JP6853374B2 - Parts mounting machine - Google Patents

Description

This specification discloses a component mounting machine.

Conventionally, a component mounting machine having a mounting head having a plurality of suction nozzles and simultaneously sucking a plurality of parts with a plurality of suction nozzles has been known. For example, in Patent Document 1, for a plurality of suction nozzles possessed by a mounting head, a component holding range is set around the component holding center thereof, and a component holding range is set around the suction nozzles, and the plurality of suction nozzles simultaneously from a plurality of component extraction positions. A component mounting machine that aligns each component so that the component extraction position is within the range in which each component can be held is disclosed. This component mounting machine calculates the amount of misalignment between the center of gravity of the overlapping range of each virtual component holding range and the center of each component holding for a plurality of suction nozzles, and uses the calculated amount of misalignment as the head portion. It is the correction amount of the moving position. Further, the component mounting machine detects the amount of misalignment of the holding position of the component taken out in the past with respect to the component holding center, multiplies the detected amount of misalignment by a coefficient in the range of 0.1 to 1, and corrects the misalignment. Set the next component retention target center based on the correction value.

Japanese Unexamined Patent Publication No. 2004-356376

However, in the above-mentioned component mounting machine, since the simultaneous adsorption of a plurality of components is executed even while the correction of the amount of misalignment is not stable, sufficient accuracy cannot be obtained and an adsorption error may occur.

A main object of the present disclosure is to perform a simultaneous suction operation of simultaneously sucking a plurality of parts to a plurality of nozzles with high accuracy.

The present disclosure has taken the following steps to achieve the above-mentioned main objectives.

The present disclosure is a component mounting machine that sucks parts supplied from a plurality of parts feeders arranged in a parts supply unit and mounts them on a substrate, and includes a head having a plurality of nozzles capable of sucking the parts and a plurality of heads. As an elevating device capable of raising and lowering the nozzles individually, a moving device for moving the head relative to the substrate along a plane orthogonal to the elevating direction of the nozzles, and a suction operation for attracting parts to the nozzles. A first suction operation in which the moving device and the elevating device are controlled so that one nozzle descends above the component supply unit to attract the component to the one nozzle, and above the component supply unit. It is possible to perform a second suction operation in which the moving device and the lifting device are controlled so that the plurality of nozzles are simultaneously lowered, and a plurality of parts are simultaneously sucked to the plurality of nozzles, and the same type can be executed. When the suction operation and the mounting operation for the parts are repeatedly executed, the first suction operation is first executed by each of the plurality of nozzles, and the parts sucked by each of the plurality of nozzles in the first suction operation. The gist is to provide a control device that learns a correction value for correcting the deviation of the suction position of the above and executes the second suction operation using the learned correction value after the predetermined condition is satisfied. ..

The component mounting machine of the present disclosure includes a control device capable of performing a first suction operation and a second suction operation (simultaneous suction operation) as a suction operation for sucking parts to a nozzle. In the first suction operation, one nozzle is lowered above the component supply unit to suck the component to the one nozzle. In the second suction operation, a plurality of nozzles are simultaneously lowered above the component supply unit, and the plurality of components are simultaneously attracted to the plurality of nozzles. When the control device repeatedly executes the suction operation and the mounting operation for the same type of parts, the control device first executes the first suction operation on each of the plurality of nozzles and is sucked by each of the plurality of nozzles in the first suction operation. A correction value for correcting the deviation of the suction position of the component is learned, and after the predetermined condition is satisfied, the second suction operation is executed using the learned correction value. As described above, in the component mounting machine of the present disclosure, when the suction operation and the mounting operation for the same type of parts are repeated, the first suction operation is executed by each of the plurality of nozzles to correct the deviation of the suction position. After learning the correction value, the process shifts to the second adsorption operation. As a result, the component mounting machine of the present disclosure can accurately perform a simultaneous suction operation of simultaneously sucking a plurality of parts to a plurality of nozzles. Here, "orthogonal" does not have to be strictly orthogonal, but may be substantially orthogonal (hereinafter, the same applies).

It is a block diagram which shows the outline of the structure of the component mounting system 1. It is a block diagram which shows the outline of the structure of the mounting head 40. It is explanatory drawing explaining the arrangement of the nozzle holder 42 and the arrangement of the 1st Z-axis drive device 70 and the 2nd Z-axis drive device 75. It is explanatory drawing explaining the air piping path. It is a block diagram which shows the outline of the structure of the pressure supply device 80. It is explanatory drawing which shows the electrical connection relationship of the control device 90 and the management device 100. It is a flowchart which shows an example of the processing routine at the time of head mounting. It is a flowchart which shows an example of the implementation control routine. It is a flowchart which shows an example of a simple adsorption processing routine. It is a flowchart which shows an example of the simultaneous adsorption processing routine.

Next, a mode for carrying out the present invention will be described with reference to the drawings.

FIG. 1 is a configuration diagram showing an outline of the configuration of the component mounting system 1. FIG. 2 is a configuration diagram showing an outline of the configuration of the mounting head 40. FIG. 3 is an explanatory diagram illustrating the arrangement of the nozzle holders 42 and the arrangement of the first Z-axis drive device 70 and the second Z-axis drive device 75. FIG. 4 is an explanatory diagram illustrating an air piping path. FIG. 5 is a configuration diagram showing an outline of the configuration of the pressure supply device 80. FIG. 6 is an explanatory diagram showing an electrical connection relationship between the control device 90 and the management device 100. The left-right direction in FIG. 1 is the X-axis direction, the front (front) and rear (back) directions are the Y-axis directions that are substantially orthogonal to the X-axis direction, and the vertical directions are the X-axis direction and the Y-axis direction (horizontal plane). The Z-axis direction is approximately orthogonal to.

As shown in FIG. 1, the component mounting system 1 includes a component mounting machine 10 and a management device 100 that controls the entire system. In the embodiment, the component mounting system 1 includes a plurality of component mounting machines 10.

As shown in FIG. 1, the component mounting machine 10 includes a housing 12, a component supply unit 22, a board transfer device 24, an XY robot 30, a mounting head 40, a control device 90 (see FIG. 6), and the like. To be equipped. In addition to these, the component mounting machine 10 also includes a parts camera 26, a mark camera 28, a nozzle station 29, and the like. The parts camera 26 is provided between the parts supply unit 22 and the substrate transfer device 24, and is for capturing the posture of the parts P sucked by the suction nozzle 44 of the mounting head 40 from below. Further, the mark camera 28 is provided on the mounting head 40 and is for capturing and reading the positioning reference mark attached to the substrate S from above. The nozzle station 29 is provided between the component supply unit 22 and the substrate transfer device 24, and is for stocking the suction nozzle 44 to be mounted on the nozzle holder 42 of the mounting head 40.

As shown in FIG. 1, the component supply unit 22 is provided at the front portion of the component mounting machine 10, and a plurality of tape feeders 23 are arranged along the X-axis direction (left-right direction). The tape feeder 23 includes a reel accommodating the tape T in which the component P is lined up, and supplies the component P to the component supply position by pulling out the tape T from the reel and sending the tape T rearward (in the Y-axis direction). The tape T has a plurality of recesses formed at predetermined intervals in the longitudinal direction. The same type of component P is housed in each of the plurality of recesses. The component P housed in the recess is protected by a film covering the surface of the tape T, and the film is peeled off and exposed before the component supply position, and is adsorbed by the suction nozzle 44 at the component supply position.

The substrate transfer device 24 has a pair of conveyor belts that are provided at intervals in the front and rear of FIG. 1 and are bridged in the X-axis direction (left-right direction). The substrate S is conveyed from left to right in the drawing by the conveyor belt of the substrate transfer device 24.

The XY robot 30 moves the mounting head 40 in the XY-axis directions (front-back, left-right directions), and includes an X-axis slider 32 and a Y-axis slider 34 as shown in FIG. The X-axis slider 32 is supported by a pair of upper and lower X-axis guide rails 31 provided on the front surface of the Y-axis slider 34 so as to extend in the X-axis direction (left-right direction), and the X-axis motor 36 (see FIG. 6). It is possible to move in the X-axis direction by driving. The Y-axis slider 34 is supported by a pair of left and right Y-axis guide rails 33 provided on the upper portion of the housing 12 so as to extend in the Y-axis direction (front-rear direction), and is supported by a Y-axis motor 38 (see FIG. 6). It is possible to move in the Y-axis direction by driving. The position of the X-axis slider 32 in the X-axis direction is detected by the X-axis position sensor 37 (see FIG. 6), and the Y-axis slider 34 is positioned in the Y-axis direction by the Y-axis position sensor 39 (see FIG. 6). Is detected. A mounting head 40 is attached to the X-axis slider 32. Therefore, the mounting head 40 can be moved to an arbitrary position on the XY plane (horizontal plane) by driving and controlling the XY robot 30 (X-axis motor 36 and Y-axis motor 38).

As shown in FIG. 2, the mounting head 40 includes a head body 41, a plurality of (8 in the embodiment) nozzle holders 42, a plurality of (8 in the embodiment) suction nozzles 44, and an R-axis drive. It includes a device 50, a Q-axis drive device 60, a first Z-axis drive device 70, a second Z-axis drive device 75, and side cameras 47 and 48. The mounting head 40 is removable from the X-axis slider 32 and can be replaced as appropriate.

The head body 41 is a rotating body that can be rotated by the R-axis drive device 50. The nozzle holders 42 are arranged at predetermined angular intervals (in the embodiment, 45 degree intervals) in the circumferential direction with respect to the head main body 41, and are supported by the head main body 41 so as to be able to move up and down. A suction nozzle 44 is attached to the tip of the nozzle holder 42. The suction nozzle 44 is removable from the nozzle holder 42, and is replaced with a suction nozzle 44 suitable for suction depending on the type of component P to be sucked.

The R-axis drive device 50 rotates (revolves) a plurality of nozzle holders 42 (a plurality of suction nozzles 44) in the circumferential direction around the central axis of the head body 41. As shown in FIG. 2, the R-axis drive device 50 transmits the rotation of the R-axis motor 51, the R-axis 52 extending in the axial direction from the central axis of the head body 41, and the rotation of the R-axis motor 51 to the R-axis 52. A transmission gear 53 for transmission is provided. The R-axis drive device 50 rotates the head body 41 by rotationally driving the R-axis 52 by the R-axis motor 51 via the transmission gear 53. Each nozzle holder 42 rotates (revolves) in the circumferential direction together with the suction nozzle 44 by the rotation of the head body 41. In addition, the R-axis drive device 50 also includes an R-axis position sensor 55 (see FIG. 6) for detecting the rotation position of the R-axis 52, that is, the turning position of each nozzle holder 42 (suction nozzle 44). ..

The Q-axis drive device 60 rotates (rotates) each nozzle holder 42 (each suction nozzle 44) around its central axis. As shown in FIG. 2, the Q-axis drive device 60 includes a Q-axis motor 61, a cylindrical gear 62, a transmission gear 63, and a Q-axis gear 64. The cylindrical gear 62 has an R-axis 52 coaxially and relatively rotatable inside the cylindrical gear 62, and flat-toothed outer teeth 62a are formed on the outer peripheral surface thereof. The transmission gear 63 transmits the rotation of the Q-axis motor 61 to the cylindrical gear 62. The Q-axis gear 64 is provided on the upper portion of each nozzle holder 42, and is slidably meshed with the outer teeth 62a of the cylindrical gear 62 in the Z-axis direction (vertical direction). The Q-axis drive device 60 rotationally drives the cylindrical gear 62 via the transmission gear 63 by the Q-axis motor 61, thereby rotating each Q-axis gear 64 that meshes with the outer teeth 62a of the cylindrical gear 62 in the same direction. be able to. Each nozzle holder 42 is integrated with the suction nozzle 44 and rotates (rotates) around its central axis by the rotation of the Q-axis gear 64. In addition, the Q-axis drive device 60 also has a Q-axis position sensor 65 (see FIG. 6) for detecting the rotation position of the Q-axis gear 64, that is, the rotation position of each nozzle holder 42 (suction nozzle 44). Be prepared.

The first and second Z-axis drive devices 70 and 75 are configured so that the nozzle holder 42 can be individually raised and lowered at two locations on the turning (revolving) orbit of the nozzle holder 42. In the embodiment, as shown in FIG. 3, the first Z-axis drive device 70 can raise and lower the nozzle holder 42 at the 0 degree position (hereinafter, also referred to as Z1) of the nozzle holder 42 supported by the head body 41. Is. Further, the second Z-axis drive device 75 can raise and lower the nozzle holder 42 at a position of 180 degrees (hereinafter, also referred to as Z2) among the nozzle holders 42 supported by the head body 41. The 0 degree position is the position on the upstream side of the substrate transport direction among the two points on the line passing through the central axis of the head body 41 and parallel to the X-axis direction (board transport direction) (A in FIG. 3). ), The position of 180 degrees is the position on the downstream side in the substrate transport direction of the above two points (E in FIG. 3).

As shown in FIG. 2, the first and second Z-axis drive devices 70 and 75 both include a Z-axis slider 72, 77 and a Z-axis motor 71, 76 that raises and lowers the corresponding Z-axis slider 72, 77. To be equipped. The first and second Z-axis drive devices 70 and 75 drive the Z-axis motors 71 and 76, respectively, to raise and lower the corresponding Z-axis sliders 72 and 77, thereby moving the nozzle holders below the Z-axis sliders 72 and 77. In contact with 42, the nozzle holder 42 is moved up and down integrally with the suction nozzle 44. The first and second Z-axis drive devices 70 and 75 may use a linear motor as the Z-axis motors 71 and 76 to move the Z-axis sliders 72 and 77 up and down, or the rotary motor and the feed screw mechanism. It may be used to raise and lower the Z-axis sliders 72 and 77. Further, the first and second Z-axis drive devices 70 and 75 may move the Z-axis sliders 72 and 77 up and down by using an actuator such as an air cylinder instead of the Z-axis motors 71 and 76. As described above, the mounting head 40 of the embodiment includes two Z-axis drive devices 70 and 75 capable of individually raising and lowering the nozzle holder 42 (suction nozzle 44), and suction is performed by using the Z-axis drive devices 70 and 75. The suction operation of the component P by the nozzle 44 can be performed individually. Therefore, the mounting head 40 is a tape feeder corresponding to the two components P so as to be arranged in the X-axis direction (left-right direction) at the same interval as the two suction nozzles 44 that can be raised and lowered by the two Z-axis drive devices 70 and 75. By supplying from 23, the two suction nozzles 44 can be lowered at the same time to suck the two parts P at the same time. In addition, the first and second Z-axis drive devices 70 and 75 are for detecting the elevating position of the corresponding Z-axis sliders 72 and 77, that is, the elevating position of the corresponding nozzle holder 42 (suction nozzle 44). Z-axis position sensors 73 and 78 (see FIG. 6) are also provided.

The suction nozzle 44 can suck the component P or mount the sucked component P on the substrate S by the pressure (negative pressure, positive pressure) supplied by the pressure supply device 80. As shown in FIG. 5, the pressure supply device 80 sets the pressure supplied to the negative pressure source (negative pressure pump) 81, the positive pressure source (factory air) 82, and the suction port of each suction nozzle 44 as negative pressure. It is provided with a switching valve 86 that can switch between pressure and atmospheric pressure. The switching valve 86 communicates with the negative pressure flow path 83 communicating with the negative pressure source 81, the positive pressure flow path 84 communicating with the positive pressure source 82, the atmospheric pressure flow path 85 communicating with the atmosphere, and the suction port of the suction nozzle 44. This is a 4-port 3-position valve connected to a holder flow path 42a formed inside the nozzle holder 42. The switching valve 86 applies negative pressure to the suction port of the suction nozzle 44 by switching the valve position to a position where the holder flow path 42a communicates with the negative pressure flow path 83 and shuts off from other flow paths (negative pressure supply position). Can be supplied. Further, the switching valve 86 is set at the suction port of the suction nozzle 44 by switching the valve position to a position where the holder flow path 42a communicates with the atmospheric pressure flow path 85 and shuts off from other flow paths (atmospheric pressure supply position). Atmospheric pressure can be supplied. Further, the switching valve 86 is positive to the suction port of the suction nozzle 44 by switching the valve position to a position where the holder flow path 42a communicates with the positive pressure flow path 84 and shuts off from other flow paths (positive pressure supply position). Pressure can be supplied. As shown in FIG. 4, the switching valve 86 is provided corresponding to each nozzle holder 42 (holder flow path 42a), and is a negative pressure flow path via a radial flow path 41a extending radially from the axial center of the head body 41. It is connected to the positive pressure flow path 84 via a radial flow path (not shown) that is connected to the 83 and similarly extends. Further, the negative pressure flow path 83 is provided with a pressure sensor 88 for detecting the pressure (negative pressure) inside the negative pressure flow path 83.

Further, the switching valve 86 does not have an automatic return function, and the valve position can be switched between the negative pressure supply position, the atmospheric pressure supply position, and the positive pressure supply position by operating the valve operation lever 87. .. As shown in FIG. 2, the valve operating lever 87 is operated by any of the first and second valve driving devices 45 and 46. The first valve driving device 45 can drive the valve operating lever 87 of the switching valve 86 corresponding to the nozzle holder 42 at the position (Z1) that can be raised and lowered by the first Z-axis driving device 70. The second valve driving device 46 can drive the valve operating lever 87 of the switching valve 86 corresponding to the nozzle holder 42 at the position (Z2) that can be raised and lowered by the second Z-axis driving device 75. The first and second valve drive devices 45 and 46 can be configured by using, for example, a motor and a conversion mechanism (cam mechanism, link mechanism, etc.) that converts the rotational motion of the motor into a stroke motion.

The side cameras 47 and 48 take an image of the vicinity of the tip of the suction nozzle 44 from the side in order to determine the presence / absence of component suction and the component suction posture of the suction nozzle 44 after the suction operation is executed by the suction nozzle 44. is there. In the embodiment, when the side camera 47 lowers the suction nozzle 44 by the first Z-axis drive device 70 to execute the suction operation, and then the suction nozzle 44 is swiveled one step ahead by the R-axis drive device 50. The suction nozzle 44 can be imaged. Further, the side camera 48 lowers the suction nozzle 44 by the second Z-axis drive device 75 to execute the suction operation, and then turns the suction nozzle 44 one step ahead by the R-axis drive device 50. The nozzle 44 can be imaged.

As shown in FIG. 6, the control device 90 is configured as a microprocessor centered on a CPU 91, and includes a ROM 92, an HDD 93, a RAM 94, an input / output interface 95, and the like in addition to the CPU 91. These are connected via bus 96. Various detection signals from the X-axis position sensor 37, the Y-axis position sensor 39, the R-axis position sensor 55, the Q-axis position sensor 65, the Z-axis position sensors 73, 78, the pressure sensor 88, and the like are input to the control device 90. ing. Further, image signals from the parts camera 26, the mark camera 28, the side cameras 47 and 48, and the like are also input to the control device 90 via the input / output interface 95. On the other hand, from the control device 90, the tape feeder 23, the substrate transfer device 24, the X-axis motor 36, the Y-axis motor 38, the R-axis motor 51, the Q-axis motor 61, the Z-axis motors 71, 76, the first and second valves Various control signals are output to the drive devices 45 and 46, the parts camera 26, the mark camera 28, the side cameras 47 and 48, and the like.

The management device 100 is, for example, a general-purpose computer, and is composed of a CPU 101, a ROM 102, an HDD 103, a RAM 104, an input / output interface 105, and the like, as shown in FIG. An input signal from the input device 107 is input to the management device 100 via the input / output interface 105. A display signal to the display 108 is output from the management device 100 via the input / output interface 105. The HDD 103 stores job information including the production program of the substrate S and other production information. Here, the production program refers to a program that defines which component P is mounted on which substrate S in what order in the component mounting machine 10, and how many substrates S so mounted are manufactured. Further, the production information includes component information (type of component P and its component supply position) regarding component P to be mounted on the substrate S, nozzle information regarding the suction nozzle 44 to be used, target mounting position of component P (XY coordinates), and the like. Is included. The management device 100 is communicably connected to the control device 90 of the component mounting machine 10 and exchanges various information and control signals.

When the component mounting machine 10 of the embodiment configured in this way receives the job information by the management device 100, the suction operation, the imaging operation, and the mounting operation are executed as one cycle. The suction operation corresponds by moving the mounting head 40 above the component supply position and turning each nozzle holder 42 (suction nozzle 44) so that the component P comes into contact with the suction port of the suction nozzle 44 at the component supply position. This is an operation of lowering the nozzle holder 42 and supplying a negative pressure to the suction port of the corresponding suction nozzle 44. The imaging operation is an operation in which the component P adsorbed on the adsorption nozzle 44 by the adsorption operation is imaged by the component camera 26, and the adsorption deviation is detected by processing the obtained captured image to correct the target mounting position of the component P. Is. In the imaging operation, in the embodiment, the head mark M attached to the mounting head 40 is imaged by the parts camera 26 together with the component P adsorbed on the suction nozzle 44, so that the component P with reference to the head mark M is used. It is performed by recognizing the suction position. In the mounting operation, the mounting head 40 is moved above the target mounting position on the substrate S, and each nozzle holder 42 (suction nozzle 44) is swiveled so that the component P sucked by the suction nozzle 44 abuts on the target mounting position. At the same time, the corresponding nozzle holder 42 is lowered to supply positive pressure to the suction port of the corresponding suction nozzle 44.

Next, the operation of the component mounting machine 10 when the mounting head 40 is replaced will be described. FIG. 7 is a flowchart showing an example of a head mounting processing routine executed by the CPU 91 of the control device 90. This routine is executed when the new mounting head 40 is mounted on the X-axis slider 32. When the head mounting processing routine is executed, the CPU 91 of the control device 90 first executes calibration of static operation (S100). Here, the calibration of the static operation is performed by the positions of the parts camera 26, the mark camera 28 and the head mark M, the position when each nozzle holder 42 is raised with respect to the head mark M, and the tilt position when each nozzle holder 42 is lowered. This is a process for adjusting the positions of the suction nozzles 44 by measuring the presence or absence of bending and the positions of the suction nozzles 44. The position of the parts camera 26 can be measured by using the mark camera 28, and the other positions and the like can be measured by using the parts camera 26.

Subsequently, the CPU 91 executes the calibration of the dynamic operation (S110). In the calibration of the dynamic operation, the operation of each nozzle holder 42 assuming the single suction operation described later and the operation of each nozzle holder 42 assuming the simultaneous suction operation described later are measured, and these operations are adjusted. It is the processing of. In the measurement of the operation assuming a single suction operation, the mounting head 40 is moved above the parts camera 26 by the XY robot 30, and the first and second Z-axis drives are driven while the R-axis drive device 50 rotates each nozzle holder 42. This is performed by lowering the corresponding nozzle holder 42 by any of the devices 70 and 75 and imaging the stop position of the nozzle holder 42 with the parts camera 26. Further, in the measurement of the operation assuming the simultaneous suction operation, the mounting head 40 is moved above the parts camera 26 by the XY robot 30, and each nozzle holder 42 is swiveled by the R-axis drive device 50, and the first and second Zs are measured. This is performed by simultaneously lowering the corresponding two nozzle holders 42 by both the shaft drive devices 70 and 75 and measuring the stop positions of the two nozzle holders 42 with the parts camera 26. The measurement of these operations is performed for each nozzle holder 42.

Then, the CPU 91 sets a value 0 in the simultaneous suction permission flag F indicating whether or not the simultaneous suction operation is possible (S120), and ends the processing routine at the time of head mounting. Here, the simultaneous adsorption permission flag F is a flag indicating whether or not the simultaneous adsorption operation can be executed. The simultaneous adsorption flag F indicates that the simultaneous adsorption operation is prohibited when the value is 0, and indicates that the simultaneous adsorption operation is permitted when the value is 1. In the embodiment, when the mounting head 40 is replaced, the CPU 91 determines that the lowering position accuracy of the suction nozzle 44 may not be sufficient, sets the simultaneous suction flag F to a value of 0, and temporarily performs the simultaneous suction operation. Ban.

Next, the operation of the component mounting machine 10 in the case where the component P is sucked and mounted on the substrate S by using the single suction operation or the simultaneous suction operation will be described. FIG. 8 is a flowchart showing an example of a mounting control routine executed by the CPU 91 of the control device 90. This routine is executed when job information is received from the management device 100. In the embodiment, the mounting control routine is applied when the operation of sucking the same type of component P and mounting it on the substrate S is repeatedly executed. When the mounting control routine is executed, the CPU 91 of the control device 90 first determines whether or not the simultaneous adsorption permission flag F has a value of 0 (S200). When the CPU 91 determines that the simultaneous suction permission flag has a value of 0, it determines that the simultaneous suction operation is prohibited, and executes a single suction operation of sucking the component P to one suction target nozzle (S210). The single adsorption operation is performed by executing the single adsorption processing routine illustrated in FIG. The single adsorption processing routine will be described later. On the other hand, when the CPU 91 determines that the simultaneous suction permission flag has a value of 1, it determines that the simultaneous suction operation is permitted, and executes the simultaneous suction operation of simultaneously sucking the component P to each of the two suction target nozzles ( S220). The simultaneous adsorption operation is performed by executing the simultaneous adsorption processing routine illustrated in FIG. The simultaneous adsorption processing routine will be described later. When the CPU 91 executes a single suction operation or a simultaneous suction operation, it is determined whether or not a planned number of parts P have been sucked to the plurality of suction nozzles 44 of the mounting head 40 (S230). When the CPU 91 determines that a predetermined number of parts P are not sucked on the plurality of suction nozzles 44, the next suction target nozzle can be moved up and down by Z1 or Z2 (the first Z-axis drive device 70 or the second Z-axis drive device 75). While controlling the R-axis drive device 50 (R-axis motor 51) so as to come to the position) (S240), the process returns to S200 and the processes of S200 to S240 (single suction operation or simultaneous suction operation) are repeated.

When the CPU 91 determines in S230 that a predetermined number of parts P have been sucked on the plurality of suction nozzles 44, the CPU 91 controls the XY robot 30 so that the mounting head 40 comes above the parts camera 26 (S260). Subsequently, the CPU 91 takes an image of the component P sucked by the plurality of suction nozzles 44 by the parts camera 26 (S270). Then, the CPU 91 detects the component P from the obtained captured image, and determines whether or not a suction error has occurred in which the component P to be sucked is not sucked to any of the plurality of suction nozzles 44 ( S270). When the CPU 91 determines that a suction error has occurred in any of the plurality of suction nozzles 44, the CPU 91 sets a value 0 in the simultaneous suction permission flag F (S370). Then, the CPU 91 controls the R-axis drive device 50 so that the nozzle holder 42 for mounting the suction nozzle 44 in which the suction error has occurred comes to Z1 or Z2 (S380), returns to S200, and the suction error occurs. The component P is sucked again by the suction nozzle 44. On the other hand, when the CPU 91 determines that no suction error has occurred in any of the suction nozzles 44, the CPU 91 recognizes the component P and the head mark M from the captured image and the suction deviation of the component P sucked by each suction nozzle 44. The quantity (ΔXd, ΔYd) is measured (S280). The suction deviation amount (ΔXd, ΔYd) is the deviation amount in the XY axis direction between the center of the suction nozzle 44 and the center of the component P, and is measured for each suction nozzle 44.

Next, the CPU 91 determines whether or not the simultaneous adsorption permission flag F has a value of 0 (S290). When the CPU 91 determines that the simultaneous adsorption permission flag F is not a value 0 but a value 1, the process proceeds to S350. On the other hand, when the CPU 91 determines that the simultaneous suction permission flag F has a value of 0, the CPU 91 next time in Z1 based on the suction deviation amount (ΔXd, ΔYd) of the component P sucked by the suction nozzle 44 lowered by Z1. The head position correction values (ΔXhz1, ΔYhz1) of the mounting head 40 when the suction nozzle 44 is lowered to suck the component P are learned (S300). The learning of the head position correction value (ΔXhz1, ΔYhz1) is performed by multiplying the adsorption deviation amount (ΔXd, ΔYd) by the coefficient k and subtracting it from the current head position correction value (ΔXhz1, ΔYhz1). The coefficient k is a reflection rate when the suction deviation amount is reflected in the head position correction value, and is set to a value larger than the value 0 and smaller than the value 1. The coefficient k may be a fixed value, for example, first set to a large value (for example, 0.5) and then set to a small value (for example, 0.3 or 0.2). , It may be made smaller as the learning progresses. Further, the CPU 91 lowers the suction nozzle 44 in Z2 to suck the component P next time based on the suction deviation amount (ΔXd, ΔYd) of the component P sucked in the suction nozzle 44 lowered in Z2. The head position correction values (ΔXhz2, ΔYhz2) of the mounting head 40 are learned (S310). The learning of the head position correction value (ΔXhz2, ΔYhz2) is performed by multiplying the adsorption deviation amount (ΔXd, ΔYd) by the above coefficient k and subtracting it from the current head position correction value (ΔXhz2, ΔYhz2). Then, the CPU 91 calculates the average value and 3σ of the adsorption deviation amounts (ΔXd, ΔYd) in the XY axis direction (S320), and determines whether or not the calculated value is within a predetermined range (S330). The predetermined range is for determining whether or not the suction position accuracy of the component P by the suction nozzle 44 is stable by learning the head movement correction value, and can be appropriately determined. In the embodiment, the CPU 91 evaluates the suction position accuracy using 3σ, which indicates the variation in the suction deviation amount (ΔXd, ΔYd), but σ or 2σ may be used. When the CPU 91 determines that the calculated value is within the predetermined range, the simultaneous adsorption permission flag F is set to the value 1 (S340), the process proceeds to S350, and when it is determined that the calculated value is not within the predetermined range, S340 is skipped. Then proceed to S350. As described above, in the embodiment, the CPU 91 first sucks the component P by the single suction operation, and when the learning of the head movement correction value progresses and the suction position accuracy becomes stable, the CPU 91 shifts to the simultaneous suction operation. As a result, it is possible to suppress the frequent occurrence of suction errors due to the execution of the simultaneous suction operation.

Then, the CPU 91 corrects the target mounting position of the component P to be mounted based on the suction deviation amount (ΔXd, ΔYd) measured in S280 (S350), and mounts the component P at the corrected target mounting position. Execute (S360) to end the implementation control routine.

Next, the single adsorption processing routine of FIG. 9 will be described. In the single adsorption processing routine, the CPU 91 first determines whether or not to execute the single adsorption operation this time in Z1 (S400). In the embodiment, the execution order is determined so that the single adsorption operation of Z1 and the single adsorption operation of Z2 are alternately executed. When the CPU 91 determines that the single suction operation of this time is executed in Z1, the suction target component to be suctioned by the suction nozzle 44 lowered by Z1 is fed by the target feed amount Fz1 and supplied to the component supply position. A control signal is output to the tape feeder 23 (S410). Subsequently, the CPU 91 determines whether or not the head movement correction values (ΔXhz1, ΔYhz1) set in S300 of the mounting control routine described above exist (S420). When the mounting head 40 is replaced and the single suction operation is executed for the first time, the head movement correction values (ΔXhz1, ΔYhz1) have not yet been set. When the CPU 91 determines that the head movement correction values (ΔXhz1, ΔYhz1) do not exist, the process proceeds to S440. On the other hand, when the CPU 91 determines that the head movement correction value (ΔXhz1, ΔYhz1) exists, the CPU 91 adds the head movement correction value (ΔXhz1, ΔYhz1) to the current target head position (Xh, Yh) to obtain the target head position (Xh, ΔYhz1). Yh) is corrected (S430), and the process proceeds to S440. The target head position is corrected by adding a part of the head movement correction value (the head movement correction value multiplied by a coefficient larger than the value 0 and smaller than the value 1) to the current target head position. May be. Next, the CPU 91 controls the XY robot 30 so that the mounting head 40 comes to the target head position (Xh, Yh) (S440). Then, the CPU 91 controls the first Z-axis drive device 70 (Z1 holder lowers) so that the suction target nozzle descends, and controls the first valve drive device 45 so that a negative pressure is supplied to the suction port of the suction target nozzle. (Z1 valve is opened) (S450), and the single adsorption processing routine is completed.

When the CPU 91 determines in S400 that the single suction operation is executed by Z2 instead of Z1, the suction target parts to be sucked by the suction nozzle 44 lowered by Z2 are fed by the target feed amount Fz2 and the component supply position. A control signal is output to the corresponding tape feeder 23 so as to be supplied to the tape feeder 23 (S460). Subsequently, the CPU 91 determines whether or not the head movement correction values (ΔXhz2, ΔYhz2) set in S310 of the mounting control routine described above exist (S470). When the mounting head 40 is replaced and the single suction operation is executed for the first time, the head movement correction values (ΔXhz2, ΔYhz2) have not yet been set. When the CPU 91 determines that the head movement correction values (ΔXhz2, ΔYhz2) do not exist, the process proceeds to S490. On the other hand, when the CPU 91 determines that the head movement correction value (ΔXhz2, ΔYhz2) exists, the CPU 91 adds the head movement correction value (ΔXhz2, ΔYhz2) to the current target head position (Xh, Yh) to obtain the target head position (Xh, ΔYhz2). Yh) is corrected (S430), and the process proceeds to S490. The target head position is corrected by adding a part of the head movement correction value (the head movement correction value multiplied by a coefficient larger than the value 0 and smaller than the value 1) to the current target head position. May be. Next, the CPU 91 controls the XY robot 30 so that the mounting head 40 comes to the target head position (Xh, Yh) (S490). Then, the CPU 91 controls the second Z-axis drive device 75 (Z2 holder lowering) so that the suction target nozzle descends, and controls the second valve drive device 46 so that a negative pressure is supplied to the suction port of the suction target nozzle. (Z2 valve is opened) (S500), and the single adsorption processing routine is completed.

Next, the simultaneous adsorption processing routine will be described. In the simultaneous suction processing routine, the CPU 91 first corrects the target feed amounts Fz1 and Fz2 of the two suction target parts to be sucked by the two suction target nozzles that are simultaneously lowered by Z1 and Z2 (S550). The correction of the target feed amount Fz1 is performed by adding the head movement correction value ΔYhz1 in the Y-axis direction set in S300 of the mounting control routine to the current target feed amount Fz1. Further, the correction of the target feed amount Fz2 is performed by adding the head movement correction value ΔYhz2 in the Y-axis direction set in S310 of the mounting control routine to the current target feed amount Fz2. The target feed amount is corrected by multiplying the current target feed amount by a part of the head movement correction value in the Y-axis direction (the head movement correction value is multiplied by a coefficient larger than the value 0 and smaller than the value 1). It may be done by adding. Subsequently, the CPU 91 outputs a control signal to the corresponding tape feeder 23 so that the respective suction target parts are supplied with the corrected target feed amounts Fz1 and Fz2 (S560). Next, the CPU 91 corrects the target head position Xh in the X-axis direction (S570). The correction of the target head position Xh in the X-axis direction is performed on the current target head position Xh in the X-axis direction in the X-axis direction set by the head movement correction values ΔXhz1 in the X-axis direction set in S300 of the mounting control routine and S310. It is performed by adding the sum of the head movement correction value ΔXhz2 divided by the value 2. The correction of the target head position in the X-axis direction is a part of the calculated value obtained by dividing the sum of the head movement correction values ΔXhz1 and ΔZhz2 in the X-axis direction by the value 2 to the current target head position in the X-axis direction (the calculation). It may be done by adding a value (multiplied by a coefficient greater than value 0 and less than value 1). The target head position Yh in the Y-axis direction is not corrected. Subsequently, the CPU 91 controls the XY robot 30 so that the mounting head 40 comes to the target head position (Xh, Yh) (S580). Then, the CPU 91 controls the first Z-axis drive device 70 and the second Z-axis drive device 75 so that the suction target nozzle in Z1 and the suction target nozzle in Z2 are lowered at the same time, and the suction ports of the two suction target nozzles. The first valve drive device 45 and the second valve drive device 46 are controlled (S590) so that a negative pressure is supplied to the vehicle, and the simultaneous suction processing routine is terminated.

Here, when the two suction target nozzles are simultaneously lowered by Z1 and Z2 to suck the two suction target parts at the same time, the pitch between the two suction target nozzles (pitch in the X-axis direction) is fixed. Due to the influence of the tolerance of each part, the two suction target nozzles cannot aim at the center of the two suction target parts and suck at the same time. Therefore, in the component mounting machine 10, the smaller the size of the component P to be adsorbed, for example, a chip component having a size of 0.4 mm × 0.2 mm, the more difficult it is to execute the simultaneous suction operation. On the other hand, in the component mounting machine 10 of the embodiment, the head movement correction values (ΔXhz1, ΔYhz1) and (ΔXhz2, ΔYhz2) of the mounting head 40 are learned while performing a single suction operation at first, and the suction target nozzle is sucked. When the position accuracy becomes stable, the simultaneous suction operation is started. By executing the simultaneous suction operation using the learned head movement correction value, the component mounting machine 10 of the embodiment can sufficiently secure the suction position accuracy even in the simultaneous suction operation, and the small-sized component P can be used. It is possible to suppress the occurrence of adsorption errors during adsorption. Further, the component mounting machine 10 of the embodiment corrects the target head position Xh in the X-axis direction of the mounting head 40 by using the head movement correction values ΔXhz1 and ΔXhz2 in the X-axis direction in the simultaneous suction operation, and is in the Y-axis direction. The head movement correction values ΔYhz1 and ΔYhz2 are used to correct the target feed amounts Fz1 and Fz2 of the two tape feeders 23 that supply the two suction target parts. As a result, the component mounting machine 10 can individually correct the suction deviation in the Y-axis direction for Z1 and Z2 in the simultaneous suction operation, so that the suction position accuracy in the Y-axis direction can be further improved. Since the smaller the size of the component P, the more difficult the simultaneous suction operation becomes. Therefore, when the size of the component P to be sucked is larger than the predetermined size, the component mounting machine 10 may execute the simultaneous suction operation from the beginning. Of course, it's good.

Here, the correspondence between the components of the embodiment and the components of the present disclosure described in the claims will be clarified. The component supply unit 22 of the embodiment corresponds to the component supply unit of the present disclosure, the tape feeder 23 corresponds to the parts feeder, the component mounting machine 10 corresponds to the component mounting machine, and the suction nozzle 44 corresponds to the nozzle for mounting. The head 40 corresponds to the head, the first and second Z-axis drive devices 70 and 75 correspond to the elevating device, the XY robot 30 corresponds to the moving device, and the control device 90 corresponds to the control device. Further, the mounting head 40 corresponds to the rotary head, the nozzle holder 42 corresponds to the nozzle holder, the first Z-axis drive device 70 corresponds to the first elevating device, and the second Z-axis drive device 75 corresponds to the second elevating device. To do.

The component mounting machine 10 of the embodiment described above has a first suction operation (as a suction operation) in which one nozzle is lowered and a negative pressure is supplied to the suction port of the one nozzle to suck the parts to one nozzle. Single suction operation) and second suction operation (simultaneous suction operation) in which a plurality of nozzles are simultaneously lowered and negative pressure is supplied to the suction ports of the plurality of nozzles to simultaneously suck parts to the plurality of nozzles. A control device 90 capable of executing the above is provided. When the control device 90 repeatedly executes the suction operation and the mounting operation for the same type of parts, the control device 90 first executes the first suction operation on each of the plurality of suction nozzles 44, and at the same time, the plurality of suction nozzles 44 in the first suction operation. The correction value for correcting the deviation of the suction position of the component P sucked by each of the above is learned, and after the predetermined condition is satisfied, the second suction operation is executed using the learned correction value. As described above, when the component mounting machine 10 of the present disclosure repeats the suction operation and the mounting operation for the same type of component, the component mounting machine 10 executes the first suction operation on each of the plurality of suction nozzles 44 to learn the correction value. To the second adsorption operation. As a result, the component mounting machine 10 of the present disclosure can accurately perform the simultaneous suction operation of simultaneously sucking a plurality of parts on the plurality of suction nozzles 44.

Further, the component mounting machine 10 of the embodiment measures the variation in the adsorption position of the component P adsorbed on the adsorption nozzle 44 (the average value of the adsorption deviation amount and 3σ) in the first adsorption operation (single adsorption operation), and the variation thereof is measured. The second adsorption operation (simultaneous adsorption operation) is executed after the variation has converged within a predetermined range. In this way, the component mounting machine 10 can further improve the accuracy of the second suction operation by executing the second suction operation based on the correction value learned in the first suction operation, for example, 0.4 mm. Simultaneous adsorption of extremely small parts such as chip parts of × 0.2 mm can be realized.

Further, the component mounting machine 10 of the embodiment corrects the target head position Xh in the X-axis direction of the mounting head 40 by using the head movement correction values ΔXhz1 and ΔXhz2 in the X-axis direction in the second suction operation (simultaneous suction operation). Then, the target feed amounts Fz1 and Fz2 of the two corresponding tape feeders 23 are corrected by using the head movement correction values ΔYhz1 and ΔYhz2 in the Y-axis direction. In this way, the component mounting machine 10 can individually correct the suction deviation in the Y-axis direction in the second suction operation for Z1 and Z2, so that the suction position accuracy in the Y-axis direction can be further improved. it can.

Further, in the component mounting machine 10 of the embodiment, when the mounting head 40 is replaced or a suction error occurs in the simultaneous suction operation, the simultaneous suction permission flag F is set to a value 0 to prohibit the simultaneous suction operation. As a result, it is possible to prevent the simultaneous suction operation from being executed in a situation where the suction position accuracy is lowered, and to suppress the frequent occurrence of suction errors.

It goes without saying that the present invention is not limited to the above-described embodiment, and can be implemented in various aspects as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the component mounting machine 10 includes a rotary type mounting head 40 in which a plurality of nozzle holders 42 are arranged in the circumferential direction with respect to the head main body 41. However, the component mounting machine 10 is a parallel type mounting machine 10 having nozzle holders (suction nozzles) that are arranged at the same pitch as the parts feeder (tape feeder 23) along the arrangement direction and can be raised and lowered independently of each other. It may be provided with a head.

In the above-described embodiment, the mounting head 40 includes two Z-axis drive devices 70 and 75 that individually raise and lower two nozzle holders 42 (suction nozzles 44) at predetermined positions. However, the mounting head 40 may be provided with three or more Z-axis drive devices, and the three or more Z-axis drive devices simultaneously lower three or more suction nozzles, and each suction nozzle has three or more suction nozzles. The component P may be adsorbed at the same time.

In the above-described embodiment, the CPU 91 corrects the target feed amounts Fz1 and Fz2 of the two tape feeders 23 that supply the two suction target parts by using the head movement correction values ΔYhz1 and ΔYhz2 in the Y-axis direction in the simultaneous suction operation. did. Further, the CPU 91 corrects the target head position Xh in the X-axis direction of the mounting head 40 by using the head movement correction values ΔXhz1 and ΔXhz2 in the X-axis direction, and does not correct the target head position Yh in the Y-axis direction of the mounting head 40. I made it. However, the CPU 91 may correct the target head position Yh of the mounting head 40 in the Y-axis direction by using the head movement correction values ΔYhz1 and ΔYhz2 in the Y-axis direction instead of correcting the target feed amounts Fz1 and Fz2. In this case, the CPU 91 corrects the target head position Yh by adding the sum of the head movement correction value ΔYhz1 and the head movement correction value ΔYhz2 divided by the value 2 to the current target head position Yh in the Y-axis direction. do it.

In the above-described embodiment, the CPU 91 shifts to the simultaneous suction operation after the suction position accuracy (average value of the suction deviation amount and 3σ) of the suction nozzle 44 converges within a predetermined range in the single suction operation. However, the CPU 91 may shift to the simultaneous suction operation when the progress of learning the head movement correction value reaches a predetermined degree in the single suction operation (for example, when the number of learnings reaches a predetermined number).

In the above-described embodiment, the CPU 91 sets a value 0 in the simultaneous suction permission flag F when the mounting head 40 is replaced and when a suction error occurs in the simultaneous suction operation to prohibit the simultaneous suction operation. And said. However, the present invention is not limited to this, and the CPU 91 may set the value 0 in the simultaneous adsorption permission flag F when the tape feeder 23 is replaced.

In the above-described embodiment, the XY robot 30 moves the mounting head 40 in the XY axis direction, but the substrate B may be moved in the XY axis direction.

In the above-described embodiment, the component mounting machine 10 includes position sensors 37, 39, 55, 65, 73, 78 that detect the positions of the respective axes (X-axis, Y-axis, R-axis, Q-axis, and Z-axis). However, the "position sensor" may include an encoder or a linear scale.

The present invention can be used in the manufacturing industry of component mounting machines and the like.

1 Parts mounting system, 10 Parts mounting machine, 12, Housing, 22 Parts supply, 23 Tape feeder, 24 Board transfer device, 26 Parts camera, 28 Mark camera, 29 Nozzle station, 30 XY robot, 31 X-axis guide rail , 32 X-axis slider, 33 Y-axis guide rail, 34 Y-axis slider, 36 X-axis motor, 37 X-axis position sensor, 38 Y-axis motor, 39 Y-axis position sensor, 40 mounting head, 41 head body, 41a radial flow Road, 42 nozzle holder, 42a holder flow path, 44 suction nozzle, 45 first valve drive device, 46 second valve drive device, 47, 48 side camera, 50 R axis drive device, 51 R axis motor, 52 R axis, 53 Transmission gear, 55 R-axis position sensor, 60 Q-axis drive device, 61 Q-axis motor, 62 Cylindrical gear, 62a outer teeth, 64 Q-axis gear, 65 Q-axis position sensor, 70 1st Z-axis drive device, 71,76 Z-axis motor, 72,77 Z-axis slider, 73,78 Z-axis position sensor, 75 2nd Z-axis drive device, 80 pressure supply device, 81 negative pressure source, 82 positive pressure source, 83 negative pressure flow path, 84 positive pressure flow path , 85 atmospheric pressure flow path, 86 switching valve, 87 valve operating lever, 88 pressure sensor, 90 control device, 91 CPU, 92 ROM 93 HDD, 94 RAM, 95 input / output interface, 96 bus, 100 management device, 101 CPU, 102 ROM, 103 HDD, 104 RAM, 105 input / output interface, 107 input device, 108 display, P component, S board.

Claims (7)

It is a component mounting machine that sucks components supplied from multiple component feeders arranged in the component supply section and mounts them on a board.
A head having a plurality of nozzles capable of adsorbing the parts and
An elevating device that can raise and lower the plurality of nozzles individually,
A moving device that moves the head relative to the substrate along a plane orthogonal to the elevating direction of the nozzle.
A parts camera that captures the parts adsorbed on the nozzle, and
As a suction operation for sucking a component to the nozzle, the moving device and the elevating device are controlled so that one nozzle descends above the component supply unit, and the component is sucked to the one nozzle. A second method in which the moving device and the elevating device are controlled so that the suction operation and the plurality of nozzles are simultaneously lowered above the component supply unit so that the plurality of parts are simultaneously sucked by the plurality of nozzles. When the suction operation can be executed and the suction operation and the mounting operation for the same type of parts are repeatedly executed, the first suction operation is first executed by each of the plurality of nozzles, and the first suction operation is performed. The correction value for correcting the deviation of the suction position of the parts sucked by each of the plurality of nozzles was learned from the captured image of the parts obtained by the parts camera , and after the predetermined conditions were satisfied, the learning was performed. A control device that executes the second suction operation using the correction value, and
A component mounting machine equipped with. The component mounting machine according to claim 1.
The control device measures the accuracy of the suction position of the component sucked by the nozzle in the first suction operation, and after the accuracy of the suction position falls within a predetermined range as the predetermined condition, the second suction operation. To execute,
Parts mounting machine. The component mounting machine according to claim 1 or 2.
The control device executes the second suction operation after the progress of the learning reaches a predetermined degree as the predetermined condition.
Parts mounting machine. The component mounting machine according to any one of claims 1 to 3.
The control device corrects the moving position of the head based on the learned correction value in the second suction operation.
Parts mounting machine. The component mounting machine according to any one of claims 1 to 3.
The parts feeder is a tape feeder that supplies a tape containing a plurality of parts of the same type in a predetermined direction.
A plurality of the tape feeders are arranged in the component supply unit along a direction orthogonal to the predetermined direction so as to supply a plurality of components simultaneously attracted by the plurality of nozzles.
In the second suction operation, the control device corrects the supply amount of the tape in the plurality of tape feeders based on the learned correction value, and the head in a direction orthogonal to the supply direction of the tape. Correct the movement position of
Parts mounting machine. The component mounting machine according to any one of claims 1 to 5.
The control device ends the execution of the second suction operation based on the replacement of the parts feeder, the replacement of the head, or the occurrence of a suction error.
Parts mounting machine. The component mounting machine according to any one of claims 1 to 6.
The head has a rotating body in which nozzle holders for holding the nozzles are arranged in the circumferential direction and supports the nozzle holders so as to be able to move up and down, and the rotation of the rotating bodies causes the plurality of nozzle holders to rotate in the circumferential direction. It is a rotary head that makes you
The elevating device includes a first elevating device that elevates and elevates the nozzle holder at the first position on a line parallel to the substrate transport direction through the central axis of the rotating body among the plurality of nozzle holders, and the plurality of nozzles. It has a second lifting device that raises and lowers the nozzle holder at a second position on a line parallel to the substrate transport direction through the central axis of the rotating body, which is different from the first position of the holder.
Parts mounting machine.

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