通孔 1 Base part 2, 2A Heat dissipation part 3, 3A Heat generating component 4 First circuit board (large current circuit board, circuit board)
5 Second circuit board (small current circuit board, circuit board)
11 Arrangement surface 21 Top surface (surface)
21A side (surface)
31 Main body 32, 32A Lead for large current (lead)
33,33A Lead for small current (lead)
42, 52 First main surface 51 Insertion hole

Claims

A heat-generating component having a main body and leads protruding from the main body, a plurality of circuit boards arranged at intervals in the thickness direction, a base having an arrangement surface, and the base so as to project from the arrangement surface. With a heat dissipation part provided in the part ,
A plurality of the circuit boards are connected by the leads, and the plurality of circuit boards are connected by the leads .
The main body of the heat generating component is arranged on the surface of the heat radiating portion.
A mounting structure of heat-generating components in which a plurality of the circuit boards are arranged at positions lower than the tip of the heat-dissipating portion in the protruding direction at intervals in the protruding direction of the heat-dissipating portion .

The mounting structure for a heat-generating component according to claim 1 , wherein the main body of the heat-generating component is arranged on the top surface of the heat-dissipating portion.

The mounting structure for a heat generating component according to claim 1 or 2 , wherein at least one circuit board is formed with an insertion hole through which the heat radiating portion is inserted so as to penetrate in the thickness direction thereof.

The heat radiating portion, the base portion and separately formed, the mounting structure of the heat-generating component according to claims 1 to be attached to the base portion in any one of claims 3.

The plurality of circuit boards
A large-current circuit board with large-current wiring through which a large current flows,
Mounting structure of the heat generating component according to any one of claims 4 wherein the small-current circuit board having wiring for the small current flowing is smaller smaller current than a large current, from claim 1 there is.

The mounting structure for heat-generating components according to claim 5 , wherein the large-current circuit board is smaller than the small-current circuit board in a plan view from the thickness direction of the circuit board.

The leads of the heat generating component include a lead for a large current through which a large current flows and a lead for a small current through which a small current flows.
The high current lead is electrically connected to the high current wiring of the high current circuit board.
The mounting structure for a heat generating component according to claim 5 or 6 , wherein the small current lead is electrically connected to the small current wiring of the small current circuit board.

A base portion having an arrangement surface and a heat radiating portion provided on the base portion so as to protrude from the arrangement surface are provided.
The main body of the heat generating component is arranged on the surface of the heat radiating portion.
A plurality of the circuit boards are arranged at positions lower than the tip of the heat radiating portion in the protruding direction at intervals in the protruding direction of the heat radiating portion.
The plurality of circuit boards include a large current circuit board having a large current wiring through which a large current flows, and a small current circuit board having a small current wiring in which a small current smaller than the large current flows.
The mounting structure for heat-generating components according to any one of claims 1 to 7 , wherein the small current circuit board is arranged between the arrangement surface and the large current circuit board.