JP6860562B2 - 電子デバイス製造において基板を搬送するためのロボットアセンブリ、基板処理装置、及び方法 - Google Patents
電子デバイス製造において基板を搬送するためのロボットアセンブリ、基板処理装置、及び方法 Download PDFInfo
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
本出願は、あらゆる目的のために参照により本書に援用される、2015年10月23日出願の「電子デバイス製造において基板を搬送するためのロボットアセンブリ、基板処理装置、及び方法(ROBOT ASSEMBLIES, SUBSTRATE PROCESSING APPARATUS, AND METHODS FOR TRANSPORTING SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING)」と題された米国特許通常出願第14/921,806号 (代理人整理番号23250/USA)に対する優先権を主張する。
Claims (14)
- トラックと、
前記トラックに沿って移動可能なキャリッジと、
前記キャリッジに装着されたロボットであって、第1のアーム、前記第1のアームに連結された第1の従動部材、第2のアーム、及び前記第2のアームに連結された第2の従動部材を少なくとも備えたロボットと、
駆動アセンブリであって、
第1の駆動部材、
前記第1の駆動部材と前記第1の従動部材に連結され、前記トラックの長さに沿って延びる第1の伝達部材、
前記第1の駆動部材に連結された第1の駆動モータであって、前記第1の駆動部材を動かして、前記第1の伝達部材を介して前記第1の従動部材の回転と前記第1のアームの回転を生じさせるように構成された第1の駆動モータ、
第2の駆動部材、及び
前記第2の駆動部材と前記第2の従動部材との間に連結され、前記トラックの長さに沿って延びる第2の伝達部材、を含む駆動アセンブリと、
を備える、ロボットアセンブリ。 - 第3の駆動部材、
前記第3の駆動部材に連結された第3の伝達部材であって、前記キャリッジに連結され、前記トラックの長さに沿って延びる第3の伝達部材、及び
前記第3の駆動部材に連結された第3の駆動モータであって、前記第3の伝達部材を介して前記第3の駆動部材の回転を生じさせると、前記トラックに沿って前記キャリッジを動かすように構成された第3の駆動モータ
を備える、請求項1に記載のロボットアセンブリ。 - 第3のアーム、及び前記第3のアームに連結されたエンドエフェクタを備え、前記エンドエフェクタは基板を担持するように構成される、請求項1に記載のロボットアセンブリ。
- 前記第1の伝達部材に連結された第1のアイドラ部材と、前記第2の伝達部材に連結された第2のアイドラ部材とを備える、請求項1に記載のロボットアセンブリ。
- 第3の駆動部材と、
前記第3の駆動部材に連結された第3の伝達部材であって、前記キャリッジに連結され、前記トラックの長さに沿って延びる第3の伝達部材と、
前記第3の伝達部材に連結された第3のアイドラ部材と、
を備える、請求項3に記載のロボットアセンブリ。 - 基部、前記基部の第1の端部に連結された駆動アセンブリ、及び、前記基部の第2の端部に連結された少なくとも2つのアイドラ部材を備える、
請求項1に記載のロボットアセンブリ。 - 第1のアイドラハウジングに回転可能に装着され、前記第1の伝達部材と接触している第1のアイドラ部材であって、前記第1のアイドラハウジングは第1の長手方向位置において基部に締結可能である、第1のアイドラ部材
を含む第1のアイドラアセンブリを備える、請求項1に記載のロボットアセンブリ。 - 第2のアイドラハウジングに回転可能に装着され、第2の伝達部材と接触している第2のアイドラ部材であって、前記第2のアイドラハウジングは前記第1の長手方向位置から間隔を空けた第2の長手方向位置において前記基部に締結可能である、第2のアイドラ部材
を含む第2のアイドラアセンブリを備える、請求項7に記載のロボットアセンブリ。 - 第3の駆動部材と、
前記第3の駆動部材に連結された第3の伝達部材であって、前記キャリッジに連結され、前記トラックの長さに沿って延びる第3の伝達部材と、
第3のアイドラアセンブリであって、
第3のアイドラハウジングに回転可能に装着され、前記第3の伝達部材と接触している第3のアイドラ部材であって、前記第3のアイドラハウジングは、前記第1の長手方向位置及び前記第2の長手方向位置の間で間隔をあけた長手方向位置において前記基部に締結可能である、第3のアイドラ部材
を含む第3のアイドラアセンブリと、
を備える、請求項8に記載のロボットアセンブリ。 - 長手方向位置調整能力を含むアイドラアセンブリを備える、請求項1に記載のロボットアセンブリ。
- 前記第1の伝達部材、前記第2の伝達部材、及び前記第3の伝達部材の張力を調整するように構成された、第1のアイドラアセンブリ、第2のアイドラアセンブリ、及び第3のアイドラアセンブリを備える、請求項2に記載のロボットアセンブリ。
- 1つ以上のアイドラプーリアセンブリであって、アイドラハウジングに回転可能に装着されたアイドラ部材をそれぞれが含み、前記アイドラハウジングは基部に締結可能であり且つ長手方向位置調整能力を含む、1つ以上のアイドラプーリアセンブリを備える、請求項1に記載のロボットアセンブリ。
- 移送チャンバ、
前記移送チャンバの長さに沿って配設された複数の処理チャンバ、及び、
前記処理チャンバとの間で基板を移動するように構成されたロボットアセンブリ、を備える基板処理装置であって、前記ロボットアセンブリが、
トラックと、
前記トラックに沿って移動可能なキャリッジと、
前記キャリッジに装着されたロボットであって、第1のアーム及び前記第1のアームに連結された第1の従動部材、第2のアーム、及び前記第2のアームに連結された第2の従動部材を少なくとも備えるロボットと、
駆動アセンブリと、を備え、前記駆動アセンブリが、
第1の駆動部材、
前記第1の駆動部材と前記第1の従動部材に連結され、前記トラックの長さに沿って延びる第1の伝達部材、
前記第1の駆動部材に連結された第1の駆動モータであって、前記第1の駆動部材を動かして、前記第1の伝達部材を介して前記第1の従動部材の回転と前記第1のアームの回転を生じさせるように構成された第1の駆動モータ、
第2の駆動部材、及び、
前記第2の駆動部材と前記第2の従動部材との間に連結され、前記トラックの長さに沿って延びる第2の伝達部材
を備える、基板処理装置。 - 基板処理装置の内部で基板を搬送する方法であって、
トラックに沿って移動可能なキャリッジと、前記キャリッジに装着され、第1のアーム、前記第1のアームに連結された第1の従動部材、第2のアーム、及び前記第2のアームに連結された第2の従動部材を少なくとも備えるロボットと、駆動アセンブリであって、第1の駆動部材、前記第1の駆動部材と前記第1の従動部材に連結され、前記トラックの長さに沿って延びる第1の伝達部材、前記第1の駆動部材に連結された第1の駆動モータ、第2の駆動部材、及び前記第2の駆動部材と前記第2の従動部材との間に連結され、前記トラックの長さに沿って延びる第2の伝達部材を備える駆動アセンブリと、を含むロボットアセンブリを提供すること、並びに、
前記基板の移動を生じさせるために、前記第1の駆動部材を回転させ、前記第1の伝達部材を介して前記第1の従動部材の回転と前記第1のアームの回転を生じさせるように前記第1の駆動モータを動作させること
を含む方法。
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Application Number | Priority Date | Filing Date | Title |
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US14/921,806 | 2015-10-23 | ||
US14/921,806 US9799544B2 (en) | 2015-10-23 | 2015-10-23 | Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing |
PCT/US2016/054093 WO2017069920A1 (en) | 2015-10-23 | 2016-09-28 | Robot assemblies, substrate processing apparatus, and methods for transporting substrates in electronic device manufacturing |
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JP2018535548A JP2018535548A (ja) | 2018-11-29 |
JP2018535548A5 JP2018535548A5 (ja) | 2020-08-27 |
JP6860562B2 true JP6860562B2 (ja) | 2021-04-14 |
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JP (1) | JP6860562B2 (ja) |
KR (1) | KR102182483B1 (ja) |
CN (1) | CN108028215B (ja) |
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US9724834B2 (en) | 2014-01-05 | 2017-08-08 | Applied Materials, Inc. | Robot apparatus, drive assemblies, and methods for transporting substrates in electronic device manufacturing |
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2016
- 2016-09-28 CN CN201680055698.4A patent/CN108028215B/zh active Active
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- 2016-09-28 WO PCT/US2016/054093 patent/WO2017069920A1/en active Application Filing
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US20170117171A1 (en) | 2017-04-27 |
JP2018535548A (ja) | 2018-11-29 |
CN108028215A (zh) | 2018-05-11 |
WO2017069920A1 (en) | 2017-04-27 |
CN108028215B (zh) | 2022-07-29 |
KR102182483B1 (ko) | 2020-11-24 |
US9799544B2 (en) | 2017-10-24 |
TW201725099A (zh) | 2017-07-16 |
TWI704038B (zh) | 2020-09-11 |
KR20180061393A (ko) | 2018-06-07 |
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