JP6861383B2 - lighting equipment - Google Patents

Description

The present invention relates to a luminaire including a light emitting module having a plurality of light emitting elements arranged on a substrate and one or more circuit components.

Conventionally, for example, a ceiling light which is a lighting fixture arranged on a ceiling is known. For example, the conventional ceiling light described in Patent Document 1 includes an instrument body, an instrument attachment portion for attaching the instrument body to a building material, and a light source board and a circuit board supported by the instrument body. A plurality of light emitting diodes (LEDs: Light Emitting Diodes) are mounted on the light source substrate. A plurality of circuit components constituting a lighting circuit for lighting each of the plurality of LEDs are mounted on the circuit board.

The circuit board is arranged in a ring shape on the instrument body so as to surround the periphery of the instrument mounting portion. The light source board is arranged in a ring shape on the instrument body so as to surround the circuit board.

Japanese Unexamined Patent Publication No. 2012-146666

When assembling the above-mentioned conventional ceiling light, first, positioning work for positioning the light source board and the circuit board with respect to the instrument main body is performed, and then wiring work for connecting the light source board and the circuit board with lead wires is performed. There is a need. Therefore, for example, it is difficult to improve the assembly efficiency of the ceiling light.

Therefore, it is conceivable to realize the light source board and the circuit board with one board, but in this case, since elements such as circuit parts, lead wires of circuit parts, and solder are present on the back surface of the board. , These storage spaces are needed. The presence of this accommodation space can be a factor in increasing the thickness of the luminaire.

In consideration of the above-mentioned conventional problems, the present invention provides a luminaire including a light emitting module having a plurality of light emitting elements arranged on a substrate and one or more circuit components, which can be made thinner. With the goal.

The lighting fixture according to one aspect of the present invention is a lighting fixture including a fixture main body and a light emitting module attached to the fixture main body, and the light emitting module is arranged on a substrate and a main surface of the substrate. It has one or more circuit components and a plurality of light emitting elements arranged in an annular shape on the main surface of the substrate so as to surround the one or more circuit components, and the instrument body is the substrate. It has a mounting surface portion that forms a surface that contacts a region on the back side of the plurality of light emitting elements and a region on the back side of the one or more circuit components on the back surface that is the surface opposite to the main surface.

According to the present invention, it is possible to provide a luminaire including a light emitting module having a plurality of light emitting elements and circuit components arranged on a substrate, which can be made thinner.

FIG. 1 is an exploded perspective view of the luminaire according to the embodiment. FIG. 2 is a plan view showing an outline of the configuration of the light emitting module according to the embodiment. FIG. 3 is a perspective view showing the structural relationship between the substrate and the instrument main body according to the embodiment. FIG. 4 is a cross-sectional view showing an outline of the configuration of the lighting fixture according to the embodiment. FIG. 5 is a plan view showing an outline of the configuration of the light emitting module according to the first modification of the embodiment. FIG. 6 is a perspective view showing an outline of the configuration of the instrument main body according to the second modification of the embodiment. FIG. 7 is a cross-sectional view of a groove portion of the instrument main body according to the second modification of the embodiment.

Hereinafter, embodiments and modifications thereof will be described with reference to the drawings. Each of the embodiments and modifications described below is a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, arrangement positions of the components, connection forms, and the like shown in the following embodiments and modifications are examples, and are not intended to limit the present invention. Therefore, among the components in the following embodiments and modifications, the components not described in the independent claims indicating the highest level concept of the present invention will be described as arbitrary components.

It should be noted that each figure is a schematic view and is not necessarily exactly shown. Further, in each figure, substantially the same configuration is designated by the same reference numerals, and duplicate description may be omitted or simplified.

(Embodiment)
Hereinafter, the lighting fixture 100 according to the embodiment will be described.

[Overall configuration of lighting equipment]
First, the overall configuration of the luminaire 100 according to the embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is an exploded perspective view of the luminaire 100 according to the embodiment. FIG. 2 is a plan view showing an outline of the configuration of the light emitting module 10 according to the embodiment.

As shown in FIG. 1, the luminaire 100 of the present embodiment is, for example, a ceiling light attached to the ceiling 4. The upper side (plus direction of the Z axis) in FIG. 1 corresponds to the direction of the floor surface (not shown) facing the ceiling 4. That is, the luminaire 100 in FIG. 1 is shown in an upside-down posture as opposed to normal use.

The lighting fixture 100 according to the present embodiment includes a fixture main body 106 and a light emitting module 10 attached to the fixture main body 106. The light emitting module 10 includes a substrate 11, a plurality of light emitting elements 20 arranged on the main surface 11a of the substrate 11, and one or more circuit components 80. In the present embodiment, a plurality of circuit components 80 are arranged on the main surface 11a of the substrate 11, and the power supply circuit 90 is composed of the plurality of circuit components 80. In the present embodiment, the lighting fixture 100 further includes a circuit cover 150, a light source cover 160, a lighting cover 140, and a fixture mounting portion 8.

[Instrument body]
As shown in FIG. 1, the instrument main body 106 is formed in a disk shape, and is a member manufactured by using a sheet metal such as an aluminum plate or a steel plate. For example, a white paint having high light reflectance is applied or a reflective metal material is vapor-deposited on the surface of the instrument body 106 on the side where the light emitting module 10 or the like is arranged.

Further, as shown in FIG. 1, a circular opening is formed in the central portion of the instrument main body 106, and a substantially cylindrical support portion 126 extending from the peripheral edge of the opening to the light emitting module 10 side is formed. Has been done. The support portion 126 is, for example, a member made of resin and has a structure that can be fitted with the fixture mounting portion 8.

In the instrument main body 106, a mounting surface portion 132 is formed around the support portion 126, and a peripheral edge portion 131 is formed around the mounting surface portion 132. The light emitting module 10 is fixed to the instrument main body 106 with screws or the like (not shown) in a state where the flat back surface 11b of the substrate 11 is in surface contact with the flat mounting surface portion 132. The structural relationship between the light emitting module 10 and the instrument main body 106 will be described later with reference to FIGS. 3 and 4.

[Apparatus mounting part]
The instrument mounting portion 8 is attached to the support portion 126 by being inserted into the support portion 126 of the instrument main body 106. Further, the fixture mounting portion 8 is detachably attached to the ceiling side mounting member 9 installed on the ceiling 4. As the fixture mounting portion 8 is detachably attached to the ceiling side mounting member 9 in this way, the fixture main body 106 is detachably attached to the ceiling 4. A cushion member (not shown) for suppressing wobbling of the appliance main body 106 is arranged between the appliance main body 106 and the ceiling 4.

[Light emitting module]
As shown in FIGS. 1 and 2, the light emitting module 10 includes a substrate 11, a plurality of light emitting elements 20 arranged on the substrate 11, and one or more (plural) circuits arranged on the substrate 11. It includes a component 80.

The outer shape of the substrate 11 in a plan view (when the substrate 11 is viewed from the thickness direction of the substrate 11) is a rectangular shape with cut corners, and a circular opening 12 is formed in the central portion. That is, the substrate 11 has an annular shape. The substrate 11 is a printed circuit board in which a conductor pattern (metal wiring) is provided only on the main surface 11a side of the substrate. As such a substrate 11, for example, a glass composite substrate such as a CEM3 (Composite epixy material-3) substrate, a resin substrate, a ceramic substrate, a paper phenol substrate, or the like is adopted.

Each of the plurality of light emitting elements 20 of the present embodiment is, for example, an LED element in which an LED chip is packaged. That is, the mounting structure of the light emitting module 10 is an SMD (Surface Mount Device) structure in which an LED element in which an LED chip is packaged is mounted on a substrate 11. The plurality of light emitting elements 20 included in the light emitting module 10 may include, for example, a plurality of types of light emitting elements 20 having different color temperatures.

For example, even if the plurality of light emitting elements 20 included in the light emitting module 10 are composed of a group of light emitting elements 20 having a high color temperature (first group) and a group of light emitting elements 20 having a low color temperature (second group). Good. In this case, by adjusting the brightness of each of the light emitting element 20 of the first group and the light emitting element 20 of the second group, that is, by controlling the dimming, the color of the light emitted by the light emitting module 10 is adjusted, that is, toning. Control may be performed.

Further, in the present embodiment, as shown in FIG. 2, a plurality of light emitting elements 20 are arranged in the second region 13b, which is the outer peripheral region of the first region 13a on the main surface 11a of the substrate 11. These plurality of light emitting elements 20 are connected to a conductor pattern (metal wiring) provided on the main surface 11a by solder. That is, the plurality of light emitting elements 20 are surface-mounted on the second region 13b on the main surface 11a of the substrate 11.

As shown in FIG. 2, for example, the plurality of light emitting elements 20 are arranged side by side in an annular shape so as to surround the first region 13a of the substrate 11. The mode of electrical connection of the plurality of light emitting elements 20 is not particularly limited. For example, a plurality of groups (light emitting element groups) of n (n is an integer of 2 or more) light emitting elements 20 connected in series may be formed, and these plurality of light emitting element groups may be connected in parallel. Further, all the light emitting elements 20 arranged on the substrate 11 may be connected in series. Further, in the present embodiment, the light emitting unit 25 in the light emitting module 10 is configured by the plurality of light emitting elements 20. That is, the light emitting unit 25 is arranged in the second region 13b on the main surface 11a of the substrate 11.

The first region 13a, which is a region of the central portion (peripheral portion of the opening 12) of the substrate 11 in a plan view, is a region in which one or more circuit components 80 are arranged. The one or more circuit components 80 are components that form at least a part of an electric circuit used for operating the light emitting unit 25 (lighting, extinguishing, changing the dimming rate, etc.). In the present embodiment, a plurality of circuit components 80 are arranged in the first region 13a, and the plurality of circuit components 80 constitute a power supply circuit 90 that supplies electric power for light emission to the light emitting unit 25. There is.

The power supply circuit 90 converts AC power supplied from, for example, a cable (not shown) extending from the instrument main body 106 into DC power suitable for light emission of the light emitting unit 25 and supplies the AC power. As a result, the light emitting unit 25 emits light.

Each of the plurality of circuit components 80 constituting the power supply circuit 90 is, for example, a capacitance element such as an electrolytic capacitor or a ceramic capacitor, a resistance element, a coil element, a choke coil (choke transformer), a noise filter, and a diode or an integrated circuit element. Such as semiconductor elements.

In the present embodiment, a patterned metal wiring (not shown) is provided only on one surface (main surface 11a in FIGS. 1 and 2) of both sides of the substrate 11 in the thickness direction. Further, in the present embodiment, the plurality of circuit components 80 are, for example, all surface mount type chip components, and are soldered to metal wiring (not shown) provided on the main surface 11a of the substrate 11. That is, the power supply circuit 90 does not include a lead-through mounting type lead component (radial component or axial component). Therefore, the power supply circuit 90 is arranged on the main surface 11a of the substrate 11 without causing the tip of the lead wire and the convex portion formed of solder on the back surface 11b of the substrate 11.

The lead component may be mounted on the main surface 11a of the substrate 11 by forming the lead of the lead component such as an electrolytic capacitor or a connector. Further, in this case, for example, by adhering the component body of the lead component to the main surface 11a, the lead component can be more stably fixed to the main surface 11a. That is, one or more of the plurality of circuit components 80 according to the present embodiment may be lead components.

Further, the plurality of light emitting elements 20 are also surface mount type LED elements as described above. Therefore, even after the plurality of light emitting elements 20 and the circuit components 80 are mounted on the substrate 11, the back surface 11b of the substrate 11 remains in a flat state without unevenness.

The light emitting module 10 having such a structure can be manufactured by using, for example, a soldering method called a reflow method.

Specifically, paste-like solder (also referred to as "cream solder") is applied to a plurality of mounting positions (positions where the light emitting element 20 and the circuit component 80 should be arranged) on the main surface 11a of the substrate 11, and each solder is applied. A plurality of light emitting elements 20 and a plurality of circuit components 80 are arranged so as to be in contact with the solder. After that, by going through a step of applying heat (heating step) or the like, each light emitting element 20 and each circuit component 80 are connected to the metal wiring provided on the main surface 11a. In this way, the plurality of light emitting elements 20 and the plurality of circuit components 80 are soldered to the substrate 11 by a reflow method.

The boundary between the first region 13a and the second region 13b, which is represented by the alternate long and short dash line in FIG. 2, does not need to be visibly displayed on the substrate 11, and the shape also follows the outer shape of the substrate 11. It does not have to be a shape. For example, in a plan view, the boundary between the first region 13a and the second region 13b may be defined by a virtual line circumscribing the power supply circuit 90 composed of a plurality of circuit components 80.

[Circuit cover]
As shown in FIG. 1, the circuit cover 150 is a member arranged so as to cover a plurality of circuit components 80 arranged on the substrate 11. That is, the circuit cover 150 is a member that covers the power supply circuit 90 arranged in the first region 13a of the substrate 11. In the present embodiment, the circuit cover 150 is made of a metal such as iron or aluminum and has nonflammability.

Further, the portion forming the outer surface of the circuit cover 150 functions as a reflecting surface that reflects the light emitted from the light emitting unit 25.

For example, a resin insulating sheet may be arranged on the inner surface of the circuit cover 150. As a result, the inner surface of the circuit cover 150 can be brought closer to the circuit component 80 inside the circuit cover 150, and as a result, the circuit cover 150 can be miniaturized. Further, the circuit cover 150 may be formed of, for example, a flame-retardant resin instead of metal. Thereby, for example, the circuit cover 150 can be made smaller or lighter.

In the present embodiment, the circuit cover 150 is attached to the instrument main body 106 together with the light source cover 160 and the light emitting module 10 by, for example, a plurality of screws (not shown).

[Light source cover]
As shown in FIG. 1, the light source cover 160 is a member that covers a plurality of light emitting elements 20 of the light emitting module 10, and is made of a translucent (for example, transparent) resin or the like. The light source cover 160 is formed in a donut shape, and is fixed to the main surface 11a of the light emitting module 10 in a state of surrounding the circuit cover 150 and covering a plurality of light emitting elements 20 arranged in an annular shape.

Further, the light source cover 160 has a plurality of lens portions 161. The plurality of lens units 161 are provided in a one-to-one correspondence with the plurality of light emitting elements 20. The lens unit 161 expands the light distribution angle of the light from the corresponding light emitting element 20, for example. That is, the lens unit 161 has a function of diverging light. By arranging the lens unit 161 corresponding to each light emitting element 20 in this way, for example, the diffusion of light from each of the plurality of light emitting elements 20 can be precisely controlled.

The light source cover 160 does not have to have the lens portion 161. The light source cover 160 may be formed, for example, in a shape and size that collectively covers all of the plurality of light emitting elements 20.

[Lighting cover]
The lighting cover 140 is a member that covers the side of the fixture body 106 to which the light emitting module 10 and the like are attached, and is made of a translucent resin. The illumination cover 140 is made of, for example, a milky white resin, and can diffuse the light from each light emitting element 20 and emit it to the outside. Further, the lighting cover 140 is detachably attached to, for example, the fixture main body 106.

[Structural relationship between the light emitting module and the fixture body]
Next, the structural relationship between the light emitting module 10 and the instrument main body 106 according to the present embodiment will be described with reference to FIGS. 3 and 4.

FIG. 3 is a perspective view showing a structural relationship between the substrate 11 and the instrument main body 106 according to the embodiment. In FIG. 3, in order to make the structural relationship easier to understand, the substrate 11 and the instrument main body 106 are separated from each other, and the substrate 11 and the substrate 11 are tilted so that the back surface 11b of the substrate 11 can be seen. The instrument body 106 is shown. Further, in FIG. 3, each of the inner region 132a and the outer region 132b is represented by a dotted region so that the inner region 132a and the outer region 132b on the mounting surface portion 132 can be easily recognized.

FIG. 4 is a cross-sectional view showing an outline of the configuration of the lighting fixture 100 according to the embodiment. Note that FIG. 4 shows a cross section of the luminaire 100 in the YZ plane passing through the IV-IV line shown in FIG.

In the light emitting module 10 according to the present embodiment, as described above, the light emitting element 20 and the circuit component 80 are surface-mounted only on the main surface 11a of the substrate 11. That is, circuit components, lead wires of circuit components, and the like are not arranged on the back surface 11b of the substrate 11, so that the back surface 11b forms a flat surface having substantially no unevenness.

As a result, as shown in FIGS. 3 and 4, the light emitting module 10 is fixed to the instrument main body 106 (for example, in a state where the entire area (or almost the entire area) of the back surface 11b of the substrate 11 is in surface contact with the mounting surface portion 132 (for example). Can be screwed).

Specifically, as shown in FIG. 3, the back surface 11b of the substrate 11 has a third region 13c, which is a region on the back side of the plurality of circuit components 80, and a fourth region, which is a region on the back side of the plurality of light emitting elements 20. Including 13d. In the present embodiment, the region on the main surface 11a of the substrate 11 on the back side of the first region 13a (see FIG. 2) in which the plurality of circuit components 80 (power supply circuits 90) are arranged corresponds to the third region 13c. .. Further, the back side of the second region 13b (see FIG. 2) in which the plurality of light emitting elements 20 are arranged on the main surface 11a of the substrate 11 corresponds to the fourth region 13d.

When the substrate 11 configured in this way is attached to the mounting surface portion 132 of the instrument main body 106, the third region 13c of the back surface 11b of the substrate 11 comes into contact with the inner region 132a of the mounting surface portion 132, and the back surface 11b of the substrate 11 The fourth region 13d of the above contacts the outer region 132b of the mounting surface portion 132.

As described above, the lighting fixture 100 according to the present embodiment includes the fixture main body 106 and the light emitting module 10 attached to the fixture main body 106. The light emitting modules 10 are arranged in a ring shape on the substrate 11, one or more circuit components 80 arranged on the main surface 11a of the substrate 11, and the one or more circuit components 80 on the main surface 11a of the substrate 11. It has a plurality of arranged light emitting elements 20. The appliance main body 106 has a region on the back side of the plurality of light emitting elements 20 (fourth region 13d) and a region on the back side of one or more circuit components 80 on the back surface 11b which is a surface opposite to the main surface 11a of the substrate 11. It has a mounting surface portion 132 that forms a surface in contact with (third region 13c).

According to this configuration, the region on the main surface 11a of the substrate 11 on the back side of the plurality of light emitting elements 20 and the circuit components 80 of one or more (plural in the present embodiment) is supported by the mounting surface portion 132 of the instrument main body 106. To. In the present embodiment, the substrate 11 (light emitting module 10) is attached to the mounting surface portion 132 in a state where the flat back surface portion 11b of the substrate 11 is in contact with the flat mounting surface portion 132 similar to the back surface portion 11b. That is, for example, a storage space for accommodating a circuit component or the like existing on the back surface of the substrate is not required for the fixture main body 106, whereby the lighting fixture 100 is made thinner (in the present embodiment, the width in the Z-axis direction). Can be shortened).

Further, according to the above configuration, for example, in FIG. 4, the distance from the bottom surface of the fixture body 106 (the most negative side surface in the Z-axis direction) to the mounting surface portion 132 can be shortened, whereby the light emitting module 10 can be shortened. Can be kept away from the lighting cover 140. Thereby, for example, the amount of light reaching the peripheral edge of the illumination cover 140 from the light emitting module 10 can be increased. That is, when the illumination cover 140 is viewed in a plane, the peripheral portion of the illumination cover 140 can be illuminated brightly. As a result, for example, the light emitted from the luminaire 100 can illuminate a wider area.

Further, as described above, since the mounting surface portion 132 of the instrument main body 106 does not require an expropriation space for accommodating circuit parts and the like existing on the back surface of the substrate, the flat mounting surface portion 132 having a relatively large area is required. Can be provided on the instrument body 106. Therefore, for example, the substrate 11 can be arranged in the same shape as the mounting surface portion 132 forming the circular region in the present embodiment without cutting the excess portion (unnecessary portion) of the substrate 11. Specifically, for example, cut the portion used for position regulation at the time of mounting the circuit component 80 or the like (for example, the discarded substrate forming the reference hole for positioning with respect to the component mounting machine) from the substrate 11. Instead, the substrate 11 (light emitting module 10) can be mounted on the mounting surface portion 132 as it is. That is, the step of cutting the unnecessary portion of the substrate 11 is unnecessary. This is advantageous from the viewpoint of improving the manufacturing efficiency of the luminaire 100 or suppressing the manufacturing cost, for example.

Here, when trying to reduce the thickness of the luminaire 100, for example, the heat generated by the light emitting module 10 is externally generated because the distance between various parts of the luminaire 100 is narrowed (high density of parts). It may be difficult to release it. In this regard, according to the luminaire 100 according to the present embodiment, as described below, the efficiency of the heat generated in the light emitting module 10 (heat generated in each of the light emitting unit 25 and the power supply circuit 90) is high. Good heat dissipation.

Specifically, in the present embodiment, the mounting surface portion 132 is in contact with the back side of the heat source element (plurality of light emitting elements 20 and the plurality of circuit components 80) arranged on the main surface 11a of the substrate 11. It is attached to the instrument body 106. Therefore, the heat generated by the light emitting module 10 can be efficiently released to the outside through the instrument main body 106. As a result, for example, deterioration of the plurality of light emitting elements 20 or the plurality of circuit components 80 is suppressed.

More specifically, in the present embodiment, as the base material of the substrate 11, a base material having an insulating property such as a resin base material is adopted, and no metal wiring is formed on the back surface 11b. Therefore, for example, the back surface 11b of the substrate 11 can be directly brought into contact with the metal instrument main body 106 without using an insulating member such as an insulating sheet. This contributes to the improvement of heat dissipation efficiency of the light emitting module 10.

Here, when the instrument body is provided with a storage space for accommodating circuit parts and the like on the back surface of the substrate, for example, in the instrument body, a step portion for forming the accommodation space at a position facing a part of the back surface of the substrate. Is provided. Since this stepped portion is a portion that does not come into contact with the substrate, it is disadvantageous from the viewpoint of heat dissipation efficiency. In this regard, in the present embodiment, the substrate 11 is fixed to the instrument body 106 in a state where the entire area of the back surface 11b of the substrate 11 and the mounting surface portion 132 of the instrument body 106 are substantially in contact with each other. Therefore, efficient heat dissipation using the instrument main body 106 is realized for the heat generated by the light emitting module 10.

Further, in the present embodiment, as described above, when the light emitting module 10 is manufactured, the plurality of light emitting elements 20 and the plurality of circuit components 80 are both heated in a state of being arranged on the main surface 11a of the substrate 11. As a result, it is soldered to the main surface 11a of the substrate 11. Simply put, the plurality of light emitting elements 20 and the plurality of circuit components 80 can be soldered to the substrate 11 in one heating step. Therefore, for example, an electronic component that is relatively heat-sensitive (for example, a reflow-dedicated component whose soldering by the flow method is not guaranteed) or the like can be adopted as the circuit component 80.

Further, in the present embodiment, one or more circuit components 80 included in the light emitting module 10 are electrically connected to the plurality of light emitting elements 20, and the one or more circuit components 80 are connected to the plurality of light emitting elements 20. A power supply circuit 90 that supplies electric power for light emission is configured.

Here, the power supply circuit 90 is generally a circuit component 80 that easily generates high heat, such as a filter element, a MOSFET (methal-axis-semiconductor field-effect transformer), a coil element, a resistance element, a regulator, or various control ICs. Is included. Therefore, it is also important to efficiently dissipate heat generated from these circuit components 80. In this regard, in the present embodiment, the region on the back side of the power supply circuit 90 on the substrate 11, that is, the third region 13c (see FIG. 3) contacts the inner region 132a included in the mounting surface portion 132 of the instrument main body 106. .. As a result, the heat generated by each circuit component 80 constituting the power supply circuit 90 is efficiently released to the outside via the instrument main body 106.

The configuration of the light emitting module 10 and the fixture main body 106 included in the lighting fixture 100 is not limited to the configuration described in the above embodiment. Therefore, a modified example of the light emitting module 10 and the instrument main body 106 will be described below, focusing on the difference from the above embodiment.

(Modification example 1)
FIG. 5 is a plan view showing an outline of the configuration of the light emitting module 10a according to the first modification of the embodiment. The slit 16 penetrating the substrate 11 is represented by dots in FIG. 5 so as to be easily distinguished from another element.

In the light emitting module 10a shown in FIG. 5, a plurality of slits 16 are provided on the substrate 11. Specifically, slits 16 are formed at positions on the substrate 11 between the plurality of light emitting elements 20 and one or more (plural) circuit components 80 (in this modification).

As a result, for example, the heat generated by the plurality of light emitting elements 20 is less likely to be transferred to the plurality of circuit components 80 via the substrate 11. That is, it is possible to reduce the influence of heat on the plurality of circuit components 80 from the plurality of light emitting elements 20 that are more likely to generate high heat as compared with the plurality of circuit components 80. As a result, for example, deterioration of each of the plurality of circuit components 80 due to heat is suppressed. Further, even in this case, since the fourth region 13d (see FIG. 3) on the back side of the plurality of light emitting elements 20 on the substrate 11 comes into contact with the mounting surface portion 132 of the fixture main body 106, it is generated by the plurality of light emitting elements 20. The generated heat is efficiently released to the outside via the instrument body 106.

More specifically, the instrument body 106 has a peripheral edge 131 around the mounting surface 132, for example, as shown in FIG. Therefore, the heat conducted from the fourth region 13d of the back surface 11b of the substrate 11 to the outer region 132b of the mounting surface portion 132 is further conducted to the peripheral edge portion 131. As a result, the heat generated by the plurality of light emitting elements 20 can be efficiently released to the outside.

A groove (a groove that does not penetrate the substrate 11 in the thickness direction (Z-axis direction)) is provided at a position on the substrate 11 between the plurality of light emitting elements 20 and one or more circuit components 80 instead of the slit 16. Even if it is provided, the above-mentioned various effects can be achieved.

Further, in the present modification, it can be said that the slits 16 are elongated in the arrangement direction of the plurality of light emitting elements 20 and are arranged along the arrangement direction. More specifically, the four slits 16 are arranged along the arrangement direction of the plurality of light emitting elements 20.

The shape, number, and arrangement position of the slits 16 included in the substrate 11 are not limited to the shape, number, and arrangement position shown in FIG. For example, in a plan view, curved slits 16 or grooves along an array of a plurality of light emitting elements 20 may be formed on the substrate 11.

(Modification 2)
FIG. 6 is a perspective view showing an outline of the configuration of the instrument main body 106a according to the second modification of the embodiment. In FIG. 6, the substrate 11 and the instrument main body 106a are shown in a state where the substrate 11 and the instrument main body 106a are separated from each other and the substrate 11 is tilted so that the back surface 11b of the substrate 11 can be seen. Further, in FIG. 6, each of the inner region 132a and the outer region 132b is represented by a dotted region so that the inner region 132a and the outer region 132b on the mounting surface portion 132 can be easily recognized.

FIG. 7 is a cross-sectional view of a groove 134 included in the instrument main body 106a according to the second modification of the embodiment. Specifically, FIG. 7 shows a VII-VII cross section in FIG.

The instrument body 106a shown in FIG. 6 has a groove 134 formed in the mounting surface 132. Specifically, the mounting surface portion 132 includes an outer region 132b corresponding to a plurality of light emitting elements 20 and an inner region 132a corresponding to one or more circuit components 80 in a plan view. The mounting surface portion 132 has a groove portion 134 formed in a bulging shape on the side opposite to the substrate 11 between the outer region 132b and the inner region 132a.

According to this configuration, for example, the rigidity of the mounting surface portion 132 formed flat due to surface contact with the back surface 11b of the substrate 11 is improved. As a result, the rigidity of the instrument body 106 formed to be relatively thin is improved. As a result, for example, the occurrence of bending of the fixture body 106 during manufacturing or transportation of the lighting fixture 100 is suppressed.

Further, according to the above configuration, between the inner region 132a that mainly receives heat from one or more (plural) circuit components 80 and the outer region 132b that mainly receives heat from the plurality of light emitting elements 20. , The heat conduction path is extended. Thereby, for example, the influence of heat on the plurality of circuit components 80 from the plurality of light emitting elements 20 can be reduced as in the above-mentioned modification 1. As a result, for example, deterioration of each of the plurality of circuit components 80 due to heat is suppressed. Further, even in this case, as described in the first modification, the heat dissipation effect due to the presence of the peripheral edge portion 131 around the mounting surface portion 132 is also achieved.

(Other embodiments)
Although the present invention has been described above based on the embodiments and modifications thereof, the present invention is not limited to the embodiments and modifications thereof.

For example, the back surface 11b of the substrate 11 and the mounting surface 132 of the instrument body 106 do not have to be flat. For example, when the mounting surface portion 132 of the instrument main body 106 is curved, the back surface 11b of the substrate 11 may also be curved along the mounting surface portion 132. That is, the mounting surface portion 132 may form a surface in contact with the fourth region 13d and the third region 13c on the back surface 11b of the substrate 11. As a result, for example, the thickness of the instrument main body 106 can be easily reduced as compared with the case where the mounting surface portion 132 is provided with a step for accommodating a circuit component or the like. In addition, the heat dissipation effect of the above-mentioned instrument main body 106 is also achieved.

Further, for example, as the substrate 11 of the light emitting module 10, in addition to the glass composite substrate and the resin substrate exemplified in the above embodiment, for example, a metal base substrate made of a metal material whose surface is coated with a resin may be adopted. .. In this case, for example, the heat of the plurality of light emitting elements 20 and the plurality of circuit components 80 surface-mounted on the main surface 11a of the substrate 11 is efficiently conducted to the instrument main body 106 via the substrate 11.

Further, the outer shape of the substrate 11 is not limited to the outer shape shown in FIG. 2, for example. For example, the light emitting module 10 may be provided with an annular substrate 11 having an opening in the center.

Further, the outer shape of the instrument main body 106 is not limited to the outer shape shown in FIG. 3 and the like. The instrument main body 106 may have a polygonal outer shape such as a rectangle in a plan view, or may have an outer shape composed of a straight line and a curved line.

Further, one or more circuit components 80 arranged on the substrate 11 may form an electric circuit (electronic circuit) of a type different from that of the power supply circuit 90. For example, a control circuit that controls dimming or color matching of a plurality of light emitting elements 20 according to a signal transmitted from the outside of the luminaire 100 may be composed of one or more circuit components 80. Further, the power supply circuit 90 may include the control circuit.

Further, the light emitting element 20 is an SMD type LED element, but the present invention is not limited to this. For example, the light emitting module 10 may have a COB (Chip On Board) structure in which an LED chip is directly mounted on a substrate 11. In this case, a plurality of LED chips mounted on the substrate 11 are collectively sealed or individually sealed by a sealing member containing a wavelength conversion material to obtain illumination light having a predetermined color temperature. be able to.

Further, in the above-described embodiment and modification, an LED element in which an LED chip is packaged as the light emitting element 20 is exemplified. However, a semiconductor light emitting device such as a semiconductor laser, or another type of solid light emitting device such as an organic EL (Electro Luminescence) or an EL element such as an inorganic EL may be adopted as the light emitting element 20.

In addition, a form obtained by applying various modifications to the above-described embodiment and its modification, and components and functions in each embodiment and its modification without departing from the spirit of the present invention. The present invention also includes a form realized by arbitrarily combining the above.

10, 10a Light emitting module 11 Board 11a Main surface 11b Back surface 13c Third region (the area behind one or more circuit components on the back surface of the substrate)
13d Fourth region (region on the back surface of the substrate, behind the plurality of light emitting elements)
16 Slit 20 Light emitting element 80 Circuit parts 90 Power supply circuit 100 Lighting equipment 106, 106a Equipment body 132 Mounting surface 132a Inner area 132b Outer area 134 Groove

Claims (3)

A lighting fixture including a fixture body and a light emitting module attached to the fixture body.
The light emitting module
With the board
One or more circuit components arranged on the main surface of the board and
It has a plurality of light emitting elements arranged in an annular shape so as to surround the one or more circuit components on the main surface of the substrate.
The fixture main body is attached so as to form a surface in contact with a region on the back side of the plurality of light emitting elements and a region on the back side of the one or more circuit components on the back surface, which is a surface opposite to the main surface of the substrate. It has a face,
The mounting surface portion
In plan view, the outer region corresponding to the plurality of light emitting elements and the inner region corresponding to the one or more circuit components are included.
A luminaire having a groove formed in a bulge shape on the side opposite to the substrate between the outer region and the inner region. The luminaire according to claim 1, wherein a slit or a groove is formed at a position on the substrate between the plurality of light emitting elements and the one or more circuit components. The one or more circuit components are electrically connected to the plurality of light emitting elements, and the one or more circuit components constitute a power supply circuit that supplies electric power for light emission to the plurality of light emitting elements. The lighting equipment according to claim 1 or 2.

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